EP1782916A1 - Procédés et appareil de meulage de miroirs - Google Patents

Procédés et appareil de meulage de miroirs Download PDF

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Publication number
EP1782916A1
EP1782916A1 EP06123456A EP06123456A EP1782916A1 EP 1782916 A1 EP1782916 A1 EP 1782916A1 EP 06123456 A EP06123456 A EP 06123456A EP 06123456 A EP06123456 A EP 06123456A EP 1782916 A1 EP1782916 A1 EP 1782916A1
Authority
EP
European Patent Office
Prior art keywords
substrate
grinding wheel
process according
grinding
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06123456A
Other languages
German (de)
English (en)
Inventor
David D Nguyen
Chad P. Stay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP1782916A1 publication Critical patent/EP1782916A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like

Definitions

  • This invention relates generally to ring laser gyroscopes, and more specifically, to methods and apparatus for processing of discrete mirrors utilized in ring laser gyroscopes.
  • Discrete mirror processing for at least one known ring laser gyroscope involves three processes normally used in optical fabrication, specifically, grinding, lapping, and polishing.
  • the lapping and polishing processes typically utilize a loose abrasive slurry.
  • the loose abrasive slurry comprises multiple abrasive particles dispersed in a liquid medium, for example, water.
  • loose abrasive slurries are widely used in the lapping and polishing processes to provide an optically clear surface finish on glass articles, loose abrasive slurries also have many disadvantages associated therewith.
  • such loose abrasive slurries must be periodically analyzed to assure quality and dispersion of the abrasive particles.
  • the equipment associated with the loose abrasive slurry process must also be continually maintained. Maintenance of such equipment is costly due to the labor costs associated with the maintenance. Further, additional equipment is typically incorporated into the slurry process for the preparation, handling and disposal of the loose abrasive slurry mixtures. Also, the cost of maintaining a loose abrasive slurry process is costly in term of raw materials, equipment maintenance, disposal of used slurries and labor. Processes which use slurries are usually very untidy because the loose abrasive slurry splatters easily and is difficult to contain.
  • a method for processing glass substrates for utilization as discrete mirrors comprises temporarily mounting a first end of at least one substrate onto a grinding machine plate, engaging a second end of the at least one substrate with a grinding wheel, rotating the plate and grinding wheel in opposite directions, and moving the grinding wheel and the plate toward one another at a rate.
  • a process for fabricating a mirror from a substrate comprises rotating an end of the substrate in a first direction, configuring a grinding wheel with a matrix between nine and twenty-five microns, engaging the end of the substrate with the grinding wheel, and rotating the grinding wheel in a direction opposite that of the substrate.
  • the methods and apparatus described herein provides for the elimination of the loose abrasive slurry lapping process that is currently utilized in the fabrication of high precision optics. Specifically, a grinding process that enables high precision optics to be ground to the same or a better surface finish, with minimal sub-surface damage and clarity as compared to conventional loose abrasive lapping is described. This grinding process provides for the fabrication and modification of glass articles such that the loose abrasive lapping process is eliminated and the glass articles are moved directly to polishing processes.
  • Figures 1 and 2 illustrate a plurality of rods 10 mounted to a plate 12.
  • plate 12 is of the type that is utilized with a grinding machine. Utilizing the illustrated configuration provides for the fabrication of discrete mirrors and substrates using a multi-speed grinder (e.g., a grinding machine) enabling the elimination of loose abrasive slurry lapping.
  • plate 12 is attached to a NAG-250 multi-speed grinder on which is mounted a 9-25 micron metal, metal/resin or resin bond matrix, for example, a nine micron resin bond matrix diamond wheel.
  • plate 12 is a circular glass plate.
  • Rods 10 include circular glass rods ranging from, for example, from 0.1 inches to about 3 inches, more specifically, from 0.305 inches to about 2.50 inches in diameter. Glass rods 10 are evenly spaced and temporarily mounted on glass plate 12. While described in terms of glass rods, it is to be understood that the processes described herein are not limited to such rods. Rather, substrates including, but not limited to, wafers, rods, cubes or other geometrical shapes may be polished as described herein.
  • glass plate 12 when attached to a grinding machine (not shown), glass plate 12 rotates clockwise at a speed of either about thirteen rpm (rough grind) or about four rpm (fine grind) while the grinding tool within the grinding machine rotates counter clockwise at a speed of either about 1000 rpm (rough grind) or about 1400 rpm (fine grind).
  • glass rods 10 are moved towards the grinding wheel at a rate.
  • a rough grind feed rate is about 0.07 mm/min and a fine grind feed rate is about 0.015 mm/min.
  • a 0.5% coolant and water mixture is used to provide lubrication at the surfaces being ground and further helps to remove glass swarf between the surface of the grinding wheel and ends of glass rods attached to plate 12.
  • Figure 3 is a flowchart 100 illustrating a rod grinding process utilizing the equipment and fixtures for grinding as described above. Specifically, glass rods 10 are mounted 102 onto a grinding machine plate 12. Rods 10 are mounted 102 at an end opposite the end that is to be ground and polished. The ends to be polished are then engaged 104 by a grinding wheel of the grinding machine.
  • the grinding machine plate 12 and grinding wheel are rotated 106 in opposite directions, and the grinding machine plate 12 and grinding wheel are moved 108 toward one another at a specific rate.
  • the surface finish on the glass rods is evaluated with a diamond stylus.
  • a diamond stylus is commercially available under the trade designation Mahr Pocket Surf available from Deterco, Inc., Houston, TX.
  • Initial surface finishes or Ra values of the of the ground ends of glass rods 10 typically fall within a range of 0.01 micrometer to 0.30 micrometer, while surface finishes utilizing a nine micron loose abrasive aluminum oxide slurry lapping process after an initial grinding range from 0.28 micrometer to 0.30 micrometer.
  • Sub-surface damage of the ground ends of the glass rods typically fall within 2.87 micrometers to 3.05 micrometers while sub-surface damage of ground ends of glass rods polished using the above described lapping process is between 3.10 micrometers and 3.30 micrometers.
  • the above described grinding process results in substrates and/or glass rods having a surface compatible with polishing processes that result in a polished substrate surface finish of between 1 Angstrom and 3 Angstroms.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Surface Treatment Of Glass (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
EP06123456A 2005-11-04 2006-11-03 Procédés et appareil de meulage de miroirs Withdrawn EP1782916A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/266,984 US20070105483A1 (en) 2005-11-04 2005-11-04 Methods and apparatus for discrete mirror processing

