EP2047540A2 - Encapsulated electroluminescent device - Google Patents

Abstract

The invention concerns an encapsulated electroluminescent device (100) comprising an electroluminescent system (1) including an active electroluminescent layer (12) disposed on a protective substrate (2) and between two electrodes (11 to 13), a protective cover (3) of said electroluminescent layer (15), secured to the substrate, means of sealing out water and vapor, a protective device (50') on the perimeter of the device at at least one part, the protective device (50) is of at least one metallic part (5a, 5b) or at least one plastic or glass part having a metallic part, the metallic part or the metallic part serving at least 20 for a first electrical connection to one of the electrodes, or in that it comprises at least one electroconductive layer deposited on one of the edges of the section of the substrate or of the protective cap and extending between the protective device and the substrate or the protective cover, for a first electrical connection to one of the electrodes.

Description

 ENCAPSULATED ELECTROLUMINESCENT DEVICE

The invention relates to an encapsulated electroluminescent device. In a known manner, organic emitting devices (OEDs), in particular electroluminescent diodes based on an organic light-emitting diode (OLEDs), are electronic components that are very sensitive to oxygen. and with liquid water and in vapor form.

Document US2002 / 0068191 proposes an electroluminescent device encapsulated with an electroluminescent system comprising an organic electroluminescent layer between two electrodes. The organic electroluminescent layer is on an OLED carrier substrate and a protective cover such as a glass, which is sealed to the substrate by an adhesive film covering thermosetting epoxy adhesive below the layer.

The device is further provided at the periphery with epoxy adhesive containing an oxygen absorbing element (deoxidizer) and an aluminum surround around the periphery and on the outer edges of the cover and the substrate. Between this surround and the edges of the substrate are arranged two bent conductor strips for the electrical connections. For each strip, a first end is inserted into a groove made in the adhesive film

(- via a removable spacer -) and this first end is on the associated electrode. The second end as for it overflows outside the device.

The object of the invention is to provide an electroluminescent device encapsulated with a simpler electrical connection system without sacrificing or even improving durability, and in particular a device that is more compatible with industrial requirements (ease of obtaining on the production, reliability) even for large surfaces.

For this purpose, the invention proposes an encapsulated electroluminescent device comprising:

an electroluminescent system comprising an electroluminescent active layer disposed on a protective substrate and between two electrodes, a protective cover of said active layer, integral with the substrate,

sealing means with liquid water and / or vapor,

an entourage, around the periphery of the device, in at least one metal part or in at least one plastic or glass part having a metal part, the metal part or the metal part serving at least for a first electrical connection to one electrodes or an entourage, around the periphery of the device, in at least one part and at least one electroconductive layer deposited on one of the edges of the wafer of the substrate or the cover and overflowing between the surround and the substrate or the cover for a first electrical connection to one of the electrodes. By serving for at least one electrical connection, the metal surround or with a metal part facilitates the making of connections by limiting or even avoiding the use of flowing conductive strips of the prior art, the entourage also protects from possible internal electrical connections and finally makes it possible to limit or even eliminate the conduction paths of the water generated by these overflowing strips.

In substitution for at least one bonded bristle-bonded conductive strip of the prior art, the invention also proposes to coat the substrate or the cover associated with one of the electrodes (at least one edge edge and one outer edge) with a electroconductive layer (monolayer or multilayer) overflowing, preferably thin, deposited by any known means. This layer can be part of or be one of the electrodes, can be for example enamel conductive. In this configuration, the entourage can be in one or two rooms, be entirely made of metal or be

(Essentially) dielectric material, particularly of glass or plastic, but preferably with at least one metallic outer lining.

These types of encapsulation are able to withstand extreme weather conditions, including high humidity and / or high temperature, and to provide sufficient long-term protection.

Thus, the electroluminescent device encapsulated according to the invention is simple, compact and reliable, durable, easily manipulated without risk of breakage of the substrate or hood, or damage to the connections.

The surround can form for example a mounting frame (the body in the case of windows for the automobile) or be mounted in duplicate glazing for the building.

The surround extends (at least mainly) around the substrate and hood. The surround is neither arranged between the substrate and the cover nor held by the inner face of the substrate. Its assembly is simple. This surround may be opaque because it is not likely to disturb the properties of the electroluminescent system, for example illumination by the faces of the substrate and / or the cover.

The surround is suitable for any type of assembly of the substrate with the cover, in particular by lamination, covering casting resin, or any other means at the periphery between the substrate and the cover, in particular brace surmounted by glue, epoxy glue, polymeric seal.

The surround according to the invention is suitable for any type, any device geometry. The substrate can of any shape (rectangular, round ...). The device can be of any size especially with a surface exceeding the m ² . The surround according to the invention provides a single or additional insulation (reinforcing any sealing means with water vapor and / or liquid between the cover and the substrate) to the various gas-type aggression, liquids, dust, and / or to provide mechanical reinforcement. The surround may be hollow or solid, curved, flat, may or may not follow the contours of the device, in particular the edge of the substrate. The surround may preferably have a so-called lateral portion, surrounding the periphery being pressed by its inner face against the edge of the substrate and held fixed by the assembly means. In order to encircle the entire periphery, the free ends of the entourage may overlap in pairs or have complementary shapes adapted to cooperate mutually to achieve their assembly according to a butt. The ends may further be separated by glass spacers. The entourage can be thin. The surround may be at least one aluminum foil preferably of minimum thickness of about 200 microns or stainless steel preferably of a minimum thickness of about 500 microns.

The surround may be thicker in particular for fixing, for example on rails, including walls. The surround may be in the form of a substantially flat profile approximately 1 mm thick and of substantially parallelepipedal section.

This profile advantageously has a low mechanical inertia, that is to say that it can be easily wound by having a small winding radius of 10 cm for example.

The surround can be preformed (cast, molded, extruded ...), folded on the hood and the substrate by a folding system. Thus, during the process, the edges of the edges are for example made by folding using machines well known to those skilled in the art specialized in the processing of materials for example metal.

The surround may be rigid enough to perform the function of mechanical support of the substrate and the cover. In this configuration, its rigidity is defined by the very nature of its constituent material, whose linear buckling resistance must be at least 400 N / m. The surround can be arranged in the manner of a ribbon on the slices and ensure the mechanical assembly of the device through the assembly means which ensure its total adhesion to the cover and the substrate.

The surround may be composite that is to say with at least one plastic part possibly reinforced in particular by fibers or glass, and a metal part or a metallized glass. For example, plastic, for example butyl, may serve as reinforcement and / or support for a metal or metal-based film possibly mixed with synthetic material on the inner and / or outer walls.

This metal-based or all-metal protective film, in particular of the aluminum or stainless steel strip type, serves for better sealing, particularly with steam water and / or for one or the electrical connections. This film may for example be from 2 to 50 μm thick or more. This strip can further protect a plastic surround against abrasion, for example during its handling or transport and promotes heat exchange with a thermoplastic when it must soften during manufacture.

An outer metal film may be furthermore sufficiently wide to be folded over the main external edges of the substrate and / or the hood or to be folded against the inner face. A metal film on the inside of the plastic with one or more ends overflowing the edges of the plastic, can be used for the electrical connection.

A metal film on the inner face and overflowing may be associated with conductive assembly means to serve for the electrical connection.

The plastic surround can very advantageously incorporate intrinsically, in part or in whole, a desiccant in the form of powder or granules. The desiccant may be a molecular sieve such as zeolite powder, which may be up to 20% by weight or about 10% by volume. The quantity of the desiccant may be a function of the lifetime that is to be attributed to the device.

The surround and the assembly means surrounding the hood and the substrate may form a single element comprising a membrane (adhesive) composed in bulk of a polyisobutylene-based material, membrane covered on the outer surface of a film made of metal and synthetic material (s). In this configuration, preference is given to overflowing layers for the electrical connections.

The surround can be essentially or even entirely metallic, especially aluminum preferably of minimum thickness of about 0.2 mm or stainless steel preferably of a minimum thickness of about 0.5 mm.

The metallic surround or the metal strip of a composite surround may itself be covered with a means of protection against corrosion, preferably with a polysulfide or a polyimide, in particular for outdoor use. The surround can be assembled by the slice of the plane substrate and / or the sides of the cover (its slice if the cover is flat) and / or by the edges of the external main faces of the cover (plane or curve) and / or the substrate .

For example, in a simple form to achieve, the entourage may have a U-shaped section. In an advantageous embodiment, the surround is assembled at least in part by the wafer of the substrate and / or by the wafer of the selected plane cover.

Naturally, in this mode, the selected substrate and / or hood plane is thick enough to maintain the surrounding. For example, the substrate and / or the cover may have a thickness of between 1 mm and 10 mm, preferably of at least 2 mm, even more preferentially between 4 mm and 10 mm. and 6 mm.

