AU2006344160A1 - Temperature managing for electronic components - Google Patents
Temperature managing for electronic components Download PDFInfo
- Publication number
- AU2006344160A1 AU2006344160A1 AU2006344160A AU2006344160A AU2006344160A1 AU 2006344160 A1 AU2006344160 A1 AU 2006344160A1 AU 2006344160 A AU2006344160 A AU 2006344160A AU 2006344160 A AU2006344160 A AU 2006344160A AU 2006344160 A1 AU2006344160 A1 AU 2006344160A1
- Authority
- AU
- Australia
- Prior art keywords
- liquid
- tempering
- operatively
- spraying
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000007788 liquid Substances 0.000 claims description 159
- 238000005496 tempering Methods 0.000 claims description 123
- 239000007921 spray Substances 0.000 claims description 110
- 238000001816 cooling Methods 0.000 claims description 73
- 238000005507 spraying Methods 0.000 claims description 63
- 238000010438 heat treatment Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 24
- 239000003595 mist Substances 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 description 21
- 239000002826 coolant Substances 0.000 description 5
- 238000007667 floating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011874 heated mixture Substances 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZJIJAJXFLBMLCK-UHFFFAOYSA-N perfluorohexane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F ZJIJAJXFLBMLCK-UHFFFAOYSA-N 0.000 description 2
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229960004624 perflexane Drugs 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
WO 2007/142558 PCT/SE2006/000657 1 TITLE Temperature Managing for Electronic Components 5 TECHNICAL FIELD The present invention relates in general to a spray tempering arrangement capable of both cooling and heating electronic components. 10 BACKGROUND OF THE INVENTION Today liquid cooling is well known in the art of cooling electronics. As air cooling systems continue to be pushed to new performance levels, so has their cost, complexity, and 15 weight. Liquid cooing is replacing air cooling and enables the performance of electronics to grow exponentially. A preferred method of liquid cooling is the so-called two-phase cooling. A two-phase cooling occurs when the coolant changes from one phase to another, e.g. from liquid to 20 vapor. Due to the increased energy required for a phase change, two-phase cooling systems often offers the ability to provide more compact and higher performance cooling systems than single-phase systems. As a contrast, a single-phase cooling occurs when the coolant remains in the same phase during the whole cooling process, e.g. remains liquefied or vaporized during the whole cooling process. 25 An exemplary two-phase cooling method is spray cooling. Common spray cooling system uses at least one pump for supplying fluid to at least one nozzle that transforms the fluid into droplets. These droplets impinge on the surface of the component to be cooled so as to typically create a thin liquid film. Energy is transferred from the surface of the 30 component to the thin liquid film as the liquid evaporates. Since the fluid may be dispensed at or near its saturation point, the absorbed heat causes the thin film to turn to vapor. This vapor is then condensed, often by means of a heat exchanger, or condenser, and returned to a reservoir and/or the pump. 35 However, even if the cooling ability of a spray cooling system may be satisfactory the opposite problem is not approached. Today there is a problem to get electronics to start, or start properly, in low temperatures. This may e.g. be the case during power up in winter conditions or on high altitudes. In addition, an operative electronic component may also be WO 2007/142558 PCT/SE2006/000657 2 exposed to environment temperatures and/or operative conditions that lower the working temperature of the operative component to an unsatisfactory level. However, some alternatives exist to deal with low temperature in electronic components: 5 - Foil or resistors or other type of electrical heaters can be arranged close to the electronic components. However this requires a certain amount of volume, extra cabling and it has to be designed into the system from the start. In addition, the trend is dense packaging of the electronic components, not to insert a number of extra components. 10 - Heated air can be arranged to flow around the electronics. However, this requires extra volume for air channels, fan and heater. It will also add extra weight to the system. - Heated liquid can be arranged to flow in radiators or convectors near the electronics. However, this requires extra volume for piping, radiators/convectors and pump. It will also add extra weight to the system. 15 - The electronic components can be selected from components that are specified for particularly low temperatures. However, this is only possible to a certain degree, e.g. depending on the limited availability of such components with the required functions. The components are also costly and rarer than normal components. 20 Hence there is a need for an improved temperature managing arrangement which utilizes the advantages of a two-phase cooling method or at least a single-phase cooling method for cooling electronic components, which arrangement avoids at least one of the disadvantages associated with starting and/or operating electronic components in low temperatures as mentioned above. 25 SUMMARY OF THE INVENTION The present invention represents an improvement compared to prior art by providing a 30 spray tempering arrangement capable of both heating and cooling electronic components. This is achieved by a temperature managing arrangement comprising a reservoir arranged to operatively accumulate a tempering liquid, a pressurizing device arranged to operatively pressurise the tempering liquid and at least one spray module arranged to operatively 35 receive the pressurized liquid and which comprises at least one spraying device, e.g. a nozzle, arranged to operatively spray the liquid on at least one electronic component so as to create a thermal coupling between the sprayed liquid and the component. In addition, the temperature managing arrangement comprises a heat remover arranged to operatively cool the tempering liquid after spraying when thermal energy is to be removed from said WO 2007/142558 PCT/SE2006/000657 3 component (224). Here, the tempering liquid becomes at least one of a liquid, a vapor or a mist after spraying, e.g. due to sprinkling in the spraying device or heating by the electric component. Further, the tempering managing arrangement comprises a heating device arranged to operatively heat the tempering liquid before spraying when thermal energy is 5 to be provided to said component. Here, the tempering liquid is in liquid form before spraying. Regarding a removal of thermal energy it is preferred that the thermal energy is removed from said component according to a two-phase cooling. 