EP1964450A1

EP1964450A1 - Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof

Info

Publication number: EP1964450A1
Application number: EP06820270A
Authority: EP
Inventors: Rino Messere; Philippe Armand
Original assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Current assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Priority date: 2005-10-21
Filing date: 2006-10-10
Publication date: 2008-09-03
Also published as: CN101297606A; FR2892594B1; FR2892594A1; KR20080074899A; TW200731571A; US20090114928A1; CN101297606B; US8044415B2; JP2009512977A; WO2007045786A1

Abstract

The invention concerns a light-emitting diode lighting structure (100), comprising a first dielectric element (1a) with a substantially flat main surface (12a) associated with a first electrode (2a); a second dielectric element (1b) with a substantially flat main surface (12b) associated with a second electrode (2b) which is opposite the first electrode and in a different plane; at least one first light-emitting diode, called first LED (4), comprising a semiconductor chip (4) including, on first and second opposite sides, first and second electrical contacts (41, 42); the first electrical contact being electrically connected to the first electrode, the second electrical contact being electrically connected to the second electrode, at least the first element transmitting at least partly a radiation included in the ultraviolet, called UV, or the visible light. The invention also concerns a method for making such a structure and its uses.

Description

LIGHT STRUCTURE COMPRISING AT LEAST

AN ELECTROLUMINESCENT DIODE, ITS MANUFACTURE AND ITS APPLICATIONS

The present invention relates to a light structure and in particular to a light structure comprising at least a first light-emitting diode, the method of manufacturing this structure and its applications.

A traditional light emitting diode (LED) generally comprises: a semiconductor chip;

- An envelope, often epoxy, encapsulating the chip and whose functions are multiple (protection of oxidation and humidity, diffusing element etc ...);

- electrical connection elements comprising two thin gold wires welded to the contacts and connected to two metal pins

(called ^λ pins') emerging from the envelope.

It is known to insert such a light emitting diode as well as its electrical connection circuit, inside a laminated glass in order to confer to it functionalities for lighting or signaling automobile.

WO2004 / 062908 thus teaches a laminated automotive glazing comprising at least two sheets of glass, between which traditional diodes, with an individual envelope or made common, are inserted. For the power supply, a conductive layer deposited on the inner surface of one of the glass sheets. This conductive layer is divided into at least two distinct conductive zones, separated by a thin insulating line formed by laser etching or by screen printing with a mask system, each of the two zones being connected to a separate terminal. The LEDs are arranged in parallel, one of their terminals being in connection with the first conducting zone and the other terminal being in connection with the second conducting zone.

The present invention aims an alternative LED light structure, more reliable and / or simplified design, particularly at the level of the entire connection circuit (from the contacts to the power supply) to meet industrial requirements (in terms of performance, therefore cost, speed, automation ...), thus making it possible to produce products ^λ low cost 'without sacrificing performance.

The invention also proposes extending the range of products available, products with new functionalities and / or dedicated to new applications.

For this purpose, the present invention proposes a light-emitting diode light structure comprising:

a first dielectric element with a substantially plane main face associated with a first electrode,

a second dielectric element with a substantially plane main face associated with a second electrode which is opposite the first electrode and in a separate plane,

at least one first light-emitting diode, called the first LED, comprising:

a semiconductor chip comprising, on first and second opposite faces, first and second electrical contacts, the first electrical contact being in electrical connection with the first electrode, the second electrical contact being in electrical connection with the second electrode, and least the first element transmitting at least partially a radiation selected from ultraviolet and visible.

Thus the present invention provides an alternative light emitting diode light structure. According to the invention, it is chosen to incorporate between two dielectric elements one or LEDs having opposite contacts, therefore more spaced apart, which simplifies the connection by respectively associating them with electrodes on separate surfaces. This also makes it possible to overcome the need to form fine etching lines to separate polarities such as those provided in the prior art.

The light structure may be large, for example at least 1 m ² . In an advantageous embodiment, the first electrical contact is in direct electrical connection with the first electrode, and preferably the second electrical contact is in direct electrical connection with the second electrode. The electrical connections are said to be direct in the sense that the contacts and the electrodes are contiguous, no "intermediate" element of wire-type connection, pin being used, or preferably no direct solder, contact / electrode being used, a simple gluing with a conductive glue remaining however possible. Direct connections prevent any dissipation or short circuit, any risk of contact breakage, and the connection becomes invisible.

Furthermore, the first electrical contact may be in the form of at least one layer and preferably the second electrical contact may be in the form of at least one layer. In the present invention, the term layer may mean either a single layer or a multilayer. Thus, the contacts may be multilayer.

The contacts are not necessarily of similar size, in particular of the same width, nor be in the same material (s). A connection can be made substantially in the center of the contact or on an edge or be distributed substantially over the entire surface of the contact.

Preferably, the first LED is free of envelope, in particular individual, encapsulating the chip which makes possible the direct connection (s) and preferably the first LED consists of said chip, which simplifies the assembly and reduces the cost of the structure.

Naturally, the LED preferably does not include a lens or diffusing element, or even an individual base, for direct links.

By reducing the height of the LED preferably to that of a single chip, the structure according to the invention can also gain in compactness. The first LED may however include a partial protective envelope leaving the first and second contacts free, for example to protect the chip during handling or to improve the compatibility between the materials of the chip and other materials.

For the power supply, the light structure according to the invention may comprise current supply members coupled to the first and second electrodes and in particular in the form of conductive strips. silkscreen enamel silver preferably disposed on the edge of the first and / or second dielectric elements and, in particular on the edge of the main faces. It is also possible to use plugs, foils, cables, etc. The light structure according to the invention may comprise means for holding at least one of the direct links between the first and second electrodes and the first and second contacts, respectively. to increase reliability and / or longevity, including:

- mechanically, by applying pressure on at least one of the main faces, pressure controlled for example by a pressure sensor that can be associated or incorporated into the structure,

- or by using a conductive glue,

The light structure according to the invention may further comprise at least one elastic and / or flexible electroconductive piece arranged between the first electrical contact and the first electrode to ensure the permanence of the first electrical connection and preferably of the second electrical connection.

This elastic and / or flexible electroconductive member is preferably in the form of a spring, in particular a helical spring, (cone) conical, with blades, or a flexible tab folded at least in two (for example in U, in V). .)

The elastic and / or flexible electroconductive member makes it possible to overcome any fluctuations in the flatness of the first electrode or even, if appropriate, the variations in thickness of the chip-carrying element, for example a lamination interlayer.

Each first direct link (or each second direct electrical link) of such a piece is preferably equipped.

The elastic and / or flexible electroconductive member is preferably integral and can be glued or welded to the electrode and / or the contact.

The electroconductive part can be centered on the contact. This piece may also preferably be greater than or equal to the width of the contact.

The electroconductive part may be typically metal including copper or aluminum, and be thin. At least one of the first and second electrodes may also have one or more of the following additional functions:

- reflect the visible or the UV,

- reflect thermal radiation to provide solar control, or reflect infrared for a low emissivity function,

- Or to form an electrode of an optoelectronic element associated with the light structure (electrochromic, switchable mirror, especially in multilayer systems) for example to vary the color, transparency, transmission properties or reflection of light.

