EP1918102A2 - Applicateur de composants électriques ou électroniques - Google Patents
Applicateur de composants électriques ou électroniques Download PDFInfo
- Publication number
- EP1918102A2 EP1918102A2 EP07020094A EP07020094A EP1918102A2 EP 1918102 A2 EP1918102 A2 EP 1918102A2 EP 07020094 A EP07020094 A EP 07020094A EP 07020094 A EP07020094 A EP 07020094A EP 1918102 A2 EP1918102 A2 EP 1918102A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- transfer belt
- components
- printed
- conveyor
- conveying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012546 transfer Methods 0.000 claims abstract description 97
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 57
- 238000007639 printing Methods 0.000 claims description 18
- 239000002318 adhesion promoter Substances 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005496 tempering Methods 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000011990 functional testing Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000000047 product Substances 0.000 description 9
- 230000008901 benefit Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 101100008046 Caenorhabditis elegans cut-2 gene Proteins 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Definitions
- the invention relates to a method for applying electronic components according to the preamble of claim 1 and a device for the application of electronic components, which is preferably used to integrate electronic or electrical components in printed products, according to the preamble of claim 20.
- a typical applicator system associated with printing applications will be described in US Pat WO 2005/013179 A described.
- the device is used for printing at least a continuous web, the device serving at least one device for the continuous transmission of individual transponders or transponder parts based on the functional principle of Radio Frequency Identification.
- the disadvantage of this solution is that the transfer takes place on a continuous web and the application of the transponder or transponder parts takes place in the printing process.
- Most packaging is made from sturdy material that is difficult to roll up for product protection and storage stability. Normally such materials are processed in sheets.
- Another disadvantage of an applicator system working against a continuous web is that in most cases several uses are printed side by side. In this case, several applicator systems would be needed, which are arranged side by side, wherein the required number of applicators may vary depending on the benefit size.
- the DE 10 2005 006 978 B3 describes an applicator system in which the semiconductor elements or interposers are fixed on a flexible, continuous carrier tape by fixing the semiconductor element or the interposer by heating elements on the carrier tape, wherein an endless belt runs around the heating elements. Again, the application of semiconductor elements is described on an endless carrier tape, the application for individual products will not be described.
- the DE 101 40 661 C1 discloses an apparatus and method for manufacturing flip-chip modules. First, an adhesive is applied to a continuous carrier tape. On the tape then a chip is positioned with a pick-and-place machine. Thereafter, a contact pressure is exerted on the chips by a synchronously revolving pressing tool. At the same time additional energy, for example by radiation, can be applied to accelerate the curing of the adhesive.
- This patent also speaks of a continuous carrier tape, not of the assembly on individual printed products. Another disadvantage of the chosen application is that using pick-and-place machines only a limited process speed can be achieved, which is not sufficient for the throughput volume of a folding carton manufacturer.
- the object of the invention is therefore to define an application device which applies electrical and / or electronic components to a printing blank or a printed sheet safely and with sufficient accuracy.
- the solution according to the invention provides that an electronic component, for example a strap, interposer or microchip module, deposited by a feeder on a circulating, endless transfer belt, then transported in the conveying direction of the transfer belt and placed after the deflection of the transfer belt to a deflection roller on the print material ,
- the print material is transported by a continuously or clocking working conveyor and the strap, interposer or microchip module is fixed by the transfer belt on the print material under pressure application.
- the storage of the electronic component on the transfer belt is controlled or controlled such that the electronic component on AntennenanQuerypads a printed on the substrate conductive structure in tight tolerance limits correctly and accurately comes to rest.
- the position of the aligned blank on the conveyor can be detected by position detection sensors and by means of the signal, the storage of the electronic component can be controlled on the transfer belt.
- Suitable sensors include triangulation sensors, capacitive sensors or cameras.
- the invention enables a long contact pressure of the on an auxiliary carrier (strap or interposer) located electrical or electronic component on the individual print material.
- auxiliary carrier trap or interposer located electrical or electronic component on the individual print material.
- FIG. 1 The solution according to the invention is shown by way of example in FIG. 1 in a longitudinal section.
