EP1969626A1 - Electronic module, and method for producing one - Google Patents

Electronic module, and method for producing one

Info

Publication number
EP1969626A1
EP1969626A1 EP06819359A EP06819359A EP1969626A1 EP 1969626 A1 EP1969626 A1 EP 1969626A1 EP 06819359 A EP06819359 A EP 06819359A EP 06819359 A EP06819359 A EP 06819359A EP 1969626 A1 EP1969626 A1 EP 1969626A1
Authority
EP
European Patent Office
Prior art keywords
substrate
electronic module
components
power
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06819359A
Other languages
German (de)
French (fr)
Inventor
Kuno Wolf
Wolfgang Feiler
Thomas Koester
Stefan Hornung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1969626A1 publication Critical patent/EP1969626A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to an electronic module, and an electric motor comprising such a module and a method for producing such an electronic module according to the preamble of the independent claims.
  • an electric motor which has become known, which has an electronic module which is arranged within the transmission housing.
  • the electronic module is in this case formed in a sandwich construction, wherein electronic power components are arranged between a stamped grid as a first conductive substrate and a second conductive substrate.
  • the power devices are connected via their upper and lower surfaces directly to the two conductive substrates, wherein the first substrate is connected to the second substrate by means of soldering or a conductive adhesive.
  • the disadvantage of such a sandwich construction is that when using only one power component, or of several power components of different height, the two substrates can be aligned parallel to each other only at great expense, or the contact between the semiconductor devices and the two substrates is not formed very reliable.
  • the device according to the invention and the production method according to the invention with the features of the independent claims have the advantage that, by forming the second substrate with a smaller base area, the power components are fastened next to the second substrate on the first substrate can be.
  • the second substrate can be arranged directly on the first substrate without having components with different heights between the two substrates.
  • the overall height of the electronics module can be reduced and an exact parallel alignment of the two substrates can be achieved.
  • the power components can be soldered directly to the first substrate in the horizontal direction next to the second substrate.
  • the power components in this case have no own plastic housing, so that they can be attached by soldering or gluing on the first substrate.
  • the back of the device is connected directly to the substrate. This can be a
  • An electrically insulating adhesive is advantageously used for the connection between the first and second substrate, so that it is ensured that no unwanted leakage currents flow even with a small distance between the two substrates.
  • the two substrates are then connected to each other for electrical contacting by means of bonding wires.
  • the power components are also electrically contacted by means of bonding wires with the first and / or second substrate electrically.
  • a metal stamped grid is preferably used, which has a base body and projections formed thereon.
  • the extensions are at least partially designed as fastening elements, for example with a bore, by means of which the stamped grid can be fixed in a manufacturing mold during the manufacturing process.
  • the second substrate is formed as a hybrid ceramic, which was fitted to the first substrate with different electronic components prior to assembly.
  • the second substrate can be produced very inexpensively in the form of a large-scale card, whereby a series of manufacturing steps can be done simultaneously in parallel.
  • the power components are formed in a preferred embodiment as transistors, in particular as power MOSFETs or IGBTs, which do not have their own plastic housing. Thereby, the electronic module can be made very compact, with all electronic components are protected by means of a subsequently molded plastic body. Likewise, diodes can also be used cost-effectively as power components.
  • the power devices are arranged symmetrically relative to the second (logic) substrate.
  • the logic substrate is preferably arranged in the middle of the first substrate and the power components are distributed symmetrically about the second substrate.
  • Control electronics of an electric motor as this can be arranged directly in the region of the collector and a position sensor of the electric motor by the compact connection of the electrical and mechanical interfaces in an electronic module. Due to the additional integration of carbon brushes in the electronics module by the decoupling of the vibrations
  • the electronics module Due to the design of the electronic module housing as a molded plastic body, the electronics module is a mechanically stable unit that can be installed very variable self-supporting within the gear housing of the electronic motor.
  • the stamped grid is particularly favorable to arrange the stamped grid within the plastic body in a single horizontal plane at a constant distance from the second substrate.
  • the stamped grid can be made simpler as a single planar plane, on the other hand simplifies the attachment of the second substrate and the power devices on the first substrate (punched grid).
  • a compact electronic module can be produced very cost-effectively, which is particularly suitable for use as control electronics in electric motors. Be in a region of the main body of the stamped grid, which corresponds to the floor plan of the second substrate, no - A -
  • the second substrate in this area with a very small distance from the stamped grid can be precisely adhered to this glued. Since the electrical connections are realized by means of bonding wires, an insulating adhesive for the connection of the two substrates can be advantageously used, which can be cured in a further process step.
  • an insulating adhesive for the connection of the two substrates can be advantageously used, which can be cured in a further process step.
  • Fastening means for connecting the electronic module to the electric motor can be used simultaneously for fixing in the joining device.
  • the components - in particular power semiconductors - can be fixed exactly and reliably on the first substrate.
  • Figure 2 is a plan view of the corresponding module
  • FIG 3 shows an electronic motor with a schematic arrangement of the electronic module.
  • FIG. 1 shows the schematic structure of an electronic module 10
  • a punched grid 14 is formed of, for example, a copper sheet by punching, bending and stamping with different segments 20.
  • power devices 22 diodes 24 or transistors 26 For example, power MOSFETs 28 are arranged.
  • the power components 22 have different heights 23.
  • a ceramic substrate 30 having a metallic coating 32 formed in the form of traces 34 is disposed.
  • electronic components 40 such as a microprocessor 42, a position sensor 44 and SMD components 46 are arranged, which together form the logic part 48 for driving an electric motor 12.
  • the electronic components 40 have been applied to this before the assembly of the second substrate 18 by means of SMD method or flip-chip technology.
  • the second substrate 18 is then connected by means of an electrically insulating adhesive 36 directly to the first substrate 16, wherein between the two substrates 16, 18 no components 40 are arranged.
  • the first substrate 16 has an upper surface 38, which extends in at least the entire area 39, on which the second substrate 18 abuts, in exactly one horizontal plane 37.
  • the power components 22 are soldered to the stamped grid 14, the lower
  • Base surfaces 50, including the solder 52 directly abut the punched grid 14.
  • FIG. 2 schematically shows the relative arrangement of the first substrate 16 to the second substrate 18.
