EP2077415A1 - LED-Lampe mit Wärmeabfuhrvorrichtung - Google Patents
LED-Lampe mit Wärmeabfuhrvorrichtung Download PDFInfo
- Publication number
- EP2077415A1 EP2077415A1 EP08000087A EP08000087A EP2077415A1 EP 2077415 A1 EP2077415 A1 EP 2077415A1 EP 08000087 A EP08000087 A EP 08000087A EP 08000087 A EP08000087 A EP 08000087A EP 2077415 A1 EP2077415 A1 EP 2077415A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- light source
- heat removal
- housing
- led
- removal device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to light sources and more particularly to an LED (light-emitting diode) having a heat removal device for sufficiently dissipating excess heat generated by a high power (“Hi-Power”) LED.
- LED light-emitting diode
- Hi-Power high power
- LED lamps have advantages including longer life, less power consumption (i.e., more energy-efficient), and no special ballasts being required.
- LED based light sources have gradually replace conventional incandescent lamps and fluorescent lamps as an ideal light source.
- One type of LED lamp has a Hi-Power LED as light source.
- excess heat can be generated by the Hi-Power LED.
- LED lamps are limited in applications (e.g., in indoor environment).
- a need has arisen for an improved LED lamp having a heat removal device for dissipating excess heat generated by the Hi-Power LED so that the LED lamp can find applications in indoor environment.
- the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being integrally formed with the cone by die casting.
- the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being formed separately prior to assembling with the cone.
- the cone comprises a plurality of longitudinal heat radiating grooves so as to provide a large heat radiating surface.
- the heat radiating grooves have openings so as to provide a large heat radiating surface and space.
- the LED bulb comprises a base 10, a housing 20, a heat removal device 30, a bulb 40, a printed circuit board (PCB) 50, and a solid state light source 60.
- PCB printed circuit board
- the base 10 is a well known device and is adapted to mount in an electrical socket.
- the base 10 comprises a bottom contact 11 being used as, for example, positive terminal, a metallic element 12 formed of copper, the metallic element 12 being used as, for example, negative terminal, and an insulator 13 formed between the contact 11 and the metallic element 12 for preventing them from electrically contacting each other.
- the hollow, cylindrical housing 20 is adapted to mount on the base 10.
- the housing 20 consists of two mated halves.
- the housing 20 is formed of an insulative material and comprises a lower portion 21 of reduced diameter adapted to secure to an upper portion of the base 10, an annular flange 22 formed between the lower portion 21 and an upper main portion of the housing 20, and a plurality of top tabs 23.
- the insulative housing 20 is mounted between the heat removal device 30 and the metallic element 12 for preventing them from electrically contacting each other.
- the PCB 50 is fastened in the housing 20.
- the PCB 50 comprises electrical elements such as capacitors, resistors, diodes, etc.
- the PCB 50 has two conductors (not numbered) electrically connected to the contact 11 and the metallic element 12 respectively.
- the heat removal device 30 is formed of good conductive material (e.g., metal) and comprises an inverted, truncated cone 32 surrounding most portion of the housing 20 and having its bottom edge rested upon and secured to the flange 22, the cone 32 including a plurality of longitudinal, spaced heat radiating grooves 321 formed around the outer surface, the heat radiating grooves 321 substantially having one end adjacent the top edge of the cone 32 and the other end adjacent the bottom edge of the cone 32 such that the heat radiating grooves 321 can provide a large heat radiating surface, and a disc-shaped mounting member 31 secured to a top edge of the cone 32, the mounting member 31 including a plurality of holes 311 secured to the tabs 23 by snapping the tabs 23 through the holes 311 with the light source 60 on the mounting member 31 being surrounded by the holes 311. Further, the light source 60 is electrically connect to the PCB 50.
- good conductive material e.g., metal
- the bulb 40 is made of transparent material (e.g., glass) as to be clear or frosted to diffuse the light.
- the bulb 40 is mounted on the top edge of the heat removal device 30 so as together with the heat removal device 30, the housing 20, and the base 10 to sealingly receive the PCB 50 and the light source 60.