10 The tempering liquid is preferably an electrically insulating fluid. The heating device is preferably arranged to operatively heat the tempering liquid to a temperature near or above the middle of the temperature range specified by the 15 manufacturer for the electronic component to be provided with thermal energy. Said at least one spraying device can be arranged to operatively spray the tempering liquid on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component to be heated or cooled by the liquid. 20 Said at least one spraying device can be arranged to operatively spray the tempering liquid on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards. 25 Said at least one spraying device can be arranged to operatively spray the tempering liquid on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic to be heated or cooled by the liquid. Said spray module can comprise at least two types of spraying devices, wherein a first 30 spraying device type is arranged to be operatively used when the temperature managing arrangement operates as a cooling arrangement and a second spraying device type is arranged to be operatively used when the temperature managing arrangement operates as a heating system. 35 In addition, the present invention represents an improvement compared to prior art by providing a method for temperature managing using said temperature managing arrangement, which method comprises the steps of accumulating a tempering liquid (242) in a reservoir (140, 240); pressurizing the tempering liquid (242) by means of a pressurizing device (110, 210); providing the pressurized liquid (242) to at least one spray WO 2007/142558 PCT/SE2006/000657 4 module (120, 220) comprising at least one spraying device (222) arranged to spray the liquid (242) on at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); cooling the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, by means of 5 a heat remover (130, 230) when thermal energy is to be removed from said component (224); and heating the tempering liquid (242) by means of a heating device (145, 245) before spraying, when thermal energy is to be provided to said component (224). The steps must not necessarily be performed in the above order. 10 According to the method, the tempering liquid is preferably heated to a temperature near or above the middle of the temperature range specified by the manufacturer for the electronic component to be provided with thermal energy. 15 According to the method, at least one spraying device is spraying the tempering liquid on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component to be heated or cooled by the liquid. According to the method, said at least one spraying device can spray the tempering liquid 20 on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards. According to the method, said at least one spraying device can spray the tempering liquid on a first electronic component in the form of a cooling flange or a cooling surface 25 thermally coupled to a second electronic to be heated or cooled by the liquid. Further advantages of the present invention and embodiments thereof will appear from the following detailed description of the invention. 30 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic illustration of a temperature managing arrangement in the form of an exemplifying spray tempering system 100 according to a first embodiment of 35 the present invention. Fig. 2 is a schematic illustration of a temperature managing arrangement in the form of an exemplifying spray tempering system 200 according to a second embodiment of the present invention.
WO 2007/142558 PCT/SE2006/000657 5 DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS 5 A FIRST EMBODIMENT Structural elements Fig. 1 is a schematic illustration of a closed loop two-phase spray tempering system 100 10 according to a first exemplifying embodiment of the present invention. The exemplifying spray tempering system 100 comprises a pump 110, a spray module 120, a heat remover 130 and a reservoir 140 provided with a heating device 145. The tempering system 100 also comprises a tube system 150 for connecting said components in a suitable manner, i.e. said reservoir 140 to said pressurizing device 110 and further to said spray module 15 120 and to said heat remover 130 and back again to said pressurizing device 110. The pump 110 is adapted to pressurize a suitable tempering liquid (not shown in Fig. 1). Preferably the pump 110 is powered by means of a direct-current motor for creating accurate and precise pressures and flow rates. However, the pump 110 can be powered by 20 other means, e.g. an alternating current motor, a hydraulic motor or any other suitable powering means. The pump 110 operates according to any suitable method for pressurizing the tempering liquid, e.g. according to a reciprocating method or a rotary method in connection with displacement pumping or dynamic pumping. 25 The spray module 120 is provided with at least one nozzle. Several spray modules 120 may be used within the spray tempering system 100 and each spray module may comprise a plurality of nozzles. The heat remover 130 may be a heat exchanger or some other suitable condensing means 30 adapted to operatively condense the mixture of liquid, mist (i.e. small droplets of the liquid floating through air or some other gas) and vapor (i.e. the gas state of the liquid) that is created within or in the vicinity of the spray module 120 during cooling. The reservoir 140 is adapted to accumulate the tempering liquid of the tempering system 35 100. The reservoir is illustrated as a separate unit in Fig. 1, being connected to the spray tempering system by the tube system 150. This indicates that the reservoir 140 is formed as a separate chamber of suitable size. However, in some embodiments a reservoir may be formed entirely by the tube system 150, i.e. the tubes alone may provide enough volume to form a suitable reservoir.
