CN101449637A - Temperature management of electronic components - Google Patents
Temperature management of electronic components Download PDFInfo
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- CN101449637A CN101449637A CNA2006800548058A CN200680054805A CN101449637A CN 101449637 A CN101449637 A CN 101449637A CN A2006800548058 A CNA2006800548058 A CN A2006800548058A CN 200680054805 A CN200680054805 A CN 200680054805A CN 101449637 A CN101449637 A CN 101449637A
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- liquid
- temperature adjustment
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- temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a temperature management device (100, 200), comprising: a liquid storage (240) arranged to store temperature regulating liquid (242); a pressurizing device (210) arranged to pressurize the temperature regulating liquid (242); at least one jetting module (220) arranged to receive the pressurized liquid (242) and having at least one jetting device (222) which is arranged to jet the liquid to at least one electronic component (224) to generate thermal coupling between the jetted liquid (242) and the component (224); a heat remover (230) arranged to operably cool the temperature regulating liquid (242) when taking heat away from the component (224), the temperature regulating liquid (242) being in the form of at least one of liquid, steam or smoke after being jetted; further comprising: a heating device (245) arranged to heat the temperature regulating liquid (242) before the temperature regulating liquid is jetted when supplying heat to the component (224). Furthermore, the invention provides a method using the temperature management device.
Description
Technical field
The present invention relates generally to the injection temperature equipment that can cool off and heat electronic unit.
Background technology
Now, liquid cools is well-known in the cool electronic field.Owing to constantly force air cooling system will reach new performance level, so the cost of air cooling system, complexity and weight are all very big.Liquid cools is replacing air cooling and is making the performance exponentially of electronic device increase.
The method for optimizing of liquid cools is so-called two-phase cooling.When the two-phase cooling comes across cooling agent from a phase change to another phase (for example changing to steam from liquid).Because comparing with single phase system, the increase of phase transformation institute energy requirement, two-phase cooling system often have the compact more more ability of high-performance cooling system that provides.By contrast, single-phase cooling comes across cooling agent and keep same phase during whole cooling procedure, for example keeps liquefaction or vaporization during whole cooling procedure.
Exemplary two-phase cooling method is to spray cooling.Thereby common spraying cooling system uses at least one pump to feed the flow at least one nozzle that fluid is converted to drop.These droplet impacts to the surface of parts to be cooled so that generally produce fluid film.Along with liquid evaporation, energy is transferred to fluid film from the surface of parts.Because fluid may be sent with its saturation point or near its saturation point, so the heat that is absorbed makes film be transformed into steam.This steam often is condensed by heat exchanger or condenser then, and gets back to liquid reservoir and/or pump.
Yet,, but also do not solve relative problem even the cooling capacity of spraying cooling system may be gratifying.Now, allow electronic device start at low temperatures or normally start also existing problems.This situation may for example occur under the situation in winter or the situation that powers up under the high height above sea level.In addition, the electronic unit of operation also may be exposed to ambient temperature and/or the operating condition that the working temperature that makes functional unit is reduced to unsafty level.
Yet, there is the low temperature of some alternatives with the reply electronic unit:
The electric heater of-foil or resistance or other type can be positioned adjacent to electronic unit.Yet this requires a certain amount of volume, extra cable, and it must be designed in the system from the beginning.In addition, trend is the intensive encapsulation of electronic unit rather than inserts many extra parts.
The air of-heating can be configured to flow around electronic device.Yet this requirement is used for the additional volumes of air flue, fan and heater.This also will increase extra weight to system.
-heated liquid can be provided near flowing in the radiator of electronic device or the convector.Yet this requirement is used for the additional volumes of pipeline, radiator/convector and pump.This also will increase extra weight to system.
-electronic unit can be selected from the parts that are given for special low temperature.Yet this only is possible to a certain extent, for example depends on the limited supply of the parts that this type of has required function.These parts are also very expensive and more rare more than conventional components.
Therefore, existence is to the demand of improved temperature treatment equipment, the advantage of this improved temperature treatment equipment utilization two-phase cooling method or single-phase at least cooling method is come cooling electronic components, at least one shortcoming that this equipment has been avoided under the low temperature as mentioned above starting and/or operation electronic component is associated.
Summary of the invention
By a kind of injection temperature equipment that can the heating and cooling electronic unit is provided, the present invention has represented the improvement than prior art.