  • the first substrate 16 formed as a stamped grid 14 has individual segments 20 which are connected to each other by means of a dam-bar 60 (dashed line) such that the stamped grid 14 is a contiguous part may first be connected to the second substrate 18 and then overmolded with a plastic body 62.
  • This can be produced in particular in the transfer molding process by means of low-pressure epoxy.
  • formed as a punched grid 14 first substrate 16 consists of a base body 54, which after the finished production of
  • Electronic module 10 is completely within the plastic body 62.
  • extensions 56 are formed, which form electrical and mechanical interfaces 58 with further motor components 64.
  • Forestry sets 56 are formed as fastening elements 66 of the electronic module 10. These have e.g. Holes 68, with which the first substrate 16 during the manufacturing process of the electronic module 10 in a
  • the second substrate 18 has a base area 19 which is smaller than the base body 54 of the first substrate 16.
  • the second substrate 18 is fastened in a middle area 39 of the lower base body 54 thereon.
  • the electronic module 10 has, for example, four power components 22 which are arranged point-symmetrically with respect to the second substrate 18.
  • the power components 22 are connected to each other and to the second substrate 18 by means of bond wires 74, wherein the electrical connections 72 are also arranged symmetrically with respect to the second substrate 18.
  • the bonding wires 74 are contacted on the upper sides 76 of the power devices 22.
  • the schematically indicated plastic body 62 then completely encloses the second substrate 18 and the main body 54 of the first substrate 16 with the power components 22 and the bonding wires 74.
  • the plastic body 62 is dimensioned such that after its injection, the dam-bar 60 can be removed by punching, so that the individual segments 20 are no longer conductively connected to each other.
  • a portion of the extensions 56 is formed as a connector pins 80 for the power and signal connection, other extensions 56 are as electrical contact points 82 for external electrical components 64.
  • Two further extensions 56 are as Spring clip 84 is formed, on which the carbon brushes 86 are arranged, which cooperate with a collector 88 of an armature shaft 90.
  • Another extension 56 is formed as an electrical and mechanical link 82 to a shield against electromagnetic interference.
  • FIG. 3 shows a transmission drive unit 11, in which an electric motor 12 with an armature shaft 90 is mounted in a housing 92 over its entire length.
  • a first gear member 94 is mounted, which is coupled to a second gear member 95, and transmits the drive torque to an output pinion which drives, for example, a window or a sunroof in a motor vehicle.
  • the collector 88 is disposed on the armature shaft 90, which is in sliding connection with carbon brushes 88, which are connected via spring clip 84 to the electronic module 10.
  • the extensions 56 of the conductive stamped grid 14 protrude as free ends of the molded plastic body 62 and form the spring clip 84, and electrical connections 82 for electrical and mechanical contacts to components not shown in detail 64.
  • the electronic module 10 has next to the lead frame 14 on the second Substrate 18 on various electronic components 40, such as a microprocessor 42 or a position detection sensor 44 which cooperates with a position sensor 45 on the armature shaft 90.
  • the electrically conductive stamped grid 14 with the integrated spring clips 84 is mounted radially to the armature shaft 90 in the housing 92 after the gear members 94, 95, and the armature shaft 90 have been inserted radially into the housing 92.
  • the plastic body 62 is arranged at a small distance directly radially relative to the position sensor 45.
  • the electronic module 10 is thereby pressed or screwed in the housing 92 (by means of bores 68).
  • Electronic module 10 are poured or clamped by a second housing part.
  • the electronic module 10 can also be used for EC motors, valve controls or ignition coils.

Abstract

Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive substrate (18) mounted on it, and having at least one power component which is arranged on a first substrate (16), and the second substrate (18) is fitted with further components (40) on a side (32) which is remote from the first substrate (16), where the second substrate (18) has a smaller base area (19) than the basic body (54) of the first substrate (16), and the power components (22) are mounted on the first substrate (16) outside the outer perimeter (70) of the second substrate (18) - next to the latter.

Description

Beschreibungdescription
Titeltitle
Elektronikmodul sowie Verfahren zur Herstellung eines solchenElectronic module and method for producing such
Die Erfindung betrifft ein Elektronikmodul, sowie einen Elektromotor beinhaltend ein solches Modul und ein Verfahren zum Herstellen eines solchen Elektronikmoduls nach der Gattung der unabhängigen Ansprüche.The invention relates to an electronic module, and an electric motor comprising such a module and a method for producing such an electronic module according to the preamble of the independent claims.
Stand der TechnikState of the art
Mit der DE 103 52 079 Al ist ein Elektromotor bekannt geworden, der ein Elektronikmodul aufweist, das innerhalb des Getriebegehäuses angeordnet ist. Das Elektronikmodul ist hierbei in Sandwich-Bauweise ausgebildet, wobei zwischen einem Stanzgitter als erstes leitfähiges Substrat und einem zweiten leitfähigen Substrat elektronische Leistungsbauelemente angeordnet sind. Die Leistungsbauelemente sind über ihre oberen und unteren Oberflächen direkt mit den beiden leitenden Substraten verbunden, wobei das erste Substrat mit dem zweiten Substrat mittels Löten oder einem leitfähigen Klebstoff verbunden ist. Der Nachteil einer solchen Sandwich-Bauweise besteht darin, dass bei der Verwendung nur eines Leistungsbauelements, oder von mehreren Leistungsbauelementen unterschiedlicher Höhe, die beiden Substrate nur unter sehr großem Aufwand parallel zueinander ausgerichtet werden können, bzw. die Kontaktierung zwischen den Halbleiterbauelementen und den beiden Substraten nicht sehr zuverlässig ausgebildet wird.With the DE 103 52 079 Al an electric motor has become known, which has an electronic module which is arranged within the transmission housing. The electronic module is in this case formed in a sandwich construction, wherein electronic power components are arranged between a stamped grid as a first conductive substrate and a second conductive substrate. The power devices are connected via their upper and lower surfaces directly to the two conductive substrates, wherein the first substrate is connected to the second substrate by means of soldering or a conductive adhesive. The disadvantage of such a sandwich construction is that when using only one power component, or of several power components of different height, the two substrates can be aligned parallel to each other only at great expense, or the contact between the semiconductor devices and the two substrates is not formed very reliable.