WO 2007/142558 PCT/SE2006/000657 6 The heating device 145 is preferably arranged in the liquid-filled part of the tempering system 100. As indicated in Fig. 1 it is particularly preferred that the heating device 145 is arranged in the reservoir 140 to operatively heat the tempering liquid therein. The heating 5 device 145 is preferably an immersion heater or similar arranged within the tempering liquid. However, other heat sources are clearly conceivable, e.g. a heat exchanger or even a microwave emitter. Function of and co-operation between the structural elements 10 In operation the tempering liquid is pressurized by the pump 110 and subsequently moved to a series of system components via the tube system 150. The tube system 150 is made of a material that is compatible with the tempering liquid. The material can be rigid or semi-rigid, or even flexible to allow for variable three dimensional configurations. 15 The spray module 120 in the spray tempering system 100 is arranged to operatively receive pressurized tempering liquid from the pump 110. The nozzle or nozzles of the spray module 120 is/are arranged to operatively spray the received tempering liquid onto at least one electronic component (not shown in Fig. 1). 20 When the electronic components are cooled by the spray module 120, a mixture of liquid, mist and vapor is created within or in the vicinity of the spray module 120. The liquid and the mist are essentially created by the spraying activity of the spray module 120, whereas the vapor is essentially created from the liquid being gasified by absorbing energy from the 25 hot components within or in the vicinity of the spray module 120. The resulting mixture of liquid, mist and vapor is received by the heat remover 130 via the tube system 150 of the spray tempering system 100. It is preferred that the heat remover 130 is arranged in the mixture filled and not the liquid filled part of the spray tempering 30 system 100. The heat remover 130 in Fig. 1 is illustrated as a separate unit connected to the spray tempering system 100 by the tube system 150. However, the heat remover 130 may alternatively be arranged in the spray module 120 or in the reservoir 140 or in any other suitable position in the mixture filled parts of the spray tempering system 100. 35 The condensed liquid is collected in the reservoir 140 from which the liquid is subsequently retrieved to be pressurized again by the pump 110.
WO 2007/142558 PCT/SE2006/000657 7 The spray-cooling function of the exemplifying spray tempering system 100 in Fig. 1 has been discussed above in some detail. The description will now proceed with a discussion of the spray-heating capability of the spray tempering system 100 in Fig. 1. 5 The heating capability of the spray tempering system 100 requires a heating device. Hence, an exemplifying heating device 145 arranged in the reservoir 140 is schematically illustrated in Fig. 1. It is particularly preferred that the heater 145 is arranged in the reservoir 140 for operatively heating the tempering liquid therein to a temperature within the temperature interval specified by the manufacturer of the electronic component (e.g. 10 specified by the manufacturer of an integrated circuit). For components with a specified temperature range of 0-70 0 C the tempering liquid could e.g. be heated to a temperature within the interval of 10-65 0 C or within the interval of 20-55 0 C, or more preferably to a temperature near the middle of the temperature range specified by the manufacturer. For components with a specified temperature range of e.g. 0-70 0 C this implies that the 15 tempering liquid may be heated to a temperature near 35 0 C. However, due to losses in the tube system 250 and in other components of the spray tempering system 100 it may be necessary to heat the tempering liquid even further, e.g. heated an additional 5-20*C. The heated tempering liquid in the reservoir 140 is moved by the pump 110 to the spray 20 module 120. The spray module 120 is arranged to operatively spray the received heated tempering liquid onto at least one electronic component (not shown in Fig. 1). The spraying is preferably accomplished by utilizing the same spraying means (e.g. the same nozzle) that is used for spray-cooling the electronic component as previously described. 25 When the electronic components are spray-heated by the spray module 120, a heated mixture of liquid and mist (i.e. small droplets floating through air or similar gas) is created by the spraying activity within the spray module 120. However, since the temperature of the electronic components are assumed to be below the temperature of the sprayed mixture there will be no energy transported from the components to the heated mixture 30 when the spray-heating capability of the system 100 is utilized. Consequently, there is no creation of vapor. Instead the heated mixture will be cooled by the electronic components in the spray module 120, at the same time as the mixture will assume a liquid state as it hits the components and objects in the spray module 120. 35 The liquefied mixture is received by the heat remover 130 and is then collected in the reservoir 140, wherein the liquid is heated and subsequently retrieved to be pressurized again by the pump 110. It should be added that the heat remover 130 may be idle or even turned off when the heating capability of the spray tempering system 100 is used, since there is substantially no mist or vapor to condensate when the spray-heating capability is WO 2007/142558 PCT/SE2006/000657 8 utilized. In other words, the liquefied mixture (i.e. the tempering liquid) is simply moved through the heat remover 130, or is alternatively bypassing the heat remover 130 as schematically illustrated by the bypass tube 151 in Fig. 1. 