EP1825188B1 - Element de phare automobile - Google Patents

Element de phare automobile Download PDF

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Publication number
EP1825188B1
EP1825188B1 EP05821310A EP05821310A EP1825188B1 EP 1825188 B1 EP1825188 B1 EP 1825188B1 EP 05821310 A EP05821310 A EP 05821310A EP 05821310 A EP05821310 A EP 05821310A EP 1825188 B1 EP1825188 B1 EP 1825188B1
Authority
EP
European Patent Office
Prior art keywords
light
emitting diode
motor vehicle
vehicle headlight
element according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP05821310A
Other languages
German (de)
English (en)
Other versions
EP1825188B8 (fr
EP1825188A1 (fr
Inventor
Gerhard Behr
Alois Biebl
Moritz Engl
Heinz Haas
Stefan Hackenbuchner
Peter Helbig
Günther Hirschmann
Markus Hofmann
Rainer Huber
Joachim Reill
Thomas Reiners
Ralf Vollmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Osram GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to EP09160785A priority Critical patent/EP2085686B1/fr
Publication of EP1825188A1 publication Critical patent/EP1825188A1/fr
Application granted granted Critical
Publication of EP1825188B1 publication Critical patent/EP1825188B1/fr
Publication of EP1825188B8 publication Critical patent/EP1825188B8/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0017—Devices integrating an element dedicated to another function
    • B60Q1/0023—Devices integrating an element dedicated to another function the element being a sensor, e.g. distance sensor, camera
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
    • B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
    • B60Q1/14—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights having dimming means
    • B60Q1/1415—Dimming circuits
    • B60Q1/1423—Automatic dimming circuits, i.e. switching between high beam and low beam due to change of ambient light or light level in road traffic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/12—Controlling the intensity of the light using optical feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/18—Controlling the intensity of the light using temperature feedback
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q2300/00—Indexing codes for automatically adjustable headlamps or automatically dimmable headlamps
    • B60Q2300/05—Special features for controlling or switching of the light beam
    • B60Q2300/054—Variable non-standard intensity, i.e. emission of various beam intensities different from standard intensities, e.g. continuous or stepped transitions of intensity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q2300/00—Indexing codes for automatically adjustable headlamps or automatically dimmable headlamps
    • B60Q2300/30—Indexing codes relating to the vehicle environment
    • B60Q2300/31—Atmospheric conditions
    • B60Q2300/314—Ambient light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a motor vehicle headlight element.
  • the pamphlets WO 01 / 01037A1 and WO 01 / 01038A1 describe a car headlight.
  • the vehicle headlamp element is suitable, for example, to act as a light-generating element in a motor vehicle headlight.
  • vehicle headlight elements can be arranged in a headlight.
  • other light-generating components such as halogen or gas discharge lamps are included in the vehicle headlamp element.
  • the vehicle headlamp element contains at least one light-emitting diode.
  • the light-emitting diode contains at least one light-emitting diode chip, the light-emitting diode preferably contains a plurality of light-emitting diode chips.
  • the vehicle headlamp element is suitable for emitting white light.
  • the vehicle headlamp element includes a Control device.
  • the control device is suitable for processing a signal dependent on a measured variable.
  • the measured variable can be, for example, a temperature, the intensity with which the light-emitting diode of the motor vehicle headlight element emits electromagnetic radiation, the ambient brightness outside the headlight element, the current flowing through the light-emitting diode, or the like.
  • the measured variable is detected by a detector and converted into an electrical signal.
  • the control device is suitable for processing the electrical signal, which has been generated as a function of the measured variable, and for impressing a corresponding current into the light-emitting diode. That is, the control device controls the current flowing through the light emitting diode depending on at least one physical quantity.
  • the control device may include, for example, a microprocessor.
  • the control device and the light-emitting diode are arranged on a common carrier.
  • the carrier is a printed circuit board. That is, on the support electrical connection points are arranged, by means of which, for example, the control device can be electrically contacted from the outside.
  • the carrier preferably has electrical conductor tracks which are suitable for electrically connecting the connection points and the control device as well as the control device and the light-emitting diode.
  • the carrier also serves as a heat conducting element and is adapted to emit the heat generated by the light emitting diode during operation, for example, to a heat sink on which the carrier is mounted.
  • the vehicle headlamp element therefore has at least one light-emitting diode.
  • the motor vehicle headlamp element has at least one control device which is suitable for processing a signal dependent on a measured variable and impressing a current corresponding to the signal into the light-emitting diode, the control device and the light-emitting diode being arranged on a common carrier.
  • the control device is suitable for determining the current through the light-emitting diode as a function of the voltage drop across a resistor.
  • the light-emitting diode is connected in series with a shunt resistor.
  • the resistor is preferably arranged on the carrier.
  • the control device is suitable to determine the current through the light emitting diode. The thus determined actual value can be compared by the control device with a desired current value.
  • the control device is then suitable for adjusting the current through the light-emitting diode such that the current through the light-emitting diode at least approaches the desired current value.
  • the desired current value can be predetermined, for example, from outside the vehicle headlight element.
  • a corresponding signal is coupled from the outside into the control device.
  • the signal is coupled into the control device by means of a connection pin with which the control device is conductively connected.
  • the connecting pin is arranged on the carrier.
  • the desired current may preferably be continuously variable. In this way, for example, a continuous dimming of the light emitting diode by means of variation of the desired current value is possible.
  • this is suitable for impressing the current through the light-emitting diode as a function of the signal of a temperature sensor.
  • the control device is also suitable to provide a control current for operating the temperature sensor.
  • the temperature sensor generates an electrical signal, depending on the temperature of the LED. If the temperature of the light-emitting diode exceeds a predetermined maximum value, for example, then the control device is suitable for reducing the current through the light-emitting diode. Furthermore, the control device is suitable for generating a corresponding error signal when the maximum value is reached or exceeded.
  • the error signal can be passed to the outside, for example, by means of a connection pin.
  • the temperature sensor is thermally coupled to the light-emitting diode. That is, at least part of the heat generated by the light emitting diode during operation is conducted from the light emitting diode to the temperature sensor by means of thermal coupling.
  • the thermal coupling can be heat conduction, heat radiation or convection.
  • the temperature sensor is z. B. by one of the following device: NTC resistor, PTC resistor, infrared temperature sensor, diode.
  • the temperature be determined for example by means of the temperature dependence of the flux voltage of the diode.
  • the temperature sensor is arranged on the carrier. If the carrier is a printed circuit board, then the temperature sensor can be connected to the control device by means of conductor tracks of the printed circuit board. On the one hand, the signal generated by the temperature sensor can be forwarded to the control device in this way, on the other hand, the temperature sensor can be supplied by the control device with a control current.