Offenbarung der ErfindungDisclosure of the invention
Die erfindungsgemäße Vorrichtung und das erfindungsgemäße Herstellungsverfahren mit den Merkmalen der unabhängigen Ansprüche haben den Vorteil, dass durch die Ausbildung des zweiten Substrats mit einer kleineren Grundfläche die Leistungsbauelemente neben dem zweiten Substrat auf dem ersten Substrat befestigt werden können. Dadurch kann das zweite Substrat direkt auf dem ersten Substrat angeordnet werden, ohne dass sich Bauteile mit unterschiedlicher Höhe zwischen den beiden Substraten befinden. Dadurch kann die Gesamtbauhöhe des Elektronikmoduls reduziert werden und eine exakte parallele Ausrichtung der beiden Substrate erzielt werden. Die Leistungsbauelemente können hierbei in horizontaler Richtung neben dem zweiten Substrat direkt auf das erste Substrat gelötet werden.The device according to the invention and the production method according to the invention with the features of the independent claims have the advantage that, by forming the second substrate with a smaller base area, the power components are fastened next to the second substrate on the first substrate can be. As a result, the second substrate can be arranged directly on the first substrate without having components with different heights between the two substrates. As a result, the overall height of the electronics module can be reduced and an exact parallel alignment of the two substrates can be achieved. In this case, the power components can be soldered directly to the first substrate in the horizontal direction next to the second substrate.
Die Leistungsbauelemente weisen hierbei kein eigenes Kunststoffgehäuse auf, sodass diese mittels Löten oder Kleben am ersten Substrat befestigt werden können. Dabei wird die Rückseite des Bauelements direkt mit dem Substrat verbunden. Hierzu kann eineThe power components in this case have no own plastic housing, so that they can be attached by soldering or gluing on the first substrate. The back of the device is connected directly to the substrate. This can be a
Fügeform verwendet, in die das erste Substrat mit den Leistungsbauelementen eingesetzt wird.Used in joining mold, in which the first substrate with the power devices is used.
Wird bspw. das so genannten Die- Attach- Verfahren zum Anlöten der Leistungsbauelemente auf einen Stanzgitterstreifen (Leadframe) verwendet, ist keine eigene Fügeform notwendig, wodurch der Fertigungsprozess vereinfacht wird.If, for example, the so-called die-attach method is used for soldering the power components onto a leadframe strip (leadframe), no separate joining form is necessary, which simplifies the manufacturing process.
Für die Verbindung zwischen dem ersten und zweiten Substrat wird vorteilhaft ein elektrisch isolierender Kleber verwendet, sodass gewährleistet ist, dass auch bei geringem Abstand zwischen den beiden Substraten keine unerwünschten Leckströme fließen.An electrically insulating adhesive is advantageously used for the connection between the first and second substrate, so that it is ensured that no unwanted leakage currents flow even with a small distance between the two substrates.
Die beiden Substrate werden dann zur elektrischen Kontaktierung mittels Bond-Drähten miteinander verbunden. Die Leistungsbauelemente werden günstig mittels Bond-Drähten auch mit dem ersten und/oder zweiten Substrat elektrisch kontaktiert.The two substrates are then connected to each other for electrical contacting by means of bonding wires. The power components are also electrically contacted by means of bonding wires with the first and / or second substrate electrically.
Als erstes Substrat wird vorzugsweise ein metallenes Stanzgitter verwendet, das einen Grundkörper und daran angeformte Fortsätze aufweist. Die Fortsätze sind zumindest teilweise als Befestigungselemente, beispielsweise mit einer Bohrung ausgebildet, mittels derer das Stanzgitter beim Herstellungsprozess in einer Fügeform fixiert werden kann.As the first substrate, a metal stamped grid is preferably used, which has a base body and projections formed thereon. The extensions are at least partially designed as fastening elements, for example with a bore, by means of which the stamped grid can be fixed in a manufacturing mold during the manufacturing process.
In einer bevorzugten Ausgestaltung ist das zweite Substrat als Hybridkeramik ausgebildet, die vor der Montage auf das erste Substrat mit unterschiedlichen Elektronikbauteilen bestückt wurde. Das zweite Substrat kann dabei sehr kostengünstig in Form einer Groß-Karte hergestellt werden, wodurch eine Reihe von Fertigungsschritten gleichzeitig parallel erfolgen kann. Die Leistungsbauelemente sind in einer bevorzugten Ausführung als Transistoren, insbesondere als Power-MOSFETs oder IGBTs ausgebildet, die kein eigenes Kunststoffgehäuse aufweisen. Dadurch kann das Elektronikmodul sehr kompakt ausgebildet werden, wobei alle Elektronikbauteile mittels eines anschließend angespritzten Kunststoffkörpers geschützt werden. Ebenso können auch kostengünstig Dioden als Leistungsbauelemente verwendet werden.In a preferred embodiment, the second substrate is formed as a hybrid ceramic, which was fitted to the first substrate with different electronic components prior to assembly. The second substrate can be produced very inexpensively in the form of a large-scale card, whereby a series of manufacturing steps can be done simultaneously in parallel. The power components are formed in a preferred embodiment as transistors, in particular as power MOSFETs or IGBTs, which do not have their own plastic housing. Thereby, the electronic module can be made very compact, with all electronic components are protected by means of a subsequently molded plastic body. Likewise, diodes can also be used cost-effectively as power components.
Damit die in den Leistungsbauelementen erzeugte Wärme effektiv aus dem Elektronikmodul abgeleitet werden kann, werden die Leistungsbauelemente relativ zu dem zweiten (Logik-)Substrat symmetrisch angeordnet. Dazu wird das Logik-Substrat vorzugsweise in der Mitte des ersten Substrats angeordnet und die Leistungsbauelemente symmetrisch um das zweite Substrat verteilt.In order for the heat generated in the power devices to be effectively dissipated from the electronics module, the power devices are arranged symmetrically relative to the second (logic) substrate. For this purpose, the logic substrate is preferably arranged in the middle of the first substrate and the power components are distributed symmetrically about the second substrate.