The structure can also integrate all functionalizations known in the field of glazing, either on the same face as that carrying an electrode, preferably the inner face of the associated dielectric element, or on an opposite face, or on faces other elements added. Among the functionalizations, mention may be made of: hydrophobic / oleophobic, hydrophilic / oleophilic layer, photocatalytic anti-fouling, thermal radiation (solar control) or infra-red (low-emissive) reflective stack, anti-reflective stack. Furthermore, at least one of the first and second electrodes may substantially cover the associated main face, in particular to facilitate and simplify the connections with the current supply members, for example located at the periphery.

At least one of the first and second electrodes may furthermore be chosen to be transparent or translucent, in particular for applications in the field of lighting.

At least one of the first and / or second electrodes may be solid in particular formed from contiguous leads (parallel, braided, etc.) or a metal sheet or ribbon (copper ...) to stick on. At least one of the first and second electrodes may comprise a conductive layer preferably distributed over or substantially covering the associated main face.

This conductive layer may be opaque, semi-transparent for example in screen-printed enamel, or transparent, starting from a conductive metal oxide or having electronic gaps in particular fluorinated tin oxide (SnO ₂ : F), mixed indium tin oxide

(ITO), zinc oxide doped with indium or aluminum.

This conductive layer may also be conductive polymer or be an adhesive. This conductive layer may be deposited by any means known to those skilled in the art such as liquid deposits, vacuum deposits

(magnetron sputtering, evaporation), by pyrolysis (powder or gaseous route), by screen printing, by ink jet.

In an advantageous embodiment, the light structure comprises a conductive thin layer, in particular a metallic, low emissivity layer and / or solar control layer, covered with one or more dielectric thin layers, and possibly interposed between thin dielectric layers, said thin layer conductor forming at least partly one of the first and second electrodes. Thus, this conductive thin layer, for example of a thickness of a few nanometers or ten nanometers, may be a (single) layer based on gold, palladium or preferably silver, optionally incorporating other minority metals.

The stack may comprise a plurality of conductive thin layers possibly with distinct functionalities (solar control for one layer and another lower emissive layer located further in).

The dielectric thin layer or layers above the (last) conducting layer, for example thick (s) of a few nanometers or ten nanometers, are for example based on the following materials:

nitride, carbonitride, oxynitride or silicon oxycarbonitride,

- metal oxides (for example zinc oxide, tin oxide) possibly doped. This or these dielectric layers are able to maintain electrical conduction between the conductive thin film and the contact of the chip for example because they are sufficiently thin and / or are sufficiently compressed in the electrical connection zone.

The stack is preferably transparent, is not necessarily symmetrical and preferably does not include a mechanical protection layer to promote electrical conduction. The two electrodes may comprise such a stack. This stack may be on glass or on a polymer such as PET.

Examples of stacks with a thin functional layer include the stacks described in EP718250, WO00 / 293477, EP877006 incorporated herein by reference.

Examples of stacks with several functional thin layers include the stacks described in EP847965, WO03 / 010105, EP1060876, WO01 / 20375 incorporated herein by reference. In one embodiment of the invention, at least one of the first and second electrodes comprises a conductive network which preferably substantially occupies the associated main face.

This conductive network may be in the form of a discontinuous conductive layer (opaque, semi-opaque, transparent) for example forming conductive strips. The layer areas can be isolated from each other by large insulating areas. The layered conductive network may be formed directly by deposition in predetermined areas or by removal of a solid layer.

This conductive network may be with linear conductive patterns, and not surface (broadband ...), for example each pattern forming at least one conductive line or being a conducting wire. The patterns can also be more complex in shape, including wavy, zig-zag etc. The shape, arrangement and extent of the patterns can be chosen according to the (predetermined) distribution of the LEDs. The electrode may comprise a plurality of wires or lines in the same orientation or different orientations ... A grid arrangement makes it possible to place the LEDs in a manner.

If necessary, limit the width of the wires (or lines):

to make the son as discreet as possible to the naked eye if the electrode material is relatively opaque to radiation, and / or

and / or to avoid damaging the radiation emission.

For example, a width 11 of the wire (or line) of less than or equal to 50 μm, preferably 20 μm or even 10 μm, is chosen. More broadly, this network can be defined by a width 11 of patterns (maximum width in case of plurality of widths) and a given pitch pi between patterns (not minimum in case of plurality of steps).

It is thus possible to obtain an overall transparency (UV or visible) by using a network of conductive patterns and adapting, depending on the desired transparency, the width 11 and / or pitch pi.

Also, the ratio of width 11 to pitch pi may be less than or equal to 50%, preferably less than or equal to 10%, even more preferably less than or equal to 1%. For example, the pitch pi may be between 5 μm and 2 cm, preferably between 50 μm and 1.5 cm, even more preferably 100 μm and 1 cm, and the width 11 may be between 1 μm and 1 mm, preferably between 10 μm and 10 μm. and 50 μm.

By way of example, it is possible to use an array of conductive lines, for example made of copper, with a pitch pi of 100 μm and a width 11 of 10 μm, arrayed on a sheet of glass or plastic, for example of the PET type.

A network of conductive lines can be obtained by inkjet.

It is also possible to use a network of conducting wires, by choosing a pi pitch between 1 and 10 mm, in particular 3 mm, and a width 11 between 10 and 50 μm, in particular between 20 and 30 μm. This network may be in the form of a series of son (parallel, corrugated, different orientations or not) which are integrated partially on the surface of a lamination interlayer, in particular PVB or PU. The electrodes can be hybrid, that is to say, layer and son.

Series of patterns can be crossed. The network can be organized in particular as a grid, a fabric, a canvas. These patterns may be metallic for example tungsten, copper or nickel.

The area between the chip contact and the electrode may comprise a pattern or a plurality of patterns connected to a same terminal.

When the two electrodes comprise patterns of conductive patterns, these patterns are not necessarily identical or coincidental. In projection, these patterns can form a mesh, in particular a grid for addressing the LEDs. The network may have an electrical continuity in which case all the patterns of the network are associated with the same terminal. Alternatively, all the patterns of the network are not associated with the same terminal and / or are not powered simultaneously.

The structure may preferably comprise a second position LED inverted with respect to the first LED. This makes it possible to carry out an LED addressing by LED or by zone of

LED, for lighting or partial display, punctual, dynamic LED

For example, two sets of conductive wires or conductive lines that are substantially parallel to each other and connected to separate terminals are chosen via silver screened peripheral screen-printed strips. More broadly, the structure may comprise a plurality of LEDs and LED control means for emitting the radiation either permanently or intermittently and either of a given color, or of different colors, or for addressing the LEDs.

Each of the first and second electrodes may comprise a network of conductive patterns, preferably elongate, linear, in a given orientation, these networks forming a projection mesh.

In addition, a series of LEDs can be provided.

In a first example, LEDs can be (pre) assembled on one or coplanar conductive supports, preferably thin, in particular of thickness less than or equal to 1 mm, or even 0.1 mm, support (s) forming part or forming one of the first and second electrodes.

In a second example, the structure comprises a plurality of first coplanar dielectric elements, carrying first electrodes and a plurality of first LEDs, the first dielectric elements being associated with a preferably mineral glass substrate, and preferably being thin in particular thickness less than or equal to 1 mm, or even 0.1 mm and may exceed the associated main face.