In simple shapes to achieve, the entourage may have a rectangular section (maintaining the environment by the edge of the substrate and the edges of the cover) or L (maintaining the environment by the edge of the substrate and the edges of the cover).

The assembly means may be selected, in part at least, from one or the following means:

an adhesive, in particular a biface, an adhesive whose setting is effected by chemical reaction activated or not by heat or by pressure or by cooling, in particular a glue which is crosslinkable to UV or preferably to infrared (IR), glue mono or two-component, with or without solvent (without degassing), for example an epoxy glue,

a vapor-tight water-based material based on hot-melt polymer (s) chosen from at least one of the following families of polymers: ethylene vinyl acetate, polyisobutylene and polyamide, optionally covered by a material that is impervious to liquid water such as polysulfide or polyurethane or silicone,

a vapor-tight liquid-tight adhesive of the glue type such as a hot-melt polyurethane,

- at least one soldering in English, if necessary applied with ultrasound or soldering.

The aforementioned hot-melt polymers can also be in the form of copolymers or branched polymers. These three families of hot-melt polymer are particularly advantageous for at least two reasons: they offer a high intrinsic seal, and they are especially very impermeable to water in vapor form. Being hot melt, they are also particularly easy to implement, at a lower cost: they can be injected in liquid or semi-liquid form at the desired locations easily, by known industrial means. These polymers are preferably between 40 and 98% by weight of the material constituting the seal. Additives can be added, including three different functions.

On the one hand, at least one crosslinking agent, for example of the isocyanate and / or epoxide type, can be added. a certain number of mineral fillers, preferably in powder form, and for example in aluminum or magnesium oxide, in silica sand, in quartz, in diatomaceous flours, in thermal silica also known as pyrogenation, in non-fumed silica. It may also be silicates such as talc, mica, kaolin, glass microspheres, or other mineral powders such as calcium carbonate, or mineral fibers.

Finally, one or more resins called "tackifying" or "tacky", whose function is to improve the adhesion of the seal with the material with which it will be in contact, can be added. It may especially be of very low molecular weight compounds, not more than 10,000, especially less than 5000, or between 500 and 2000 and preferably a softening point between 50 and 130 ⁰ C, in particular between 90 and 100 ⁰ C. An example is a saturated hydrocarbon aliphatic resin.

It is indeed important not only to choose an intrinsically sealed polymer, but which also adheres very well to the materials with which it is in contact, so as to avoid creating diffusion paths at the joint interface / material to be sealed, from way to avoid any delamination of the joint.

Instead of or in addition to the use of such a tackifier, one can also play on the distribution of the molar masses present in the hot-melt polymer, particularly in the case of polyisobutylenes: mixing several molar masses allows to have a good resistance to creep in temperature (for high masses) and also to have good adhesion to the materials to be sealed, a good "tack" (for low molar masses).

Overall these thermofusible polymer joints advantageously have:

a water permeability in vapor form less than or equal to 3 g / m ² / 24h, in particular less than or equal to 1 g / m ² / 24h according to the ASTM E9663T standard: this means that they are particularly impermeable to water; 'water

a softening point of between 70 and 180 ^° C., in particular between 90 and 100 ^° C. or between 145 and 170 ^° C., it is therefore possible to liquefy them in order to put them into shape at commercially acceptable temperatures, -. A viscosity between 0.8 and 8 Pa s measured at 190 ⁰ C. Advantageously, if deemed necessary, can be associated to the seal described above at least one other seal "complementary" in the sense that complete its sealing function, particularly vis-à-vis the liquid water. It can thus be a second seal of the polysulfide, polyurethane or silicone type, which can be applied against the first seal by coating it, in a known manner, or by coextrusion and / or simultaneous extrusions. two joints.

To achieve sealing especially vis-à-vis the liquid water, one can form a seal, covering assembly means watertight vapor ,:

by extrusion of polyurethane (PU) or of any thermoplastic elastomeric polymer TPE,

by reactive injection of PU (technique that is often referred to as "RIM" in English for "Reactive Injection Molding"),

by thermoplastic injection of a PVC (polyvinyl chloride) / TPE mixture,

by injection and vulcanization of terpolymer of ethylene, propylene and an EPDM diene. All of them are particularly preferred polyurethane-based hot-melt glue type adhesives, in particular crosslinkable with the humidity of the air, and ensuring both a good impermeability to water vapor and liquid water. Their water permeability in vapor form is typically less than or equal to 3 g / m ² / 24h, or even close to 2. Naturally, the adhesive must preferably also withstand takeoff by liquid water, ultraviolet as well as by the tractions that can be exerted perpendicularly to the faces of the glazing and commonly called shear stresses, and by the pulls exerted parallel to the force of the weight of the glazing. A satisfactory adhesive should preferably withstand stripping stresses of at least 0.45 MPa. Preferably, the adhesive may have fast bonding properties, of the order of a few seconds. The glue can also be slow to check the electrical connections or redo them.

The coefficient of permeability to water vapor of the assembly means may be preferably less than 5 g / 24h.m ² , even more preferably less than 1 g / 24h.m ² .

The choice of assembly means may depend on:

sealing performance of the covering means or device for assembling the cover to the substrate; and / or the possible presence of an additional material for sealing between the surround and the covering or peripheral means and / or a desiccant.

The assembly means may be chosen electrical insulators then preferably having an electrical conductivity less than 10 ^"4 ohm ^{" 1} , cm ^"1

Alternatively, in particular to facilitate the electrical connection or connections by the entourage, the metal part or the metal part may be assembled at least in part by conductive assembly means, on the majority or all of the periphery or on main external edges of the cover or the substrate, chosen from at least one of the following assembly means: a metal weld, a solder, a conductive adhesive, especially a silver-filled epoxy type glue.

To do this, the device may comprise at least one of the characteristics described below (cumulative or alternative) (cumulative or alternative) for the connection or connections.

For at least the first electrical connection, and preferably for each of the electrical connections, it comprises at least one of the following means:

- An internal electrical connection means, preferably thin, in particular selected from at least one of the following electrical connection means associated with the environment:

at least one electroconductive wire, for example metal, for example copper, gold, silver, aluminum, tungsten,

at least one optionally self-adhesive electroconductive strip, in particular of the foil type, for example thick, between approximately 50 μm and 100 μm, possibly extending preferably along an internal main edge of the substrate or of the cover for a better current distribution,

an electroconductive filler, in particular a foam, a possibly tacky material deposited by jet ink charged with (nano) metallic particles silver or copper type

an electroconductive enamel, approximately 10 μm to 100 μm thick, possibly extending preferably along an internal main edge of the substrate or of the cover for a better distribution of the current

an electroconductive glue, for example a silver-filled epoxy adhesive,

- At least one metal weld possibly extending one or more assembly welds.

A known foil is a thin copper strip with a thickness of 50 to 100 μm and a width of between 1 and 100 mm, preferably between 3 and 5 mm. The copper strips are covered with a tinning for example tin-based or lead tin alloy to limit corrosion and facilitate electrical contacts for example by metal welds

To simplify the electrical connection by the surroundings, the device may comprise, for at least the first electrical connection, an internal connection means projecting over at least one edge of the wafer of said substrate or said cover, and is chosen from one of or the following means: an electroconductive strip of the foil type,

an electroconductive enamel,

an electroconductive glue,

an electroconductive thin layer (monolayer or multilayer) possibly transparent, these means being preferably associated with metal joining welds by the edge of the cover or the substrate, and / or an overflowing portion of one of the electrodes, in particular under a metal weld assembly of the edge of the cover or the substrate. The other electrode attached to the substrate may, on the other hand, be non-protruding confined to the main internal face of the substrate.

According to one characteristic, one of the electrodes may comprise two protruding portions on two possibly opposing edges of the wafer of the substrate or the cover, one of the protruding parts being electrically insulated from the other protruding part (by any mechanical means chemical or laser treatment) and serving for electrical connection of the other electrode.

The surround may be at least two pieces of metal for a separate electrical connection, the parts being secured and electrically isolated by at least one of the following means:

a material based on a hot-melt polymer (s) chosen from at least one of the following families of polymers: ethylene vinyl acetate, polyisobutylene, polyamide, optionally covered by a liquid-tight material such as polysulfide or polyurethane or silicone,

- A waterproof adhesive vapor and liquid water type hot melt glue such as polyurethane.

Preferably, identical means are chosen for the non-conductive assembly means. The surround may also be a single piece of metal and serving for the first connection and preferably, the second electrical connection is made by a through hole formed preferably in the selected dielectric cover, the hole being filled by a metal weld and / or by another electroconductive material (foam etc). The hole may be of the order of 5 mm.

In addition, a covering metal pellet can be welded around the hole.