5 From the above it should be clear that the heated tempering liquid enables the spray tempering system 100 to heat the electronic components as well as cool the components as previously described. Heating of electronic components is particularly advantageous when the components are 10 powered up in cool environments, e.g. during power up in winter conditions or on high altitudes. A heating is also advantageous when an operative electronic component is exposed to environment temperatures and/or operational conditions that lower the working temperature of the component to an unsatisfactory level. On the whole, the heating ability of the spray tempering system 100 is generally advantageous whenever the 15 temperature of an electronic component falls below or is near the allowed lower working temperature specified by the manufacturer of the electronic component. A SECOND EMBODIMENT 20 Structural elements Fig. 2 is a schematic illustration of a closed loop two-phase spray tempering system 100 according to a second exemplifying embodiment of the present invention. The exemplifying spray tempering system 200 comprises a pump 210, a filter 215, a spray module 220, a 25 heat remover 230 and a reservoir 240. The tempering system 200 also comprises a tube system 250 for connecting said components in a suitable manner, i.e. said reservoir 240 to said pressurizing device 210 and further to said spray module 220 and to said heat remover 230, and back again to said pressurizing device 110. 30 The pump 210, the spray module 220, the heat remover 230, the reservoir 240 and the tube system 250 operates in the same or similar way as the corresponding components described above in connection with the first embodiment of the present invention. Hence, e.g. the pump 210 is arranged to pressurize a suitable tempering liquid 242 in the 35 same or similar way as described above in connection with the pump 110 in the first embodiment.
WO 2007/142558 PCT/SE2006/000657 9 Similarly, the spray module 220 is preferably provided with at least one nozzle. More than one spray module 220 may be used within the spray tempering system 200 and each spray module may comprise a plurality of nozzles. 5 In addition, the heat remover 230 may be a heat exchanger or some other suitable condensing means arranged to operatively condense the resulting mixture to a liquid. However, in the second embodiment the tempering liquid 242 is defined as being any well known electronic tempering liquids such as e.g. Fluorinert T M , which is the brand name for 10 the line of electronics coolant liquids sold commercially by 3M. This is an electrically insulating, inert perfluorocarbon fluid which is used in various cooling applications. Different molecular formulations are available with a variety of boiling points, allowing it to be used in "single phase" applications wherein it remains a fluid, or for "two-phase" applications wherein the liquid boils to remove additional heat via evaporative cooling. An 15 example of one of the formulations 3M uses would be for instance, FC-72, or perfluorohexane (C6F14) which is used for low temperature heat transfer applications due to its boiling point of 56 0 C. Fluorinert T M is often used in situations where air would not carry away enough heat, or where airflow is so restricted that some sort of forced pumping is required anyway. Generally it is preferred that the tempering liquid 242 is in liquid form 20 at the temperature when the electronic component is switched on. Function of and co-operation between the structural elements In operation the tempering liquid 242 is pressurized by the pump 210 so as to be moved 25 from the reservoir 240 via the tube system 250 through the filter 215 and into the spray module 220. Preferably the spray module 220 in the spray tempering system 200 comprises a substantially closed space - e.g. a substantially closed box - arranged to receive the 30 pressurized tempering liquid 242 from the pump 210. Internally the spray module 220 is arranged to operatively spray the received tempering liquid 242 onto at least one electronic component 224. The spraying is preferably accomplished by means of a nozzle arrangement 221 provided with at least one nozzle 222. The nozzle 222 is arranged so as to operatively direct a spray 223 of mist and/or droplets onto the electronic component 35 224 when the spray module 220 receives pressurized tempering liquid 242 from the pump 210. When the electronic component 224 is cooled by the spray 223 a mixture of liquid, mist (i.e. small droplets of the liquid floating through air or some other gas) and vapor (i.e. the WO 2007/142558 PCT/SE2006/000657 10 gas state of the liquid) is created within the spray module 220. The liquid and the mist are essentially created by the spraying activity of the nozzle 222, whereas the vapor is essentially created from the liquid being gasified by absorbing energy from the hot component 224. 5 The resulting mixture of liquid, mist and vapor is cooled by the heat remover 230 arranged in the spray module 220. The heat remover 230 in Fig. 2 is arranged at an upper end of the spray module 220 under the assumption that the vapor is rising within the module 220. Other positions are clearly conceivable to meet other distributions of the vapor within 10 the module 220. It is preferred that the heat remover 230 is a thermally conductive helix or some other thermally conductive structure through which a coolant can be circulated so as to condense the resulting mixture of liquid, mist and vapor to a liquid 242. However, other well known cooling arrangements are clearly conceivable. The circulation of the coolant in the heat remover 230 is illustrated by two opposite arrows at the top of Fig. 2. 