These first dielectric elements may be polyester sheets provided with solid conductive layers or conductive networks as electrodes. These first dielectric elements may be, for example, in the form of strips.

Moreover, at least one of the first and second dielectric elements comprises a glass element (mineral or organic) and preferably plane, this element being transparent or translucent or (semi) opaque and / or diffusing. In a structure configuration with a single luminous "face", for example that of the first dielectric element, the other dielectric element, the second dielectric element, the second in this example, may be arbitrary, possibly opaque, for example being a glass-ceramic, or even a non-dielectric. glass. The (partially) translucent character can be used to position the structure and / or to visualize or verify the functioning of the structure.

Preferably, the transmission factor (possibly global) of the dielectric element (s) and electrode (s) associated with the emitting surface around the peak of the visible radiation (produced directly by the chip or by a phosphor) is greater than or equal to 50%, even more preferably greater than or equal to 70%, and even greater than or equal to 80%.

The first and second dielectric elements may be of any shape (rectangular, square, round, oval, ...), or even slightly curved along the same radius of curvature and are preferably parallel.

At least one of the first and second dielectric elements can serve as mechanical protection, being sufficiently rigid, and / or chemical protection (against corrosion, moisture ...), and / or provide electrical insulation.

In a first example, at least one of the first and second dielectric elements comprises a glass sheet, in particular of 4 mm or less.

The glass may be of clear or extraclear silico-soda-lime glass, colored. The glass may have optionally previously undergone a heat treatment of the type hardening, annealing, quenching, bending. This glass can also be matted, sandblasted, screen printed, etc.

The structure can be essentially mineral especially for a high flow resistance, for example if the first LED is a power LED.

At least one of the first and second dielectric elements may form part of an insulating glazing unit, under vacuum, under argon, or with a simple air gap.

In particular, an electrode may be associated with a first or second element, selected glass, in different ways: by being directly on its surface, or - Being on a dielectric carrier element, assembled to the glass element so that the electrode is on the face opposite to the assembly face.

At least one of the first and second dielectric elements may be monolithic or laminated. This dielectric element may be formed in various combinations combining, for example, a mineral glass element (rigid, monolithic or laminated), and / or plastics (rigid, monolithic or laminated) or other resins capable of bonding by bonding with glass products . As rigid plastics, 0.1 to 10 mm thick, mention may be made of polyurethanes (PU), polycarbonates, acrylates such as polymethyl methacrylate (PMMA), polyesters, especially terephthalic polyesters (PET).

In a second example, at least one of the first and second elements comprises a polymeric film including polyethylene terephthalate (PET), especially between 10 and 100 microns.

In a third example, at least one of the first and second dielectric elements comprises an adhesive, for example is a heat-curable adhesive or UV or is a polymer which preferably forms a lamination interlayer with a mineral glass.

As usual lamination interlayer, mention may be made of polyurethane (PU) used as a flexible material, a plasticizer-free thermoplastic such as ethylene / vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), a copolymer of polyethylene and acrylate by example sold by Dupont under the name of Butacite or sold by Solutia under the name of Saflex. These plastics have, for example, a thickness between 0.2 mm and 1.1 mm, in particular 0.38 and 0.76 mm. These plastics can partially integrate the electrodes in their mass or carry the electrodes on the surface.

As other plastics, it is also possible to use polyolefins such as polyethylene (PE), polypropylene (PP) PEN or PVC or ionomer resins.

If necessary, it naturally ensures compatibility between different plastics used, including their good adhesion and / or their temperature resistance. Naturally, any aforementioned dielectric element is chosen to pass enough radiation (visible or UV) if it is disposed on a side for transmitting light.

In one embodiment of the invention, the portion delimited by the first element and the second element form a part (essentially) laminated.

In another embodiment of the invention, the first and second elements are maintained at substantially constant distances by means of peripheral seals (seal, glue, etc.), or by spacers and delimit an internal space incorporating said LED and filled of a dielectric.

This internal space may be under primary vacuum, to maintain the direct links, or this dielectric may be a resin preferably transparent or aesthetic. The LED may be arranged in a through hole of a third solid dielectric element interposed between the first and second dielectric elements.

The third dielectric is preferably thin for example of height less than or equal to 95% of the height of the LED, transparent, substantially plane, glass and may include a lamination interlayer.

The light structure comprises at least a second LED similar to the first LED and arranged in the hole, the height of the hole being slightly greater than the height of the semiconductor chip, when it is a spacer or any element whose surface melts at the time of assembly.

At least one of the first or second electrodes may be on the associated dielectric element or on this third dielectric element.

The LEDs preferably have a thickness less than or equal to 5 mm, or even 1 mm, even more preferably less than or equal to 0.5 mm, and the same for its width and length.

The structure may comprise at least one phosphor coating associated with one of the first and second dielectric elements, said radiation being exciter of the phosphor.

This phosphor coating may be on the main face associated with an electrode or on the opposite main face of said dielectric element.

The phosphor material may advantageously be selected or adapted to determine the color of the lighting in a wide range of colors. The phosphor or a mixture of phosphor can make it possible to obtain a white light, in particular from monochromatic LEDs in the visible or the near UV. All or part of the faces of at least one of the first and second dielectric elements may be coated with the phosphor material emitting in the visible to form illuminating areas and "dark" areas juxtaposed. And the phosphor can be itself transparent. The LED can also emit exciter UV radiation, for example UVC (between 200 and 280 nm).

For example, the phosphor is carried on a main face opposite to the face associated with an electrode and the dielectric element is a material transmitting the UV radiation chosen preferably from quartz, silica, magnesium fluoride (MgF ₂ ) or Calcium (CaF ₂ ), a borosilicate glass, a glass with less than 0.05% Fe ₂ O ₃ . As examples, for thicknesses of 3 mm: magnesium or calcium fluorides transmit more than 80% or even 90% over the entire range of UVs, quartz and some high purity silicas transmit more than 80% or 90% on the whole range of UVs.

The LED can also emit UV or near UV excitation radiation, that is to say between 360 and 400 nm.

For example, the phosphor is carried on a main face opposite the face associated with an electrode and the dielectric element is a material transmitting this UV radiation. preferably chosen from borosilicate glass, such as Schott borofloat, which transmits more than 70% over the entire range of UVA (for 3 mm thickness), silicosodocalcic glasses with less than 0.05% Fe III or Fe ₂ O ₃ (for 3 mm thickness), especially Saint-Gobain's Diamant glass, Pilkington's Optiwhite glass and Schott's B270 glass, transmit more than 70% or even 80% over the entire range of UVA (for 3 mm thick).

In addition, a soda-lime glass, such as Planilux glass sold by Saint-Gobain, has a transmission greater than 80% beyond 360 nm, which may be sufficient for certain embodiments and applications. At least one of the first and second electrodes may be based on a material transmitting said UV radiation or arranged to allow overall transmission to said UV radiation if the material is absorbent or UV reflective. The electrode material transmitting said UV radiation may be a very thin layer of gold, for example of the order of 10 nm, or of alkali metals such as potassium, rubidium, cesium, lithium or potassium, for example 0.1 at 1 μm, or an alloy, for example 25% sodium, and 75% potassium. A fluorine doped tin oxide layer may also be suitable.

