EP1977482A1 - Component part having an electrical printed circuit board - Google Patents
Component part having an electrical printed circuit boardInfo
- Publication number
- EP1977482A1 EP1977482A1 EP06841408A EP06841408A EP1977482A1 EP 1977482 A1 EP1977482 A1 EP 1977482A1 EP 06841408 A EP06841408 A EP 06841408A EP 06841408 A EP06841408 A EP 06841408A EP 1977482 A1 EP1977482 A1 EP 1977482A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- circuit board
- printed circuit
- leadframe
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 9
- 210000002105 tongue Anatomy 0.000 claims description 21
- 238000005476 soldering Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910016347 CuSn Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/112—Resilient sockets forked sockets having two legs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Definitions
- the present invention is concerned with a component having a flat electrical module, which has an electronic circuit and is electrically contacted with a leadframe.
- the subject matter of the present invention is also a method for assembling such a component.
- Such components with electrical printed circuit boards are used for example in vehicles as housing halves of actuators in the engine compartment, z. B. for throttle valves wherein the electronic circuit forms the driver electronics for the actuator.
- the electrical components are usually integrated into the housing of the actuators, where the drive of the actuator is located.
- the printed circuit board is arranged in the housing and then connected. The provided on the printed circuit board contact points are connected to other contacts, which by different
- soldering or bonding takes place.
- the manual soldering of the contacts is very complex and also has a high source of error in the durability of the solder joints.
- automated soldering reduces the risk of a defective contact point, the components in the engine compartment are exposed to increasingly higher temperatures, which can lead to a softening of the solder joints.
- thick wire bonding is used as a further connection technique. In this case, wires are pressed onto the contact points and, for example by means of
- the object of the present invention is therefore to provide a component with an electrical printed circuit board that can be easily installed and connected and ensures reliable, permanent contact.
- the object is achieved by a component of the type described above, projecting at the leadframe next to the printed circuit board first contact elements, which are connected to second contact elements on the printed circuit board pluggable via a resilient intermediate region, wherein the first and the second contact elements in pairs with each other are contacted, that cooperates in a spring-elastic clamping connection in each case at least one point and / or line-shaped contact region on the one contact element with a flat contact region on the other contact element.
- the advantage of the component according to the invention is that a permanent and reliable contact is ensured by the clamping connection with at least one point and / or line-shaped and a flat contact area. Due to the flexible intermediate area, the contact area is free from mechanical stress and allows easy mechanical contacting. In addition, the risk is minimized that are transmitted to the contact area movements, for example, by different
- connection of the printed circuit board assembly through the clamping connection can be made simple and inexpensive, for example, during the installation process of the mechanical parts in the housing of the component without special environmental conditions must be met here.
- the printed circuit board is connected to the leadframe via at least three contacts. Appropriately, an uninterrupted connection of the contact elements to housing connectors.
- the planar contact area is formed as a contact tab on the resilient intermediate region and the point and / or linear contact areas are formed by two contact tongues, which face with narrow sides that define a slot, wherein at least one of the contact tongues is resilient and the slot is elastically expanded by the inserted contact tab.
- the number of parts required is thereby reduced to a minimum.
- the Slot also results in a simple sequence of movements for the connection of the printed circuit board, which can be easily automated.
- the spring-elastic contact tongues ensure a permanent contact pressure of the jamming and thus a permanent contact.
- the slot has a widening at its open end in order to be able to more easily insert the contact lug into the slot.
- the widening has insertion slopes or fillets.
- a further expansion can be provided which is greater than the inside width of the slot at the point of the point and / or line-shaped contact region. This ensures that the electrical contact always takes place via the punctiform and / or linear contact areas and there are no undefined contact points between the two contact partners in the region of the slot bottom.
- one of the two contact tongues forms a straight, linear contact region and the other of the two contact tongues has on its slot flank a projection which forms a round or pointed, point contact region. This ensures that the contact tab always bears against the punctiform contact region of one side and is pressed against the linear contact region with the other side, so that defined contact points are present.