  • control device is suitable for impressing the current through the light-emitting diode as a function of the signal of a photodetector.
  • the control device is preferably suitable for providing a control current for operating the photodetector.
  • the photodetector may be, for example, a photodiode or a phototransistor.
  • the photodetector is suitable for detecting substantially the electromagnetic radiation emitted by the light-emitting diode.
  • the electromagnetic radiation emitted by the light-emitting diode means that, for example, even small amounts of scattered light can strike the photodetector from outside the vehicle headlight element.
  • the photodetector is preferably positioned in such a way that it is primarily that of the emitted light of the vehicle headlamp element emitted electromagnetic radiation.
  • the control device is suitable for generating an error signal.
  • the error signal can be delivered to the outside.
  • the connecting pin is arranged on the carrier.
  • the photodetector is arranged on the carrier. If the carrier is a printed circuit board, then the photodetector can be connected to the control device via the existing conductor tracks of the printed circuit board for signal transmission and for supplying the photodetector with a control current.
  • the photodetector is suitable for detecting substantially the ambient brightness.
  • the ambient brightness here means that the photodetector is arranged in such a way that it primarily detects light from outside the headlight element. at the most A small amount of stray light from the vehicle headlight element strikes the photodetector.
  • an external photodetector enables a current to be impressed by the light emitting diode depending on the external light conditions. For example, when the ambient brightness decreases -. B. when driving through a tunnel - the current through the LED can be increased. As the ambient brightness increases, the current can then be reduced again.
  • the electrical signal generated by the photodetector can be supplied to the control device, for example, by means of a connection pin.
  • the connecting pin is arranged on the carrier. If the carrier is a printed circuit board, then the connecting pin is connected to the control device by means of conductor tracks of the printed circuit board.
  • the motor vehicle headlight element preferably has both a photodetector outside the headlight element for detecting the ambient brightness and an internal photodetector for determining the intensity of the electromagnetic radiation emitted by the light-emitting diode.
  • the external photodetector is arranged outside the headlamp, for example on the body of the vehicle.
  • At least one varistor is arranged on the carrier.
  • the varistor serves, for example, as protection of the components of the motor vehicle headlight element Surges.
  • the varistor provides protection against ESD (electrostatic discharge) voltage pulses.
  • At least one varistor of the light-emitting diode is connected in parallel.
  • the varistor then serves as ESD protection for the LED in the reverse direction.
  • At least one Pi filter is arranged on the carrier.
  • the pi-filter is used, for example, for spark suppression.
  • a pulse width modulation circuit is arranged on the carrier.
  • the pulse width modulation circuit is preferably suitable for dimming the light emitting diode.
  • the pulse width modulation circuit generates z. B. for a given time interval T 1 current of a certain strength I 1 .
  • the pulse width modulation generates an electrical square wave signal. The larger the duty ratio T 1 / (T 1 + T 2 ), the longer flows in the time interval T 1 + T 2 current through the LED and the brighter the LED appears to the human user.
  • the frequency of the pulse width modulation circuit 1 / (T 1 + T 2 ) is preferably at least 100 Hz, so that the human observer due to the inertia of optical signal processing in humans, the LED appears to be continuously lit.
  • the control device is suitable for setting the pulse duty factor of the pulse width modulation circuit. For example, then, due to an external signal supplied to the control device, a certain duty ratio may be predetermined by the control device of the pulse width modulation circuit. In this way, the light-emitting diode is preferably continuously dimmable.
  • a current-regulated voltage supply can be arranged on the carrier.
  • the power supply may be a boost / buck converter.
  • Such a DC-DC converter is preferably suitable for converting an external input voltage into a voltage which is suitable for operating the light-emitting diode.
  • the input voltage can be between 6 and 16V
  • the light-emitting diode can be operated, for example, with a voltage between 1 and 5 V per LED chip.
  • the light-emitting diode is preferably operated with a voltage of approximately 3.3 V per LED chip.
  • a voltage of approximately 17 V is applied to the light-emitting diode.
  • a flyback converter can also be arranged on the carrier.
  • the control device is suitable, a duty cycle of the DC-DC converter adjust. For example, depending on an external signal that is fed to the control device, the light-emitting diode is continuously dimmable.
  • At least one connecting pin is arranged on the carrier. If the carrier is a printed circuit board, then the connecting pin is preferably connected to the control device via printed conductors of the printed circuit board.
  • an external electrical signal is coupled into the control device by means of at least one connection pin.
  • a signal is coupled into the control device by means of a connection pin, which signal specifies a desired current value for the current flowing through the light-emitting diodes.
  • a signal can be coupled into the control device by means of a connection pin, which signal is generated by an external detector, for example by a photodetector.
  • a switching signal can be coupled into the control device via a connecting pin.
  • the switching signal the light emitting diode of the headlight element can be switched on and off via the control device, ie depending on the switching signal, the light emitting diode is energized by the control device or not energized.
  • At least one connecting pin can be arranged on the carrier, on which a supply voltage for operation of the motor vehicle headlamp element is applied. This can be a DC voltage or an AC voltage. If an alternating voltage is present at the connecting pin, a rectifier element is preferably arranged on the carrier which is suitable for converting the alternating voltage into direct voltage suitable for the operation of the light-emitting diode and the control device.
  • At least one pin for incoming signals is TTL compatible.
  • pins may be arranged on the carrier, which are adapted to direct a signal generated by the control device to the outside.
  • a fault such as the failure of a light emitting diode or the overheating of a light emitting diode, a corresponding signal to a pin can be applied.
  • all arranged on the support pins are each protected by a varistor ESD.
  • the pins are suitable for a bus connection.
  • the light-emitting diode has at least one light-emitting diode chip.
  • the light-emitting diode preferably has a plurality of light-emitting diode chips.
  • the light-emitting diode chips of the light-emitting diode can be connected, for example, in parallel or in series.
  • the light-emitting diode chip is followed by a light-emitting diode optics.
  • the light-emitting diode a plurality of light-emitting diode chips, to which a common light-emitting diode system is arranged downstream.
  • the light-emitting diode optics is preferably positioned relative to the light-emitting diode chips such that a large part of the electromagnetic radiation emitted by the light-emitting diode chips is influenced by the light-emitting diode optics.
  • the light-emitting diode optics preferably contains at least one of the following optical elements: refractive optics, diffractive optics, reflective optics, fiber optics.
  • the light-emitting diode optical system is suitable for reducing the divergence of the light emitted by the light-emitting diode chip.
  • the light emitted by the light-emitting diode chips is influenced, for example, when passing through the light-emitting diode optics such that its divergence after emergence is lower than before it entered the light-emitting diode optics.
  • the LED optic is a non-imaging optical concentrator.