The so-called lower electrode is the closest to the substrate (or is even a part of a conductive substrate), the so-called upper electrode is the farthest from the substrate.

The cover may be secured to the substrate by a so-called peripheral means surrounding the layer or by a means, said covering, on the active system (by laminating interlayer type thermoplastic sheet, epoxy resin-type casting ...). A spacing means or peripheral link can prevent damage to the electroluminescent system (pollution, risk of short circuit ...) can be easy to put and / or economic. The peripheral means can also prevent the hood from touching the system, even if the hood is flat. This peripheral means can be: an adhesive, in particular a UV-curable adhesive, such as Addision Clear Wave's AC-A1438 commercial glue, or Nagase's XNR4416L glue, or an infrared-curable glue (IR), a mono or two-component glue, without solvent, for example an epoxy glue or an acrylic glue,

a glass spacer with glue on its support faces,

- or a frit of molten glass.

Preferably, this peripheral means may be liquid watertight even more preferably with respect to steam, particularly as the glass frit.

The choice of the peripheral means may depend on:

- sealing performance of the environment and means of assembly, - the possible presence of a desiccant or other waterproof material between the surrounding and the peripheral means,

- The device manufacturing mode (performed continuously or in several stages).

The position of the peripheral means is naturally a function of the extent and arrangement of the active layer on the substrate and the size of the cover. The peripheral means may be on the main edges or closer to the center of the hood.

The device can also form a laminated glazing. The laminated glazings usually consist of two rigid substrates between which is disposed a sheet or a superposition of polymer sheets of the thermoplastic type. The invention also includes so-called laminated glazings

"Asymmetric" using a single rigid glass-type protective substrate associated with multiple polymeric protective sheets.

The invention also includes laminated glazings having at least one interlayer sheet based on a single or double-sided adhesive polymer of the elastomer type (that is to say not requiring a lamination operation in the conventional sense of the term, laminating imposing heating generally under pressure to soften and adhere the thermoplastic interlayer sheet). In this configuration, the means for securing hood and substrate can then be a lamination interlayer including a sheet of thermoplastic material for example polyurethane (PU), polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), or thermally crosslinkable resin or multi-component resin (epoxy, PU) or ultraviolet (epoxy, acrylic resin). It is preferably (substantially) of the same size as the cover and the substrate.

The lamination interlayer may make it possible to prevent bending of the bonnet, particularly for devices of large dimensions, for example with an area greater than 0.5 m ² . In particular, EVA offers many advantages:

- it is not or little loaded with water in volume,

it does not necessarily require a high pressurization for its implementation;

A thermoplastic lamination interlayer may be preferred to a cast resin cover because it is both easier to implement, more economical and possibly more watertight.

The interlayer optionally comprises a network of electroconductive son embedded in its so-called internal surface facing an electrode, and / or an electroconductive layer or electroconductive strips on said inner surface.

And in this latter design, preferably, it may include one of the following means of electrical connection associated with one or the other of the electrodes:

an electroconductive strip, in particular a U-shaped strip, preferably of the foil type, fixed to at least one edge of the lamination interlayer (by softening of the thermoplastic material preferably) and in contact with an inner wall of the metallic surround (by welding preferably),

an electroconductive strip, in particular a U-band, preferably of a foil type, with a first end associated with said electrode (preferably by welding) and with a second end in contact with a through hole filled with metallic material of a dielectric cover and between these ends a portion passing through said spacer which is incised. If the connecting means - peripheral or covering - is sufficiently waterproof in the short term this allows to store and / or transport the sealed device. Indeed, the assembly of the entourage is not necessarily realized in the site of realization of the system or this assembly can be deferred, for flexibility of manufacture. If the complete device is carried out continuously, it is not necessary to provide a connection means (particularly) waterproof especially with water vapor and / or desiccant if the entourage once assembled provides a sufficient protection threshold . In this case, the peripheral type of connecting means has the role of spacer between the substrate and the cover. The device according to the invention may comprise a desiccant disposed preferentially on the substrate, at the outer edge of the peripheral means, even covering and / or being mixed with this means.

Thus disposed, the desiccant surrounding the seal is in small quantities. It is on the path of conduction of water and as close as possible to the peripheral connecting means or recessed covering. This desiccant may be opaque, which is less expensive than a clear desiccant, even in a configuration where the emitter system emits from both sides.

The desiccant may be a particularly adhesive tape or a powder, such as calcium oxide or other oxides of alkali or alkaline earth metals. This powder is preferably compacted by pressure of the surroundings and optionally a filling material at the edge. This compacting makes it possible to further reinforce its drying properties.

If the cover is flat and smaller than the substrate, one can choose a thick cover for example 3 mm to place the desiccant.

If the cover is flat and of size substantially equal to that of the substrate, one can choose a thick cover with a thinned peripheral area, for example a beveled edge, to place the desiccant.

In addition, the device may comprise a filling material forming a cord or a seal between the surrounding and the covering or peripheral means.

The filling material seal may have any of the following characteristics:

- be adhesive (in particular a glue without solvent), - be waterproof vis-à-vis the water in vapor form, - be non-conducting

The gas-tight seal with respect to water in vapor form may in particular be based on a hot-melt polymer (s) chosen from at least one of the three aforementioned polymer families, particularly for the means of solidarity.

Preferably this filler material may have an electrical conductivity of less than at least 10 ^-4 OhIn ^-1 . cm ^{~ ι} , especially less than 10 ^"5 ohm ^" l.cm ^~ \ and even less than 10 ^"7 ohm ^{" 1} .cm ^"1 or 10 ^{" 9} ohm ^ cm ^"1 (as possibly the assembly means if necessary By choosing a substantially electrically insulating joint, it is ensured that there is no risk of the electrically conductive layer being short-circuited by the joint, for example the seals described in FIG. EP0836932. These are seals in a polymer matrix based on thermoplastic polymer (s) or thermosetting (s), preferably based on elastomer (s) (A), in particular of the essentially hydrocarbon elastomer type. saturated, preferably chosen from rubbers based on mono-olefins such as isobutylene or ethylene-propylene, or polyolefins catalyzed by metallocene catalysts, or based on ethylene vinyl acetate EVA, or based on ethylene vinylbutyrate EVB, or based on silicone (s) or polyurethane do (s).

This type of seal may be crosslinked partially or totally, in particular using crosslinking agents of the isocyanate or epoxide type. It is preferably a polymer based on elastomer (s). The latter type of polymer is indeed interesting in that it has vitreous transmission temperatures well below the ordinary temperature of use, its characteristics allow its incorporation into the active glazing by automated techniques well mastered as the technique extrusion and that it has good adhesion to substrates including glass. The preferred elastomers are, for example, chosen from essentially saturated hydrocarbon polymers (hydrocarbon polymers, silicones), preferably chosen from polymers based on monoolefins such as isobutylene or ethylene-propylene or catalysed polyolefins by catalysts. metallocenes, especially of the polyethylene type. The polyolefins may also be used, of the polyethylene type, ethylene-propylene copolymer, ethylene-propylene-butene copolymer, polymethyl pentene, propylene, isobutylene-isoprene, ethylene-vinyl acetate, EVA, ethylene vinylbutyrate EVB copolymer. It is also possible to use polymers of the family of polyurethanes, or, as mentioned above, of the family of silicones, more particularly having the unit: with R 1 and R ₂ being in particular chlorine-type halogens, hydrocarbon radicals saturated type such as a methyl or ethyl group, or aromatic type such as a phenol, or finally a hydrogen. It is advantageous to constitute the polymer matrix not with a single polymer of the elastomer type, but with a plurality of them, and in particular at least three, having different molar masses. They are preferably chosen in a molar mass range of at least 2.10 ⁴ , for example between 3.10 ⁴ and 2.10 ⁶ . The polymer matrix of the seal may also contain a tackifier, a filler, in particular chosen to be electrically non-conducting, preferably mineral, and in the form of a powder. The presence of charge in the matrix can contribute to imparting the desired mechanical strength. These fillers may be of the metal oxide type such as aluminum oxide, magnesium oxide, of the sand type such as silica sand, quartz, diatomaceous flour or thermal silica, also known as pyrogenation silica. or else non-pyrogenic silica. It may also be silicates such as talc, mica, kaolin, microspheres or glass beads, or other mineral powders such as calcium carbonate. It is also possible to crosslink the polymer matrix of the joint, for example with a crosslinking agent of the isocyanate and / or epoxide type.

These aforementioned seals may also serve as an electrical insulating assembly means preferably in combination with the protruding layers, and / or as a means of joining two pieces of metal to be electrically insulated.

The substrate and the protective cover may be of any kind (mineral, in particular glass or organic, especially plastic) as long as they are sufficiently dust-tight, to liquids with gases. Preferably, the protective cover may be flat, thick constant, possibly with a beveled slice or major edges facing the substrate grooves and / or drilled in particular to create a space for the connector, or to add a seal and / or desiccant.

