EP1706271B1 - Ensemble d'ejection de gouttelettes - Google Patents
Ensemble d'ejection de gouttelettes Download PDFInfo
- Publication number
- EP1706271B1 EP1706271B1 EP04815777A EP04815777A EP1706271B1 EP 1706271 B1 EP1706271 B1 EP 1706271B1 EP 04815777 A EP04815777 A EP 04815777A EP 04815777 A EP04815777 A EP 04815777A EP 1706271 B1 EP1706271 B1 EP 1706271B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- well
- nozzle
- nozzle opening
- fluid
- meniscus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005499 meniscus Effects 0.000 claims description 38
- 239000012530 fluid Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 22
- 239000002210 silicon-based material Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 52
- 239000000758 substrate Substances 0.000 description 10
- 239000002699 waste material Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000013060 biological fluid Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/07—Ink jet characterised by jet control
- B41J2/11—Ink jet characterised by jet control for ink spray
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
- B41J2/04581—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
Definitions
- This invention relates to ejecting drops.
- Ink jet printers are one type of apparatus for depositing drops on a substrate.
- Ink jet printers typically include an ink path from an ink supply to a nozzle path. The nozzle path terminates in a nozzle opening from which ink drops are ejected.
- Ink drop ejection is typically controlled by pressurizing ink in the ink path with an actuator, which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element.
- An actuator which may be, for example, a piezoelectric deflector, a thermal bubble jet generator, or an electrostatically deflected element.
- a typical print assembly has an array of ink paths with corresponding nozzle openings and associated actuators. Drop ejection from each nozzle opening can be independently controlled.
- each actuator is fired to selectively eject a drop at a specific pixel location of an image as the print assembly and a printing substrate are moved relative to one another.
- the nozzle openings typically have a diameter of 50 microns or less, e.g. around 25 microns, are separated at a pitch of 100-300 nozzles/inch, have a resolution of 100 to 3000 dpi or more, and provide drops with a volume of about 1 to 120 picoliters (pl) or less.
- Drop ejection frequency is typically 10 kHz or more.
- Hoisington et al. U.S. Patent No. 5,265,315 describes a print assembly that has a semiconductor body and a piezoelectric actuator.
- the body is made of silicon, which is etched to define ink chambers. Nozzle openings are defined by a separate nozzle plate, which is attached to the silicon body.
- the piezoelectric actuator has a layer of piezoelectric material, which changes geometry, or bends, in response to an applied voltage. The bending of the piezoelectic layer pressurizes ink in a pumping chamber located along the ink path.
- Piezoelectric ink-jet print assemblies are also described in Fishbeck et al. U.S. Patent No. 4,825,227 , Hine U.S. Patent No. 4,937,598 , Moynihan et al. U.S. Patent No. 5,659,346 and Hoisington U.S. Patent No. 5,757,391 .
- the invention features fluid drop ejection.
- a printhead is provided that includes a flow path in which fluid is pressurized to eject drops from a nozzle opening.
- the nozzle opening is disposed in a well. Fluid is supplied to the well from the nozzle opening to form a meniscus.
- the meniscus defines a fluid depth above the edge of the nozzle opening equal to about 1 to 15% of the nozzle opening width with the well filled with fluid.
- the meniscus is formed by controlling the pressure at the meniscus .
- the invention features a printhead with a flow path in which fluid is pressurized to eject drops from a nozzle opening.
- the nozzle opening is disposed in a well.
- the ratio of the cross-section of the well to the cross-section of the nozzle opening is about 1.4 to about 2.75. In embodiments, the ratio of the well depth to the cross-section of the nozzle opening is about 0.15 to 0.5.
- a printhead in another aspect, includes a fluid flow path in which fluid is pressured to eject drops from a nozzle opening.
- the nozzle opening is disposed in a well.
- the well has a relatively long axis and a short axis.
- Forming the meniscus is performed by reducing the pressure in the fluid.
- a vacuum is applied at a location upstream of the nozzle opening.
- the vacuum at the nozzle opening is from about 0.5 to about 10 inwg (vacuum pressures herein are in inches of water gauge (inwg)).
- the ratio of the well width to the nozzle opening width is from about 1.4 to about 2.8.
- the well has a depth of about 0.15 to 0.5 of the nozzle opening.
