EP2067631B1 - Embossing device using embossing belts - Google Patents

Abstract

The device has embossing units (1) arranged on a transport conveyor (2). The adjacent embossing units are combined into a common part and/or closely arranged such that embossing distance (1p) between the units is coordinated with overlapping length. The adjacent units are provided at clear distance with each other in longitudinal direction, where the clear distance is less than length of the adjacent units. Each embossing unit has a supporting roller (1a) and intermediately arranged stabilizing rollers.

Description

The invention is based on a device for embossing workpieces guided along a transport path with a film, preferably a laminating film or transfer film, for. B. hot stamping foil. This device comprises an embossing device which is arranged on the transport path, a workpiece transport device which moves the workpieces along the transport path past the embossing device and a film guiding device which feeds the film to the embossing device and optionally removes a carrier film remaining after being embossed as waste , The embossing device has at least two support rollers and a circumferentially driven embossing band of silicone, preferably metal-reinforced silicone or of an elastomer with silicone-like properties. This embossing device forms a longitudinally extending embossing path in the direction of the transport path. In the embossing path, the film is applied under the action of pressure and temperature on the embossing belt on the guided in the transport path workpiece. In practice, this is called impressing or embossing the workpiece with the film.

Such devices for embossing are z. B. from the DE 41 21 766 C2 , of the DE 102 16 139 C1 and the DE 103 52 700 B3 known. These documents describe embossing stations each having two back-up rolls and a driven idler roll arranged in a triangle configuration with a circumferential embossing belt. These embossing stations each have an embossing path, which is formed between the two guide rollers. The embossing speed is determined by the dimensions of this embossing station, that is largely determined by the distance between the two support rollers. The embossing devices are used in particular for embossing milled edges of ceiling and floor panels. In particular, if several chamfer surfaces are to be stamped on different edges or with different angular position or irregular chamfers, the known embossing devices result in a complex procedure with sometimes low embossing speed, so that the desired high production rate is not optimally achieved.

The DE 25 53 802 A1 describes a double-band embossing press, is pressed in the pressed material between two circulating guided steel strips with the aim of compaction and solidification of the pressed material under application of laminating material. The press belts can be used to press surface structures into the surface of the pressed material.

The CH 661 804 A5 describes a device in which a relief is embossed in a thermoplastic ribbon-shaped material. In the relief embossing device described there, the relief embossing process takes place between two calender rolls, specifically in the tangential contact area of these two opposing calender rolls.

The US 3,067,718 A describes a device for treating surface-hardened materials, in which substances such as paint, adhesive or coating material are applied to the materials to be treated. The materials to be treated are moved between a conveyor belt and a working belt, wherein the material to be applied to the material is applied to the working belt. In order to treat the materials under the action of a uniform pressure as possible, magnetic clamping plates are provided, wherein at least the working band consists of a responsive to magnetic forces material.

The invention has for its object to develop a device for embossing of the type mentioned so that a simple operation with the possibility of high production speeds can be realized.

This object is achieved by the invention with the subject matter of patent claim 1.

It is envisaged that in the embossing device according to the invention now at least two adjacent embossing means along the transport path arranged one behind the other and / or are arranged transversely to the transport path offset parallel to each other and are so closely adjacent arranged that the embossing lines of the at least two adjacent embossing means overlapping longitudinal extents are arranged or directly adjoin one another in the longitudinal direction or have a clearance in the longitudinal direction, which is less than the length of one of the two embossing lines of the adjacent embossing means. With this close succession arrangement or juxtaposition of the embossing lines is achieved that the composite of the plurality of embossing embossing unit has composite embossing lines that are longer than in the prior art and thus allow increased embossing speed or offset parallel to each other, the simultaneous operation in embossing allows and thus also allows an increase in production speed. By arranging the plurality of closely spaced embossing means in a common structural unit with a common carrier, common housing or other connecting parts, practicable handling of the embossing unit composed of a plurality of smaller embossing means is obtained, with the required precise geometric alignment of the embossing lengths of the individual embossing means being securely adjusted can.