- the second contact element is formed as a flat band, which is attached at its first end to the printed circuit board, forms the resilient intermediate region and rotated at its second end by approximately 90 ° in the longitudinal direction and as a contact tab in the slot is introduced.
- the second contact element can be manufactured and assembled inexpensively.
- the attachment and electrical contact with the printed circuit board can for example take place in that the end is U-shaped and pushed onto the edge of the printed circuit board.
- the fixation can be done by soldering or Conductive bonding done. Since a flat band perpendicular to its plane is much easier to deform than parallel to its plane, a movement required for the connection of the second contact should also be perpendicular to the plane of the band.
- a tab is provided which can be inserted in the direction in a slot in which the band is the most easily deformable.
- a material for the band for example, a CuSn alloy is suitable, which can also be used for the first contact elements.
- the CuSn alloy can be used without surface treatment.
- only one contact area is tinned, z. B. the area of the contact tab.
- the resilient intermediate region describes at least one loop, so that the contact regions are clamped together without mechanical stress.
- the contact tab can be inserted into the slot without causing a tensile load on the connection at the attachment point of the flexible intermediate region on the printed circuit board.
- the second contact element can bridge different distances between the first and the second contact element.
- the resilient intermediate region is damped against vibration to prevent the intermediate region from transmitting motion to the contact regions and resonating phenomena occur when the resilient intermediate region would be excited by an external vibration, for example due to engine vibrations or an imbalance in a wheel of the vehicle, in the frequency of the natural vibration.
- an external vibration for example due to engine vibrations or an imbalance in a wheel of the vehicle, in the frequency of the natural vibration.
- the vibration damping can be done for example by elastomers.
- the contacted, electrically conductive edge region of the printed circuit board is arranged at a distance from the leadframe so that it can not lead to a short circuit, z. B. due to small metal chips, abrasion of carbon brushes of an electric motor or deposits that may occur over time.
- the distance can be generated, for example, by providing a bead in the leadframe in the region of the terminals of the printed circuit board.
- the distance can also be achieved in that the area of the leadframe on which the printed circuit board is mounted is raised in relation to the surrounding area and the printed circuit board projects beyond the elevation in the region of the terminals.
- the first contact elements are each formed as the contact tongues and the second contact elements as the contact tab with the resilient intermediate region.
- the contact tongues can thereby be produced together with the leadframe, which is a kind of lattice girder, which is usually at least partially surrounded by plastic.
- the leadframe preferably forms continuous electrical Connections between the first contact elements and the contacts of an externally provided on the component electrical connector, ie, the contacts of the contact element are integrally formed with the contacts of the connector to minimize the number of contact points.
- the second contact elements can be attached to the printed circuit board prior to installation in the component. The contacting of the first contact elements with the second contact elements takes place, for example, promptly or simultaneously with the attachment of the printed circuit board on the
- the leadframe holds the printed circuit board and further preferably is formed as a heat sink at least in the region of the printed circuit board.
- the printed circuit board is then connected to the leadframe in a heat-conducting manner.
- the printed circuit board is glued to the leadframe with an adhesive layer or a film adhesive on both sides, wherein the bond should have the best possible thermal conductivity.
- the adhesive layer can also be electrically conductive, so that the printed circuit board can be connected via the adhesive layer to a region of the leadframe which preferably represents the electrical ground. Even without electrical connection to the printed circuit board, the leadframe can shield the circuit from radiation.
- the invention also provides a method for assembling the previously described component.
- the electrical printed circuit board is mounted flat on the leadframe and the first contact elements are then connected or in the same operation with the second contact elements in pairs mechanically via a resilient intermediate region by a clamping connection.
- a simple assembly obtained by sticking the printed circuit board on the leadframe.