- the spacing between well perimeter and nozzle perimeter is from about 0.2 or more of the nozzle width.
- the fluid has a surface tension of about 20-45 dynes/cm.
- the nozzle opening and the well is defined by a common body.
- the nozzle opening and/or the well is, for example, defined in a silicon material.
- the nozzle opening and/or the well may also be defined in metal, carbon or plastic.
- the fluid is pressurized by a piezoelectric element.
- the nozzle opening has a width is about 70 micron or less.
- the method includes a plurality of nozzle openings and the nozzle openings may have a pitch of about 25 nozzles/inch or more.
- the method may include ejecting drops having a volume of about 1 to about 70 pL.
- Embodiments may include one or more of the following advantages.
- Printhead operation is robust and reliable since waste ink about the face of the nozzle plate is controlled to reduce interference with drop formation and ejection.
- Drop velocity and trajectory straightness is maintained in high performance printheads in which large arrays of small nozzles must accurately eject ink to precise locations on a substrate.
- the well structure controls waste ink and permits desirable jetting characteristics with a variety of jetting fluids, such as inks with varying viscosity or surface tension characteristics, and heads with varying pressure characteristics at the nozzle openings.
- the well structure itself is robust, does not require moving components, and can be implemented by etching, e.g., in a semiconductor material such as a silicon material.
- an ink jet apparatus 10 includes a reservoir 11 containing a supply of ink 12 and a passage 13 leading from the reservoir 11 to a pressure chamber 14.
- the actuator is operable to force ink from the pressure chamber 14 through a passage 16 leading to a nozzle opening 17 in an nozzle plate 18, causing a drop of ink 19 to be ejected from the nozzle 17 toward a substrate 20.
- the ink jet apparatus 10 and the substrate 20 can be moved relative to one another.
- the substrate can be a continuous web that is moved between rolls 22 and 23.
- the ink jet apparatus also controls the operating pressure at the ink meniscus proximate the nozzle openings when the system is not ejecting drops.
- pressure control is provided by a vacuum source 30 such as a mechanical pump that applies a vacuum to the head space 9 over the ink 12 in the reservoir 11.
- the vacuum is communicated through the ink to the nozzle opening 17 to prevent ink from weeping through the nozzle opening by force of gravity.
- a controller 32 e.g. a computer controller, monitors the vacuum over the ink in the reservoir 11 and adjusts the source 30 to maintain a desired vacuum in the reservoir.
- a vacuum source is provided by arranging the ink reservoir below the nozzle openings to create a vacuum proximate the nozzle openings.
- An ink level monitor detects the level of ink, which falls as ink is consumed during a printing operation and thus increases the vacuum at the nozzles.
- a controller monitors the ink level and refills the reservoir from a bulk container when ink falls below a desired level to maintain vacuum within a desired operation range.
- the ink can be pressurized to maintain a meniscus proximate the nozzle openings.
- the operating vacuum is maintained at about 0.5 to about 10 inwg.
- ink may collect on the nozzle plate 18. Over time, the ink can form puddles which cause printing errors. For example, puddles near the edge of a nozzle opening can effect the trajectory, velocity or volume of the ejected drops. Also, a puddle could become large enough so that it drips onto printing substrate 20 causing an extraneous mark. The puddle could also protrude far enough off the nozzle plate 18 surface that the printing substrate 20 comes into contact with it, causing a smear on the printing substrate 20.
- the nozzle plate 18 includes an array of closely spaced nozzle openings 17 and each nozzle opening 17 is located in a well 40.
- the nozzle opening 17 is defined in and centered on the floor 42 of the well 40.
- the floor 42 of the well extends to the wall 44 of the well, which projects outwardly to the face 46 of the nozzle plate.
- the dimensions of the well including its width, W w , its depth, d w , and the spacing, S, of the well wall from the perimeter of the nozzle opening are selected to control waste ink.
- a meniscus 52 is formed.
- the meniscus has a depthat the edge of the nozzle opening, d m , that is small compared to the nozzle width W n .
- the predictable shape of the meniscus provides reliable jetting.
- the shallow depth of the meniscus provides jetting without substantially affecting the drop direction or velocity.
- the spacing, S is selected to reduce the likelihood that waste ink on the face 46 of the nozzle plate 18 will influence drop formation or ejection.
- the effect on the meniscus is illustrated as the well width, W w , increases and the operating pressure varies.