  • the light-emitting diode optics is preferably arranged downstream of the radiation coupling-out area of at least one light-emitting diode chip such that the radiation inlet opening of the optical element is the actual radiation exit opening of the concentrator. In this way, electromagnetic radiation passing through the radiation inlet opening into the light-emitting diode optics leaves the concentrator with reduced divergence through the radiation outlet opening.
  • the light-emitting diode optics can be formed at least partially in the manner of one of the following optical elements: composite parabolic concentrator (CPC compound Parabolic Concentrator), composite elliptic concentrator (CEC - Compound Ellyptic Concentrator), composite hyperbolic concentrator (CHC - Compound Hyperbolic Concentrator).
  • the light-emitting diode optics may have reflective side walls which are suitable for reflecting at least part of the electromagnetic radiation emitted by the light-emitting diode chip.
  • the side walls are then at least partially formed in the manner of one of the above-mentioned optical elements.
  • the non-imaging optical concentrator has side walls which connect the radiation inlet opening to the radiation exit opening of the light-emitting diode optics and are designed such that connecting lines extending between the radiation inlet opening and the radiation outlet opening extend essentially straight on the side walls.
  • the side walls form, for example, the shape of a pyramid or truncated cone.
  • the LED optic may be a solid body made of a dielectric material.
  • the electromagnetic radiation passing through the radiation inlet opening into the light-emitting diode optics is then preferably totally reflected at the lateral boundary surfaces of the solid body to the surrounding medium.
  • the LED optics can also be formed by a hollow body whose inner walls are coated reflective.
  • each light-emitting diode chip is assigned exactly one light-emitting diode optics.
  • the radiation inlet opening of the optical element is preferably arranged downstream of the radiation coupling-out area of the light-emitting diode chip in a main emission direction of the light-emitting diode chip.
  • the light-emitting diode chips can be associated with a common light-emitting diode optics.
  • the light-emitting diode chips can be arranged, for example, along at least one straight line.
  • the radiation entrance opening of the optical element is then arranged downstream of the total area of the radiation output surfaces of the individual light-emitting diode chips in a main emission direction of the light-emitting diode chips.
  • the radiation entrance opening of the light-emitting diode optics has a cross-sectional area which is at most twice as large as the total radiation output surface of the light-emitting diode chips assigned to the optical element.
  • the total radiation output surface is given by the sum of the radiation outcoupling surfaces of the individual light-emitting diode chips assigned to the light-emitting diode optics.
  • the surface of the radiation inlet opening is at most 1.5, particularly preferably at most 1.25 times as large as the total radiation coupling-out area of the light-emitting diode chips assigned to the light-emitting diode optics.
  • Such a small radiation entrance opening makes it possible to reduce the solid angle into which the electromagnetic radiation is emitted as close as possible to the radiation coupling-out area of the light-emitting diode chip.
  • Cross-sectional area of the beam cone emitted by the LED chip is particularly small. This allows the construction of components with optimized etendue. This means that the highest possible radiation intensity is projected onto the smallest possible area.
  • the Etendue is a conservative size of optics. It is formed by the product of area of a light source and solid angle into which the light source radiates.
  • a gap for example an air gap, is arranged between the radiation coupling-out surface of the light-emitting diode chip and the radiation inlet opening of the light-emitting diode optics.
  • the radiation exit opening of the optical element is arranged downstream of an additional optical element in the main emission direction.
  • the additional optical element is preferably a light-refracting or light-diffractive optical system with which a further reduction in the divergence of the radiation passing through the additional optical element can be achieved.
  • the light-emitting diode system preferably reduces the divergence of a beam cone passing through the radiation inlet opening in at least one spatial direction in such a way that the beam cone at the exit through the radiation exit opening has an opening angle between 0 and 70 °, preferably between 0 and 30 °, particularly preferably between 0 and 10 ° Has longitudinal central axis of the optical element, which is perpendicular to the radiation output surface of a light emitting diode optics associated LED chip.
  • the light-emitting diode has a luminescence conversion material which is arranged downstream of the radiation output surface of at least one of the light-emitting diode chips.
  • a luminescence conversion material of the radiation outcoupling surface of each LED chip is arranged downstream of the vehicle headlamp element.
  • the luminescence conversion material is preferably suitable for converting wavelengths at least a part of the electromagnetic radiation emitted by the light-emitting diode chip.
  • the emitted from the LED chip mixes Radiation with the wavelength-converted proportion to white light.
  • the electromagnetic radiation emitted by the light-emitting diode chip is substantially completely wavelength-converted by the luminescence conversion material.
  • radiation emitted by the light-emitting diode chip in the non-visible spectral range can thus be converted into radiation in the visible spectral range.
  • two different phosphors in the luminescence conversion material can then z. B. white light can be generated.
  • Suitable phosphors for wavelength conversion are, for example, in the document WO 98/12757 described, the disclosure content, concerning the phosphors, is hereby incorporated by reference.
  • the luminescence conversion material may be mixed in at least one embodiment of the motor vehicle headlamp element of an at least partially radiation-permeable potting compound.
  • the casting compound preferably surrounds the light-emitting diode chip at least partially.
  • the potting compound may contain, for example, epoxy or silicone materials.
  • the luminescence conversion material can also be applied as a thin layer directly onto the radiation coupling-out surface of the individual light-emitting diode chips.
  • the luminescence conversion material may be contained at least in places in the light-emitting diode optics.
  • the luminescence conversion material may be in the form of a thin layer on sidewalls, which are arranged downstream of the radiation output surface of the LED chip, be applied.
  • the luminescence conversion material may be homogeneously distributed on the sidewalls.
  • the luminescence conversion material is applied to defined locations of the side walls. In this way, a particularly defined conversion of passing through the optical element electromagnetic radiation is possible.
  • the light-emitting diode contains light-emitting diode chips which emit radiation of different wavelengths. Preferably, this radiation then mixes to white light.
  • the light-emitting diode may comprise at least one light-emitting diode chip which is suitable for emitting light in the red spectral range, at least one light-emitting diode chip which is suitable for emitting light in the green spectral range and at least one light-emitting diode chip which is suitable for emitting light in the blue spectral range.
  • the light-emitting diode can additionally have light-emitting diode chips which are suitable for emitting light in other spectral ranges, for example in the yellow spectral range.
  • the motor vehicle headlamp element has at least one light-emitting diode which is suitable for emitting electromagnetic radiation in the non-visible spectral range.
  • the light-emitting diode is preferably suitable for emitting radiation in the infrared spectral range.
  • the light-emitting diode may, for example, contain at least one light-emitting diode chip which is suitable for emitting radiation in the infrared spectral range.
  • the car headlight element is then suitable, for example, as a lighting device of the traffic area in conjunction with infrared-sensitive cameras.
