Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
  • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
  • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
  • B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
  • B32B17/10055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet with at least one intermediate air space
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
  • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
  • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
  • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
  • B32B17/10165—Functional features of the laminated safety glass or glazing
  • B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
• • G—PHYSICS
  • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
  • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
  • G09F19/00—Advertising or display means not otherwise provided for
  • G09F19/22—Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
• • G—PHYSICS
  • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
  • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
  • G09F19/00—Advertising or display means not otherwise provided for
  • G09F19/22—Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
  • G09F19/226—External wall display means; Facade advertising means
• • G—PHYSICS
  • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
  • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
  • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
  • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
  • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0108—Transparent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/032—Materials
  • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0388—Other aspects of conductors
  • H05K2201/0391—Using different types of conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]

Definitions

• Display device in particular transparent multimedia facade
• the invention relates to a display device, in particular a large-area display device, especially a transparent media facade.
• Large-area display devices have become known from the prior art, for example as large-area video displays for outdoor sports broadcasts or in the form of media facades consisting of lamellae.
• the individual lamellae are equipped with light sources such as light emitting diodes.
• the slats themselves are assembled into grids or nets.
• the mesh structures are very noticeable due to the thicknesses of the individual slats of up to 20 mm or more.
• the net structures or lamellae can also be mounted in front of the facades of a building.
• bulbs are preferably LED ' s integrated.
• Media facades it is possible, for example, to illuminate large areas of facades in many colors.
• color sequences or animated graphics can be generated on the large-area display devices or media facades.
• video images for example moving television pictures with the help of the display devices over a large area on facades.
• a disadvantage of the display devices, in particular the media facades according to the prior art was that they were hardly transparent or needed a complex construction and a variety of slats had to be mounted openly in front of the facades of a building. On the slats then the individual LEDs were arranged. The slats themselves were very susceptible to weathering, especially in extreme weather conditions such as wind and expensive to produce.
• the object of the invention is thus to provide a large-scale display, in particular media facade, which overcomes the disadvantages of the prior art, in particular their complex structure.
• this object is achieved in that a large-area display device, in particular a media facade, an element comprising at least a part of a transparent and / or quasi-transparent element, wherein the transparent and / or quasi-transparent element comprises at least one transparent and / or quasitransparentes substrate and At least on a part of the transparent and / or quasi-transparent substrate are mounted light-emitting means.
• the mounting of the luminous means on the transparent substrate takes place, for example, as described in EP-A-1 450 416.
• the transparent and / or quasi-transparent substrate is transparent or quasi-transparent in the visible light range and, in particular, can be structured as desired.
• the lighting means are applied according to the invention directly on a surface of the transparent substrate.
• Transparent substrates are understood in particular to be substrates such as, for example, glasses with a transmission of> 80%, very particularly preferably> 90% in the visible wavelength range with normal incidence of light.
• the visible wavelength range is from 380 to 780 nm, preferably from 420 to 780 nm.
• Quasi-transparent means substrates with a transmission in the range from 40% to 80% in the visible wavelength range with normal incidence of light.
• Suitable materials for the transparent and / or quasi-transparent substrate are all inorganic glasses, in particular silicate glasses, preferably soda-lime glasses, but also borosilicate glasses, in particular also fire-resistant glasses.
• Further materials for transparent and / or quasi-transparent substrates may also be transparent and / or quasi-transparent plastics in the visible wavelength range, in particular transparent or transparent plastics, such as, for example, polymethyl methacrylates, acrylic glass or polycarbonates.
• a large-area display device which at least partially comprises a transparent and / or quasi-transparent optical element with at least one transparent and / or quasi-transparent substrate, it is possible, for example, to create a transparent and / or quasi-transparent media facade which provides a view of the building or from the building in front of which the media façade is attached, still allows, but at the same time avoids a complex lamellar construction.
• the media façade can be designed such that it is itself a part of the transparent and / or quasi-transparent facade element, or in particular arranged as a transparent and / or quasi-transparent media facade in front of existing facades, for example, hung.
• the light sources are preferably made of organic or inorganic light-emitting diodes. If you want to use the media façade, for example, for the playback of television images, so you put in a first embodiment of the invention preferably inorganic LED design as a light source that produce all three primary colors of the video pixel (red, green and blue) in a single housing. Such LEDs are referred to as RGB LEDs. Transparent large area
• Display devices in particular media facades with so-called RGB light-emitting diodes, are ideally suited for corresponding projection of the individual light-emitting diodes for media projection, for example television pictures.
• RGB light-emitting diodes all basic colors of the television picture (red, green, blue) are realized in a single LED chip.
• An alternative embodiment of the invention is to arrange three LEDs next to each other closely adjacent.
• One of the light emitting diodes emits red light, the other green light and the third blue light.
• the distance between the three LEDs is 5mm.
• the lighting means ie the individual light-emitting diodes for the viewer in the distance with a large distance to the display device inconspicuous, in particular invisible supplied with electricity and controlled.
• Suitable for this purpose are, for example, transparent strip conductors as have become known, for example, in EP-A 1 450 416 or else WO 2006/018066.
• the disclosure of the two documents WO 2006/018066 and EP-A-1 450 416 is fully incorporated in the present application.
• the tracks serve both the power supply as well as the control of the individual RGB light emitting diodes.
• the control line and the power line are the same, at least for one pole.
• the other pole of the light-emitting diode can then lie on a busbar.
• the transparent conductor tracks consist of a transparent, electrically conductive and power-transmitting layer.
• the transparent conductor tracks consist of a transparent, electrically conductive and power-transmitting layer.
• higher currents can be transmitted via these interconnects, so that several lamps can be supplied via a conductor track.
• an arrangement with conductor tracks is constructed such that each individual light-emitting diode can be controlled individually in order to generate the corresponding images.
• interconnects with a transmission> 40%, in particular ⁇ 60% in the visible wavelength range it is also possible to use interconnects with low transparency, i. a transmission of less than 40%, in particular> 60% are used, if the conductor tracks correspondingly narrow, d. H. are designed with a small width.
• Such printed conductors are, for example, printed conductors based on silver conductive paste.
• the transparent and / or quasi-transparent element comprises in particular at least one transparent and / or quasi-transparent substrate with luminous means arranged thereon, wherein the transparent and / or quasi-transparent substrate is preferably in the form of a disk.
• the transparent and / or quasi-transparent substrate can, as already mentioned, from Plastic or glass or a crystalline or a partially crystalline or a ceramic or a partially ceramic material, in particular a glass ceramic.
