EP2135291A2 - Procédé de fabrication d'une cellule solaire et cellule solaire ainsi fabriquée - Google Patents
Procédé de fabrication d'une cellule solaire et cellule solaire ainsi fabriquéeInfo
- Publication number
- EP2135291A2 EP2135291A2 EP08716221A EP08716221A EP2135291A2 EP 2135291 A2 EP2135291 A2 EP 2135291A2 EP 08716221 A EP08716221 A EP 08716221A EP 08716221 A EP08716221 A EP 08716221A EP 2135291 A2 EP2135291 A2 EP 2135291A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- solar cell
- silicon substrate
- doped
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 41
- 239000010703 silicon Substances 0.000 claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 230000003667 anti-reflective effect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 80
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000002161 passivation Methods 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a method for producing a solar cell from silicon or from a silicon substrate and to a solar cell produced by such a method.
- the performance of solar cells is usually influenced by the type of surface of the solar cell or a surface coating.
- the focus here is on the antireflection and passivation properties, in particular to allow the greatest possible incidence of sunlight into the solar cell.
- a solar cell has an antireflection layer on the front side, for example SiN.
- the production of a conventional solar cell involves a sequence of process steps, which are shown below in abbreviated form.
- the basis is usually mono- or polycrystalline p-Si wafers, which are textured to improve the absorption properties of the surface via an etching process.
- This etching process is carried out in monocrystalline silicon with a mixture of sodium or potassium hydroxide solution with isopropyl alcohol.
- Polycrystalline silicon is etched with a solution of hydrofluoric and nitric acid.
- further etching-cleaning sequences are carried out in order to optimally prepare the surface for the following diffusion process. In this process, a pn junction in the silicon is created by the diffusion of phosphorus to a depth of about 0.5 microns.
- the pn junction separates the carriers formed by light.
- a Phosphorus source heated, usually a gas mixture or an aqueous solution.
- phosphorus penetrates into the silicon surface.
- the phosphorus-doped layer is negatively conductive in contrast to the positively-conducting boron-doped base.
- a phosphorous glass is formed on the surface, which is removed in the subsequent steps by etching with HF.
- a layer about 80 nm thick mostly consisting of SiN: H, is applied to the silicon surface for reducing the reflection and for passivation.
- the invention has for its object to provide an aforementioned method and a solar cell thus prepared, with which disadvantages of the prior art can be avoided and in particular the efficiency of a solar cell can be further increased.
- Advantageous and preferred embodiments of the invention are the subject of further claims and are explained in more detail below.
- the wording of the claims is incorporated herein by express reference.
- the wording of the priority application DE 102007012268.5 of March 8, 2007 of the same Applicant is incorporated by express reference into the content of the present specification.
- a first layer having an optical refractive index n is applied to a doped silicon substrate, which is already pretreated for the further production of a solar cell, at least on one side, wherein the refractive index is between 3.5 and 4.0 lies.
- a second layer with an optical refractive index n between 1, 9 and 2.2 is applied on this first layer.
- a two-layer structure for a surface coating of a solar cell or an antireflection layer is provided.
- the reflection of light falling on the solar cell can be further reduced, so that more light is incident on the solar cell and its efficiency is thus higher.
- a passivation of the front side of the solar cell can also be improved by such a multilayer structure.
- the first layer may have a refractive index between 3.6 and 3.9. It may comprise or consist of silicon and / or germanium. Advantageously, it consists of a- SiGe or a-SiGe: H. In this case, therefore, this layer of this material is not used as a semiconductor layer, but it should act antireflective.
- the second layer may have a refractive index n which is between 1.94 and 2.1.
- n refractive index
- the second layer can comprise or consist of silicon, advantageously SiN (x): H.
- each but both sides of the solar cell on such a double layer structure at least if both sides are to be irradiated with light.
- both sides of the silicon substrate are coated with the first layer.
- the second layer can be applied to both sides. So a more manageable process technology is possible.
- the first layer may comprise silicon and germanium, for example the abovementioned compounds. It can be provided that at least the first layer in itself, in particular also the second layer or the first layer and the second layer together, have a gradient of the concentration of germanium which increases. Such a gradient can be produced, for example, during production or application of the layers. This also has a positive influence on the antireflection properties and the passivation properties.
- Such a contact is advantageously metallic or consists of metal. It can be particularly advantageous linear or lattice-like, but at least take on a front side of the solar cell only small area for lowest possible shading.
- an electrical contact such as is applied as a line contact, is made so that it is not directly touched by the first layer or has no connection to this.
- the first layer through a dielectric layer of the be separated electrical contact, wherein such a dielectric layer consists for example of SiN.
- the dielectric layer is formed by the second layer.
- the second layer is applied to the first layer, wherein the second layer is then also introduced into the areas which have been removed in the first layer corresponding to the structural course.