Preferably, the chip can emit said radiation via the two opposite faces.

The structure may further have two "light faces" for passing said radiation out via the first and second main faces, or a single "light face", the other side being absorbent or reflective.

The structure may comprise a receiving diode of control signals, especially in the infrared, for remote control of the LED.

The structure according to the invention can be used for decorative, architectural, domestic or industrial lighting, in particular to form a flat luminaire such as an illuminating wall, in particular suspended, or an illuminating slab or a lamp, in particular of very small thickness. It can also have a function of night lighting or display information of any nature such as drawing, logo, alphanumeric signage or other signage, for example forming a sign-type sign ....

LEDs can be arranged at the edge or be distributed, regularly or not, over the entire surface of the structure according to the invention, and possibly constitute decorative patterns or constitute a display such as a logo or a mark. The light structure, in particular glazing, may be: intended for the building, intended for street furniture such as abribus, sign or advertising sign, an aquarium, a display, a showcase, a shelf element, a greenhouse, - intended for interior furnishing, a mirror, intended for a computer, television or telephone type display system screen, or else be electrically controllable like a liquid crystal glazing, and in particular be a device for backlighting an LCD screen, a photovoltaic glazing unit possibly with a system for ^power accumulation (battery), in particular for supplying electric power.

The structure according to the invention can be integrated for example in a household electrical appliance for example be a refrigerator shelf, a kitchen shelf.

The structure can also be used as a door, as office partition or store, balustrade, facade of buildings (chassis) or structural glazing fixed point (product type Spider sold by the company SAINT GOBAIN, ...), or like window of furniture, window of jeweler's stalls, window of museum.

The structure may preferably be transparent, at least outside of (s) zone (s) LED, for example form an illuminating window.

In addition, the LED or LEDs can be almost invisible to the naked eye, in the ^λ off state.

The light structure may form an illuminating glazing for a transport vehicle, for example windshield, rear window, side window sunroof or non-opening sunroof, rear-view mirror, or protective glass or any other land, water or air vehicle . The insertion of LEDs in these glazings makes it possible, in particular, the following signaling functionalities:

- display of indicator lights for the driver of the vehicle or the passengers (example: engine temperature warning lamp in the windshield, start-up indicator of the electric defrosting system, windows); display of warning lights for persons outside the vehicle (example: warning lamp for activating the vehicle alarm in the side windows); - illuminated display on the windows of vehicles (eg flashing light on emergency vehicles, safety display with low power consumption indicating the presence of a vehicle in danger).

The insertion of LEDs in automotive glazing allows, in particular, the following lighting functions: - Ambient lighting of the interior of the vehicle in a particularly aesthetic way (for example integration of the ambient lighting in the roof in glass of a vehicle);

- lights and headlight in the surface of the glazing (for example integration into the rear window of the vehicle of the third stop light).

The LED can be "high power" that is to say greater than 80 Lumens per 1000 mA.

To avoid glare, an element such as a diffuser can be added to the structure, especially in the form of an additional diffusing layer. At least one of the first and second dielectric elements can also fulfill this diffusing function.

The LED can be of less power, without risk of discomfort for the eye, that is to say less than 20 Lumens per 100 mA.

Illumination providing from 10 to 500 lumens, preferably from 20 to 250 lumens, from 30 to 100 lumens can be achieved economically.

The invention also relates to a plastic sheet, in particular a thermoplastic sheet such as PVB, EVA or PU, or a polyethylene-acrylate or polyolefin copolymer, comprising at least one through-hole in its thickness, said hole comprising at least one minus a first light-emitting diode with a semiconductor chip having first and second electrical contacts respectively on opposite first and second faces.

Naturally, this sheet may preferably be transparent and / or may serve as a lamination interlayer.

The invention finally relates to a method of manufacturing the light structure as defined above comprising the following steps:

positioning the first electrical contact of the first LED directly on the first electrode or via a conductive adhesive and / or an elastic or flexible electroconductive piece, - Positioning the second electrode directly on the second electrical contact or via a conductive adhesive.

This method, simple to implement, allows direct electrical connection of the first and second electrical contacts with the first and second electrodes respectively.

This method may comprise a subsequent step of primary vacuum of the structure comprising said internal space, to strengthen the electrical connections, for example a pressure of the order of 200 mbar. This method may comprise a subsequent step of injecting a dielectric liquid resin between the first and second electrodes and on either side of the chip, in order to protect and / or better immobilize and / or isolate the chip.

This injection is preferably carried out under a primary vacuum. Said third dielectric element may be chosen as a lamination interlayer and said insertion step may be carried out hot, preferably at the time of a hot forming step of said hole.

- Figure 1 shows schematically a sectional view of an LED light structure in a first embodiment of the invention.

FIG. 2a is a detail of FIG. 1,

- Figures 2b, 2c show schematically partial views of section of LED light structures in variants of the first embodiment of the invention. - Figures 3a, 3b schematically show top views of the LED light structure of the first embodiment of the invention and one of its variants.

FIG. 4a schematically represents a sectional view of an LED light structure in a second embodiment of the invention and FIG. 4b is a detail of one of the conductive networks used as an electrode in this second mode.

- Figure 5a schematically shows a sectional view of an LED light structure in a third embodiment of the invention. FIG. 5b is a detail of FIG. 5a. • Figure 5c schematically shows a partial sectional view of an LED light structure in a variant of the third embodiment of the invention.

- Figure 6a schematically shows a sectional view of an LED light structure in a fourth embodiment of the invention.

FIG. 6b is a detail of FIG. 6a.

- Figure 6c shows schematically a partial sectional view of an LED light structure in a variant of the fourth embodiment of the invention.

FIG. 7 schematically represents a sectional view of an LED light structure in a fifth embodiment of the invention.

- Figure 8 schematically shows a sectional view of an LED light structure in a variant of the fifth embodiment of the invention.

• Figure 9 schematically shows a partial sectional view of an LED light structure in a sixth embodiment of the invention. - Figure 10 schematically shows a partial sectional view of an LED light structure in a variant of the sixth embodiment of the invention.

• Figure 11 schematically shows a partial sectional view of an LED light structure in a seventh embodiment of the invention.

- Figure 12 schematically shows a partial sectional view of an LED light structure in a variant of the seventh embodiment of the invention.

• Figure 13 schematically shows a partial sectional view of an LED light structure in an eighth embodiment of the invention.

- Figures 14 and 15 schematically show partial sectional views of an LED light structure in variants of the seventh embodiment of the invention. • Figure 16 schematically shows a partial view of an LED light structure capable of addressing the LEDs. FIG. 17 schematically represents a partial sectional view of an LED light structure in a ninth embodiment of the invention.

It is specified that for the sake of clarity the various elements of the objects represented are not necessarily reproduced on the scale.

Other details and advantageous features of the invention appear on reading the examples of LED light structures illustrated by the following figures.

FIG. 1 schematically represents a sectional view of an LED light structure 100 in a first embodiment of the invention and FIG. 2a is an enlarged view of a portion of FIG. 1, FIG. 3a is a view from below the structure 100.