This realizes that by a kind of temperature treatment equipment this equipment comprises: the liquid reservoir that is configured to operationally gather temperature adjustment liquid; The pressue device of described temperature adjustment liquid is configured to operationally to pressurize; And at least one jet module, described jet module is configured to operationally to receive the liquid after the pressurization and comprises at least one injection apparatus (for example nozzle), and this injection apparatus is configured to described liquid operationally is ejected at least one electronic unit so that produce thermal coupling between liquid that is sprayed and described parts.In addition, temperature treatment equipment also comprises heat remover, and this heat remover is configured to operationally cool off temperature adjustment liquid after spraying in the time will taking away heat energy from described parts (224).Here, this temperature adjustment liquid for example becomes at least a in liquid, steam or the smog owing to being sprayed in the injection apparatus or being heated by electronic unit after spraying.In addition, the temperature adjustment management equipment comprises heater, and this heater is configured to operationally heat described temperature adjustment liquid before spraying described temperature adjustment liquid when heat energy will be provided to described parts.Here, described temperature adjustment liquid was in liquid form before spraying.
About taking away heat energy, preferably cooling is taken away heat energy from described parts according to two-phase.
Described temperature adjustment liquid is electrical insulation fluids.
Described heater preferably be configured to described temperature adjustment liquid operationally be heated to by near the mid point of the temperature range of manufacturer's defined of the electronic unit that will be provided heat energy or on temperature.
Described at least one injection apparatus is configured to described temperature adjustment liquid operationally is ejected on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid heat or cooling.
Described at least one injection apparatus is configured to that described temperature adjustment liquid operationally is ejected into circuit board or is provided with on the electronic unit of frame form of a plurality of circuit boards.
Described at least one injection apparatus is configured to described temperature adjustment liquid operationally is ejected on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid heat or cooling.
Described jet module comprises at least two kinds of injection apparatus, when wherein first kind of injection apparatus is configured to operationally be used for temperature treatment equipment and operates as cooling device, and second kind of injection apparatus is configured to operationally be used for temperature treatment equipment when operating as heating system.
In addition, by a kind of method of utilizing described management equipment to carry out temperature treatment is provided, the present invention has represented the improvement than prior art.This method may further comprise the steps: gather temperature adjustment liquid (242) in liquid reservoir (140,240); By pressue device (110,210) pressurization described temperature adjustment liquid (242); Liquid (242) after the pressurization is provided at least one jet module (120,220), described jet module (120,220) comprise at least one injection apparatus (222), this injection apparatus (222) is configured to that described liquid (242) is ejected at least one electronic unit (224) and goes up so that produce thermal coupling between liquid that is sprayed (242) and described parts (224); In the time will taking away heat energy from described parts (224), by heat remover (130,230) cooling described temperature adjustment liquid (242), this temperature adjustment liquid (242) is at least a form in liquid, steam or the smog form after spraying; And when heat energy will be provided to described parts (224), spraying described temperature adjustment liquid (242) before by heater (145,245) heating described temperature adjustment liquid (242).
These steps needn't be carried out according to top order.
According to this method, preferably with described temperature adjustment liquid heat to by near the mid point of the temperature range of manufacturer's defined of the electronic unit that will be provided heat energy or on temperature.
According to this method, to first electronic unit of cooling flange or cooling surface form, described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid heat or cooling at least one injection apparatus with the described temperature adjustment liquid jet.
According to this method, described at least one injection apparatus with the described temperature adjustment liquid jet to circuit board or be provided with on the electronic unit of frame form of a plurality of circuit boards.
According to this method, to first electronic unit of cooling flange or cooling surface form, described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid heat or cooling to described at least one injection apparatus with the described temperature adjustment liquid jet.
Other advantage of the present invention and embodiment will display by the following detailed description of this invention.
Description of drawings
Fig. 1 is the schematic diagram according to the temperature treatment equipment of exemplary injection thermoregulating system 100 forms of the first embodiment of the present invention.
Fig. 2 is the schematic diagram of the temperature treatment equipment of exemplary injection thermoregulating system 200 forms according to a second embodiment of the present invention.
Embodiment
First embodiment
Structural detail
Fig. 1 is the schematic diagram that sprays thermoregulating system 100 according to the closed loop two-phase of first exemplary embodiment of the present invention.Exemplary injection thermoregulating system 100 comprises pump 110, jet module 120, heat remover 130 and the liquid reservoir 140 that has heater 145.Thermoregulating system 100 also comprises pipe-line system 150, be used for connecting in a suitable manner described parts, just described liquid reservoir 140 be connected to described pressue device 110, then link described jet module 120, described heat remover 130 and get back to described pressue device 110.
