EP1937044A1 - Verfahren zur Herstellung eines Leiters - Google Patents

Verfahren zur Herstellung eines Leiters Download PDF

Info

Publication number
EP1937044A1
EP1937044A1 EP06077306A EP06077306A EP1937044A1 EP 1937044 A1 EP1937044 A1 EP 1937044A1 EP 06077306 A EP06077306 A EP 06077306A EP 06077306 A EP06077306 A EP 06077306A EP 1937044 A1 EP1937044 A1 EP 1937044A1
Authority
EP
European Patent Office
Prior art keywords
mould
synthetic material
conduit
conductor
viscous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP06077306A
Other languages
English (en)
French (fr)
Inventor
designation of the inventor has not yet been filed The
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority to EP06077306A priority Critical patent/EP1937044A1/de
Priority to EP20070104422 priority patent/EP1926356A1/de
Priority to US12/515,925 priority patent/US8192657B2/en
Priority to EP20070834711 priority patent/EP2092808A1/de
Priority to PCT/NL2007/050583 priority patent/WO2008063063A1/en
Publication of EP1937044A1 publication Critical patent/EP1937044A1/de
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • B29C45/1704—Introducing an auxiliary fluid into the mould the fluid being introduced into the interior of the injected material which is still in a molten state, e.g. for producing hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0079—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping applying a coating or covering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1703—Introducing an auxiliary fluid into the mould
    • B29C45/1704—Introducing an auxiliary fluid into the mould the fluid being introduced into the interior of the injected material which is still in a molten state, e.g. for producing hollow articles
    • B29C2045/1724—Introducing an auxiliary fluid into the mould the fluid being introduced into the interior of the injected material which is still in a molten state, e.g. for producing hollow articles hollows used as conduits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Definitions

