EP1892576A1 - Exposure device for producing printing screen - Google Patents

Exposure device for producing printing screen Download PDF

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Publication number
EP1892576A1
EP1892576A1 EP06405369A EP06405369A EP1892576A1 EP 1892576 A1 EP1892576 A1 EP 1892576A1 EP 06405369 A EP06405369 A EP 06405369A EP 06405369 A EP06405369 A EP 06405369A EP 1892576 A1 EP1892576 A1 EP 1892576A1
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EP
European Patent Office
Prior art keywords
exposure
laser diodes
light
exposure device
screen printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06405369A
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German (de)
French (fr)
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EP1892576B1 (en
Inventor
Peter Berner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luescher Technologies AG
Original Assignee
XPOSE HOLDING AG
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Publication date
Application filed by XPOSE HOLDING AG filed Critical XPOSE HOLDING AG
Priority to EP06405369.7A priority Critical patent/EP1892576B1/en
Priority to DK06405369.7T priority patent/DK1892576T3/en
Priority to PCT/CH2007/000419 priority patent/WO2008022485A1/en
Priority to CN2007800315372A priority patent/CN101506738B/en
Priority to US11/895,646 priority patent/US20080047445A1/en
Publication of EP1892576A1 publication Critical patent/EP1892576A1/en
Application granted granted Critical
Publication of EP1892576B1 publication Critical patent/EP1892576B1/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Definitions

  • the invention relates to an exposure apparatus for the production of screen printing stencils according to claim 1.
  • the invention relates to an exposure apparatus for the production of screen printing stencils with a support for the screen printing stencil, an exposure system comprising at least one, a light beam generating light source and optics in an exposure head, further comprising a signal source supplying digital signals, which with the exposure system in a manner
  • the exposure head is movable relative to the screen printing stencil.
  • the exposure system to a micromechanical mirror system, which is provided with a plurality of at least partially movable micromirrors.
  • micromechanical mirror systems are also known as so-called DMDs (Digital Micromirror Devices) and are commercially available.
  • the micromechanical mirror system is used to direct and modulate a beam of light so that the position the movable micromirror in response to the signals of a computer is changeable such that the respective mirrored part of the light beam either goes into the light output or not.
  • the light output here means the light directed to the screen printing form or screen printing stencil.
  • the light source used here is a permanent light, for example electrodeless, microwave-excited UV lamps.
  • the holder with the screen printing form and the exposure system is movable relative to each other.
  • the device according EP-0 953 877 Despite the widespread use of DMD components today (for example, for projectors), the device according EP-0 953 877 however, some serious disadvantages. Since the DMDs are mechanically moving mirror systems, there are of course certain limits with regard to changing very quickly in the light beam to be modulated. Common DMDs have a cutoff frequency of about 20 kHz, which of course ultimately limits the 'imaging speed' for the screen printing stencils. Overall, according to the manufacturer (CST) for relevant devices maximum imaging speeds in the range of about 500 sq.ft / hr achieved at 65 lpi (but only for "fast" emulsion types and low stencil thickness).
  • CST manufacturer
  • the achievable imaging speed is also determined by the radiation energy to be applied (depending on the stencil / emulsion material to be imaged, very different radiation energies are sometimes required).
  • the application of DMDs are limited, because by the use of mirrors always relatively high losses arise (the 'reflected away' portions of the light beam manifest in the form of relatively high heat loss, which must be dissipated).
  • the light source must be a high-performance continuous Radiation source can be used, which in turn is expensive and per se is also associated with relatively high power loss (because only a part of the energy supplied is ever converted into usable radiation).
  • UV light sources with powers of usually 600 - 1200 watts used which in turn require a special cooling.
  • the object of the invention is to specify an improved exposure apparatus for the production of screen printing stencils.
  • a number n of similar laser diodes operating in the wavelength range of 300-450 nm which can be driven by the signals of the signal source (computer), the light signals of the laser diodes via an equal number n of light-conducting fibers to form a grid plate in FIG To guide exposure head and to direct the light output of the grid plate to one in the wavelength range of the laser diodes adapted focusing optics in the exposure head.
  • direct modulated laser diodes has several significant advantages. On the one hand eliminates the need for continuous operation and thus the power loss of the entire exposure device can be significantly reduced. Furthermore, the reaction speed of laser diodes (at least in the field of application of the printing stencil exposure of interest here) upwards has virtually no limits because the achievable cutoff frequencies are in the GHz range. Furthermore, eliminates the simple controllability of the laser diodes and the absence of light-deflecting mirrors in the beam path another cause of unwanted power loss, because namely with the exception of absorption losses in the materials in the beam path (optical components) no additional losses must be accepted.
  • the exposure device according to the invention can basically be used both for flat screen printing stencil production and for cylindrical screen printing stencil production.
  • a grid arrangement of individually controllable light sources (in this case the laser diodes) is of central importance for exposure apparatuses of this kind.
  • the laser diodes themselves need not necessarily be mounted in the grid arrangement necessary for the exposure of the stencil material. Rather, it is sufficient to guide the photoconductive fibers to a grid plate in the exposure head and to make the grid plate itself so that the photoconductive fibers appear there in the necessary for the exposure of the template material grid arrangement.
  • the grid plate is thus a fiber array which receives the photoconductive fibers and aligns them in a rectangular or trapezoidal grid arrangement parallel to the optical axis of the focusing optics. Since it is provided to make the light-conducting fibers on both sides, so both in the connections to the laser diodes as well as in the connections to the grid plate pluggable, there are advantages in terms of flexibility and maintainability.
  • the grid plate in the grid arrangement thus provides a number n of light beams of the laser diodes aligned parallel to the optical axis of the focusing optics, the beam diameter of the individual light beams essentially corresponding to the diameter of the light-conducting fibers and the object of the focusing optics being a reduced or enlarged image to generate this grid arrangement on the stencil material to be imaged (exposing).
  • the focusing optics is preferably also equipped with a Autofokussier observed.
  • the proposed exposure device according to the invention can be realized particularly well in the case of a gantry-type exposure unit.
  • Such exposure units are often arranged vertically to save space due to the size of the screen printing stencils to be exposed, i. the holder for the screen printing stencil lies in a vertical plane.
  • the exposure unit forms, together with a control unit and a computer unit, the exposure device for producing screen printing stencils.
  • the laser diodes and the light-conducting fibers are arranged insertable in heat-dissipating modules in an interface part.
  • the interface part is arranged with the modules in a manner to the exposure unit that it participates the movements of the exposure head only in one of the required for the exposure of a stencil material movement directions to keep the mass to be moved for an exposure process as small as possible. This is the case, for example, when the interface part with the modules is arranged on the portal arm of a gantry-type exposure table.
  • the interface part makes then the relatively slow movements of the exposure head in the X direction (movement direction of the portal arm) with, the relatively fast movements of the exposure head in the Y direction (movement direction of the exposure head on the portal arm) but not.
  • the interface part with the modules would then not participate in any of the movements of the exposure head in the directions of movement required for the exposure of a stencil material.
  • Another advantage of the exposure device according to the invention is undoubtedly also the fact that cheaper optics can be used in the exposure head due to the possibility of using a focusing optics adapted to the laser diodes in the wavelength range. Namely, if you work with light sources with a wider spectral distribution than in laser diodes, the optics must be optimized for the entire spectral range to be covered because of the required focusing accuracy. Since it is also provided in the exposure device according to the invention that the exposure optics can be changed interchangeably or with little effort, the device can be easily switched to the processing of stencil material with different spectral sensitivity requirements.
  • the new machine concept therefore has considerable advantages compared to the usual machine concepts, particularly with regard to adjustability, maintainability and expandability.
  • An exposure apparatus for the production of screen printing stencils is designed in portal construction and consists essentially of an exposure unit 1, a control unit 2 and a computer unit 3.
  • the exposure unit 1 comprises a vertically arranged processing table with a holder 4 for screen printing stencils (to be exposed). Above the holder 4 and the screen printing stencil a portal arm 6 is movable on an X-axis guide 7 in an X direction. On the portal arm 6, an exposure head 9 with a focusing lens 10 in a Y-direction is movable on a Y-axis guide 8. The X-direction thus corresponds to the direction of movement of the portal arm 6. Both for the movement in the X direction and for the movement in the Y direction precision guides and precision drives are present (not shown).
  • an interface part 11 is attached.
  • the interface part 11 On the interface part 11 are several heat-dissipating modules 12 with groups of laser diodes and a data distributor 13 and interface electronic components (not shown).
  • the digital signals originating from the computer unit 3 as a signal source are converted into optical signals. Since the exposure head 9 is arranged to be movable relative to the modules 12 with the laser diodes, the signals are transmitted from the laser diodes via optical fibers via a Y-drag chain 14 to the exposure head 9.
  • 4 to 8 modules 12 may be arranged with groups of 16 laser diodes on the interface part. This then results in a total number n of 64 to 128 laser diodes, wherein the light output of each laser diode via a separate photoconductive fiber via the Y-drag chain 14 to the grid plate in the exposure head 9 is passed.
  • the laser diodes operate advantageously in a wavelength range of 300-450 nm, preferably in the blue light range at 405 nm.
  • the laser diodes are used in a direct modulated operation, ie they are in the usual type directly controlled by a digital signal.
  • the signals are transmitted to the data distributor 13 via an X-drag chain 15.
  • the necessary signals and power supplies for the control and movement of the exposure head 9 are carried in the Y direction.
  • a recorded by the holder 4 screen printing stencil 5 is fully or partially exposed by movements of the exposure head in the X and Y directions. It can be assumed that the movement in the X direction is usually slower than the movement in the Y direction, because in the Y direction only a much smaller mass must be moved.
  • control unit 2 The function of the control unit 2 is basically to control the movements of the exposure head 9 in the X and Y directions.
  • the necessary functions are advantageously realized in a programmable logic controller 16 (PLC unit).
  • PLC unit programmable logic controller 16
  • the control unit 2 also contains the drive circuits necessary for the motion control, etc.
  • the computer unit 3 (signal source) provides the data to be exposed on a screen printing stencil 5 and controls the exposure process.
  • Both the functions of the computer unit 3 as well as the functions of the control unit 2 are well known to those skilled in the art from generic devices and therefore require no further explanation here.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The device has an exposure unit (1) with a light source e.g. laser diode, for producing a beam of light. A focusing lens system (10) is provided in an exposure head (9) that is moved relative to a screen-print stencil (5) e.g. e.g. flat screen-stencil. A signal source e.g. computer unit (3), is connected with the unit, so that the entire stencil is exposed to the diode in accordance with digital signals. The light signals of the diode are guided to a raster plate in the head by using light-guiding fibers. A light output of the plate is passed to the system.