15 The condensed liquid 242 flows downwards in the spray module 220 in Fig. 2 by means of gravity to a lower end of the module 220, from where it is collected in the reservoir 240 via a part of the tube system 250. The tempering liquid 242 is subsequently retrieved from the reservoir 240 to be pressurized again by the pump 210. 20 The spray-cooling function of the exemplifying spray tempering system 100 in Fig. 1 has now been discussed in some detail and the description proceeds with a discussion of the spray-heating capability of the spray tempering system 200 in Fig. 2. 25 The heating capability of the spray tempering system 200 in Fig. 2 requires a heating device, i.e. similar to the first embodiment discussed above with reference to Fig. 1. Hence, an exemplifying heating device 245 is schematically illustrated in Fig. 2. The heating device 245 is arranged in the reservoir 240 so as to operatively heat the tempering liquid 242 therein. It is preferred that the heating device 245 is an electrically 30 powered immersion heater or similar, even if other heat sources are conceivable. The electrical feeding of the heating device 245 is illustrated by two opposite arrows at the bottom of Fig. 2. The heated tempering liquid 242 in the reservoir 240 is moved by the pump 210 to the 35 spray module 220. The spray module 220 is arranged to operatively spray the received heated tempering liquid onto at least one electronic component 224. The spraying is preferably accomplished by utilizing the same spraying means (e.g. the same nozzle) that is used for spray-cooling the electronic component as previously described.
WO 2007/142558 PCT/SE2006/000657 11 When the electronic component 224 is heated by the spray 223 a heat mixture of liquid and mist (i.e. small droplets floating through air or similar gas) is created in the spray module 220. However, since the temperature of the electronic component 224 is assumed to be below the temperature of the heat mixture, there will be no thermal energy 5 transported from the component 224 to the mixture. Consequently, there is no creation of vapor. Instead the heat mixture will be cooled by the electronic component 224 in the spray module 220, at the same time as the mixture will assume a liquid state as it hits the cold component 224 and other objects in the spray module 220. 10 The liquefied mixture is received by the heat remover 230 and then collected in the reservoir 240, wherein the liquid 242 is re-heated. In general it is preferred that the tempering liquid 242 is heated to a temperature that ensures to a suitable working temperature specified by the manufacturer of the electronic component 224 to be heated. However, as already mentioned above, due to losses in the tube system 250 and in other 15 components of the spray tempering system 200 it may be necessary to heat the tempering liquid 242 even further, e.g. heated an additional 5-20 0 C. From the above it should be clear that the heated tempering liquid enables the spray tempering system 200 to heat the electronic component 224 as well as cool the 20 component 224 as previously described. It should be added that the invention is by no means limited to one or several single electronic components 242. On the contrary, the electronic component may be a full circuit board comprising a plurality of different electronic and non-electronic components. The 25 electronic component may even be a rack provided with a plurality of such circuit boards comprising a plurality of different electronic and non-electronic components. A spray cooling system designed to operate on circuit boards in a rack is described in e.g. the patent US 5,718,117 granted to McDunn et. al. However, the McDunn patent does not provide for a heating capability and in particularly not a heating capability that is 30 integrated in the spray cooling system as in the present invention. Furthermore, even if the spray tempering system 200 in Fig. 2 has been illustrated with a single nozzle 222 this does not prevent other embodiment from utilizing two or several different nozzle types. A first nozzle type may e.g. be adapted to be used when the 35 tempering system operates as a cooling system and a second nozzle type may be adapted to be used when the system operates as a heating system. Moreover, even if the nozzle 222 in the spray module 220 delivers the spray 223 directly onto the electronic component 224 is should be emphasised that the spray may be WO 2007/142558 PCT/SE2006/000657 12 delivered to a cooling flange or some other cooling surface or cooling arrangement that is thermally coupled to the electronic component in question, i.e. the spray is delivered directly to the cooling arrangement and possibly indirectly to the electronic component to be cooled or heated. In that case, the cooling flange or other cooling surface or cooling 5 arrangement should be regarded as the "electronic component". The present invention has now been described with reference to exemplifying embodiments. However, the invention is not limited to the embodiments described. On the contrary, the full extent of the invention is determined by the scope of the appended 10 claims.
