EP2077415A1 - LED bulb with heat removal device - Google Patents

LED bulb with heat removal device Download PDF

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Publication number
EP2077415A1
EP2077415A1 EP08000087A EP08000087A EP2077415A1 EP 2077415 A1 EP2077415 A1 EP 2077415A1 EP 08000087 A EP08000087 A EP 08000087A EP 08000087 A EP08000087 A EP 08000087A EP 2077415 A1 EP2077415 A1 EP 2077415A1
Authority
EP
European Patent Office
Prior art keywords
light source
heat removal
housing
led
removal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08000087A
Other languages
German (de)
French (fr)
Other versions
EP2077415B1 (en
Inventor
Albert Stekelenburg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP08000087A priority Critical patent/EP2077415B1/en
Priority to AT08000087T priority patent/ATE537405T1/en
Publication of EP2077415A1 publication Critical patent/EP2077415A1/en
Application granted granted Critical
Publication of EP2077415B1 publication Critical patent/EP2077415B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to light sources and more particularly to an LED (light-emitting diode) having a heat removal device for sufficiently dissipating excess heat generated by a high power (“Hi-Power”) LED.
  • LED light-emitting diode
  • Hi-Power high power
  • LED lamps have advantages including longer life, less power consumption (i.e., more energy-efficient), and no special ballasts being required.
  • LED based light sources have gradually replace conventional incandescent lamps and fluorescent lamps as an ideal light source.
  • One type of LED lamp has a Hi-Power LED as light source.
  • excess heat can be generated by the Hi-Power LED.
  • LED lamps are limited in applications (e.g., in indoor environment).
  • a need has arisen for an improved LED lamp having a heat removal device for dissipating excess heat generated by the Hi-Power LED so that the LED lamp can find applications in indoor environment.
  • the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being integrally formed with the cone by die casting.
  • the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being formed separately prior to assembling with the cone.
  • the cone comprises a plurality of longitudinal heat radiating grooves so as to provide a large heat radiating surface.
  • the heat radiating grooves have openings so as to provide a large heat radiating surface and space.
  • the LED bulb comprises a base 10, a housing 20, a heat removal device 30, a bulb 40, a printed circuit board (PCB) 50, and a solid state light source 60.
  • PCB printed circuit board
  • the base 10 is a well known device and is adapted to mount in an electrical socket.
  • the base 10 comprises a bottom contact 11 being used as, for example, positive terminal, a metallic element 12 formed of copper, the metallic element 12 being used as, for example, negative terminal, and an insulator 13 formed between the contact 11 and the metallic element 12 for preventing them from electrically contacting each other.
  • the hollow, cylindrical housing 20 is adapted to mount on the base 10.
  • the housing 20 consists of two mated halves.
  • the housing 20 is formed of an insulative material and comprises a lower portion 21 of reduced diameter adapted to secure to an upper portion of the base 10, an annular flange 22 formed between the lower portion 21 and an upper main portion of the housing 20, and a plurality of top tabs 23.
  • the insulative housing 20 is mounted between the heat removal device 30 and the metallic element 12 for preventing them from electrically contacting each other.
  • the PCB 50 is fastened in the housing 20.
  • the PCB 50 comprises electrical elements such as capacitors, resistors, diodes, etc.
  • the PCB 50 has two conductors (not numbered) electrically connected to the contact 11 and the metallic element 12 respectively.
  • the heat removal device 30 is formed of good conductive material (e.g., metal) and comprises an inverted, truncated cone 32 surrounding most portion of the housing 20 and having its bottom edge rested upon and secured to the flange 22, the cone 32 including a plurality of longitudinal, spaced heat radiating grooves 321 formed around the outer surface, the heat radiating grooves 321 substantially having one end adjacent the top edge of the cone 32 and the other end adjacent the bottom edge of the cone 32 such that the heat radiating grooves 321 can provide a large heat radiating surface, and a disc-shaped mounting member 31 secured to a top edge of the cone 32, the mounting member 31 including a plurality of holes 311 secured to the tabs 23 by snapping the tabs 23 through the holes 311 with the light source 60 on the mounting member 31 being surrounded by the holes 311. Further, the light source 60 is electrically connect to the PCB 50.
  • good conductive material e.g., metal
  • the bulb 40 is made of transparent material (e.g., glass) as to be clear or frosted to diffuse the light.
  • the bulb 40 is mounted on the top edge of the heat removal device 30 so as together with the heat removal device 30, the housing 20, and the base 10 to sealingly receive the PCB 50 and the light source 60.
  • the light source 60 is implemented as an LED (e.g., Hi-Power LED in this embodiment). Alternatively, the light source 60 is formed of another material in other embodiments.
  • Heat generated by the light source 60 can be effectively conducted away by the heat removal device 30 (i.e., through the mounting member 31 and the heat radiating grooves 321 of the cone 32).
  • a heat removal device 30' according to a second preferred embodiment of the invention is shown.
  • the characteristics of the second preferred embodiment are detailed below.
  • the mounting member 31' is integrally formed with the cone 32' by die casting. Further, the heat radiating grooves 321 are replaced by latches 321' having an open top end 323' and a lower opening 322' so as to provide a large heat radiating surface and space.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A LED bulb includes a housing (20) a having a base (10) mounted in an electrical socket; a heat removal device (30) mounted on a lower portion of the housing for surrounding the remaining portion of the housing; a bulb (40) formed of transparent material or being frosted, the bulb being mounted on a top edge of the heat removal device (30); a light source (60) (e.g., Hi-Power LED) mounted on the heat removal device and the housing; and a circuit board (50) received in the housing, the circuit board being electrically connected to the light source (60) and the base respectively. Heat generated by the LED is adapted to conduct away by the heat removal device. In one embodiment, the heat removal device includes an inverted, truncated cone having a corrugated surface. In another embodiment, the cone includes a plurality of longitudinal, spaced latches formed around, the latches having an opening.