Advantageously, the mutually adjacent stamping devices are assigned as closely as possible to one another. The clear distance of the longitudinal direction successively arranged embossing lines is preferably less than 50% of the length of the embossing path of one of these closely adjacent embossing devices. The clear distance of the embossing lines may in this case preferably be approximately the same as the diameter of one of the support rollers of the adjacent embossing devices and / or approximately equal to the sum of half the diameter of the two terminal support rollers at the mutually facing ends of the two adjacent embossing devices. Thus, a very close succession of the embossing lines is obtained when the closely adjacent embossing means are arranged so that the embossing lines are arranged in alignment with each other in their longitudinal extent.

In the event that the closely adjacent embossing means are arranged to each other that the embossing lines are arranged offset parallel to each other in the direction transverse to the transport path, in particular embodiments in which the embossing lines are arranged with overlapping longitudinal extent or in the longitudinal direction directly without clearance connect to each other.

In overlapping longitudinal extent of the embossing lines is an advantageous simultaneous embossing z. B. of angularly arranged chamfer surfaces possible.

In principle, the embossing lines of the closely adjacent stamping devices can be arranged in a common plane or in two planes which are arranged at an angle to one another.

Embodiments are provided in which the adjacent embossing devices each carry out the embossing process with a separate film or with a common film. Working with separate foils in the adjacent embossing means can be carried out in particular in embodiments in which mutually parallel embossing paths are present in order to z. B. Beveled chamfer surfaces which are arranged at an angle to each other. The feeding of the adjacent stamping stations with a separate film can also be used if certain areas of the workpiece are to be embossed with a plurality of film layers or partially overlapping. The equipping of the individual embossing device with a common film is particularly in question when the embossing lines are arranged one behind the other in their longitudinal direction and only an increase in the embossing speed or extension of the embossing line is desired.

In the following embodiments will be described with reference to figures.

Figur 1

eine schematische Draufsicht einer Prägevorrichtung mit zwei hintereinander angeordneten Prägeeinrichtungen;

Figur 2

eine schematische Schnittansicht in Schnittebene entlang Schnittlinie II-II in Figur 1, wobei ausschnittweise das Werkstück mit abgefaster Kante mit ebener Fasenfläche und eine mit der ebenen Fasenfläche zusammenwirkende Prägeeinrichtung mit dazwischen angeordneter Transferfolie gezeigt ist;

Figur 3

eine Schnittansicht entsprechend Figur 2, wobei ausschnittweise ein Werkstück mit abgefaster Kante mit zwei ebenen winkelig zueinander angeordneten Fasenflächen und zwei mit den beiden ebenen Fasenflächen zusammenwirkende Prägeeinrichtungen mit einer dazwischen angeordneten, gemeinsamen Transferfolie gezeigt ist;

Figur 4

eine Schnittansicht wie Figur 3, wobei aber im Unterschied zu Figur 3 zwei separate Transferfolien zum Beprägen der beiden Fasenflächen vorgesehen sind.

Show

FIG. 1

a schematic plan view of an embossing device with two consecutively arranged embossing means;

FIG. 2

a schematic sectional view in section plane along section line II-II in FIG. 1 , wherein fragmentary the workpiece with chamfered edge with flat chamfer surface and a cooperating with the flat chamfer surface embossing device is shown with interposed transfer film;

FIG. 3

a sectional view accordingly FIG. 2 in which a workpiece with a chamfered edge is partially shown with two planar chamfer surfaces arranged at an angle to one another and two embossing devices cooperating with the two planar chamfer surfaces with a common transfer film arranged therebetween;

FIG. 4

a sectional view like FIG. 3 , but unlike FIG. 3 two separate transfer sheets are provided for embossing the two chamfer surfaces.

The embossing device in FIG. 1 comprises two embossing devices 1, 1. The embossing devices 1, 1 are arranged on a transport path 2, along which the workpieces 3 to be embossed are guided.

The embossing devices 1, 1 are in the in FIG. 1 illustrated case along the transport path 2 arranged closely behind one another. They can be summarized as a unit with a common carrier, not shown, or a common housing.