Claims (13)
1. A temperature managing arrangement (100, 200) comprising; - a reservoir (140, 240) arranged to operatively accumulate a tempering liquid 5 (242); - a pressurizing device (110, 210) arranged to operatively pressurise the tempering liquid (242); - at least one spray module (120, 220) arranged to operatively receive the pressurized liquid (242) and comprising at least one spraying device (222) 10 arranged to operatively spray the liquid (242) on at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); - a heat remover (130, 230) arranged to operatively cool the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, when 15 thermal energy is to be removed from said component (224); and wherein said tempering managing arrangement (100, 200) is further comprising a heating device (145, 245) arranged to operatively heat the tempering liquid (242) before spraying when thermal energy is to be provided to said component (224). 20
2. A temperature managing arrangement (100, 200) according to claim 1 wherein thermal energy is to be removed from said component (224) according to a two-phase cooling.
3. A temperature managing arrangement (100, 200) according to claim 1-2 wherein the 25 tempering liquid (242) is an electrically insulating fluid.
4. A temperature managing arrangement (100, 200) according to claim 1-3 wherein the heating device (145, 245) is arranged to operatively heat the tempering liquid (242) to a temperature near or above the middle of the temperature range specified by the 30 manufacturer for the electronic component (224) to be provided with thermal energy.
5. A temperature managing arrangement (100, 200) according to claim 1-4 wherein said at least one spraying device (222) is arranged to operatively spray the tempering liquid (242) on a first electronic component in the form of a cooling flange or a cooling 35 surface thermally coupled to a second electronic component to be heated or cooled by the liquid (242).
6. A temperature managing arrangement (100, 200) according to claim 1-5 wherein said at least one spraying device (222) is arranged to operatively spray the tempering WO 2007/142558 PCT/SE2006/000657 14 liquid (242) on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards.
7. A temperature managing arrangement (100, 200) according to claim 1-6 wherein said 5 at least one spraying device (222) is arranged to operatively spray the tempering liquid (242) on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic to be heated or cooled by the liquid (242). 10
8. A temperature managing arrangement (100, 200) according to claim 1 wherein said spray module (120, 220) comprises at least two types of spraying devices (222), wherein a first spraying device type is arranged to be operatively used when the temperature managing arrangement (100, 200) operates as a cooling arrangement and a second spraying device type is arranged to be operatively used when the 15 temperature managing arrangement (100, 200) operates as a heating system.
9. A method for temperature managing, which method comprises the steps of: - accumulating a tempering liquid (242) in a reservoir (140, 240); - pressurizing the tempering liquid (242) by means of a pressurizing device (110, 20 210); - providing the pressurized liquid (242) to at least one spray module (120, 220) comprising at least one spraying device (222) arranged to spray the liquid (242) on at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); 25 - cooling the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, by means of a heat remover (130, 230) when thermal energy is to be removed from said component (224); - heating the tempering liquid (242) by means of a heating device (145, 245) before spraying, when thermal energy is to be provided to said component (224). 30
10. A method for temperature managing according to claim 9, wherein the tempering liquid (242) is heated to a temperature near or above the middle of the temperature range specified by the manufacturer for the electronic component (224) to be heated. 35
11. A method for temperature managing according to claim 9-10, wherein said at least one spraying device (222) is spraying the tempering liquid (242) on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic component to be heated or cooled by the liquid (242). WO 2007/142558 PCT/SE2006/000657 15
12. A method for temperature managing according to claim 9-11, wherein said at least one spraying device (222) is spraying the tempering liquid (242) on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards. 5