Von besonderem Vorteil ist das Elektronikmodul für die Verwendung alsOf particular advantage is the electronic module for use as
Steuerelektronik eines Elektromotors, da durch die kompakte Verbindung der elektrischen und mechanischen Schnittstellen in einem Elektronikmodul dieses unmittelbar im Bereich des Kollektors und eines Positiongebers des Elektromotors angeordnet werden kann. Durch die zusätzliche Integration von Kohlebürsten in das Elektronikmodul kann durch die Entkopplung von Schwingungen dieControl electronics of an electric motor, as this can be arranged directly in the region of the collector and a position sensor of the electric motor by the compact connection of the electrical and mechanical interfaces in an electronic module. Due to the additional integration of carbon brushes in the electronics module by the decoupling of the vibrations
Geräuschentwicklung deutlich reduziert werden. Durch die Ausbildung des Elektronikmodul-Gehäuses als angespritzter Kunststoffkörper stellt das Elektronikmodul eine mechanisch stabile Einheit dar, die selbsttragend innerhalb des Getriebegehäuses des Elektronikmotors sehr variabel eingebaut werden kann.Noise emission can be significantly reduced. Due to the design of the electronic module housing as a molded plastic body, the electronics module is a mechanically stable unit that can be installed very variable self-supporting within the gear housing of the electronic motor.
Besonders günstig ist es, das Stanzgitter innerhalb des Kunststoffkörpers in einer einzigen horizontalen Ebene mit konstantem Abstand zum zweiten Substrat anzuordnen. Einerseits kann das Stanzgitter als eine einzige plane Ebene einfacher hergestellt werden, andererseits vereinfacht sich hierdurch die Befestigung des zweiten Substrats und der Leistungsbauelemente auf dem ersten Substrat (Stanzgitter).It is particularly favorable to arrange the stamped grid within the plastic body in a single horizontal plane at a constant distance from the second substrate. On the one hand, the stamped grid can be made simpler as a single planar plane, on the other hand simplifies the attachment of the second substrate and the power devices on the first substrate (punched grid).
Mittels des erfmdungsgemäßen Herstellungsverfahrens kann sehr kostengünstig ein kompaktes Elektronikmodul hergestellt werden, das insbesondere für den Einsatz als Steuerelektronik in Elektromotoren geeignet ist. Werden in einem Bereich des Grundkörpers des Stanzgitters, der dem Grundriss des zweiten Substrats entspricht, keine - A -By means of the manufacturing method according to the invention, a compact electronic module can be produced very cost-effectively, which is particularly suitable for use as control electronics in electric motors. Be in a region of the main body of the stamped grid, which corresponds to the floor plan of the second substrate, no - A -
Bauelemente auf dem Stanzgitter angeordnet, kann das zweite Substrat in diesem Bereich mit sehr geringem Abstand zum Stanzgitter exakt justiert auf diesem aufgeklebt werden. Da die elektrische Verbindungen mittels Bond-Drähten realisiert werden, kann günstiger Weise ein isolierender Kleber für die Verbindung der beiden Substrate verwendet werden, der in einem weiteren Prozessschritt ausgehärtet werden kann. Beim Anspritzen des Kunststoffkörpers als Gehäuse des Elektronikmoduls werden beide Substrate sehr zuverlässig vom Kunststoffkörper umschlossen, da keine kleinen Hohlräume zwischen den beiden Substraten ausgespritzt werden müssen.Components arranged on the stamped grid, the second substrate in this area with a very small distance from the stamped grid can be precisely adhered to this glued. Since the electrical connections are realized by means of bonding wires, an insulating adhesive for the connection of the two substrates can be advantageously used, which can be cured in a further process step. When molding the plastic body as a housing of the electronic module both substrates are very reliably enclosed by the plastic body, since no small voids between the two substrates must be injected.
Während der Montage des Elektronikmoduls können am Stanzgitter angeformteDuring assembly of the electronic module can be molded on the punched grid
Befestigungsmittel zum Verbinden des Elektronikmoduls mit dem Elektromotor gleichzeitig für die Fixierung in der Fügevorrichtung verwendet werden. Dadurch können die Bauteile - insbesondere Leistungshalbleiter - exakt und zuverlässig auf dem ersten Substrat befestigt werden.Fastening means for connecting the electronic module to the electric motor can be used simultaneously for fixing in the joining device. As a result, the components - in particular power semiconductors - can be fixed exactly and reliably on the first substrate.
Zeichnungdrawing
In der Zeichnung sind Ausführungsbeispiele einer erfmdungsgemäßen Vorrichtung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen:In the drawings, embodiments of a device according to the invention are shown and explained in more detail in the following description. Show it:
Figur 1 einen schematischen Schnitt durch ein Elektronikmodul,1 shows a schematic section through an electronic module,
Figur 2 eine Draufsicht des entsprechenden Moduls undFigure 2 is a plan view of the corresponding module and
Figur 3 ein Elektronikmotor mit einer schematischen Anordnung des Elektronikmoduls.3 shows an electronic motor with a schematic arrangement of the electronic module.