  • Such systems can be used in night vision systems, sensor systems for pedestrian protection or distance sensors for motor vehicles. In this case, the illumination with an infrared radiation source offers the particular advantage of not dazzling road users, even with a higher radiation power.
  • At least one of the light-emitting diode chips of the light-emitting diode has a radiation decoupling surface, by means of which a large part of the electromagnetic radiation emitted by the light-emitting diode chip is decoupled.
  • the entire radiation emitted by the light-emitting diode chip emerges through the radiation coupling-out surface.
  • the radiation output surface is given for example by a part of the surface of the LED chip.
  • the radiation output surface is given by a main surface of the LED chip, which is arranged for example parallel to an epitaxial layer sequence of the LED chip, which is suitable to generate electromagnetic radiation.
  • the epitaxial layer sequence can have, for example, a pn junction, a double heterostructure, a single quantum well or particularly preferably a multiple quantum well structure.
  • quantum well structure includes in the context of the application any structure in which charge carriers Confinement experience a quantization of their energy states.
  • quantum well structure does not include information about the dimensionality of the quantization. It thus includes quantum wells, quantum wires and quantum dots and any combination of these structures.
  • the light-emitting diode chip is preferably a semiconductor light-emitting diode chip in which the growth substrate is at least partially removed and a carrier element is applied to the surface facing away from the original growth substrate.
  • the carrier element can be chosen relatively freely compared to a growth substrate.
  • a carrier element is selected, which is particularly well adapted to the radiation-generating epitaxial layer sequence in terms of its thermal expansion coefficient.
  • the carrier element may contain a material which is particularly good heat conducting.
  • a basic principle of a thin-film light-emitting diode chip is, for example, in the document I. Schnitzer et al., Appl. Phys. Lett. 63 (16), 18 October 1993, 2174-2176 described, the disclosure of which is the basic principle of a thin-film light-emitting diode chip hereby incorporated by reference.
  • All LED chips of the vehicle headlamp element are preferably thin-film light-emitting diode chips.
  • FIG. 1 shows a schematic sectional view of a light emitting diode 20 with a light emitting diode optics 4 according to a first embodiment of the light emitting diode 20th
  • the LED chip 1 is arranged here in a housing 2.
  • the housing 2 may for example contain a ceramic material.
  • the housing 2 has vias for contacting the LED chip 1.
  • the housing 2 is applied to a printed circuit board 25.
  • the printed circuit board 25 has, for example, printed conductors and contact points for contacting the LED chip 1.
  • the light-emitting diode chip 1 is, for example, a thin-film light-emitting diode chip, as explained in the general part of the description.
  • the LED chip 1 is followed by a light-emitting diode 4, which may be, for example, a three-dimensional CPC-like, non-imaging optical concentrator.
  • the light-emitting diode optics 4 has a light input opening b through which electromagnetic radiation 3 emitted by the light-emitting diode chip 1 can pass.
  • the electromagnetic radiation 3 is reflected at least partially on the side walls of the LED optic 4, which are provided for this purpose, for example with a reflective coating.
  • the radiation 3 leaves the light-emitting diode optics through the radiation exit opening 5.
  • FIG. 1 it is possible for a plurality of light-emitting diode chips to be arranged along a straight line in the housing 2, for example, and for these light-emitting diode chips to be assigned a common light-emitting diode optics 4 (see also FIG. 4b ).
  • FIG. 2 shows that the beam cone 6 of the light passing through the LED optics 4 radiation Radiation exit opening 5 with a maximum angle ⁇ to a central axis 7 of the LED optic 4 leaves.
  • the length 1 of the light-emitting diode optics 4 determines the angle ⁇ for a given width of the radiation entrance opening b.
  • l b 2 ⁇ 1 + sin ⁇ ⁇ cos ⁇ sin 2 ⁇ ⁇ ,
  • the length l of the light-emitting diode optics must be about 23 times as large as the width of the radiation inlet opening b.
  • FIG. 3 shows that as an alternative to a CPC-like optical concentrator, the LED optics can also have side walls 8, which extend in straight lines from the radiation inlet opening b to the radiation outlet opening 5.
  • the LED optic 4 may be a solid body of a dielectric material having a truncated cone or truncated pyramidal basic shape.
  • the radiation exit opening 5 may be arched outward in the manner of a spherical or aspherical lens which forms an additional light-emitting diode 9, which is an integral part of the light-emitting diode optics, and is suitable for reducing the divergence of the radiation 3 passing through the optical element 4.
  • FIG. 4a shows a schematic plan view of a first embodiment of the vehicle headlamp element 40 described here.
  • At least one light-emitting diode 20, as used for example in the FIG. 1 is shown here is arranged on a support 25.
  • the carrier 25 is, for example, a printed circuit board, for. B. a metal core board.
  • the carrier 25 may, for example, have a base area of at most 30 mm ⁇ 60 mm, preferably of at most 20 mm ⁇ 40 mm, particularly preferably of at most 15 mm ⁇ 30 mm.
  • the light-emitting diodes 20, a shunt resistor 12 is connected in series.
  • the control device 10 may include an integration circuit for detecting the current through the LEDs 20.
  • the current through the LEDs 20 is adjusted by the control device 10, for example, according to a target current value.
  • the desired current value may be predetermined for the control device 10 by an external electrical signal.
  • the external signal is supplied to the control device 10, for example, by means of the connection pin 16d.
  • the light emitting diodes 20 are energized if the control device 10, a corresponding switching signal (enable signal) is supplied.
  • the switching signal may be supplied to the control device 10, for example by means of a connection pin 16c.
  • controller 10 may be externally supplied with the signal of an external photodetector 17 via the pin 16f.
  • the LEDs 20 are then from the Control device 10 is energized depending on the ambient brightness.
  • control device 10 can be supplied with signals from a photodetector 13 and a temperature sensor 14.
  • the temperature sensor 14 is preferably suitable for generating a signal dependent on the temperature of the light-emitting diodes 20.
  • the signal of the temperature sensor 14 is passed to the control device 10 and processed by the latter. Depending on the signal, the control device 10 then regulates the current through the light-emitting diodes 20. If the temperature of the light-emitting diodes 20 is too high, for example, the current flowing through the light-emitting diodes 20 can be reduced by the control device 10.
  • the internal photodetector 13 detects the intensity of the emitted from the light emitting diodes 20 electromagnetic radiation 20.
  • the signal of the photodetector 13 is passed to the control device 10. Lets the intensity of the LEDs 20, for example, due to aging, the current through the LEDs 20 by means of the control device 10 can be readjusted accordingly.
  • both temperature sensor 14 and photodetector 13 are mounted on the carrier 25.
  • the temperature sensor can be thermally coupled to the light-emitting diodes 20 by means of heat conduction by means of the carrier 25.