• acrylic glass as a plastic substrate or soda-lime glass or gray glass or a low-iron glass which preferably has an iron oxide content of less than 0.05% by weight, preferably less than 0.03% by weight, would be conceivable as the glass substrate.
• the transparent and / or quasi-transparent element may preferably comprise a cover disk and is then designed in particular as a composite element.
• a cover disk is arranged above the transparent and / or quasi-transparent substrate with the lighting means.
• the transparent and / or quasi-transparent element may comprise a cast resin layer, which makes it possible to attach the transparent and / or quasi-transparent substrate with bulbs either directly to the facade or to connect to the cover plate, resulting in a kind of laminated glass pane.
• a connection with a cast resin a connection with an adhesive film is conceivable.
• PVB polyvinyl butyral
• TPU thermoplastic polyurethane
• PET polyethylene terephthalate
• EVA ethylene vinyl acetate
• the foils which are laminated in the laminated glass pane between the transparent and / or quasi-transparent substrate with illuminants and the cover pane may also be a special foil, for example a foil which is coated with liquid crystals.
• a liquid crystal-coated film makes it possible to switch the film from a non-transparent state to a transparent state by applying voltages. In this case, a phase transition of the liquid crystals is switched from an initially completely disordered structure, which makes the film appear cloudy in transmission, into an ordered phase, which transmits visible light. The film then appears transparent and no longer milky.
• the switchable film can cover the entire surface of the element or only a part.
• a film which contains liquid crystals it is also possible to use as a film a film which comprises scattering centers.
• a film comprising scattering centers has become known, for example, from DE-U-2 000 09 099 or DE-U-2 000 12 471.
• the films comprising scattering centers, for example a scattering layer, are suitable for visualizing projected photographs in the area of the scattering film.
• a gray film can be introduced as a contrast enhancement agent between the scattering film and one of the two laminated glass panes.
• the scattering film is formed as a film with liquid crystals, as described above, then the projection surface of the scattering milky cloudy state of the switchable film can be formed with liquid crystals. Such a projection surface could then again, if no projection is made, be switched to a transparent state.
• the projection surface allows for the back and forth projection of images and in particular logos with the aid of light sources in the form of LEDs.
• the transparent and / or quasi-transparent element is designed as a laminated glass element with at least two panes
• the light bulbs can be laminated into a transparent film, for example an optically nonfunctional PVB film, a TPU film or a PET film.
• a transparent film for example an optically nonfunctional PVB film, a TPU film or a PET film.
• WO 2004/106056 The disclosure of this document is incorporated in full.
• a transparent film which is equipped with bulbs, such as light emitting diodes, transparent and conductive, for example, by the company SUN-TEC Swiss United Technologies GmbH & Co. Rebenweg 20, 6331 Hünenberg, Switzerland, distributed.
• Such LED-equipped films are transparent and conductive.
• the LED-equipped foils can be integrated into a laminated glass element Cast resin to be poured. Also possible is lamination by means of adhesive film, for example PVB film, TPU film or EVA film.
• the cover plate can be an inorganic glass, in particular a silicate glass, preferably a soda lime glass, but also borosilicate glass, in particular also a fire protection glass.
• a silicate glass preferably a soda lime glass
• borosilicate glass in particular also a fire protection glass.
• Other glasses are possible as cover plates.
• amorphous silicon for example.
• a photovoltaic module is then formed in thin-film technology, which is also translucent to the outside.
• Photovoltaic modules in thin-film technology are, for example, the ASI glass modules from SCHOTT Solar GmbH, Carl-Zeiss-Strasse 4, 63755 Alzenau. The energy absorbed by the sun from such a module can be stored and retrieved at a later time to power the LEDs.
• thin-film technology for solar applications in particular photovoltaic modules, reference is made to EP 0 500 451 A.
• a translucent photovoltaic cell in thin-film technology is characterized by a transparent substrate to which a stack of thin layers comprising a transparent metal layer, a photovoltaic semiconductor conversion layer and a further metallic layer for generating a photocurrent is applied.
• the cover plate can be connected to the transparent and / or quasi-transparent substrate so that a gap is formed between the cover plate and the transparent or quasi-transparent substrate, resulting, for example, in an insulating glass composite.
• an insulating glass composite it would be possible in particular to provide heat protection layers and sun protection layers.
• the strip conductors are divided into a plurality of circuits for the power supply of the lighting means, in such a way that individual lighting means are individually controllable. In this way it is possible on the large area Display device, in particular the media facade to produce video images.
• the individual RGB light-emitting diodes are arranged in the manner of a matrix on the transparent substrate.
• the intermediate space may also be filled with a medium, for example a cooling medium.
• the light-emitting diodes In order to prevent the light-emitting diodes from radiating in the direction of the interior of the building in front of which the media façade is arranged, they can be shielded from the interior. In particular, a back-side radiation of the lamps or light-emitting diodes in the building should be prevented. As an alternative to shielding a light emitting on all sides, it is also possible to use light-emitting diodes emitting on one side.
• Shielding would be possible by a very narrow design of the pads that receive the individual LEDs on the transparent substrate.
• the transparent substrate could be sandblasted or provided with a mirror effect in the region in which the light-emitting diodes are arranged. Furthermore, with the mirror elements lying opposite of the light emitting diodes, radiation into the interior can be prevented.
• metal oxides are used in a preferred embodiment, for example ITO (InO x : Sn), FTO (SnO x : F) or ATO (SnO x : Sb).
• ITO InO x : Sn
• FTO SnO x : F
• ATO SnO x : Sb
• FTO SnO x : F
• Sn ⁇ 2 F
• SnO 2 : F as a heat protection layer is the "thin film technology on flat glass" by Hans Joachim glasses, p. 155 - p. 199, Verlag Karl Hofmann, 1999, the disclosure of which is fully incorporated into the application, described.
• this conductive layer to the transparent substrate is preferably carried out by means of chemical vapor deposition (CVD) or physical vapor deposition (PVD), dip coating, spraying, chemical or electrochemical coating, sol-gel coating.
• CVD chemical vapor deposition
• PVD physical vapor deposition
• spray pyrolysis for example, spray pyrolysis, sputtering and SoI-GeI processes are mentioned here.
• the application by means of spray pyrolysis is particularly cost-effective, with preference being given to using SnO 2 : F or SnO x : F or ZnO x : F as coating material. If one wishes to achieve particularly good optical properties, the preferred application method is sputtering.