The function of structural detail and between co-operation
In operation, temperature adjustment liquid is transplanted on a series of system unit via pipe-line system 150 subsequently by pump 110 pressurizations.Pipe-line system 150 is by making with the material of temperature adjustment liquid receptive.This material can be for rigidity or semirigid, perhaps or even flexible to allow variable three-dimensional configuration.
Spray the pressurization temperature adjustment liquid that jet module 120 in the thermoregulating system 100 is configured to operationally to receive self-pumping 110.The temperature adjustment liquid that one or more nozzles of jet module 120 are configured to be received operationally is ejected at least one electronic unit (not being shown among Fig. 1).
When electronic unit is cooled off by jet module 120, in jet module 120 or near it, produce liquid, smog and steam mixture.Liquid and smog mainly are to be produced by the injection action of jet module 120, and steam mainly be by by absorb from the jet module 120 or near the liquid that gasifies of the energy of the thermal part it produce.
The liquid that obtains, smog and steam mixture are received by heat remover 130 via the pipe-line system 150 of spraying thermoregulating system 100.Preferred heat remover 130 is set at sprays being filled with mixture rather than being filled with in the element of liquid of thermoregulating system 100.Heat remover 130 is shown by pipe-line system 150 and is connected to the separate unit that sprays thermoregulating system 100 among Fig. 1.Yet heat remover 130 can be arranged in jet module 120 or the liquid reservoir 140 replacedly or be arranged on any other appropriate location in the element that is filled with mixture that sprays thermoregulating system 100.
Condensed liquid is collected in the liquid reservoir 140, fetches liquid so that pressurizeed once more by pump 110 from this liquid reservoir 140 subsequently.
Gone through the injection-refrigerating function of exemplary injection thermoregulating system 100 among Fig. 1 above.To carry out the discussion of the injection-heating efficiency of exemplary injection thermoregulating system 100 among Fig. 1 now.
The heating efficiency of spraying thermoregulating system 100 needs heater.Therefore, schematically illustrated the exemplary heater 145 that is arranged in the liquid reservoir 140 among Fig. 1.Especially preferredly be, heater 145 is set in the liquid reservoir 140, in order to the temperature in the temperature range that will temperature adjustment liquid wherein operationally be heated to electronic unit manufacturer defined manufacturer's defined of integrated circuit (for example by).For the set point of temperature scope is 0-70 ℃ parts, temperature adjustment liquid can for example be heated in the 10-65 ℃ of interval or 20-55 ℃ of interval in temperature, perhaps more preferably be heated to by near the temperature the mid point of the temperature range of manufacturer's defined.For the set point of temperature scope is 0-70 ℃ parts, this means that temperature adjustment liquid can be heated near the temperature 35 ℃.Yet, because in the pipe-line system 150 and spray loss in other parts of thermoregulating system 100, may be necessary be with the temperature adjustment liquid heat in addition higher, 5-20 ℃ of for example additional heating.
Temperature adjustment liquid in the liquid reservoir 140 after the heating is transplanted on jet module 120 by pump 110.Jet module 120 is set operationally is ejected at least one electronic unit (not being shown among Fig. 1) with the temperature adjustment liquid after the heating that will be received.This sprays preferably finishes with the identical injection apparatus that is used to spray cooling electronic components as previously mentioned (for example same nozzle) by utilizing.
When electronic unit when jet module 120 sprays heating, jet module 120 in, produce the mixture of liquid after heating and smog (that is, through air or similar gas and floating droplet) by injection action.Yet, because the temperature of supposition electronic unit is lower than the temperature of institute's spray mixture, so the mixture after when utilizing the injection heating efficiency of system 110, not having energy from these component feed to heating.Thereby, just can not produce steam yet.On the contrary, the mixture after the heating is the electronic unit in the injected module 120 cooling, in case mixture can present liquid state when mixture strikes on parts in the jet module 120 and the object simultaneously.
Liquified mixt is received by heat remover 130, then is collected in the liquid reservoir 140, and wherein liquid is heated and is retrieved subsequently so that pressurizeed once more by pump 110.What add is, when using the heating efficiency of spraying thermoregulating system 100 heat remover 130 can be idle or even turn off, reason is do not have smog or steam to want condensation basically when utilizing the injection heating efficiency.In other words, the mixture of liquefaction (that is, the temperature adjustment liquid) heat remover 130 of just passing through is perhaps alternatively walked around heat remover 130, shown in the bypass duct among Fig. 1 151.