- the connection of the at least one point and / or line-shaped contact region on the one contact element with the flat contact region on the other contact element ensures a simple and reliable contacting, which is achieved by a simple mechanical insertion of the tab on the yielding intermediate region in the slot formed by two contact tongues takes place, the point and / or linear contact areas represent.
- the slot is thereby widened elastically by the inserted tab.
- Figure 1 is a schematic oblique view of a detail with a clamping connection in the open state.
- FIGS. 1 and 2 shows a section through a leadframe with a closed clamping connection according to FIGS. 1 and
- FIG. 3 shows a section through a leadframe according to FIG. 2 with an elevated printed circuit board assembly and a lateral support of the yielding region;
- Fig. 4 is a partial view of the contact tongue of
- FIG. 1 shows the detail of a leadframe 10 with a printed circuit board 12 arranged on the leadframe 10.
- the leadframe 10 is a metallic grid structure that is at least partially surrounded by plastic 11. This does not lead to delamination in areal regions of the lattice structure, for example due to different temperature expansions between the plastic 11 and the Metal mesh, holes can be provided in the lattice structure, especially in higher temperature areas, through which it comes to a better anchorage.
- the leadframe 10 has functionally different regions 10a, 10b, which are not electrically connected to each other.
- An area 10a for example, directly forms a contact 15 of a connector 13 for connection of the component in connection and thus has the function of a one-piece, continuous electrical conductor.
- Another area 10b is used to attach the printed circuit board 12, which may be, for example, a printed circuit board with electronic circuits thereon or a hybrid electronics in the form of a substrate ceramic with SMD components arranged thereon.
- This area serves as a support and has the function of heat dissipation (see below).
- the electronic circuit is sealed with the exception of the bottom with an insulating layer, for example by a paint-like coating.
- the leadframe 10 has a protruding first contact element 14 which is connected to a plug.
- Contact element 16 is attached to the printed circuit board 12 and is not yet in contact with the first contact element 14 in FIG. 1.
- the first contact element 14 has a point and / or line-shaped contact region (see also FIG. 4), which is formed by two contact tongues 18, 20, which face with narrow sides which delimit a slot 22 into which the second contact element 16 , which has a flat contact area, is insertable.
- Contact tongues 18, 20 is at least one resilient, so that the slot 22 can be elastically expanded.
- the slot 22 has at its open end a widening 24 in the form of two insertion bevels 26 in order to be able to more easily insert the second contact element 16 into the slot 22.
- a contact tongue 18 forms a linear contact region 25 and the other contact tongue 20 has its slot flank on a projection 27 which forms a round or pointed, selective contact area.
- the second contact element 16 is formed as a flat band, which at its first end 28 at the
- Printed circuit board 12 is fixed, forms a resilient intermediate region 30 and is rotated at its second end by approximately 90 ° in the longitudinal direction. This end is formed as a tab 32 which is insertable into the slot 22.
- the second contact element 16 has a U-shaped first end 28, which is pushed onto the printed circuit board 12 and attached to the printed circuit board 12 by conductively bonding or soldering (see Fig. 2).
- the tab 32 of the second contact element 16 is inserted into the slot 22 of the first contact element 14. This is done mechanically by automated pressing of the tab 32 with a predetermined path.
- the printed circuit board 12 is connected to the leadframe 10 with a corresponding number of contacts.
- the resilient intermediate region 30 describes a loop 34.
- the connection of the two contact elements 14, 16 relieved of tension forces.
- the second contact element 16 through the loop 34 is able to bridge different distances between the first contact element 14 and the second contact element 16.
- the conductive, resilient intermediate region 30 may be made of resilient material, for example.
- the edges 35 of the side which is first inserted into the slot 22 are sharp-edged and / or formed as a ridge.
- the contact areas of the first contact element are scratched, thereby eliminating any contamination present.
