EP2056057A3 - Échangeur de chaleur - Google Patents

Échangeur de chaleur Download PDF

Info

Publication number
EP2056057A3
EP2056057A3 EP08253579A EP08253579A EP2056057A3 EP 2056057 A3 EP2056057 A3 EP 2056057A3 EP 08253579 A EP08253579 A EP 08253579A EP 08253579 A EP08253579 A EP 08253579A EP 2056057 A3 EP2056057 A3 EP 2056057A3
Authority
EP
European Patent Office
Prior art keywords
heat exchanger
recess
heat transfer
accelerating portion
transfer accelerating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08253579A
Other languages
German (de)
English (en)
Other versions
EP2056057A2 (fr
EP2056057B1 (fr
Inventor
Masaru c/o Calsonic Kansei Corporation Sawaguchi
Shinji c/o Calsonic Kansei Corporation Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Corp
Original Assignee
Calsonic Kansei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008054179A external-priority patent/JP4509197B2/ja
Application filed by Calsonic Kansei Corp filed Critical Calsonic Kansei Corp
Publication of EP2056057A2 publication Critical patent/EP2056057A2/fr
Publication of EP2056057A3 publication Critical patent/EP2056057A3/fr
Application granted granted Critical
Publication of EP2056057B1 publication Critical patent/EP2056057B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
EP08253579.0A 2007-11-02 2008-10-31 Échangeur de chaleur Not-in-force EP2056057B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007285807 2007-11-02
JP2008054179A JP4509197B2 (ja) 2008-03-05 2008-03-05 熱交換器

Publications (3)

Publication Number Publication Date
EP2056057A2 EP2056057A2 (fr) 2009-05-06
EP2056057A3 true EP2056057A3 (fr) 2013-01-23
EP2056057B1 EP2056057B1 (fr) 2016-04-06

Family

ID=40303698

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08253579.0A Not-in-force EP2056057B1 (fr) 2007-11-02 2008-10-31 Échangeur de chaleur

Country Status (2)

Country Link
US (1) US20090114373A1 (fr)
EP (1) EP2056057B1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140060789A1 (en) * 2008-10-03 2014-03-06 Modine Manufacturing Company Heat exchanger and method of operating the same
DE112010002307T5 (de) * 2009-06-22 2012-06-21 Meidensha Corp. Kühlkörper
US9091489B2 (en) 2010-05-14 2015-07-28 Paragon Space Development Corporation Radiator systems
JP5236838B2 (ja) * 2010-10-27 2013-07-17 本田技研工業株式会社 冷却構造体
US20120318479A1 (en) * 2011-06-14 2012-12-20 Fukuta Electric & Machinery Co., Ltd. Liquid cooled motor assembly and cover thereof
DE102012006122A1 (de) * 2012-03-26 2013-09-26 Thesys Gmbh Wärmeübertragungseinrichtung, insbesondere Heiz- und/oder Kühlplatte
CN106062949B (zh) 2014-09-17 2018-11-30 富士电机株式会社 半导体模块
US10388589B2 (en) 2015-11-25 2019-08-20 Mitsubishi Electric Corporation Semiconductor device, inverter device, and vehicle
DE102016210302A1 (de) * 2016-06-10 2017-12-14 Volkswagen Aktiengesellschaft Kühlstruktur in einem Gehäuse oder Werkzeug
CH714102A2 (de) * 2017-08-30 2019-03-15 Ener C Ag Wärmetauscher für eine Vorrichtung zur Temperaturbehandlung eines Körpers und Vorrichtung mit einem solchen Wärmetauscher.
CN110012637A (zh) * 2018-01-05 2019-07-12 神讯电脑(昆山)有限公司 热导板及散热装置
DE202019005654U1 (de) * 2018-06-08 2021-04-30 Dana Canada Corporation Nutzung eines toten Kanals zur Verbesserung von Temperaturgleichförmigkeit auf thermischem Grenzflächenmaterial
JP7087850B2 (ja) * 2018-09-05 2022-06-21 株式会社デンソー 半導体装置
DE202018004979U1 (de) 2018-10-25 2020-01-28 Reinz-Dichtungs-Gmbh Plattenartiger Flüssigkeitsbehälter und Batterietemperieranordnung
DE102022109148A1 (de) 2022-04-13 2023-10-19 Rittal Gmbh & Co. Kg Kühlkörper für eine elektronische Komponente und eine entsprechende Kühlanordnung
FR3137748A1 (fr) * 2022-07-07 2024-01-12 Valeo Systemes Thermiques Dispositif de régulation thermique, notamment de refroidissement