Beschreibung der AusführungsbeispieleDescription of the embodiments
In Figur 1 ist der schematische Aufbau einer als Elektronikmodul 10 ausgebildetenFIG. 1 shows the schematic structure of an electronic module 10
Elektronikeinheit 10 im Schnitt entlang der Linie I-I der Figur 2 dargestellt. Als ein erstes unteres Substrat 16 ist ein Stanzgitter 14 beispielsweise aus einem Kupferblech mittels Stanzen, Biegen und Prägen mit unterschiedlichen Segmenten 20 geformt. Auf dem Stanzgitter 14 sind als Leistungsbauelemente 22 Dioden 24 oder Transistoren 26, beispielsweise Power-MOSFETs 28 angeordnet. Die Leistungsbauteile 22 weisen dabei unterschiedliche Bauhöhen 23 auf. Als ein zweites, oberes Substrat 18 ist ein Keramiksubstrat 30 mit einer metallischen Beschichtung 32, die in Form von Leiterbahnen 34 ausgebildet ist, angeordnet. Auf dieser dem Stanzgitter 14 abgewandten Beschichtung 32 des zweiten Substrats 18 sind elektronische Bauelemente 40, wie beispielsweise ein Mikroprozessor 42, ein Positionssensor 44 und SMD-Bauteile 46 angeordnet, die zusammen den Logikteil 48 zur Ansteuerung eines Elektromotors 12 bilden. Die elektronischen Bauelemente 40 sind vor der Montage des zweiten Substrats 18 mittels SMD-Verfahren oder Flip-Chip-Technologie auf dieses aufgebracht worden. Das zweite Substrat 18 ist dann mittels eines elektrisch isolierenden Klebemittels 36 direkt mit dem ersten Substrat 16 verbunden, wobei zwischen den beiden Substraten 16, 18 keine Bauelemente 40 angeordnet sind. Das erste Substrat 16 weist eine obere Oberfläche 38 auf, die sich zumindest über den gesamten Bereich 39, an dem das zweite Substrat 18 anliegt, in genau einer horizontalen Ebene 37 erstreckt. Die Leistungsbauelemente 22 sind am Stanzgitter 14 fest gelötet, wobei deren untereElectronic unit 10 shown in section along the line II of Figure 2. As a first lower substrate 16, a punched grid 14 is formed of, for example, a copper sheet by punching, bending and stamping with different segments 20. On the punched grid 14 are as power devices 22 diodes 24 or transistors 26, For example, power MOSFETs 28 are arranged. The power components 22 have different heights 23. As a second, upper substrate 18, a ceramic substrate 30 having a metallic coating 32 formed in the form of traces 34 is disposed. On this the punched grid 14 facing away from coating 32 of the second substrate 18 are electronic components 40, such as a microprocessor 42, a position sensor 44 and SMD components 46 are arranged, which together form the logic part 48 for driving an electric motor 12. The electronic components 40 have been applied to this before the assembly of the second substrate 18 by means of SMD method or flip-chip technology. The second substrate 18 is then connected by means of an electrically insulating adhesive 36 directly to the first substrate 16, wherein between the two substrates 16, 18 no components 40 are arranged. The first substrate 16 has an upper surface 38, which extends in at least the entire area 39, on which the second substrate 18 abuts, in exactly one horizontal plane 37. The power components 22 are soldered to the stamped grid 14, the lower
Basisflächen 50 unter Einschluss des Lots 52 direkt am Stanzgitter 14 anliegen.Base surfaces 50, including the solder 52 directly abut the punched grid 14.
Figur 2 zeigt schematisch die relative Anordnung des ersten Substrats 16 zum zweiten Substrat 18. Das als Stanzgitter 14 ausgebildete erste Substrat 16 weist einzelne Segmente 20 auf, die mittels einer Dam-Bar 60 (gestrichelt) derart miteinander verbunden sind, dass das Stanzgitter 14 als ein zusammenhängendes Teil zuerst mit dem zweiten Substrat 18 verbunden und anschließend mit einem Kunststoffkörper 62 umspritzt werden kann. Dieser kann insbesondere im Transfer-Molding- Verfahren mittels Niederdruck- Epoxidmasse hergestellt werden. Dabei besteht das als Stanzgitter 14 ausgebildete erste Substrat 16 aus einem Grundkörper 54, der nach fertiger Herstellung desFIG. 2 schematically shows the relative arrangement of the first substrate 16 to the second substrate 18. The first substrate 16 formed as a stamped grid 14 has individual segments 20 which are connected to each other by means of a dam-bar 60 (dashed line) such that the stamped grid 14 is a contiguous part may first be connected to the second substrate 18 and then overmolded with a plastic body 62. This can be produced in particular in the transfer molding process by means of low-pressure epoxy. In this case, formed as a punched grid 14 first substrate 16 consists of a base body 54, which after the finished production of
Elektronikmoduls 10 komplett innerhalb des Kunststoffkörpers 62 liegt. Am Grundkörper 54 sind Fortsätze 56 angeformt, die elektrische und mechanische Schnittstellen 58 mit weiteren Motorbauteilen 64 bilden. Dabei sind Forstsätze 56 als Befestigungselemente 66 des Elektronikmoduls 10 ausgebildet. Diese weisen z.B. Bohrungen 68 auf, mit denen das erste Substrat 16 auch während des Fertigungsprozesses des Elektronikmoduls 10 in einerElectronic module 10 is completely within the plastic body 62. On the main body 54 extensions 56 are formed, which form electrical and mechanical interfaces 58 with further motor components 64. Forestry sets 56 are formed as fastening elements 66 of the electronic module 10. These have e.g. Holes 68, with which the first substrate 16 during the manufacturing process of the electronic module 10 in a
Fügeform fixierbar ist. Das zweite Substrat 18 weist eine Grundfläche 19 auf, die kleiner ist, als der Grundkörper 54 des ersten Substrats 16. Das zweite Substrat 18 ist in einem mittleren Bereich 39 des unteren Grundkörpers 54 an diesem befestigt. Außerhalb eines äußeren Umfangs 70 des zweiten Substrats 18 sind die Leistungsbauelemente 22 in einem äußeren Randbereich 55 auf dem ersten Substrat 16 fest gelötet, wodurch die Leistungsbauelemente 22 horizontal benachbart zum zweiten Substrat 18 angeordnet sind. Das Elektronikmodul 10 weist beispielsweise vier Leistungsbauelemente 22 auf, die punktsymmetrisch zum zweiten Substrat 18 angeordnet sind. Die Leistungsbauelemente 22 sind mittels Bond-Drähten 74 untereinander und mit dem zweiten Substrat 18 verbunden, wobei die elektrischen Verbindungen 72 auch symmetrisch bezüglich des zweiten Substrats 18 angeordnet sind. Die Bond-Drähte 74 sind dabei an den Oberseiten 76 der Leistungsbauelemente 22 kontaktiert. Der schematisch angedeutete Kunststoffkörper 62 umschließt dann das zweite