  • the carrier 25 then serves as Thermally conductive element. Further, they are electrically connected by means of conductor tracks of the carrier 25 with the control device 10.
  • a corresponding error signal can be output by the control device 10 to the connection pin 16b.
  • control device 10 is suitable for setting a corresponding duty cycle on a controllable voltage supply 11. In this way, the control device 10 can regulate the current through the LEDs 20.
  • control device 10 For processing the signals entering the control device 10, the control device 10 may comprise, for example, a microprocessor.
  • the controller 10 may be a microcontroller.
  • the controllable power supply 11 is, for example, a DC-DC converter which can be operated at a frequency of 100-500 kHz.
  • the controllable voltage supply 11 is suitable for converting an input voltage, which for example is applied to the connection pin 16 a, into a voltage suitable for operating the light-emitting diodes 20.
  • the vehicle headlight element is grounded.
  • a varistor (not shown) may be connected to ground at all of the connection pins 16a to 16f.
  • the pin terminals 16a to 16f may be connected in series with a pi filter which may include a capacitor and an inductor.
  • the pi-filter is used, for example, for spark suppression.
  • At least one connecting pin may be arranged on the carrier 25, which forms a communication interface, for example a LIN bus.
  • FIG. 4b shows a perspective view of a second embodiment of the vehicle headlamp element 40 described here.
  • a light emitting diode 20 is disposed on a metal core board, which acts as a carrier 25.
  • the light-emitting diode 20 comprises, for example, five light-emitting diode chips 1.
  • the light-emitting diode chips 1 are arranged, for example, on the bottom 23 of a housing 2.
  • the housing 2 contains, for example, a ceramic material.
  • the housing 2 may have inner walls shaped like a non-imaging optical concentrator.
  • the inner walls 24 of the housing 2 are at least locally reflective.
  • the inner walls 24 may follow a light-emitting diode optics (not shown) in the main emission direction of the light-emitting diode chips 1, as described above.
  • the LED chips 1 are by means of bonding wires 22 with inner Contact surfaces 21 contacted.
  • the inner contact surfaces are electrically conductively connected to outer contact surfaces 18, via which the light-emitting diode can be electrically contacted.
  • the carrier 25 may also have fitting holes 26, by means of which the vehicle headlight element can be adjusted, for example, to a carrier 33.
  • FIG. 5 shows a schematic sectional view of a headlamp with the headlamp elements 40 described here.
  • automotive headlight elements 40 as in the FIGS. 4a and 4b described here can be mounted here on a support 33.
  • three vehicle headlight elements 40 are mounted on the carrier 25.
  • the carrier 33 preferably also serves as a heat sink for the heat generated by the light-emitting diodes 20 during operation.
  • the carrier 33 has cooling fins on its surface facing away from the vehicle headlight elements 40.
  • the carrier 33 preferably contains a good heat-conducting metal such as copper.
  • the vehicle headlight elements 40 and the carrier 33 can be adjusted to each other by means of dowel pins 32. In this way, the vehicle headlight elements 40 are adjusted to each other.
  • the dowel pins 32 may be separate components.
  • Carrier 33 and vehicle headlight elements 40 then have recesses, for example, fitting holes.
  • the mating holes in the carrier 33 and the vehicle headlight element 40 have a suitable diameter, so that the dowel pins 32 fit flush into the mating holes.
  • the dowel pins 32 are an integral part of the carrier 33. That is, the dowel pins are mechanically fixed to the carrier 33. This can happen, for example, during the production of the carrier 33.
  • the circuit board 25 of the vehicle headlamp element 40 then has recesses 26 (see FIG. 4b ), which are suitable for receiving these dowel pins.
  • dowel pins 32 are an integral part of the motor vehicle headlamp element 40. In the carrier 33 then recesses for receiving these dowel pins are provided.
  • carrier 33 and vehicle headlight elements 40 are adjusted to each other by means of registration marks.
  • the alignment of the vehicle headlight elements 40 to the carrier 33 and thus also the alignment of the motor vehicle headlight elements 40 to each other can then take place for example via an image processing system.
  • Pass marks are to z.
  • the registration marks may be detected by a camera and aligned with a reference point located on the carrier 33.
  • the reference point may be another registration mark.
  • the registration marks on the carrier 33 and the vehicle headlight element 40 are given either by markings or by certain components of the components of the headlight.
  • certain light-emitting diode chips 1 of the light-emitting diode 20 may represent such registration marks.
  • the vehicle headlight elements 40 for example, a common optical element 30 is arranged downstream.
  • the optical element 30 is, for example, a diffractive or refractive lens, which is arranged downstream of all headlight elements 40 of the headlamp, so that the light emitted by all the light-emitting diodes 20 is influenced by the optical element 30.
  • the optical element 30 and the carrier 33 are aligned with each other by means of dowel pins 31. In this way, the vehicle headlight elements 40 and the optical element 30 are adjusted to each other.
  • the dowel pins can be separate components. But it is also possible that the dowel pins are an integral part of the carrier 33 or optical element 30. The respective other component then has recesses - e.g. Mating holes - on, which are suitable for receiving the dowel pins.
  • the vehicle headlight elements 40 are mechanically firmly connected to the carrier.
  • the vehicle headlight elements 40 may be glued, screwed or caulked to the carrier 33.
  • the optical element 30 is preferably mechanically fixed to the carrier 33 after the adjustment process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (26)

  1. Elément de phare pour véhicule automobile, présentant :
    - au moins une diode luminescente (20) dotée de plusieurs puces (1) de diode luminescente,
    - une sonde de température (14) couplée thermiquement à la diode luminescente (20),
    - une optique commune (4) de diodes luminescentes qui est disposée en aval des puces (1) de la ou des diodes luminescentes (20),
    - un support (25) formé par une carte de circuit et
    - au moins un dispositif de commande (10) qui permet de traiter un signal qui dépend d'au moins une grandeur de mesure et d'injecter dans la diode luminescente (20) un courant qui correspond au signal, le dispositif de commande (10), la sonde de température (14) et la diode luminescente (20) étant disposés sur le support (25) commun et le signal dépendant de la sonde de température (14).
  2. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel le dispositif de commande (10) permet de déterminer le courant qui traverse la diode luminescente (20) en fonction de la chute de tension aux bornes d'une résistance (12).
  3. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel la résistance (12) est disposée sur le support.
  4. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel le dispositif de commande (10) permet d'injecter le courant dans la diode luminescente (20) en fonction du signal d'un photodétecteur (13, 17).
  5. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel le photodétecteur (13) permet de détecter essentiellement le rayonnement électromagnétique émis par la diode luminescente (20).
  6. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel le photodétecteur (13) est disposé sur le support (25).
