EP1951445A2 - Arrayed ultrasonic transducer - Google Patents
Arrayed ultrasonic transducerInfo
- Publication number
- EP1951445A2 EP1951445A2 EP06827415A EP06827415A EP1951445A2 EP 1951445 A2 EP1951445 A2 EP 1951445A2 EP 06827415 A EP06827415 A EP 06827415A EP 06827415 A EP06827415 A EP 06827415A EP 1951445 A2 EP1951445 A2 EP 1951445A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- stack
- ultrasonic transducer
- kerf
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004891 communication Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 557
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 173
- 238000000034 method Methods 0.000 description 59
- 239000000463 material Substances 0.000 description 53
- 239000002131 composite material Substances 0.000 description 36
- 239000004593 Epoxy Substances 0.000 description 28
- 229920001486 SU-8 photoresist Polymers 0.000 description 26
- 230000000670 limiting effect Effects 0.000 description 23
- 230000004044 response Effects 0.000 description 22
- 230000008569 process Effects 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 19
- 238000013461 design Methods 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 18
- 230000036961 partial effect Effects 0.000 description 17
- 229920000642 polymer Polymers 0.000 description 16
- 238000004458 analytical method Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000012790 adhesive layer Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000010931 gold Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- 238000003491 array Methods 0.000 description 8
- 238000005459 micromachining Methods 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000011065 in-situ storage Methods 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007736 thin film deposition technique Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- -1 for example Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 206010044334 Trance Diseases 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005289 physical deposition Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 238000010171 animal model Methods 0.000 description 1
- ISQINHMJILFLAQ-UHFFFAOYSA-N argon hydrofluoride Chemical compound F.[Ar] ISQINHMJILFLAQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000012285 ultrasound imaging Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73309105P | 2005-11-02 | 2005-11-02 | |
| PCT/US2006/042889 WO2007067282A2 (en) | 2005-11-02 | 2006-11-02 | Arrayed ultrasonic transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1951445A2 true EP1951445A2 (en) | 2008-08-06 |
Family
ID=37891998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06827415A Withdrawn EP1951445A2 (en) | 2005-11-02 | 2006-11-02 | Arrayed ultrasonic transducer |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1951445A2 (ja) |
| JP (1) | JP4807761B2 (ja) |
| CN (1) | CN101405090A (ja) |
| CA (1) | CA2627927A1 (ja) |
| WO (1) | WO2007067282A2 (ja) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1952175B1 (en) | 2005-11-02 | 2013-01-09 | Visualsonics, Inc. | Digital transmit beamformer for an arrayed ultrasound transducer system |
| US9173047B2 (en) | 2008-09-18 | 2015-10-27 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
| US9184369B2 (en) | 2008-09-18 | 2015-11-10 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
| US8207652B2 (en) * | 2009-06-16 | 2012-06-26 | General Electric Company | Ultrasound transducer with improved acoustic performance |
| CN101844130A (zh) * | 2010-05-14 | 2010-09-29 | 中国科学技术大学 | 阵列式硅微超声换能器及其制造方法 |
| JP5695350B2 (ja) * | 2010-06-10 | 2015-04-01 | 国立大学法人東北大学 | 高周波振動圧電素子、超音波センサおよび高周波振動圧電素子の製造方法 |
| CN103221148B (zh) | 2010-11-18 | 2016-04-13 | 皇家飞利浦电子股份有限公司 | 具有嵌在挠性箔片内的超声波换能器的医疗设备 |
| WO2013080875A1 (ja) * | 2011-11-28 | 2013-06-06 | 株式会社村田製作所 | 積層型圧電素子、および、重送検知用センサ |
| US9180490B2 (en) * | 2012-05-22 | 2015-11-10 | General Electric Company | Ultrasound transducer and method for manufacturing an ultrasound transducer |
| JP6273743B2 (ja) * | 2013-09-30 | 2018-02-07 | セイコーエプソン株式会社 | 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置 |
| KR101600445B1 (ko) * | 2013-12-20 | 2016-03-07 | 전자부품연구원 | 압전 스피커 유닛 및 그 제조 방법 |
| DE102015209238A1 (de) * | 2015-05-20 | 2016-11-24 | Robert Bosch Gmbh | Akustischer Sensor zum Senden und Empfangen akustischer Signale |
