EP2047486B1 - Element resistif ayant des caracteristiques de ctp ainsi qu'une conductivite electrique et thermique elevee - Google Patents

Element resistif ayant des caracteristiques de ctp ainsi qu'une conductivite electrique et thermique elevee Download PDF

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Publication number
EP2047486B1
EP2047486B1 EP07785661A EP07785661A EP2047486B1 EP 2047486 B1 EP2047486 B1 EP 2047486B1 EP 07785661 A EP07785661 A EP 07785661A EP 07785661 A EP07785661 A EP 07785661A EP 2047486 B1 EP2047486 B1 EP 2047486B1
Authority
EP
European Patent Office
Prior art keywords
ceramic body
recesses
resistor element
element according
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP07785661A
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German (de)
English (en)
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EP2047486A1 (fr
Inventor
Werner Kahr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
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Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP2047486A1 publication Critical patent/EP2047486A1/fr
Application granted granted Critical
Publication of EP2047486B1 publication Critical patent/EP2047486B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient

Definitions

  • An object to be solved is to provide a resistance element which is characterized by a high electrical and thermal conductivity.
  • a ceramic ceramic body resistance element having PTC characteristics is disclosed.
  • the abbreviation PTC stands for Positive Temperature Coefficient.
  • the first and second major surfaces of the ceramic body have an array of depressions.
  • the first major surface of the ceramic body has an array of first recesses and the second major surface of the ceramic body has an array of second recesses.
  • the main surfaces of the ceramic body including the surface of the recesses, are preferably covered with an electrode layer.
  • Each electrode layer forms an electrode surface.
  • the resistance of the resistive element is the lower the larger the electrode area and the smaller the distance between the electrode layers. These parameters depend directly on the geometric parameters such. B. depth, width of the wells and distance between the wells together. By setting the electrode area explained below and the distance between the electrode layers, it is possible to achieve a given resistance value for the given size of the resistance element.
  • the depressions make it possible, in particular, to increase an effective electrode area of the ceramic body and thus to lower the resistance value of the resistance element compared to the embodiment without depressions.
  • the recesses also make it possible to reduce the distance between two opposite electrode surfaces of the resistance element. By enlarging the electrode surface, it is also possible to achieve a particularly small resistance element with a high heat output. Low resistance and high heat dissipation are also achieved by small distances of the recesses.
  • the first (and second) recesses are preferably in the form of columns or grooves that are parallel to each other.
  • the depressions may also be formed as blind holes. A regular arrangement of identically formed depressions is preferred.
  • the second recesses may be parallel to the first recesses.
  • the second depressions may also extend transversely, in particular perpendicularly or obliquely to the first depressions.
  • the recesses may have any cross section.
  • the side walls of the recesses may be perpendicular or oblique to the major surfaces of the resistive element be curved or curved.
  • the depressions may also have steps.
  • the depth of the recesses preferably exceeds their width.
  • the depth of the depressions may be, for example, at least twice their width.
  • the depth of the recesses is preferably at least 20% of the thickness of the ceramic body.
  • the depth of the recesses may also exceed 50% of the thickness of the ceramic body.
  • the first and second recesses may have the same depth. But they can in principle also have different thicknesses from each other.
  • the second recesses are arranged offset in an advantageous variant with respect to the first recesses (in a plan view).
  • the ceramic body has a serpentine cross section.
  • the staggered first and second recesses may overlap with respect to the thickness direction of the ceramic body (in a side view) so as to interlock with each other in a central area of the ceramic body.
  • the first and second recesses are alternately arranged in the middle region of the ceramic body. In this case, the depth of the recesses exceeds half the thickness of the ceramic body.
  • the second recesses may lie in a further variant (in a plan view) with respect to the first recesses.