- the meniscus labeled M H , M l and M L , is represented at high, intermediate, and low vacuum pressure, respectively.
- the depth of the meniscus over the nozzle openings decreases as the well width increases. Referring particularly to FIG. 2 , the meniscus is over the nozzle opening at all pressures. At high vacuum pressure, the meniscus depth is relatively shallow, which is typically desirable for jetting. At low vacuum, the meniscus depth is greater, which can result in non-optimal jetting. In this case, the depth of the well can be decreased to reduce the meniscus depth. Referring to FIG.
- the meniscus is at a selected depth at high and intermediate pressures and non-optimally deep at low pressure.
- the meniscus is at a desirable operating depth at intermediate pressure, non-optimally deep at low pressure, and non-optimally shallow at high pressure.
- the meniscus does not form over the nozzle opening. Most of the ink is drawn into the nozzle opening, while some waste ink is retained in the well.
- the meniscus does not form over the nozzle opening at any operating pressure. Fluid collects in the corner between the well floor and wall and extends to the perimeter of the nozzle opening. This condition is non-optimal since fluid at the perimeter of the nozzle opening can effect jetting.
- the meniscus fluid has a surface tension of 30 dynes/cm and the operating vacuum pressure is 2, 4, and 6 inwg. The dimensions are in mm.
- spacing, S between the well wall and the perimeter of the nozzle provides a distance that reduces the likelihood that waste ink on the nozzle plate face will affect jetting.
- spacing, S is about 20% or more, e.g. 25 to 100% of the nozzle width, W n .
- the dimensions of the well also provide a desirable meniscus depth over the nozzle openings.
- the well provides a meniscus depth over the edge of the nozzle opening of about 1 to 15% of the nozzle width when the well is full of fluid of a given surface tension and the nozzle is within a given operating pressure.
- the well is full of fluid when there is sufficient fluid to substantially cover the wall of the well.
- the meniscus depth, measured at the edge of the nozzle is about 1 to 25% of the nozzle opening.
- the desired meniscus depth is maintained over a desired range of operating pressures.
- the operating pressure is about - 0.5 to -10 inwg, e.g. about -2 to -4 or -6 inwg.
- the fluid has a surface tension of about 20 to 40 dynes/cm.
- the ratio of the well width to the nozzle width is about 1.4 to about 2.8, e.g. about 1.5 to about 1.7.
- the well depth is about 0.15 to 0.5 of the nozzle opening width.
- the well dimensions can also be selected to define a volume needed to accommodate a certain volume of waste ink.
- well and nozzle widths are measured at the minimum values.
- the well depth is measured between the nozzle opening and the face of the nozzle plate.
- the nozzles width is about 200 micron or less, e.g. about 10 to 30 micron
- the nozzle pitch is about 100 nozzles/inch or more, e.g., 300 nozzles/inch
- the drop volume is about 1 to 70 pL.
- the fluid has a viscosity of about 1 centipoise to about 40 centipoise.
- a nozzle plate 70 includes a nozzle opening 72 which is circular, and a well 74, which is an oval.
- the major axis, A L , of the oval is arranged along a direction (arrow 76) in which the nozzle face can be wiped or washed in a manual or mechanical cleaning operation.
- the oval well collects debris along the length of its major axis A L at locations remote from the nozzle opening, which reduces the likelihood of obstructing the nozzle opening with debris carried into the well during cleaning.
- the length of the well along the major axis is about 300 to 600 micron, while the width of the well across the minor axis is about 50 - 70 microns.
- the nozzle openings have non-circular geometries that match or do not match the geometry of the well.
- the nozzle opening can be offset from the center of the well.
- the well depth can vary between the nozzle opening and the location in which the perimeter of the well meets the nozzle plate.
- the well and/or the nozzle opening can be formed by machining, laser ablation, or chemical or plasma etching.
- the well can also be formed by molding, e.g. a plastic element.
- the well and nozzle opening can be formed in a common body or in separate bodies that are assembled.
- the nozzle opening is formed in a body that defines other components of an ink flow path and the well is formed in a separate body which is assembled to the body defining the nozzle opening.
- the well, nozzle opening, and pressure chamber are formed in a common body.