| WO2017069701A1 (en) * | 2015-10-21 | 2017-04-27 | Agency For Science, Technology And Research | Ultrasound transducer and method of forming the same |
| CN105232146B (zh) * | 2015-11-18 | 2018-01-02 | 郑州大学 | 一种具有超声定位功能的介入消融导管 |
| JP6907539B2 (ja) * | 2017-01-06 | 2021-07-21 | セイコーエプソン株式会社 | 超音波デバイス、超音波プローブ、及び超音波装置 |
| CN107470116B (zh) * | 2017-08-14 | 2019-10-18 | 太仓宏微电子科技有限公司 | 一种基于mems技术的高频超声阵列换能器及制作方法 |
| US10356523B2 (en) | 2017-12-13 | 2019-07-16 | Nvf Tech Ltd | Distributed mode loudspeaker actuator including patterned electrodes |
| CN109926298B (zh) * | 2017-12-18 | 2021-01-05 | 深圳先进技术研究院 | 一种模式转换超声换能器及其制造方法 |
| US11678865B2 (en) * | 2017-12-29 | 2023-06-20 | Fujifilm Sonosite, Inc. | High frequency ultrasound transducer |
| CN108903968B (zh) * | 2018-05-03 | 2024-04-23 | 中国科学院苏州生物医学工程技术研究所 | 超声换能器、超声成像系统及超声换能器的制造方法 |
| US11109831B2 (en) * | 2018-07-17 | 2021-09-07 | 1929803 Ontario Corp, (o/a FloSonics Medical) | Ultrasound patch for detecting fluid flow |
| EP3918886A4 (en) * | 2019-01-29 | 2022-11-02 | Butterfly Network, Inc. | PACKAGING STRUCTURES AND METHODS FOR ULTRASONIC ON-CHIP DEVICES |
| CN110172566B (zh) * | 2019-05-10 | 2020-10-16 | 北京理工大学 | 一种用于复杂构件残余应力消减和均化的装置及方法 |
| CN110000075A (zh) * | 2019-04-02 | 2019-07-12 | 苏州诺莱声科技有限公司 | 一种能够降低横向振动的超声换能器 |
| WO2021039374A1 (ja) * | 2019-08-30 | 2021-03-04 | 富士フイルム株式会社 | 音響整合層材、音響整合層材用組成物、音響整合シート、音響波プローブ、音響波測定装置、及び音響波プローブの製造方法 |
| CN110756418A (zh) * | 2019-10-29 | 2020-02-07 | 海鹰企业集团有限责任公司 | 调节高频曲面换能器频率的方法 |
| US11937976B2 (en) | 2020-07-06 | 2024-03-26 | 1929803 Ontario Corp | Ultrasound patch with integrated flexible transducer assembly |
| CN112697075B (zh) * | 2020-12-03 | 2022-08-02 | 中国科学院光电技术研究所 | 一种交会对接激光雷达合作目标的投影面积分析方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4802099A (en) * | 1986-01-03 | 1989-01-31 | International Business Machines Corporation | Physical parameter balancing of circuit islands in integrated circuit wafers |
| DE4142372A1 (de) * | 1991-12-20 | 1993-06-24 | Siemens Ag | Ultraschall-wandlerarray |
| JP2000050391A (ja) * | 1998-07-31 | 2000-02-18 | Olympus Optical Co Ltd | 超音波トランスデューサーおよびその製造方法 |
| US6822374B1 (en) * | 2000-11-15 | 2004-11-23 | General Electric Company | Multilayer piezoelectric structure with uniform electric field |
| US6664717B1 (en) * | 2001-02-28 | 2003-12-16 | Acuson Corporation | Multi-dimensional transducer array and method with air separation |
| US6635019B2 (en) * | 2001-08-14 | 2003-10-21 | Koninklijke Philips Electronics Nv | Scanhead assembly for ultrasonic imaging having an integral beamformer and demountable array |
| EP1382301B1 (en) * | 2002-07-19 | 2010-11-17 | Aloka Co. Ltd. | Ultrasonic probe and manufacturing method thereof |
-
2006
- 2006-11-02 CA CA002627927A patent/CA2627927A1/en not_active Abandoned
- 2006-11-02 EP EP06827415A patent/EP1951445A2/en not_active Withdrawn
- 2006-11-02 CN CNA2006800501884A patent/CN101405090A/zh active Pending
- 2006-11-02 JP JP2008539043A patent/JP4807761B2/ja active Active
- 2006-11-02 WO PCT/US2006/042889 patent/WO2007067282A2/en active Application Filing
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2007067282A3 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2627927A1 (en) | 2007-06-14 |
| JP4807761B2 (ja) | 2011-11-02 |
| WO2007067282A2 (en) | 2007-06-14 |
| JP2009515439A (ja) | 2009-04-09 |
| CN101405090A (zh) | 2009-04-08 |
| WO2007067282A8 (en) | 2008-10-02 |
| WO2007067282A3 (en) | 2007-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070222339A1 (en) | Arrayed ultrasonic transducer | |
| EP1951445A2 (en) | Arrayed ultrasonic transducer | |
| EP1738407B1 (en) | Arrayed ultrasonic transducer | |
| US20220006002A1 (en) | Methods for manufacturing ultrasound transducers and other components | |
| US11845108B2 (en) | Methods for manufacturing ultrasound transducers and other components | |
| US8316518B2 (en) | Methods for manufacturing ultrasound transducers and other components | |
| EP2459322B1 (en) | Ultrasound imaging transducer acoustic stack with integral electrical connections | |
| EP4003612B1 (en) | Method of manufacturing a panel transducer scale package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20080529 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1123252 Country of ref document: HK |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Effective date: 20100621 |
|
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1123252 Country of ref document: HK |