• the conductive layer consists of a vapor-deposited or sputtered metal such as Al, Ag, Au, Ni or Cr, which is usually quasitransparent. Metal layers are preferably used at high ambient temperatures.
• the conductor tracks can also be applied to the transparent and / or quasi-transparent substrate with the aid of a fine conductor pressure, for example of silver.
• transparent conductive layers are understood as meaning layers having a transmission of> 40%, preferably ⁇ 60%, in particular> 70%, very preferably 80% in the visible wavelength range.
• a special reflection layer For example, a TiO 2 , SiO 2 , or a mixed layer of Ti x Sh
• the transparent element may comprise an anti-reflection layer to allow an unobstructed view through the transparent element.
• an anti-reflection layer to allow an unobstructed view through the transparent element.
• a coating for a highly antireflective glass for example, the highly anti-reflective glass AMIRAN® Schott AG, Mainz. AMIRAN® is a dip method, e.g. on both sides interference-optical anti-reflective glass with a residual reflection of only one percent. With the highly anti-glare glass, the reflection can be reduced by about 1/8 and thus an extraordinary transparency of the element can be achieved.
• the conductive layer of metal oxide or metal can be structured in matrix form as well as arbitrarily. This allows the application of complex structures to the transparent substrate. This in turn allows to apply a complete electronic circuit on one and the same transparent substrate.
• the structuring of the conductive layer can be carried out after application by targeted interruption of the layer, for example by means of a laser, which locally heats the coating and evaporates it.
• a laser for introducing the structures into a conductive layer applied over the entire area, it is advantageous if the layer has a particularly high absorption in the region of the laser wavelength of the laser used and the substrate is transmissive for this wavelength. In such a system, virtually all of the energy input into the conductive layer occurs and the glass surface has little damage. In particular, cracking in the glass surface can be avoided in such a system.
• the structuring of a layer applied over the entire area by means of lithography and subsequent etching processes is possible.
• structuring is also conceivable in that already during coating, for example during vapor deposition with the aid of mask techniques, the printed conductors are applied in the predetermined structure.
• track structures made of silver layers are conceivable, for example, those made of silver conductive paste.
• the conductor tracks made of silver conductive paint are not necessarily transparent themselves, but they are designed so that they are inconspicuous for a distant observer. Such an effect can be achieved by forming the individual strip conductors correspondingly narrow with a small width.
• the conductor tracks in particular of conductive layers, which can be patterned by using a laser, are so-called highly conductive layers, in particular of a metal oxide, in particular of
• SnO x : F preferably Sn ⁇ 2 : F
• Highly conductive layers are.
• Highly conductive layers in particular those comprising SnO x : F, preferably have a surface resistance ⁇ 15 ohms / square ( ⁇ / ⁇ ), in particular ⁇ 10 ohms / square ( ⁇ / o), particularly preferably ⁇ 8 ohms / square ( ⁇ / D), in particular preferably ⁇ 7 ohms / square ( ⁇ / ⁇ ), particularly preferably ⁇ 5 ohms / square ( ⁇ / ⁇ ) at a layer thickness of approximately 500 nm.
• the layer thicknesses of these highly conductive layers are preferably more than 150 nm, preferably more than 180 nm, more preferably more than 280 nm, especially preferably more than 420 nm, more preferably more than 500 nm, most preferably more than 550 nm.
• connection points can be applied to the conductive layer or the conductor track made of highly conductive material.
• connection points comprise a conductive paste or lacquer, for example silver-conductive lacquer or
• connection points can be effected by means of screen printing or stencil printing and subsequent baking, wherein such a method can be used in the case of the use of glasses as a transparent substrate at the same time for biasing the glasses.
• One advantage of components produced in this way is that particularly strong glasses can be obtained without an additional further processing step.
• Another advantage is that the application of the pads for the first time allows soldering on a transparent substrate.
• gluing can also be carried out. Unlike bonded joints, however, solder joints are more stable, longer-lasting and less sensitive to environmental influences such as humidity, heat, chemicals, etc.
• the arrangement of the lighting means does not take place directly on the transparent or quasi-transparent substrate, for example by gluing, but indirectly.
• a connection point i. a ubend, upset.
• the illuminant i. the LED, soldered.
• the silver conductive lacquer can be produced by screen printing or metering. In the metering process, silver solder paste is applied by means of a metering device.
• the silver conductive lines can also be applied to the transparent substrate by means of inkjet processes, for example inkjet printing. Another possibility would be the application of thin wires, preferably metal wires.
• the mounting of the carrier substrate with light-emitting diodes can be carried out according to known standard methods from the electronics industry, for example by applying solder paste to the individual connection points or connection pads by means of stencil printing. Subsequently, the LEDs are applied to the carrier plate.
• a chip bonder can be used, which fixes the individual bulbs on the carrier material before the soldering process. After attaching the individual bulbs, the carrier substrate is then passed through a reflow oven. Alternatively, the LEDs populated with a chip bonder may be passed through a wave solder bath.
• the soldering process and the indirect application has the advantage of a simple processing, in particular the carrier substrates can be washed after application of the LEDs.
• Carrier substrate to apply a conductive adhesive so that the lighting means or electrical components can be applied directly to the carrier substrate.
• Both isotropic conductive and anisotropic conductive adhesive can be used. At very low interconnect spacing, the use of anisotropic adhesive is preferred.
• a disadvantage of a direct application by means of adhesive is the elaborate processing, which generally requires clean room conditions.
• the particular advantage of the present invention is the free structurability. This makes it possible for not only illuminants, for example light-emitting diodes, as in the prior art, to be applied to the carrier substrate, but also other electrical or electronic components.
• illuminants for example light-emitting diodes
• other electrical or electronic components are all known electrical and electronic components in Consider, for example, sensors, discrete semiconductors, passive and active components, resistors, capacitors, coils, speakers, interactive components such as keyboards, etc.
• the interactive components allow z. For example, the display and retrieval of customer information, the speakers in addition to playback of image information, and the reproduction of sound information. It is also possible that in some areas an LC film is controlled by means of the conductive layer.
• Large-area video display devices that can be formed according to the invention comprise more than 1000, in particular more than 5000, preferably more than 10,000 individual bulbs, most preferably more than 100,000 bulbs, more preferably more than 250,000 bulbs, most preferably more than 1 million individual bulbs.
• the large-area display devices in particular the transparent media facades with a number of light-emitting diodes as indicated above, are preferably divided such that, for example, more than 80, in particular more than 100, preferably more than 200, preferably more than 500, very preferably more than 750, particularly preferably More than 1000 or more individual LEDs are associated with a control electronics, wherein the control electronics is preferably arranged on the transparent substrate. This is particularly possible if not the entire substrate is equipped with bulbs.