- a conveyor which consists of a conveyor table 5 and 4 conveyor belts.
- the conveyor 4, 5 is arranged upstream of a feeder 7.
- the feeding device supplies in the conveying direction A a printed material 1 a, 1 b in the form of blanks, for example, for folding boxes for the conveyor 4, 5 at.
- These blanks are usually provided with an irregular contour. Therefore, it is expedient if the conveyor belts 4 are designed as suction belts and the conveyor table 5 is a suction belt table.
- print material 1 a, 1 b blanks are provided in particular with a printed electronic circuit. Suitable printable circuits are antennas 2 or antenna pads 3. After the assembly of the printed matter 1 a, 1 b with electronic components 9, this is in an output device 20 of the conveyor 4, 5 removed and designed.
- the assembly may be in direct connection to a production line consisting of a printing machine producing printed circuits 2, 3, e.g. a sheetfed offset printing machine, and a punching device may be arranged.
- the punching device may in this case be provided as an inline aggregate of the printing machine, in which case the printing press is followed by a sorting device for the individual copies of the printed material 1a, 1b.
- the particular structure of the device according to the invention is shown in that electronic components 9 in the form of straps, of interposers or of microchip modules by a strap dispenser or a feeder 13 on a around at least two pulleys 11 a, 11 b rotating, endless transfer belt 10 are stored. Thereafter, the components 9 are transported in the conveying direction C of the transfer belt 10 and placed after the deflection of the transfer belt 10 to the deflection roller 11a on a printing material 1 a, 1 b. Finally, the electronic components 9 are fixed by means of the transfer belt 10 using a compressive force on the printing material 1 a, 1 b.
- the printed matter 1a, 1b is preferably cut as a blank, e.g. Folding box formed.
- the print material 1 a, 1 b is transported by a continuously or clocking working conveyor having one or more conveyor belts 4, which in turn are guided around pulleys 8 a, 8 b to a conveyor table 5.
- the conveyor table 5 may include a suction box 6 in order to be able to transport the printed material 1a, 1b pneumatically on conveyor belts 4 designed as suction belts.
- the print material 1a, 1b is fed to the conveyor belts 4 by a feeding and aligning device 7 in always the same orientation.
- an output or display device 20 is provided, by means of which the equipped with the electronic components 9 print material can be stacked. In this case, particular attention is paid to the shifted by the electronic components 9 stack layer.
- the storage of the electronic components 9 on the transfer belt 10 is carried out regulated or controlled so that it comes to Antennenan gleichpads 3 a printed on the printed material 1 a, 1 b printed antenna 2 or other conductive structures in close tolerance limits in the correct orientation and accurate fit (see Fig. 2).
- the position of the aligned blank 1 a, 1 b on the conveyor 4, 5 can be detected by a position sensor 17 and the signal obtained for the storage of the electronic components 9 are used on the transfer belt 10.
- a position sensor 17 any suitable sensor can be used, which makes it possible the position of the blank 1 a, 1 b the conveyor 4 to detect.
- sensors triangulation sensors, capacitive sensors or cameras could be used.
- the fixation of the electronic components 9 on the transfer belt 10 can be carried out pneumatically.
- the pneumatic negative pressure can be effected by a vacuum chamber 14, which fixes the electronic components 9 on the transfer belt 10 to the first contact or shortly before the first contact with the print material 1 a, 1 b on the transfer belt 10.
- the vacuum chamber 14 may be followed by a blast air chamber 15, which is acted upon by the transfer belt 10 for better replacement of the electronic components 9 with blowing air.
- the blast air of the blast air chamber 15 may be heated by a heater to accelerate the curing of the connection between the electronic components 9 and the printed antenna 2 and the printed pads 3 of the antenna 2, respectively.
- the electronic components 9 located on the transfer belt 10 can be provided with an adhesion promoter by an adhesive application device 16b.
- the nature of the adhesion promoter within the meaning of the invention is irrelevant.
- Anisotropic adhesives are expressly included as suitable adhesion promoters.