According to the above, should be understood that the temperature adjustment liquid after the heating makes that spraying thermoregulating system 100 can heat electronic unit and cool off these parts, as previously described.
When powering up these parts (for example under the winter situation or power up under the high height above sea level) in cold environment, the heating of electronic unit is especially favourable.When the operability electronic unit was exposed to the working temperature that makes parts and is reduced to the ambient temperature of unsafty level and/or operating condition, heating also was favourable.Generally speaking, in the time of under the temperature of electronic unit drops to by the permission lower limit working temperature of manufacturer's defined of electronic unit or near it, the heating efficiency of spraying thermoregulating system 100 generally is favourable.
Second embodiment
Structural detail
Fig. 2 is the schematic diagram that sprays thermoregulating system 200 according to the closed loop two-phase of second exemplary embodiment of the present invention.Exemplary injection thermoregulating system 200 comprises pump 210, jet module 220, heat remover 230 and liquid reservoir 240.Thermoregulating system 200 comprises that also pipe-line system 250 is used for connecting in a suitable manner described parts, just described liquid reservoir 240 is connected to described pressue device 210, then links described jet module 220 and described heat remover 230 and get back to described pressue device 210.
Pump 210, jet module 220, heat remover 230, liquid reservoir 240 and pipe-line system 250 are to operate with the top identical or similar mode of describing about the first embodiment of the present invention of corresponding component.
Therefore, for example the temperature adjustment liquid 242 of pump 210 to pressurize suitable is set with the top identical or similar fashion of describing about the pump among first embodiment 110.
Similarly, jet module 220 preferably is provided with at least one nozzle.In spraying thermoregulating system 200, can use an above jet module 120 and each jet module can comprise a plurality of nozzles.
In addition, heat remover 130 can be that heat exchanger or some are configured to resultant mixture operationally is condensed into other suitable condensing unit of liquid.
Yet in a second embodiment, temperature adjustment liquid 242 is defined as any liquid of knowing that adjusts the temperature electronically (such as Fluorinert
TM, this is the brand name by the electronics coolant liquid of the commercial sale of 3M company).This is to be used for electric insulation, the inert perfluorocarbon fluid that various coolings are used.Different molecular formula has different boiling points, makes it can be used for " single-phase " and uses (the wherein phase of its maintenance fluid), or be used for " heterogeneous " application (thereby wherein liquid boiling removes extra heat via evaporative cooling).The example of one of molecular formula that 3M company uses can be for example FC-72 or perflexane (C
6F
14), perflexane (C
6F
14) owing to being 56 ℃, its boiling point is used for the low temperature heat transfer application.Fluorinert
TMBeing often used for air can not take away in the situation of a lot of heats or to be used for air-flow so limited so that need certain to force the situation of pumping in a word.Generally preferably, be in liquid form under the temperature of temperature adjustment liquid 242 when connecting electronic unit.
The function of structural detail and between co-operation
In operation, temperature adjustment liquid 242 is by pump 210 pressurizations, so that transfer process filter 215 and enter jet module 220 from liquid reservoir 240 via pipe-line system 150.
Preferably, the jet module 220 in the injection thermoregulating system 200 comprises the space (for example base closed box) of base closed, and it is configured to receive the pressurization temperature adjustment liquid 242 of self-pumping 210.In inside, the temperature adjustment liquid 242 that jet module 220 is configured to be received operationally is ejected at least one electronic unit 224.This injection is preferably finished by the injector arrangement 221 that has at least one nozzle 222.When nozzle 222 being set from pump 210, receiving pressurization temperature adjustment liquid 242 jet flow 223 of smog and/or drop is operationally guided on the electronic unit 224 with convenient jet module 220.
When electronic unit 224 during by jet flow 223 cooling, the mixture of generation liquid, smog jet module 220 in (that is, through air or some other gas and floating droplets of liquids) and steam (that is the gaseous state of liquid).Liquid and smog mainly are to be produced by the injection action of nozzle 222, and steam mainly is to be produced by the liquid that gasifies by the energy that absorbs from thermal part 224.
The liquid that obtains, smog and steam mixture are via heat remover 230 coolings that are arranged in the jet module 220.Heat remover 230 among Fig. 2 is set at the upper end of jet module 220, supposes that steam rises in module 220.Obviously can expect that other position is to satisfy steam other distribution in module 220.Preferably, heat remover 230 is heat conduction helix or some other conductive structures, through these conductive structures can circulating coolant so that liquid, smog and the steam mixture that obtains is condensed into liquid 242.Yet, obviously can expect the cooling device that other is known.The circulation of cooling agent in heat remover 230 illustrated by two relative arrows at Fig. 2 top.