- the light source 60 is implemented as an LED (e.g., Hi-Power LED in this embodiment). Alternatively, the light source 60 is formed of another material in other embodiments.
- Heat generated by the light source 60 can be effectively conducted away by the heat removal device 30 (i.e., through the mounting member 31 and the heat radiating grooves 321 of the cone 32).
- a heat removal device 30' according to a second preferred embodiment of the invention is shown.
- the characteristics of the second preferred embodiment are detailed below.
- the mounting member 31' is integrally formed with the cone 32' by die casting. Further, the heat radiating grooves 321 are replaced by latches 321' having an open top end 323' and a lower opening 322' so as to provide a large heat radiating surface and space.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT08000087T ATE537405T1 (de) | 2008-01-04 | 2008-01-04 | Led-lampe mit wärmeabfuhrvorrichtung |
EP08000087A EP2077415B1 (de) | 2008-01-04 | 2008-01-04 | LED-Lampe mit Wärmeabfuhrvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08000087A EP2077415B1 (de) | 2008-01-04 | 2008-01-04 | LED-Lampe mit Wärmeabfuhrvorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2077415A1 true EP2077415A1 (de) | 2009-07-08 |
EP2077415B1 EP2077415B1 (de) | 2011-12-14 |
Family
ID=39283904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08000087A Not-in-force EP2077415B1 (de) | 2008-01-04 | 2008-01-04 | LED-Lampe mit Wärmeabfuhrvorrichtung |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2077415B1 (de) |
AT (1) | ATE537405T1 (de) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102032490A (zh) * | 2010-12-28 | 2011-04-27 | 深圳市聚作实业有限公司 | 内轴散热式led球泡灯 |
WO2011068431A1 (ru) | 2009-12-03 | 2011-06-09 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Способ изготовления светодиодной лампы, светодиодная лампа, изготовленная этим способом и радиатор для этой лампы |
EP2341277A1 (de) * | 2009-09-09 | 2011-07-06 | Panasonic Corporation | Birnenförmige lampe und beleuchtungsvorrichtung |
WO2012007403A1 (de) * | 2010-07-13 | 2012-01-19 | Osram Gesellschaft mit beschränkter Haftung | Kühlkörper für eine halbleiterlampe und halbleiterlampe |
WO2012020366A1 (en) * | 2010-08-13 | 2012-02-16 | Koninklijke Philips Electronics N.V. | A led lamp |
EP2699844A2 (de) * | 2011-04-21 | 2014-02-26 | LG Innotek Co., Ltd. | Led-beleuchtungsvorrichtung |
WO2014193266A1 (ru) * | 2013-05-31 | 2014-12-04 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Светодиодная лампа |
US8979337B2 (en) | 2010-05-11 | 2015-03-17 | Koninklijke Philips N.V. | Lighting module |
US9182110B2 (en) | 2011-09-23 | 2015-11-10 | Koninklijke Philips N.V. | Lighting device with a circuit board mounting |
RU2680720C1 (ru) * | 2018-05-03 | 2019-02-26 | Юрий Борисович Соколов | Светодиодная лампа общего назначения |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688042A (en) | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
EP1467414A1 (de) * | 2001-12-29 | 2004-10-13 | Hangzhou Fuyang Xinying Dianzi Ltd. | Led und led-lampe |
US20060092640A1 (en) * | 2004-11-01 | 2006-05-04 | Chia Mao Li | Light enhanced and heat dissipating bulb |
US7086767B2 (en) | 2004-05-12 | 2006-08-08 | Osram Sylvania Inc. | Thermally efficient LED bulb |