- the printed matter 1a, 1b can be provided with an adhesion promoter by an adhesive applicator 16a, and then the electronic components 9 can be pressed over the transfer tape 10 against the adhesive present on the substrate 1a, 1b.
- the synchronization of the application of the bonding agent by the adhesive applicator 16a on the printing material 1 a, 1 b is performed by cooperation of a controller 18 for signal evaluation for donor and adhesive with the position sensor 17.
- the position sensor 17 in this case, the position of the printed matter 1 a, 1 b before , so that in connection with the conveying movement by the transfer belt 10, the time for applying the adhesion promoter can be determined.
- the controller 18 In the case of the activation of the adhesive application device 16b for supplying the electronic components 9 with a bonding agent, the controller 18 to Signal evaluation for dispenser and adhesive coupled to the control of the feed device 13 and the transfer belt 10.
- the electronic components 9 located on the transfer belt 10 can also be provided with a solder (bump) by means of an adhesive application device 16b.
- a solder bump
- the synchronization of the transfer belt 10 with the conveyor 4 is ensured by a synchronization device 19.
- This can be a mechanical or electronic wave.
- the surface speed of the transfer belt 10 and the conveyor 4, 5 is detected by a suitable sensor to compensate for differences in surface speed resulting from different expansion ratios via the synchronizer 19, so that the transfer belt 10 and conveyor 4, 5 run at the same surface speed .
- An advantageous extension of the invention found solution is that the temperature of the transfer belt 10 and the conveyor 4, 5 is detected at each one or more locations of the conveyor line.
- the temperature of one or both pulleys 11a, 11b of the transfer belt 10 and one or both pulleys 8a, 8b of the conveyor 4, 5 the temperature can be kept constant by the measured temperature is compared with a target value and setpoint deviations on the tempering the temperature as far as readjusted until the setpoint specification is reached again.
- the detection of the surface speed may possibly be dispensed with.
- a pressing distance L1, L2 of the transfer belt 10 in the adjustment direction F can be adjusted by one or more adjustable deflection rollers 12.
- the entire transfer belt 10 is also adjustable with an adjusting device in the height direction E in an ideal manner, so that the pressure of the transfer belt 10 on the print material 1 a, 1 b with the applied electronic components 9, even with different substrate thicknesses within narrow limits can be kept the same.
- the conveyor 4, 5 has an adjustment possibility of at least one conveyor belt in the adjustment direction B in order to be able to adapt the conveyor to the different sizes of the printed material 1a, 1b.
- the transfer belt 10, which in the width direction of the conveyor 4, 5 may comprise only a portion of the width range of the conveyor 4, can be adjusted mechanically or electrically in the lateral direction D so that it is ideal for the antenna 2 printed on the printed material 1 a, 1 b is positioned with the antenna connection pads 3.
- a further extension according to the invention according to FIG. 4 comprises the application of the electronic components 9 to a non-aligned or insufficiently aligned print material 1 on the conveyor belt.
- the position of the blank 1 or the position of the antenna 2 or the antenna connection pads 3 or other suitable measuring marks is determined in good time by suitable measuring means, e.g. a camera, detected on the blank and the applicator module 13 in the adjustment direction G for filing the electronic components 9 on the transfer belt 10 and possibly the adhesive applicator 16b adjusted so that the electronic components 9 are applied within narrow limits angularly accurate to the antenna connection pads 3.
- the finished objects ie printed material 1 a, 1 b with printed circuit 2, 3 and applied electronic component 9 still have to be sorted out as described. It is important to control the quality of the combination product Druckgut-circuit component.