The embossing devices 1, 1 are each constructed identically in the illustrated embodiment. They each comprise two support rollers 1a and a deflection roller 1b and a support body belt driven circumferentially about these three rollers, hereinafter referred to as embossing belt 1c. The embossing band 1c is formed as a silicone band. A metal reinforcement of the silicone strip is possible and preferred in order to increase the mechanical stability of the silicone strip. Likewise, the use of elastomers, rubbers or plastics is possible, which have similar properties as silicones, namely a high temperature resistance and as constant as possible and easily adjustable elasticity over the highest possible temperature range. Each embossing device 1 is in FIG. 1 formed with a triangle configuration, that is, the two support rollers 1 a and the guide roller 1b are arranged in a triangular configuration, so that the circumferential embossing belt 1 c has a substantially triangular orbit. In the illustrated case, the orbit is formed as an equilateral triangle. The base side between the two support rollers 1 a forms the embossing path 1 p of the respective embossing device 1. In the region of the two legs to the guide roller 1 b each have a heater 1 h is arranged. This ensures that the Stamping tape 1 c is heated and thus in the embossing path 1 p the embossing process can be carried out under the action of pressure and temperature. This is necessary when using a hot stamping foil, so that during the embossing process the transfer layer of the hot stamping foil is properly detached from the carrier foil and impressed on the surface of the workpiece to be embossed. By the respective heaters 1 h in both embossing devices 1 both embossing bands 1 c are each heated separately. During the circulation of the embossing belt 1 c in the orbit cools the embossing belt in the embossing path 1 p in its longitudinal extent. By dividing the composite embossing path into two separate shorter embossing lines 1 p is achieved in an advantageous manner that the embossing belt 1c only over a relatively short distance (the embossing path 1 p) cools and compared to a non-composite, uninterrupted similarly long embossing line in the Average higher temperature and thus has better properties as embossing tool.

The embossing lines 1p of the embossing devices 1, 1 closely arranged one behind the other in the illustrated case along the transport path 2 are arranged one behind the other in a line in their longitudinal direction. The clear distance between the two embossing lines 1 p is small, that is in the order of the diameter of a support roller 1 a. Thus, a composite embossing line for the two successively arranged embossing devices 1, 1 is obtained, which has twice the length as the embossing path of a single embossing device 1. This makes it possible to work with a higher embossing speed and thus with a higher production rate.

The transport route 2 is in FIG. 1 Part of a transport device, not shown, in which the workpieces 3 arranged one behind the other are moved past the embossing devices 1, 1 at a feed rate. The feed rate corresponds to the rotational speed of the embossing belt 1 c. The workpieces 3 are driven in the transport path 2 on a non-illustrated with the relevant feed speed Fixed conveyor belt arranged. The attachment is such that the workpieces 3 are taken with the conveyor belt without play and are fixed in position on the conveyor belt in the longitudinal and transverse directions. This fixation can take place, for example, in that the workpieces are braced via fastening elements with the conveyor belt or are fixed on the surface of the conveyor belt via a suction device in conjunction with frictional engagement.

The workpieces 3 are in the illustrated case, panels with a chamfered edge, as in the sectional view in FIG. 2 is recognizable. The chamfer surface is embossed with a foil 4 during the embossing process. The film 4 is formed in the case shown as a hot stamping film having a transfer layer and a carrier film. This stamping foil 4 will, as in FIG. 1 Recognizable from a film feeding 5a the embossing devices 1, 1 fed. The film feed device 5a comprises a film unwinder 5a1 and a plurality of deflection rollers 5a2. The stamping foil 4 is the embossing devices 1, 1 in FIG. 1 supplied so that it passes first in the illustration left embossing device 1 and then the right embossing device 1. Each embossing device 1 in each case forms an embossing path 1 p, in which the workpieces which have just been passed through the embossing device 1 are embossed with the embossing film 4 which is just passing. The embossing path 1p is formed by the pressure region of the embossing belt 1c on the workpiece to be embossed. This pressure region is formed on the outside of the embossing belt 1c in the region between the two support rollers. In the area between the two support rollers 1a can still axially parallel to the support rollers a plurality of stabilizing rollers of smaller diameter, not shown, which ensure that the embossing belt is supported in the embossing path between the support rollers 1 a and thus the most uniform pressure in the embossing paths 1 p is present at the embossing band. For this purpose, the stabilizing rollers can be pressurized by means of controllable hydraulic or servomotor support devices.