- the first contact element 14 and the second contact element 16 are made a CuSn alloy and only the area of the tab 32 is tinned. Should the metal be slightly corroded at the contact areas of the first contact tongue 18 and the second contact tongue 20, the corrosion layer is likewise eliminated by scratching by the sharp edges and / or ridges of the tab 32, thus ensuring that there is proper contact comes between the contact areas.
- a further expansion 33 is provided, which is larger than the clear width between the point and / or line-like contact regions 25, 27, which are arranged between the widening 24 and the further widening 33.
- the point- and / or line-like contact areas 25, 27 are also on the tab 32, if it is thicker at its lower edge and the slot 22 would otherwise open V-shaped without the further expansion and thus it to no defined Contact between the contact elements would come.
- the printed circuit board 12 is adhesively bonded to the leadframe 10, for example with an adhesive layer or a film adhesive on both sides.
- the leadframe 10 is arranged at least in the region in which the printed circuit board 12 is arranged on the leadframe 10 is formed as a cooling surface.
- the adhesive film 36 therefore has the best possible thermal conductivity.
- the surface of the leadframe 10, on which the printed circuit board 12 is arranged is connected to the electrical ground of the component. If the adhesive film 36 is electrically conductive, the ground contact between the printed circuit board 12 and the leadframe 10 can also be produced via the attachment.
- a bead 38 is provided at the location of the terminal of the second contact element 16. The distance is so sufficiently dimensioned that in this depression over time impurities, eg. As metal chips or abrasion of the carbon brushes of a arranged in the same housing actuator motor can accumulate without it can lead to a short circuit.
- recesses may also be arranged in the leadframe 10.
- the area of the leadframe 10 may also be arranged in the leadframe 10.
- Leadframes 10, on which the printed circuit board 12 is arranged may also be formed as a raised portion 40, wherein the printed circuit board 12 projects beyond the elevation 40 at the location at which the second contact elements 16 are connected (see FIG. 3).
- a support 42 is provided to limit the deformation of the intermediate portion 30 due to vibrations or shocks, so that the contact areas are protected against dynamic loads.
- An attenuation of the flexible intermediate region 30 can also be achieved, for example, by elastomers, which in a further embodiment can be provided on the flexible intermediate region 30.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006001876A DE102006001876A1 (en) | 2006-01-13 | 2006-01-13 | Component with an electrical printed circuit board |
PCT/EP2006/069813 WO2007082617A1 (en) | 2006-01-13 | 2006-12-18 | Component part having an electrical printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1977482A1 true EP1977482A1 (en) | 2008-10-08 |
EP1977482B1 EP1977482B1 (en) | 2009-07-08 |
Family
ID=37726768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06841408A Expired - Fee Related EP1977482B1 (en) | 2006-01-13 | 2006-12-18 | Component part having an electrical printed circuit board |
Country Status (4)
Country | Link |
---|---|
US (1) | US7806703B2 (en) |
EP (1) | EP1977482B1 (en) |
DE (2) | DE102006001876A1 (en) |
WO (1) | WO2007082617A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009055858A1 (en) * | 2009-11-26 | 2011-06-01 | Osram Gesellschaft mit beschränkter Haftung | Lighting device and method for building a lighting device |
