CN1906988A - 用于抗振地容装电气特种元件和/或电路的装置 - Google Patents

用于抗振地容装电气特种元件和/或电路的装置 Download PDF

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CN1906988A
CN1906988A CNA2004800410284A CN200480041028A CN1906988A CN 1906988 A CN1906988 A CN 1906988A CN A2004800410284 A CNA2004800410284 A CN A2004800410284A CN 200480041028 A CN200480041028 A CN 200480041028A CN 1906988 A CN1906988 A CN 1906988A
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pedestal
circuit substrate
pin
aforementioned
special components
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沃尔夫冈·米勒
托马斯·乌兰
迪尔克·施密特
易卜拉欣·德伊尔曼吉
弗朗克·迪斯特勒
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Robert Bosch GmbH
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0056Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10462Flat component oriented parallel to the PCB surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10606Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045Protection against vibrations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

一种用于抗振地容装电气特种元件11,12和/或电路的装置10,尤其是构造为控制器中的第二装配平面,包括一个基座13,一个电路基板14连同固定在它上面的特种元件11,12优选通过粘接电绝缘地在至少部分面积上安置在该基座上。

Description

用于抗振地容装电气特种元件和/或电路的装置
现有技术
本发明涉及一种用于抗振地容装电气特种元件和/或电路的装置,尤其是构造为控制器中的第二装配平面。
为了容装电气特种元件如电容器、继电器等,已经知道一种基座,它用被塑料注塑包封的冲压栅制成。在此,元件焊接在叉上,这些叉是冲压栅的一部分,借助布置在元件与基座之间的胶粘缝将这些特种元件固定在基座上。基座自身通过螺钉联接在控制器的底上。此外还有可替换的保持架用于将特种元件固定在印制电路板上,这些保持架阻止特种元件的相对运动。
实践表明,尤其是当用在汽车中时,印制电路板会振动并且存在这样的危险:具有一定自重的特种元件发生松动。
因此,本发明的任务是,提供一种用于抗振地容装电气特种元件和/或电路的装置,该装置保证在各种不同的振动激励下可靠地固定特种元件。
根据本发明,该任务通过权利要求1中所述的特征解决。
在从属权利要求中给出本发明的有利扩展。
发明优点
基于该装置的本发明构造方案可达到高的静态和动态强度,因为电路基板与基座减振连接。同时,发明方案使得可使用多种不同的元件、结构形式和电路而无需大量修改,其中还存在这样的可能性,通过将特种元件和必要时将电路安置在第二电气平面中可实现一个控制器的结构尺寸。
在本发明装置中有利地在器件变化时可达到高的灵活性,通过简单的排版变化还可使用其它不同的元件和结构形式。
通过将电路基板固定地安置在基座上还可达到极好的耐热性。损耗功率减小,因为可通过基座向控制器的底部散热。
按照本发明,电路基板优选通过一种电绝缘的介质至少在部分面积上安置。该绝缘介质可以由优选具有导热性能的绝缘薄膜组成。在基座上的安置可以分单个段地或者整个面地进行,特别是通过粘接。基座可以具有用于穿透的接触引脚的开口并且因此在这些区域中不与电路基板连接。
按照本发明的一种优选构造方案,电路基板在基座上的安置在电路基板装配后、特别是与SMD(表面贴装器件)器件装配后进行。优选规定,固定在基座上的电路基板可通过引脚或柔性薄膜或插接连接与控制器连接。
固定在电路基板上的引脚优选可构造为引脚接触片(Pinleiste),SMD引脚,冲压弯曲部分或引线接触片(Sfiftleisten)。
在使用引脚接触片时,按照另一优选构造方案规定,引脚接触片设置在电路基板的一个连接板上,该连接板向外伸出到基座之外。由此使引脚有利地具有附加的弹性特性,这有助于使接触连接可靠并且减小振动激励到电路基板上的传递。
或者可以有利地将引脚接触片作为引线接触片压入电路基板中以便节省制造步骤,其中,引线接触片钎焊到主板上。
或者也可以通过SMD引脚进行电路基板与控制器之间的连接,这些引脚钎焊在电路部分上并且超过基座的侧边缘向下伸出以便与主板连接。由此也可有利地实现电路基板的良好的振动脱耦。
按照本发明的另一构造方案,电路基板具有螺钉孔,供可拧入控制器底部中的固定螺钉穿过。
基座优选用铝铸件构成,由此结合了高刚度和良好排热性的优点。在基座用铝铸件构成时,电路基板通过一种电绝缘的介质、例如塑料薄膜电绝缘地安置上。如果基座替换地用不导电的材料制成,则电路基板可以带着固定在上面的特种元件直接至少在局部面积上安置上。
附图
下面参照附图详细解释本发明的两个实施例。
附图表示:
图1本发明装置第一实施例的倾斜的立体俯视图,其中设置了通过引脚接触片到主板的连接,和
图2本发明装置第二实施例的倾斜的立体俯视图,其中设置了SMD引脚用于与主板的电连接。
实施例描述
在图1中示出用于无振动地容装特种元件11,12的本发明装置10的第一实施例。该装置10包括一个用铝铸件制成的板状的基座13,在该基座上在至少局部面积上粘接了呈印制电路板形式的电路基板14。电路基板14附加具有用于抗振地固定特种元件11、例如电容器的保持架15。另外的特种元件例如器件12用SMD技术固定在电路基板14上。
基座13在其四个角的区域内具有螺钉孔16,这些螺钉孔设置得供未示出的固定螺钉穿过,这些固定螺钉用于将基座13例如固定在未示出的控制器的底部内。
电路基板14在彼此相对的侧面上具有连接板17,它们分别伸出到该基板的侧面18,19之外,由塑料保持架构成的引脚接触片20及20′通过钎焊固定在它们上面,引脚注塑在这些引脚接触片中。通过固定在连接板17和17′上使引脚具有附加的弹性特性。
或者可以通过采用压入技术的未示出的引线接触片来取代这些引脚接触片20及20′,以便节省制造步骤。在此,引线接触片被压入电路基板中,然后可通过钎焊与主板连接。
在图2中示出用于无振动地容装电气特种元件和/或电路的本发明装置30的另一实施例,尤其是构造为控制器中的第二装配平面。在装置30中设置了一个基座31,该基座同样用铝铸件制成并且构造为矩形板,在它的侧面32和33上各成型上三个螺钉孔34。
在基座31上粘接上一个呈印制电路板形式的电路基板35,在该电路基板上固定和粘接上特种元件36——借助保持架37以及SMD器件38。另外用39表示螺钉,它们取代未示出的压紧装置用于在胶粘剂硬化时压紧印制电路板。
在基座31的彼此相对的端面41和41′的区域中,在电路基板35上钎焊了SMD引脚装置40,40′,用于产生与主板的电连接。SMD引脚装置40及40′的各个引脚与端面41,41′隔开距离地向下伸出并且可以与未示出的另外的板、例如一个主板通过坩锅焊(Tiegelloeten)或波焊连接。