Each embossing device 1 is in FIG. 1 As is known per se, it is designed with a triangular configuration, that is, the two support rollers 1a and the deflection roller 1b are arranged in a triangular configuration, so that the peripheral embossing belt 1c has a substantially triangular orbit. In the illustrated case, the orbit is formed as an equilateral triangle. The base side between the two support rollers 1 a forms the embossing path 1 p of the respective embossing device 1. In the region of the two legs to the guide roller 1b each have a heater 1h is arranged. This ensures that the embossing belt 1c is heated and thus in the embossing path 1 p of the embossing process can be carried out under the action of pressure and temperature. This is necessary in the use of a hot stamping foil, so that during the embossing process, the transfer layer of the hot stamping foil is properly detached from the carrier foil and impressed on the surface to be embossed.

The composite embossing unit of the embossing unit formed from the two embossing devices 1, 1 connected one behind the other is, as explained above, formed by the embossing lines 1p arranged one behind the other in the longitudinal direction. The embossing process takes place in the area of the composite embossing path. In the embossing process, the transfer layer 4a under the action of pressure and elevated temperature on the chamfer surface 3a (see FIG. 2 ) and detached from the carrier film 4b.

The untransferred carrier film 4b is drawn off as waste via the film removal device 5b at the end of the second embossing device 1 from the embossed surface. The Folienabführeinrichtung 5b has for this purpose in FIG. 1 a film unwinder 5b1, which peels off the carrier film 4b via deflection rollers 5b2 and winds on a cross-wound bobbin of the film unwinder 5b1.

FIG. 2 shows a sectional view through the embossing device 1 in FIG. 1 , The workpiece 3 to be embossed is designed as a panel. It points, as in FIG. 2 can be seen, a chamfered edge with a flat inclined chamfer surface 3a, the is embossed with the transfer layer 4a of the transfer film 4. Further shows FIG. 2 a section of the embossing device 1 in the region of the stamping line 1 c formed by the embossing belt 1 c. The width of the embossing belt 1c is slightly larger than the width of the beveled chamfer surface 3a. Also, the width of the transfer film is in FIG. 2 larger than the width of the beveled chamfer surface 3a of the workpiece. The transfer film is on both sides over the beveled chamfer surface 3a. The embossing takes place exclusively in the region in which the embossing belt 1c comes under pressure during the embossing process under pressure on the chamfer surface 3a under pressure. The remaining portions of the film, which are not applied to the chamfer surface 3a, either remain on the carrier film as non-distinct components and adhere to the salient components on the edge of the chamfer surface 3a and are removed in the embossing process by brushes or the like.

In FIG. 3 is a workpiece 4 with a chamfered edge with two mutually angularly arranged chamfer surfaces 3a1, 3a2 shown. The two chamfer surfaces 3a1 and 3a2 form an obtuse angle with each other. The embossing of the two chamfer surfaces 3a1, 3a2 takes place in FIG. 3 with a common film 4. This film 4 has a width which covers the two bevel surfaces 3a1, 3a2 in their width and corresponding to as in FIG. 2 something overhangs on the edge. The embossing process in FIG. 3 done by placing the first in FIG. 3 upper chamfer surface 3a1 with a first embossing device 1 and the second in FIG. 3 lower chamfer surface 3a2 cooperates with a second embossing device 1. For this purpose, these embossing devices 1, 1 are arranged so that the embossing lines are arranged at an angle to each other and that at an angle corresponding to the obtuse angle, the two chamfer surfaces 3a1, 3a2 form each other, that is, the embossing path 1p of the first embossing device 1 lies in the The plane of the first chamfer surface 3a1 and the embossing path 1p of the second embossing device 1 lie in the plane of the second chamfer surface 3a2. The embossing lines 1 b thus form the same angle with each other as the planes of the chamfer surfaces 3a1, 3a2.

The embossing devices 1 are in FIG. 3 along the transport path preferably arranged at a distance one behind the other, so that they do not collide with their space. The first and second embossing lines 1p formed therewith are offset parallel to one another and adjacent to one another in the apex line of the chamfer surfaces 3a1, 3a2.