This structure emits, via the external faces 11a, 11b (emission symbolized by the two arrows), first and second sheets 1a, 1b made of preferably soda-lime and extraclear glass, for example 4 mm thick.

On their inner faces 12a, 12b, the first and second glass sheets comprise transparent conductive layers based on fluorine-doped tin oxide 2a, 2b connected to separate terminals.

Between these layers 2a, 2b are arranged a sufficient number of LEDs

4 to obtain the desired light effect. The LEDs are isolated from each other by transparent dielectric 3 and preferably thin, for example of height less than or equal to 95% of the height of the LEDs. Preferably, the dielectric 3 is a lamination interlayer such as a PVB.

More precisely, as shown in FIG. 2, each of the LEDs 4 is disposed in an individual through-hole 31 of the insert 3.

Each LED preferably comprises simply a semiconductor chip 4, for example with a quantum multiwell active layer, of AIInGaP technology or other semiconductors.

The LED is for example monochromatic. All colors are conceivable. You can also adjust the power via the power supply.

This chip comprises first and second contact layers 41, 42 on its opposite faces, for example in the form of an Au / Zn multilayer and Al for one and Au / Ge alloy for the other. Suitable chips are for example sold under the names Alingap LEDs HWFR-B310, 410 and 510 by Lumileds.

To reduce costs, limit and simplify the connections, the chip 4 is therefore chosen without encapsulation and the first and second contact layers 41, 42 are respectively directly on the first and second conductive layers 2a, 2b.

The connection circuit is completely invisible even when using two sheets of extraclear glass.

Alternatively, a simple conductive adhesive, for example silver, is interposed between the first and second contacts and the first and second layers. The glue must be chosen for its resistance to the high temperatures and pressure necessary to produce the laminated glazing.

The risks of creep of the glue are less critical than in the prior art in which it was necessary to scrupulously ensure that it does not spread in the insulating strip during laminating of the laminate.

Thanks to their small size, when the device is off, the LEDs are practically not visible. It is therefore particularly conceivable to have the LEDs, not only around the glazing but also on the central part or on a large part of the glass surface without hindering the visibility, as shown in FIG. 3a in which, for the sake of clarity the first dielectric element 1a and the layer 2a are omitted to visualize the lamination interlayer 3 with the LEDs 4 in plan view.

Current feed members, for example in the form of screen-printed conductive strips 50 (some of which are dashed in FIG. 3a) are arranged on the longitudinal edges of the inner main faces of the glass sheets so as to be coupled to the electrodes.

In this first embodiment, the LEDs are arranged in series. The voltage applied between the electrodes is of the order of volts or ten volts, preferably less than or equal to 24 volts.

LEDs can form a luminous pattern, for example a logo or a mark.

By inserting a large number of LEDs, a luminous intensity equivalent to that of incandescent lighting can be obtained, while requiring only a lower consumption. This structure can be used for example for decorative lighting or signaling, for example as a panel or light partition.

Alternatively, the glass sheet intended to be outside may be a colored glass sheet. This type of laminated glass is particularly suitable for making a car roof. Its light transmission (TL) can thus be lowered to 14% and its energy transmission (TE) to 11%.

One of the LEDs can be replaced by an LED used to remotely control the structure, receiving signals in the infrared. One or more transparent conductive layers can be in a stack, and be silver layers.

The structure according to the invention is not necessarily symmetrical. It is possible to use separate dielectric elements, electrodes of distinct material or of different technology. In a first example, one of the transparent layers may be replaced by a semi-transparent layer (screen-printed), by a mirror layer, for example in silver, or by a colored opaque layer (enamel, etc.), for example to make the layers transparent. LEDs invisible on one side of the structure.

In a second example, one of the transparent layers may be replaced by a network of conductive patterns including wires or lines.

In a third example, it is possible to engrave layer areas. At least one of the main faces of the glass sheets may comprise a solar control layer, low emissivity, self-cleaning ...

Different types of LEDs can be provided. At least one of the LEDs may emit exciting radiation a phosphor added to one of the main faces, for example a UVA or UVC radiation.

An example of manufacture of the structure comprises the following steps: supply of glass sheets coated with transparent conductive layers (or deposits of layers on bare glass sheets), optional pre-bonding by placing glue points on the predefined areas of the glass. one or both sheets of glass, - realization of the individual holes by localized heating and hot insertion of the LEDs in these holes, autoclaving of the structure according to a cycle well known to those skilled in the art.

In a first variant, shown in FIG. 2b, the structure 100 "differs in the following manner from the structure 100: the LEDs are serially aligned and pre-assembled on preferably thin coplanar dielectric supports 51 (PET sheets, for example) and each coated with a conductive layer 2b (or any other type of electrode), each series of LEDs is inserted into a common through hole 31 ', for example a rectangular groove, this groove being able to open on at least one one of the edges and being filled with a transparent or aesthetic resin 52 after arrangement of the LEDs, just like the space between the supports 51 'The width of the supports 51' may be identical to or greater than that of the LEDs. are assembled for example by thin layers of glue (not shown) to the glasses Ia, Ib.

The grooves may be of sufficient height to incorporate the supports and in this case, the grooves are preferably outlets or edges where the electrodes are connected.

The face 11b may or may not transmit light. Mixed arrangements, with individual holes and common holes, can be provided.

FIG. 3b shows a second variant of the structure 100 in which, for the sake of clarity, the first dielectric element 1a and the layer 2a are omitted to display the lamination interlayer 3 with the LEDs 4 in plan view.

The structure 100 'differs in the following way: the LEDs are serially aligned and pre-assembled on conductive thin-film coplanar conductor supports 51 replacing (or in addition to) the first conductive layer 2b, and preferably exceeding at least one longitudinal edge of the main face to facilitate the power supply, or both edges for a homogeneous distribution, each series of LEDs is inserted into a common through hole 31 'of the insert 3, for example a rectangular groove, for example with rounded edges, groove filled with a transparent or aesthetic resin 52 after arrangement of the LEDs.

The conductive supports 51 are for example connected to a same terminal. The conductive supports 51 are assembled for example by thin layers of glue (not shown) to the glasses Ia, Ib.

The width of the conductive supports 51 may be identical to or greater than that of the LEDs.

The grooves may be of sufficient height to incorporate the conductive supports and in this case, the grooves are preferably open on the edge or edges where the conductive supports are fed. Mixed arrangements, with individual holes and common holes, can be provided.

The face 11b may or may not transmit light. One or more sets of LEDs can be reversed positions (the chips are then returned) and be fed with reverse polarities. This allows in particular to be able to alternate lighted areas and extinguished areas with adequate control means.

In a third variant, shown in Figure 2c, the structure 100 '"differs in that the chip comprises a partial envelope 43 leaving the free contacts 41, 42 serving for example to protect the chips during assembly.

Figure 4a schematically shows a sectional view of an LED light structure 200 in a second embodiment of the invention. The structure 200 differs from the structure 100 in the following way: the transparent conductive layers are replaced by networks of generally transparent conductive patterns 20a, 20b, these networks are carried by PET sheets, preferably thin and assembled for example by thin layers of glue

HOa, 110b or alternatively by lamination interleaves. These networks 20a, 20b are in the form of copper conductor lines for example forming an electrical continuity, and are for example organized in a grid as shown in Figure 4b. In this configuration, each network 20a, 20b is connected to a single terminal for example via four screen-printed strips (two lateral and two longitudinal) periphery of each main face 12a, 12b.