EP2688101A1 (en) * | 2012-07-20 | 2014-01-22 | ABB Technology AG | Method for electrically connecting vertically positioned substrates |
TWI475183B (en) * | 2012-08-01 | 2015-03-01 | Asia Vital Components Co Ltd | Heat sink structure and method of manufacturing same |
JP5700026B2 (en) * | 2012-11-28 | 2015-04-15 | 株式会社デンソー | Terminal equipment for electrical equipment |
DE102013201899A1 (en) * | 2013-02-06 | 2014-08-07 | Phoenix Contact Gmbh & Co. Kg | Method for producing a leadframe |
DE102013216472A1 (en) * | 2013-08-20 | 2015-02-26 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Electrical contact arrangement for an electric motor and method of manufacture |
WO2016180394A1 (en) * | 2015-05-10 | 2016-11-17 | Hottinger Baldwin Messtechnik Gmbh | Plug-in connector structure for electronic printed circuit boards |
KR102601853B1 (en) * | 2016-11-30 | 2023-11-13 | 엘지디스플레이 주식회사 | Display device and image processing method thereof |
JP2019079641A (en) * | 2017-10-23 | 2019-05-23 | アイシン精機株式会社 | Electrical connection structure |
DE102019134584A1 (en) * | 2019-12-16 | 2021-06-17 | Phoenix Contact Gmbh & Co. Kg | CONTACT ELEMENT FOR CONTACTING ELECTROTECHNICAL COMPONENTS AND ELECTROTECHNICAL COMPONENTS |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2188497B (en) | 1986-03-27 | 1990-11-07 | Yazaki Corp | Connector |
ES2106530T3 (en) | 1993-06-09 | 1997-11-01 | United Technologies Automotive | HYBRID JUNCTION BOX. |
DE4416888C1 (en) | 1994-05-13 | 1995-06-01 | Neutrik Ag | Contact element for electrical plug connector |
JP3213794B2 (en) * | 1995-07-31 | 2001-10-02 | ローム株式会社 | Surface mount type electronic component and method of manufacturing the same |
US5548484A (en) | 1995-08-16 | 1996-08-20 | Itt Corporation | IC card-receiving host |
JP3233195B2 (en) * | 1996-07-02 | 2001-11-26 | 信越ポリマー株式会社 | Semiconductor element inspection socket |
US5878890A (en) * | 1997-09-30 | 1999-03-09 | Kaneko Denki Kabushiki Kaisha | Carrier tape |
DE10027125A1 (en) | 2000-05-31 | 2001-12-06 | Wabco Gmbh & Co Ohg | Electrical plug contact |
JP3602453B2 (en) | 2000-08-31 | 2004-12-15 | Necエレクトロニクス株式会社 | Semiconductor device |
DE10149574C2 (en) | 2001-10-08 | 2003-10-09 | Wolf Neumann-Henneberg | Lead frame with a knife holder contact |
DE202004006434U1 (en) | 2004-04-23 | 2004-07-15 | Tyco Electronics Amp Gmbh | Circuit with circuit board carrying conductive grid for use in industrial technology, typically in car manufacture, with electric components |
DE202004006998U1 (en) | 2004-05-03 | 2004-07-08 | Lumberg Connect Gmbh & Co. Kg | Electric contact structure for engaging conductive paths on circuit boards, metallised plastics contours of moulded interconnect device (mid) type, contact blades, etc. containing sliding contacts, e.g. forked spring contacts |
JP4506456B2 (en) * | 2004-12-24 | 2010-07-21 | 住友電装株式会社 | Board terminal mounting structure on circuit board |
DE102006011657A1 (en) * | 2006-03-12 | 2007-09-20 | Kramski Gmbh | Contact pin and method for its manufacture |
-
2006
- 2006-01-13 DE DE102006001876A patent/DE102006001876A1/en not_active Withdrawn
- 2006-12-18 EP EP06841408A patent/EP1977482B1/en not_active Expired - Fee Related
- 2006-12-18 WO PCT/EP2006/069813 patent/WO2007082617A1/en active Application Filing
- 2006-12-18 US US12/160,661 patent/US7806703B2/en not_active Expired - Fee Related
- 2006-12-18 DE DE502006004213T patent/DE502006004213D1/en active Active
Non-Patent Citations (1)
Title |
---|
See references of WO2007082617A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102006001876A1 (en) | 2007-11-08 |
WO2007082617A1 (en) | 2007-07-26 |
US20100190362A1 (en) | 2010-07-29 |
DE502006004213D1 (en) | 2009-08-20 |
EP1977482B1 (en) | 2009-07-08 |
US7806703B2 (en) | 2010-10-05 |
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