• the substrate can not be used at an edge of the optical element. Then it is possible to arrange the control electronics at the edge of the optical element.
• the leads to the individual LEDs can then be supplied at the edge of a bus, which runs along the edge and the individual LEDs with Power supplied. From the edge itself then only a few cables are led out of the transparent substrate.
• the large-area displays according to the invention comprise display areas of more than 10 m 2 , in particular more than 50 m 2 , very particularly preferably more than 100 m 2 , particularly preferably more than 1000 m 2 , more preferably more than 3000 m 2 , particularly preferably more as 5000 m 2 .
• about 400,000 LEDs are distributed on a media façade with an area of 4000 m 2 . Since the transparent substrates of this size can not be produced, such large-format media facades are formed by individual modularly arranged transparent elements, each comprising a transparent substrate according to the invention.
• the modular design of the transparent elements makes it possible to produce an arbitrarily large display area.
• the advantage of the electronics or control lines applied to the transparent substrate, in particular when using RGB light-emitting diode chips for video display, is that there is a simple wiring outlay compared with the current state of the art.
• the individual LEDs are preferably not applied directly to the substrate, for example by gluing, but indirectly.
• the substrate is provided with so-called connection pads, comprising a conductive paste or lacquer, for example Silberleitlack or silver paste. On the connection pads then single or multiple lamps, eg. Light-emitting diodes are applied by soldering.
• Carrier substrate and active components such as speakers are applied. This is of particular relevance when RGB light emitting diodes are used.
• the luminous means are protected by a second transparent substrate.
• the light-emitting diodes then lie between the transparent carrier substrate and the further transparent substrate. In this way, the light sources can be additionally protected against environmental influences, such as moisture and mechanical shearing.
• the further transparent substrate is likewise provided with a conductive, transparent layer.
• the transparent substrate may be both a glass and a plastic substrate. It is particularly preferred if the glass substrate is hardened and prestressed. As particularly preferred glasses find soda-lime glasses use.
• Carrier substrates with illuminants e.g. Light emitting diodes to connect and contact each other.
• the transparent element according to the invention is used for a media façade in a glass composite, for example an insulating glass composite.
• An insulating glass composite is also referred to as a so-called double-glazing unit (DGU).
• DGU double-glazing unit
• a double-glazing unit (DGU) or an insulating glass element is understood to mean a glass element, in particular a glass element for use in the field of architecture, which consists of two glass elements spaced apart from one another. At least one of these glass elements comprises the transparent element, which has one or more light sources.
• the space between the at least two spaced glass elements that form the double glazing unit (DGU) with can be guided with a medium.
• the medium may be either gaseous or liquid and z. B. serve cooling purposes.
• the one element which comprises the transparent element with one or more light sources, can either be a single-pane glass
• the transparent element as described above is part of a laminated glass, for example a laminated safety glass, which may comprise both toughened safety glass and partially tempered glass.
• a laminated safety glass which may comprise both toughened safety glass and partially tempered glass.
• the light-emitting diodes it is possible for the light-emitting diodes to be arranged either directly on the conductive coating, which is applied to, for example, a pane of the laminated glass, or in a film which is introduced between the two panes.
• the first element may further be a special glass such as a mirrored glass, a heat-insulating glass, a solar control glass or a fire-resistant glass.
• the first element may also comprise transparent concrete or a glass ceramic.
• the second element of the insulating glass composite, spaced from the first element, may again be either a single pane, a tempered safety glass, a semi-tempered single pane glass, a laminated safety glass, a laminated safety glass comprising a tempered safety glass and a laminated safety glass comprising a semi-tempered glass or a special glass such as a mirrored glass Glass, a decorative glass, a through-colored glass, a color effect glass with interference-optical coating, a heat protection glass or a solar control glass.
• a mirrored glass Glass a decorative glass, a through-colored glass, a color effect glass with interference-optical coating, a heat protection glass or a solar control glass.
• the second element of the insulating glass composite can be a fire-resistant glass or even transparent concrete.
• the distance between the two elements, in particular in the insulating glass element is by a spacer element, for example a
• the distance A between the two opposite surfaces of the insulating glass composite is between 5 mm and 50 mm, preferably in the range 10 mm to 30 mm.
• sealing materials preferably made of butyl rubber.
• Disk-shaped in this application is understood to mean both flat and curved disk-shaped elements.
• the extent in the area defined by the disk is 10 times greater than the thickness of the disk itself.
• the second element which does not include the light-emitting diodes, can take many forms.
• a high-specular glass for example the highly mirrored glass AMIRAN® from Schott AG, which reduces the reflection to one-eighth compared to non-antireflective glasses.
• color effect glasses such as Schott AG's coated NARIMA® color effect glass based on an interference-optical effect, could be used.
• the second optical element could comprise through-colored flat glass, for example the IMERA® glass from Schott AG with a structureless surface, or a through-colored flat glass with a surface structured on one side, such as Schott AG's ARTISTA® glass.
• a glass as a second optical element in the insulating glass composite, which is transparent in the visible range, but has a structured surface, for example a printed or sandblasted surface.
• the opposite pane does not have to be structured, antireflected or formed as a color effect glass or decorative glass over the entire area of the transparent optical element, but rather it is also possible to form only partial areas of the glass opposite the element with light-emitting diodes.
• FIG. 3 a section of a transparent substrate for a transparent one
• Figure 4a shows a first embodiment of a transparent
• Façade element with several successively arranged transparent substrates with light emitting diodes
• Façade element with several successively arranged transparent substrates with light emitting diodes
• Figure 4c shows a third embodiment with a plurality of successively arranged transparent substrates with light-emitting diodes
• Figure 6 is a multimedia facade
• Figure 7a-b section and top view of a first embodiment of two interconnected facade elements
• Figure 7c section and top view of a second embodiment of two interconnected facade elements
• Figure 8 Example of a fastening of a transparent element to a
• FIG. 1 shows a transparent or quasi-transparent substrate, which acts as a carrier substrate for the light-emitting diodes of a transparent element, for example for a media façade with an applied conductive layer, which in turn was structured in such a way that printed conductors 3 are formed on the transparent carrier substrate 1.
• On the conductor track 3 individual connection points 9 are arranged, of which one is shown here.
• the connection points 9 serve to connect the individual lighting means, for example light-emitting diodes, in particular RGB light-emitting diodes (not shown), in a conductive manner to the conductor track 3 and thus to ensure their power supply.