The two embossing devices 1, 1 in FIG. 3 are arranged according to the invention close to each other. You can as a common unit z. B. be summarized with a common carrier. They are arranged closely behind one another in the longitudinal direction of the transport path 2, so that the mutually parallel embossed paths 1p of the embossing devices 1, 1 follow one another with only a very small clearance in the longitudinal direction. The clearance is preferably in the order of the diameter of a support roller 1 a of each identically formed embossing devices 1, 1. This is the minimum clear distance of the successively arranged embossing devices 1.1. Due to the smallest possible clearance, a better handling of the embossing foil 4 is achieved with a stamping foil 4 common to both embossing devices 1, 1, so that this embossing foil 4 practically can not warp or wrinkle within the small clear distance and thus the embossing process in the second Embossing device 1 is not adversely affected.

At the in FIG. 3 provided angular arrangement of the embossing means 1, 1, it is also possible to arrange the embossing means immediately adjacent to each other at an angle to each other, that is without offset in the longitudinal direction. However, this is only possible if allowed by the width dimensions of the embossing devices 1, 1. A side-by-side arrangement is particularly suitable when the obtuse angle formed by the chamfer surfaces 3a1 and 3a2 with each other is relatively small.

Furthermore, in the arrangement in FIG. 3 be provided that the embossing devices 1 each in a double arrangement in the longitudinal direction of Transport path are arranged one behind the other, so that the chamfer surface 3a1 and the chamfer surface 3a2 are each embossed with a composite embossing path, which is composed of the aligned in a line successively embossing paths 1 p of successively arranged embossing devices 1, 1, as in the embodiment of FIGS. 1 and 2 is explained for the chamfer surface 3a.

Instead of the angularly arranged to each other separate embossing devices 1, 1 can at one opposite FIG. 3 modified embodiment, an embossing device are used, the embossing belt 1 c correspondingly flexible to the two chamfer surfaces 3a1 and 3a2 adaptable or is profiled angularly so that both chamfer surfaces 3a1 and 3a2 are embossed by a common embossing band of a common embossing device 1 with the film. It is also possible for a plurality of such common embossing devices 1 to be arranged in alignment in a line one behind the other, as is the case for embossing the flat chamfer surface 3a in the case of the FIGS. 1 and 2 shown embodiment is provided.

When using a sufficiently flexible embossing belt 1c, the embossing of a chamfered edge can also take place, in which the configuration of the two chamfer surfaces 3a1 and 3a2 varies in the longitudinal direction of the chamfer, that is, the chamfer surfaces 3a1 and 3a2 take different angular positions in the longitudinal course of the chamfer and have different Width up. It may also be provided convex and concave chamfer surfaces and wavy irregularities along the chamfer. The flexible embossing belt 1 c adapts with sufficient flexibility in each case in the support position during embossing to the shape of the chamfer surfaces and ensures a continuous embossing of varying over its longitudinal extent chamfering. In this case too, several embossing devices can advantageously be connected in series, in order to multiply the length of the embossing line accordingly and to increase the embossing speed. Furthermore, with the extension of the embossing line, in particular also in the case of embossing, the longitudinal direction is obtained varying chamfering an increase in the certainty that the entire varying bevel is each properly properly stamped.

In FIG. 4 As can be seen, the embossing of the two chamfer surfaces 3a1 and 3a2 with two separate embossing foils 4 with the same angular arrangement of the embossing devices 1, 1 and embossments 1 p, as in FIG. 3 is shown. In both embossing devices 1, 1 in this case, in each case a separate embossing film 4, preferably via a respective separate Folienzuführeinrichtung for each embossing device supplied. In this case as well, the chamfer surface 3a1 and the chamfer surface 3a2 can each be assigned a plurality of embossing devices 1, which can each be arranged in alignment one behind the other, in order to multiply the respective embossing path on the chamfer surfaces 3a1 and 3a2 and thus realize a higher embossing speed.