Between these networks 20a, 20b are arranged a sufficient number of LEDs 4 to obtain the desired light effect.

Alternatively, each network is formed of a single series of parallel lines or not, depending on the distribution of LEDS on the main faces. The lines of a network are connected for example to a single terminal for example via two screen-printed strips at the periphery of two opposite edges of its inner main face 12a, 12b.

The conductive lines are for example sufficiently thin and / or spaced for overall transparency.

Lines of a network can also be connected to separate terminals for addressing etc.

Variants similar to those described for the first embodiment may be provided (asymmetry of the structure, common hole, coplanar supports, partial encapsulation, opaque layer, mirror, additional solar control type functions). Mixed arrangements, with individual holes and common holes, with different categories of LEDs, can be included.

Figure 5a schematically shows a sectional view of an LED light structure 300 in a third embodiment of the invention.

The structure 300 differs from the structure 100 in the following way: the transparent conductive layers are replaced by networks 30a, 30b of conductive wires 32a these wires being partially inserted into additional lamination interleaves 3a, 3b or in any other suitable dielectric material .

The son of each network 30a, 30b are connected for example to a single terminal for example via two screen-printed strips at the periphery of two opposite edges of the associated internal main face. The networks are pre-assembled on the elements 3a, 3b or intercalated at the time of assembly of the structure.

Between these arrays 30a, 30b are arranged a sufficient number of LEDs 4 to obtain the desired light effect. Variants similar to those described for the first embodiment may be provided (asymmetry of the structure, common hole, coplanar supports, partial encapsulation, opaque layer, mirror, additional solar control type functions, etc.). Mixed arrangements, with individual holes and common holes, with different categories of LEDs, can be included.

In a variant, shown in FIG. 5c, the structure 300 'differs from the structure 300 in the following manner.

Each network of conducting wires 32a 'is pre-assembled in the PVB 3' or inserted at the time of assembly between the PVB 3 'and the second laminating interlayer 3'a so as to be in direct connection with the associated contact 41 via a conductive adhesive layer 33.

Figure 6a schematically shows a sectional view of an LED light structure 400 in a fourth embodiment of the invention.

The structure 400 differs from the structure 100 as follows:

the sheets of glass are replaced by plates a, b of PMMA, the transparent conductive layers are replaced respectively by a conductive polymer layer 2'a and a mirror layer 2'b, the plate b can then be opaque, semi opaque,

- The lamination interlayer 3 is replaced by a non-adhesive solid dielectric 3 ', preferably thin and transparent, for example a thin glass or a PET.

As shown in FIG. 6b, each LED is inserted in a hole 31 'of the PET 3' and attached laterally by a dielectric glue 6.

The contacts 41, 42 may be further connected to the layers 2'a, 2'b by points of conductive adhesive 6a, 6b. Between these conductive surfaces 2'a, 2'b are arranged a sufficient number of LEDs 4 to obtain the desired light effect.

The structure 400 emits a radiation in the visible only by the face 11a (symbolized by the single arrow) for example for use as illuminating slab, ceiling, or as wall lighting or be integrated into a household electrical appliance.

In a variant, shown in FIG. 6c, the conductive layers are replaced by adhesive layers 2 "a, 2" b which are sufficiently conductive and thin to be transparent, the contacts then being embedded in these adhesive layers 2 "a, 2" b.

Moreover, the thickness of the solid dielectric 3 'is for example lower than that of the LED.

Variants similar to those described for the first embodiment may be provided (asymmetry of the structure, common hole, coplanar supports, partial encapsulation, opaque layer, mirror, additional solar control type functions, etc.). Mixed arrangements, with individual holes and common holes, with different categories of LEDs, can be included.

Figure 7 schematically shows a sectional view of an LED light structure 500 in a fifth embodiment of the invention.

This light structure 500 comprises first and second plates 1a, 1b of glass and each having an outer face 11a, 11b and an inner face 12a, 12b.

The structure 500 emits radiation in the visible by the two outer faces. On the internal faces 12a, 12b are arranged first and second electrodes 2a, 2b conductive coating preferably transparent for example fluorinated tin oxide tin. The plates Ia, Ib are associated with facing their internal faces 12a, 12b and are assembled via a sintering frit 7, for example a glass frit thermal expansion coefficient neighbor that of the plates of La, Ib glass such as lead frit. Alternatively, the plates are assembled by an adhesive for example silicone or by a heat-sealed glass frame. These modes of Sealing is preferable if plates 1a, 1b are chosen with different coefficients of expansion. Indeed, the plate Ib may be glass material or more largely dielectric material suitable for this type of structure, translucent or opaque (if we condemn the lighting on this side).

The surface of each glass plate la, Ib is for example of the order of Im ² or even beyond, and their thickness of 3 mm. A silicosodocalcic glass, preferably extraclear, is chosen. The plates are for example rectangular. The spacing between the glass plates is fixed by the LEDs arranged between the plates, in an internal space 8. In the internal space, between the LEDs there is a primary vacuum, for example of the order of 200 mbar allowing to maintain firmly the direct links.

The first glass plate has it near the periphery a hole 81 pierced in its thickness, a few millimeters in diameter whose outer orifice is obstructed by a sealing pad 82, in particular copper welded to the outer face 31.

This structure is essentially mineral so it is particularly suitable for power LEDs. Alternatively, the structure 500 emits radiation in the visible only by the face 11a for example for use as illuminating slab, ceiling, or wall lighting, or as backlighting a liquid crystal matrix.

Variations similar to those described for previous embodiments may be provided (dissymmetry of the structure, conductor son networks, coplanar supports preferably of mineral nature, opaque layer, mirror, addition of coating (s) of material (s). phosphor (s), uses of LED emitting in the UV, additional functions of type solar control ...). Mixed arrangements, with individual holes and common holes, with different categories of LEDs, can be included.

The current leads can also be of the "bus bar" type disposed at the periphery of the faces 12a, 12b as already described above.

FIG. 8 shows a variant of the structure 500. This structure 500 'differs in the absence of the vacuum hole 81 and the pellet 82. The vacuum is in fact made by a system of hollow needles F for example of metal.

Figure 9 schematically shows a partial sectional view of an LED light structure 600 in a sixth embodiment of the invention. This structure 600 differs from the structure 500 in that the transparent conductive layers are replaced by networks of conductive lines 20a, 20b similar to those described in connection with Figure 4a.

Figure 10 schematically shows a partial sectional view of an LED light structure 600 'in a variant of the fifth embodiment of the invention.

This structure 600 'differs from the structure 500 in that the transparent conductive layer 2b covering the entire inner face 12b is replaced by coplanar dielectric supports 51 "(preferably mineral based for high power, for example thin glasses of 0 1 to 0.3 mm thick) coated with transparent conductive layers 2b Alternatively, conductive supports are selected.

Figure 11 shows schematically a partial sectional view of an LED light structure 700 in a seventh embodiment of the invention.

This structure 700 differs from the structure 500 'in that a transparent dielectric resin 81 is injected, preferably under a primary vacuum, into the internal space 8 using a system of hollow needles F1, F2.