• the track for example, from ITO or FTO (SnO x : F) has a width b in the range of a few mm.
• a soda-lime glass is provided as the carrier substrate.
• FIGS. 2 a to 2 d show a method sequence according to the invention for producing a transparent substrate for accommodating light sources for a transparent element of a multimedia facade.
• the transparent carrier substrate 1 is coated over its entire area with a conductive layer, for example in the sol-gel process.
• a structuring is produced, for example by means of a laser, which locally heats the coating and evaporates it.
• the carrier substrates which are patterned with the aid of a laser, preferably comprise a conductive layer which has a high absorption in the region of the laser wavelength of the laser used and a substrate which is transmissive at this wavelength.
• the glass layer has only minor injuries.
• the cracking in such systems can be largely avoided.
• the conductive layer is a highly conductive metal oxide layer as described above. Materials of this highly conductive layer may include one or more of the following metal oxides:
• the highly conductive coating preferably has a sheet resistance R n ⁇ 15 ohms / square ( ⁇ / D), in particular ⁇ 10 ohms / square ( ⁇ / D), in particular ⁇ 9 ohms / square ( ⁇ / D) , in particular ⁇ 7 ohms / square ( ⁇ / D), in particular ⁇ 5 ohms / square ( ⁇ / D).
• the layer thicknesses of the highly conductive layers are preferably more than 150 nm, preferably more than 180 nm, more preferably more than 280 nm, more preferably more than 420 nm, more preferably more than 500 nm, most preferably more than 550 nm a wavelength of 550 nm of such layers is more than 82%, in particular more than 87%, very particularly preferably more than 89%.
• the highly conductive layers are SnO x : F, SnO x : Sb, ZnO x : F layers.
• An advantage of the SnO x : F, in particular the SnO 2 layer, is that it acts not only as a conductive layer but also as a thermal barrier coating.
• connection pads 9 comprise a conductive paste or lacquer, for example silver-conductive lacquer or silver paste, and is applied by screen printing or stencil printing on the conductive substrate and then baked. By baking, at the same time, pretensioning of the transparent substrate, in particular of the transparent glass substrate, can take place. As a result, a high mechanical strength is achieved in a single process step.
• a conductive paste or lacquer for example silver-conductive lacquer or silver paste
• the solder can be applied by dosing.
• the contacts in the different areas 13.1-13.4 are, as shown in Figure 2d, equipped with a standard method by, for example, solder paste is applied to the connection pads 9, for example by means of stencil printing.
• the light-emitting diodes (LEDs) 4 are then applied to the carrier plate, wherein a chip bonder can be used, which fixes the light-emitting diodes 4 on the carrier material before the soldering process.
• the carrier substrate 1 with the LEDs mounted thereon is passed through a reflow oven or through a wave solder bath.
• a glass substrate typically a soda lime glass
• a fluorine doped tin oxide SnO x : F.
• the application of the coating can be done as follows:
• a soda-lime glass as the transparent substrate is heated to 500 0 C.
• the glass is then sprayed with monobutyltinchlohd and hydrofluoric acid in ethanol, the spray solution having the following composition:
• the soda-lime glass comprises a transparent, fluorine-doped tin oxide layer.
• the coating is separated with a laser into individual areas or conductor tracks. With the help of a squeegee is silver-screened by screen printing, z.
• Cerdec SP 1248 applied.
• the paste Cerdec 1248 is dried in a continuous oven at 14O 0 C for 2 min and then baked by a tempering machine at about 70O 0 C for a soda-lime glass and tempered. Then commercially available solder paste is applied by stencil printing and equipped with LEDs. During the following reflow soldering, the assembled substrate is preheated to 120 ° C. for 2 minutes and then heated to 235 ° C. for 5 s. Then it is slowly cooled.
• RGB light-emitting diodes are used as light-emitting diodes.
• RGB LEDs are light emitting diodes that produce all three primary colors of a video pixel, namely red, green and blue in a single package. With the help of such LEDs, it is very easy to produce moving images, such as television images on the multimedia facade.
• the individual RGB light-emitting diodes are preferably individually controlled in order to generate, for example, moving television images on the media façade with the aid of a computer.
• the pattern with which the RGB LEDs on the transparent member applied as a supporting substrate is preferably a regular pixel pattern.
• the media facade can also be equipped with simple LEDs, which are then used to generate lighting patterns, eg. B. can generate running or changing images.
• FIG. 3 shows an embodiment of the invention in which a transparent element comprising a carrier substrate 1 is structured in different regions 13.1, 13.2, 13.3, 13.4.
• the regions can be regarded as printed conductors, light-emitting diodes 4 being applied on or to the printed conductors by means of the method described in FIGS. 2a-2d.
• the carrier substrate also contains more electronic components, such as computer chips 23 which allow a single control of the RGB LED chips 4.
• FIG. 4 a shows an alternative embodiment of the invention.
• the transparent element 200 which can be used as a facade element, comprises a total of four substrates, here the four transparent panes 202.1, 202.2, 202.3 and 202.4 which are arranged one behind the other.
• the transparent substrates 202.1, 202.2, 202.3 are substrates which are provided with a conductive substrate
• Coating 204.1, 204.2, 204.3 are provided.
• the conductive coating conductor tracks to the respective bulbs, here light emitting diodes 208.1, 208.2, 208.3, 208.4, 208.5, 208.6 introduced, for example.
• the transparent disk 202.4 is a cover disk of the element 200. Together, we hold the element 200 through, for example
• Brackets 206.1, 206.2 A casting of the individual panes together in the form of a laminated glass pane, for example with cast resin or an adhesive film would be possible.
• the LEDs 208.1, 208.2, 208.3, 208.4, 208.5, 208.6 are arranged on the different transparent substrates 202.1, 202.2, 202.3, 202.4 offset from one another, but all with the emission side in the same direction, so that in the direction 210 results in a higher radiation than in the direction 212.
• the direction 210 is a preferred emission direction. If the laminated glass pane is designed with a foil, the light-emitting diodes can not only be applied to the substrate, but also be introduced into the foil.
• the LEDs of the various substrates can emit light at different wavelengths, so that even colored representations are possible, as with RGB LED chips.
• the light-emitting diodes 208.1 may be light emitting diodes emitting red light
• the light emitting diodes 208.2 emitting light emitting diodes emitting green light
• the light emitting diodes 208.3 emitting blue light emitting diodes.
