EP1703321B1 - Procédé de fabrication d'une plaque d'impression lithographique sans traitement - Google Patents
Procédé de fabrication d'une plaque d'impression lithographique sans traitement Download PDFInfo
- Publication number
- EP1703321B1 EP1703321B1 EP20050101966 EP05101966A EP1703321B1 EP 1703321 B1 EP1703321 B1 EP 1703321B1 EP 20050101966 EP20050101966 EP 20050101966 EP 05101966 A EP05101966 A EP 05101966A EP 1703321 B1 EP1703321 B1 EP 1703321B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- printing plate
- hydrophilic
- heat
- image
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
- 238000007639 printing Methods 0.000 title claims description 86
- 238000000034 method Methods 0.000 title claims description 36
- 239000002243 precursor Substances 0.000 claims description 35
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 27
- 239000010936 titanium Substances 0.000 claims description 26
- 229910052719 titanium Inorganic materials 0.000 claims description 26
- 230000002209 hydrophobic effect Effects 0.000 claims description 21
- 238000000137 annealing Methods 0.000 claims description 17
- 238000007743 anodising Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000008151 electrolyte solution Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 35
- 239000000976 ink Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 12
- -1 TiOx (x= 1.0-2.0) Chemical class 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000002585 base Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000002679 ablation Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 239000006096 absorbing agent Substances 0.000 description 5
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000002048 anodisation reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229940021013 electrolyte solution Drugs 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910017107 AlOx Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001342 alkaline earth metals Chemical group 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000005660 hydrophilic surface Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000007540 photo-reduction reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 101100172118 Caenorhabditis elegans eif-2Bgamma gene Proteins 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 229920000881 Modified starch Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101100030361 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pph-3 gene Proteins 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 150000001340 alkali metals Chemical group 0.000 description 1
- AWUCVROLDVIAJX-UHFFFAOYSA-N alpha-glycerophosphate Natural products OCC(O)COP(O)(O)=O AWUCVROLDVIAJX-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 159000000011 group IA salts Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229920001477 hydrophilic polymer Polymers 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- YZMHQCWXYHARLS-UHFFFAOYSA-N naphthalene-1,2-disulfonic acid Chemical compound C1=CC=CC2=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C21 YZMHQCWXYHARLS-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000002910 rare earth metals Chemical group 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- AWUCVROLDVIAJX-GSVOUGTGSA-N sn-glycerol 3-phosphate Chemical compound OC[C@@H](O)COP(O)(O)=O AWUCVROLDVIAJX-GSVOUGTGSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 230000007928 solubilization Effects 0.000 description 1
- 238000005063 solubilization Methods 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/10—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme
- B41C1/1041—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by modification of the lithographic properties without removal or addition of material, e.g. by the mere generation of a lithographic pattern
Definitions
- the present invention relates to a method for making a negative-working, heat-sensitive printing plate precursor which is suitable for making a lithographic printing plate by direct-to-plate recording.
- Lithographic printing presses use a so-called printing master such as a printing plate which is mounted on a cylinder of the printing press.
- the master carries a lithographic image on its surface and a print is obtained by applying ink to said image and then transferring the ink from the master onto a receiver material, which is typically paper.
- ink as well as an aqueous fountain solution (also called dampening liquid) are supplied to the lithographic image which consists of oleophilic (or hydrophobic, i.e. ink-accepting, water-repelling) areas as well as hydrophilic (or oleophobic, i.e. water-accepting, ink-repelling) areas.
- driographic printing the lithographic image consists of ink-accepting and ink-abhesive (ink-repelling) areas and during driographic printing, only ink is supplied to the master.
- Printing masters are generally obtained by the image-wise exposure and processing of an imaging material called plate precursor.
- plate precursor an imaging material
- heat-sensitive printing plate precursors have become very popular in the late 1990s.
- thermal materials offer the advantage of daylight stability and are especially used in the so-called computer-to-plate method wherein the plate precursor is directly exposed, i.e. without the use of a film mask.
- the material is exposed to heat or to infrared light and the generated heat triggers a (physico-)chemical process, such as ablation, polymerization, insolubilization by cross linking of a polymer, heat-induced solubilization, or by particle coagulation of a thermoplastic polymer latex.
- a (physico-)chemical process such as ablation, polymerization, insolubilization by cross linking of a polymer, heat-induced solubilization, or by particle coagulation of a thermoplastic polymer latex.
- the most popular thermal plates form an image by a heat-induced solubility difference in an alkaline developer between exposed and non-exposed areas of the coating.