The substrate and the protective cover may be preferably rigid or semi-rigid. The term "rigid or semi-rigid" can be understood to mean an element that can in particular be based on glass or PET polyethylene terephthalate polymer (s), polymethyl methacrylate PMMA or polycarbonate PC.

The substrate and the protective cover may in particular be sheets of glass, for example silico-soda-lime, flat, curved and / or tempered, optionally associated with polymer sheets (PET etc.). The protective cover may be smaller than or equal to the substrate.

The cover and the substrate can be transparent, semi opaque, opaque depending on the emission configurations. The substrate may also be preferably a glass sheet.

The distance between the substrate and the cover may preferably be as low as possible. It generally corresponds roughly to the height of the connecting means is typically a few microns for a glue type adhesive, a few hundred microns for a glass frit, a few tenth of a mm for a thermoplastic lamination.

The electroluminescent system can be in turn ultra thin, for example not exceeding a few microns or 500 nm.

Furthermore, the distance between the peripheral means or cover and the edge of the cover and / or the distance between the edge of the cover and the edge of a selected substrate of smaller size may be at least 1 mm to facilitate the electrical connections and / or to place a desiccant and / or additional waterproof bead.

The hood and the surrounding may have in an assembly area roughness or texturations complementary to curb the penetration of water. It is preferably the main edges of the hood or the substrate.

Especially in the case of an assembly by the wafer, the substrate may have a smooth wafer for better assembly.

The electroluminescent system can be of different designs:

the system carried by the substrate and preferably the electroluminescent layer is thin, organic or inorganic, - Or one of the electrodes, said lower, is associated with the substrate, in particular deposited on the substrate, the other of the electrodes, said upper is partly at least associated with the cover, in particular deposited on the cover, preferably the electroluminescent layer. is inorganic and thick. The above connection methods are suitable for any electrode configuration.

In a first configuration, the lower electrode is an electroconductive layer, wider than the active layer and extending for example on an edge of the substrate. The upper electrode is an electroconductive layer extending on the substrate, and extending for example on the opposite edge. Connections occur on the inner face of the substrate and / or on its edge (overflowing electrode ...)

In a second configuration, the upper electrode is not reported on the substrate, it is electrically connected: - by the side, above the substrate (for example by an internal wire and / or by an adhesive, a foil .. .)

and / or from above for example by the pierced cover or by electroconductive joining means and / or by an electroconductive wire network embedded in the surface of a lamination interlayer forming said covering means.

The device is necessarily symmetrical. It is thus possible to provide separate electrical connection methods or methods for the two electrodes or asymmetrical assembly methods.

The electrodes may be electroconductive layers advantageously chosen from metal oxides, especially the following materials:

doped tin oxide, in particular fluorine SnO ₂ : F or antimony SnO ₂ : Sb (the precursors that can be used in the case of CVD deposition may be organo-metallic or tin halides associated with a fluorine precursor of hydrofluoric acid or trifluoroacetic acid type),

doped zinc oxide, especially with aluminum ZnO: Al (the precursors that can be used, in the case of CVD deposition, may be organo-metallic or zinc and aluminum halides) or with gallium ZnO: Ga, or doped indium oxide, in particular with tin ITO (the precursors that can be used in the case of CVD deposition may be organometallic or tin and indium halides), or the oxide of zinc-doped indium (IZO). More generally, any type of transparent electroconductive layer may be used, for example so-called TCO 'layers (for Transparent Conductive Oxide in English), for example of thickness between 20 and 1000 nm.

It is also possible to use metal thin films known as TCC (for transparent conductive coating in English), for example in Ag, Al, Pd, Cu, Pd, Pt In, Mo, Au and typically of thickness between 2 and 50 nm. The electrodes are not necessarily continuous.

All of the aforementioned electrode materials can be used for overlying electroconductive layers. The electrodes can be deposited on a flexible substrate of the type

PET (polyethylene terephthalate) that is available for example between two sheets of thermoplastic polymer PVB (polyvinyl butyral) type to assemble the two rigid protective elements of the glass type.

The electroluminescent layer may be inorganic or organic or organic / inorganic hybrid, especially thin.

With a thin inorganic electroluminescent layer, we speak of TFEL (Thin electroluminescent film in English). This system generally comprises a so-called phosphor layer between two dielectric layers.

The dielectric layers include, but are not limited to, the following materials: Si ₃ N ₄ , SiO ₂ , Al ₂ O ₃ , AlN, BaTiO ₃ , SrTiO ₃ , HfO, TiO ₂ .

The phosphor layer (thin or thick inorganic electroluminescent) can be composed for example by the following materials: ZnS: Mn, ZnS: TbOF, ZnS: Tb, SrS: Cu, Ag, SrS: Ce.

Examples of inorganic electroluminescent stacks are for example described in US6358632.

With an organic electroluminescent layer, OLED is generally referred to as OLED. More precisely, OLEDs are generally dissociated into two large families according to the organic material used.

If the organic electroluminescent layers are polymers we speak of PLED (Polymer Light Emitting Diodes in English). If the layers electroluminescent are small molecules are called SM-OLED (Small Mollecule Organic Light Emitting Diodes).

An example of PLED consists of a following stack:

a layer of poly (2,4-ethylene dioxythiophene) doped with poly (styren sulphonate) (PEDOT: PSS) of 50 nm,

a layer of phenyl poly (p-phenylenevinylenene) Ph-PPV of 50 nm.

The upper electrode may be a layer of Ca. In general, the structure of an SM-OLED consists of a hole injection layer stack, hole transport layer, emissive layer, transport layer of electron

An example of a hole injection layer is copper phthalocyanine (CuPC), the hole-transporting layer may be, for example, N, N'-Bis (naphthalen-1-yl) -N, N'-bis ( phenyl) benzidine (alpha-NPB), The emitting layer may be for example by a layer of 4,4 ', 4 ^H - tri (N-carbazolyl) triphenylamine (TCTA) doped with tris (2-phenylpyridine) iridium [Ir (ppy) ₃ ].

The electron transport layer may be composed of tris- (8-hydroxyquinoline) aluminum (Alq ₃ ) or bathophenanthroline (BPhen). The upper electrode may be a layer of Mg / Al or LiF / Al.

Examples of organic electroluminescent stacks are for example described in US6645645.

In a particular embodiment, the electroluminescent layer is inorganic and the first electrode is based on doped and / or undoped mineral oxide (s) deposited at high temperature, preferably by pyrolysis, in particular in the gas phase on the electroluminescent layer and the second electrode is metallic, for example based on silver or aluminum.

The device can also integrate any functionalization (s) known (s) in the field of glazing. Among the functionalizations, mention may be made of: hydrophobic / oleophobic, hydrophilic / oleophilic layer, anti-fouling photocatalytic, thermal radiation reflective (solar control) or infra-red (low-emissive) stack, antireflection, mirror reflecting layer. Without being essential, one can however consider, between the layer emitting and the hood, a protective layer such as a thin inorganic layer, for example in particular described in the document US2005248270, for example thin layers of glass, Si ₃ N _4, Al ₂ O ₃ or SiO _2. The device can form (alternative or cumulative choice) a lighting system, decorative, architectural, a signaling system, display - for example of the type drawing, logo, alphanumeric signaling arranged both outside and inside -.

The device may be intended for the building possibly mounted in double glazing, forming a particularly illuminating facade, a (door) window including illuminating.

The device may be intended for a transport vehicle, such as a rear window, a side window or a car roof, a rear view mirror, a windscreen section, a windscreen or any other land vehicle, aquatic or aerial, including a porthole or cockpit.

The device can be intended for street furniture such as a bus shelter wall, be a display, a jewelery showcase, a showcase, a greenhouse.

The device can be intended for interior furnishings, in particular be a shelf element, a mirror, a furniture illuminating facade, an aquarium wall, be a pavement, especially illuminating, for wall coverings or floors or ceilings.

The present invention will be better understood on reading the following detailed description of nonlimiting exemplary embodiments and the following figures 1 to 12 which schematically show partial views of electroluminescent devices encapsulated in various embodiments of the invention.

For the sake of clarity, the elements in the figures are not represented to scale.

Figs. 1a to 1d show partial schematic views in side and bottom section of an encapsulated light-emitting device 100 in a first embodiment of the invention.