• the light-emitting diodes can also be controlled individually, for example if the conductor tracks to the individual light-emitting diodes are led out of the element 200 one by one. In this way, it is also possible to produce running pictures or changing pictures for a media facade with a structure as shown in Fig. 4a.
• FIG. 4b shows an alternative embodiment of an element in which several transparent substrates with light-emitting diodes are arranged one behind the other.
• the transparent element 300 which is used as a facade element, comprises a total of two substrates, the transparent panes 302.1, 302.2, which are arranged one behind the other.
• the two panes 302. 1, 302. 2 are connected to one another, for example with the aid of clamps or, as is usual with laminated glass panes, with sealing elements.
• the two panes 302.1, 302.2 provide conductive coatings 304.1, 304.2 on their inside, ie on the side opposite the gap formed by the spaced panes. It is particularly preferred if the arranged on the conductive coating 304.1, 304.2 light emitting diodes 308.1, 308.2, 308.3 offset from each other and are opposite to each other.
• the façade element constructed as shown in FIG. 4b is inserted in such a way that the side marked INSIDE faces the building and the side of the outside marked EXTERNAL, then the illuminants 308.1, 308.3 preferably radiate unilaterally in the direction of the outside and the light source or the light source LED 308.2 through the transparent pane 302.2 backwards also in the direction of the outside EXTERIOR.
• the rear side of the pane 302. 1 may be provided with an absorbing material or with a reflective material so that light emitted in the direction of the building also reflects toward the outside becomes.
• a noble gas can be introduced into the intermediate space between the panes 302.1 and 302.2 as in the case of an insulating glass element or with a filler, for example a filling medium, for filling purposes.
• FIG. 4c shows an alternative embodiment of a plurality of transparent substrates equipped with light-emitting diodes, which are arranged one behind the other.
• the elements are not arranged at a distance from one another, but the disks arranged one behind the other are in the form of one another
• the element 400 comprises two disks 402.1, 402.2.
• the disks 402.1, 402.2 are preferably as transparent disks, i. as transparent substrates, designed, but can also be quasi-transparent discs.
• the two discs 402.1, 402.2 are connected to each other, for example by means of one between the
• films such as PVB films or EVA films or other adhesive films may be embedded.
• functional films such as LCD films or scattering films, between the two elements.
• Light-emitting diodes 408.1, 408.2, 408.3, 408.4 are arranged on each of the two transparent or quasi-transparent substrates 402.1, 402.2. These are preferably arranged offset from one another.
• the light emitting diodes 408.1, 408.2 emit preferably in the direction of the outside, the light emitting diodes 408.3, 408.4 preferably through the transparent substrates 402.1, 402.2, also in the direction of the outside.
• the light-emitting diodes may preferably be designed as light-emitting diodes emitting on one side. Two-sided radiating LEDs are possible. If the light-emitting diodes are those which radiate in both directions, the light reflected in the direction of the facade, that is to say inwards, can be reflected toward the outside by means of corresponding reflectors.
• the light sources in particular light-emitting diodes, can be arranged on the conductive coating which is applied to a pane of the laminated glass, or in a foil which is introduced between the two panes.
• the second element of the insulating glass composite which is arranged at a distance from the first element, may again comprise either a single-pane glass, a toughened safety glass, a semi-tempered single-pane glass, a laminated safety glass, a laminated safety glass comprising
• Tempered safety glass and a laminated safety glass comprising a partially tempered glass.
• the distance between the two elements in the insulating glass element is ensured by a spacer element, for example a metal spacer and a seal between the two, the insulating glass composite forming elements.
• the distance A between the two opposite surfaces of the insulating glass composite is between 5 mm and 50 mm, preferably in the range 10 mm to 30 mm.
• sealing materials preferably made of butyl rubber.
• the second element which does not include the light emitting diodes, can now take many forms.
• a highly specular glass for example the highly mirrored AMIRAN glass from Schott AG, which reduces the reflection to one-eighth compared to non-antireflective glasses.
• color effect glasses such as Schott AG's coated NARIMA® color effect glass based on an interference-optical effect, could be used.
• the second optical element could comprise colored flat glasses, for example IMERA glass from Schott AG with a structureless surface, or a solid-colored flat glass with a single-sided structured surface such as Schott AG's ARTISTA glass.
• a glass as a second optical element in the insulating glass composite, which is transparent in the visible range, but has a structured surface, for example a printed or sandblasted surface.
• the opposite pane does not have to be structured, antireflected or formed as a color effect glass or decorative glass over the entire area of the transparent optical element, but rather it is also possible to form only partial areas of the glass opposite the element with light-emitting diodes.
• the transparent element with luminous means for example the transparent substrate with luminous means, can also be used in glass composites, in particular
• Isolierglasverbünden be used.
• at least one further element with the transparent element is spaced apart with light sources, for example via spacers.
• FIGS. 5a to 5f show elements consisting of at least one transparent and / or quasi-transparent substrate and one further element shown.
• the further element can also be regarded as a cover plate.
• the elements shown in Figures 5a-5f are preferably insulating glass elements with a gap.
• Embodiment consists of a laminated glass element 500 and a mono-disk 510.
• the laminated glass element 500 consists of a transparent substrate 520 with conductive coating 530 applied thereto.
• the light-emitting means 540 are arranged on the conductive coating 530, for example via soldering pads.
• a second disc 560 is provided, which covers in the transparent substrate.
• a cast resin 570 is incorporated, resulting in a laminated glass element.
• the laminated glass element may also be such, in which a film, the z. B. can carry the bulbs, between the discs, i. the transparent substrate and the opposite second disc is introduced.
• the foil with bulbs is laminated with other films between the two discs.
• the further films can also be films with special functions, for example a film with liquid crystals, which can be switched between two states.
• the distance A between the inner surfaces 580, 590 of the two elements 500, 510, ie here the laminated glass pane 500 and the single-disc element 510, which form the insulating glass element 600, is between 55 mm, preferably in the range between 10 mm and 30 mm, in particular at 16 mm.
• the distance between the laminated glass element and the monoblock is maintained by a piece of metal, preferably of aluminum.
• the spacer 610 is sealed against the disk-shaped elements by means of a sealing material 620, which preferably consists of a butyl rubber.
• the complete sealing of the gap between the first and second disk-shaped Element is achieved by applied below the spacer 610 butyl rubber 630.
• a gaseous medium Between the first 500 and the second disc-shaped element 510 is preferably a gaseous medium.
• a noble gas medium is used here.
• the noble gas medium may, for example, the
• Elements include argon or xenon or krypton.