13. A method for temperature managing according to claim 9-12, wherein said at least one spraying device (222) is spraying the tempering liquid (242) on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic to be heated or cooled by the liquid (242). 10 WO 2007/142558 PCT/SE2006/000657 16 AMENDED CLAIMS [received by the International Bureau on 08 March 2007 (08.03.2007)] 1. A temperature managing arrangement (100, 200) comprising; - a reservoir (140, 240) arranged to operatively accumulate a tempering liquid 5 (242); - a pressurizing device (110, 210) arranged to operatively pressurise the tempering liquid (242); - at least one spray module (120, 220) arranged to operatively receive the pressurized liquid (242) and comprising at least one spraying device (222) 10 arranged to operatively spray the liquid (242) on at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); - a heat remover (130, 230) arranged to operatively cool the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, when 15 thermal energy is to be removed from said component (224); and wherein said tempering managing arrangement (100, 200) is further comprising a heating device (145, 245) arranged to operatively heat the tempering liquid (242) before spraying when thermal energy is to be provided to said component (224). 20 2. A temperature managing arrangement (100, 200) according to claim 1 wherein thermal energy is to be removed from said component (224) according to a two-phase cooling, 3. A temperature managing arrangement (100, 200) according to any of the claims 1-2 25 wherein the tempering liquid (242) is an electrically Insulating fluid. 4. A temperature managing arrangement (100, 200) according to any of the claims 1-3 wherein the heating device (145, 245) is arranged to operatively heat the tempering liquid (242) to a temperature near or above the middle of the temperature range 30 specified by the manufacturer for the electronic component (224) to be provided with thermal energy, 5, A temperature managing arrangement (100, 200) according to any of the claims 1-4 wherein said at least one spraying device (222) is arranged to operatively spray the 35 tempering liquid (242) on a first electronic component In the form of a cooling flange or a cooling surface thermally coupled to a second electronic component to be heated or cooled by the liquid (242). AMENDED SHEET (ARTICLE 19) WO 2007/142558 PCT/SE2006/000657 17 6. A temperature managing arrangement (100, 200) according to any of the claims 1-5 .:::wherein::-said:::at--leastr:one-..spraying::.device= .(2-22)=:is-.-arranged,.-to.--.operatively::.spray.: the- tempering liquid (242) on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards. 5 7. A temperature managing arrangement (100, 200) according to any of the claims 1-6 wherein said at least one spraying device (222) is arranged to operatively spray the tempering liquid (242) on a first electronic component In the form of a cooling flange or a cooling surface thermally coupled to a second electronic to be heated or cooled by 10 the liquid (242). 8. A temperature managing arrangement (100, 200) according to claim 1 wherein said spray module (120, 220) comprises at least two types of spraying devices (222), wherein a first spraying device type is arranged to be operatively used when the 15 temperature managing arrangement (100, 200) operates as a cooling arrangement and a second spraying device type is arranged to be operatively used when the temperature managing arrangement (100, 200) operates as a heating system. 9. A method for temperature managing, which method comprises the steps of: 20 - accumulating a tempering liquid (242) in a reservoir (140, 240); - pressurizing the tempering liquid (242) by means of a pressurizing device (110, 210); - providing the pressurized liquid (242) to at least one spray module (120, 220) comprising at least one spraying device (222) arranged to spray the liquid (242) on 25 at least one electronic component (224) so as to create a thermal coupling between the sprayed liquid (242) and the component (224); - cooling the tempering liquid (242), being in at least one of a liquid, a vapor or a mist form after spraying, by means of a heat remover (130, 230) when thermal energy is to be removed from said component (224); 30 - heating the tempering liquid (242) by means of a heating device (145, 245) before spraying, when thermal energy is to be provided to said component (224). 10, A method for temperature managing according to claim 9, wherein the tempering liquid (242) is heated to a temperature near or above the middle of the temperature 35 range specified by the manufacturer for the electronic component (224) to be heated. 11, A method for temperature managing according to any of the claims 9-10, wherein said at least one spraying device (222) is spraying the tempering liquid (242) on a first electronic component In the form of a cooling flange or a cooling surface AMENDED SHEET (ARTICLE 19) WO 2007/142558 PCT/SE2006/000657 18 thermally coupled to a second electronic component to be heated or cooled by the =:llquid.:(242).=: 12. A method for temperature managing according to any of the claims 9-11, wherein 5 said at least one spraying device (222) is spraying the tempering liquid (242) on an electronic component in the form of a circuit board, or a rack provided with a plurality of circuit boards, 13. A method for temperature managing according to any of the claims 9-12, wherein 10 said at least one spraying device (222) is spraying the tempering liquid (242) on a first electronic component in the form of a cooling flange or a cooling surface thermally coupled to a second electronic to be heated or cooled by the liquid (242). AMENDED SHEET (ARTICLE 19)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/SE2006/000657 WO2007142558A1 (en) | 2006-06-02 | 2006-06-02 | Temperature managing for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2006344160A1 true AU2006344160A1 (en) | 2007-12-13 |