Substrat 18 und den Grundkörper 54 des ersten Substrats 16 mit den Leistungsbauelementen 22 und den Bond-Drähten 74 komplett. Der Kunststoffkörper 62 ist dabei derart bemessen, dass nach dessen Anspritzen die Dam-Bar 60 mittels Stanzen entfernt werden kann, damit die einzelnen Segmente 20 nicht mehr leitend miteinander verbunden sind. Aus dem Kunststoffkörper 62 ragen die verschiedenen Fortsätze 56 des Stanzgitters 14. Ein Teil der Fortsätze 56 ist als Steckerpins 80 für die Strom- und Signalverbindung ausgebildet, andere Fortsätze 56 sind als elektrische Kontaktstellen 82 für externe elektrische Komponenten 64. Zwei weitere Fortsätze 56 sind als Federbügel 84 ausgebildet, an denen die Kohlenbürsten 86 angeordnet sind, die mit einem Kollektor 88 einer Ankerwelle 90 zusammenwirken. Ein weiterer Fortsatz 56 ist als elektrisches und mechanisches Verbindungsglied 82 zu einem Abschirmelement gegenüber elektromagnetischer Störung ausgebildet.Joining form is fixable. The second substrate 18 has a base area 19 which is smaller than the base body 54 of the first substrate 16. The second substrate 18 is fastened in a middle area 39 of the lower base body 54 thereon. Outside an outer periphery 70 of the second substrate 18, the power devices 22 are in one outer edge region 55 is soldered to the first substrate 16, whereby the power devices 22 are arranged horizontally adjacent to the second substrate 18. The electronic module 10 has, for example, four power components 22 which are arranged point-symmetrically with respect to the second substrate 18. The power components 22 are connected to each other and to the second substrate 18 by means of bond wires 74, wherein the electrical connections 72 are also arranged symmetrically with respect to the second substrate 18. The bonding wires 74 are contacted on the upper sides 76 of the power devices 22. The schematically indicated plastic body 62 then completely encloses the second substrate 18 and the main body 54 of the first substrate 16 with the power components 22 and the bonding wires 74. The plastic body 62 is dimensioned such that after its injection, the dam-bar 60 can be removed by punching, so that the individual segments 20 are no longer conductively connected to each other. A portion of the extensions 56 is formed as a connector pins 80 for the power and signal connection, other extensions 56 are as electrical contact points 82 for external electrical components 64. Two further extensions 56 are as Spring clip 84 is formed, on which the carbon brushes 86 are arranged, which cooperate with a collector 88 of an armature shaft 90. Another extension 56 is formed as an electrical and mechanical link 82 to a shield against electromagnetic interference.
In Figur 3 ist eine Getriebe- Antriebseinheit 11 dargestellt, bei der ein Elektromotor 12 mit einer Ankerwelle 90 über deren gesamten Länge in einem Gehäuse 92 gelagert ist. Auf der Ankerwelle 90 ist ein erstes Getriebeelement 94 gelagert, das mit einem zweiten Getriebeelement 95 gekoppelt ist, und das Antriebsmoment an ein Abtriebsritzel weiterleitet, das beispielsweise eine Fensterscheibe oder ein Schiebedach in einem Kraftfahrzeug antreibt. Zur Bestromung ist an der Ankerwelle 90 der Kollektor 88 angeordnet, der in Schleifverbindung mit Kohlebürsten 88 steht, die über Federbügel 84 mit dem Elektronikmodul 10 verbunden sind. Die Fortsätze 56 des leitfähigen Stanzgitters 14 ragen als freien Enden aus dem angespritzten Kunststoffkörper 62 und bilden die Federbügel 84, sowie elektrische Verbindungen 82 für elektrische, sowie mechanische Kontaktierungen zu nicht näher dargestellten Komponenten 64. Das Elektronikmodul 10 weist neben dem Stanzgitter 14 auf dem zweiten Substrat 18 verschiedene elektronische Bauelemente 40 auf, wie beispielsweise ein Mikroprozessor 42 oder einen Positionserfassungssensor 44, der mit einem Positionsgeber 45 auf der Ankerwelle 90 zusammenwirkt. Das elektrisch leitende Stanzgitter 14 mit den integrierten Federbügeln 84 ist radial zur Ankerwelle 90 in das Gehäuse 92 montiert, nachdem die Getriebebauteile 94, 95, sowie die Ankerwelle 90 radial in das Gehäuse 92 eingesetzt wurden. Um einen minimalen Abstand zwischen dem im Kunststoffkörper 62 eingegossenen Positionssensor 44 und dem auf der Ankerwelle 90 angeordneten Positionsgeber 45 - beispielsweise ein Magnetring 45 - zu erzielen, ist der Kunststoffkörper 62 mit geringem Abstand unmittelbar radial gegenüber dem Positionsgeber 45 angeordnet. Das Elektronikmodul 10 wird dabei im Gehäuse 92 eingepresst oder festgeschraubt (mittels Bohrungen 68). Alternativ kann dasFIG. 3 shows a transmission drive unit 11, in which an electric motor 12 with an armature shaft 90 is mounted in a housing 92 over its entire length. On the armature shaft 90, a first gear member 94 is mounted, which is coupled to a second gear member 95, and transmits the drive torque to an output pinion which drives, for example, a window or a sunroof in a motor vehicle. For energizing the collector 88 is disposed on the armature shaft 90, which is in sliding connection with carbon brushes 88, which are connected via spring clip 84 to the electronic module 10. The extensions 56 of the conductive stamped grid 14 protrude as free ends of the molded plastic body 62 and form the spring clip 84, and electrical connections 82 for electrical and mechanical contacts to components not shown in detail 64. The electronic module 10 has next to the lead frame 14 on the second Substrate 18 on various electronic components 40, such as a microprocessor 42 or a position detection sensor 44 which cooperates with a position sensor 45 on the armature shaft 90. The electrically conductive stamped grid 14 with the integrated spring clips 84 is mounted radially to the armature shaft 90 in the housing 92 after the gear members 94, 95, and the armature shaft 90 have been inserted radially into the housing 92. In order to achieve a minimum distance between the position sensor 44 cast in the plastic body 62 and the position sensor 45 arranged on the armature shaft 90-for example a magnetic ring 45-the plastic body 62 is arranged at a small distance directly radially relative to the position sensor 45. The electronic module 10 is thereby pressed or screwed in the housing 92 (by means of bores 68). Alternatively, the
Elektronikmodul 10 eingegossen werden oder durch ein zweites Gehäuseteil festgeklemmt werden.Electronic module 10 are poured or clamped by a second housing part.