• the areas typical of an insulating glass element are designated, as well as the sides facing the outside, i. at the facade facing the weather side and the inside, i. the side facing the building.
• the laminated glass element which faces the outside comprises surfaces F1 and F2, the mono-disk facing the building, the surfaces F3 and F4.
• the surface F4 is provided with an antireflection coating, for example, as in the flat glass AMIRAN®.
• an antireflection coating for example, as in the flat glass AMIRAN®.
• heat protection layers such as soft coating, based on silver layers or even hard coatings, based on SnO x : F or sun protection layers may be applied.
• a pane of the composite element or the mono-pane is a colored glass.
• decorative glass would also be possible.
• FIG. 5 b a similar structure to that shown in FIG. 5 a is shown, however, in the case of the laminated glass element 700, the light sources 740 are introduced into a foil 702 which is connected between the two panes 720, 760 of the laminated glass element with further foils, e.g. As adhesive sheets (not shown) as previously described, is laminated. Otherwise, it is a same structure as in Figure 5a, and the same reference numerals, increased by 200, are used for the same components.
• FIG. 5c shows a construction of an insulating glass element with two laminated glass panes 800, 900. In such a structure, for example, in the laminated glass element 800, which is outside, the bulbs 840 may be incorporated.
• the light sources can, as already shown in FIG. 5b, be introduced into a foil.
• the foil with illuminants in turn is inserted between the discs 820 and 860 with the aid of adhesive films (not shown).
• a laminated glass element 900 comprising two disks 904, 906 is again shown in the disk facing the inside, which of course may also comprise more than two disks, for example three disks.
• the film 908 laminated into this laminated glass element may, for example, be a film 908 with liquid crystals to switch back and forth between two states, namely a scattering or cloudy state and a transmissive state, or at least in the area of a film provided with scattering bodies, which has the possibility of Up or back projection allows. Otherwise, the same components are again denoted by the same reference numerals in Figure 5c.
• the distance of the two laminated glass elements resulting in the insulating glass element is maintained by a piece of metal, preferably made of aluminum.
• an insulating glass element 950 comprising a transparent substrate 952, on which illuminants 954.1, 954.2, 954.3 are arranged, and a cover disk 960 are shown.
• Both the cover plate 960 and the transparent substrate 952 are single-pane glasses, for example soda-lime glasses.
• a conductive coating 958 is applied, which form the conductor tracks to the individual lamps 954.1, 954.2, 954.3.
• the transparent or quasi-transparent substrate 952 and the cover plate 960 form an insulating glass composite 950.
• a spacer 962 between the two disc-shaped elements 960 and 952 is introduced and sealed against the disc-shaped elements, with the aid of a sealing material, which preferably consists of butyl rubber. Between the two disks 960 and 952 then creates a gap, which preferably filled with a noble gas is, but also with a medium, such as a cooling medium can be filled.
• FIG. 5e a particular embodiment of an insulating glass element 980 is shown, comprising a transparent substrate 982, the part of a
• Composite element 956 is, in which the bulbs 954.1, 954.2, 954.3 between the transparent substrate 982 and one connected to the transparent substrate 982 disc 983 are arranged.
• the laminated glass element in turn is connected to spacers 992 with a solar module.
• the solar module is translucent and bears the reference numeral 988. Again, the inside of the insulating glass composite with INSIDE and the outside is marked with OUTSIDE.
• the solar module is arranged on the inside and the laminated glass element with bulbs on the outside. Otherwise, the arrangement is identical to the arrangement according to FIG. 5f. Due to the transparency of the composite pane with lamps arranged on the pane, enough sunlight falls on the solar module arranged on the inside.
• the transparent element according to the invention with a transparent substrate can be used as a part, preferably as a modular component of a facade construction of a multi-media facade or a large-area display with areas of 10, 20, 50, 100, 1000, 3000 square meters and more.
• the individual transparent elements have sizes of, for example, 2 ⁇ 2 m, 2 ⁇ 5 m, 2 ⁇ 10 m
• FIG. 6 shows a media façade according to the invention.
• the media façade is the reference numeral 1000.
• the media façade comprises at least one in the illustrated embodiment, however, are shown here four preferred transparent elements 1002.1, 1002.2, 1002.3, 1002.4 according to the invention with light emitting diodes, for example, to a particular facade body 1010, for example, a building with Interior are mounted with the usual art fasteners.
• the elements according to the invention can be constructed as shown in FIG. 3, FIG. 4a-c or FIG. 5a-f. It is important that the transparent elements include light sources that can be arranged on transparent substrates.
• the transparent elements are preferably standard elements with an area of for example 2 ⁇ 2 m, preferably 2 ⁇ 4 m or even 2 ⁇ 10 m. For example, the four transparent elements would result in a display area of 80 square meters if each individual transparent element had an area of 2 x 10 meters.
• the individual facade elements 1002.1, 1002.2, 1002.3, 1002.4 all comprise a multiplicity of light-emitting diodes preferably arranged in a pixel structure, preferably RGB light-emitting diode chips, which individually drive, generate running images 1050, such as television images on the front of the transparent media façade.
• a multiplicity of light-emitting diodes preferably arranged in a pixel structure, preferably RGB light-emitting diode chips, which individually drive, generate running images 1050, such as television images on the front of the transparent media façade.
• FIGS. 7a-b a first possibility of an embodiment of individual transparent modules, which are connected to one another to form a media façade, is represented.
• Fig. 7a shows a section through two such interconnected
• Module and Fig. 7b is a plan view of two such modules.
• the first module is designated by the reference numeral 2000.1, the second module by the reference numeral 2000.2.
• Each module 2000.1, 2000.2 comprises a transparent substrate 2004.1 for the module 2000.1 and 2004.2 for the module 2000.2 on which lamps, 2008.1.1, 2008.1.2, 2008.2.1, 2008.2.2 are arranged.
• the lamps, 2008.1.1, 2008.1.2, 2008.2.1, 2008.2.2 are arranged.
• Illuminants are in turn preferably soldered to so-called pads, which are connected to individual strip conductors which have been cut out of the conductive, transparent layer on the transparent substrates 2004.1, 2004.2.
• the transparent element 2000.1 comprises a cover disk or a further second disk 2006.1, 2006.2.
• the second pane which is likewise transparent or quasi-transparent, is connected to the first pane, for example by means of a casting resin 2007.1, 2007.2 or adhesive foils, such as PVB foils, introduced into the intermediate space between the two panes 2006.1, 2006.2 to form an element.