Description

Die Erfindung betrifft eine Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen nach Patentanspruch 1.The invention relates to an exposure apparatus for the production of screen printing stencils according to claim 1.

Die Erfindung betrifft insbesondere eine Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen mit einer Halterung für die Siebdruckschablone, einem Belichtungssystem, das mindestens eine, einen Lichtstrahl erzeugende Lichtquelle und eine Optik in einem Belichtungskopf aufweist, ferner eine digitale Signale liefernde Signalquelle, welche mit dem Belichtungssystem in einer Weise in Verbindung steht, dass entsprechend den Signalen die ganze Siebdruckschablone belichtbar ist, und wobei der Belichtungskopf relativ zur Siebdruckschablone bewegbar ist. Es handelt sich somit um ein Vorrichtung zur Implementierung eines sogenannten CtS (Computer-to-Screen) Verfahrens, also um eine Vorrichtung, bei der die auf die Druckvorlagen (Siebdruckschablonen) zu übertragenden Informationen von den digitalen Signalen eines Computers gesteuert und über ein optisches Belichtungssystem bereitgestellt werden.More particularly, the invention relates to an exposure apparatus for the production of screen printing stencils with a support for the screen printing stencil, an exposure system comprising at least one, a light beam generating light source and optics in an exposure head, further comprising a signal source supplying digital signals, which with the exposure system in a manner In connection is that according to the signals, the entire screen printing stencil is exposed, and wherein the exposure head is movable relative to the screen printing stencil. It is thus a device for implementing a so-called CtS (computer-to-screen) method, ie an apparatus in which the information to be transferred to the print templates (screen printing stencils) is controlled by the digital signals of a computer and via an optical exposure system to be provided.

Aus der EP-0 953 877 ist ein Verfahren zur Herstellung von Siebdruckformen sowie eine Belichtungsvorrichtung hierfür bekannt, die die vorstehend genannten Merkmale aufweist. Bei dieser Vorrichtung weist das Belichtungssystem ein mikromechanisches Spiegelsystem auf, das mit einer Vielzahl von zumindest teilweise beweglichen Mikrospiegeln versehen ist. Derartige mikromechanische Spiegelsysteme sind auch bekannt als sogenannte DMDs (Digital Micromirror Devices) und sind im Handel erhältlich. Bei der vorliegenden Anwendung dient das mikromechanische Spiegelsystem dazu, einen Lichtstrahl so zu lenken und zu modulieren, dass die Stellung der beweglichen Mikrospiegel in Abhängigkeit von den Signalen eines Computers derart veränderbar ist, dass der jeweils gespiegelte Teil des Lichtstrahls entweder in den Lichtausgang geht oder nicht. Der Lichtausgang bedeutet hier natürlich das zur Siebdruckform bzw. Siebdruckschablone gelenkte Licht. Als Lichtquelle wird hier ein Dauerlicht verwendet, beispielsweise elektrodenlose, mikrowellenangeregte UV-Strahler. Zudem ist auch bei dieser Vorrichtung die Halterung mit der Siebdruckform und das Belichtungssystem relativ zueinander bewegbar.From the EP-0 953 877 For example, there is known a method for producing screen printing forms and an exposure apparatus therefor which have the aforementioned features. In this device, the exposure system to a micromechanical mirror system, which is provided with a plurality of at least partially movable micromirrors. Such micromechanical mirror systems are also known as so-called DMDs (Digital Micromirror Devices) and are commercially available. In the present application, the micromechanical mirror system is used to direct and modulate a beam of light so that the position the movable micromirror in response to the signals of a computer is changeable such that the respective mirrored part of the light beam either goes into the light output or not. Of course, the light output here means the light directed to the screen printing form or screen printing stencil. The light source used here is a permanent light, for example electrodeless, microwave-excited UV lamps. In addition, in this device, the holder with the screen printing form and the exposure system is movable relative to each other.