This encapsulated electroluminescent device 100 firstly comprises a light emitting system 1 (that is to say UV and / or visible radiation), comprising: a lower electrode 11 in the form of a layer electroconductive transparent or reflecting, which is deposited on a first region (left in Figure 1) of a planar substrate, protective 2, and preferably dielectric, rigid, and transparent (if the system emits by the substrate), such as a glass sheet 2, - an electroluminescent layer 12, which may be continuous or discontinuous, for example in the form of squares or other geometrically uniformly distributed patterns or else forming signage,

an upper electrode 13 in the form of a transparent or reflective electroconductive layer projecting over a second region of the substrate 2 (on the right in FIG. 1),

- optionally an inorganic layer (not shown) for example Si ₃ N ₄ , SiO ₂ , leaving exposed the edge or edges of the upper electrode 13 for electrical connections. The electroluminescent device may be organic, for example of the OLED type. The inner face 21 is coated in this order:

a first transparent electrode 11 (monolayer or multilayer) such as a TCO layer,

the organic electroluminescent system 12 (OLED) typically formed:

an alpha-NPD layer,

a layer of TCTA + Ir (ppy) ₃ ,

- a BPhen layer,

a LiF layer, a second reflecting electrode 13, in particular a metal electrode, preferably in the form of an electroconductive layer, in particular based on silver or aluminum. The electroluminescent device (for all embodiments) may be inorganic thin. The inner face 21 is coated in this order: an electrode comprising a transparent electroconductive layer (monolayer or multilayer),

an inorganic electroluminescent system (TFEL) typically formed:

a layer of Si ₃ N ₄ , a layer of ZnS: Mn, - a layer of Si ₃ N ₄

- A reflective electrode in the form of an electroconductive layer including metal, preferably based on silver or aluminum. The electroluminescent device may be inorganic and thick and include:

an electroconductive layer TCC or TCO,

a thick layer of ZnS: Mn deposited by screen printing,

- A layer of BaTiO ₃ - a reflective electroconductive layer optionally surmounted by a TCC or TCO layer.

The glass sheet 2 is approximately 3 to 10 mm thick, optionally extraclear, with a surface area of the order of m ² , and with external main 22 and internal edges 23. Its wafer 21 is preferably smooth. The sheet 2 is optionally tempered thermally or chemically and curved.

The device 100 further comprises a protective cover 3 of the electroluminescent layer 12, hood dustproof, air, liquid water, gas. This cover 3 is preferably a glass sheet which comprises a wafer 31 with a thickness of between 0.5 mm and 10 mm, in particular of the order of mm and of the external main 32 and internal 33 edges. The sheet 3 is optionally tempered thermally or chemically and curved.

In an application of illuminating tile or illuminating tile can be adjusted the thickness of the hood 2 to put the device 100 at the same level as slabs or tiles (ground or wall) surrounding.

The protective cover 3 is for example of the same shape as the substrate 2 for example rectangular. In this mode, it is smaller than the substrate 2. The protective cover 3 is sealed to the substrate by a peripheral connection means, closely surrounding the active layer 12 and preferably ensuring an airtightness, dust, and at the water.

For example, an epoxy glue 41 that can be UV-curable or IR-stable is chosen if the layer 12 withstands heat. This glue 41, about 10 μm thick, moves the system away from the hood and is deposited on a width by example of 1 to 5 mm. This glue 41 is deposited for example directly on the electrodes 11, 13 or on the optional protective inorganic layer.

As a variant of the connection, it is possible to choose a glass spacer with glue on the bearing faces or a lamination interlayer in the form of a thermoplastic sheet, in particular of the PU, PVB or EVA type.

The device 100 is further provided with a surround 50 around the periphery of the device 100, providing enhanced airtightness, dust, liquid water, gas and a better mechanical strength. This surround 50 is preferably rigid, especially metal for example stainless steel or aluminum.

This surround 50 is for example thick in particular of thickness of about 1 mm to facilitate its fixation and strengthen the device.

This surround can also be thin with a thickness of about 0.1 mm. This surround 50 is for example a plurality of parts, for example two parts 5a, 5b each forming an L, in lateral section. Each part 5a, 5b comprises:

a lateral portion 51, 53 pressed against an edge or edges of the wafer 21 of the substrate 2, a covering portion 52, 54, plane, at 90 ° to the lateral portion 51,

53 and assembled to the substrate 3 by one or more external main edges 32 of the cover 3.

For the sake of clarity, the two parts 5a and 5b are not shown completely in Figure la. As shown in Figure Ib, these lateral portions 51, 53 may form two "U" or alternatively not shown two "L".

The lateral portions 51, 53 may be pressed around the periphery by folding. The covering portions 52, 54 can be folded down on the cover 3 by folding. The respective assemblies of the lateral portions 51, 53 to the substrate 2, and covering portions 52, 54 to the cover 3 are made by a means of assembly preferably dust-tight, air-tight, water-proof, for example a IR-curable epoxy adhesive 61, 62, a polymer material impervious to liquid water and vapor such as a polyurethane hot melt polymer, or a hot melt polymer selected from at least one of following polymer families: ethylene vinyl acetate, polyisobutylene, polyamide, optionally combined with a waterproof polymer material such as a polysulfide, a polyurethane or a silicone.

To delay the penetration of water, the inner surfaces of the covering portions 52, 54 and the outer leading edges 32 of the cover 3 may have complementary textures in the joining areas.

The lateral portions 51, 53 (respectively the covering portions 52, 54) have their free ends which abut for example in the middle of two opposite edges of the substrate (respectively the cover). As a variant shown in FIG. 1c, the lateral portions 51, 53 (and the covers) are overlapping sheets.

Alternatively shown in Figure Id., These side portions 51, 53 (and covers) fit together.

The joining of the two parts 5a, 5b to each other is carried out by a securing means 610 chosen electrical insulator which may be identical to the assembly means 61, 62 mentioned above.

The entourage may be protected from corrosion for example a polysulfide type plastic 620 or polyimide. The latter also protects the seal 610 of the liquid water. The distance between the inner edge 23 and the inner wall of each covering portion 52,54 is at least a few mm and the distance 11 between the slices 21 and 31 and is at least a few mm to enhance the sealing by placing materials provided for this purpose and / or to facilitate connections.

Thus, in the internal space delimited by the substrate 2, the cover 3, the surround 50 and the peripheral seal 41 are preferably placed:

- As close to the connection means 41 a desiccant in the form of a powder 71 surrounding the seal, or in the form of a self-adhesive pellet,

- And a seal 81 vapor-tight water surrounding the desiccant 71, and protected by the surrounding 5, electrical insulation for example a gray polyisobutylene marketed by Teroson under the name "Terostat - 969G".

In the above example, the seal is hot melt (it is a "hot melt" according to the English term). It is soft at room temperature where it can be melted and then injected under pressure. It can also be placed on the periphery glass. The operation of setting the entourage 50 the calibrant to the desired section under the effect of pressure.

Alternatively, the seal 81 is replaced by a bead of adhesive without degassing. For the power supply of the first and second electrical wires

91, 92 - or foils - are connected to the outer walls of the surrounding 50 (passing through the possible coating 620 against corrosion). Each of the parts 5a, 5b of the surround is connected respectively to the lower electrode 11 and upper 13 via internal connection means. These are electrical wires fixed by metal welding or conductive bonding on the inner walls and fixed by metal welding or conductive bonding directly on the electrodes or on conductive strips 110, 130 and distributed along the edge (s) internal main 23 of the substrate to ensure optimal distribution of the current. These bus bar forming strips 110, 130 may preferably be enameled with silver, for example deposited by screen printing, then approximately 10 μm to 100 μm thick, or may be deposited by ink jet charged with (nano) ) silver or copper metal particles.

The arrangement of the electrodes 11, 13 on the substrate 2 may be distinct. For example the upper electrode 13 may be present at the four corners of the inner edges 23 and the lower electrode 11 along these inner edges 23 between these corners. The positions and system of internal connections are therefore chosen accordingly.

The device 100 may have other modifications described below.

The positions of desiccant 71, and seal 81 can be modified. For example, the cover 2 is of size substantially equal to that of the substrate, is thick, especially between 4 and 6 mm and has a beveled edge on all its edges. This bevel makes it possible to create sufficient space for placing the desiccant 71 and / or the filling material 81 in the border. It is also possible to provide grooves a few mm wide in the internal main edges 32. The assembly zones of the covering portions with the outer leading edges 33 can be enlarged further improving the tightness and strength of the device 100. The connecting joint can be a glass frit which is sufficiently to avoid using desiccant 71, or the filling material 81 and to replace the epoxy adhesive 61, 62 with ordinary glue, for example an acrylic glue or a double-sided adhesive.

FIGS. 2a and 2b show partial schematic views in lateral section and in bottom view of an electroluminescent device 200 encapsulated in a second embodiment of the invention.

This device 200 differs from the first device 100 by the characteristics presented below relating to the electrical connection.

A portion of the adhesive for assembly with the substrate 2 is chosen to be conductive 61 ', for example based on an epoxy resin filled with silver and crosslinkable with IR. The device 200 then does not necessarily include bus bars or internal wires.