Figure 12 shows schematically a partial sectional view of an LED light structure 700 'in a variant of the seventh embodiment of the invention.

This structure 700 'differs from the structure 700 as follows:

the LEDs 4 'emit UV radiation, for example UVA,

the layers 2'a, 2'b are chosen to sufficiently transmit the UVA, these layers are disposed on the inner faces of thin and transparent dielectric elements with UVA 91a, 91b, for example specific glasses already described above,

- The phosphor coatings 92a, 92b emitting in the visible are deposited on the outer faces of the elements 91a, 91b.

This structure can be asymmetrical (a single phosphor ...). LEDs can also emit in the visible and the coating (s) can be used to produce a white light.

Figure 13 schematically shows a partial sectional view of an LED light structure 800 in an eighth embodiment of the invention.

This structure 800 comprises in this order, vertically:

a first sheet of PET glass 10a, or any other dielectric substrate, for example flexible, this sheet carrying: a first network of conductive lines 20a as already described, LEDs separated from each other by dielectric resin 82 and of which the first contact 41 is in direct connection with the network 20a,

a second network of conductive lines 20b preferably similar to the first and in direct connection with the second contact 42, a second sheet of PET glass 10b, or any other dielectric substrate.

This structure can be sold alone, cut and / or, for greater strength, be laminated between two glasses 1a, 1b with PVB 3a, 3b as shown in FIG.

Figure 15 schematically shows a partial sectional view of an LED light structure 900 in a variant of the seventh embodiment of the invention.

This structure 900 differs from the structure 800 in that the first and second sheets of PET 10a, 10b are replaced by sheets of glass Ia, Ib and / or the networks are replaced by transparent layers

2a, 2b. Figure 16 shows a schematic top view of an LED light structure 650 capable of addressing the LEDs.

This structure 650 is a variant of the structure 600 shown in FIG.

The first sheet of glass comprises on its inner main face a "first" network 20'a of conductive lines L1 to L4 (or alternatively son) parallel to the side edges, for example conductive lines obtained by ink jet in particular based on silver or copper.

The second glass sheet Ib comprises on its inner main face a "second" network 20'b conductive lines C1 to C4 (or son) parallel to the longitudinal edges for example conductive lines obtained by ink jet. Between these sealed glass sheets are arranged LEDs with opposite contacts and arranged on the lines (or son) of each network 20'a, 20'b.

More precisely, to selectively switch on certain LEDs 4 _lr 4 ₂ , 4 ₃ ,

4 ₃ independent control means are provided for each line or group of lines. In the illustrated example, the lines L1 and L3, C1 and C3 (shown in bold for this purpose) are fed to light the LEDs 4i, 4 ₂ , 4 ₃ , 4 ₃

(represented in black) which are positioned at the crossings of these lines.

Moreover, these lines are arranged and / or are sufficiently thin for a global transparency.

Similarly, each line can be replaced by two lines and the LEDs are on these lines. In addition, the LEDs can be off-center with respect to line crossings.

In a variant, the electrodes are formed of conductive strips, preferably transparent, separated by insulating strips, conductive strips parallel to the longitudinal edges for the first network and parallel to the side edges for the second network.

FIG. 17 schematically represents a partial sectional view of an LED light structure 550 in another variant of the structure of the fifth embodiment of the invention presented in FIG. 9. This structure 550 differs from the structure 500 in that the transparent layers 2a, 2b are functional thin conducting layers, in particular metallic, preferably silver, arranged between thin dielectric layers 2c, 2d which are:

optionally a blocking layer directly on the metal-based silver layer, a stoichiometric metal oxide alloy of a metal, a metal alloy,

a layer based on a metal oxide, for example zinc oxide optionally doped with aluminum and / or a layer of silicon nitride.

In this example, the thin dielectric layers 2d are compressed at the contacts 41 of the chip 4. Naturally, this type of stack can be used in variants of other embodiments.

In all the embodiments, conductive glue can be provided between the contacts and the associated electrodes.

Claims

1. Light structure (100, 100 ', 100 ", 100'", 200, 300, 300 ', 400, 400', 500, 550, 500 ', 600, 650, 600', 700, 700 ', 800, 850, 900) with light-emitting diode comprising:

a first dielectric element (la, a, 10a) with a substantially plane main face (12a) associated with a first electrode (2a, 2'a, 20a, 2 "a, 20'a, 30a);

a second dielectric element (Ib, b, 10b) with a substantially plane main face (12b) associated with a second electrode

(2b, 2'b, 2 "b, 20b, 20'b, 30b) which is opposite the first electrode and in a separate plane;

at least a first light-emitting diode, called the first LED (4, 4i to 4 ₄ ), comprising a semiconductor chip (4) comprising, on first and second opposite faces, first and second electrical contacts (41, 42) ; the first electrical contact being in electrical connection with the first electrode, the second electrical contact being in electrical connection with the second electrode, at least the first element transmitting at least partially a radiation comprised in the ultraviolet, said UV, or the visible.

2. Light structure (100, 100 ', 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to the claim Characterized in that the first electrical contact (41) is in direct electrical connection with the first electrode (2a, 2'a, 20a, 2 "a, 20'a,

30a), and preferably the second electrical contact (42) is in direct electrical connection with the second electrode (2b, 2'b, 2 "b, 20b, 20'b, 30b).

3. Light structure (100, 100 ', 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to the one of claims 1 to 2 characterized in that the first electrical contact (41) is in the form of at least one layer and preferably the second electrical contact (42) is in the form of at least one layer.

4. Light structure (100, 100 ', 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to the one of claims 1 to 3 characterized in that the first LED (4, 4i to 4 ₄ ) is free of envelope encapsulating the chip and preferably the first LED (4, 4i to 4 ₄ ) consists of said chip.

5. Light structure (100 '") according to one of claims 1 to 3, characterized in that the first LED (4) comprises a partial protective envelope (43) leaving the first and second contacts free

(41, 42).

6. Light structure (100) according to one of claims 1 to 5, characterized in that it comprises current supply members (50) coupled to the first and second electrodes (2a, 2b) and in the form of strips. screen printed conductors.

7. Light structure (100, 100 ', 100 ", 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to one of claims 1 to 6, characterized in that it comprises means for maintaining at least one of the direct links between the first and second electrodes and respectively the first and second electrical contacts.

8. Light structure (500, 550, 500 ', 600, 650, 600', 700, 700 ', 800, 900) according to claim 7, characterized in that the holding means correspond to a controlled pressurization of at least one of the main faces (la, Ib).

9. Light structure according to one of claims 1 to 8, characterized in that it comprises at least one elastic and / or flexible electroconductive member disposed between the first electrical contact and the first electrode to ensure the permanence of at least the first electrical connection, and in that, preferably, said piece is in the form of a spring or a flexible tab folded at least in two.

10. Light structure (100, 100 ', 100 ", 400, 400', 500, 550, 500 ', 650, 700, 700') according to one of claims 1 to 9, characterized in that at least l one of the first and second electrodes comprises a conductive layer (2a, 2'a, 2b, 2'b) preferably distributed over or substantially covering the associated main face.

