EP1904861A4 - Prüfkartenbaugruppe mit einem wechselbaren prüfeinsatz - Google Patents
Prüfkartenbaugruppe mit einem wechselbaren prüfeinsatzInfo
- Publication number
- EP1904861A4 EP1904861A4 EP06774597.6A EP06774597A EP1904861A4 EP 1904861 A4 EP1904861 A4 EP 1904861A4 EP 06774597 A EP06774597 A EP 06774597A EP 1904861 A4 EP1904861 A4 EP 1904861A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- probe
- card assembly
- interchangeable
- insert
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59548005P | 2005-07-08 | 2005-07-08 | |
US36027005A | 2005-12-21 | 2005-12-21 | |
PCT/US2006/026723 WO2007008790A2 (en) | 2005-07-08 | 2006-07-07 | Probe card assembly with an interchangeable probe insert |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1904861A2 EP1904861A2 (de) | 2008-04-02 |
EP1904861A4 true EP1904861A4 (de) | 2013-05-29 |
Family
ID=39126467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06774597.6A Withdrawn EP1904861A4 (de) | 2005-07-08 | 2006-07-07 | Prüfkartenbaugruppe mit einem wechselbaren prüfeinsatz |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1904861A4 (de) |
JP (1) | JP2009500633A (de) |
KR (1) | KR101304031B1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4398513B1 (ja) * | 2009-04-28 | 2010-01-13 | 株式会社アドバンテスト | 配線基板ユニットおよび試験装置 |
KR101897008B1 (ko) * | 2012-03-08 | 2018-09-12 | 주식회사 코리아 인스트루먼트 | 프로브 카드 |
JP6220596B2 (ja) | 2013-08-01 | 2017-10-25 | 東京エレクトロン株式会社 | プローバ |
TW201606314A (zh) * | 2014-08-14 | 2016-02-16 | 漢民科技股份有限公司 台北巿大安區敦化南路2 段38 號14 樓 | 探針卡結構及其組裝與更換方法 |
KR102393600B1 (ko) * | 2020-09-11 | 2022-05-03 | 스테코 주식회사 | 프로브 카드 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656943A (en) * | 1995-10-30 | 1997-08-12 | Motorola, Inc. | Apparatus for forming a test stack for semiconductor wafer probing and method for using the same |
US20020118029A1 (en) * | 1999-05-14 | 2002-08-29 | Rikihito Yamasaka | Probe card and contactor |
US20030099097A1 (en) * | 2001-11-27 | 2003-05-29 | Sammy Mok | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US20040108848A1 (en) * | 2002-03-21 | 2004-06-10 | Jacobsen Chris R. | Adapter method and apparatus for interfacing a tester with a device under test |
US20050012513A1 (en) * | 2003-07-17 | 2005-01-20 | Shih-Jye Cheng | Probe card assembly |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163221B2 (ja) * | 1993-08-25 | 2001-05-08 | 東京エレクトロン株式会社 | プローブ装置 |
US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
US6535003B2 (en) * | 1999-01-29 | 2003-03-18 | Advantest, Corp. | Contact structure having silicon finger contactor |
EP1200843A1 (de) * | 1999-07-28 | 2002-05-02 | Nanonexus, Inc. | Konstruktionsstrukturen und herstellverfahren für testkarte für ic-wafer |
US6847218B1 (en) * | 2002-05-13 | 2005-01-25 | Cypress Semiconductor Corporation | Probe card with an adapter layer for testing integrated circuits |
-
2006
- 2006-07-07 JP JP2008520441A patent/JP2009500633A/ja active Pending
- 2006-07-07 KR KR1020087003169A patent/KR101304031B1/ko active IP Right Grant
- 2006-07-07 EP EP06774597.6A patent/EP1904861A4/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656943A (en) * | 1995-10-30 | 1997-08-12 | Motorola, Inc. | Apparatus for forming a test stack for semiconductor wafer probing and method for using the same |
US20020118029A1 (en) * | 1999-05-14 | 2002-08-29 | Rikihito Yamasaka | Probe card and contactor |
US20030099097A1 (en) * | 2001-11-27 | 2003-05-29 | Sammy Mok | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
US20040108848A1 (en) * | 2002-03-21 | 2004-06-10 | Jacobsen Chris R. | Adapter method and apparatus for interfacing a tester with a device under test |
US20050012513A1 (en) * | 2003-07-17 | 2005-01-20 | Shih-Jye Cheng | Probe card assembly |
Also Published As
Publication number | Publication date |
---|---|
KR20080041643A (ko) | 2008-05-13 |
EP1904861A2 (de) | 2008-04-02 |
KR101304031B1 (ko) | 2013-09-04 |
JP2009500633A (ja) | 2009-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080204 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR IT |
|
DAX | Request for extension of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR IT |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: KAWAMATA, NOBUHIRO Inventor name: SAEKI, TAKAO Inventor name: ELDRIDGE, BENJAMIN, N. Inventor name: REYNOLDS, CARL, V. |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20130426 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01R 1/073 20060101ALI20130422BHEP Ipc: G01R 31/02 20060101AFI20130422BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20131126 |