EP2029974A1 - Sensor in mikromechanischer bauweise zum messen des massendurchflusse nach dem coriolis-prinzip - Google Patents
Sensor in mikromechanischer bauweise zum messen des massendurchflusse nach dem coriolis-prinzipInfo
- Publication number
- EP2029974A1 EP2029974A1 EP07765440A EP07765440A EP2029974A1 EP 2029974 A1 EP2029974 A1 EP 2029974A1 EP 07765440 A EP07765440 A EP 07765440A EP 07765440 A EP07765440 A EP 07765440A EP 2029974 A1 EP2029974 A1 EP 2029974A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- line sections
- line
- layers
- sensor according
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 125000006850 spacer group Chemical group 0.000 claims abstract description 18
- 230000010355 oscillation Effects 0.000 claims abstract description 7
- 239000012530 fluid Substances 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 8
- 230000003534 oscillatory effect Effects 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 4
- 108090000623 proteins and genes Proteins 0.000 claims description 2
- 239000000725 suspension Substances 0.000 abstract description 5
- 238000010276 construction Methods 0.000 description 12
- 230000005284 excitation Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 6
- 230000006399 behavior Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000003339 best practice Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
- G01F1/78—Direct mass flowmeters
- G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
- G01F1/84—Coriolis or gyroscopic mass flowmeters
- G01F1/845—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits
- G01F1/8468—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits
- G01F1/849—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits having straight measuring conduits
- G01F1/8495—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits having straight measuring conduits with multiple measuring conduits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0032—Structures for transforming energy not provided for in groups B81B3/0021 - B81B3/0029
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
- G01F1/78—Direct mass flowmeters
- G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
- G01F1/84—Coriolis or gyroscopic mass flowmeters
- G01F1/8409—Coriolis or gyroscopic mass flowmeters constructional details
- G01F1/844—Coriolis or gyroscopic mass flowmeters constructional details microfluidic or miniaturised flowmeters
- G01F1/8445—Coriolis or gyroscopic mass flowmeters constructional details microfluidic or miniaturised flowmeters micromachined flowmeters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
- G01F1/78—Direct mass flowmeters
- G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
- G01F1/84—Coriolis or gyroscopic mass flowmeters
- G01F1/845—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits
- G01F1/8468—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits
- G01F1/8472—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits having curved measuring conduits, i.e. whereby the measuring conduits' curved center line lies within a plane
- G01F1/8477—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits having curved measuring conduits, i.e. whereby the measuring conduits' curved center line lies within a plane with multiple measuring conduits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
Definitions
- the invention relates to a sensor in micromechanical construction for measuring the mass flow rate according to the Coriolis principle, which two vibratory mounted pipe sections for the fluid whose mass flow is to be measured, wherein the line sections together with the oscillatory storage by layered, structured layers are formed.
- a mass flow sensor according to the Coriolis principle which has a different design.
- the line sections used for the measurement have a straight course in this sensor and are arranged parallel to one another. To carry out the measurement, the line sections are set in bending oscillations.
- the sensor micromechanically produced is made up of two bonded silicon wafers, in which each half ⁇ shells of the prepared to generating line sections. the half-shells are completed to form a closed line cross-section because of the associated with the anisotropic etching of silicon wafers expense of the mass flow sensor is only.
- two line sections are produced which lie in one plane in accordance with the geometrical extent of the wafers
- the two line sections can be vibrated in different oscillation modes, whereby it can be shown that depending on the selected type of excitation can reach different sensor behaviors.
- the sensor performance in English also called Quality Factor Q hereinafter
- Q ⁇ 1500 grades can be achieved.
- the object of the invention is to provide a mass flow sensor nor the Coriolis principle in micromechanical design, the sensitivity is improved.
- the spacing structure is integrated in the micromechanical structure in the form of various layers, so that production in micromechanical construction is facilitated. Due to the symmetries occur in the layered construction of the sensor can be det USAGE ⁇ for the two line sections of equal parts so that the production effort for the micromechanical niche sensor according to the invention despite Vorsehnung of more than two layers can be kept within limits.
- the line sections are formed by two layered Lei ⁇ processing layers, in the connecting surface of the line cross-section is located.