• the carrier substrate for the lamps 2004.1, 2004.2 is always wider than the cover plate 2006.1, 2006.2. This results in a border area 2010.1.1, 2010.1.2, 2010.2.1, 2010.2.2 on each side of the substrate 2004.1.
• the supply lines to the individual lamps can, as shown in Fig. 7b, in the edge region of
• Carrier substrates are performed. In the edge region of the carrier substrate then runs a Sammelstromchuck 2012.1.1, 2012.1.2, 2012.2.1, 2012.2.2, each supplying the LEDs of the substrate with power.
• FIG. 7b shows a plan view of part of a transparent optical element 2004.1, 2004.2.
• this is a representation of the transparent substrate with edge area.
• the individual light sources in particular light emitting diodes 2009.1, 2009.2, 2009.3, 2009.4 on the transparent substrate, are connected via parallel lines 2200.1, 2200.2, 2200.3, 2200.4, all to the edge 2010.1. 2 and from there to a control and / or collective power supply are supplied with power.
• the resulting gap between the individual modules is connected by means of a T-piece, as shown in Fig. 7a. Before the control 2011, a single cable will be led outwards in 2013.
• FIG. 7c shows an alternative embodiment of a connection of two modules.
• the first module is designated by the reference numeral 3000.1, the second module by the reference numeral 3000.2.
• Each module 3000.1, 3000.2 comprises a transparent substrate 3004.1 for the module 3000.1 and 3004.2 for the module 3000.2, on which lamps 3008.1.1, 3008.1.2, 3008.2.1, 3008.2.2 are arranged.
• the lighting means are in turn preferably soldered to so-called pads, which are connected to the individual conductor tracks which have been cut out of the conductive transparent layer 3004.1, 3004.2.
• the transparent element 3000.1 comprises a cover disk or a further second disk 3006.1, 3006.2.
• the second disc which is also transparent or quasi-transparent, is with the first disc, for example by a in the Intermediate space between the two discs 3006.1, 3006.2 introduced cast resin or adhesive films such as PVB films connected to form an element.
• the carrier substrate for the light sources 3004.1, 3004.2 is wider at one edge than the cover plate 3006.1, 3006.2. This results in an edge region 3010.1 on one side of the substrate 3004.1.
• the carrier substrate 3004.1 is shorter than the cover plate 3006.1.
• the cover plate 3006.1 projects beyond the carrier substrate 3004.1 in the edge region 3010.2.
• the projections of both the substrate 3004.1 in the edge region 3010.1 and the cover plate 3006.1 in the edge region 3010.2 are selected such that they are the same length.
• the module 3000.1 is overlapped, ie spanned, by the cover disk of the adjacent module 3000.2 at the locations where the carrier substrate protrudes. In this way, it is possible to provide a system in which one module seamlessly connects to the other.
• a T-profile as in the case of the embodiment according to FIGS. 7a and 7b, is not required.
• FIG. 8 the connection of a transparent optical element consisting of two panes, as shown in FIGS. 7a and 7b, respectively, is now shown with a facade.
• bores are preferably introduced into the transparent substrate or else into the cover disk. These holes are marked with reference number 5000. Through the holes with the reference numeral 5000 fasteners, such as screws, can be passed. With the help of screws then the facade elements are attached to the building.
• the fastening elements can also be designed as a hollow body, can be passed through the lines to the outside of the module.
• the facade element is designed as a composite element, as shown, consisting of a transparent substrate 5002 arranged thereon with bulbs 5004 and a cover plate.
• an intermediate layer 5006 is placed between the transparent substrate 5002 and the cover plate 5008, for example, a cast resin or an adhesive sheet.
• the cover plate 5008 is then fixed on the transparent substrate 5002, resulting in a composite element.
• the insert 5010 is provided with a functional element, for. B. connected to a fastening bolt 5020 connected.
• the insert 5010 is inserted before the transparent element 5002 is assembled together with the cover plate 5008 into a composite element.
• a metallic insert 5010 is glued to the transparent substrate by means of a hardenable glass-metal adhesive and, after the insert 5010 has been glued to the transparent pane by means of the hardenable glass-metal adhesive, then the intermediate layer is applied and with the aid of the intermediate layer 5006 and the Cover plate 5008 made the composite element.
• the conductivity of such systems or tracks is in the range of 3 to 6 ⁇ 10 ⁇ Ohnrvcm, in particular 5 to 5.5 -10 ⁇ ohm cm ( ⁇ cm).
• the layer thickness for the TiO 2 layer is preferably in the range 5 nm to 50 nm, preferably in the range 10 nm to 30 nm, and the layer thickness of the SnO 2 : F layer in the range 200 nm to 2000 nm, in particular in the range 500 nm to 600 nm.
• the highly conductive interconnects as described above can be used in all elements shown in this application, in particular display elements and are not limited to some of the applications mentioned in this application.
• the highly conductive interconnects have the advantage over low-conductive interconnects or layers that they do not become warm and thus dyeings or detachment from the transparent substrate can be avoided. Furthermore, a glass with highly conductive tracks or highly conductive
• Layers are coated, for example, by an anti-reflective coating.

Landscapes

• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Marketing (AREA)
• Accounting & Taxation (AREA)
• Business, Economics & Management (AREA)
• Manufacturing & Machinery (AREA)
• Devices For Indicating Variable Information By Combining Individual Elements (AREA)
• Laminated Bodies (AREA)
• Non-Insulated Conductors (AREA)
• Surface Treatment Of Glass (AREA)
• Magnetic Record Carriers (AREA)
• Photoreceptors In Electrophotography (AREA)
• Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Applications Claiming Priority (6)

Publications (1)

Family

ID=39877475

Family Applications (2)

Family Applications Before (1)

Country Status (5)

Families Citing this family (9)

Family Cites Families (22)

• 2008
  • 2008-06-30 WO PCT/EP2008/005274 patent/WO2009003652A1/fr active Application Filing
  • 2008-06-30 EP EP08773732A patent/EP2179632B1/fr not_active Not-in-force
  • 2008-06-30 EP EP08784565A patent/EP2172087A2/fr not_active Withdrawn
  • 2008-06-30 WO PCT/EP2008/005273 patent/WO2009003651A2/fr active Application Filing
  • 2008-06-30 DE DE502008001851T patent/DE502008001851D1/de active Active
  • 2008-06-30 AT AT08773732T patent/ATE488981T1/de active
• 2009
  • 2009-12-29 US US12/648,779 patent/US20100244732A1/en not_active Abandoned

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events