EP1714535A1 - Dispositif pour loger de maniere exempte de vibrations, des composants electriques speciaux et/ou des circuits electriques - Google Patents
Dispositif pour loger de maniere exempte de vibrations, des composants electriques speciaux et/ou des circuits electriquesInfo
- Publication number
- EP1714535A1 EP1714535A1 EP04804614A EP04804614A EP1714535A1 EP 1714535 A1 EP1714535 A1 EP 1714535A1 EP 04804614 A EP04804614 A EP 04804614A EP 04804614 A EP04804614 A EP 04804614A EP 1714535 A1 EP1714535 A1 EP 1714535A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- circuit carrier
- circuit
- pins
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
Definitions
- the invention relates to a device for shake-proof accommodation of special electrical components and / or electrical circuits, in particular in the form of a second component level in a control unit.
- a carrier which consists of a lead frame which is encapsulated with plastic.
- the components are welded to forks, which are part of the lead frame, and the special components are held on the carrier by means of an adhesive bead, which is arranged between the component and the carrier.
- the carrier itself is screwed to a base of a control unit by means of screws.
- the invention is accordingly based on the object of making available a device for shaking-resistant accommodation of special electrical components and / or electrical circuits, which ensures that the special components are held securely in the event of various vibration excitations.
- the inventive concept enables the use of various components, designs and circuits without major changes, and there is also the possibility of realizing the size of a control unit by moving the special components and, if necessary, circuits to a second electrical level.
- the device according to the invention it is advantageously possible to achieve a high degree of flexibility when changing components, and the use of other components and designs is possible by simply changing the layout.
- the circuit carrier is preferably applied at least in part over an electrically insulating medium.
- This insulating medium can consist of an insulating film, advantageously with heat conduction properties. It can be applied to the carrier in individual sections or over the entire surface, in particular by gluing.
- the carrier may have passages for contact pins that pass through and is accordingly not connected to the circuit carrier in such areas.
- the circuit carrier is applied to the carrier after the circuit carrier has been fitted, in particular with SMD components. It is preferably provided that the circuit carrier fastened on the carrier can be connected to a control unit via pins or a flexible film or a plug connection.
- the pins attached to the circuit carrier can preferably be designed as pin strips, SMD pins, stamped and bent parts or pin strips.
- Pin strip is arranged on a tab of the circuit carrier, which protrudes outward beyond the carrier. This advantageously gives the pins an additional elastic property, what helps to secure the contact connection and to reduce the transmission of vibrational excitations to the circuit carrier.
- the pin strip can advantageously be pressed into the circuit carrier as a pin strip in order to save a manufacturing step, the pin strip being soldered to a main circuit board.
- a connection between the circuit carrier and the control device can also take place via the SMD pins, which are soldered to the circuit part, and project downwards over the lateral edges of the carrier for connection to a motherboard. This also advantageously enables good vibration decoupling of the circuit carrier.
- the circuit carrier has screw openings for the passage of fastening screws which can be screwed into the bottom of a control device.
- the carrier is preferably made of cast aluminum and thus combines the advantages of high rigidity with those of good heat dissipation.
- the circuit carrier is applied in an electrically insulated manner via an electrically insulating medium, for example a plastic film. If the carrier alternatively consists of an electrically non-conductive material, the circuit carrier with special components attached to it can be applied directly at least over part of the surface.
- Figure 1 is an oblique perspective top view of a first embodiment of a device according to the invention, in which a connection to a motherboard is provided via a pin strip;
- Figure 2 is an oblique perspective top view of a second embodiment of a device according to the invention, in which SMD pins are provided for an electrical connection to a motherboard. DESCRIPTION OF THE EMBODIMENTS
- FIG. 1 shows a first exemplary embodiment of a device 10 according to the invention for shaking special components 11, 12 without shaking.
- the device 10 consists of a plate-shaped carrier 13 made of cast aluminum, onto which a circuit carrier 14 in the form of a printed circuit board is glued at least in part.
- the circuit carrier 14 additionally has holders 15 for the vibration-proof fastening of special components 11, for example capacitors.
- Other special components, such as component 12, are attached to circuit carrier 14 using SMD technology.
- the carrier 13 has screw openings 16 in the region of its four corners, which are provided for the passage of fastening screws (not shown) for fastening the carrier 11, for example in the bottom of a control device (not shown).
- the circuit carrier 14 has tabs 17 on opposite sides, which protrude in each case from the sides 18 and 19 of the carrier and to which pin strips 20 and 20 ', which consist of a plastic holder into which the pins are cast, are fastened by soldering.
- the pins are given an additional elastic property by the attachment to the tab 17 and 17 '.
- the pin strips 20 and 20 ' can be replaced by a pin strip (not shown) with press-in technology in order to save a manufacturing step.
- the pin header is pressed into the circuit board and can then be connected to a motherboard by soldering.
- FIG. 2 shows a further exemplary embodiment of a device 30 according to the invention for the shake-free reception of special electrical components and / or electrical circuits, in particular in the form of a second component level in a control unit.
- a support 31 is provided, which also consists of cast aluminum and is designed as a rectangular plate, on the sides 32 and 33 of which three screw openings 34 are formed.
- a circuit carrier 35 in the form of a printed circuit board is glued onto the carrier 31, on which special components 36 are fastened and glued by means of a holder 37 and SMD components 38. With 39 additional screws are indicated, which are used instead of a holding-down device, not shown, for the printed circuit board when an adhesive is curing.
- SMD pin arrangements 40, 40 ' are soldered to the circuit carrier 35 in the region of opposite end faces 41 and 41 * of the carrier 31 in order to establish an electrical connection to a main circuit board.
