EP2022302A4 - Gestion de température de composants électroniques - Google Patents

Gestion de température de composants électroniques

Info

Publication number
EP2022302A4
EP2022302A4 EP06747851A EP06747851A EP2022302A4 EP 2022302 A4 EP2022302 A4 EP 2022302A4 EP 06747851 A EP06747851 A EP 06747851A EP 06747851 A EP06747851 A EP 06747851A EP 2022302 A4 EP2022302 A4 EP 2022302A4
Authority
EP
European Patent Office
Prior art keywords
electronic components
temperature managing
managing
temperature
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06747851A
Other languages
German (de)
English (en)
Other versions
EP2022302A1 (fr
Inventor
Torbjoern Nilsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of EP2022302A1 publication Critical patent/EP2022302A1/fr
Publication of EP2022302A4 publication Critical patent/EP2022302A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP06747851A 2006-06-02 2006-06-02 Gestion de température de composants électroniques Withdrawn EP2022302A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2006/000657 WO2007142558A1 (fr) 2006-06-02 2006-06-02 Gestion de température de composants électroniques

Publications (2)

Publication Number Publication Date
EP2022302A1 EP2022302A1 (fr) 2009-02-11
EP2022302A4 true EP2022302A4 (fr) 2010-07-21

Family

ID=38801705

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06747851A Withdrawn EP2022302A4 (fr) 2006-06-02 2006-06-02 Gestion de température de composants électroniques

Country Status (7)

Country Link
US (1) US20090283248A1 (fr)
EP (1) EP2022302A4 (fr)
JP (1) JP2009539246A (fr)
CN (1) CN101449637A (fr)
AU (1) AU2006344160A1 (fr)
MX (1) MX2008014702A (fr)
WO (1) WO2007142558A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010050868A1 (fr) * 2008-11-03 2010-05-06 Telefonaktiebolaget L M Ericsson (Publ) Système présent dans un nœud de réseau pour réguler la température d'un équipement électronique
CN105228421B (zh) * 2015-10-30 2018-01-23 江苏同盛环保技术有限公司 一种用于电子设备的微雾冷却装置
FR3075471B1 (fr) * 2017-12-14 2019-11-08 Valeo Systemes Thermiques Dispositif de regulation de temperature d'une batterie a l'aide d'un fluide dielectrique et pack-batterie comprenant un tel dispositif
EP3881388A1 (fr) * 2018-11-16 2021-09-22 Valeo Systemes Thermiques-THS Dispositif de régulation thermique d'un composant électronique
US10798851B1 (en) 2019-05-24 2020-10-06 L3 Technologies, Inc. Systems and methods for implementing intelligent cooling interface archiectures for cooling systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328134A (ja) * 1986-07-21 1988-02-05 Nec Corp 空冷型送信装置
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
JPH11231944A (ja) * 1998-02-10 1999-08-27 Komatsu Ltd 温度制御装置
JP2001051012A (ja) * 1999-08-16 2001-02-23 Nec Corp 半導体試験システムおよび試験温度安定制御方法
JP4087190B2 (ja) * 2002-02-12 2008-05-21 古河電気工業株式会社 光学装置、光学装置の起動方法及び駆動方法、並びに光通信機器
US6880350B2 (en) * 2002-09-13 2005-04-19 Isothermal Systems Research, Inc. Dynamic spray system
US6976528B1 (en) * 2003-02-18 2005-12-20 Isothermal Systems Research, Inc. Spray cooling system for extreme environments
US6995980B2 (en) * 2003-08-21 2006-02-07 Unisys Corporation Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module
US7043933B1 (en) * 2003-08-26 2006-05-16 Isothermal Systems Research, Inc. Spray coolant reservoir system
JP4451399B2 (ja) * 2006-01-16 2010-04-14 株式会社ソニー・コンピュータエンタテインメント 電子デバイスの冷却制御のためのプログラムを格納した記録媒体、電子デバイス冷却装置および電子デバイス冷却方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2007142558A1 *

Also Published As

Publication number Publication date
US20090283248A1 (en) 2009-11-19
MX2008014702A (es) 2008-12-01
CN101449637A (zh) 2009-06-03
JP2009539246A (ja) 2009-11-12
WO2007142558A1 (fr) 2007-12-13
EP2022302A1 (fr) 2009-02-11
AU2006344160A1 (en) 2007-12-13

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Legal Events

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