  7. Elément de phare pour véhicule automobile selon la revendication 4, dans lequel le photodétecteur (17) permet de détecter essentiellement la luminosité ambiante.
  8. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel le photodétecteur (17) est disposé à l'extérieur du phare.
  9. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel un filtre Pi (15) est disposé sur le support (25).
  10. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel un varistor est raccordé en parallèle à la diode luminescente (20).
  11. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel un circuit de modulation de la largeur des impulsions est disposé sur le support (25).
  12. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel le circuit de modulation de la largeur des impulsions permet d'atténuer ou d'augmenter progressivement la lumière émise par la diode luminescente (20).
  13. Elément de phare pour véhicule automobile selon l'une des revendications 11 ou 12, dans lequel le dispositif de commande (10) permet d'établir un rapport impulsion/pause du circuit de modulation de la largeur des impulsions.
  14. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel une alimentation réglable en tension (11) est disposée sur le support.
  15. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel le dispositif de commande (10) permet d'établir un rapport impulsion/pause de l'alimentation en tension (11).
  16. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel au moins une tige de raccordement (16a-16f) est disposée sur le support (25).
  17. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel un varistor est raccordé en parallèle sur au moins une de les tiges de raccordement (16a-16f).
  18. Elément de phare pour véhicule automobile selon les revendications 16 ou 17, dans lequel un signal électrique externe peut être injecté dans le dispositif de commande (10) au moyen de la tige de raccordement (16a-16f).
  19. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel l'optique (4) de la diode luminescente permet de réduire la divergence du rayonnement électromagnétique émis par la puce de diode luminescente.
  20. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel l'optique (4) de la diode luminescente est un concentrateur optique ne formant pas d'image.
  21. Elément de phare pour véhicule automobile selon l'une des revendications 19 à 20, dans lequel l'optique (4) de la diode luminescente est formée au moins en partie sous la forme d'un des éléments optiques suivants : CPC, CEC, CHC, tronc de pyramide, tronc de cône.
  22. Elément de phare pour véhicule automobile selon l'une des revendications 19 à 21, dans lequel l'optique (4) de la diode luminescente présente une ouverture (b) d'entrée de rayonnement qui est au plus deux fois aussi grande que la surface totale de sortie de rayonnement de la puce à diode luminescente (1) associée à l'élément optique.
  23. Elément de phare pour véhicule automobile selon l'une des revendications 19 à 22, dans lequel la diode luminescente contient au moins une puce de diode luminescente en film mince.
  24. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel l'élément de phare pour véhicule automobile contient au moins une diode luminescente (20) qui permet de former de la lumière blanche.
  25. Elément de phare pour véhicule automobile selon l'une des revendications précédentes, dans lequel l'élément de phare pour véhicule automobile contient au moins une diode luminescente (20) qui permet de créer un rayonnement électromagnétique dans la plage spectrale non visible.
  26. Elément de phare pour véhicule automobile selon la revendication précédente, dans lequel la diode luminescente (20) permet de créer un rayonnement dans la plage spectrale de l'infrarouge.
EP05821310A 2004-12-17 2005-11-30 Element de phare automobile Active EP1825188B8 (fr)

Priority Applications (1)

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EP09160785A EP2085686B1 (fr) 2004-12-17 2005-11-30 Elément de phare automobile

Applications Claiming Priority (2)

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DE102004060890A DE102004060890A1 (de) 2004-12-17 2004-12-17 Kfz-Scheinwerferelement
PCT/DE2005/002154 WO2006063552A1 (fr) 2004-12-17 2005-11-30 Element de phare automobile

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EP1825188A1 EP1825188A1 (fr) 2007-08-29
EP1825188B1 true EP1825188B1 (fr) 2009-07-01
EP1825188B8 EP1825188B8 (fr) 2009-09-02

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EP09160785A Active EP2085686B1 (fr) 2004-12-17 2005-11-30 Elément de phare automobile

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US (2) US8159144B2 (fr)
EP (2) EP1825188B8 (fr)
JP (1) JP5141257B2 (fr)
CN (1) CN100591982C (fr)
AT (2) ATE435400T1 (fr)
DE (3) DE102004060890A1 (fr)
WO (1) WO2006063552A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2579682A1 (fr) 2011-10-07 2013-04-10 Goodrich Lighting Systems GmbH Procédé de contrôle d'un phare d'avion

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005018175A1 (de) * 2005-04-19 2006-10-26 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH LED-Modul und LED-Beleuchtungseinrichtung mit mehreren LED-Modulen
DE102006046729B4 (de) * 2006-10-02 2008-12-11 Infineon Technologies Ag Stromversorgungsschaltung mit temperaturabhängigem Ausgangsstrom und Schaltungsanordnung mit einer Stromversorgungschaltung
US7741825B2 (en) 2006-11-02 2010-06-22 Infineon Technologies Ag Power supply circuit with temperature-dependent drive signal
WO2008104228A1 (fr) * 2007-03-01 2008-09-04 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Circuiterie et procédé de réglage de sources de lumière à semi-conducteur
US7942556B2 (en) 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
