EP2068103A3 - Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul - Google Patents

Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul Download PDF

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Publication number
EP2068103A3
EP2068103A3 EP08020788.9A EP08020788A EP2068103A3 EP 2068103 A3 EP2068103 A3 EP 2068103A3 EP 08020788 A EP08020788 A EP 08020788A EP 2068103 A3 EP2068103 A3 EP 2068103A3
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EP
European Patent Office
Prior art keywords
measuring
module
contact element
chamber
measuring module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08020788.9A
Other languages
English (en)
French (fr)
Other versions
EP2068103A2 (de
EP2068103B1 (de
Inventor
Olivier Zogmal
Daniel Guy Baumann
Frank Lehnert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bruker Switzerland AG
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Bruker Biospin SAS
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Publication of EP2068103A2 publication Critical patent/EP2068103A2/de
Publication of EP2068103A3 publication Critical patent/EP2068103A3/de
Application granted granted Critical
Publication of EP2068103B1 publication Critical patent/EP2068103B1/de
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2600/00—Control issues
    • F25D2600/04—Controlling heat transfer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Ein Messmodul zur Messung eines Messobjektes (6) mit einer Messkammer (4), mit einem Kontaktelement (5a, 5b), wobei das Messobjekt (6) mit einer ersten Kontaktfläche (9a) des Kontaktelementes (5a, 5b) thermisch verbunden ist, und mit einem Kaltkopf (1 b, 2b, 2c), der mit einer zweiten Kontaktfläche (9b) des Kontaktelementes (5a, 5b) thermisch verbunden werden kann, wobei das Kontaktelement (5a, 5b) aus thermisch gut leitendem Material besteht, ist dadurch gegenzeichnet, dass der Kryokühler (1 a, 2a) samt Kaltkopf in einer Kühlkammer (3) untergebracht ist, welche von der Messkammer (4) räumlich getrennt und unabhängig von dieser evakuierbar ist, dass das Kontaktelement (5a, 5b) thermisch isoliert von der Außenwand des Messmoduls befestigt, Teil einer Trennwand zwischen der Messkammer (4) und der Kühlkammer (3) ist und eine lokale thermische Verbindung von der Messkammer (4) zur Kühlkammer (3) herstellt, und dass eine Kontaktierungseinrichtung zur Änderung des Wärmeflusses im hermetisch geschlossenen Zustand des Messmoduls vorgesehen ist. Mit einem derartigen Messmodul können Abkühlzeiten und Aufwärmzeiten des Messobjekts stark verkürzt werden.
EP08020788.9A 2007-12-05 2008-11-29 Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul Active EP2068103B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007055712A DE102007055712A1 (de) 2007-12-05 2007-12-05 Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul

Publications (3)

Publication Number Publication Date
EP2068103A2 EP2068103A2 (de) 2009-06-10
EP2068103A3 true EP2068103A3 (de) 2018-03-21
EP2068103B1 EP2068103B1 (de) 2020-08-19

Family

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Family Applications (1)

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EP08020788.9A Active EP2068103B1 (de) 2007-12-05 2008-11-29 Messmodul zur schnellen Messung von elektrischen, elektronischen und mechanischen Bauteilen bei kryogenen Temperaturen sowie Messeinrichtung mit einem solchen Messmodul

Country Status (3)

Country Link
US (1) US7667476B2 (de)
EP (1) EP2068103B1 (de)
DE (1) DE102007055712A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5715444B2 (ja) * 2011-02-28 2015-05-07 東京エレクトロン株式会社 載置装置
JP5947023B2 (ja) * 2011-11-14 2016-07-06 東京エレクトロン株式会社 温度制御装置、プラズマ処理装置、処理装置及び温度制御方法
GB2513151B (en) 2013-04-17 2015-05-20 Siemens Plc Improved thermal contact between cryogenic refrigerators and cooled components
NL1040379C2 (en) * 2013-09-06 2015-03-09 Janssen Prec Engineering Actuated thermal switch.
US10041894B1 (en) * 2015-09-09 2018-08-07 Amazon Technologies, Inc. Thermal conductivity measurement of anisotropic substrates
US10126359B2 (en) * 2017-01-12 2018-11-13 Sensata Technologies Free piston stirling cooler temperature control system for semiconductor test
JP6770758B2 (ja) * 2019-01-15 2020-10-21 株式会社 Ｓｙｎａｘ コンタクタおよびハンドラ
US11619691B2 (en) * 2019-05-02 2023-04-04 General Electric Company Integrated cooling circuit for use with a superconducting magnet
CN112986730A (zh) * 2021-02-08 2021-06-18 国网内蒙古东部电力有限公司呼伦贝尔供电公司 一种适用于极寒环境下的配电变压器交接试验移动式检测装置
CN117387816A (zh) * 2023-10-18 2024-01-12 中国原子能科学研究院 一种温度调整装置及中子衍射残余应力测量系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2203844A1 (de) * 1971-01-28 1972-08-24 Cryogenic Technology, Inc., WaItham, Mass. (V.St.A.) Vorrichtung zum Kühlen eines Kühlgutes
US4115736A (en) * 1977-03-09 1978-09-19 The United States Of America As Represented By The Secretary Of The Air Force Probe station
WO1984000404A1 (en) * 1982-07-06 1984-02-02 Helix Tech Corp Means for periodic desorption of a cryopump
US20050166600A1 (en) * 2003-10-15 2005-08-04 Hitoshi Mitsubori Superconducting magnet apparatus and maintenance method of refrigerator for the same
US20070234751A1 (en) * 2006-04-06 2007-10-11 National Institute Of Advanced Industrial Science And Technology Sample cooling apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960677B2 (ja) * 1996-02-27 1999-10-12 長瀬産業株式会社 冷凍機を用いた試験装置
DE19720677C1 (de) * 1997-05-16 1998-10-22 Spectrospin Ag NMR-Meßvorrichtung mit gekühltem Meßkopf
US6191599B1 (en) * 1998-10-09 2001-02-20 International Business Machines Corporation IC device under test temperature control fixture
US6184504B1 (en) * 1999-04-13 2001-02-06 Silicon Thermal, Inc. Temperature control system for electronic devices
JP2002043381A (ja) * 2000-07-19 2002-02-08 Tokyo Electron Ltd ウエハ温度制御装置
US6628131B1 (en) * 2000-11-06 2003-09-30 Intel Corporation Test unit and enclosure for testing integrated circuits
US7397258B2 (en) * 2005-09-15 2008-07-08 Advantest Corporation Burn-in system with heating blocks accommodated in cooling blocks

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2203844A1 (de) * 1971-01-28 1972-08-24 Cryogenic Technology, Inc., WaItham, Mass. (V.St.A.) Vorrichtung zum Kühlen eines Kühlgutes
US4115736A (en) * 1977-03-09 1978-09-19 The United States Of America As Represented By The Secretary Of The Air Force Probe station
WO1984000404A1 (en) * 1982-07-06 1984-02-02 Helix Tech Corp Means for periodic desorption of a cryopump
US20050166600A1 (en) * 2003-10-15 2005-08-04 Hitoshi Mitsubori Superconducting magnet apparatus and maintenance method of refrigerator for the same
US20070234751A1 (en) * 2006-04-06 2007-10-11 National Institute Of Advanced Industrial Science And Technology Sample cooling apparatus

Also Published As

Publication number Publication date
US20090146676A1 (en) 2009-06-11
EP2068103A2 (de) 2009-06-10
EP2068103B1 (de) 2020-08-19
US7667476B2 (en) 2010-02-23
DE102007055712A1 (de) 2009-06-18

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