Publications (1)

Publication Number Publication Date
EP1782916A1 true EP1782916A1 (fr) 2007-05-09

Family

ID=37744571

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06123456A Withdrawn EP1782916A1 (fr) 2005-11-04 2006-11-03 Procédés et appareil de meulage de miroirs

Country Status (2)

Country Link
US (1) US20070105483A1 (fr)
EP (1) EP1782916A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239094A1 (fr) * 2009-04-08 2010-10-13 Honeywell International Inc. Verfahren zum Schutz von Oberflächen aus Poliermittelresten
CN111174809A (zh) * 2019-12-28 2020-05-19 中国船舶重工集团公司第七一七研究所 一种激光陀螺腔体内孔清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4144099A (en) * 1977-10-31 1979-03-13 International Business Machines Corporation High performance silicon wafer and fabrication process
US5942445A (en) * 1996-03-25 1999-08-24 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafers
JPH11320357A (ja) * 1998-05-08 1999-11-24 Nippei Toyama Corp 研削方法及び研削装置
US20050173377A1 (en) * 2004-02-05 2005-08-11 Georg Pietsch Semiconductor wafer, apparatus and process for producing the semiconductor wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300607A (ja) * 1998-04-16 1999-11-02 Speedfam-Ipec Co Ltd 研磨装置
JP3006591B2 (ja) * 1998-07-02 2000-02-07 信濃電気製錬株式会社 ロール研磨用多孔質砥石及びロール表面の研磨方法
US6394888B1 (en) * 1999-05-28 2002-05-28 Saint-Gobain Abrasive Technology Company Abrasive tools for grinding electronic components
WO2002001616A1 (fr) * 2000-06-29 2002-01-03 Shin-Etsu Handotai Co., Ltd. Procede de traitement d'une plaquette de semi-conducteur et plaquette de semi-conducteur
US6685755B2 (en) * 2001-11-21 2004-02-03 Saint-Gobain Abrasives Technology Company Porous abrasive tool and method for making the same
US20050181708A1 (en) * 2004-02-17 2005-08-18 Infineon Technologies Richmond, Lp. Removal of embedded particles during chemical mechanical polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4144099A (en) * 1977-10-31 1979-03-13 International Business Machines Corporation High performance silicon wafer and fabrication process
US5942445A (en) * 1996-03-25 1999-08-24 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafers
JPH11320357A (ja) * 1998-05-08 1999-11-24 Nippei Toyama Corp 研削方法及び研削装置
US20050173377A1 (en) * 2004-02-05 2005-08-11 Georg Pietsch Semiconductor wafer, apparatus and process for producing the semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2239094A1 (fr) * 2009-04-08 2010-10-13 Honeywell International Inc. Verfahren zum Schutz von Oberflächen aus Poliermittelresten
CN111174809A (zh) * 2019-12-28 2020-05-19 中国船舶重工集团公司第七一七研究所 一种激光陀螺腔体内孔清洗方法

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Publication number Publication date
US20070105483A1 (en) 2007-05-10

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