  • the invention concerns a method for manufacturing a 2D or 3D conductor structure between at least one point A and at least one other point B, the conductor structure having a predefined geometrical shape.
  • Wiring structures in e.g. vehicles often include a carrier or support body, on which or in which a plurality of isolated copper wires are mounted.
  • a wiring structure is formed by one or more synthetic carriers comprising one or more metal conductors
  • the manufacturing of such structure is rather complex due to the fact that the metal conductor(s) have to be made in a separate process and inserted into a mould which, subsequently, is filled with a viscous, hardenable synthetic material, which encloses - entirely of partially - the metal conductor.
  • One aim of the present invention is to provide an improved manufacture method for a wiring structure, having a shorter processing time and resulting in a precise and reliable product. Another aim of the invention is to provide an improved wiring structure.
  • the method for manufacturing a 2D or 3D conductor structure between at least one point A and at least one other point B, the conductor structure having a predefined geometrical shape preferably comprises the steps of: provide a mould having an inner shape which is essentially similar to the predefined geometrical shape of the conductor to be manufactured and fill the mould with a viscous, hardenable synthetic material.
  • a process is well known as e.g. injection moulding of thermoplastic of thermosetting synthetic resins.
  • perform hardening the outside layer of the synthetic material in the mould e.g. by means of cooling (when using thermoplastic material) or heating (when using thermosetting material) the mould and in particular the wall of the cavity in which the synthetic material had been injected.
  • a pressure medium is fed from A to B in order to drive out the still liquid or viscous part of the material and thus to form a conduit throughout the hardened synthetic material.
  • a conductive coating has to be applied inside the conduit throughout the hardened synthetic material.
  • Well known in the art is a sequence of steps to be performed to make such a conductive coating, e.g. next sequence:
  • a precatalysed synthetic material may be used to form a conduit from A to B.
  • All those steps can be performed by feeding the respective agents in liquid form through the conduit of synthetic material.
  • the result of those steps is that the conduit has been provided of a (rather thin) metal coating inside the conduit. If it is desired to produce a wiring structure having a lower resistance, to be able to conduct relative large currents (e.g. of 100 Amps), the thin conductive metal layer inside the conduit can be thickened by means of electrolytic metallization.
  • the conductive coating is applied to the inside surface of the conduit throughout the hardened synthetic material.
  • the conductive layer could be applied on the outer surface of an auxiliary conductor carrier.
  • a carrier body is inserted in the mould having a shape which is essentially similar to the inner shape of the mould, however having a smaller diameter than it, and wherein, after hardening the outside layer of the synthetic material in the mould and feeding a pressure medium through it and driving out the liquid or viscous part of the material and forming a conduit throughout the hardened synthetic material, the conductive coating is applied to the outside surface of the carrier body.
  • Figure 1 shows schematically an injection moulded part 1 between points A and B, which resides within an injection mould 2 by means of which it was made. Manufacturing such a moulded part 1 is generally known and understood by persons skilled in the art and does not need further explication. It is noted that the mould 2 may comprise two or more mould parts, may be including shift kernels, ejectors etc., which enable the part 1 to be released after the synthetic material has become solid.
  • the mould 2 has an inner shape which is essentially similar to the predefined geometrical shape of the conductor to be manufactured. "Essentially”, because it may be needed to provide part 1 with e.g. auxiliary parts 1a like (extra) sprues or supports members, ect., which may or may not be removed after the conductor has been completed.
  • FIG 2 shows the subsequent process steps more in detail.
  • the figure's left side corresponds with point A in figure 1 during the process steps; the right side with point B at the end of the process steps.
  • Step I includes to fill the mould 2 with a viscous, hardenable synthetic material 3.
  • material 3 is a thermoplastic material, it may be injected as a melt from the left side A. When the mould is cooled, the material 3 will solidify by extraction of heat, starting at the outside of the material 3. If material 3 is a thermosetting material, it may be injected at room temperature from the left side A. When the mould is heated, the material 3 will solidify by curing due the heat which is applied to the mould, starting at the outside of the material 3.
  • Step II illustrates hardening the outside layer of the synthetic material in the mould and feeding a pressure medium 4, e.g. air or water, from A to B in order to drive out the still liquid or viscous part of the material 3 and thus to form a conduit 5 throughout the hardened synthetic material.
  • a pressure medium e.g. air or water
  • the mould 2 could mainly be removed: see up/down arrows at steps I and II, indicating the mould's suggested release direction.
  • Steps III and IV illustrate applying a conductive coating (6a, 6b) inside the conduit throughout the hardened synthetic material.
  • step III the result is shown of a number sub-steps, like:
  • step IV the conductive coating 9 is thickened by means of electrolytic metallization - using conductive coating 9 as receiving electrode - resulting in a substantial metal conductor 6a inside the inside conduit 5.
  • Figure 3 represents an alternative for the previous. Only the differences will be discussed.
  • a carrier body 7 is inserted in the mould having a shape which is essentially similar to the inner shape of the mould, however having a smaller diameter than it.
  • the carrier body 7 may comprise e.g. support extensions (not shown) to centre the carrier body 7 in the inner shape of the mould.
  • the carrier body 7 has been made in a preceding step (not illustrated), within the same mould 2, by means of additional mould parts, which e.g. may have a release direction perpendicular to the release direction indicated by the arrows in figures 2 and 3 .
  • the conductive coating 6b is applied to the outside surface of the carrier body 7, using the same sub-steps as discussed with figure 2 .
  • Figure 3 shows that the conductive layer 6b is only applied on the surface of member 7. This may be performed by using for the conduit 3 a synthetic material which - different from the situation in figure 2 - is not suited for the application of the sub-steps of surface sensitization, surface activation, forming a metallizing base layer or seed layer and metallizing and formation of a metal coating, and thus not for the final electrolytic metallization process, as for member 7 a synthetic material is chosen which is suited for successful application of those sub-steps and final electrolytic metallization step.
  • the metallization process may be performed on both, the inside surface of hollow part 1 and the outside surface of part 7, resulting in a electrolytically metallized inside surface of hollow part 1 and a electrolytically metallized outside surface of part 7.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
EP06077306A 2006-11-22 2006-12-22 Verfahren zur Herstellung eines Leiters Ceased EP1937044A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP06077306A EP1937044A1 (de) 2006-12-22 2006-12-22 Verfahren zur Herstellung eines Leiters
EP20070104422 EP1926356A1 (de) 2006-11-22 2007-03-19 Produkt mit Festkörper und einem oder mehreren Innenräumen
US12/515,925 US8192657B2 (en) 2006-11-22 2007-11-22 Product with internal cavities, and method, system and mould for manufacturing such a product
EP20070834711 EP2092808A1 (de) 2006-11-22 2007-11-22 Produkt mit internen hohlräumen und verfahren, system und form zur herstellung eines solchen produkts
PCT/NL2007/050583 WO2008063063A1 (en) 2006-11-22 2007-11-22 Product with internal cavities, and method, system and mould for manufacturing such a product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06077306A EP1937044A1 (de) 2006-12-22 2006-12-22 Verfahren zur Herstellung eines Leiters