Description

    BACKGROUND OF THE INVENTION 1. Field of Invention
  • The invention relates to light sources and more particularly to an LED (light-emitting diode) having a heat removal device for sufficiently dissipating excess heat generated by a high power ("Hi-Power") LED.
    • 2. Description of Related Art
  • LED lamps have advantages including longer life, less power consumption (i.e., more energy-efficient), and no special ballasts being required. Thus, LED based light sources have gradually replace conventional incandescent lamps and fluorescent lamps as an ideal light source.
  • One type of LED lamp has a Hi-Power LED as light source. However, excess heat can be generated by the Hi-Power LED. Hence, such LED lamps are limited in applications (e.g., in indoor environment). Hence, a need has arisen for an improved LED lamp having a heat removal device for dissipating excess heat generated by the Hi-Power LED so that the LED lamp can find applications in indoor environment.
  • There have been numerous suggestions in prior patents for LED based light sources. For example, U.S. Pat. No. 5,688,042 discloses an LED lamp and U.S. Pat. No. 7,086,767 discloses an LED bulb.
    • SUMMARY OF THE INVENTION
  • It is therefore one object of the invention to provide an LED bulb including a metal heat removal device mounted between a bulb and a housing, and a Hi-Power LED being in good thermal contact with the heat removal device such that excess heat generated by the Hi-Power LED can be sufficiently dissipated.
  • In one aspect of the invention the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being integrally formed with the cone by die casting.
  • In another aspect of the invention the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being formed separately prior to assembling with the cone.
  • In yet another aspect of the invention the cone comprises a plurality of longitudinal heat radiating grooves so as to provide a large heat radiating surface.
  • In a further aspect of the invention the heat radiating grooves have openings so as to provide a large heat radiating surface and space.
  • The above and other objects, features and advantages of the invention will become apparent from the following detailed description taken with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
    • FIG. 1 is a side elevation of an LED bulb incorporating a first preferred embodiment of heat removal device according to the invention;
    • FIG. 2 is a longitudinal sectional view of the LED bulb of FIG. 1;
    • FIG. 3 is an exploded view of the LED bulb of FIG. 1; and
    • FIG. 4 is a perspective view of a second preferred embodiment of heat removal device according to the invention.
    DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 to 3, an LED bulb in accordance with the invention is shown. The LED bulb comprises a base 10, a housing 20, a heat removal device 30, a bulb 40, a printed circuit board (PCB) 50, and a solid state light source 60. Each component is discussed in detail below.
  • The base 10 is a well known device and is adapted to mount in an electrical socket. The base 10 comprises a bottom contact 11 being used as, for example, positive terminal, a metallic element 12 formed of copper, the metallic element 12 being used as, for example, negative terminal, and an insulator 13 formed between the contact 11 and the metallic element 12 for preventing them from electrically contacting each other.
  • The hollow, cylindrical housing 20 is adapted to mount on the base 10. The housing 20 consists of two mated halves. The housing 20 is formed of an insulative material and comprises a lower portion 21 of reduced diameter adapted to secure to an upper portion of the base 10, an annular flange 22 formed between the lower portion 21 and an upper main portion of the housing 20, and a plurality of top tabs 23. The insulative housing 20 is mounted between the heat removal device 30 and the metallic element 12 for preventing them from electrically contacting each other.
  • The PCB 50 is fastened in the housing 20. The PCB 50 comprises electrical elements such as capacitors, resistors, diodes, etc. The PCB 50 has two conductors (not numbered) electrically connected to the contact 11 and the metallic element 12 respectively.
  • The heat removal device 30 is formed of good conductive material (e.g., metal) and comprises an inverted, truncated cone 32 surrounding most portion of the housing 20 and having its bottom edge rested upon and secured to the flange 22, the cone 32 including a plurality of longitudinal, spaced heat radiating grooves 321 formed around the outer surface, the heat radiating grooves 321 substantially having one end adjacent the top edge of the cone 32 and the other end adjacent the bottom edge of the cone 32 such that the heat radiating grooves 321 can provide a large heat radiating surface, and a disc-shaped mounting member 31 secured to a top edge of the cone 32, the mounting member 31 including a plurality of holes 311 secured to the tabs 23 by snapping the tabs 23 through the holes 311 with the light source 60 on the mounting member 31 being surrounded by the holes 311. Further, the light source 60 is electrically connect to the PCB 50.
  • The bulb 40 is made of transparent material (e.g., glass) as to be clear or frosted to diffuse the light. The bulb 40 is mounted on the top edge of the heat removal device 30 so as together with the heat removal device 30, the housing 20, and the base 10 to sealingly receive the PCB 50 and the light source 60.
  • The light source 60 is implemented as an LED (e.g., Hi-Power LED in this embodiment). Alternatively, the light source 60 is formed of another material in other embodiments.
  • Heat generated by the light source 60 can be effectively conducted away by the heat removal device 30 (i.e., through the mounting member 31 and the heat radiating grooves 321 of the cone 32).
  • Referring to FIG. 4, a heat removal device 30' according to a second preferred embodiment of the invention is shown. The characteristics of the second preferred embodiment are detailed below. The mounting member 31' is integrally formed with the cone 32' by die casting. Further, the heat radiating grooves 321 are replaced by latches 321' having an open top end 323' and a lower opening 322' so as to provide a large heat radiating surface and space.
  • While the invention herein disclosed has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims (7)