Es sei angemerkt, dass hinsichtlich der in den Figuren gezeigten Ausführungsbeispiele vielfältige Kombinationsmöglichkeiten der einzelnen Merkmale untereinander möglich sind. So kann die Auswahl der elektronischen Bauelemente 40 der entsprechenden Anwendung angepasst werden. Anstelle der als Schnittstellen 58 ausgebildeten Fortsätze 56 können diese auch einstückig mit den entsprechenden Motorbauteilen 64 oder den externen Elektrik-Komponenten ausgebildet sein. Die Herstellung des leitfähigen Stanzgitters 14 ist nicht auf Stanzen beschränkt. Bevorzugt findet die erfindungsgemäßeIt should be noted that, with regard to the exemplary embodiments shown in the figures, a variety of possible combinations of the individual features are possible with one another. Thus, the selection of the electronic components 40 of the corresponding application can be adapted. Instead of the extensions 58 formed as interfaces 58, these can also be formed integrally with the corresponding motor components 64 or the external electrical components. The production of the conductive punched grid 14 is not limited to punching. Preferably, the inventive
Vorrichtung Anwendung bei elektrischen Verstellantrieben, insbesondere von Fensterscheiben und Schiebedächern. Das erfindungsgemäße Elektronikmodul 10 kann jedoch auch für EC-Motoren, Ventilsteuerungen oder Zündspulen eingesetzt werden. Device Application in electrical adjustment drives, in particular windows and sunroofs. However, the electronic module 10 according to the invention can also be used for EC motors, valve controls or ignition coils.

Claims

Ansprüche claims
1. Elektronikmodul(lO), insbesondere zur Ansteuerung eines Elektromotors (12), mit einem einen Grundkörper (54) aufweisendem elektrisch leitfähigen ersten Substrat (16), auf dem ein zweites elektrisch leitfähiges Substrat (18) befestigt ist, und mindestens einem Leistungsbauelement, das auf dem ersten Substrat (16) angeordnet ist, und das zweite Substrat (18) auf einer dem ersten Substrat (16) abgewandten Seite (32) mit weiteren Bauteilen (40) bestückt ist, dadurch gekennzeichnet, dass das zweite Substrat (18) eine kleinere Grundfläche (19) aufweist als der Grundkörper (54) des ersten Substrats (16), und die Leistungsbauelemente (22) außerhalb des äußeren Umfangs (70) des zweiten1. Electronic module (10), in particular for controlling an electric motor (12), having a base body (54) exhibiting electrically conductive first substrate (16) on which a second electrically conductive substrate (18) is attached, and at least one power component, which is arranged on the first substrate (16), and the second substrate (18) is equipped on a side (32) facing away from the first substrate (16) with further components (40), characterized in that the second substrate (18) a smaller base (19) than the base (54) of the first substrate (16), and the power devices (22) outside the outer periphery (70) of the second
Substrats (18) - neben diesem - auf dem ersten Substrat (16) befestigt sind.Substrate (18) - in addition to this - are mounted on the first substrate (16).
2. Elektronikmodul (10) nach Anspruch 1, dadurch gekennzeichnet, dass die Leistungsbauelemente (22) auf dem ersten Substrat (16) angelötet oder leitfähig angeklebt sind - insbesondere unter Verwendung einer Fügeform.Second electronic module (10) according to claim 1, characterized in that the power components (22) on the first substrate (16) are soldered or adhesively bonded - in particular using a joining mold.
3. Elektronikmodul (10) nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass die Leistungsbauelemente (22) mittels Die- Attach- Verfahren mit dem ersten Substrat (16) elektrisch leitend verbunden sind.3. Electronic module (10) according to any one of claims 1 or 2, characterized in that the power components (22) by means of die attach method with the first substrate (16) are electrically connected.
4. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das zweite Substrat (18) elektrisch isolierend auf des erste Substrat (16) aufgeklebt ist.4. The electronic module (10) according to any one of the preceding claims, characterized in that the second substrate (18) is electrically insulating on the first substrate (16) is glued.
5. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die elektrischen Verbindungen (72) zwischen den Leistungsbauelementen (22) untereinander und/oder mit dem zweiten und/oder mit dem ersten Substrat (16) als Bond-Drähte (74) ausgebildet sind. 5. Electronic module (10) according to one of the preceding claims, characterized in that the electrical connections (72) between the power components (22) with each other and / or with the second and / or with the first substrate (16) as bond wires ( 74) are formed.
6. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das erste Substrat (16) als Stanzgitter (14) mit daran angeformten Befestigungselementen (66) ausgebildet ist, die gleichzeitig für die Fixierung des Stanzgitters (14) in der Fügeform nutzbar sind.6. The electronic module (10) according to any one of the preceding claims, characterized in that the first substrate (16) as a stamped grid (14) formed thereon with fastening elements (66), which at the same time for the fixation of the stamped grid (14) in the joining form are usable.
7. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das zweite Substrat (18) als Hybridkeramik (17) ausgebildet ist, auf der als elektronische Bauteile (40) ein Mikroprozessor (42) und/oder eine Ansteuerlogik (48) und eine Positions-Sensorik (44) für eine Ankerwelle (90) des Elektromotors (12) angeordnet ist, und die elektronischen Bauteile (40) in SMD-7. Electronic module (10) according to one of the preceding claims, characterized in that the second substrate (18) as a hybrid ceramic (17) is formed on the electronic components (40), a microprocessor (42) and / or a drive logic (48 ) and a position sensor (44) for an armature shaft (90) of the electric motor (12) is arranged, and the electronic components (40) in SMD
Technik oder Flip-Chip-Technik variabel mittels Löt- oder Leitklebetechnik bestückbar sind.Technology or flip-chip technology can be variably equipped by soldering or Leitklebetechnik.
8. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leistungsbauelemente (22) als Bare-Die-Elemente ohne8. Electronic module (10) according to any one of the preceding claims, characterized in that the power components (22) as bare die elements without
Gehäuse - insbesondere als Power-MOSFETS (28) - ausgebildet sind.Housing - in particular as a power MOSFETs (28) - are formed.
9. Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leistungsbauelemente (22) in Randbereichen (55) des Grundkörpers (54) näherungsweise symmetrisch bezüglich des zweiten Substrats9. electronic module (10) according to any one of the preceding claims, characterized in that the power components (22) in edge regions (55) of the base body (54) approximately symmetrically with respect to the second substrate
(18) angeordnet sind.(18) are arranged.
