Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
  • H05K3/061—Etching masks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
  • H01Q15/14—Reflecting surfaces; Equivalent structures
  • H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0284—Details of three-dimensional rigid printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09018—Rigid curved substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
  • H05K2203/107—Using laser light
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0017—Etching of the substrate by chemical or physical means
  • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
  • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
  • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49155—Manufacturing circuit on or in base
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49155—Manufacturing circuit on or in base
  • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49155—Manufacturing circuit on or in base
  • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Definitions

• the present invention relates to a method for producing electrically conductive patterns on a non-developable three-dimensional surface of an insulating substrate. Although not exclusively, it is particularly suitable for producing, on a surface at least approximately in the form of a paraboloid, a hyperboloid, etc., a polarization grid (frequency reuse antenna) or a series of resonant patterns (dichroic antennas).
• the invention also relates to devices comprising such a substrate, said non-developable surface carrying said electrically conductive patterns, made according to the method.
• the outline of said patterns is mechanically traced thereon by means of a tool that digs grooves whose depth is at least equal to the thickness of said layer of protection, and then said layers are subjected to the action of a chemical agent capable of selectively attacking said electrically conductive material without attacking said material. protection, this etching operation being continued for a time sufficient for said electrically conductive material to be removed over its entire thickness above said grooves, after which the parts of said layer are peeled off from the substrate; electrically conductive material exterior to said patterns.
• electrically conductive patterns can be made directly on non-developable three-dimensional surfaces without resorting to a mask or an auxiliary substrate with which, moreover, it would be technically difficult to obtain optical characteristics. They are as precise in their shape as in their position on the said surfaces.
• a tool for the tracing of the contours of said electrically conductive patterns, a tool provided with at least one etching tip or at least one cutting blade is used, said tool being mounted in a machine (eg controlled digital and five axes of rotation) responsible for moving relative to the non-developable surface.
• a machine eg controlled digital and five axes of rotation
• the implementation of this known method allows the realization of high quality grid reflectors, able to work in the Ku band (from 1 1 to 18 GHz) and formed of at least one network of parallel conductive wires, these conductors son having a width of 0.25 mm, a thickness of 35 micrometers and being distributed in a pitch of 1 mm on an area at least approximately in the form of paraboloid, whose opening diameter can reach 2300 mm.
• the edge effects become significant, the tips or blades pushing, in the manner of a plow, the conductive material of reduced thickness and reducing the adhesion of the conductive wires to the substrate; and - the zones between wires are fragile and are therefore liable to break during peeling.
• the present invention aims to overcome these disadvantages.
• the method for producing electrically conductive patterns on a non-developable three-dimensional surface of an electrically insulating substrate the method according to which one begins by uniformly covering said non-developable surface with a layer of an electrically conductive material, which is in turn covered with a layer of a protective material, after which portions of said layer of protective material which do not cover areas of said layer of electrically conductors trice to form said patterns, and then removing portions of said layer of electrically conductive material discovered by the removal of said portions of said layer of protective material, is remarkable in that the removal of portions of the layer of protective material , which do not cover said zones of said layer of electrically conductive material to form said patterns, is made by laser ablation using a laser head that is moved, with respect to said non-developable surface covered with said layer of electrically conductive material and said layer of protective material, to cover all portions of said layer of protective material which do not cover said areas of said layer of electrically conductive material to form said electrically conductive patterns.
• the portions of the layer of electrically conductive material are removed by the action of a chemical agent capable of attacking the material electrically conductive without attacking said protective material.
• said chemical agent may be iron perchloride, when said layer is copper.
• said protective material insensitive to the action of said chemical agent, may be an organic varnish.
• a device such as a reflector for example, comprising an electrically insulating substrate carrying electrically conductive patterns on one of its non-developable surfaces with three dimensions and remarkable in that said electrically conductive patterns are realized by the implementation of the method according to the invention specified above.
• FIG. 1 schematically represents an antenna device, whose reflector is provided with electrically conductive patterns produced by the implementation of the method according to the present invention.
• FIGS. 3A to 3D schematically illustrate, in section, steps of the method according to the present invention, applied to the production of the electrically conductive patterns of FIGS. 1 and 2.
• FIG. 1 diagrammatically shows a device antenna 1 provided with an antenna reflector 2 (shown in diametral section), supported by a bearing surface 3, via a support 4.
• the reflector 2 comprises an electrically insulating substrate 5 (for example made of composite material), the surface 6 opposite the support 4 is concave and has a non-developable shape, for example the at least approximate shape of a paraboloid, a hyperbolo ⁇ de, etc ...
• the reflector 2 carries electrically conductive patterns, formed in the example shown by conductors 7 parallel to each other and equidistant.
• Each conductor 7 has a rectangular section of width et and thickness e and the distribution pitch of the parallel conductors 7 is designated p.
• a separation zone 8 band-shaped having a width equal to p (see also Figure 2).
• the reflector 2 begins by uniformly covering the non-developable surface 6 of the substrate 5 by a layer 9 of an electrically conductive material (see Figure 3A) of thickness equal to e .
• a layer 9 may, for example, be deposited under vacuum on the surface 6 or be attached thereto by gluing. It may be metallic and for example constituted by copper or aluminum.
• said layer of electrically conductive material 9 is covered by a layer 10 of a protective material, for example an organic varnish.
• the laser protective ablation portions of the protective material layer 10 are then laser-ablated by means of a moving laser head. Placing the separation zones 8, that is to say which do not cover the zones of the layer 9 to form the conductors 7. After this laser ablation, it does not remain on the layer of electrically conductive material anymore. 9 lines 10.7 protective material, above the future conductors 7 and having the width I.
• the protective lines 10.7 and the conductive layer 9 are subjected to the action of a chemical agent, for example applied by spraying or dipping.
• This chemical agent attacks, between the lines 10.7, the layer of electrically conductive material 9, without attacking said lines 10.7 of protective material.
• the chemical agent then selectively eliminating the conductive layer 9, is for example iron perchloride, when the layer 9 is copper.
• the action of the chemical agent on the conductive layer 9 is continued until it is removed over its entire thickness in line with the separation zones 8 ( Figure 3C). This results in driver training 7.
• the removal of the lines 10.7 covering the conductors 7 is also carried out.
• the protective material of the layer 10 for example an organic varnish
• the protective material of the layer 10 is chosen to possess characteristics that make it compatible with the environment. (eg spatial) in which the reflector will be called to work.
• the lines 10.7 can then remain on the conductors 7 and serve as protection therefor, for example against corrosion.
• the laser ablation speed can be very fast (for example 0.3 m / s) and that one can use multiple ablation laser sources simultaneously;
• the ablation can resume after partial reconstitution of the layer 10 of protective material, without alteration of the substrate 5 and the conductive layer 9 ;

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (4)

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Family Cites Families (9)

• 2005
  • 2005-02-23 FR FR0501815A patent/FR2882490B1/fr not_active Expired - Fee Related
• 2006
  • 2006-02-20 US US11/815,447 patent/US7721426B2/en not_active Expired - Fee Related
  • 2006-02-20 EP EP06709341A patent/EP1852002A1/de not_active Withdrawn
  • 2006-02-20 WO PCT/FR2006/000373 patent/WO2006090050A1/fr not_active Ceased

Non-Patent Citations (1)

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