In order to avoid short circuits, it is used for the assembly as for the fastenings of the metal parts 5a, 5b of the surrounding 50 electrically insulating means 610a to 61Od, for example one or polymeric materials sealed to liquid water and steam already mentioned. As shown in Figure 2b, the joining can be done at the corners.

Conductive glue 61 'can also be provided only in restricted areas. In this configuration, it will then be preferable to add bus bars to the electrodes for a better distribution of the current.

The conductive glue 61 'can cover the internal walls (the glue 62 is then removed)

Conductive glue 61 '(and glue 62) may further be partially or completely replaced by metal welds or solders. The second device 200 can naturally incorporate other characteristics already described for the first mode, particularly in its variants (bonding by glass frit, laminating, absence of desiccant, beveled hood, cross sectional area ...).

FIG. 3 is a diagrammatic sectional view of an electroluminescent device 300 encapsulated in a third embodiment of the invention.

This device 300 differs from the second device 200 by the characteristics presented hereinafter.

The bonding joint is a frit of molten glass 42 with a thickness of the order of 100 μm. The frit 42 is sufficiently sealed for do not use desiccant or seal at the edge and to replace the means of assembly and joining for an ordinary glue for example an acrylic glue or a double-sided adhesive.

The substrate 2 and the cover 3 have the same dimension. The cover 3, like the substrate 2, may be thin, for example 0.3 mm thick.

The surround 50 comprises two additional covering portions 55, 55 'associated with the external main edges 22 of the substrate 2.

The surround 50 is assembled at the same time by the external main edges and the slices 21, 31. The lateral portions 51, 53 are joined by dielectric glue 62 to the cover 3. The lateral portions 51, 53 are assembled to the substrate 2 both by the conductive glue 61 'and by electrically insulating means 61 such as epoxy glue or the aforementioned polymers sealed-or only by conductive glue. The assembly areas of the covering portions 52, 54, 55, 55 'are wide. The conductive glue 61 'can cover the internal walls (the glue 62 is then removed)

The conductive glue 61 'may further be partially or completely replaced by metal solders.

The third device 300 can naturally incorporate other characteristics already described for the other embodiments (bonding by laminating glass frame, or epoxy glue, beveled cover, etc.).

To manufacture the device 300, a portion of the conductive adhesive 61 'may be placed on the surface of the electrodes 11, 13 before sealing.

FIG. 4 is a diagrammatic sectional view of an electroluminescent device 400 encapsulated in a fourth embodiment of the invention.

This device 400 differs from the third device 300 by the characteristics presented hereinafter essentially related to the entourage.

Each part 5a, 5b of the surrounding 50 'comprises: - a plastic part 51 ", 53" possibly reinforced in particular by fibers.

an internal protective film 51 ', 53' of metal of the aluminum or stainless steel strip type for better sealing with steam water, projecting from at least one edge or edges of the plastic part for the electrical connections by means of 'outside. During manufacture, each metal film 51 ', 53' is sufficiently wide to be folded over the outer major edges of the substrate and the cover.

The conductive adhesive 61 'is in contact with the portions 56, 56' for electrical connections by the strips. The conductive glue 61 'may further be partially or completely replaced by metal welds.

On the other hand, if the bonding joint is an epoxy adhesive 41, it is preferred to choose a thick cover with a bevel 33 'to place another desiccant 71 and another seal 81.

The fourth device 400 may naturally incorporate other characteristics already described for the other embodiments (lower-dimensioned non-beveled cover, glass frit and absence of desiccant and edge seal, laminated connection, etc.). Figure 5 shows a schematic side sectional view of a light emitting device 500 encapsulated in a fifth embodiment of the invention.

This device 500 differs from the second device 200 by the characteristics presented below essentially related to the environment and the arrangement of the seal 81 and desiccant 72.

The substrate 2 and the cover 3 have the same dimension. The surround 50 is assembled by the slices of the substrate 2 and the cover 3 of thickness for example of the order of 5 mm.

The entourage 50 is for example four pieces (two pieces are shown) abutments. The lateral section of each piece 5a, 5b is in three portions forming a U. The lateral portions 57, 57 'are parallel to the slices. Between the perpendicular portions 58a to 58'b, spaced apart by 2 mm, the desiccant 72 is placed, for example, self-adhesive, and the seal 81. The fifth device may naturally incorporate other features already described for the embodiments. previous (connection by lamination, glass frit or glass frame, uses internal connection means ...).

FIGS. 6a to 6c show partial schematic sectional views of an encapsulated light-emitting device 600 in a sixth mode embodiment of the invention.

The device 600 differs from the first device 100 by the features presented hereinafter.

The inner walls of the lateral and covering portions 51 to 54 are welded to the edge 31 of the cover and to the inner edges 23 of the substrate. The metal welds 63, 63 'also form the internal electrical connections between the metal surround 50 and the two electrodes 11, 13. Preferably, an ultrasonic tinning procedure is provided on the substrate and / or the cover to ensure wettability between glass and welding material. The device 600 does not necessarily include a bus bar.

The inner walls of the lateral and covering portions 51 to 54 are furthermore also welded to the external edges 33 and the wafer 21 or alternatively glued.

The surround 50 makes it possible to shape the metal welds 63, 63 'and to protect the electrodes 11, 13 from possible oxidation.

To avoid short circuits, the metal welds and the metal parts are separated by glass spacers 59 (as shown in FIGS. 6b and 6c) bonded to the parts 5a, 5b, preferably by a non-conductive hot-melt polymer 610 ', for example a polyisobutylene gray marketed by Teroson under the name "Terostat - 969G" ..

Alternatively, each piece has only a lateral portion of rectangular section.

This device 600 does not include desiccant or additional seal and the connection joint 41 may be a simple acrylate adhesive if the device 600 is made continuously.

The sixth device 600 may naturally incorporate other characteristics described for the other embodiments (bonding by glass frit lamination, cover of the same bevelled dimension, uses additional internal connection means ...). FIG. 7a is a schematic partial sectional view of an electroluminescent device 700 encapsulated in a seventh embodiment of the invention.

This device 700 differs from the sixth device 600 by the characteristics presented below. The hood and the substrate are of the same size. The entourage 50, of cross-section, is assembled by two metal welds 63, 63 'isolated from each other by securing means such as the polymers already described.

The connecting joint 42 is a glass frit for better resistance to heat.

The seventh device 700 may naturally incorporate other features already described for the other embodiments.

Alternatively, the welds 63, 63 'may only be present in a plurality of restricted areas in addition to seals. In this configuration, it will then be preferable to add ^λ bus bars' silver-enamel type or foils on the electrodes 11, 13 for a better distribution of the current.

Figures 7b to 7d show partial and schematic sectional views of encapsulated electroluminescent devices 710 to 730 in variants of the seventh embodiment of the invention.

The first variant differs from the seventh device 700 by the features presented below.

Firstly, the device 710 has overflowing electrodes 11 ', 13' on the wafer 21 of the substrate. These arrangements, for example obtained directly by the electrode deposition method, facilitate the electrical connections with the metal welds 63, 63 '.

Then, the device 710 is laminated with a lamination interlayer 43, for example with a thickness of the order of 0.4 mm, for example EVA. Finally, each metal part 5a, 5b of the surrounding 50 have an L-shaped lateral section.

The second variant 720 differs from the two previous devices 700 and 710 by the features presented hereinafter.

The upper electrode 13 is not extended on the substrate. The upper electrode 13 (possibly topped with one or more other conductive layers) is applied to a network of conducting wires 93

(parallel, grid ...) inlaid on the surface of a sheet 43 of thermoplastic polymer lamination interlayer office. Other conductive elements may be to associate the electrode, for example with a more conductive layer, and / or with a plurality of strips or wires. conductors. Reference is made to the patent WO-00/57243 for the implementation of such multi-component electrodes.

The end 94 of the wire network 93 makes it possible to connect the upper electrode 13 to the metal weld 63 'via a conductive zone, preferably a busbar-type strip 130, for example made of conducting enamel or even of material deposited by inkjet. charged with (nano) metal particles silver or copper type or a foil with a pre-assembled end on the interlayer or a conductive adhesive type epoxy silver. This zone 130, at right angle, overflows on one of the edges of the slice 21.

In another variant, the electrode 11 'is protruding on two edges (here opposite) of the wafer 21. One of the protruding parts is isolated, which then comes into contact with the network of wires 94 thus possibly replacing the bus bar 130. Naturally, the network 93 and the bus bar 130 do not touch the lower electrode 11 '.

In a variant, the network of wires 93 is replaced by at least one electroconductive layer and / or with one or more conductive strips added.

The device 720 can naturally incorporate other features already described for the previous embodiments (assembly by the outer edges of the cover and / or the substrate, partial or total replacement of the metal weld by conductive glue ...).