- This embodiment of the invention has the advantage that can be used for the production of the line sections on best practices, as described for example in Enoksson ⁇ ben.
- a particular embodiment of the invention provides that the spacer structure is formed by a recess in at least one of the cable layers, preferably by symmetrical depressions in both cable layers, wherein the cable layers are connected to each other with the side facing away from the connection surface.
- the elements required for the spacing structure can advantageously be integrated into the layers of the sensor structure, which in any case must be provided for producing the line sections.
- the spacer structure is formed by a spacer layer, wherein the Kausab ⁇ sections forming layers are attached to form the distance a on the opposite sides of the spacer layer.
- This construction makes an additional position in the sensor necessary, such a construction is particularly advantageous if the line sections form ⁇ the layers are produced in etching technology. In this way, the geometry of these layers is not unnecessarily complexed, so that efficient process control during the etching treatment of the silicon wafers is possible.
- the simple geometry of the layers forming the line sections further enables a standardization of these layers, so that the sensor structure can be assembled, in particular in the case of a symmetrical structure, from respectively identically designed layers.
- the spacer layer is a comparatively low prepared standard component to which can be linked intimately with the silicon layers to USAGE ⁇ .
- the requirements for the dimensional accuracy of the distance ⁇ position are in fact substantially less than the requirements on the geometry of the line sections forming layers.
- the spacing only requires a defined thickness in the areas which are fastened to the adjacent layers.
- the line sections have a loop-shaped course and the ends of each of a Budapestlyab- Cut together in a common storage location. In this way, an oscillatory system is created, which can advantageously undergo a large deflection at low excitation forces, since the design of the line sections comparable to a flying bearing leads to a low rigidity of the suspension.
- Another embodiment of the invention is obtained when the line sections are straight and are mounted with their ends depending ⁇ Weil in two opposite bearing points. Such a trained sensor is excited so that the line sections perform bending vibrations.
- the associated higher rigidity of the sensor is particularly advantageous when fluids with a high density, in particular ⁇ special liquids should be evaluated in terms of their mass flow.
- the line sections are surrounded by a hermetic encapsulation.
- This advantageously represents a protection of the sensitive sensor structure from the environment.
- the encapsulation can advantageously be used to reduce the pressure in the interior of the encapsulation with respect to the environment, in particular to generate a vacuum in the hermetic encapsulation, whereby the vibrations of the line sections associated air friction can be reduced. This measure causes a additional reduction of the damping, whereby the sensitivity of the sensor can be advantageously further improved.
- Figure 1 shows a schematic cross section through an embodiment of the sensor according to the invention, which is additionally provided with a hermetic encapsulation
- Figure 2 is a perspective view of the line sections and the suspension of the sensor according to Figure 1
- Figure 3 is a perspective view of another Ausu ⁇ tion of the sensor according to the invention schematically shows the embodiment according to Figure 4 and portions of a sensor 1 with four symmetrically arranged ⁇ line and the resulting mechanical stresses.
- a micromechanically produced mass flow sensor 11 which consists of a total of nine micromechanically produced layers.
- the heart is represented by cable layers 12a, 12b, which contribute to the formation of line sections 13.
- One line layer 12a and one line layer 12b each form half shells 14 which, after bonding of the layers, become closed line cross sections 15. These are connected in a manner not shown with the frame structures 16, whereby the suspension of the line sections 13 takes place (more on this in the following).
- the line sections 13 perform at a Schwingungsanre ⁇ tion vibrations, which are indicated by parts 17. So that the line sections that lichst to generate a mög ⁇ high quality are excited in opposite phase, the vibrations cause not interfere during removal, is between
- Conductive layers 12a provided a spacer layer 18, the thickness of which guarantees a defined distance a between the cable layers.
- the spacer layer is in this case to the frame 16 of the structural ⁇ structures line layers 12a.
- the line layers 12b are each provided with further spacer layers 19 towards the outside, which are supported in the same way on the frame structures 16 of the line layers 12b.
- cover layers 20 are provided with which a closure of the system is possible.
- the further spacings 19 fulfill the same function as the previously mentioned spacer layer 17, which consists in that the line sections 13 do not bounce against the cover layers 20 while they perform their oscillations.