- the second layer is patterned with a thinner course or removed except for the underlying silicon substrate in the form that in the resulting structure, the electrical contacts can be introduced with the desired course.
- a structuring of the layers can be done mechanically, for example, but advantageously with a laser.
- the silicon substrate can be n-doped for preparation prior to the application of the layers according to the invention on an upper side, advantageously with phosphorus.
- a p-doped layer can be produced, which should be thinner and which is advantageously doped with or consisting of aSiGe-boron.
- Fig. 2 shows a modification of the solar cell of Fig. 1 with a slightly modified contact arrangement on the front and
- Fig. 3 shows a further modification of the solar cell of Fig. 1 with again modified contacting at the front and back.
- a solar cell 20 is shown in section.
- a substrate 4 of p-doped silicon is on the in the drawing upwards send front side a thinner layer 3 of phosphorus-doped n-silicon applied.
- a thinner layer 3 of phosphorus-doped n-silicon is applied.
- a front first antireflection layer 2 having an optical refractive index n between 3.6 and 3.9.
- a front second antireflection layer 1 is applied.
- Their optical refractive index n is between 1.94 and 2.1.
- a back-side first antireflection layer 5 is provided, whose refractive index n corresponds to the front first antireflection layer 2.
- a back-side second antireflection layer 6 is provided, whose refractive index n in turn corresponds to the front first antireflection layer 1.
- the coating of the substrate 4 or the previous doping has been explained in the introduction.
- the front and the back-side first antireflection layers 2 and 5 are applied to the substrate 4 with the front-side n-silicon layer 3.
- the front and rear second antireflection layers 1 and 6 are applied.
- trenches are introduced into the front side or the front first and second antireflection layers 1 and 2, for example by laser processing.
- M eta I contacts 9 are introduced into these trenches in the manner described above, for example printed.
- the electrical contact 9 is advantageously made of aluminum and also contacts the n-silicon layer 3.
- FIG. 2 shows a further solar cell 120. It in turn consists of a substrate 104 as previously described with reference to FIG. 1, which has a phosphorus-doped n-silicon layer 103 on its upper side. On the front and back first antireflection layers 102 and 105 are applied. In turn, second antireflection layers 101 and 106 are applied to these.
- the optical refractive indices may be as described for Fig. 1.
- the advantage here is that the metallic contact 109, as described above, is only directly connected to or contacted with the n-silicon layer 103, but not with the front first antireflection layer 102.
- FIG. 3 shows a further variation of a solar cell 220 which, similar to FIG. 2, also provides for the formation of the front-side contact-making on the rear side. That is, between the backside first antireflective layer 205 and the backside metal contacts 207 made of aluminum, a part of the rear side second antireflection layer 206 with portions 213 reaches the rear side of the substrate 204. The sections 213 form a dielectric layer for insulating the rear metal contact 207 against the rear-side first anti-reflection layer 205. Again, the aluminum Backsurfacefield 208 is formed again.
- the structure of the solar cell 220 having the substrate 204, n-type silicon layer 203, and antireflection front coating by the front first antireflection layer 202 and the front second antireflection layer 201 having the front metal contact 209 corresponds to the structure of Fig. 2. That is true also for the manufacturing process.
- front and rear contacts are the same in the figures shown. However, they may differ, for example, linear contacts may be provided on one side and different forms of contact on the other side. Due to the properties of the first antireflection coating, in particular on the front side, to the silicon substrate underneath, the optical properties can be optimally adjusted. Furthermore, as tension-free as possible a coating of the silicon substrate is possible.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
L'invention concerne un procédé de fabrication d'une cellule solaire (20). Sur la face avant et la face arrière d'un substrat en silicium (4), on applique d'abord une première couche anti-réflexion (2, 5) ayant un indice de réfraction optique n compris entre 3,6 et 3,9. On applique sur cette couche une deuxième couche anti-réflexion (1, 6) ayant un indice de réfraction optique n compris entre 1,94 et 2,1. Les couches anti-réflexion (1, 2, 5, 6) sont sectionnées jusqu'au substrat en silicium (4), pour amener des contacts métalliques (7, 9) jusqu'au substrat en silicium (4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007012268A DE102007012268A1 (de) | 2007-03-08 | 2007-03-08 | Verfahren zur Herstellung einer Solarzelle sowie damit hergestellte Solarzelle |