- the individual pins of the SMD pin arrangement 40 or 40 ' project downwards at a distance from the end faces 41, 41' and can be connected to a further circuit board, not shown, for example a main circuit board, by means of crucible or wave soldering.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
L'invention concerne un dispositif (10) permettant de loger de manière exempte de vibrations des composants électriques spéciaux (11, 12) et/ou des circuits électriques, notamment en configuration sous forme de second plan d'implantation dans un appareil de commande. Ledit dispositif comprend un support (13) sur lequel est monté, de préférence par collage, au moins partiellement en nappe, un support de circuit (14) isolé électriquement avec des composants spéciaux (11, 12) fixés dessus.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004004741A DE102004004741A1 (de) | 2004-01-30 | 2004-01-30 | Vorrichtung zur schüttelfesten Aufnahme von elektrischen Sonderbauelementen und/oder elektrischen Schaltungen |
PCT/EP2004/053177 WO2005074344A1 (fr) | 2004-01-30 | 2004-11-30 | Dispositif pour loger de maniere exempte de vibrations, des composants electriques speciaux et/ou des circuits electriques |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1714535A1 true EP1714535A1 (fr) | 2006-10-25 |
Family
ID=34813054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04804614A Withdrawn EP1714535A1 (fr) | 2004-01-30 | 2004-11-30 | Dispositif pour loger de maniere exempte de vibrations, des composants electriques speciaux et/ou des circuits electriques |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070249188A1 (fr) |
EP (1) | EP1714535A1 (fr) |
CN (1) | CN1906988A (fr) |
DE (1) | DE102004004741A1 (fr) |
WO (1) | WO2005074344A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005059584A1 (de) * | 2005-12-14 | 2007-06-21 | Robert Bosch Gmbh | Schaltungsanordnung mit einem mechanischen Dämpfungselement |
US7955093B2 (en) * | 2009-02-05 | 2011-06-07 | Tyco Electronics Corporation | Connector assembly having electronic components mounted thereto |
WO2012153559A1 (fr) * | 2011-05-10 | 2012-11-15 | 日産自動車株式会社 | Unité de sectionnement électrique |
TWM417677U (en) * | 2011-05-26 | 2011-12-01 | Wistron Corp | Connector mechanism with connection interface of clips and metal contacts |
CN108189780A (zh) * | 2017-12-12 | 2018-06-22 | 杭州云乐车辆技术有限公司 | 具有散热装置的汽车底板架 |
CN108882521B (zh) * | 2018-02-27 | 2021-07-30 | 宁波央腾汽车电子有限公司 | 一种印刷电路板上电容器的固定结构及设置方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5107404A (en) * | 1989-09-14 | 1992-04-21 | Astec International Ltd. | Circuit board assembly for a cellular telephone system or the like |
US5091826A (en) * | 1990-03-27 | 1992-02-25 | At&T Bell Laboratories | Printed wiring board connector |
EP0608418B1 (fr) * | 1992-05-20 | 1998-11-04 | Seiko Epson Corporation | Cartouche destinee a un appareil electronique |
US5359208A (en) * | 1993-02-26 | 1994-10-25 | Nippon Sheet Glass Co., Ltd. | Chip package with microlens array |
CA2161718A1 (fr) * | 1994-10-31 | 1996-05-01 | Hiromi Kurashima | Module optique a structure permettant de determiner la position des manchons par rapport a celle des porte-manchons |
US5611691A (en) * | 1995-01-17 | 1997-03-18 | Serge A. Atlan | Modular construction kit using electronic control modules |
US5801924A (en) * | 1996-02-22 | 1998-09-01 | Cray Research, Inc. | Method and apparatus for cooling daughter card modules |
US5911329A (en) * | 1996-04-30 | 1999-06-15 | Micron Technology, Inc. | Apparatus and method for facilitating circuit board processing |
US6147869A (en) * | 1997-11-24 | 2000-11-14 | International Rectifier Corp. | Adaptable planar module |
DE20012623U1 (de) * | 2000-07-18 | 2000-11-30 | TRW Automotive Electronics & Components GmbH & Co. KG, 78315 Radolfzell | Gehäuse für ein elektronisches Steuergerät in Fahrzeugen |
DE10202095A1 (de) * | 2002-01-21 | 2003-07-24 | Siemens Ag | Elektrisches Gerät |
EP1363026A3 (fr) * | 2002-04-26 | 2004-09-01 | Denso Corporation | Onduleur intégré moteur pour un véhicule automobile |
US6660563B1 (en) * | 2002-05-31 | 2003-12-09 | Hewlett-Packard Development Company, L.P. | Method and system for assembling a printed circuit board using a land grid array |
DE20304703U1 (de) * | 2003-01-20 | 2003-07-10 | Power Mate Technology Co., Ltd., Taichung | Wärme-ableitende Struktur einer Schaltungskarte |
US7345891B2 (en) * | 2003-10-07 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
-
2004
- 2004-01-30 DE DE102004004741A patent/DE102004004741A1/de not_active Withdrawn
- 2004-11-30 EP EP04804614A patent/EP1714535A1/fr not_active Withdrawn
- 2004-11-30 CN CNA2004800410284A patent/CN1906988A/zh active Pending
- 2004-11-30 US US10/588,142 patent/US20070249188A1/en not_active Abandoned
- 2004-11-30 WO PCT/EP2004/053177 patent/WO2005074344A1/fr not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO2005074344A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN1906988A (zh) | 2007-01-31 |
US20070249188A1 (en) | 2007-10-25 |
DE102004004741A1 (de) | 2006-05-24 |
WO2005074344A1 (fr) | 2005-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20060830 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE IT SE |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE IT SE |
|
17Q | First examination report despatched |
Effective date: 20070724 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20071204 |