- the coating typically comprises an oleophilic binder, e.g. a phenolic resin, of which the rate of dissolution in the developer is either reduced (negative working) or increased (positive working) by the image-wise exposure.
- the solubility differential leads to the removal of the non-image (non-printing) areas of the coating, thereby revealing the hydrophilic support, while the image (printing) areas of the coating remain on the support.
- Typical examples of such plates are described in e.g.
- Some of these thermal processes enable plate making without wet processing and are for example based on ablation of one or more layers of the coating. At the exposed areas the surface of an underlying layer is revealed which has a different affinity towards ink or fountain than the surface of the unexposed coating; the image (printing) and non-image or background (non-printing) areas are obtained.
- US 5,605,780 discloses a lithographic printing plate comprising an anodized aluminum support and provided thereon an image-forming layer comprising an IR absorbing agent and a cyanoacrylate polymer binder.
- the image-forming layer is removed by laser-induced thermal ablation whereby the underlying hydrophilic support is revealed.
- EP-A 580,393 discloses a lithographic printing plate directly imageable by laser discharge, the plate comprising a topmost first layer and a second layer underlying the first layer wherein the first layer is characterized by efficient absorption of infrared radiation and the first and second layer exhibit different affinities for at least one printing liquid.
- EP 1,065,051 discloses a negative-working heat-sensitive material for making lithographic plates comprising in the order given a lithographic base having a hydrophilic surface, an oleophilic imaging layer and a cross-linked hydrophilic upper layer. The heat generated during exposure in the light-sensitive layer removes the hydrophilic upper layer by ablation.
- ablative plates generate ablation debris which may contaminate the electronics and optics of the exposure device and which needs to be removed from the plate by wiping it with a cleaning solvent, so that ablative plates are often not truly processless. Ablation debris which is deposited onto the plate's surface may also interfere during the printing process and result in for example scumming.
- thermal processes which enable plate making without wet processing are for example processes based on a heat-induced hydrophilic/ oleophilic conversion of one or more layers of the coating so that at exposed areas a different affinity towards ink or fountain is created than at the surface of the unexposed coating.
- US 5,855,173 , US 5,839,369 and 5,839,370 describe a method relying on the image-wise hydrophilic-hydrophobic transition of a ceramic such as a zirconia ceramic and the subsequent reverse transition in an image erasure step.
- This image-wise transition is obtained by exposure to infrared laser irradiation at a wavelength of 1064 nm at high power which induces local ablation and formation of substoichiometric zirconia.
- US 5,893,328 , US 5,836,248 and US 5,836,249 disclose a printing material comprising a composite of zirconia alloy and ⁇ -alumina which can be imaged using similar exposure means to cause localized "melting" of the alloy in the exposed areas and thereby creating hydrophobic/oleophilic surfaces.
- a similar printing material containing an alloy of zirconium oxide and Yttrium oxide is described in US 5,870,956 .
- the high laser power output required in these prior art methods implies the use of expensive exposure devices.
- EP 1,002,643 discloses a printing plate comprising an anodized titanium metal sheet which becomes hydrophilic or ink-repellent upon image-wise exposure to actinic light. Said printing plate can be regenerated after printing by first cleaning the plate and subsequently subjecting the plate to a heat-treatment step whereby the plate surface becomes evenly oleophilic or ink-accepting.
- EP 958,941 discloses a plate precursor having a surface layer comprising Si 3 N 4 and/or BN on which an image can be formed after image-wise exposure of the layer to light.
- US 6,240,091 discloses a method of producing a lithographic printing plate by image-wise irradiation of a printing plate precursor which comprises a support having a hydrophilic, metallic compound layer with photo-catalytic properties and light-heat convertible minute particles onto said layer, whereby the polarity of the metallic layer is converted and a hydrophobic area is obtained.
- US 6,455,222 discloses lithographic printing plate precursors comprising light-heat convertible particles with a hydrophilic surface such as inorganic metal oxides including TiO x , SiO x and AlO x . Upon heat exposure of said particles there surface is converted from a hydrophilic state to a hydrophobic state.
- a hydrophilic surface such as inorganic metal oxides including TiO x , SiO x and AlO x .
- EP 903,223 discloses a lithographic printing method using a printing plate precursor comprising a surface having a thin layer of TiO 2 , ZnO or a compound selected from the group consisting of RTiO 3 wherein R represents an alkaline earth metal atom, AB 2-x C x D 3 - x E x O 10 wherein A represents a hydrogen atom or an alkali metal atom; B represents an alkaline earth metal atom or a lead atom; C represents a rare earth atom; D represents a metal atom of the group 5A of the Periodic Table; E represents a metal atom of the group 4A of the Periodic Table; and x represents a number from 0 to 2, SnO2, Bi 2 O 3 and Fe 2 O 3 .