In the jet module 220 of Fig. 2, condensed liquid 242 flows to the lower end of module 220 downwards by means of gravity, liquid is collected in the liquid reservoir 240 via section of tubing system 250 from this lower end.Fetch temperature adjustment liquid 242 so that pressurize once more from this liquid reservoir 240 subsequently by pump 210.
Gone through the injection-refrigerating function of exemplary injection thermoregulating system 100 among Fig. 1 above.To carry out the discussion of the injection-heating efficiency of exemplary injection thermoregulating system 200 among Fig. 2 now.
The heating efficiency of spraying thermoregulating system 200 among Fig. 2 needs heater, above promptly being similar to reference to first embodiment that Fig. 1 discussed.Therefore, schematically illustrated exemplary heater 245 among Fig. 2.Heater 245 is set in the liquid reservoir 240 so that heating temperature adjustment liquid 242 wherein operationally.Preferably, heater 245 is electronic immersion heater or analog, but can expect other thermal source.Two relative arrows that the electricity of heater 245 is supplied with by Fig. 2 bottom illustrate.
Temperature adjustment liquid 242 in the liquid reservoir 240 after the heating is transplanted on jet module 220 by pump 210.Jet module 220 is set operationally to be ejected at least one electronic unit 224 with the temperature adjustment liquid after the heating that will be received.This sprays preferably finishes with the identical injection apparatus that is used to spray cooling electronic components as previously mentioned (for example same nozzle) by utilizing.
When electronic unit 224 during, jet module 220 in, produce the mixture of liquid after heating and smog (that is, through air or similar gas and floating droplet) by jet flow 223 heating.Yet,, therefore do not have energy to be transported to mixture from parts 224 because the temperature of supposition electronic unit 224 is lower than the temperature of hot mixt.Thereby, just can not produce steam yet.On the contrary, hot mixt is the electronic unit in the injected module 220 224 cooling, in case mixture can present liquid state when mixture strikes low temperature parts 224 in the jet module 220 and other object simultaneously.
Liquified mixt is received by heat remover 230, then is collected in the liquid reservoir 240, and wherein liquid 242 is reheated.Usually, preferably temperature adjustment liquid 242 is heated to the temperature of guaranteeing to reach by the suitable working temperature of manufacturer's defined for the treatment of heated electronic unit 224.Yet, as above mentioned because in the pipe-line system 150 and spray loss in other parts of thermoregulating system 100, may be necessary be temperature adjustment liquid 242 to be heated to even higher, for example heating is additional 5-20 ℃.
According to the above, should be understood that the temperature adjustment liquid after the heating makes that spraying thermoregulating system 200 can heat electronic unit 224 and cool off this parts 224, as previously described.
What add is that the present invention never is subject to one or several independent electronic unit 242.On the contrary, electronic unit can be the full circuit board that comprises a plurality of different electronic units and non-electronic unit.Electronic unit even can be to be provided with a plurality of this frames (rack) that comprise the circuit board of a plurality of different electronic units and non-electronic unit.In the United States Patent (USP) 5,718,117 of for example authorizing people such as McDunn, the spraying cooling system that moves on the circuit board that is designed in frame has been described.Yet the patent of McDunn does not provide heating efficiency, does not especially provide as the present invention and is integrated in heating efficiency in the spraying cooling system.
In addition, even injection thermoregulating system 200 figure among Fig. 2 are shown with single-nozzle 222, but this does not hinder other embodiment to utilize two or some different bleed types.First kind of nozzle can for example be suitable for being used in thermoregulating system when operating as cooling system, and second kind of nozzle can be suitable for being used in thermoregulating system when operating as heating system.
And, even the nozzle 222 in the jet module 220 is directly delivered to jet flow 223 on the electronic unit 224, but what should emphasize is that this jet flow can be sent to the cooling flange or certain is thermally coupled in other cooling surface or the cooling device of described electronic unit, and promptly this jet flow is directly delivered to cooling device and may be delivered to electronic unit to be cooled or heating indirectly.Under the sort of situation, cooling flange or other cooling surface or cooling device should be taken as " electronic unit ".
With reference to exemplary embodiment the present invention has been described now.Yet this invention is not subject to described embodiment.On the contrary, the full breadth of this invention is determined by the scope of claims.