Trotz des heute weit verbreiteten Einsatzes von DMD-Bausteinen (beispielsweise für Beamer) hat die Vorrichtung gemäss EP-0 953 877 jedoch einige gewichtige Nachteile. Da es sich bei den DMDs um mechanisch bewegte Spiegelsysteme handelt, bestehen natürlich gewisse Grenzen hinsichtlich sehr schnell zu erfolgender Wechsel in dem zu modulierenden Lichtstrahl. Gebräuchliche DMDs weisen eine Grenzfrequenz von ca. 20 kHz auf, was natürlich letztlich die ,Bebilderungsgeschwindigkeit' für die Siebdruckschablonen stark begrenzt. Insgesamt werden nach Angaben des Herstellers (CST) für einschlägige Geräte maximale Bebilderungsgeschwindigkeiten im Bereich von ca. 500 sq.ft/hr bei 65 lpi erreicht (allerdings nur bei "schnellen" Emulsionstypen und bei geringer Schablonendicke). Die erreichbare Bebilderungsgeschwindigkeit wird natürlich auch von der aufzuwendenden Strahlungsenergie bestimmt (je nach zu bebildernderndem Schablonen/Emulsions-Material werden zum Teil sehr unterschiedliche Strahlungsenergien benötigt). Auch hier sind der Anwendung von DMDs Grenzen gesetzt, weil durch die Anwendung von Spiegeln stets relativ hohe Verluste entstehen (die 'weggespiegelten' Anteile des Lichtstrahles manifestieren sich in der Form von relativ hoher Verlustwärme, die abgeführt werden muss). Schliesslich muss als Lichtquelle eine mit hoher Leistung arbeitende kontinuierliche Strahlungsquelle eingesetzt werden, was wiederum teuer ist und per se auch wieder mit relativ hoher Verlustleistung verbunden ist (weil nur ein Teil der zugeführten Energie überhaupt in nutzbare Strahlung umgesetzt wird). So werden, wiederum nach Angaben des Herstellers, UV-Lichtquellen mit Leistungen von üblicherweise 600 - 1200 Watt eingesetzt, die ihrerseits wieder eine spezielle Kühlung benötigen.Despite the widespread use of DMD components today (for example, for projectors), the device according EP-0 953 877 however, some serious disadvantages. Since the DMDs are mechanically moving mirror systems, there are of course certain limits with regard to changing very quickly in the light beam to be modulated. Common DMDs have a cutoff frequency of about 20 kHz, which of course ultimately limits the 'imaging speed' for the screen printing stencils. Overall, according to the manufacturer (CST) for relevant devices maximum imaging speeds in the range of about 500 sq.ft / hr achieved at 65 lpi (but only for "fast" emulsion types and low stencil thickness). Of course, the achievable imaging speed is also determined by the radiation energy to be applied (depending on the stencil / emulsion material to be imaged, very different radiation energies are sometimes required). Again, the application of DMDs are limited, because by the use of mirrors always relatively high losses arise (the 'reflected away' portions of the light beam manifest in the form of relatively high heat loss, which must be dissipated). Finally, the light source must be a high-performance continuous Radiation source can be used, which in turn is expensive and per se is also associated with relatively high power loss (because only a part of the energy supplied is ever converted into usable radiation). Thus, again according to the manufacturer, UV light sources with powers of usually 600 - 1200 watts used, which in turn require a special cooling.

Aufgabe der Erfindung ist es, eine verbesserte Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen anzugeben.The object of the invention is to specify an improved exposure apparatus for the production of screen printing stencils.

Diese Aufgabe wird durch die Merkmale des Patentanspruchs 1 gelöst.This object is solved by the features of patent claim 1.

Erfindungsgemäss wird vorgeschlagen, als Lichtquelle eine Anzahl n gleichartiger, im Wellenlängenbereich von 300 - 450 nm arbeitender Laserdioden zu verwenden, die von den Signalen der Signalquelle (Computer) ansteuerbar sind, die Lichtsignale der Laserdioden über eine gleiche Anzahl n lichtleitender Fasern zu einer Rasterplatte im Belichtungskopf zu führen und den Lichtausgang der Rasterplatte zu einer im Wellenlängenbereich den Laserdioden angepassten Fokussieroptik im Belichtungskopf zu leiten.According to the invention, it is proposed to use as light source a number n of similar laser diodes operating in the wavelength range of 300-450 nm, which can be driven by the signals of the signal source (computer), the light signals of the laser diodes via an equal number n of light-conducting fibers to form a grid plate in FIG To guide exposure head and to direct the light output of the grid plate to one in the wavelength range of the laser diodes adapted focusing optics in the exposure head.

Die Verwendung von direktmodulierbaren Laserdioden hat verschiedene signifikante Vorteile. Zum Einen entfällt die Notwendigkeit des kontinuierlichen Betriebes und somit kann die Verlustleistung der gesamten Belichtungsvorrichtung wesentlich gesenkt werden. Weiterhin sind der Reaktionsgeschwindigkeit von Laserdioden (zumindest in dem hier interessierenden Anwendungsbereich der Druckschablonenbelichtung) nach oben kaum Grenzen gesetzt, denn die erreichbaren Grenzfrequenzen liegen im GHz-Bereich. Weiterhin entfällt durch die einfache Ansteuerbarkeit der Laserdioden und die Abwesenheit von lichtablenkenden Spiegeln im Strahlengang eine weitere Ursache unerwünschter Verlustleistung, weil nämlich mit Ausnahme von Absorptionsverlusten in den Materialen im Strahlengang (Optikkomponenten) keine zusätzlichen Verluste in Kauf genommen werden müssen.The use of direct modulated laser diodes has several significant advantages. On the one hand eliminates the need for continuous operation and thus the power loss of the entire exposure device can be significantly reduced. Furthermore, the reaction speed of laser diodes (at least in the field of application of the printing stencil exposure of interest here) upwards has virtually no limits because the achievable cutoff frequencies are in the GHz range. Furthermore, eliminates the simple controllability of the laser diodes and the absence of light-deflecting mirrors in the beam path another cause of unwanted power loss, because namely with the exception of absorption losses in the materials in the beam path (optical components) no additional losses must be accepted.