DE102007029369A1 (de) 2007-06-26 2009-01-02 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102007045259A1 (de) * 2007-09-21 2009-04-02 Continental Automotive Gmbh Verfahren und Vorrichtung zur Erfassung der von einer LED-Lichtquelle abgestrahlten Lichtleistung
US20090122565A1 (en) * 2007-11-13 2009-05-14 Lear Corporation Vehicle exterior lighting system
DE102008016095A1 (de) 2008-03-28 2009-10-01 Osram Opto Semiconductors Gmbh Lumineszenzdiodenmodul
DE102008017483A1 (de) * 2008-04-03 2009-10-08 Steinel Gmbh Leuchtenvorrichtung
DE102008018808A1 (de) * 2008-04-15 2009-10-22 Ledon Lighting Jennersdorf Gmbh Mikrocontroller optimierte Pulsweitenmodulation-(PWM)-Ansteuerung einer Licht emittierenden Diode(LED)
US7906913B2 (en) * 2008-04-18 2011-03-15 Osram Sylvania Inc. Low loss input channel detection device for a direct current powered lighting system
DE102008029980A1 (de) * 2008-06-24 2010-02-11 Bruno Gruber Spannungswandler mit integrierter LED
DE102008030365A1 (de) * 2008-06-26 2009-08-20 Continental Automotive Gmbh Einrichtung zur Ansteuerung von in einem Array angeordneten Einzellichtquellen
DE102008057347A1 (de) * 2008-11-14 2010-05-20 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung
US8278841B2 (en) * 2009-07-02 2012-10-02 Innovations In Optics, Inc. Light emitting diode light engine
US8684545B2 (en) * 2009-07-30 2014-04-01 The Regents Of The University Of California Light concentration apparatus, systems and methods
US9039213B2 (en) 2009-07-30 2015-05-26 The Regents Of The University Of California Light concentration apparatus, systems and methods
US20110049749A1 (en) * 2009-08-28 2011-03-03 Joel Brad Bailey Dynamically Controlled Extrusion
WO2011033432A1 (fr) * 2009-09-18 2011-03-24 Koninklijke Philips Electronics N.V. Module d'éclairage
DE102009056809A1 (de) * 2009-12-04 2011-06-09 Westiform Holding Ag Leuchtreklame, insbesondere Leuchtbuchstabe
CN101749625B (zh) * 2010-01-22 2014-07-16 深圳市中庆微科技开发有限公司 一种照明模块
DE102010001798B4 (de) * 2010-02-11 2012-10-31 Osram Ag Verfahren zum Betreiben einer Leuchtdiodenanordnung sowie Schaltanordnung
DE102010028406A1 (de) 2010-02-12 2011-08-18 Osram Gesellschaft mit beschränkter Haftung, 81543 LED-Leuchtvorrichtung und Verfahren zum Betreiben einer LED-Leuchtvorrichtung
DE202010002406U1 (de) * 2010-02-16 2010-05-06 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung eines Kraftfahrzeugs
US8403527B2 (en) * 2010-10-26 2013-03-26 Thomas J. Brukilacchio Light emitting diode projector
DE102010050747A1 (de) * 2010-11-08 2012-05-10 Vishay Electronic Gmbh Schaltungsanordnung zum Betreiben einer Leuchtdiode
US8845161B2 (en) 2011-02-09 2014-09-30 Truck-Lite Co., Llc Headlamp assembly with heat sink structure
GB201115450D0 (en) * 2011-09-07 2011-10-26 Sparrow Roger L D Lamp
DE102011083025B4 (de) * 2011-09-20 2016-10-20 Automotive Lighting Reutlingen Gmbh Beleuchtungseinrichtung für ein Fahrzeug
US9730294B2 (en) 2011-11-07 2017-08-08 GE Lighting Solutions, LLC Lighting device including a drive device configured for dimming light-emitting diodes
CN103998919B (zh) * 2011-12-19 2017-09-01 皇家飞利浦有限公司 用于使用反射的辐射来发射红外辐射以提升发射效率的系统与方法
JP6037619B2 (ja) 2012-01-25 2016-12-07 株式会社小糸製作所 発光モジュールおよび車両用灯具
DE102012201415A1 (de) * 2012-02-01 2013-08-01 Osram Gmbh Schaltungsanordnung, Leuchteinheit für ein Fahrzeug und Verfahren zur Ansteuerung von Halbleiterleuchtelementen
DE102012101818B4 (de) 2012-03-05 2018-11-08 Osram Opto Semiconductors Gmbh Optoelektronisches Modul mit einem Kodierelement in einer Aussparung, Beleuchtungseinrichtung mit diesem Modul und Verfahren zu seiner Herstellung
DE102012105630B4 (de) 2012-06-27 2023-04-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Beleuchtungsanordnung mit Beleuchtungsvorrichtung und Verfahren zum Betreiben einer Beleuchtungsvorrichtung
FR2996404B1 (fr) * 2012-09-28 2015-05-29 Renault Sa Procede d'elaboration d'une consigne de fonctionnement pour un ensemble de diodes d'eclairage d'un projecteur de vehicule, et vehicule correspondant
FR2996403B1 (fr) * 2012-09-28 2015-05-22 Renault Sa Procede de regulation de la tension aux bornes d'un ensemble de diodes d'eclairage d'un projecteur de vehicule, et vehicule correspondant
CN104703841A (zh) * 2012-10-04 2015-06-10 矢崎总业株式会社 负载控制单元
DE102012111639A1 (de) * 2012-11-30 2014-06-05 Hella Kgaa Hueck & Co. Zusatzlichtmodul für einen Scheinwerfer eines Fahrzeugs
DE102012023786A1 (de) * 2012-12-05 2014-06-18 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Scheinwerferanordnung für ein Kraftfahrzeug
DE102013202282A1 (de) * 2013-02-13 2014-08-14 Continental Automotive Gmbh Lichtquelle und Verfahren zur Herstellung der Lichtquelle
US10479262B2 (en) * 2013-03-14 2019-11-19 International Research Institute iRI Systems and methods for replicating vehicular illumination
DE102013006045A1 (de) * 2013-04-06 2014-10-09 GM Global Technology Operations, LLC (n.d. Ges. d. Staates Delaware) Verfahren zur Steuerung eines Scheinwerfers
JP6160955B2 (ja) * 2013-07-10 2017-07-12 パナソニックＩｐマネジメント株式会社 発光ダイオード駆動装置、それを備えた車両用照明装置および車両
DE102013018120B4 (de) * 2013-11-29 2022-02-10 Cooper Crouse-Hinds Gmbh Verfahren zur Temperaturüberwachung einer Leuchte
DE102013020698A1 (de) * 2013-11-29 2015-06-03 Cooper Crouse-Hinds Gmbh Leuchte und Verfahren zur Temperaturbestimmung
DE102014101783B4 (de) * 2014-02-13 2021-08-19 HELLA GmbH & Co. KGaA Verfahren zum Aufbau eines LED- Lichtmoduls
CN103928590A (zh) * 2014-04-25 2014-07-16 江苏洪昌科技股份有限公司 用于汽车前照灯led4×1芯片cob封装结构
AT517629B1 (de) * 2015-09-02 2018-02-15 Zkw Group Gmbh LED Strom-Kodierung durch erweiterten Shunt-Widerstand
DE102016205529A1 (de) * 2016-04-04 2017-10-05 Osram Gmbh Verfahren zum Vermessen von Licht
DE102016207823A1 (de) * 2016-05-06 2017-11-09 Osram Gmbh Scheinwerfer mit Schaltungsanordnung zur Simulation eines Laststroms aus einem Bordnetz
JP2017212052A (ja) * 2016-05-23 2017-11-30 市光工業株式会社 車両用灯具及びその車両用灯具の製造方法