10. Elektronikmodul (10), insbesondere ein Zündmodul einer Zündspule, nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass auf dem ersten Substrat10. electronic module (10), in particular an ignition module of an ignition coil, according to one of the preceding claims, characterized in that on the first substrate
(16) genau ein Leistungsbauelement (22) und ein Shunt zur Strommessung anlötet oder leitend angeklebt ist.(16) exactly one power component (22) and a shunt for current measurement is soldered or adhesively bonded.
11. Elektromotor (12) mit einem Elektronikmodul (10) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Grundkörper (54) des ersten Substrats11. Electric motor (12) with an electronic module (10) according to one of the preceding claims, characterized in that the base body (54) of the first substrate
(16) und das zweite Substrat (18) zusammen derart mit einem Kunststoffkörper (62) umspritzt sind, dass am Grundkörper (54) angeformte Fortsätze (56) aus dem Kunststoffkörper (62) ragen, um eine elektrische und/oder mechanische Schnittstelle (58) zur Anbindung weiterer Motorbauteile (64) zu bilden. (16) and the second substrate (18) are encapsulated together with a plastic body (62) such that projections (56) formed on the base body (54) protrude from the plastic body (62) to form an electrical and / or mechanical interface (58 ) to connect further engine components (64).
12. Elektromotor (12) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das erste Substrat (16) zum zweiten Substrat (18) hin eine ebene Oberfläche (38) aufweist, die sich durchgehend, zumindest innerhalb des Kunststoffkörpers (62), in einer einzigen horizontalen Ebene (37) erstreckt.12. Electric motor (12) according to any one of the preceding claims, characterized in that the first substrate (16) to the second substrate (18) out towards a flat surface (38), the continuous, at least within the plastic body (62), in a single horizontal plane (37) extends.
13. Verfahren zum Herstellen eines Elektronikmoduls (10), insbesondere nach einem der vorhergehenden Ansprüche, gekennzeichnet durch folgende Schritte: auf einem ersten Substrat (16) - insbesondere ein Stanzgitter (14) - mit einem Grundkörper (54) und daran angeformten äußeren Fortsätzen (56) werden am äußeren Randbereich (55) des Grundkörpers (54) Leistungsbauelemente (22) - insbesondere Transistoren (26) und/oder Dioden (24) - aufgelötet oder leitfähig aufgelebt ein zweites Substrat (18) - insbesondere eine Hybridkeramik (17) - mit einer kleineren Grundfläche (19) als der Grundkörper (54) des ersten Substrats (16) wird zuvor mit elektronischen Bauteilen (40) bestückt und elektrisch isolierend auf einen freien Bereich (39) des ersten Substrats (16) geklebt der so entstandene Verbund wird mittels eines Ofenprozesses ausgehärtet danach werden zwischen den Leistungsbauelementen (22) untereinander und/oder zu dem ersten und/oder zweiten Substrat (16, 18) elektrische Bond-13. A method for producing an electronic module (10), in particular according to one of the preceding claims, characterized by the following steps: on a first substrate (16) - in particular a stamped grid (14) - with a base body (54) and formed thereon outer extensions ( 56) are at the outer edge region (55) of the main body (54) power devices (22) - in particular transistors (26) and / or diodes (24) - soldered or conductively revived a second substrate (18) - in particular a hybrid ceramic (17) - with a smaller footprint (19) than the main body (54) of the first substrate (16) is previously equipped with electronic components (40) and electrically insulating on a free area (39) of the first substrate (16) glued the resulting composite hardened by a furnace process thereafter between the power components (22) with each other and / or to the first and / or second substrate (16, 18) electrical bonding
Verbindungen (74) hergestellt um den Grundkörper (54) des ersten Substrats (16) wird zusammen mit dem zweiten Substrat (18) ein Kunststoffkörper (62) derart angespritzt, dass die Fortsätze (56) frei aus dem Kunststoffkörper (62) ragen.Connections (74) made around the main body (54) of the first substrate (16) together with the second substrate (18), a plastic body (62) is injection-molded such that the extensions (56) protrude freely from the plastic body (62).
14. Verfahren nach Anspruch 13, dadurch gekennzeichnet, dass zum Anlöten oder Ankleben der Leistungsbauelemente (22) und/oder Ankleben des zweiten Substrats (18) an das erste Substrat (16) dieses in eine Fügevorrichtung eingelegt wird, und insbesondere mittels am ersten Substrat (16) angeformten Befestigungsmitteln (66) - vorzugsweise Bohrungen (68) - an der Fügevorrichtung fixiert wird.14. The method according to claim 13, characterized in that for soldering or gluing the power components (22) and / or adhering the second substrate (18) to the first substrate (16) this is inserted into a joining device, and in particular by means of the first substrate (16) integrally formed fastening means (66) - preferably bores (68) - is fixed to the joining device.
15. Verfahren nach Anspruch 13 oder 14, dadurch gekennzeichnet, dass die Leistungsbauelemente (22) mittels Die- Attach- Verfahren elektrisch leitend mit dem ersten Substrat (16) verbunden werden. 15. The method according to claim 13 or 14, characterized in that the power components (22) by means of die attach method are electrically conductively connected to the first substrate (16).
EP06819359A 2005-12-28 2006-11-09 Electronic module, and method for producing one Withdrawn EP1969626A1 (en)

Applications Claiming Priority (2)

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DE102005062783A DE102005062783A1 (en) 2005-12-28 2005-12-28 Electronic module for controlling electric motor, has upper substrate comprising smaller base surface than base body of lower substrate, and power component fastened to lower substrate at outer side of outer periphery of upper substrate
PCT/EP2006/068282 WO2007079997A1 (en) 2005-12-28 2006-11-09 Electronic module, and method for producing one

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JP4886791B2 (en) 2012-02-29
CN101351882B (en) 2010-12-29
US8169791B2 (en) 2012-05-01
DE102005062783A1 (en) 2007-07-05
JP2009522758A (en) 2009-06-11
US20080247142A1 (en) 2008-10-09
CN101351882A (en) 2009-01-21

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