- the exposure step with actinic light through a film mask renders the surface hydrophilic at the exposed areas and subsequent heating results in a hydrophilic/hydrophobic conversion.
- a major problem associated with the prior art materials based on metal oxides is that these materials require exposure with high power laser light and/or the use of expensive exposure devices.
- Other plates based on metal oxides have to undergo a photo-reduction reaction prior to their use to induce a hydrophobic/hydrophilic conversion.
- This photo-reduction reaction can be initiated by for example a pre-heat treatment step and/or a flood UV-exposure step which have to be performed by the end-user.
- pre-treatment steps make plate making a cumbersome process.
- a printing plate precursor having a support with a surface comprising titanium is converted from a hydrophobic state into a hydrophilic state by first anodizing and than annealing said surface under reduced pressure.
- a switch from a hydrophilic state into a hydrophobic state is obtained.
- the support of the printing plate precursor having a surface comprising titanium is preferably a titanium metal sheet.
- the support is a base onto which a thin layer of titanium metal is applied.
- the titanium metal sheet may be a commercially available titanium metal sheet having preferably a 99.5 %wt to 99.9 %wt purity. Also suitable is an alloy of titanium containing about 4 %wt to 5 %wt of for example aluminium, vanadium, manganese, iron, chromium and molybdenum.
- the thickness of the titanium metal sheet is not critical: it may be between 0.05 mm to 0.6 mm, preferably from 0.05 mm to 0.4 mm, more preferably from 0.1 mm to 0.3 mm.
- the base onto which a thin layer of titanium is applied may be a metal sheet including for example aluminum, stainless steel, nickel, and copper.
- a flexible plastic support such as polyester or cellulose ester, waterproof paper, polyethylene-laminated paper, or polyethylene-impregnated paper.
- the support can also be a laminate comprising an aluminum foil and a plastic layer, e.g. polyester film.
- the surface of the metal base may have been roughened by any of the known methods.
- the surface roughening may be conducted by mechanical means, electrochemical means and chemical etching means, or by combinations of these methods.
- a particularly preferred lithographic support is an electrochemically grained and anodized aluminum support.
- the grained and anodized aluminum support is preferably grained by electrochemical graining, and anodized by means of anodizing techniques employing phosphoric acid or a sulphuric acid/phosphoric acid mixture. Methods of both graining and anodization of aluminum are very well known in the art.
- the aluminium support By anodizing the aluminium support, its abrasion resistance and hydrophilic nature are improved.
- the microstructure as well as the thickness of the Al 2 O 3 layer are determined by the anodizing step, the anodic weight (g/m 2 A1203 formed on the aluminium surface) varies between 1 and 8 g/m 2 .
- the thin layer of titanium present on the base may be applied by known methods such as for example vapor deposition, spray pyrolysis, sputtering, or electrodeposition.
- the thickness of the deposited titanium metal layer is preferably from 0.01 ⁇ m to 10 ⁇ m, more preferably from 0.05 ⁇ m to 1.0 ⁇ m, most preferably the thickness varies between 0.10 ⁇ m and 0.30 ⁇ m.
- the titanium sheet or the base provided with a titanium layer may be subjected to a surface roughening step treatment prior to the anodization step.
- a degreasing step may be conducted with for example a surfactant, an organic solvent or an aqueous alkali solution.
- the surface roughening treatment of the titanium sheet or the base provided with a titanium layer can be conducted by various methods; examples thereof include mechanically roughening (e.g. grinding with balls, brushing, blasting, or buffing), electrochemical dissolution (e.g. surface roughening in an electrolytic solution with application of an AC or DC current) or chemical dissolution (e.g. immersing the metal in an aqueous solution of one or more alkaline salts selected from sodium hydroxide, sodium carbonate, sodium silicate or sodium pyrophosphate). These methods may be used alone or in combination.
- mechanically roughening e.g. grinding with balls, brushing, blasting, or buffing
- electrochemical dissolution e.g. surface roughening in an electrolytic solution with application of an AC or DC current
- chemical dissolution e.g. immersing the metal in an aqueous solution of one or more alkaline salts selected from sodium hydroxide, sodium carbonate, sodium silicate or sodium pyrophosphate.