Da für die erfindungsgemässe Lösung eine Anzahl von Laserdioden verwendet werden muss und verwendbare Laserdioden zum Zweck der Bebilderung der gewünschten Substratmaterialien auch in einem Wellenlängenbereich von 300 - 450 nm arbeitenden müssen, wurden derartige Lösungen unter anderem auch aus Kostengründen bisher gar nicht in Betracht gezogen. Seit einiger Zeit sind nun aber leistungsfähige blaue Laserdioden, die im Wellenlängenbereich von 405 nm arbeiten (von Nichia) relativ kostengünstig erhältlich. Zudem ist mit dem vermehrten Aufkommen neuer DVD-Technologien, bei denen ebenfalls blaue Laserdioden eingesetzt werden, mit einem weiteren Preiszerfall für blaue Laserdioden zu rechnen, so dass die erfindungsgemässe Lösung gegenüber den DMD- und ähnlichen Lösungen zunehmend attraktiv wird. Im Übrigen muss noch darauf hingewiesen werden, dass bei DMD-Lösungen (also bei Mikrospiegel-Chips) stets ausgesuchte Chips verwendet werden müssen (da alle Pixel voll funktionstauglich sein müssen) und dass selbst in grossen Stückzahlen hergestellte DMD-Chips mit hoher Pixel-Zahl noch immer sehr teuer sind, was die erfindungsgemässe Lösung attraktiv erscheinen lässt, insbesondere dann, wenn - wie vorgesehen - die vorgeschlagene Belichtungseinrichtung in einer Weise ausgestaltet ist, dass die Anzahl der verwendeten Laserdioden erweiterbar ist. Softwaremässig, d.h. seitens der Signalquelle bzw. des Steuercomputers, ist eine solche Erweiterbarkeit (beispielsweise mit einer doppelten Anzahl von Laserdioden) hinsichtlich der Anpassbarkeit des einzusetzenden Steuerprogramms relativ einfach umzusetzen. Zudem gewinnt man mit dieser Massnahme den Vorteil, dass Geräte in verschiedenen Preis- und Leistungsklassen angeboten werden können.Since a number of laser diodes must be used for the inventive solution and usable laser diodes for the purpose of imaging the desired substrate materials in a wavelength range of 300 - 450 nm have to work, such solutions have not been taken into account, among other reasons, for cost reasons. However, powerful blue laser diodes operating in the wavelength range of 405 nm (by Nichia) have been available relatively inexpensively for some time now. In addition, with the increased advent of new DVD technologies, in which blue laser diodes are also used, to expect further price decay for blue laser diodes, so that the inventive solution over the DMD and similar solutions is increasingly attractive. Incidentally, it must be pointed out that in DMD solutions (ie micromirror chips) always selected chips must be used (since all pixels must be fully functional) and that even produced in large quantities DMD chips with high pixel count still very expensive, which makes the solution according to the invention look attractive, especially if - as intended - the proposed exposure device is designed in such a way that the number of laser diodes used can be extended. In terms of software, ie on the part of the signal source or of the control computer, such expandability (for example with a double number of laser diodes) is relatively easy to implement with regard to the adaptability of the control program to be used. In addition, one gains with this measure the advantage that devices in different Price and performance classes can be offered.

Die erfindungsgemässe Belichtungsvorrichtung lässt sich zudem grundsätzlich sowohl für flache Siebdruckschablonenherstellung als auch für zylindrische Siebdruckschablonenherstellung einsetzen.In addition, the exposure device according to the invention can basically be used both for flat screen printing stencil production and for cylindrical screen printing stencil production.

Eine Rasteranordnung einzeln ansteuerbarer Lichtquellen (in diesem Fall die Laserdioden) ist für Belichtungsvorrichtungen dieser Art jedoch von zentraler Bedeutung. Dabei müssen die Laserdioden selbst noch nicht notwendigerweise in der für die Belichtung des Schablonenmateriales notwendigen Rasteranordnung montiert sein. Vielmehr genügt es, die lichtleitenden Fasern zu einer Rasterplatte im Belichtungskopf zu führen und die Rasterplatte selbst so zu gestalten, dass die lichtleitenden Fasern dort in der für die Belichtung des Schablonenmateriales notwendigen Rasteranordnung erscheinen. Die Rasterplatte ist somit ein Faser-Array, das die lichtleitenden Fasern aufnimmt und diese in einer rechteckigen oder trapezartigen Rasteranordnung parallel zur optischen Achse der Fokussieroptik ausrichtet. Da vorgesehen ist, die lichtleitenden Fasern beidseits, also sowohl bei den Anschlüssen an die Laserdioden wie auch bei den Anschlüssen an die Rasterplatte, steckbar zu gestalten, ergeben sich Vorteile hinsichtlich der Flexibilität und Wartbarkeit.However, a grid arrangement of individually controllable light sources (in this case the laser diodes) is of central importance for exposure apparatuses of this kind. In this case, the laser diodes themselves need not necessarily be mounted in the grid arrangement necessary for the exposure of the stencil material. Rather, it is sufficient to guide the photoconductive fibers to a grid plate in the exposure head and to make the grid plate itself so that the photoconductive fibers appear there in the necessary for the exposure of the template material grid arrangement. The grid plate is thus a fiber array which receives the photoconductive fibers and aligns them in a rectangular or trapezoidal grid arrangement parallel to the optical axis of the focusing optics. Since it is provided to make the light-conducting fibers on both sides, so both in the connections to the laser diodes as well as in the connections to the grid plate pluggable, there are advantages in terms of flexibility and maintainability.

Die Rasterplatte in der Rasteranordnung stellt somit eine Anzahl n von parallel zur optischen Achse der Fokussieroptik ausgerichtete Lichtstrahlen der Laserdioden bereit, wobei der Strahldurchmesser der einzelnen Lichtstrahlen im wesentlichen dem Durchmesser der lichtleitende Fasern entspricht und die Aufgabe der Fokussieroptik darin besteht, ein verkleinertes oder vergrössertes Abbild dieser Rasteranordnung auf dem zu bebildernden (belichtenden) Schablonenmaterial zu erzeugen. Um Unebenheiten des Schablonenmateriales im Betrieb ausgleichen zu können, ist die Fokussieroptik vorzugsweise auch mit einer Autofokussiereinrichtung ausgerüstet.The grid plate in the grid arrangement thus provides a number n of light beams of the laser diodes aligned parallel to the optical axis of the focusing optics, the beam diameter of the individual light beams essentially corresponding to the diameter of the light-conducting fibers and the object of the focusing optics being a reduced or enlarged image to generate this grid arrangement on the stencil material to be imaged (exposing). To compensate for unevenness of the stencil material during operation To be able to, the focusing optics is preferably also equipped with a Autofokussiereinrichtung.