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040035555A1 (en) * 2002-08-07 2004-02-26 Kenichi Nara Counter-stream-mode oscillating-flow heat transport apparatus
US20040238162A1 (en) * 2003-04-11 2004-12-02 Seiler Thomas F. Heat exchanger with flow circuiting end caps
DE102005058204A1 (de) * 2005-12-02 2007-06-14 Pierburg Gmbh Kühlvorrichtung für eine Verbrennungskraftmaschine
US20070163749A1 (en) * 2005-10-28 2007-07-19 Hideyuki Miyahara Component package having heat exchanger
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628991A (en) * 1984-11-26 1986-12-16 Trilogy Computer Development Partners, Ltd. Wafer scale integrated circuit testing chuck
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
US5005640A (en) * 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
US5137082A (en) * 1989-10-31 1992-08-11 Nippondenso Co., Ltd. Plate-type refrigerant evaporator
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP3090954B2 (ja) * 1996-01-04 2000-09-25 ダイムラークライスラー アクチエンゲゼルシャフト ピンを備えた冷却部材
US5858537A (en) * 1996-05-31 1999-01-12 The United States Of America As Represented By The Secretary Of The Navy Compliant attachment
US5799727A (en) * 1997-05-29 1998-09-01 Ford Motor Company Refrigerant tubes for heat exchangers
FR2774462B1 (fr) * 1998-01-30 2000-04-14 Peugeot Echangeur refroidisseur de fluide
JP4175443B2 (ja) * 1999-05-31 2008-11-05 三菱重工業株式会社 熱交換器
US6668915B1 (en) * 1999-09-28 2003-12-30 Peter Albert Materna Optimized fins for convective heat transfer
JP4634599B2 (ja) 2000-11-30 2011-02-16 株式会社ティラド 水冷ヒートシンク
TW523893B (en) * 2001-01-16 2003-03-11 Denso Corp Cooling equipment
JP2002210570A (ja) 2001-12-13 2002-07-30 Nippon Light Metal Co Ltd 摩擦攪拌接合方法
CA2392610C (fr) * 2002-07-05 2010-11-02 Long Manufacturing Ltd. Echangeur de chaleur refroidi par parois cloisonnees
US7017654B2 (en) * 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
US7182125B2 (en) * 2003-11-28 2007-02-27 Dana Canada Corporation Low profile heat exchanger with notched turbulizer
EP1872079A2 (fr) * 2005-04-22 2008-01-02 Ferrotec (USA) Corporation Echangeur thermique de fluide a efficacite elevee et procede de fabrication associe
US20070012423A1 (en) * 2005-07-15 2007-01-18 Koichiro Kinoshita Liquid cooling jacket and liquid cooling device
US7673389B2 (en) * 2005-07-19 2010-03-09 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
US20070068657A1 (en) * 2005-09-27 2007-03-29 Kenichi Yamamoto Sheet -shaped heat pipe and method of manufacturing the same
JP4380637B2 (ja) 2006-01-26 2009-12-09 トヨタ自動車株式会社 パワー半導体素子の冷却構造およびインバータ
DE102006008973B4 (de) * 2006-02-23 2014-09-11 Von Ardenne Anlagentechnik Gmbh Kühlbare Trägerplatte für Targets in Vakuumzerstäubungsanlagen
US7499279B2 (en) * 2007-04-30 2009-03-03 International Business Machines Corporation Cold plate stability
DE102007041338B3 (de) * 2007-08-31 2008-12-11 Pierburg Gmbh Wärmeübertragungseinheit für eine Verbrennungskraftmaschine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040035555A1 (en) * 2002-08-07 2004-02-26 Kenichi Nara Counter-stream-mode oscillating-flow heat transport apparatus
US20040238162A1 (en) * 2003-04-11 2004-12-02 Seiler Thomas F. Heat exchanger with flow circuiting end caps
US20070163749A1 (en) * 2005-10-28 2007-07-19 Hideyuki Miyahara Component package having heat exchanger
DE102005058204A1 (de) * 2005-12-02 2007-06-14 Pierburg Gmbh Kühlvorrichtung für eine Verbrennungskraftmaschine
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Also Published As

Publication number Publication date
US20090114373A1 (en) 2009-05-07
EP2056057A2 (fr) 2009-05-06
EP2056057B1 (fr) 2016-04-06

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