Publications (1)

Publication Number Publication Date
EP1937044A1 true EP1937044A1 (de) 2008-06-25

Family

ID=38294192

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06077306A Ceased EP1937044A1 (de) 2006-11-22 2006-12-22 Verfahren zur Herstellung eines Leiters

Country Status (1)

Country Link
EP (1) EP1937044A1 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19544733A1 (de) * 1995-11-30 1997-06-05 Thomson Brandt Gmbh Verfahren zur Herstellung von Spritzgußteilen
US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors
US6367503B1 (en) * 1997-07-09 2002-04-09 Mannesmann Vdo Ag Plastic container and method for using the same
WO2002057061A2 (de) * 2001-01-19 2002-07-25 Siemens Aktiengesellschaft Treibmittelleitung für eine saugstrahlpumpe und zwei verfahren zur herstellung der treibmitteilleitung
US20040245667A1 (en) * 2001-08-07 2004-12-09 Stephan Behle Method and device for the simultaneous coating and moulding of a body

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19544733A1 (de) * 1995-11-30 1997-06-05 Thomson Brandt Gmbh Verfahren zur Herstellung von Spritzgußteilen
US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors
US6367503B1 (en) * 1997-07-09 2002-04-09 Mannesmann Vdo Ag Plastic container and method for using the same
WO2002057061A2 (de) * 2001-01-19 2002-07-25 Siemens Aktiengesellschaft Treibmittelleitung für eine saugstrahlpumpe und zwei verfahren zur herstellung der treibmitteilleitung
US20040245667A1 (en) * 2001-08-07 2004-12-09 Stephan Behle Method and device for the simultaneous coating and moulding of a body

Similar Documents

Publication Publication Date Title
JP2021185033A (ja) 相互接続体と埋設されたコンポーネントとを含む３ｄ印刷された形状の作製
JP7127083B2 (ja) 特定用途向け電子機器パッケージングシステム、方法及びデバイス
US6601296B1 (en) Multi-shot injection molding process for making electrical connectors and three-dimensional circuits
US5738797A (en) Three-dimensional multi-layer circuit structure and method for forming the same
CN109863652B (zh) 单体式滑动轨道部件、滑环模块和制造滑环模块的方法
CN101277805A (zh) 形成具有可与环接合的触碰固紧件的导电带
EP0545487A2 (de) Harzverkapselte und elektrisch isolierte Halbleiteranordnung mit verbesserter Isolationseigenschaft und dazugehöriger Herstellungsprozess
CN106067456B (zh) 用于制作电子部件的方法、相应的部件和计算机程序产品
CN107960140A (zh) 旋转连接器装置
CN102597399B (zh) 用于生产机动车门锁的方法和这种机动车门锁
JP2009261220A (ja) 固定子製造方法
KR100663241B1 (ko) 인덕터의 단자 형성용 주형 및 그 형성 방법
WO2017082207A1 (ja) 造形物の製造方法及び造形物
EP1937044A1 (de) Verfahren zur Herstellung eines Leiters
CN110891756B (zh) 制造塑料金属混合构件的方法及塑料金属混合构件
CN112005325A (zh) 用于制造螺旋导电体的方法
KR20090012480A (ko) 사출성형용 코어
CN100365880C (zh) 电连接器的制造方法
ES2966755T3 (es) Procedimiento para aplicar un punto de contacto eléctrico en una pieza de conexión eléctrica
JP2693863B2 (ja) 複数の独立した立体的導電回路を内蔵封入した立体成形品の製造方法
JP4848626B2 (ja) 回路成形品の製造方法
CN106063394B (zh) 配线板的制造方法
JP2716323B2 (ja) 多孔質成形型及びその製造方法
CN114828417A (zh) 模具成型的粗化工艺和立体电路以及电子设备
US20050170078A1 (en) Low cost method to form solderable contact points for structures manufactured from conductive loaded resin-based materials

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20080720