11. Light structure (550) according to one of claims 1 to 10, characterized in that it comprises a conductive thin layer (2a), in particular metal, low emissive and / or solar control, covered with one or thin dielectric layers (2d), and optionally interposed between dielectric layers (2c, 2d), said conductive thin film forming at least in part one of the first and second electrodes (2a).

Light structure (200, 300, 300 ', 500, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to one of claims 1 to 11, characterized in that at least one of the first and second electrodes comprises a conductive network (20a, 20'a, 30a, 20b, 20'b, 30b) preferably with linear patterns and preferably substantially occupying the associated main face.

13. Light structure (300, 300 ') according to one of claims 1 to 12, characterized in that at least one of the first and second electrode comprises a conductive network with conductive son (30a, 30b, 32a, 32b) partially integrated in the associated main face.

14. Light structure according to one of claims 1 to 13 characterized in that it comprises at least a second LED similar to the first LED and in that the second LED has a reversed position relative to the first LED.

15. Light structure according to one of claims 1 to 14 characterized in that it comprises a plurality of LEDs and control means of the LEDs for emitting the radiation either permanently, or intermittently and of a given color, either of different colors or for LED addressing.

16. Light structure (650) according to one of claims 1 to 15, characterized in that each of the first and second electrodes comprises an array of conductive patterns (20'a, 20'b) in a given orientation, these networks forming in projection a mesh.

17. Light structure (100 ') according to one of claims 1 to 16, characterized in that it comprises a plurality of LEDs, and in that the LEDs are assembled on one or coplanar conductive supports (51), making part or forming one of the first or second electrodes and preferably being thin and / or protruding from the associated main face.

18. Light structure (100 ") according to one of claims 1 to 16, characterized in that it comprises a plurality of first coplanar dielectric elements carriers (51 ', 51") of first electrodes (2b) and with a plurality first LEDs, the first dielectric elements being associated with a glass substrate (Ib).

19. Light structure (100, 100 ', 100 ", 200, 300, 300', 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 850, 900) according to one of claims 1 to 18, characterized in that at least one of the first and second dielectric elements comprises a glass element (la, Ib) and preferably planar.

20. Light structure (100, 100 ', 100 ", 200, 300, 300', 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 900) according to one of Claims 1 to 19, characterized in that at least one of the first and second dielectric elements comprises a glass sheet preferably made of clear or extraclear silico-soda-lime glass.

21. Light structure (550, 500 ', 600, 650, 600') according to one of claims 1 to 20, characterized in that it is essentially mineral.

22. Light structure (200, 300, 300 ', 800, 850) according to one of claims 1 to 20, characterized in that at least one of the first and second dielectric elements comprises a polymeric film (3a, 3b , 10a 20b), preferably PET.

23. Light structure (200, 300, 300 ', 400, 800, 850) according to one of claims 1 to 20, characterized in that at least one of the first and second dielectric elements comprises an adhesive (3a, 3b, HOa,

110b) or preferably comprises a lamination interlayer.

24. Light structure (100, 100 ', 100 ", 200, 300, 300', 400, 400 ', 800, 850, 900) according to one of claims 1 to 20, characterized in that the portion delimited by the first dielectric element and the second dielectric element forms a substantially laminated part.

25. Light structure (500, 550, 500 ', 600, 650, 600', 700, 700 ') according to one of claims 1 to 21, characterized in that the first and second dielectric elements are maintained at a substantially constant distance. and delimit an internal space (8) filled with a dielectric (81) and incorporating said first LED (4).

26. Light structure (550, 500 ', 600, 600') according to claim 25, characterized in that the internal space (8) is under primary vacuum.

27. Light structure (600, 600 ') according to claim 25, characterized in that the dielectric comprises a resin (81).

28. Light structure (100, 100 ', 100 ", 100'", 200, 300, 300 ') according to one of claims 1 to 24, characterized in that the first LED is arranged in a through hole (31, 31 ') of a third solid dielectric element (3) interposed between the first and second dielectric elements.

29. Light structure (100 ', 100 ") according to claim 28, characterized in that it comprises at least a second LED similar to the first LED and arranged in the hole (31').

30. Light structure (100, 100 ', 100 ", 200, 300, 300') according to one of claims 28 to 29 characterized in that the third dielectric element (3) comprises a lamination interlayer.

31. Light structure (500, 700 ') according to one of the preceding claims, characterized in that it comprises at least one phosphor coating (92a, 92b) associated with one of the first and second dielectric elements (la, Ib ) and that said radiation is exciter of the phosphor.

32. Light structure (100, 100 ', 100 ", 200, 300, 300', 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to the one of the preceding claims, characterized in that the chip emits via its two opposite faces.

33. Light structure (100, 100 ', 100 ", 200, 300, 300', 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to the one of the preceding claims, characterized in that the structure is substantially transparent outside zone (s) with LED.

34. Light structure (100, 100 ') according to one of the preceding claims, characterized in that it comprises a receiving diode of control signals, particularly in the infrared, for remote control of the first LED.

35. Light structure (100, 100 ', 100 ", 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850, 900) according to one of the preceding claims, characterized in that it forms an illuminating glazing, decorative, architectural, display, signaling.

36. Application of the light structure (100, 100 ', 100 ", 200, 300, 300', 400, 400 ', 500, 550, 500', 600, 650, 600 ', 700, 700', 800, 850 900) according to one of the preceding claims to a structure, in particular a glazing, intended for the building, such as an illuminating window or a building facade or a structural glazing, to a photovoltaic glazing, to a transport vehicle, such as rear window, side window or roof car, any other land, water or air vehicle, street furniture such as abribus, billboard, signage or advertising, a display, a showcase, a shelf element, an aquarium, a showcase , greenhouse, interior furnishing, partition, mirror, computer display screen, television, telephone, electro-setting system, LCD backlight , to a structure integrated into a piece of household equipment, such as a refrigerator shelf, kitchen shelf.

37. Plastic sheet (100, 100 ', 100 ", 200, 300, 300', 400, 400 '), in particular thermoplastic of the PVB, EVA or PU type, or of polyethylene-acrylate or polyolefin copolymer, comprising at least one through hole in its thickness, said hole comprising at least a first light-emitting diode (4, 4i to 4 ₄ ), with a semiconductor chip (4) having, on first and second opposite faces, first and second electrical contacts (41, 42).

38. A method of manufacturing the light structure according to one of claims 1 to 36 comprising the following steps:

positioning the first electrical contact of the first LED directly on the first electrode or via a conductive adhesive and / or an elastic and / or flexible electroconductive piece;

- Positioning the second electrode directly on the second electrical contact or via a conductive adhesive, for a direct electrical connection of the first and second electrical contacts with the first and second electrodes respectively.

39. A method of manufacturing the light structure according to claim 38 comprising a subsequent step of primary vacuum of the structure comprising said internal space.

40. A method of manufacturing the light structure according to one of claims 38 to 39 characterized in that it comprises a subsequent step of injecting a dielectric liquid resin (under vacuum) between the first and second electrodes, from and other of the chip.

41. A method of manufacturing the light structure according to claim 38 characterized in that it comprises a prior step of insertion of said first LED in the through hole of said third dielectric element.

42. A method of manufacturing the light structure according to claim 41 characterized in that said third dielectric element is chosen interlayer lamination and in that said insertion step is carried out hot, preferably at the time of a training step hot said hole.