WO2006118457A1 (en) * | 2005-04-01 | 2006-11-09 | Lemnis Lighting Ip Gmbh | Heat sink, lamp and method for manufacturing a heat sink |
-
2008
- 2008-01-04 EP EP08000087A patent/EP2077415B1/de not_active Not-in-force
- 2008-01-04 AT AT08000087T patent/ATE537405T1/de active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688042A (en) | 1995-11-17 | 1997-11-18 | Lumacell, Inc. | LED lamp |
EP1467414A1 (de) * | 2001-12-29 | 2004-10-13 | Hangzhou Fuyang Xinying Dianzi Ltd. | Led und led-lampe |
US7086767B2 (en) | 2004-05-12 | 2006-08-08 | Osram Sylvania Inc. | Thermally efficient LED bulb |
US20060092640A1 (en) * | 2004-11-01 | 2006-05-04 | Chia Mao Li | Light enhanced and heat dissipating bulb |
WO2006118457A1 (en) * | 2005-04-01 | 2006-11-09 | Lemnis Lighting Ip Gmbh | Heat sink, lamp and method for manufacturing a heat sink |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2341277A4 (de) * | 2009-09-09 | 2012-08-22 | Panasonic Corp | Birnenförmige lampe und beleuchtungsvorrichtung |
EP2530373A3 (de) * | 2009-09-09 | 2013-08-07 | Panasonic Corporation | Birnenförmige Lampe und Beleuchtungsvorrichtung |
EP2341277A1 (de) * | 2009-09-09 | 2011-07-06 | Panasonic Corporation | Birnenförmige lampe und beleuchtungsvorrichtung |
US8439527B2 (en) | 2009-09-09 | 2013-05-14 | Panasonic Corporation | Bulb-type lamp and lighting device |
EA019873B1 (ru) * | 2009-12-03 | 2014-06-30 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Способ изготовления светодиодной лампы, светодиодная лампа, изготовленная этим способом, и радиатор для этой лампы |
WO2011068431A1 (ru) | 2009-12-03 | 2011-06-09 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Способ изготовления светодиодной лампы, светодиодная лампа, изготовленная этим способом и радиатор для этой лампы |
US8979337B2 (en) | 2010-05-11 | 2015-03-17 | Koninklijke Philips N.V. | Lighting module |
WO2012007403A1 (de) * | 2010-07-13 | 2012-01-19 | Osram Gesellschaft mit beschränkter Haftung | Kühlkörper für eine halbleiterlampe und halbleiterlampe |
WO2012020366A1 (en) * | 2010-08-13 | 2012-02-16 | Koninklijke Philips Electronics N.V. | A led lamp |
CN102032490A (zh) * | 2010-12-28 | 2011-04-27 | 深圳市聚作实业有限公司 | 内轴散热式led球泡灯 |
US9416953B2 (en) | 2011-04-21 | 2016-08-16 | Lg Innotek Co., Ltd. | LED lighting apparatus |
EP2699844A2 (de) * | 2011-04-21 | 2014-02-26 | LG Innotek Co., Ltd. | Led-beleuchtungsvorrichtung |
CN103620301A (zh) * | 2011-04-21 | 2014-03-05 | Lg伊诺特有限公司 | Led照明装置 |
EP2699844A4 (de) * | 2011-04-21 | 2015-01-14 | Lg Innotek Co Ltd | Led-beleuchtungsvorrichtung |
CN103620301B (zh) * | 2011-04-21 | 2018-01-30 | Lg伊诺特有限公司 | Led照明装置 |
US9182110B2 (en) | 2011-09-23 | 2015-11-10 | Koninklijke Philips N.V. | Lighting device with a circuit board mounting |
WO2014193266A1 (ru) * | 2013-05-31 | 2014-12-04 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Светодиодная лампа |
RU2556871C2 (ru) * | 2013-05-31 | 2015-07-20 | Общество с ограниченной ответственностью "ДиС ПЛЮС" | Светодиодная лампа |
RU2680720C1 (ru) * | 2018-05-03 | 2019-02-26 | Юрий Борисович Соколов | Светодиодная лампа общего назначения |
WO2019212382A1 (ru) * | 2018-05-03 | 2019-11-07 | Sokolov Yuriy Borisovich | Светодиодная лампа общего назначения |
Also Published As
Publication number | Publication date |
---|---|
EP2077415B1 (de) | 2011-12-14 |
ATE537405T1 (de) | 2011-12-15 |
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