LIST OF REFERENCE NUMBERS

1

embosser

1 a

supporting roll

1 b

deflecting

1 c

embossing tape

1 p

embossing section

1 h

heater

2

transport distance

3

workpiece

3a1

chamfer

3a2

chamfer

4

stamping foil

4a

transfer layer

4b

support film

5a

Sheet feeder

5a1

ribbon supply hub

5a2

guide rollers

5b

Foil take-off device

5b1

foil take

5b2

guide rollers

Claims (11)

1. Device for embossing work pieces (3) conveyed along a transportation line (2) having a film (4), preferably a laminate film or transfer film, e. g. hot embossing film, comprising

   - several embossing mechanisms (1), which are arranged on the transportation line (2);

   - a mechanism to transport work pieces, which moves the work pieces (3) along the transportation line (2) past the embossing mechanisms (1); and

   - a mechanism to convey the films, which supplies the embossing mechanism (1) with the film (4) and, if necessary, conveys away a transfer film (4b), which remains as waste after the embossing,
   wherein it is provided that,

   - each embossing mechanism (1) has two supporting rolls (la) and if necessary stabilising rolls positioned between them and an embossing band (1c) which is powered to rotate, made from a silicon or elastomer or rubber or plastic, and forms an embossing line (1p) allocated to the embossing mechanism, extending lengthwise in the direction of the transportation line (2), which is formed in the area between the supporting rolls; and

   - that at least two adjacent embossing mechanisms (1), are arranged consecutively along the transportation line and/or are arranged parallel to each other and transverse to the transportation line and thus are arranged so closely adjacent, that the embossing lines (1p) of the at least two adjacent embossing mechanisms (1)

   a) are arranged with an overlapping longitudinal extension, or

   b) are directly bordering each other lengthwise or

   c) have a clear gap lengthwise, which is smaller than the length of one of the two embossing lines (1p).
2. Device according to claim 1,
   characterised in that,
   the clear gap of the embossing lines (1p) of the at least two adjacent embossing mechanisms (1) is smaller than 50% of the length of the embossing line of one of these embossing mechanisms.
3. Device according to claim 2,
   characterised in that,
   the clear gap of the embossing lines (1p) of the at least two adjacent embossing mechanisms (1) is approximately equal to the diameter of one of the supporting rolls (1a) of the adjacent embossing mechanisms (1) and/or approximately equal to the sum of half of the diameter of the two terminal supporting rolls on the ends of both adjacent embossing mechanisms, which face each other.
4. Device according to one of the preceding claims,
   characterised in that,
   the embossing lines (1p) of the at least two adjacent embossing mechanisms (1) are arranged in alignment with one another in their longitudinal extension.
5. Device according to one of the preceding claims,
   characterised in that,
   the embossing lines (1p) of the at least two adjacent embossing mechanisms (1) are arranged parallel to each other in the transverse direction to the transportation line (2).
6. Device according to claim 5,
   characterised in that,
   the embossing lines (1p), which are arranged parallel to each other, are arranged with their longitudinal edges, which face each other, bordering or overlapping.
7. Device according to claim 5,
   characterised in that,
   the embossing lines, which are arranged parallel to each other, are arranged with displacement to one another in the longitudinal direction,
   wherein it is provided that,
   the first embossing line has a right-hand longitudinal edge, which is aligned with a line, with which a left longitudinal edge of the second embossing line also aligns, or that the first embossing line has a left longitudinal edge, which is aligned with a line, with which the right longitudinal edge of the second embossing line aligns.
8. Device according to one of the preceding claims,
   characterised in that,
   the embossing lines of the at least two adjacent embossing mechanisms (1) are arranged on a mutual plane.
9. Device according to one of the preceding claims,
   characterised in that,
   the embossing lines of the at least two adjacent embossing mechanisms (1) are arranged on two planes, which are arranged at an angle to each other.
10. Device according to one of the preceding claims,
    characterised in that,
    the film is conveyed to the at least two adjacent embossing mechanisms (1) by the mechanism which conveys films (5a1, 5a2) in such a way that these at least two adjacent embossing mechanisms (1) work together with a respective separate film (4) for the embossing process.
11. Device according to one of the preceding claims,
    characterised in that,
    the film is conveyed to the at least two adjacent embossing mechanisms (1) by the mechanism which conveys films (5a1, 5a2) in such a way that these at these least two adjacent embossing mechanisms (1) work together with a mutual film (4) for the embossing process.

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