Claims (13)

1.用于抗振地容装电气特种元件(11,12,36,38)和/或电路的装置(10,30),尤其是构造为控制器用的第二装配平面,包括
一个基座(13,31),一个电路基板(14,35)连同固定在它上面的特种元件(11,12,36,38)电绝缘地在至少部分面积上安置在该基座上。
2.根据权利要求1的装置,其特征在于,在基座(13,31)与电路基板(14,35)之间设置一种电绝缘的介质。
3.根据前述权利要求之一的装置,其特征在于,电路基板(14,35)通过一种优选排热的粘接剂、一种层叠上的粘接薄膜、螺钉、铆钉或折边固定在基座(13,31)上。
4.根据前述权利要求之一的装置,其特征在于,电路基板(14,35)具有印制电路板、柔性薄膜、陶瓷或电缆束。
5.根据前述权利要求之一的装置,其特征在于,基座(13,31)具有供接触引脚穿过的开口。
6.根据前述权利要求之一的装置,其特征在于,固定在基座(13,31)上的电路基板(14,35)可通过引脚(20,20′)(40,40′)与一控制器连接。
7.根据权利要求6的装置,其特征在于,这些引脚构造为引脚接触片(20,20′),SMD引脚(40,40′),冲压弯曲部分或引线接触片。
8.根据权利要求7的装置,其特征在于,引脚接触片(20,20′)安置在电路基板(14)的连接板(17,17′)上,该连接板向外伸出超过基座(13)。
9.根据权利要求7的装置,其特征在于,每个引线接触片被压入电路基板中。
10.根据权利要求7的装置,其特征在于,SMD引脚(40,40′)钎焊在电路基板(35)上并超过基座(31)的侧边缘(41,41′)向下伸出以便与一主板连接。
11.根据权利要求1至5之一的装置,其特征在于,固定在基座上的电路基板可通过柔性薄膜和插接连接与一控制器连接。
12.根据前述权利要求之一的装置,其特征在于,基座(13,31)具有螺钉孔(16,34),供特别是可拧入控制器的底部中的固定螺钉穿过。
13.根据前述权利要求之一的装置,其特征在于,基座(13,31)用铝铸件制成。
CNA2004800410284A 2004-01-30 2004-11-30 用于抗振地容装电气特种元件和/或电路的装置 Pending CN1906988A (zh)

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DE102004004741A DE102004004741A1 (de) 2004-01-30 2004-01-30 Vorrichtung zur schüttelfesten Aufnahme von elektrischen Sonderbauelementen und/oder elektrischen Schaltungen
DE102004004741.3 2004-01-30

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US (1) US20070249188A1 (zh)
EP (1) EP1714535A1 (zh)
CN (1) CN1906988A (zh)
DE (1) DE102004004741A1 (zh)
WO (1) WO2005074344A1 (zh)

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CN101859941A (zh) * 2009-02-05 2010-10-13 泰科电子公司 具有安装到其上的电子元件的连接器组件
CN108189780A (zh) * 2017-12-12 2018-06-22 杭州云乐车辆技术有限公司 具有散热装置的汽车底板架

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CN101859941B (zh) * 2009-02-05 2014-09-17 泰科电子公司 具有安装到其上的电子元件的连接器组件
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US20070249188A1 (en) 2007-10-25
EP1714535A1 (de) 2006-10-25
WO2005074344A1 (de) 2005-08-11

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