Family
ID=38801705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2006344160A Abandoned AU2006344160A1 (en) | 2006-06-02 | 2006-06-02 | Temperature managing for electronic components |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090283248A1 (en) |
| EP (1) | EP2022302A4 (en) |
| JP (1) | JP2009539246A (en) |
| CN (1) | CN101449637A (en) |
| AU (1) | AU2006344160A1 (en) |
| MX (1) | MX2008014702A (en) |
| WO (1) | WO2007142558A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010050868A1 (en) * | 2008-11-03 | 2010-05-06 | Telefonaktiebolaget L M Ericsson (Publ) | A system in a network node for regulating temperature of electronic equipment |
| CN105228421B (en) * | 2015-10-30 | 2018-01-23 | 江苏同盛环保技术有限公司 | A kind of micro- fog cooling apparatus for electronic equipment |
| FR3075471B1 (en) | 2017-12-14 | 2019-11-08 | Valeo Systemes Thermiques | DEVICE FOR CONTROLLING THE TEMPERATURE OF A BATTERY USING A DIELECTRIC FLUID AND BATTERY PACK COMPRISING SUCH A DEVICE |
| WO2020099738A1 (en) * | 2018-11-16 | 2020-05-22 | Valeo Systemes Thermiques | Device for regulating the temperature of an electronic component |
| US10798851B1 (en) | 2019-05-24 | 2020-10-06 | L3 Technologies, Inc. | Systems and methods for implementing intelligent cooling interface archiectures for cooling systems |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6328134A (en) * | 1986-07-21 | 1988-02-05 | Nec Corp | Air cooling type transmitter |
| US5907473A (en) * | 1997-04-04 | 1999-05-25 | Raytheon Company | Environmentally isolated enclosure for electronic components |
| JPH11231944A (en) * | 1998-02-10 | 1999-08-27 | Komatsu Ltd | Temperature controller |
| JP2001051012A (en) * | 1999-08-16 | 2001-02-23 | Nec Corp | Semiconductor test system and test temperature stably control method |
| JP4087190B2 (en) * | 2002-02-12 | 2008-05-21 | 古河電気工業株式会社 | OPTICAL DEVICE, OPTICAL DEVICE START-UP METHOD AND DRIVE METHOD, AND OPTICAL COMMUNICATION DEVICE |
| US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
| US6976528B1 (en) * | 2003-02-18 | 2005-12-20 | Isothermal Systems Research, Inc. | Spray cooling system for extreme environments |
| US6995980B2 (en) * | 2003-08-21 | 2006-02-07 | Unisys Corporation | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
| US7043933B1 (en) * | 2003-08-26 | 2006-05-16 | Isothermal Systems Research, Inc. | Spray coolant reservoir system |
| JP4451399B2 (en) * | 2006-01-16 | 2010-04-14 | 株式会社ソニー・コンピュータエンタテインメント | Recording medium storing program for cooling control of electronic device, electronic device cooling apparatus, and electronic device cooling method |
-
2006
- 2006-06-02 US US12/302,618 patent/US20090283248A1/en not_active Abandoned
- 2006-06-02 MX MX2008014702A patent/MX2008014702A/en not_active Application Discontinuation
- 2006-06-02 JP JP2009513091A patent/JP2009539246A/en active Pending
- 2006-06-02 EP EP06747851A patent/EP2022302A4/en not_active Withdrawn
- 2006-06-02 AU AU2006344160A patent/AU2006344160A1/en not_active Abandoned
- 2006-06-02 CN CNA2006800548058A patent/CN101449637A/en active Pending
- 2006-06-02 WO PCT/SE2006/000657 patent/WO2007142558A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| EP2022302A4 (en) | 2010-07-21 |
| WO2007142558A1 (en) | 2007-12-13 |
| CN101449637A (en) | 2009-06-03 |
| EP2022302A1 (en) | 2009-02-11 |
| JP2009539246A (en) | 2009-11-12 |
| US20090283248A1 (en) | 2009-11-19 |
| MX2008014702A (en) | 2008-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1380799B1 (en) | Method and apparatus for cooling with coolant at a subambient pressure | |
| US11109517B2 (en) | Cooling electronic devices in a data center | |
| US7499278B2 (en) | Method and apparatus for dissipating heat from an electronic device | |
| KR101391344B1 (en) | Sub-cooling unit for cooling system and method | |
| US6657121B2 (en) | Thermal management system and method for electronics system | |
| EP2061296B1 (en) | Conduction cooled circuit board assembly | |
| US9009971B2 (en) | Wicking and coupling element(s) facilitating evaporative cooling of component(s) | |
| US8792238B2 (en) | Heat-dissipating module having loop-type vapor chamber | |
| US20150257303A1 (en) | Method of cooling multiple processors using series-connected heat sinks | |
| AU2006344160A1 (en) | Temperature managing for electronic components | |
| JP2009529237A (en) | System and method for cooling a server-based data center | |
| WO2008027931A2 (en) | Manifold for a two-phase cooling system | |
| JP7418572B2 (en) | Nozzle array and cooling module | |
| WO1997043887A1 (en) | Heat spreader system and method for cooling heat generating components | |
| WO2016069271A1 (en) | Method of absorbing heat with series-connected heat sink modules | |
| WO2016069299A1 (en) | Heat sink for use with pumped coolant | |
| US20060007657A1 (en) | Thermally enhanced pressure regulation of electronics cooling systems | |
| WO2006019767A1 (en) | Azeotrope spray cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4 | Application lapsed section 142(2)(d) - no continuation fee paid for the application |