  1. An LED light source comprising:
    a housing having a base adapted to mount in an electrical socket;
    heat removal means formed of conductive material and mounted on a lower portion of the housing for surrounding the remaining portion of the housing;
    a bulb formed of transparent material or being frosted, the bulb being mounted on a top edge of the heat removal means;
    a light source mounted on the heat removal means and the housing, the light source being adapted to emit light to pass the bulb; and
    a circuit board received in the housing, the circuit board being electrically connected to the light source and the base respectively,
    wherein heat generated by the light source is adapted to conduct away by the heat removal means.
  2. The LED light source of claim 1, wherein the light source is an LED.
  3. The LED light source of claim 1, wherein the light source is a Hi-Power LED.
  4. The LED light source of claim 1, wherein the heat removal means is an integral member.
  5. The LED light source of claim 1, wherein the heat removal means comprises an inverted, truncated cone and a disc-shaped mounting member secured to the top of the cone with the light source secured thereon such that heat generated by the light source is adapted to conduct away through the mounting member and the cone.
  6. The LED light source of claim 5, wherein the cone includes a plurality of longitudinal, spaced heat radiating grooves formed around.
  7. The LED light source of claim 5, wherein the cone includes a plurality of longitudinal, spaced latches formed around, the latches having an opening.
EP08000087A 2008-01-04 2008-01-04 LED bulb with heat removal device Not-in-force EP2077415B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08000087A EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device
AT08000087T ATE537405T1 (en) 2008-01-04 2008-01-04 LED LAMP WITH HEAT DISSIPATION DEVICE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08000087A EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device

Publications (2)

Publication Number Publication Date
EP2077415A1 true EP2077415A1 (en) 2009-07-08
EP2077415B1 EP2077415B1 (en) 2011-12-14

Family

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Family Applications (1)

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EP08000087A Not-in-force EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device

Country Status (2)