Die vorgeschlagene erfindungsgemässe Belichtungsvorrichtung lässt sich besonders gut bei einer in Portalbauweise aufgebauten Belichtungseinheit realisieren. Derartige Belichtungseinheiten sind wegen der Grösse der zu belichtenden Siebdruckschablonen platzsparend oft vertikal angeordnet, d.h. die Halterung für die Siebdruckschablone liegt in einer vertikalen Ebene. Die Belichtungseinheit bildet dabei zusammen mit einer Steuereinheit und einer Rechnereinheit die Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen. Vorteilhafterweise sind dabei die Laserdioden und die lichtleitenden Fasern in wärmeableitenden Modulen in einem Interfaceteil einsteckbar angeordnet.The proposed exposure device according to the invention can be realized particularly well in the case of a gantry-type exposure unit. Such exposure units are often arranged vertically to save space due to the size of the screen printing stencils to be exposed, i. the holder for the screen printing stencil lies in a vertical plane. The exposure unit forms, together with a control unit and a computer unit, the exposure device for producing screen printing stencils. Advantageously, the laser diodes and the light-conducting fibers are arranged insertable in heat-dissipating modules in an interface part.

Das Interfaceteil ist dabei mit den Modulen in einer Weise an der Belichtungseinheit angeordnet, dass es die Bewegungen des Belichtungskopfes nur in einer der zur Belichtung eines Schablonenmateriales erforderlichen Bewegungsrichtungen mitmacht, um die für einen Belichtungsvorgang zu bewegende Masse möglichst klein zu halten. Dies ist beispielsweise der Fall, wenn das Interfaceteil mit den Modulen auf dem Portalarm eines in Portalbauweise aufgebauten Belichtungstisches angeordnet ist. Das Interfaceteil macht dann die relativ langsamen Bewegungen des Belichtungskopf in X-Richtung (Bewegungsrichtung des Portalarms) mit, die relativ schnellen Bewegungen des Belichtungskopf in Y-Richtung (Bewegungsrichtung des Belichtungskopfes auf dem Portalarm) jedoch nicht. Alternativ wäre es auch möglich, das Interfaceteil mit den Modulen an der Belichtungseinheit fix anzubringen. Das Interfaceteil mit den Modulen würde dann gar keine der Bewegungen des Belichtungskopfes in den zur Belichtung eines Schablonenmateriales erforderlichen Bewegungsrichtungen mitmachen.The interface part is arranged with the modules in a manner to the exposure unit that it participates the movements of the exposure head only in one of the required for the exposure of a stencil material movement directions to keep the mass to be moved for an exposure process as small as possible. This is the case, for example, when the interface part with the modules is arranged on the portal arm of a gantry-type exposure table. The interface part makes then the relatively slow movements of the exposure head in the X direction (movement direction of the portal arm) with, the relatively fast movements of the exposure head in the Y direction (movement direction of the exposure head on the portal arm) but not. Alternatively, it would also be possible to fix the interface part with the modules to the exposure unit. The interface part with the modules would then not participate in any of the movements of the exposure head in the directions of movement required for the exposure of a stencil material.

Ein weiterer Vorteil der erfindungsgemässen Belichtungsvorrichtung liegt zweifellos auch darin, dass durch die Möglichkeit der Verwendung einer im Wellenlängenbereich den Laserdioden angepassten Fokussieroptik im Belichtungskopf preisgünstigere Optiken eingesetzt werden können. Wird nämlich mit Lichtquellen mit einer breiteren spektralen Verteilung als bei Laserdioden gearbeitet, muss wegen der erforderlichen Fokussiergenauigkeit auch die Optik für den ganzen abzudeckenden Spektralbereich optimiert sein. Da bei der erfindungsgemässen Belichtungsvorrichtung auch vorgesehen ist, die Belichtungsoptiken austauschbar oder mit geringem Aufwand umschaltbar zu gestalten, kann die Vorrichtung sehr leicht auf die Bearbeitung von Schablonenmaterial mit unterschiedlichen Anforderungen bezüglich spektraler Empfindlichkeit umgestellt werden.Another advantage of the exposure device according to the invention is undoubtedly also the fact that cheaper optics can be used in the exposure head due to the possibility of using a focusing optics adapted to the laser diodes in the wavelength range. Namely, if you work with light sources with a wider spectral distribution than in laser diodes, the optics must be optimized for the entire spectral range to be covered because of the required focusing accuracy. Since it is also provided in the exposure device according to the invention that the exposure optics can be changed interchangeably or with little effort, the device can be easily switched to the processing of stencil material with different spectral sensitivity requirements.

Das neue Maschinenkonzept hat deshalb insbesondere bezüglich Umstellbarkeit, Wartbarkeit und Erweiterbarkeit ganz beträchtliche Vorteile gegenüber den gängigen Maschinenkonzepten.The new machine concept therefore has considerable advantages compared to the usual machine concepts, particularly with regard to adjustability, maintainability and expandability.

Im Folgenden wird die Erfindung anhand eines Ausführungsbeispieles näher erläutert.In the following the invention will be explained in more detail with reference to an embodiment.

Dabei zeigt die einzige Figur:

Fig. 1
eine Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen in Portalbauweise.
The only figure shows:
Fig. 1
an exposure device for the production of screen printing stencils in portal construction.

Eine Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen ist in Portalbauweise ausgeführt und besteht im wesentlichen aus einer Belichtungseinheit 1, einer Steuereinheit 2 und einer Rechnereinheit 3.An exposure apparatus for the production of screen printing stencils is designed in portal construction and consists essentially of an exposure unit 1, a control unit 2 and a computer unit 3.

Die Belichtungseinheit 1 umfasst dabei einen vertikal angeordneten Bearbeitungstisch mit einer Halterung 4 für (zu belichtende) Siebdruckschablonen 5. Über der Halterung 4 und der Siebdruckschablone ist ein Portalarm 6 auf einer X-Achsenführung 7 in einer X-Richtung bewegbar. Auf dem Portalarm 6 ist auf einer Y-Achsenführung 8 ein Belichtungskopf 9 mit einer Fokussieroptik 10 in einer Y-Richtung bewegbar. Die X-Richtung entspricht somit der Bewegungsrichtung des Portalarms 6. Sowohl für die Bewegung in X-Richtung als auch für die Bewegung in Y-Richtung sind Präzisionsführungen und Präzisionsantriebe vorhanden (nicht dargestellt).The exposure unit 1 comprises a vertically arranged processing table with a holder 4 for screen printing stencils (to be exposed). Above the holder 4 and the screen printing stencil a portal arm 6 is movable on an X-axis guide 7 in an X direction. On the portal arm 6, an exposure head 9 with a focusing lens 10 in a Y-direction is movable on a Y-axis guide 8. The X-direction thus corresponds to the direction of movement of the portal arm 6. Both for the movement in the X direction and for the movement in the Y direction precision guides and precision drives are present (not shown).