- the conductor layers 12a, 12b are made of silicon wafers by means of anisotropic etching. This explains the hexagonal cross-sectional line 15.
- the line layers 12a, 12b are on ⁇ due to the symmetry as identical parts performed so that these common parts in relatively large quantities can be produced. These are provided on the surface of a wafer and separated after the etching treatment.
- the further layers 18, 19, 20 may likewise be made of silicon. Like the respective layers 12a and 12b, these can then be connected to one another by wafer bonding. Alternatively, however, the further layers can also be made of a less expensive material, since they are components with relatively simple geometry. In this case, the other layers should, for example with the Lei ⁇ tung layers 12a, 12b are bonded.
- the lead portions 13 each extend in two parallel planes to each other ⁇ 21, thereby ensuring the constant distance a.
- the two line sections 13 are also designed mirror-symmetrically to a plane of symmetry 22.
- the bearings, not shown, are also symmetrical to each other, so that the system by a suitable
- Excitation can be set in phase opposition to vibrate in order to perform the indicated by the arrows 17 vibrations.
- a vibrational excitation can be carried out on the lead portions that form a capacitor and oscillatory movements induced by a suitable electrical control (not in dargestell ⁇ ter manner) in the line sections, for example, the e lectric conductive coating 23rd
- a suitable electrical control not in dargestell ⁇ ter manner
- An appropriate design of electrodes which is not shown in detail in Figure 1, can also be used for electrical reading of the vibration behavior (amplitude, frequency), this electrical signal is evaluated as a sensor signal.
- FIG. 2 shows the sensor structure according to FIG. 1 in perspective.
- the sectional plane S is tet angedeu ⁇ in Figure 2, wherein the two line sections ter Kunststoff in Figure 2 in Un ⁇ 13 is shown to Figure 1 in the deflected state.
- the layers 19 and 20 shown in FIG. 1 and the frame structures of the remaining layers are not shown in FIG. From Figure 2, however, in addition to the line sections 13 and the bearings 24 are clear, on the one hand from each of extensions 25 of the Kirsab ⁇ sections 13 and rigid clamps 26, the Interface to the frame structures 16, not shown, (see FIG.
- the line sections 13 open into the extensions 25 in a T-shape. Since the extensions 25 merge at their respective ends into the rigid clamps 26, essentially a tension stress is induced in the extensions by a deflection of the line sections 13 in the form shown in FIG.
- the line sections 13 with their fluidic filling (gas or liquid) thus serve as a mass and the extensions as a torsion spring of a vibratory spring-mass system.
- the extensions serve to introduce or discharge the fluid into and out of the pipe structure. This is also indicated in Figure 1 by arrows 27.
- the outlets 28 can be seen for the fluid, which experienced by the frame structures 16, not shown, a corresponding extension to the outside.
- the corresponding inlets are vorgese (not visible in Figure 2) ⁇ hen.
- FIG. 3 shows an alternative embodiment of the sensor.
- the line sections 13 are guided straight ahead, but these are shown in FIG. 3 in the deflected state.
- the line sections are incorporated at opposite ends into respective extensions 25, which in turn transition into restraints 26.
- This bearings 31 are created, which analogous to the bearings according to Figure 2 function as soon as bending vibrations are induced in the line sections 13.
- the sensor arrangement according to FIG. 3 can be constructed analogously to FIG. 1 in order to realize a hermetic encapsulation.
- FIG. 4 schematically shows a structure for a sensor structure which can supplement a sensor structure according to FIG. Evident are the line sections 13 and a central clamping 26 for both line sections 13.
- the line sections 13 are arranged symmetrically to the plane of symmetry 22.
- a further plane of symmetry 32 is provided which extends perpendicular to the plane of symmetry 22 in the middle by the clamping 26.
- This plane of symmetry defines the symmetrical arrangement of two further line sections 33, which extend in the opposite direction to the line sections 13.
- the line portions may have a gradient to ⁇ corresponding to the in Figure 2 is depicted. This results in respect of the course of the line sections 13 and 33 further into a plane of symmetry, which is parallel to the plane of FIG 4 and thus extends parallel both on the plane of symmetry 22 and on the plane of symmetry 32.