PCT/EP2008/001702 WO2008107156A2 (fr) | 2007-03-08 | 2008-03-04 | Procédé de fabrication d'une cellule solaire et cellule solaire ainsi fabriquée |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2135291A2 true EP2135291A2 (fr) | 2009-12-23 |
Family
ID=39678057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08716221A Withdrawn EP2135291A2 (fr) | 2007-03-08 | 2008-03-04 | Procédé de fabrication d'une cellule solaire et cellule solaire ainsi fabriquée |
Country Status (12)
Country | Link |
---|---|
US (1) | US20100018580A1 (fr) |
EP (1) | EP2135291A2 (fr) |
JP (1) | JP2010520631A (fr) |
KR (1) | KR20090129422A (fr) |
CN (1) | CN101730940A (fr) |
AU (1) | AU2008224121A1 (fr) |
CA (1) | CA2679685A1 (fr) |
DE (1) | DE102007012268A1 (fr) |
IL (1) | IL200696A0 (fr) |
MX (1) | MX2009009665A (fr) |
TW (1) | TW200901484A (fr) |
WO (1) | WO2008107156A2 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7993700B2 (en) | 2007-03-01 | 2011-08-09 | Applied Materials, Inc. | Silicon nitride passivation for a solar cell |
DE102008063558A1 (de) * | 2008-12-08 | 2010-06-10 | Gebr. Schmid Gmbh & Co. | Verfahren zur Bearbeitung der Oberfläche eines Wafers zur Herstellung einer Solarzelle und Wafer |
US20100258174A1 (en) * | 2009-04-14 | 2010-10-14 | Michael Ghebrebrhan | Global optimization of thin film photovoltaic cell front coatings |
KR101665722B1 (ko) * | 2010-09-27 | 2016-10-24 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
US9379269B2 (en) | 2012-02-29 | 2016-06-28 | Bakersun | Bifacial crystalline silicon solar panel with reflector |
CN107104161A (zh) * | 2012-02-29 | 2017-08-29 | 贝克阳光公司 | 具有反射器的双面晶体硅太阳能板 |
US20150339141A1 (en) * | 2014-05-20 | 2015-11-26 | International Business Machines Corporation | Memory management for virtual machines |
KR101657814B1 (ko) * | 2014-12-23 | 2016-09-19 | 주식회사 엘지실트론 | 반도체 기판 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3810057A1 (de) * | 1988-03-25 | 1989-10-05 | Philips Patentverwaltung | Verfahren zur messung der exzentrizitaet eines in einem zylindrischen steckerstift eingebetteten lichtwellenleiters |
DE19524459A1 (de) * | 1995-07-07 | 1997-01-09 | Forschungszentrum Juelich Gmbh | Solarzelle, insbesondere Konzentrator-Solarzelle oder Eine-Sonne-Solarzelle auf Siliziumbasis mit deponierten amorphen Silizium, Silizium-Germanium und/oder anderen Siliziumlegierungs-Schichten |
EP1519422B1 (fr) * | 2003-09-24 | 2018-05-16 | Panasonic Intellectual Property Management Co., Ltd. | Cellule solaire et sa méthode de fabrication |
US20060060238A1 (en) * | 2004-02-05 | 2006-03-23 | Advent Solar, Inc. | Process and fabrication methods for emitter wrap through back contact solar cells |
US8916768B2 (en) * | 2005-04-14 | 2014-12-23 | Rec Solar Pte. Ltd. | Surface passivation of silicon based wafers |
US7375378B2 (en) * | 2005-05-12 | 2008-05-20 | General Electric Company | Surface passivated photovoltaic devices |
-
2007
- 2007-03-08 DE DE102007012268A patent/DE102007012268A1/de not_active Withdrawn
-
2008
- 2008-03-04 WO PCT/EP2008/001702 patent/WO2008107156A2/fr active Application Filing
- 2008-03-04 EP EP08716221A patent/EP2135291A2/fr not_active Withdrawn
- 2008-03-04 CN CN200880007501A patent/CN101730940A/zh active Pending
- 2008-03-04 MX MX2009009665A patent/MX2009009665A/es not_active Application Discontinuation
- 2008-03-04 KR KR1020097018704A patent/KR20090129422A/ko not_active Application Discontinuation
- 2008-03-04 JP JP2009552113A patent/JP2010520631A/ja active Pending
- 2008-03-04 CA CA002679685A patent/CA2679685A1/fr not_active Abandoned
- 2008-03-04 AU AU2008224121A patent/AU2008224121A1/en not_active Abandoned
- 2008-03-06 TW TW097107903A patent/TW200901484A/zh unknown
-
2009
- 2009-09-02 IL IL200696A patent/IL200696A0/en unknown
- 2009-09-04 US US12/554,410 patent/US20100018580A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
---|
See references of WO2008107156A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2008107156A3 (fr) | 2009-10-29 |
IL200696A0 (en) | 2010-05-17 |
KR20090129422A (ko) | 2009-12-16 |
JP2010520631A (ja) | 2010-06-10 |
CN101730940A (zh) | 2010-06-09 |
AU2008224121A1 (en) | 2008-09-12 |
WO2008107156A2 (fr) | 2008-09-12 |
DE102007012268A1 (de) | 2008-09-11 |
CA2679685A1 (fr) | 2008-09-12 |
US20100018580A1 (en) | 2010-01-28 |
MX2009009665A (es) | 2010-06-18 |
TW200901484A (en) | 2009-01-01 |
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Legal Events
Date | Code | Title | Description |
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