- the body can be a metal, carbon or an etchable material such as silicon material, e.g. silicon or silicon dioxide. Forming printhead components using etching techniques is further described in U.S.Serial No. 10/189,947, filed July 3, 2002 , and U.S. Serial No. 60/510,459, filed October 10, 2003 , the entire contents of each are hereby incorporated by reference.
- the well can include a non-wetting coating.
- the printhead system can be utilized to eject fluids other than ink.
- the deposited droplets may be a UV or other radiation curable material or other material, for example, chemical or biological fluids, capable of being delivered as drops.
- the apparatus described could be part of a precision dispensing system.
- the actuator can be an electromechanical or thermal actuator.
- the well arrangements can be used in combination with other waste fluid control features such as apertures described in U.S. Serial No. 10/749,829, filed December 30, 2003 , projections as described in U.S. Serial No. 10/749,816, filed December 30, 2003 and/or channels as described in U.S. Serial No.
- a series of projections or a channel can be included inside the well or on the nozzle face proximate the well, e.g., surrounding the well.
- An aperture can be provided in the well or on the nozzle face.
- the fluid control structures can be combined with a manual or automatic washing and wiping system in which a cleaning fluid is applied to the nozzle plate and wiped clean.
- the cleaning structures can collect cleaning fluid and debris rather than jetted waste ink.
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Coating Apparatus (AREA)
- Ink Jet (AREA)
- Cereal-Derived Products (AREA)
- Seal Device For Vehicle (AREA)
- Saccharide Compounds (AREA)
Claims (18)
- Un procédé d'éjection de goutte de fluide, consistant à :fournir une tête d'impression comprenant un trajet d'écoulement de fluide (14, 16) dans lequel du fluide est mis en pression pour éjecter des gouttes (19) à partir d'une ouverture de buse (17), l'ouverture de buse étant ménagée dans une cavité (40),fournir du fluide (50) à la cavité à partir de l'ouverture de buse pour former un ménisque (52),caractérisé en ce que le ménisque définit, au-dessus du bord de l'ouverture de buse, une profondeur de fluide (dm) égale à environ 1 à 15 % de la largeur d'ouverture de buse (WN) avec la cavité remplie de fluide, le ménisque étant formé en jouant sur une pression au niveau du ménisque.
- Le procédé de la revendication 2, consistant à former le ménisque en réduisant la pression dans le fluide.
- Le procédé de la revendication 2, consistant à appliquer une dépression en un point situé en amont de l'ouverture de buse.
- Le procédé de la revendication 2, dans lequel la dépression au niveau de l'ouverture de buse est d'environ 0,5 à 10 pouces de colonne d'eau.
- Le procédé de la revendication 1, dans lequel le rapport de la largeur de cavité (Ww) à la largeur d'ouverture de buse est d'environ 1,4 à 2,8.
- Le procédé de la revendication 1, dans lequel la cavité a une profondeur (dw) d'environ 0,15 à 0,5 de l'ouverture de buse.
- Le procédé de la revendication 1, dans lequel l'espacement (S) entre le périmètre de cavité et le périmètre de buse est égal à environ 0,2 ou plus de la largeur de buse.
- Le procédé de la revendication 1, dans lequel le fluide a une tension superficielle d'environ 20 à 45 dynes/cm.
- Le procédé de la revendication 1, dans lequel l'ouverture de buse et la cavité sont définies par un corps commun.
- Le procédé de la revendication 1, dans lequel l'ouverture de buse et/ou la cavité sont définies dans du matériau silicium.
- Le procédé de la revendication 1, dans lequel la buse et/ou la cavité sont définies dans un métal.
- Le procédé de la revendication 1, dans lequel la buse et/ou la cavité sont définies dans du carbone.
- Le procédé de la revendication 1, dans lequel la buse et/ou la cavité sont définies dans un plastique.
- Le procédé de la revendication 1, dans lequel le fluide est mis en pression par un élément piézoélectrique.
- Le procédé de la revendication 1, dans lequel la largeur d'ouverture de buse est d'environ 70 microns ou moins.
- Le procédé de la revendication 1, comprenant une pluralité d'ouvertures de buse (17), les ouvertures de buse présentant un pas d'environ 25 buses/pouce ou plus.
- Le procédé de la revendication 1, comprenant l'éjection de gouttes présentant un volume d'environ 1 à 70pL.