Claims (according to the modification of the 19th of treaty)
1. a temperature treatment equipment (100,200) comprising:
Liquid reservoir (140,240), described liquid reservoir are configured to operationally gather temperature adjustment liquid (242);
Pressue device (110,210), the described pressue device described temperature adjustment liquid (242) that is configured to operationally pressurize;
At least one jet module (120,220), described at least one jet module is configured to operationally to receive the liquid (242) after the pressurization and comprises at least one injection apparatus (222), and this injection apparatus (222) is configured to that described liquid (242) operationally is ejected at least one electronic unit (224) and goes up so that produce thermal coupling between liquid that is sprayed (242) and described parts (224);
Heat remover (130,230), described heat remover is configured to operationally cool off described temperature adjustment liquid (242) in the time will taking away heat energy from described parts (224), this temperature adjustment liquid (242) is at least a form in liquid, steam or the smog form after spraying; And
Wherein said temperature adjustment management equipment (100,200) further comprise heater (145,245), this heater (145,245) is configured to operationally heat described temperature adjustment liquid (242) before at the described temperature adjustment liquid of injection (242) when heat energy will be provided to described parts (224).
2. temperature treatment equipment according to claim 1 (100,200), wherein cooling is taken away heat energy from described parts (224) according to two-phase.
3. according to each described temperature treatment equipment (100,200) among the claim 1-2, wherein said temperature adjustment liquid (242) is electrical insulation fluids.
4. according to each described temperature treatment equipment (100 among the claim 1-3,200), wherein said heater (145,245) be configured to described temperature adjustment liquid (242) operationally be heated to by near the mid point of the temperature range of manufacturer's defined of the electronic unit that will be provided heat energy (224) or on temperature.
5. according to each described temperature treatment equipment (100 among the claim 1-4,200), wherein said at least one injection apparatus (222) is configured to described temperature adjustment liquid (242) operationally is ejected into on first electronic unit that cools off flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
6. according to each described temperature treatment equipment (100 among the claim 1-5,200), wherein said at least one injection apparatus (222) is configured to operationally be ejected into described temperature adjustment liquid (242) with circuit board or be provided with on the electronic unit of frame form of a plurality of circuit boards.
7. according to each described temperature treatment equipment (100 among the claim 1-6,200), wherein said at least one injection apparatus (222) is configured to described temperature adjustment liquid (242) operationally is ejected on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
8. according to each described temperature treatment equipment (100 in the claim 1,200), wherein said jet module (120,220) comprise at least two kinds of injection apparatus (222), wherein first kind of injection apparatus is configured to when temperature treatment equipment (100, operationally used when 200) operating, and second kind of injection apparatus is configured to operationally be used when temperature treatment equipment (100,200) is operated as heating system as cooling device.
9. method for managing temperature said method comprising the steps of:
In liquid reservoir (140,240), gather temperature adjustment liquid (242);
By pressue device (110,210) pressurization described temperature adjustment liquid (242);
Liquid (242) after the pressurization is provided at least one jet module (120,220), described jet module (120,220) comprise at least one injection apparatus (222), this injection apparatus (222) is configured to that described liquid (242) is ejected at least one electronic unit (224) and goes up so that produce thermal coupling between liquid that is sprayed (242) and described parts (224);
In the time will taking away heat energy from described parts (224), by heat remover (130,230) cooling described temperature adjustment liquid (242), this temperature adjustment liquid (242) is at least a form in liquid, steam or the smog form after spraying;
When heat energy will be provided to described parts (224), spraying described temperature adjustment liquid (242) before by heater (145,245) heating described temperature adjustment liquid (242).
10. method for managing temperature according to claim 9, wherein described temperature adjustment liquid (242) is heated to by near the mid point of the temperature range of manufacturer's defined of wanting heated electronic unit (224) or on temperature.
11. according to each described method for managing temperature among the claim 9-10, wherein said at least one injection apparatus (222) is ejected into described temperature adjustment liquid (242) on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
12. according to each described method for managing temperature among the claim 9-11, wherein said at least one injection apparatus (222) is ejected into circuit board with described temperature adjustment liquid (242) or is provided with on the electronic unit of frame form of a plurality of circuit boards.