Am Portalarm 6 ist ein Interfaceteil 11 angebracht. Auf dem Interfaceteil 11 befinden sich mehrere wärmeableitende Module 12 mit Gruppen von Laserdioden sowie ein Datenverteiler 13 und Schnittstellen-Elektronikkomponenten (nicht dargestellt). Im Interfaceteil werden die von der Rechnereinheit 3 als Signalquelle stammenden digitalen Signale in optische Signale umgewandelt. Da der Belichtungskopf 9 gegenüber den Modulen 12 mit den Laserdioden beweglich angeordnet ist, werden die Signale von den Laserdioden über lichtleitende Fasern über eine Y-Schleppkette 14 zum Belichtungskopf 9 übertragen.At Portalarm 6 an interface part 11 is attached. On the interface part 11 are several heat-dissipating modules 12 with groups of laser diodes and a data distributor 13 and interface electronic components (not shown). In the interface part, the digital signals originating from the computer unit 3 as a signal source are converted into optical signals. Since the exposure head 9 is arranged to be movable relative to the modules 12 with the laser diodes, the signals are transmitted from the laser diodes via optical fibers via a Y-drag chain 14 to the exposure head 9.

Beispielsweise können so auf dem Interfaceteil 4 bis 8 Module 12 mit Gruppen von je 16 Laserdioden angeordnet sein. Dies ergibt dann insgesamt eine Anzahl n von 64 bis 128 Laserdioden, wobei der Lichtausgang jeder Laserdiode über je eine separate lichtleitende Faser über die Y-Schleppkette 14 zur Rasterplatte im Belichtungskopf 9 geleitet wird. Die Laserdioden arbeiten dabei vorteilhafterweise in einem Wellenlängenbereich von 300 - 450 nm, vorzugsweise im Blaulichtbereich bei 405 nm. Die Laserdioden werden in einem direktmodulierten Betrieb verwendet, d.h. sie werden in der üblichen Art direkt von einem digitalen Signal angesteuert.For example, 4 to 8 modules 12 may be arranged with groups of 16 laser diodes on the interface part. This then results in a total number n of 64 to 128 laser diodes, wherein the light output of each laser diode via a separate photoconductive fiber via the Y-drag chain 14 to the grid plate in the exposure head 9 is passed. The laser diodes operate advantageously in a wavelength range of 300-450 nm, preferably in the blue light range at 405 nm. The laser diodes are used in a direct modulated operation, ie they are in the usual type directly controlled by a digital signal.

Da auch der Portalarm 6 mit dem Interfaceteil 11 gegenüber dem Bearbeitungstisch bzw. der Halterung 4 beweglich angeordnet ist, werden die Signale zum Datenverteiler 13 über eine X-Schleppkette 15 übertragen. Im Gegensatz zur Y-Schleppkette 14 werden hier aber auch noch die erforderlichen Signale und Stromzuführungen für die Steuerung und Bewegung des Belichtungskopfes 9 in Y-Richtung mitgeführt.Since the portal arm 6 with the interface part 11 is arranged to be movable with respect to the processing table or the holder 4, the signals are transmitted to the data distributor 13 via an X-drag chain 15. In contrast to the Y-drag chain 14 but here also the necessary signals and power supplies for the control and movement of the exposure head 9 are carried in the Y direction.

Bei Geräten dieser Art wird eine von der Halterung 4 aufgenommene Siebdruckschablone 5 durch Bewegungen des Belichtungskopfes in X- und Y-Richtung vollständig oder teilweise belichtet. Dabei kann davon ausgegangen werden, dass die Bewegung in X-Richtung in der Regel langsamer erfolgt als die Bewegung in Y-Richtung, weil in Y-Richtung nur eine sehr viel kleinere Masse bewegt werden muss.In devices of this type, a recorded by the holder 4 screen printing stencil 5 is fully or partially exposed by movements of the exposure head in the X and Y directions. It can be assumed that the movement in the X direction is usually slower than the movement in the Y direction, because in the Y direction only a much smaller mass must be moved.

Die Funktion der Steuereinheit 2 besteht grundsätzlich darin, die Bewegungen des Belichtungskopfes 9 in X- und Y-Richtung zu steuern. Die dazu notwendigen Funktionen sind vorteilhafterweise in einer speicherprogrammierbaren Steuerung 16 (SPS-Einheit) realisiert. Die Steuereinheit 2 enthält auch die zur Bewegungssteuerung notwendigen Treiberschaltungen etc.The function of the control unit 2 is basically to control the movements of the exposure head 9 in the X and Y directions. The necessary functions are advantageously realized in a programmable logic controller 16 (PLC unit). The control unit 2 also contains the drive circuits necessary for the motion control, etc.

Von der Rechnereinheit 3 (Signalquelle) schliesslich werden die auf eine Siebdruckschablone 5 zu belichtenden Daten bereitgestellt und der Belichtungsvorgang gesteuert. Sowohl die Funktionen der Rechnereinheit 3 wie auch die Funktionen der Steuereinheit 2 sind aus gattungsgemässen Geräten dem Fachmann wohlbekannt und bedürfen deshalb hier keiner weiteren Erläuterung.Finally, the computer unit 3 (signal source) provides the data to be exposed on a screen printing stencil 5 and controls the exposure process. Both the functions of the computer unit 3 as well as the functions of the control unit 2 are well known to those skilled in the art from generic devices and therefore require no further explanation here.

Im neuen Maschinenkonzept gemäss obiger Beschreibung ist auch vorgesehen, mit diversen Einzelmassnahmen eine möglichst grosse Flexibilität zu erreichen, so z.B. mit:

  • konsequenter Realisierung des Modulkonzeptes für die Laserdioden, wobei jeweils pro Modul 12 im Interfaceteil 11 eine fixe Anzahl von Laserdioden eines gewünschten Typs vorhanden ist. Durch den Einbau zusätzlicher Module kann so die Bebilderungsgeschwindigkeit der Belichtungsvorrichtung auf einfache Weise erhöht werden (Ausbaubarkeit/Leistungssteigerung).
  • beidseitig steckbaren lichtleitenden Fasern zwischen den Modulen 12 und der Rasterplatte im Belichtungskopf 9. Diese erleichtert nicht nur die Wartbarkeit des Systems sondern erleichtert auch die Ausbaubarkeit.
  • mit der Austauschbarkeit der Fokussieroptik 10 im Belichtungskopf 9. Indem zusammen mit den gewünschten Laserdioden Fokussieroptiken verwendet werden, die auf den Wellenlängenbereich der verwendeten Laserdioden abgestimmt sind, können auch sehr unterschiedliche Materialen für die Siebdruckschablonen bearbeitet werden.
In the new machine concept according to the above description is also intended to achieve the greatest possible flexibility with various individual measures, for example with:
  • consistent implementation of the module concept for the laser diodes, wherein each module 12 in the interface part 11, a fixed number of laser diodes of a desired type is present. By installing additional modules, the imaging speed of the exposure device can thus be increased in a simple manner (expandability / performance increase).
  • Both sides pluggable optical fibers between the modules 12 and the grid plate in the exposure head 9. This not only facilitates the maintainability of the system but also facilitates the expandability.
  • With the interchangeability of the focusing optics 10 in the exposure head 9. By using together with the desired laser diodes focusing optics, which are tuned to the wavelength range of the laser diodes used, very different materials for the screen stencils can be edited.