Naturally the welds 63 and 64 or 63 'and 64' can meet. The third variant 730 differs from the previous device 720 by the features presented hereinafter.

The end 94 of the son network 93 makes it possible to connect the upper electrode 13 to one of the metal welds 64 'of the cover 3 via a foil 130'. This foil 130 'has: - a portion at a time (pre) fixed - for example by softening the interlayer - against the insert 43 and plated or fixed - for example by solder or conductive glue including silver epoxy or by ink-jet deposited material loaded with (nano) metal particles silver or copper type - on the inner edge 23 of the substrate, one portion at a time (pre) fixed against the edge of the insert 43, for example by softening the interlayer and plated or fixed, for example by welding or conductive glue, in particular silver epoxy or by material deposited by ink jet loaded with (nano) metal particles silver or copper type - on the edge of the cover 31,

- And a portion plated or fixed - for example by welding or by material deposited by ink jet charged with (nano) metal particles silver or copper - against the outer edge 32 of the cover 3.

Naturally, it is arranged that neither the network 93 nor the foil 130 'touches the lower electrode 11'.

Figures 8a and 8b show partial and schematic views in lateral and longitudinal section of an 800 electroluminescent device 800 encapsulated in an eighth embodiment of the invention.

This device 800 differs from the device 710 by the features presented hereinafter.

The surround 50 is formed of a single piece 5a metal rectangular side section. The connecting means is a molten glass frit 42 For the power supply of the upper electrode 13, the cover comprises a through hole 311 opposite this electrode. Conductive material 650 - for example a silver-filled epoxy resin - is injected and forms a conductive column in the respective spaces between the cover and the electrodes 11, 13, in contact with a conducting zone, for example a busbar 130 in enamel with silver. Preferably, one welds by its edges a pellet 312 to seal the hole 311. The hole is wide from 1 to

10 mm, preferably 3 to 7 mm.

Surrounding 50 serving only for the first electrical connection, it can be a single piece of metal 5a (or a part with a metal part) assembled by one or welds 63, 64 all around (see Figure 8b).

FIG. 8c represents a partial and schematic side sectional view of an encapsulated electroluminescent device 810 in a variant of the eighth embodiment of the invention. This device 810 differs from the previous device 800 by the characteristics presented below aimed in particular at the means of internal connections.

The cover and the substrate are connected by a lamination interlayer 43. For the power supply of the lower electrode 11, it comprises a first U-shaped foil-like strip 110 'both (pre) fixed - for example by softening of the spacer-against the insert 43 and plated or fixed - for example by welding, conductive adhesive - on the inner wall of the part 5a, the electrode 11 not overflowing, the inner main edge of the cover 3. For the supplying power to the upper electrode 13, it comprises a second U-shaped foil 130 'which passes through the incised insert 43 and is (pre) fixed - for example by softening the interlayer against the 43. This foil 130 'is a side plated or fixed - for example by welding, conductive adhesive including silver epoxy or ink-deposited material charged with (nano) metal particles silver or copper type - on the paro 5a, on the electrode 13 not overflowing, and covers a through hole 311 filled with metal material, preferably metal weld 630 '. The hole is 1 to 10 mm wide, preferably 3 to 7 mm wide. Surrounding 50 serving only for the first electrical connection, it may be a single piece of metal 5a assembled by one or more welds 63, 64 all around.

Figure 9 shows a schematic sectional view of a light emitting device 900 encapsulated in a ninth embodiment of the invention.

This device 900 differs from the preceding devices by the features presented below.

The surround 50 'is formed of two composite parts based on metal. Each part 5a, 5b of the surround 50 'comprises: - a plastic part 51 ", 53" possibly reinforced in particular by fibers, or glass

- An outer protective film 51 ', 53' metal strip type aluminum or stainless steel for better sealing with water vapor, film being folded against the plastic inner face. The parts 5a, 5b are assembled to the slices 21, 31 by welds 63 to 64 'for electrical connections from the outside of the enclosure 50.

Figure 10 shows a schematic sectional view of a light emitting device 1000 encapsulated in a tenth embodiment of the invention.

This device 1000 differs from the second device 200 by the characteristics presented hereinafter.

Each lateral piece 51, 53 is provided on its inner wall with one or more lugs 69, 69 'coming to bear on the electrodes 11, 13 to make the electrical connections, this replacing the conductive adhesive 61' d '. assembly which may be an epoxy glue 61.

These lugs may also serve as means for centering and positioning the entourage 50.

In a variant, the assembly means are metal welds separated by a non-conductive gray butyl seal and the means for securing the parts are also made of non-conductive gray butyl gasket.

FIG. 11 is a diagrammatic sectional view of an electroluminescent device 1100 encapsulated in an eleventh embodiment of the invention.

This device 1100 differs from the preceding devices by the features presented below.

In substitution for the overflowing conductive strips reported from the prior art, conductive layers are chosen which are overflowing. To do this, before assembly of the entourage, at the earliest after the formation of the electrodes, two opposite edges of the wafer of the substrate are successively immersed in a tin bath or silver to form these overflowing layers. , 66 '.

The surrounding 50 'may be dielectric is in one piece or two pieces for example plastic 51 ", 53" with a metal outer film 51', 53 'of protection.

The assembly means are electrically insulating means of the vapor-tight and / or liquid water-proof polymers as mentioned above (ethylene vinylacetate, polyisobutylene, polyamide, polyurethane hot-melt polymer). Alternatively, the surround and the means for assembling the surround with the cover and the substrate can form a single metal-based adhesive tape-like element comprising an adhesive membrane composed in bulk of a polyisobutylene-based material ( butyl plastoelastic, butyl rubber), membrane covered on the outer surface of a tear-resistant film and resistant to UV and weathering composed of metal for example aluminum and synthetic material (s).

Figure 12 shows a schematic sectional view of a light emitting device 1200 encapsulated in a twelfth embodiment of the invention.

This device 1200 differs from the previous devices by the features presented below.

The system 12 'has a thick inorganic electroluminescent layer surmounted by a dielectric layer and a reflective layer. The upper electrode 13 is multicomponent in that it comprises a reflective layer such as thick silver and an electroconductive layer TCC or TCO deposited on the cover 3.

The peripheral means is for example a glass spacer 44 with or without glue. The lower electrode 12 is connected to one of the metal welds 63 of the substrate via a U-shaped foil strip 110 '. This foil comprises:

a portion plated or even fixed by conductive gluing or soldering on the internal edge 33 of the cover,

a portion plated or even fixed by conductive bonding or soldering on one of the edges of the edge 31 of the cover,

- possibly a plated portion - by conductive bonding or welding - on the outer edge 32 of the cover 3.

Similarly, the upper electrode 13 is connected to one of the metal welds 64 'of the cover via a U-shaped foil 130'. It is arranged that each electrode 11 ', 13' does not touch the other metal welds 63 ', 64.

Alternatively, to replace preferably one or the foils, one or both electrodes are projecting over an edge of the wafer (substrate or hood) or one or more conductive enamel strips, for example screen-printed and to money, or a material deposited by jet ink loaded with (nano) metal particles silver or copper type or conductive glue or other conductive layers.

In all the examples, if the device is made continuously, the means for connecting the cover to the substrate may be an acrylic glue or a double-sided adhesive.

The applications of the devices described above are multiple.

The electroluminescent devices 100 to 1200 may be intended for the building, thus forming an illuminating facade, a window or illuminated window door. The devices 100 to 1200 may be intended for a transport vehicle, such as a rear-illuminating window, an illuminating side window or an illuminating automobile roof, a mirror for a mirror, a part of the windshield, or for any other land, water or air vehicle including a porthole or a cockpit. The electroluminescent devices 100 to 1200 may be intended for street furniture, such as a bus shelter, a display rack, a jewelery display, a showcase, a shelf element, an aquarium wall, a greenhouse.

Electroluminescent devices 100 to 1200 can be used for interior furnishings, a furniture facade, an illuminated paver, especially in glass, for wall or floor coverings, an illuminated ceiling slab, for the credence of the kitchen or for the hall bathroom.

Electroluminescent devices can be used for decorative, architectural, signaling and display lighting.

Claims

An encapsulated electroluminescent device (100 to 1200) comprising:

an electroluminescent system (1,1 ') comprising an electroluminescent active layer (12, 12') disposed on a protective substrate (2) and between two electrodes (11 to 13 '),

a protective cover (3) of said electroluminescent layer, integral with the substrate,

means for sealing with liquid and vapor water,

an entourage (50, 50 ') around the periphery of the device in at least one part, characterized in that the surround (50, 50') is in at least one metal part (5a) or in minus a plastic or glass part having a metal part (51 'to 53'), the metal part or metal part serving at least for a first electrical connection to one of the electrodes, or in that it comprises at least one at least one electroconductive layer (66, 66 ') deposited on one edge of the wafer of the substrate (2) or cover and overflowing, between the surround (50) and the substrate or the cover, for a first electrical connection at one of the electrodes (11).