13. according to each described method for managing temperature among the claim 9-12, wherein said at least one injection apparatus (222) is ejected into described temperature adjustment liquid (242) on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
Claims (13)
1. a temperature treatment equipment (100,200) comprising:
Liquid reservoir (140,240), described liquid reservoir are configured to operationally gather temperature adjustment liquid (242);
Pressue device (110,210), the described pressue device described temperature adjustment liquid (242) that is configured to operationally pressurize;
At least one jet module (120,220), described at least one jet module is configured to operationally to receive the liquid (242) after the pressurization and comprises at least one injection apparatus (222), and this injection apparatus (222) is configured to that described liquid (242) operationally is ejected at least one electronic unit (224) and goes up so that produce thermal coupling between liquid that is sprayed (242) and described parts (224);
Heat remover (130,230), described heat remover is configured to operationally cool off described temperature adjustment liquid (242) in the time will taking away heat energy from described parts (224), this temperature adjustment liquid (242) is at least a form in liquid, steam or the smog form after spraying; And
Wherein said temperature adjustment management equipment (100,200) further comprise heater (145,245), this heater (145,245) is configured to operationally heat described temperature adjustment liquid (242) before at the described temperature adjustment liquid of injection (242) when heat energy will be provided to described parts (224).
2. temperature treatment equipment according to claim 1 (100,200), wherein cooling is taken away heat energy from described parts (224) according to two-phase.
3. according to the described temperature treatment equipment of claim 1-2 (100,200), wherein said temperature adjustment liquid (242) is electrical insulation fluids.
4. according to the described temperature treatment equipment (100 of claim 1-3,200), wherein said heater (145,245) be configured to described temperature adjustment liquid (242) operationally be heated to by near the mid point of the temperature range of manufacturer's defined of the electronic unit that will be provided heat energy (224) or on temperature.
5. according to the described temperature treatment equipment (100 of claim 1-4,200), wherein said at least one injection apparatus (222) is configured to described temperature adjustment liquid (242) operationally is ejected on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
6. according to the described temperature treatment equipment (100 of claim 1-5,200), wherein said at least one injection apparatus (222) is configured to that described temperature adjustment liquid (242) operationally is ejected into circuit board or is provided with on the electronic unit of frame form of a plurality of circuit boards.
7. according to the described temperature treatment equipment (100 of claim 1-6,200), wherein said at least one injection apparatus (222) is configured to described temperature adjustment liquid (242) operationally is ejected on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
8. temperature treatment equipment (100 according to claim 1,200), wherein said jet module (120,220) comprise at least two kinds of injection apparatus (222), wherein first kind of injection apparatus is configured to when temperature treatment equipment (100, operationally used when 200) operating, and second kind of injection apparatus is configured to operationally be used when temperature treatment equipment (100,200) is operated as heating system as cooling device.
9. method for managing temperature said method comprising the steps of:
In liquid reservoir (140,240), gather temperature adjustment liquid (242);
By pressue device (110,210) pressurization described temperature adjustment liquid (242);
Liquid (242) after the pressurization is provided at least one jet module (120,220), described jet module (120,220) comprise at least one injection apparatus (222), this injection apparatus (222) is configured to that described liquid (242) is ejected at least one electronic unit (224) and goes up so that produce thermal coupling between liquid that is sprayed (242) and described parts (224);
In the time will taking away heat energy from described parts (224), by heat remover (130,230) cooling described temperature adjustment liquid (242), this temperature adjustment liquid (242) is at least a form in liquid, steam or the smog form after spraying;
When heat energy will be provided to described parts (224), spraying described temperature adjustment liquid (242) before by heater (145,245) heating described temperature adjustment liquid (242).
10. method for managing temperature according to claim 9, wherein described temperature adjustment liquid (242) is heated to by near the mid point of the temperature range of manufacturer's defined of wanting heated electronic unit (224) or on temperature.
11. according to the described method for managing temperature of claim 9-10, wherein said at least one injection apparatus (222) is ejected into described temperature adjustment liquid (242) on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
12. according to the described method for managing temperature of claim 9-11, wherein said at least one injection apparatus (222) is ejected into circuit board with described temperature adjustment liquid (242) or is provided with on the electronic unit of frame form of a plurality of circuit boards.