- Le procédé de la revendication 1, dans lequel le fluide présente une viscosité d'environ 40 centipoises.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/749,833 US7303259B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
US10/749,816 US7121646B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
US10/749,622 US7168788B2 (en) | 2003-12-30 | 2003-12-30 | Drop ejection assembly |
PCT/US2004/043775 WO2005065330A2 (fr) | 2003-12-30 | 2004-12-29 | Ensemble d'ejection de gouttelettes |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1706271A2 EP1706271A2 (fr) | 2006-10-04 |
EP1706271A4 EP1706271A4 (fr) | 2009-08-19 |
EP1706271B1 true EP1706271B1 (fr) | 2011-12-21 |
Family
ID=34753712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04815777A Active EP1706271B1 (fr) | 2003-12-30 | 2004-12-29 | Ensemble d'ejection de gouttelettes |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1706271B1 (fr) |
JP (1) | JP4936900B2 (fr) |
KR (1) | KR101211012B1 (fr) |
AT (1) | ATE537971T1 (fr) |
WO (1) | WO2005065330A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2760672A4 (fr) * | 2011-09-30 | 2017-05-17 | Hewlett-Packard Development Company, L.P. | Têtes de distribution comprenant éléments de surface de limitation de flaque de fluide |
GB201420264D0 (en) | 2014-11-14 | 2014-12-31 | The Technology Partnership Plc | Non-contact liquid printing |
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DE3048259A1 (de) * | 1980-12-20 | 1982-07-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "duese fuer tintenstrahldrucker" |
JPH06286129A (ja) * | 1992-02-20 | 1994-10-11 | Seikosha Co Ltd | インクジェットヘッド |
US5659346A (en) * | 1994-03-21 | 1997-08-19 | Spectra, Inc. | Simplified ink jet head |
JP3122323B2 (ja) * | 1995-01-13 | 2001-01-09 | キヤノン株式会社 | インクタンクおよびそれを搭載するインクジェット記録装置 |
US6254219B1 (en) * | 1995-10-25 | 2001-07-03 | Hewlett-Packard Company | Inkjet printhead orifice plate having related orifices |
JP3865087B2 (ja) * | 1996-10-29 | 2007-01-10 | 大日本塗料株式会社 | 基板の塗装方法 |
US6511156B1 (en) * | 1997-09-22 | 2003-01-28 | Citizen Watch Co., Ltd. | Ink-jet head nozzle plate, its manufacturing method and ink-jet head |
US6139136A (en) * | 1997-12-17 | 2000-10-31 | Pitney Bowes Inc. | Ink supply system including a multiple level ink reservoir for ink jet printing |
US6527370B1 (en) * | 1999-09-09 | 2003-03-04 | Hewlett-Packard Company | Counter-boring techniques for improved ink-jet printheads |
JP3596599B2 (ja) * | 2000-03-24 | 2004-12-02 | セイコーエプソン株式会社 | 液滴噴射方法、及び液滴噴射装置 |
ATE448085T1 (de) * | 2001-11-22 | 2009-11-15 | Canon Kk | Flüssigkeitsstrahlkopf |
JP2003154655A (ja) * | 2001-11-22 | 2003-05-27 | Canon Inc | 液体吐出ヘッド |
JP2003182092A (ja) * | 2001-12-19 | 2003-07-03 | Konica Corp | インクジェット記録装置 |
-
2004
- 2004-12-29 EP EP04815777A patent/EP1706271B1/fr active Active
- 2004-12-29 JP JP2006547519A patent/JP4936900B2/ja active Active
- 2004-12-29 AT AT04815777T patent/ATE537971T1/de active
- 2004-12-29 WO PCT/US2004/043775 patent/WO2005065330A2/fr active Application Filing
-
2006
- 2006-07-31 KR KR1020067015514A patent/KR101211012B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP4936900B2 (ja) | 2012-05-23 |
KR20060127953A (ko) | 2006-12-13 |
KR101211012B1 (ko) | 2012-12-11 |
EP1706271A4 (fr) | 2009-08-19 |
WO2005065330A2 (fr) | 2005-07-21 |
EP1706271A2 (fr) | 2006-10-04 |
WO2005065330A3 (fr) | 2006-03-02 |
ATE537971T1 (de) | 2012-01-15 |
JP2007516877A (ja) | 2007-06-28 |
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