DE102016221770A1 (de) * 2016-11-07 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Beleuchtungsvorrichtung und Beleuchtungssystem für ein Kraftfahrzeug sowie Verfahren zum Betreiben eines Beleuchtungssystems für ein Kraftfahrzeug
DE102016221771A1 (de) 2016-11-07 2018-05-09 Bayerische Motoren Werke Aktiengesellschaft Beleuchtungsvorrichtung und Beleuchtungssystem für ein Kraftfahrzeug sowie Verfahren zum Betreiben eines Beleuchtungssystems für ein Kraftfahrzeug
FR3076887B1 (fr) * 2018-01-12 2021-10-15 Valeo Vision Module optique pour vehicule automobile
US10538194B2 (en) * 2018-02-28 2020-01-21 Sno-Way International, Inc. Snowplow light control system
JP7036626B2 (ja) * 2018-03-02 2022-03-15 株式会社小糸製作所 車両用灯具、車両用灯具の検査方法および車両用灯具の検査装置
DE102018204166A1 (de) * 2018-03-19 2019-09-19 Conti Temic Microelectronic Gmbh Leuchteinheit und Fahrzeug mit einer derartigen Leuchteinheit
JP2019164916A (ja) * 2018-03-19 2019-09-26 株式会社小糸製作所 車両用灯具
KR102601799B1 (ko) 2018-10-15 2023-11-14 현대모비스 주식회사 차량용 램프
CN109899763A (zh) * 2019-03-11 2019-06-18 汉腾汽车有限公司 一种基于汽车激光照明技术的激光二极管驱动系统装置
JP6919860B2 (ja) * 2019-03-19 2021-08-18 丸茂電機株式会社 壁面照射用のランプ、およびそれを用いた照明器具
DE102021105905B4 (de) 2020-05-29 2024-08-01 GM Global Technology Operations LLC Durch quantenpunkt-material verbesserte led-beleuchtung
US11525228B2 (en) 2020-07-21 2022-12-13 Sno-Way International, Inc. Light signaling system

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02226604A (ja) * 1989-02-28 1990-09-10 Tokai Riyokaku Tetsudo Kk 電球
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5783909A (en) * 1997-01-10 1998-07-21 Relume Corporation Maintaining LED luminous intensity
US6152590A (en) 1998-02-13 2000-11-28 Donnelly Hohe Gmbh & Co. Kg Lighting device for motor vehicles
DE19805771A1 (de) * 1998-02-13 1999-08-19 Hohe Gmbh & Co Kg Beleuchtungseinrichtung für Kraftfahrzeuge
US6304828B1 (en) 1999-04-02 2001-10-16 The United States Of America As Represented By The Secretary Of The Navy System and method for calibrating a signal detection threshold circuit
JP2001015815A (ja) 1999-04-28 2001-01-19 Sanken Electric Co Ltd 半導体発光装置
US6786625B2 (en) * 1999-05-24 2004-09-07 Jam Strait, Inc. LED light module for vehicles
US6371636B1 (en) * 1999-05-24 2002-04-16 Jam Strait, Inc. LED light module for vehicles
TW493054B (en) 1999-06-25 2002-07-01 Koninkl Philips Electronics Nv Vehicle headlamp and a vehicle
TW498148B (en) 1999-06-25 2002-08-11 Koninkl Philips Electronics Nv Vehicle headlamp and a vehicle
EP1147686B1 (fr) 1999-07-07 2004-01-07 Koninklijke Philips Electronics N.V. Convertisseur indirect utilise comme circuit de commande de del
DE19950135A1 (de) * 1999-10-18 2001-04-19 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Ansteuerschaltung für LED und zugehöriges Betriebsverfahren
US6498440B2 (en) * 2000-03-27 2002-12-24 Gentex Corporation Lamp assembly incorporating optical feedback
US6441558B1 (en) * 2000-12-07 2002-08-27 Koninklijke Philips Electronics N.V. White LED luminary light control system
JP2002334604A (ja) 2001-03-06 2002-11-22 Yoshimitsu Suda ヘッドライト等のバルブ
US6617795B2 (en) 2001-07-26 2003-09-09 Koninklijke Philips Electronics N.V. Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
US7048423B2 (en) * 2001-09-28 2006-05-23 Visteon Global Technologies, Inc. Integrated light and accessory assembly
JP2003188415A (ja) 2001-12-18 2003-07-04 Asahi Matsushita Electric Works Ltd Ｌｅｄ点灯装置
JP2004059030A (ja) 2002-07-26 2004-02-26 Kyoto Seisakusho Co Ltd 光ディスク装填装置
JP2004071409A (ja) 2002-08-07 2004-03-04 Denso Corp 車両用灯具および車両用灯具の配光制御方法
WO2004023572A1 (fr) 2002-08-30 2004-03-18 Usc Corporation Generateur piezoelectrique
JP4089370B2 (ja) 2002-09-24 2008-05-28 東芝ライテック株式会社 照明装置及び照明システム
US6864641B2 (en) 2003-02-20 2005-03-08 Visteon Global Technologies, Inc. Method and apparatus for controlling light emitting diodes
JP2004276739A (ja) * 2003-03-14 2004-10-07 Koito Mfg Co Ltd 車両用灯具
DE10313246A1 (de) 2003-03-25 2004-10-21 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Kraftfahrzeugleuchtenmodul
US7235766B2 (en) * 2003-04-23 2007-06-26 Sensor Electronic Technology, Incorporated Electromagnetic radiation generation based on an object characteristic
JP2004349130A (ja) 2003-05-22 2004-12-09 Koito Mfg Co Ltd 車両用灯具
US7521667B2 (en) * 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7145125B2 (en) * 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US6995355B2 (en) 2003-06-23 2006-02-07 Advanced Optical Technologies, Llc Optical integrating chamber lighting using multiple color sources
TWI329724B (en) * 2003-09-09 2010-09-01 Koninkl Philips Electronics Nv Integrated lamp with feedback and wireless control
US7276861B1 (en) * 2004-09-21 2007-10-02 Exclara, Inc. System and method for driving LED
DE102004047766C5 (de) 2004-09-30 2014-02-27 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung
JP5048506B2 (ja) * 2004-10-27 2012-10-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 調光可能なｌｅｄ電源における起動フリッカ抑制
EP1861876A1 (fr) * 2005-03-24 2007-12-05 Tir Systems Ltd. Emballage pour dispositif d'eclairage a semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2579682A1 (fr) 2011-10-07 2013-04-10 Goodrich Lighting Systems GmbH Procédé de contrôle d'un phare d'avion

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EP2085686A1 (fr) 2009-08-05
CN100591982C (zh) 2010-02-24
WO2006063552A1 (fr) 2006-06-22
JP2008524045A (ja) 2008-07-10
US20120169232A1 (en) 2012-07-05
CN101124430A (zh) 2008-02-13
US8884521B2 (en) 2014-11-11
JP5141257B2 (ja) 2013-02-13
EP2085686B1 (fr) 2011-05-04
DE102004060890A1 (de) 2006-06-29
US8159144B2 (en) 2012-04-17
US20090302766A1 (en) 2009-12-10
ATE435400T1 (de) 2009-07-15
ATE508319T1 (de) 2011-05-15
DE502005007639D1 (de) 2009-08-13
EP1825188B8 (fr) 2009-09-02
EP1825188A1 (fr) 2007-08-29
DE502005011351D1 (de) 2011-06-16

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