- the anodization of titanium is performed by treatment of the surface comprising titanium with an aqueous electrolyte solution at a concentration of 0.001 mol/l to 5 mol/l, preferably from 0.005 mol/l to 3 mol/l, a liquid temperature of 5°C to 70°C, preferably from 15°C to 30°C, a DC voltage of 1 V to 100 V, preferably 5 V to 50 V, more preferably 10 V to 30 V, and an electrolysis period of 10 seconds to 10 minutes, preferably 1 minute to 8 minutes.
- an aqueous electrolyte solution at a concentration of 0.001 mol/l to 5 mol/l, preferably from 0.005 mol/l to 3 mol/l, a liquid temperature of 5°C to 70°C, preferably from 15°C to 30°C, a DC voltage of 1 V to 100 V, preferably 5 V to 50 V, more preferably 10 V to 30 V, and an electrolysis period of 10 seconds to 10 minutes, preferably 1 minute to 8
- the surface of the support is anodized in an aqueous electrolyte solution containing at least one of the following chemicals:
- aqueous electrolyte solutions may be used alone or in combination.
- concentration of the solutions depends on the kind of the electrolyte used for the anodization process.
- the electrolyte solution comprises oxalic acid at a concentration of 0.6 mol/l, and the anodizing reaction is carried out at room temperature using 20 V DC for a period of 5 minutes.
- Doping the anodized surface with a metal such as platinum, palladium, gold, silver, copper, nickel, iron, or cobalt or a mixture thereof may be advantageous.
- the anodized support is annealed at a reduced atmospheric pressure.
- Other gasses such as H 2 or N 2 gas may be used during the annealing step.
- the annealing temperature varies between 350°C and 550°C, more preferably between 400 °C and 500°C, and the annealing time varies between 60 minutes and 240 minutes, more preferably between 80 and 200 minutes.
- the pressure applied during the annealing step varies between 0.1 kPa (1 mBar) and 1 kPa (10 mBar), more preferably between 0.2 kPa (2 mBar) and 0.6 kPa (6 mBar).
- the lithographic printing plate precursor comprising an anodized and annealed support thus obtained may be rinsed with water, with a liquid containing a surfactant or with a desensitizing liquid (so called gum solution) containing gum arabic or a starch derivative, or with combinations thereof.
- a liquid containing a surfactant or with a desensitizing liquid (so called gum solution) containing gum arabic or a starch derivative, or with combinations thereof.
- the surface of the printing plate precursor is hydrophilic and upon image-wise exposure to heat and/or light, the exposed areas become ink accepting.
- This conversion from a hydrophilic to a hydrophobic state can for example be characterized by an increase of the contact angle for water measured on the surface: the contact angle for water increases after the treatment of the support indicating a hydrophilic/hydrophobic conversion.
- the contact angle is defined as the angle between the tangent of the edge of the water droplet at the contact zone between the support and the droplet.
- a layer which comprises a compound capable of absorbing light and converting the absorbed energy into heat may optionally be coated onto the anodized and annealed support or onto the etched and anodized support.
- the compound capable of absorbing light and converting it into heat is preferably an infrared absorbing agent.
- Preferred IR absorbing compounds are dyes such as cyanine, merocyanine, indoaniline, oxonol, pyrilium and squarilium dyes or pigments such as carbon black. Examples of suitable IR absorbers are described in e.g.
- a preferred compound is the following cyanine dye IR-A: wherein X - is a suitable counter ion such as tosylate.
- the coating may in addition to the layer comprising the infrared absorbing agent also contain one or more additional layer(s) such as i.e. a protective layer or an adhesion-improving layer between the layer comprising the infrared absorbing agent and the support.
- additional layer(s) such as i.e. a protective layer or an adhesion-improving layer between the layer comprising the infrared absorbing agent and the support.
- the layer comprising a compound capable of absorbing light or an optional other layer may further contain additional ingredients.
- additional ingredients for example binders, surfactants such as perfluoro surfactants, silicon or titanium dioxide particles or colorants may be present.
- the heat-sensitive printing plate precursor thus obtained is then image-wise exposed directly with heat or indirectly with infrared light, preferably near infrared light.
- infrared light is preferably converted into heat by an IR light absorbing compound as discussed above.
- the printing plate precursor is not sensitive to ambient light so that it can be handled without the need for a safe light environment.
- the printing plate precursor can be exposed to infrared light by means of e.g. LEDs or an infrared laser.