Insgesamt erhält man mit der erfindungsgemässen Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen ein preisgünstiges, leistungsfähiges und ausbaubares System, mit dem grundsätzlich alle gängigen Materialien für Siebdruckschablonen bearbeitet werden können.Overall, with the exposure device according to the invention for the production of screen printing stencils, a low-cost, high-performance and expandable system is obtained, with which in principle all current materials for screen printing stencils can be processed.

Claims (12)

Belichtungsvorrichtung zur Herstellung von Siebdruckschablonen (5), mit einer Halterung (4) für die Siebdruckschablone (5), einem Belichtungssystem, das mindestens eine, einen Lichtstrahl erzeugende Lichtquelle und eine Optik in einem Belichtungskopf (9) aufweist, ferner mit einer digitale Signale liefernden Signalquelle, welche mit dem Belichtungssystem in einer Weise in Verbindung steht, dass entsprechend den Signalen die ganze Siebdruckschablone (5) belichtbar ist, wobei der Belichtungskopf (9) relativ zur Siebdruckschablone (5) bewegbar ist, dadurch gekennzeichnet, dass die Lichtquelle eine Anzahl n gleichartiger, im Wellenlängenbereich von 300 - 450 nm arbeitender Laserdioden aufweist, die von den Signalen der Signalquelle ansteuerbar sind, die Lichtsignale der Laserdioden über eine gleiche Anzahl n lichtleitender Fasern zu einer Rasterplatte im Belichtungskopf (9) geführt sind und der Lichtausgang der Rasterplatte zu einer im Wellenlängenbereich den Laserdioden angepassten Fokussieroptik (10) im Belichtungskopf (9) geleitet wird.An exposure apparatus for the production of screen printing stencils (5), comprising a support (4) for the screen printing stencil (5), an exposure system comprising at least one light beam generating light source and optics in an exposure head (9), further comprising digital signals Signal source which is in communication with the exposure system in such a way that the entire screen printing stencil (5) can be exposed, the exposure head (9) being movable relative to the screen printing stencil (5), characterized in that the light source has a number n similar, in the wavelength range of 300 - 450 nm working laser diodes which are driven by the signals of the signal source, the light signals of the laser diodes over an equal number n of light-conducting fibers to a grid plate in the exposure head (9) are guided and the light output of the grid plate to a in the wavelength range adapted to the laser diodes F Okussieroptik (10) in the exposure head (9) is passed. Belichtungsvorrichtung nach Patentanspruch 1, dadurch gekennzeichnet, dass die Belichtungsvorrichtung sowohl für flache Siebdruckschablonenherstellung als auch für zylindrische Siebdruckschablonenherstellung einsetzbar ist.Exposure device according to Patent Claim 1, characterized in that the exposure device can be used both for flat screen printing stencil production and for cylindrical screen printing stencil production. Belichtungsvorrichtung nach Patentanspruch 1 oder 2, dadurch gekennzeichnet, dass direktmodulierte Laserdioden verwendet werden.Exposure device according to claim 1 or 2, characterized in that direct modulated laser diodes are used. Belichtungsvorrichtung nach Patentanspruch 3, dadurch gekennzeichnet, dass die Laserdioden in einem gepulsten Energiebereich von > 30 mW, vorzugsweise >= 200 mW arbeiten, um alle handelsüblichen Schablonenmaterialien bebildern zu können.Exposure device according to Patent Claim 3, characterized in that the laser diodes operate in a pulsed energy range of> 30 mW, preferably> = 200 mW, in order to be able to image all commercially available stencil materials. Belichtungsvorrichtung nach Patentanspruch 3, dadurch gekennzeichnet, dass die Laserdioden vorzugsweise im Blaulichtbereich bei 405 nm arbeiten.Exposure device according to claim 3, characterized in that the laser diodes preferably operate in the blue light range at 405 nm. Belichtungsvorrichtung nach einem der Patentansprüche 1 bis 5, dadurch gekennzeichnet, dass das Belichtungssystem in der Anzahl n der verwendeten Laserdioden erweiterbar ist.Exposure device according to one of the claims 1 to 5, characterized in that the exposure system is expandable in the number n of the laser diodes used. Belichtungsvorrichtung nach einem der Patentansprüche 1 bis 6, dadurch gekennzeichnet, dass die Laserdioden und die lichtleitenden Fasern in wärmeableitenden Modulen (12) in einem Interfaceteil (11) einsteckbar angeordnet sind.Exposure device according to one of the claims 1 to 6, characterized in that the laser diodes and the light-conducting fibers in heat-dissipating modules (12) in an interface part (11) are arranged insertable. Belichtungsvorrichtung nach Patentanspruch 7, dadurch gekennzeichnet, dass das Interfaceteil (11) mit den Modulen (12) in einer Weise angeordnet ist, dass es die Bewegungen des Belichtungskopfes (9) nicht oder nur in einer der zur Belichtung eines Schablonenmateriales erforderlichen Bewegungsrichtungen mitmacht, um die für einen Belichtungsvorgang zu bewegende Masse möglichst klein zu halten.Exposure device according to claim 7, characterized in that the interface part (11) is arranged with the modules (12) in such a way that it does not participate in the movements of the exposure head (9) or only in one of the directions of movement required for the exposure of a stencil material To keep the mass to be moved for an exposure process as small as possible. Belichtungsvorrichtung nach Patentanspruch 8, dadurch gekennzeichnet, dass das Interfaceteil (11) mit den Modulen (12) auf einem Portalarm (6) einer in Portalbauweise aufgebauten Belichtungseinheit angeordnet ist.An exposure apparatus according to claim 8, characterized in that the interface part (11) with the modules (12) on a gantry arm (6) of a portal type constructed exposure unit is arranged. Belichtungsvorrichtung nach einem der Patentansprüche 1 bis 9, dadurch gekennzeichnet, dass die Rasterplatte ein Faser-Array ist, das die lichtleitenden Fasern aufnimmt und diese in einer rechteckigen oder trapezartigen Rasteranordnung parallel zur optischen Achse der Fokussieroptik (10) ausrichtet.Exposure device according to one of the claims 1 to 9, characterized in that the grid plate is a fiber array which receives the photoconductive fibers and aligns them in a rectangular or trapezoidal grid arrangement parallel to the optical axis of the focusing optics (10). Belichtungsvorrichtung nach Patentanspruch 10, dadurch gekennzeichnet, dass die Rasterplatte in der Rasteranordnung eine Anzahl n von parallel zur optischen Achse der Fokussieroptik (10) ausgerichtete Lichtstrahlen der Laserdioden bereitstellt, wobei der Strahldurchmesser der einzelnen Lichtstrahlen im wesentlichen dem Durchmesser der lichtleitende Fasern entspricht und die Fokussieroptik (10) ein verkleinertes oder vergrössertes Abbild dieser Rasteranordnung auf dem zu bebildernden Schablonenmaterial bereitstellt.Exposure device according to claim 10, characterized in that the grid plate in the grid arrangement provides a number n of parallel to the optical axis of the focusing optics (10) aligned light beams of the laser diodes, wherein the beam diameter of the individual light beams substantially equal to the diameter of the photoconductive fibers and the focusing optics (10) provides a scaled down or enlarged image of this grid array on the template material to be imaged. Belichtungsvorrichtung nach Patentanspruch 11, dadurch gekennzeichnet, dass die Fokussieroptik (10) eine Autofokuseinrichtung aufweist.Exposure device according to Patent Claim 11, characterized in that the focusing optics (10) has an autofocus device.
EP06405369.7A 2006-08-25 2006-08-25 Exposure device for producing printing screen Active EP1892576B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP06405369.7A EP1892576B1 (en) 2006-08-25 2006-08-25 Exposure device for producing printing screen
DK06405369.7T DK1892576T3 (en) 2006-08-25 2006-08-25 Exposure device to produce screen printing templates
PCT/CH2007/000419 WO2008022485A1 (en) 2006-08-25 2007-08-23 Exposure device for producing screen printing stencils
CN2007800315372A CN101506738B (en) 2006-08-25 2007-08-23 Exposure device for the production of screen print stencils
US11/895,646 US20080047445A1 (en) 2006-08-25 2007-08-24 Exposure device for the production of screen print stencils