- FIG. 5 shows a sensor structure which corresponds in construction to that according to FIG. 1, but was produced by a different method.
- the line layers 12a, 12b are injection-molded parts
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Measuring Volume Flow (AREA)
- Gyroscopes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006029443A DE102006029443B3 (de) | 2006-06-21 | 2006-06-21 | Sensor in mikromechanischer Bauweise zum Messen des Massendurchflusses nach dem Coriolis-Prinzip |
| PCT/EP2007/055946 WO2007147786A1 (de) | 2006-06-21 | 2007-06-15 | Sensor in mikromechanischer bauweise zum messen des massendurchflusse nach dem coriolis-prinzip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2029974A1 true EP2029974A1 (de) | 2009-03-04 |
Family
ID=38476895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP07765440A Withdrawn EP2029974A1 (de) | 2006-06-21 | 2007-06-15 | Sensor in mikromechanischer bauweise zum messen des massendurchflusse nach dem coriolis-prinzip |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7874219B2 (de) |
| EP (1) | EP2029974A1 (de) |
| DE (1) | DE102006029443B3 (de) |
| WO (1) | WO2007147786A1 (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1034905C2 (nl) * | 2008-01-11 | 2009-07-14 | Berkin Bv | Stromingsmeetapparaat. |
| US8272274B2 (en) * | 2008-02-11 | 2012-09-25 | Integrated Sensing Systems Inc. | Microfluidic device and methods of operation and making |
| DE102008039045A1 (de) * | 2008-08-21 | 2010-02-25 | Endress + Hauser Flowtec Ag | Sensor in mikromechanischer Bauweise |
| DE102010030489A1 (de) | 2010-03-25 | 2011-09-29 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | System zu Behandlung von Flüssigkeiten |
| WO2011117275A1 (de) | 2010-03-25 | 2011-09-29 | Endress+Hauser Conducta Gesellschaft Für Mess- Und Regeltechnik Mbh+Co. Kg | System zur behandlung von flüssigkeiten |
| US8959997B2 (en) | 2010-07-01 | 2015-02-24 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Method and apparatus for measuring volume flow rate of liquid flowing into a container and/or volume of liquid which has flowed into the container |
| DE102011003615B4 (de) | 2011-02-03 | 2024-06-06 | Endress+Hauser Conducta Gmbh+Co. Kg | Verfahren und Vorrichtung zur Messung eines Volumenstroms einer in einen Behälter einströmenden Flüssigkeit und/oder eines in den Behälter eingeströmten Volumens der Flüssigkeit |
| DE102010030790A1 (de) | 2010-07-01 | 2012-01-05 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Verfahren und Vorrichtung zur Messung eines Volumenstroms einer in einen Behälter einströmenden Flüssigkeit und/oder eines in den Behälter eingeströmten Volumens der Flüssigkeit |
| DE102010035381A1 (de) | 2010-08-23 | 2012-02-23 | Siemens Aktiengesellschaft | Messverfahren und Messanordnung zur Erfassung der zeitlichen Veränderung einer elektrischen Kapazität |
| WO2012072347A1 (de) * | 2010-12-03 | 2012-06-07 | Elmos Semiconductor Ag | Verfahren und vorrichtung zur vermessung eines mikro-elektromechanischen halbleiterbauteils |
| DE102010064017A1 (de) | 2010-12-23 | 2012-06-28 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Vorrichtung und Verfahren zur pneumatischen Regelung eines Volumenstroms einer Flüssigkeit |
| US11001494B2 (en) | 2011-06-23 | 2021-05-11 | Duality Reality Energy, LLC | Multi-zone microstructure spring |
| US9085454B2 (en) * | 2011-07-05 | 2015-07-21 | Duality Reality Energy, LLC | Reduced stiffness micro-mechanical structure |
| US9076961B2 (en) | 2012-01-31 | 2015-07-07 | Duality Reality Energy, LLC | Energy harvesting with a micro-electro-machanical system (MEMS) |