- the light used for the exposure is a laser emitting near infrared light having a wavelength in the range from about 700 nm to about 1500 nm, e.g. a semiconductor laser diode, a Nd:YAG or a Nd:YLF laser.
- the exposure step may optionally be followed by a rinsing step and/or a gumming step.
- the gumming step involves post-treatment of the heat-sensitive printing plate with a gum solution.
- a gum solution is typically an aqueous liquid which comprises one or more surface protective compounds that are capable of protecting the lithographic image of a heat-sensitive material or printing plate against contamination or damaging. Suitable examples of such compounds are film-forming hydrophilic polymers or surfactants.
- the heat-sensitive printing plate is then ready for printing without an additional development step.
- the exposed plate can be mounted on a conventional, so-called wet offset printing press in which ink and an aqueous dampening liquid are supplied to the material.
- the non-image areas hold the dampening water and the image areas withhold the ink.
- the single-fluid ink comprises an ink phase, also called the hydrophobic or oleophilic phase, and a polyol phase as described in WO 00/32705 .
- the printing plate is first mounted on the printing cylinder of the printing press and then image-wise exposed directly on the press by means of an integrated image-recording device. Subsequent to exposure, the plate is ready for printing.
- the printing plate can be regenerated after printing. After printing, the printing plate is subjected to a flood exposure with UV light whereby hydrophobic areas are converted to a hydrophilic state and recover sensitivity to infrared light and/or heat irradiation.
- a cleaning step may be performed before the flood exposure step.
- Suitable solvents that can be used for cleaning include hydrophobic petroleum solvents such as aromatic hydrocarbons commercially available as printing ink solvents: kerosine, benzol, toluol, xylol, acetone, methyl ethyl ketone, and mixtures thereof.
- the regenerated printing plate precursor thus obtained can be used for a next printing operation involving image-wise exposure and printing.
- a titanium foil (Goodfellow TI000380 99,6%, 125 ⁇ m foil) was cleaned by ultrasound treatment in isopropanol and was subsequently rinsed with water.
- the precursors subsequently underwent two different annealing treatments in air at a reduced pressure:
- the thus obtained printing plate precursors 1, 2 and 3 were subsequently irradiated with a single beam IR-laser diode at 830 nm with a pitch of 7 ⁇ m at 280 mW at 4 m/s (corresponding to an energy density of 1000 mJ/cm 2 ) and with a single beam IR-laser diode at 830 nm with a pitch of 7 ⁇ m at 280 mW at 8 m/s (corresponding to an energy density of 500 mJ/cm 2 ).
- printing plate 3 Upon laser irradiation of printing plate precursor 3 (non annealed sample and annealed sample), printing plate 3 is obtained of which the contact angle remains the same for the non-annealed plate and increases for the annealed plates indicating a hydrophilic/hydrophobic switch (Table 3).
- Table 3 Contact angles after laser irradiation. Printing plate Annealing step Contact angle after IR-laser irradiation mJ/cm2 0 500 Printing plate 3 Comparative No annealing 42° 45° Invention 90 min, 430°C, 2.10-5 mBar 28° 38° Invention 180 min, 430°C, 2.10-5 mBar 27° 76°
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Claims (5)
- Un procédé pour la fabrication d'un précurseur de plaque d'impression lithographique thermosensible à effet négatif, ledit procédé comprenant les étapes ci-après :(i) la mise à disposition d'un support ayant une surface contenant du titane,(ii) la modification de la surface en produisant un oxyde de titane hydrophile, ce processus consistant à :1) anodiser la surface et2) à tremper la surface anodisée sous pression réduite, l'oxyde de titane hydrophile pouvant être rendu hydrophobe par chauffage et/ou par exposition à des rayons infrarouges.
- Procédé selon la revendication 1, caractérisé en ce que l'étape d'anodisation comprend le traitement de la surface à température ambiante dans une solution électrolytique aqueuse, la durée de l'électrolyse étant comprise entre 1 minute et 8 minutes, le rapport de l'électrolyte étant compris entre 0,005 mole/l et 3 moles/l et la tension continue appliquée étant comprise entre 10 V et 30 V.
- Procédé selon la revendication 1 ou 2, caractérisé en ce que l'étape de trempage dure de 60 à 240 minutes à une température comprise entre 350°C et 550°C et sous une pression comprise entre 1 mbar et 10 mbars (entre 0,1 kPa et 1 kPa).