  • the depth of the first and the second Recesses smaller than half the thickness of the ceramic body.
  • the recesses may be at least partially filled with a filling material whose thermal conductivity exceeds that of the material of the ceramic body.
  • the filler material can be electrically insulating.
  • the filler material may also be electrically conductive.
  • the ceramic body is preferably a solid, rigid sintered body.
  • BaTiO 3 is suitable as base material for the ceramic body.
  • the ceramic body is preferably provided as a plate.
  • the recesses may be formed as cuts in a sintered ceramic body.
  • the main surfaces of the ceramic body are metallized after the formation of the depressions to form electrode layers.
  • the electrode layers can each z. B. be applied in a galvanic process. They can also be applied by sputtering, steaming or as a metal paste and baked. It is also possible to combine these electrode technologies to generate special layer sequences.
  • Such prefabricated resistor elements are preferably provided with electrical connections for the introduction of current, wherein the mechanical design may correspond to those of radially contacted or SMD capable devices.
  • the assembly of these elements may also include a coating of insulating materials, encapsulation in plastics. In this case, a plurality of resistance elements can be encapsulated together.
  • These resistive elements can also be connected to at least one flat covering layer whose thermal conductivity preferably exceeds that of the material of the ceramic body.
  • This cover layer can be electrically conductive and be suitable as a contact for the current introduction.
  • the cover layer may also be formed as a composite comprising an electrically conductive sub-layer and an electrically insulating sub-layer.
  • the resistive elements can also be arranged without prefabricated connection to cover layers in such a way that the electrical and thermal contacting with the latter can also take place subsequently.
  • Several mechanically interconnected resistive elements can be used together in an array. These resistive elements are preferably electrically connected together.
  • FIG. 1 a resistance element with a ceramic body 1 is shown.
  • the ceramic body 1 has first recesses 21, which are arranged on its first main surface (upper side), and second recesses 22, which are arranged on its second main surface (underside). These depressions are preferably, as in the variant according to the FIG. 2 , filled with a filling material 3, which has a better thermal conductivity than the ceramic body 1.
  • a first electrode layer 61 and on the underside of a second electrode layer 62 is arranged on the upper side of the ceramic body.
  • the electrode layers 61, 62 also cover the surface of the recesses 21, 22.
  • the ceramic body 1 is in the variant according to the FIG. 3 between two cover layers 41, 42 are arranged.
  • the ceramic body 1 is preferably firmly connected to the cover layers 41, 42, for example glued.
  • resistance element is suitable for example as a heating element.
  • FIG. 4 is the resistance element according to the FIG. 2 shown, which led out to the bottom of the resistive element electrical connections 51, 52 has.
  • a resistive element is a surface mountable device or SMD device.
  • SMD stands for Surface Mounted Device.
  • This in FIG. 4 shown resistor element can be mounted on a printed circuit board and is particularly suitable for current protection applications into consideration.
  • the resistive element may alternatively be used as a wired component, i. H. with wire connections, be formed.
  • the depth of in Fig. 5A shown recesses 21, 22 exceeds half the thickness of the ceramic body 1, so that the first recesses partially engage and overlap in a central region 10 of the ceramic body.
  • the ceramic body 1 has a serpentine cross-section.
  • Particularly deep recesses 21, 22 have the advantage that thereby a particularly small distance between the electrode layers 61, 62 adjusted and thus the resistance of the resistive element can be reduced.
  • the depth of the in the Figures 5B and 5C shown depressions 21, 22 is set smaller than half the thickness of the ceramic body 1.
  • the second recesses 22 are directly opposite the first recesses 21.
  • the remaining thickness of the ceramic body between the recesses 21, 22 is selected so that it is sufficient for the stability of the resistive element.
  • FIG. 5D a non-inventive resistance element is presented, which has an array of recesses 21 only on one side.
  • the wells 21, 22 of the in the FIGS. 1 to 5C shown resistor elements have a rectangular cross-section.
  • the cross-section of the recesses 21, 22 may alternatively as in Fig. 5D rounded, as in Fig. 5E with sloping side walls or as in Fig. 5F Be V-shaped.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