2. encapsulated electroluminescent device (100 to 1200) according to the preceding claim, characterized in that the surround (50, 50 ') is assembled at least in part by the wafer (21) of said substrate and / or by the wafer (31). ) of said hood.

3. encapsulated electroluminescent device (100 to 1200) according to one of the preceding claims, characterized in that the surround (50, 50 ') is assembled by means of assembly (61 to 64') selected from one or the following means:

an epoxy type glue,

a seal in a polymer matrix based on thermoplastic or thermosetting polymer (s), preferably based on elastomer (s), in particular of the essentially saturated hydrocarbon elastomer type, preferably chosen from among rubbers based on mono-olefins such as isobutylene or ethylene-propylene, or polyolefins catalyzed by metallocene catalysts, or based on ethylene vinyl acetate EVA, or based on ethylene vinylbutyrate EVB, or based on silicone (s) or polyurethane (s), - at least vapor-tight means (610) based on hot-melt polymer (s) chosen (s) from at least l one of the following families of polymers: ethylene vinyl acetate, polyisobutylene, polyamide, optionally combined with a water-tight polymer material such as a polysulfide, a polyurethane or a silicone, a polymer material impervious to liquid water and vapor such as a polyurethane hot melt polymer.

4. encapsulated electroluminescent device according to one of the preceding claims, characterized in that the surround (50, 50 ') is assembled by means of assembly sealed to liquid water and vapor preferably mainly by one or more welds metal parts (63 to 64 ').

5. Encapsulated electroluminescent device according to one of the preceding claims, characterized in that the metal part

(5a, 5b) or the metal part (51 ', 53') is assembled at least in part by connecting means (61 to 64 ') and selected from at least one of the following assembly means : a metal solder (63, 63 ', 64, 64'), a conductive adhesive (61 '), in particular a silver-filled epoxy adhesive, a solder.

6. encapsulated electroluminescent device according to one of the preceding claims, characterized in that it comprises an internal electrical connection means, in particular for at least the first electrical connection, preferably selected from at least one of the electrical connection means following associated with the environment (50, 51 ',

5a, 5b):

at least one electroconductive wire (93),

at least one electroconductive strip (HO ', 130'), in particular metal, of foil type, - an electroconductive filler (65),

an electroconductive enamel (110, 130, 130bis),

an electroconductive glue,

at least one metal weld (63).

Encapsulated electroluminescent device according to one of the preceding claims, characterized in that, in particular for less the first electrical connection, it includes:

an internal connection means projecting over at least one edge of the wafer (21, 31) of said substrate or said cover, and chosen from one or the following means: an electroconductive strip (HO ', 130') of the foil type, an electroconductive enamel (110, 130, 130bis), an electroconductive thin film, an electroconductive glue, and / or a protruding portion of one of the electrodes (H ', 13').

8. encapsulated electroluminescent device according to one of the preceding claims, characterized in that one of the electrodes comprises two protruding portions on two edges, optionally opposite, of the wafer of the substrate or the cover, one of the protruding portions being electrically insulated. the other flowing portion and serving for electrical connection of the other electrode.

9. encapsulated electroluminescent device according to one of the preceding claims, characterized in that the entourage and the assembly means of the entourage with the cover form a single element comprising a membrane composed in bulk of a material based on polyisobutylene, membrane, especially adhesive, covered on the outer surface of a film composed of metal and synthetic material (s).

An electroluminescent encapsulated device according to one of the preceding claims, characterized in that the surround (50, 50 ') is at least two-piece (5a, 5b, 51', 53 ') serving for a separate electrical connection, the parts being secured and electrically insulated by at least one of the following securing means (610):

a seal in a polymer matrix based on thermoplastic or thermosetting polymer (s), preferably based on elastomer (s), in particular of the essentially saturated hydrocarbon elastomer type, preferably chosen from among rubbers based on mono-olefins such as isobutylene or ethylene-propylene, or polyolefins catalyzed by metallocene catalysts, or based on ethylene vinyl acetate EVA, or based on ethylene vinylbutyrate EVB, or based on of silicone (s) or of polyurethane (s), - a material based on thermofusible polymer (s) selected from among least one of the following families of polymers: ethylene vinyl acetate, polyisobutylene, polyamide, optionally covered by a liquid water-proof material such as polysulphide or polyurethane, a vapor-tight liquid-type adhesive glue-like adhesive a hot melt polyurethane.

11. encapsulated electroluminescent device according to one of claims 1 to 9, characterized in that the surround (50) is in one piece (5a) and preferably, the second electrical connection is made (91, 92, 630 ' , 650), through a through hole (510, 511, 911) preferably formed in the selected dielectric cover (3), the hole being filled by a metal weld and / or other conductive material (630 ', 65).

12. encapsulated electroluminescent device according to one of the preceding claims, characterized in that the cover is secured to the substrate by a peripheral means which is preferably selected from at least one of the following connection means: an adhesive (41), such as an epoxy resin, a glass frit (42).

13. encapsulated electroluminescent device according to one of claims 1 to 12, characterized in that it forms a laminated glazing and in that the cover being secured to the substrate a lamination interlayer (43) including a sheet of thermoplastic material PU PVB, preferably EVA preferably of substantially the same dimension as the cover and the substrate, optionally with a network of electroconductive wires (93) embedded on a so-called inner surface of the lamination interlayer (43, 43 ') facing an electrode, and / or with an electroconductive layer or electroconductive strips on said inner surface.

An electroluminescent encapsulated device according to claim 13, which comprises one of the following means of electrical connection associated with one or the other of the electrodes (11 to 13 '):

an electroconductive strip (HO ', 130'), in particular of U, of foil type, fixed to at least one edge of the lamination interlayer and in contact with an inner wall of the metallic surround,

an electroconductive strip (HO ', 130') in particular of U, of foil type, with a first end associated with said electrode and with a second end in contact with a through hole filled with metal material of a dielectric cover and between these ends a portion passing through said spacer which is incised.

15. encapsulated electroluminescent device according to one of the preceding claims, characterized in that it comprises a desiccant (71, 72) on the substrate (2) at the outer edge of a cover or peripheral means for securing the cover and the substrate, the desiccant (71) being preferably a powder.

16. Encapsulated electroluminescent device according to one of the preceding claims, characterized in that it comprises, between the surround (50) and the covering or peripheral means (41), a filling material (81) impervious to screw water vapor and liquid such as a metal weld or a vapor-tight polymeric material including electrically insulating material preferably based on polymer (s) hot melt (s) selected (s) among at least one the following families of polymers: ethylene vinyl acetate, polyisobutylene, polyamide or a seal in a polymer matrix based on thermoplastic or thermosetting polymer (s), preferably based on elastomer (s), in particular type essentially saturated hydrocarbon elastomers, preferably chosen from monoolefin-based rubbers such as isobutylene or ethylene-propylene, or polyolefins catalyzed by metallocene catalysts, or based on ethylene vinyl acetate EVA, or based on ethylene vinylbutyrate EVB, or based on silicone (s) or polyurethane (s).

17. Encapsulated electroluminescent device according to one of the preceding claims, characterized in that the cover (3) is a flat, curved and / or tempered glass sheet, with a slice (31) possibly bevelled and / or with main edges. grooves and / or drilled and in that the outer main edges of the cover (3) and the associated edges of the entourage (50) optionally have complementary textures.

18. The electroluminescent device encapsulated according to one of the preceding claims, characterized in that the electroluminescent layer is organic (11), especially thin.

19. Electroluminescent device encapsulated according to one of the preceding claims, characterized in that the surround is protected against corrosion preferably by a polysulfide (620) or a polyimide.

20. Encapsulated electroluminescent device according to one of the preceding claims, characterized in that the system carried by the substrate is one of the so-called lower electrodes, is associated with the substrate, in particular deposited on the substrate, the other of the electrodes, said upper is partly associated with the cover, in particular deposited on the cover and preferably the electroluminescent layer is inorganic and thick.

21. encapsulated electroluminescent device according to any one of the preceding claims, characterized in that it forms a decorative lighting system, architectural, a signaling system, display, and / or is intended for the building including double mounted glazing, in particular a facade, a window or a window door, and / or is intended for a transport vehicle, such as a rear window, a side window or an automobile roof, a rear-view mirror, or any other vehicle land, water or air, including a porthole or a cockpit and / or is intended for street furniture or interior furnishings, such as a bus shelter, a display, a jewelery display, a showcase, a shelf element, an aquarium wall, a greenhouse, an illuminating mirror, a furniture facade, a particularly illuminating pavement, for wall or floor or ceiling coverings.