13. according to the described method for managing temperature of claim 9-12, wherein said at least one injection apparatus (222) is ejected into described temperature adjustment liquid (242) on first electronic unit of cooling flange or cooling surface form, and described cooling flange or cooling surface are thermally coupled to second electronic unit for the treatment of by described liquid (242) heating or cooling.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/SE2006/000657 WO2007142558A1 (en) | 2006-06-02 | 2006-06-02 | Temperature managing for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101449637A true CN101449637A (en) | 2009-06-03 |
Family
ID=38801705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800548058A Pending CN101449637A (en) | 2006-06-02 | 2006-06-02 | Temperature management of electronic components |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090283248A1 (en) |
| EP (1) | EP2022302A4 (en) |
| JP (1) | JP2009539246A (en) |
| CN (1) | CN101449637A (en) |
| AU (1) | AU2006344160A1 (en) |
| MX (1) | MX2008014702A (en) |
| WO (1) | WO2007142558A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228421A (en) * | 2015-10-30 | 2016-01-06 | 江苏同盛环保技术有限公司 | A kind of micro-fog cooling apparatus for electronic equipment |
| CN111602022A (en) * | 2017-12-14 | 2020-08-28 | 法雷奥热系统公司 | Device for regulating the temperature of a battery using a dielectric fluid and battery comprising such a device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010050868A1 (en) * | 2008-11-03 | 2010-05-06 | Telefonaktiebolaget L M Ericsson (Publ) | A system in a network node for regulating temperature of electronic equipment |
| WO2020099738A1 (en) * | 2018-11-16 | 2020-05-22 | Valeo Systemes Thermiques | Device for regulating the temperature of an electronic component |
| US10798851B1 (en) | 2019-05-24 | 2020-10-06 | L3 Technologies, Inc. | Systems and methods for implementing intelligent cooling interface archiectures for cooling systems |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6328134A (en) * | 1986-07-21 | 1988-02-05 | Nec Corp | Air cooling type transmitter |
| US5907473A (en) * | 1997-04-04 | 1999-05-25 | Raytheon Company | Environmentally isolated enclosure for electronic components |
| JPH11231944A (en) * | 1998-02-10 | 1999-08-27 | Komatsu Ltd | Temperature controller |
| JP2001051012A (en) * | 1999-08-16 | 2001-02-23 | Nec Corp | Semiconductor test system and test temperature stably control method |
| JP4087190B2 (en) * | 2002-02-12 | 2008-05-21 | 古河電気工業株式会社 | OPTICAL DEVICE, OPTICAL DEVICE START-UP METHOD AND DRIVE METHOD, AND OPTICAL COMMUNICATION DEVICE |
| US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
| US6976528B1 (en) * | 2003-02-18 | 2005-12-20 | Isothermal Systems Research, Inc. | Spray cooling system for extreme environments |
| US6995980B2 (en) * | 2003-08-21 | 2006-02-07 | Unisys Corporation | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module |
| US7043933B1 (en) * | 2003-08-26 | 2006-05-16 | Isothermal Systems Research, Inc. | Spray coolant reservoir system |
| JP4451399B2 (en) * | 2006-01-16 | 2010-04-14 | 株式会社ソニー・コンピュータエンタテインメント | Recording medium storing program for cooling control of electronic device, electronic device cooling apparatus, and electronic device cooling method |
-
2006
- 2006-06-02 US US12/302,618 patent/US20090283248A1/en not_active Abandoned
- 2006-06-02 MX MX2008014702A patent/MX2008014702A/en not_active Application Discontinuation
- 2006-06-02 JP JP2009513091A patent/JP2009539246A/en active Pending
- 2006-06-02 EP EP06747851A patent/EP2022302A4/en not_active Withdrawn
- 2006-06-02 AU AU2006344160A patent/AU2006344160A1/en not_active Abandoned
- 2006-06-02 CN CNA2006800548058A patent/CN101449637A/en active Pending
- 2006-06-02 WO PCT/SE2006/000657 patent/WO2007142558A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228421A (en) * | 2015-10-30 | 2016-01-06 | 江苏同盛环保技术有限公司 | A kind of micro-fog cooling apparatus for electronic equipment |
| CN111602022A (en) * | 2017-12-14 | 2020-08-28 | 法雷奥热系统公司 | Device for regulating the temperature of a battery using a dielectric fluid and battery comprising such a device |
| US11575166B2 (en) | 2017-12-14 | 2023-02-07 | Valeo Systemes Thermiques | Device for regulating the temperature of a battery using a dielectric fluid, and battery pack comprising such a device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2022302A4 (en) | 2010-07-21 |
| WO2007142558A1 (en) | 2007-12-13 |
| AU2006344160A1 (en) | 2007-12-13 |
| EP2022302A1 (en) | 2009-02-11 |
| JP2009539246A (en) | 2009-11-12 |
| US20090283248A1 (en) | 2009-11-19 |
| MX2008014702A (en) | 2008-12-01 |
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