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06405369.7A EP1892576B1 (en) 2006-08-25 2006-08-25 Exposure device for producing printing screen

Publications (2)

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EP1892576A1 true EP1892576A1 (en) 2008-02-27
EP1892576B1 EP1892576B1 (en) 2013-06-12

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EP06405369.7A Active EP1892576B1 (en) 2006-08-25 2006-08-25 Exposure device for producing printing screen

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US (1) US20080047445A1 (en)
EP (1) EP1892576B1 (en)
CN (1) CN101506738B (en)
DK (1) DK1892576T3 (en)
WO (1) WO2008022485A1 (en)

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EP2360528A1 (en) 2010-02-23 2011-08-24 XPOSE Holding AG Exposure device for producing print templates and use of same
WO2014143928A1 (en) 2013-03-15 2014-09-18 M&R Printing Equipment, Inc. Method and apparatus for preparing a screen printing screen
CN112644145A (en) * 2020-12-18 2021-04-13 林青仕 Auxiliary environment-friendly equipment for conveniently manufacturing non-setting adhesive screen printing plate
CN112937077A (en) * 2021-04-16 2021-06-11 赵成刚 High-precision silk-screen printing laser plate-making machine

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TWI448830B (en) 2010-02-09 2014-08-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2011104180A1 (en) 2010-02-23 2011-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL2006261A (en) 2010-02-25 2011-08-29 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9696633B2 (en) 2010-04-12 2017-07-04 Asml Netherlands B.V. Substrate handling apparatus and lithographic apparatus
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JP5793236B2 (en) 2011-03-29 2015-10-14 エーエスエムエル ネザーランズ ビー．ブイ． Measurement of the position of the radiation beam spot in lithography.
NL2008426A (en) 2011-04-08 2012-10-09 Asml Netherlands Bv Lithographic apparatus, programmable patterning device and lithographic method.
KR101579916B1 (en) 2011-04-21 2015-12-23 에이에스엠엘 네델란즈 비.브이. Lithographic apparatus, method for maintaining a lithographic apparatus and device manufacturing method
US9690210B2 (en) 2011-08-18 2017-06-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL2009342A (en) 2011-10-31 2013-05-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US10346729B2 (en) 2011-11-29 2019-07-09 Asml Netherlands B.V. Apparatus and method for converting a vector-based representation of a desired device pattern for a lithography apparatus, apparatus and method for providing data to a programmable patterning device, a lithography apparatus and a device manufacturing method
KR101616764B1 (en) 2011-11-29 2016-04-29 에이에스엠엘 네델란즈 비.브이. Lithographic apparatus, device manufacturing method and computer program
NL2009806A (en) 2011-12-05 2013-06-10 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
WO2013083383A1 (en) 2011-12-06 2013-06-13 Asml Netherlands B.V. A lithography apparatus, an apparatus for providing setpoint data, a device manufacturing method, a method of calculating setpoint data and a computer program
NL2009902A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
KR101633759B1 (en) 2012-01-12 2016-06-27 에이에스엠엘 네델란즈 비.브이. A lithography apparatus, an apparatus for providing setpoint data, a device manufacturing method, a method for providing setpoint data and a computer program
CN104054024B (en) 2012-01-17 2017-06-13 Asml荷兰有限公司 Lithographic equipment and device producing method
US9715183B2 (en) 2012-02-23 2017-07-25 Asml Netherlands B.V. Device, lithographic apparatus, method for guiding radiation and device manufacturing method
NL2012052A (en) 2013-01-29 2014-08-04 Asml Netherlands Bv A radiation modulator for a lithography apparatus, a lithography apparatus, a method of modulating radiation for use in lithography, and a device manufacturing method.
CN105954974A (en) * 2016-06-27 2016-09-21 深圳劲嘉集团股份有限公司 Silkscreen plate laser plate-making equipment and plate-making method thereof
CN106647185A (en) * 2016-12-31 2017-05-10 江苏九迪激光装备科技有限公司 Silk-screen printing direct platemaking system and platemaking method
CN106647184B (en) * 2016-12-31 2019-06-14 江苏九迪激光装备科技有限公司 A kind of exposure method of write-through screen printing equipment
US10576733B2 (en) 2017-02-14 2020-03-03 M&R Printing Equipment, Inc. Tuneable flat panel UV exposure system for screen printing
JP7118394B2 (en) * 2018-01-31 2022-08-16 ミタニマイクロニクス株式会社 Screen mask manufacturing method
CN111391475A (en) * 2020-04-18 2020-07-10 杨林 Linear flowing exposure device for printing screen printing plate

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EP2360528A1 (en) 2010-02-23 2011-08-24 XPOSE Holding AG Exposure device for producing print templates and use of same
WO2011103972A1 (en) 2010-02-23 2011-09-01 Xpose Holding Ag Exposure device for producing printing originals and use of an exposure device
WO2014143928A1 (en) 2013-03-15 2014-09-18 M&R Printing Equipment, Inc. Method and apparatus for preparing a screen printing screen
CN112644145A (en) * 2020-12-18 2021-04-13 林青仕 Auxiliary environment-friendly equipment for conveniently manufacturing non-setting adhesive screen printing plate
CN112937077A (en) * 2021-04-16 2021-06-11 赵成刚 High-precision silk-screen printing laser plate-making machine

Also Published As

Publication number Publication date
CN101506738A (en) 2009-08-12
EP1892576B1 (en) 2013-06-12
WO2008022485A1 (en) 2008-02-28
US20080047445A1 (en) 2008-02-28
DK1892576T3 (en) 2013-09-16
CN101506738B (en) 2011-08-10

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