- Un procédé pour la fabrication d'une plaque d'impression lithographique, ledit procédé comprenant les étapes ci-après :(i) la mise à disposition d'un précurseur de plaque d'impression lithographique obtenu selon le procédé défini dans l'une quelconque des revendications précédentes,(ii) le chauffage et/ou l'exposition à des rayons infrarouges sous forme d'image du précurseur, rendant hydrophobe la surface hydrophile dans des zones exposées du précurseur et assurant la formation d'une image lithographique sur la surface.
- Un procédé d'impression lithographique comprenant les étapes ci-après :(i) la mise à disposition d'une plaque d'impression lithographique selon le procédé défini dans la revendication 4,(ii) la production d'une multitude de copies par encrage de la plaque d'impression et par transfert subséquent de l'encre sur du papier,(iii) le nettoyage éventuel de la plaque d'impression en enlevant l'encre d'impression de la plaque,(iv) l'effacement de l'image lithographique par exposition de la plaque d'impression au rayonnement d'un projecteur ultraviolet, hydrophilisant ainsi des zones hydrophobes de la surface, et(iv) la réutilisation du précurseur ainsi obtenu dans un cycle suivant comprenant les étapes (i) à (iv).
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07118445A EP1887424A1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
EP20050101966 EP1703321B1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
DE200560004259 DE602005004259T2 (de) | 2005-03-14 | 2005-03-14 | Verfahren zur Herstellung einer verarbeitungsfreien Flachdruckplatte |
US11/372,175 US20060201360A1 (en) | 2005-03-14 | 2006-03-08 | Method for making a processless lithographic printing plate |
Applications Claiming Priority (1)
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EP20050101966 EP1703321B1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
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EP07118445A Division EP1887424A1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
Publications (2)
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EP1703321A1 EP1703321A1 (fr) | 2006-09-20 |
EP1703321B1 true EP1703321B1 (fr) | 2008-01-09 |
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EP20050101966 Not-in-force EP1703321B1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
EP07118445A Withdrawn EP1887424A1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
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EP07118445A Withdrawn EP1887424A1 (fr) | 2005-03-14 | 2005-03-14 | Procédé de fabrication d'une plaque d'impression lithographique sans traitement |
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DE (1) | DE602005004259T2 (fr) |
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WO2010029341A2 (fr) | 2008-09-12 | 2010-03-18 | J P Imaging Limited | Améliorations de l’impression ou améliorations relatives à l’impression |
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FI104667B (fi) | 1997-07-14 | 2000-04-14 | Nokia Networks Oy | Liittymäpalvelun toteuttaminen |
EP0903223B1 (fr) | 1997-09-12 | 2002-06-05 | Fuji Photo Film Co., Ltd. | Procédé pour l'impression lithographique et précurseur de plaque pour l'impression lithographique |
JP3739962B2 (ja) | 1998-05-18 | 2006-01-25 | 富士写真フイルム株式会社 | 平版印刷版用原版、これを用いた平版印刷版の製版方法および平版印刷版用原版の製造方法 |
JP2000155422A (ja) | 1998-11-20 | 2000-06-06 | Fuji Photo Film Co Ltd | 平版印刷用原板及び平版印刷方法 |
DE60027059T2 (de) * | 1999-01-18 | 2007-03-15 | Fuji Photo Film Co., Ltd., Minami-Ashigara | Flachdruck-Verfahren und -Vorrichtung |
JP3743604B2 (ja) | 1999-03-24 | 2006-02-08 | 富士写真フイルム株式会社 | 平版印刷用原板 |
JP2000296682A (ja) * | 1999-04-15 | 2000-10-24 | Fuji Photo Film Co Ltd | 平版印刷版の製造方法 |
JP2002254592A (ja) * | 2001-03-01 | 2002-09-11 | Fuji Photo Film Co Ltd | 平版印刷方法および平版印刷装置 |
JP2005138378A (ja) * | 2003-11-05 | 2005-06-02 | Mitsubishi Heavy Ind Ltd | 印刷用版材及びその製造方法,印刷用刷版の作製方法及び再生方法,並びに印刷機 |
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- 2005-03-14 DE DE200560004259 patent/DE602005004259T2/de active Active
- 2005-03-14 EP EP20050101966 patent/EP1703321B1/fr not_active Not-in-force
- 2005-03-14 EP EP07118445A patent/EP1887424A1/fr not_active Withdrawn
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DE602005004259T2 (de) | 2009-01-15 |
EP1887424A1 (fr) | 2008-02-13 |
EP1703321A1 (fr) | 2006-09-20 |
DE602005004259D1 (de) | 2008-02-21 |
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