- an inspection device within the output device 20 monitor the position and completeness of the elements. A test device can check the function of the circuits and components at the same place, so that defective products can be eliminated immediately.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006050964A DE102006050964A1 (de) | 2006-10-28 | 2006-10-28 | Applikator für elektrische oder elektronische Bauelemente |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1918102A2 true EP1918102A2 (fr) | 2008-05-07 |
Family
ID=39204618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07020094A Withdrawn EP1918102A2 (fr) | 2006-10-28 | 2007-10-13 | Applicateur de composants électriques ou électroniques |
Country Status (3)
Country | Link |
---|---|
US (1) | US7971346B2 (fr) |
EP (1) | EP1918102A2 (fr) |
DE (1) | DE102006050964A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102998565A (zh) * | 2012-11-27 | 2013-03-27 | 惠州华阳通用电子有限公司 | 用于电子产品测试的流水线一体化装置 |
EP2594394A1 (fr) * | 2010-08-31 | 2013-05-22 | Heidelberger Druckmaschinen AG | Module d'inspection |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011116365A1 (de) * | 2011-10-19 | 2013-04-25 | Heidelberger Druckmaschinen Aktiengesellschaft | Bogenbearbeitungsmaschine mit Bogenanleger mit Saugbandmodul |
CN109435445B (zh) * | 2018-12-19 | 2023-09-12 | 东莞市轩驰智能科技有限公司 | 带轮式移印机及其印刷方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6280544B1 (en) | 1999-04-21 | 2001-08-28 | Intermec Ip Corp. | RF tag application system |
DE10140661C1 (de) | 2001-08-24 | 2003-01-16 | Orga Kartensysteme Gmbh | Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen |
WO2005013179A2 (fr) | 2003-08-01 | 2005-02-10 | Mühlbauer Ag | Dispositif et procede pour realiser une impression sur une bande |
WO2005078648A1 (fr) | 2004-02-13 | 2005-08-25 | Man Roland Druckmaschinen Ag | Procede de production d'etiquettes d'identification par radiofrequence (rfid) |
DE102005006978B3 (de) | 2005-02-15 | 2006-06-08 | Mühlbauer Ag | Verfahren und Vorrichtung zum Verbinden von Halbleiterelementen oder Interposern mit einem Trägerband und Verwendung einer derartigen Vorrichtung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59202991D1 (de) * | 1991-01-28 | 1995-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Leiterplatten. |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
US5916513A (en) * | 1997-08-04 | 1999-06-29 | Motorola | Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation |
DE10120269C1 (de) * | 2001-04-25 | 2002-07-25 | Muehlbauer Ag | Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders |
DE10128111A1 (de) * | 2001-06-11 | 2003-02-20 | Bosch Gmbh Robert | Vorrichtung zur Montage von Bauelementen auf einem Substrat |
US7623034B2 (en) * | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
-
2006
- 2006-10-28 DE DE102006050964A patent/DE102006050964A1/de not_active Withdrawn
-
2007
- 2007-10-13 EP EP07020094A patent/EP1918102A2/fr not_active Withdrawn
- 2007-10-26 US US11/977,924 patent/US7971346B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6280544B1 (en) | 1999-04-21 | 2001-08-28 | Intermec Ip Corp. | RF tag application system |
DE10140661C1 (de) | 2001-08-24 | 2003-01-16 | Orga Kartensysteme Gmbh | Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen |
WO2005013179A2 (fr) | 2003-08-01 | 2005-02-10 | Mühlbauer Ag | Dispositif et procede pour realiser une impression sur une bande |
WO2005078648A1 (fr) | 2004-02-13 | 2005-08-25 | Man Roland Druckmaschinen Ag | Procede de production d'etiquettes d'identification par radiofrequence (rfid) |
DE102005006978B3 (de) | 2005-02-15 | 2006-06-08 | Mühlbauer Ag | Verfahren und Vorrichtung zum Verbinden von Halbleiterelementen oder Interposern mit einem Trägerband und Verwendung einer derartigen Vorrichtung |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2594394A1 (fr) * | 2010-08-31 | 2013-05-22 | Heidelberger Druckmaschinen AG | Module d'inspection |
CN102998565A (zh) * | 2012-11-27 | 2013-03-27 | 惠州华阳通用电子有限公司 | 用于电子产品测试的流水线一体化装置 |
Also Published As
Publication number | Publication date |
---|---|
US7971346B2 (en) | 2011-07-05 |
DE102006050964A1 (de) | 2008-04-30 |
US20080149265A1 (en) | 2008-06-26 |
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18W | Application withdrawn |
Effective date: 20100927 |