| DE102012109729A1 (de) | 2012-10-12 | 2014-05-15 | Endress + Hauser Flowtec Ag | Meßsystem zum Ermitteln eines Volumendruchflusses und/oder einer Volumendurchflußrate eines in einer Rohrleitung strömenden Mediums |
| WO2014056709A1 (de) | 2012-10-11 | 2014-04-17 | Endress+Hauser Flowtec Ag | Messsystem zum ermitteln eines volumendurchflusses und/oder einer volumendurchflussrate eines in einer rohrleitung strömenden mediums |
| RU2600500C1 (ru) * | 2012-12-17 | 2016-10-20 | Майкро Моушн, Инк. | Улучшенный кожух для вибрационного измерителя |
| US10794745B2 (en) | 2017-08-23 | 2020-10-06 | Micro Motion, Inc. | Vibratory meter with pointed flow tube |
| WO2019089032A1 (en) | 2017-11-02 | 2019-05-09 | Micro Motion, Inc. | Compact vibrating type flowmeter |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4491025A (en) * | 1982-11-03 | 1985-01-01 | Micro Motion, Inc. | Parallel path Coriolis mass flow rate meter |
| DE3443234A1 (de) | 1984-11-27 | 1986-06-05 | Danfoss A/S, Nordborg | Massendurchfluss-messgeraet nach dem coriolis-prinzip |
| US4768385A (en) * | 1986-08-13 | 1988-09-06 | Micro Motion, Inc. | Parallel path Coriolis mass flow meter |
| US6044705A (en) * | 1993-10-18 | 2000-04-04 | Xros, Inc. | Micromachined members coupled for relative rotation by torsion bars |
| DE59607420D1 (de) * | 1995-05-31 | 2001-09-06 | Litef Gmbh | Mikromechanischer drehratensensor |
| DE19528961C2 (de) * | 1995-08-08 | 1998-10-29 | Daimler Benz Ag | Mikromechanischer Drehratensensor (DRS) und Sensoranordnung |
| US5969264A (en) * | 1998-11-06 | 1999-10-19 | Technology Commercialization Corp. | Method and apparatus for total and individual flow measurement of a single-or multi-phase medium |
| US6477901B1 (en) * | 1999-12-21 | 2002-11-12 | Integrated Sensing Systems, Inc. | Micromachined fluidic apparatus |
| JP4188087B2 (ja) * | 2001-03-23 | 2008-11-26 | シュルンベルジェ ホールディングス リミテッド | 流体特性センサー |
| US6647778B2 (en) * | 2001-06-20 | 2003-11-18 | Integrated Sensing Systems | Integrated microtube sensing device |
| WO2004038354A2 (en) * | 2002-08-29 | 2004-05-06 | Bioscale, Inc. | Resonant sensor and sensing system |
| US6722209B1 (en) * | 2002-11-27 | 2004-04-20 | Industrial Technology Research Institute | Coriolis force type flow meter using optical interferometer |
| US7059176B2 (en) * | 2003-06-18 | 2006-06-13 | Integrated Sensing Systems, Inc. | Resonant tube viscosity sensing device |
| US7568399B2 (en) * | 2006-01-05 | 2009-08-04 | Integrated Sensing Systems, Inc. | Microfluidic device |
| EP1996899B1 (de) * | 2006-03-10 | 2014-09-17 | Continental Teves AG & Co. oHG | Drehratensensor mit kopplungsbalken |
| US8061201B2 (en) * | 2007-07-13 | 2011-11-22 | Georgia Tech Research Corporation | Readout method and electronic bandwidth control for a silicon in-plane tuning fork gyroscope |
| NL1034905C2 (nl) * | 2008-01-11 | 2009-07-14 | Berkin Bv | Stromingsmeetapparaat. |
-
2006
- 2006-06-21 DE DE102006029443A patent/DE102006029443B3/de not_active Expired - Fee Related
-
2007
- 2007-06-15 EP EP07765440A patent/EP2029974A1/de not_active Withdrawn
- 2007-06-15 US US12/306,012 patent/US7874219B2/en not_active Expired - Fee Related
- 2007-06-15 WO PCT/EP2007/055946 patent/WO2007147786A1/de not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2007147786A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006029443B3 (de) | 2008-01-31 |
| US20090272200A1 (en) | 2009-11-05 |
| US7874219B2 (en) | 2011-01-25 |
| WO2007147786A1 (de) | 2007-12-27 |
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