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EP (1) EP2077415B1 (en)
AT (1) ATE537405T1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102032490A (en) * 2010-12-28 2011-04-27 深圳市聚作实业有限公司 Inner shaft radiation type LED bulb
WO2011068431A1 (en) 2009-12-03 2011-06-09 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for producing a led lamp, led lamp obtained by said method, and radiator for said lamp
EP2341277A1 (en) * 2009-09-09 2011-07-06 Panasonic Corporation Bulb-shaped lamp and lighting device
WO2012007403A1 (en) * 2010-07-13 2012-01-19 Osram Gesellschaft mit beschränkter Haftung Heat sink for a semiconductor lamp and semiconductor lamp
WO2012020366A1 (en) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. A led lamp
EP2699844A2 (en) * 2011-04-21 2014-02-26 LG Innotek Co., Ltd. Led lighting apparatus
WO2014193266A1 (en) * 2013-05-31 2014-12-04 Общество с ограниченной ответственностью "ДиС ПЛЮС" Led lamp
US8979337B2 (en) 2010-05-11 2015-03-17 Koninklijke Philips N.V. Lighting module
US9182110B2 (en) 2011-09-23 2015-11-10 Koninklijke Philips N.V. Lighting device with a circuit board mounting
RU2680720C1 (en) * 2018-05-03 2019-02-26 Юрий Борисович Соколов General-purpose led lamp

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688042A (en) 1995-11-17 1997-11-18 Lumacell, Inc. LED lamp
EP1467414A1 (en) * 2001-12-29 2004-10-13 Hangzhou Fuyang Xinying Dianzi Ltd. A led and led lamp
US20060092640A1 (en) * 2004-11-01 2006-05-04 Chia Mao Li Light enhanced and heat dissipating bulb
US7086767B2 (en) 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
WO2006118457A1 (en) * 2005-04-01 2006-11-09 Lemnis Lighting Ip Gmbh Heat sink, lamp and method for manufacturing a heat sink

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688042A (en) 1995-11-17 1997-11-18 Lumacell, Inc. LED lamp
EP1467414A1 (en) * 2001-12-29 2004-10-13 Hangzhou Fuyang Xinying Dianzi Ltd. A led and led lamp
US7086767B2 (en) 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
US20060092640A1 (en) * 2004-11-01 2006-05-04 Chia Mao Li Light enhanced and heat dissipating bulb
WO2006118457A1 (en) * 2005-04-01 2006-11-09 Lemnis Lighting Ip Gmbh Heat sink, lamp and method for manufacturing a heat sink

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2341277A4 (en) * 2009-09-09 2012-08-22 Panasonic Corp Bulb-shaped lamp and lighting device
EP2530373A3 (en) * 2009-09-09 2013-08-07 Panasonic Corporation Bulb-shaped lamp and lighting device
EP2341277A1 (en) * 2009-09-09 2011-07-06 Panasonic Corporation Bulb-shaped lamp and lighting device
US8439527B2 (en) 2009-09-09 2013-05-14 Panasonic Corporation Bulb-type lamp and lighting device
EA019873B1 (en) * 2009-12-03 2014-06-30 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for producing a led lamp, led lamp obtained by said method, and radiator for said lamp
WO2011068431A1 (en) 2009-12-03 2011-06-09 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for producing a led lamp, led lamp obtained by said method, and radiator for said lamp
US8979337B2 (en) 2010-05-11 2015-03-17 Koninklijke Philips N.V. Lighting module
WO2012007403A1 (en) * 2010-07-13 2012-01-19 Osram Gesellschaft mit beschränkter Haftung Heat sink for a semiconductor lamp and semiconductor lamp
WO2012020366A1 (en) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. A led lamp
CN102032490A (en) * 2010-12-28 2011-04-27 深圳市聚作实业有限公司 Inner shaft radiation type LED bulb
US9416953B2 (en) 2011-04-21 2016-08-16 Lg Innotek Co., Ltd. LED lighting apparatus
EP2699844A2 (en) * 2011-04-21 2014-02-26 LG Innotek Co., Ltd. Led lighting apparatus
CN103620301A (en) * 2011-04-21 2014-03-05 Lg伊诺特有限公司 Led lighting apparatus
EP2699844A4 (en) * 2011-04-21 2015-01-14 Lg Innotek Co Ltd Led lighting apparatus
CN103620301B (en) * 2011-04-21 2018-01-30 Lg伊诺特有限公司 LED light device
US9182110B2 (en) 2011-09-23 2015-11-10 Koninklijke Philips N.V. Lighting device with a circuit board mounting
WO2014193266A1 (en) * 2013-05-31 2014-12-04 Общество с ограниченной ответственностью "ДиС ПЛЮС" Led lamp
RU2556871C2 (en) * 2013-05-31 2015-07-20 Общество с ограниченной ответственностью "ДиС ПЛЮС" Led lamp
RU2680720C1 (en) * 2018-05-03 2019-02-26 Юрий Борисович Соколов General-purpose led lamp
WO2019212382A1 (en) * 2018-05-03 2019-11-07 Sokolov Yuriy Borisovich General-purpose led lamp

Also Published As

Publication number Publication date
ATE537405T1 (en) 2011-12-15
EP2077415B1 (en) 2011-12-14

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