L'invention concerne un élément résistif muni d'un corps (1) en céramique qui présente des caractéristiques de CTP. Au moins une surface principale du corps (1) en céramique présente un arrangement de creux (21, 22).

Claims (10)

  1. Élément de résistance
    - avec un corps céramique (1) présentant des propriétés CPT,
    - sachant qu'une première face principale du corps céramique (1) présente une disposition de premiers creux (21), caractérisé en ce qu'une seconde face principale du corps céramique (1) présente une disposition de seconds creux (22).
  2. Élément de résistance selon la revendication 1,
    - sachant que les seconds creux (22) sont disposés à une position décalée par rapport aux premiers creux (21).
  3. Élément de résistance selon la revendication 2,
    - sachant que les premiers et les seconds creux (21, 22) se chevauchent par rapport au sens de l'épaisseur du corps céramique (1) de telle manière qu'ils s'engrènent les uns dans les autres.
  4. Élément de résistance selon l'une quelconque des revendications 1 à 3,
    - sachant que la profondeur des creux (21, 22) représente au moins 20% de l'épaisseur du corps céramique (1).
  5. Élément de résistance selon l'une quelconque des revendications 1 à 4,
    - sachant que les faces principales du corps céramique (1), y compris la surface des creux (21, 22), sont recouvertes d'une couche d'électrode (61, 62).
  6. Élément de résistance selon l'une quelconque des revendications 1 à 5,
    - sachant que les creux (21,22) sont remplis d'une matière de remplissage (3), dont la conductibilité thermique est supérieure à celle de la matière du corps céramique (1).
  7. Élément de résistance selon l'une quelconque des revendications 1 à 6,
    - sachant qu'au moins une face principale du corps céramique (1) est reliée à une couche de recouvrement (41, 42), dont la conductibilité thermique est supérieure à celle de la matière du corps céramique (1).
  8. Élément de résistance selon l'une quelconque des revendications 1 à 7,
    - sachant qu'au moins une face principale du corps céramique (1) est rigidement reliée à un raccord électrique (51, 52).
  9. Élément de résistance selon l'une quelconque des revendications 1 à 7,
    - sachant que le corps céramique (1) est enveloppé d'une couche de recouvrement avec les raccords électriques (51, 52) qui sont raccordés sur lui.
  10. Élément de résistance selon l'une quelconque des revendications 1 à 9,
    - qui est relié mécaniquement et électriquement à au moins un autre élément de résistance.
EP07785661A 2006-07-20 2007-07-19 Element resistif ayant des caracteristiques de ctp ainsi qu'une conductivite electrique et thermique elevee Expired - Fee Related EP2047486B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006033691A DE102006033691A1 (de) 2006-07-20 2006-07-20 Widerstandselement mit PTC-Eigenschaften und hoher elektrischer und thermischer Leitfähigkeit
PCT/DE2007/001293 WO2008009280A1 (fr) 2006-07-20 2007-07-19 Élément résistif ayant des caractéristiques de CTP ainsi qu'une conductivité électrique et thermique élevée

Publications (2)

Publication Number Publication Date
EP2047486A1 EP2047486A1 (fr) 2009-04-15
EP2047486B1 true EP2047486B1 (fr) 2011-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP07785661A Expired - Fee Related EP2047486B1 (fr) 2006-07-20 2007-07-19 Element resistif ayant des caracteristiques de ctp ainsi qu'une conductivite electrique et thermique elevee

Country Status (5)

Country Link
US (1) US7902958B2 (fr)
EP (1) EP2047486B1 (fr)
JP (1) JP2009544160A (fr)
DE (2) DE102006033691A1 (fr)
WO (1) WO2008009280A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6590004B2 (ja) * 2018-01-15 2019-10-16 三菱マテリアル株式会社 サーミスタ素子及びその製造方法
DE102020202195A1 (de) 2020-02-20 2021-08-26 Eberspächer catem Hermsdorf GmbH & Co. KG Elektrische Heizeinrichtung
CN112802649A (zh) * 2020-12-28 2021-05-14 广西新未来信息产业股份有限公司 一种增大陶瓷体-银电极接触面积的压敏瓷片

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JPS5258139A (en) * 1975-11-08 1977-05-13 Murata Manufacturing Co Method of producing heater using positive characteristic thermistor
US4179797A (en) * 1978-03-23 1979-12-25 Xerox Corporation Method of making a resistor array
DE3107290A1 (de) 1980-03-03 1982-01-07 Canon K.K., Tokyo Heizvorrichtung
US4314230A (en) * 1980-07-31 1982-02-02 Raychem Corporation Devices comprising conductive polymers
DE8309023U1 (de) 1983-03-25 1986-02-20 Siemens AG, 1000 Berlin und 8000 München Flexibles Heizelement in Bandform, das aus elektrisch leitfähigen Körnchen aus PTC-Material und einem organischen isolierenden Kunststoff als Bindemittel
US4529958A (en) * 1983-05-02 1985-07-16 Dale Electronics, Inc. Electrical resistor
DE3445698A1 (de) * 1984-12-14 1986-06-26 C. Conradty Nürnberg GmbH & Co KG, 8505 Röthenbach Chip-varistor und verfahren zu seiner herstellung
JPH03114171A (ja) * 1989-09-28 1991-05-15 Tdk Corp 正特性サーミスタ装置
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US5081439A (en) * 1990-11-16 1992-01-14 International Business Machines Corporation Thin film resistor and method for producing same
US5397518A (en) * 1993-04-16 1995-03-14 Texas Instruments Incorporated Process for forming ceramic pixel array and pixel array formed thereby
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Also Published As

Publication number Publication date
US20090179730A1 (en) 2009-07-16
JP2009544160A (ja) 2009-12-10
DE502007006682D1 (de) 2011-04-21
US7902958B2 (en) 2011-03-08
EP2047486A1 (fr) 2009-04-15
WO2008009280A1 (fr) 2008-01-24
DE102006033691A1 (de) 2008-01-31

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