EP1702165B1 - Assembly used for cooling a circuit board or similar - Google Patents

Assembly used for cooling a circuit board or similar Download PDF

Info

Publication number
EP1702165B1
EP1702165B1 EP05791377.4A EP05791377A EP1702165B1 EP 1702165 B1 EP1702165 B1 EP 1702165B1 EP 05791377 A EP05791377 A EP 05791377A EP 1702165 B1 EP1702165 B1 EP 1702165B1
Authority
EP
European Patent Office
Prior art keywords
air
carrier frame
fan
circuit board
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP05791377.4A
Other languages
German (de)
French (fr)
Other versions
EP1702165A1 (en
Inventor
Wolfgang Arno Winkler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebm Papst St Georgen GmbH and Co KG
Original Assignee
Ebm Papst St Georgen GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebm Papst St Georgen GmbH and Co KG filed Critical Ebm Papst St Georgen GmbH and Co KG
Priority to EP11009570.0A priority Critical patent/EP2436933B1/en
Publication of EP1702165A1 publication Critical patent/EP1702165A1/en
Application granted granted Critical
Publication of EP1702165B1 publication Critical patent/EP1702165B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/002—Axial flow fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0693—Details or arrangements of the wiring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/52—Casings; Connections of working fluid for axial pumps
    • F04D29/54—Fluid-guiding means, e.g. diffusers
    • F04D29/541—Specially adapted for elastic fluid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/60—Mounting; Assembling; Disassembling
    • F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps

Definitions

  • the invention relates to an arrangement for cooling a printed circuit board or the like.
  • the WO 99/07196 A describes a heat sink with a conductive plate mounted on a surface of an integrated circuit package.
  • the thickness of the plate gradually increases from its edge zone to its central portion, following a curved profile which has a concave away from the integrated circuit.
  • the US 6,130,820 describes a support frame with which a small fan is attached at a predetermined distance above an integrated circuit.
  • the support frame is formed in a spider shape with a receiving block and carrier elements arranged thereon for attachment to a main circuit board carrying the circuit.
  • the receiving block has a recess in which a device fan is arranged.
  • this object is achieved by an arrangement for cooling a printed circuit board according to claim 1.
  • a support frame is provided, to which a small or micro fan is attached, and on this support frame, an air guide is provided, which serves to the flow direction to divert at least a portion of the air transported through the air passage opening during operation.
  • an air flow is generated, which is particularly suitable for the cooling of a printed circuit board, and it is possible even below such an arrangement to arrange components on the circuit board and to cool by the arrangement.
  • High heat generation devices may e.g. be placed directly at the fan in the strongest airflow. This may either be directed towards the printed circuit board, or away from it, to suck warm air from the circuit board.
  • Such a support frame can itself form part of the fan, keeping it at a distance from a circuit board to be cooled, and also directs the air flow generated by the fan in the desired direction.
  • Fig. 1 shows a schematic longitudinal section through an inventive arrangement 1.
  • This has as main components a fan 3 with a fan 31, the fan blades are shown at 32, and with an electric motor 33 for driving the fan wheel 31.
  • the arrangement 1 has a support frame 4, which carries the fan 3 and is attached to this.
  • supporting frame 4 supporting elements 41 a and latching elements 41 b are formed.
  • the latching elements 41 b By means of the latching elements 41 b, the support frame 4 can be fastened on a printed circuit board 2 by clipping.
  • Fig. 8 shows an alternative, preferred method of attachment to the printed circuit board 2.
  • the fan 3 is arranged with its fan 31 so that it sucks on its side facing away from the circuit board 2 side C an air flow with a direction substantially perpendicular to the circuit board 2 direction (the direction of rotation axis A of the fan 3). At least part of this air flow is through an air guide 5, which is about the shape a bell has, deflected so that this air flow is approximately parallel to the circuit board 2 and thereby optimally cool the components 21.
  • the locking elements 41 b have at their ends in each case a latching hook 43 for engaging behind a recess 22 of the printed circuit board 2.
  • the support elements 41 a have a positioning extension 44 for fixing the position an associated, complementary recess 23 of the printed circuit board 2.
  • the electrical connection of the electric motor 33 can be done by soldering in the solder bath together with the soldering of the components 21.
  • the electric motor 33 is electrically connected by means of a circuit board 6 with wire connections 61. This makes it possible to use normal fans with standardized electrical connections.
  • the board 6 rests in this case on a flange 3 supporting the fan or supporting member 45 of the support frame 4.
  • the ends 62 of the wire connections 61 are soldered in the assembled state with conductor tracks on the circuit board 2.
  • the support member 45 has an inner upstanding edge 48 and an outer upstanding edge 49, which serve to receive the board 6.
  • the latter has, as in Fig. 7 shown, a radially extending connector 64, and this is interrupted by an interruption 49a (FIG. Fig. 5 ) of the outer edge 49 guided radially outward and with the vertically extending connecting leads 61 connected.
  • the recess 48a in the inner edge 48 stretches for attachment of the motor 33 on the support member 45th
  • Fig. 8 shows, you can use, for example, three connection lines 61.
  • the electronic components for the motor 33 such as a Hall sensor and a Kommut istsbaustein located in the board 6, and therefore this has a predetermined position relative to the motor 33.
  • an electronically commutated micro fan has very small dimensions.
  • an ebm-papst 250 series electronically commutated DC axial fan has dimensions of 25 x 25 x 8mm, a weight of 8g, and a power rating of 0.2 to 0.6W Fig. 1 and 2 may have, for example, an outer diameter of 55 mm and a height of 36 mm.
  • the lines 61 are partially surrounded for their protection by a sheath 51, which is formed on the support frame 4.
  • the arrangement 1 is formed on its side facing away from the circuit board 2 side C to rest against a housing wall or the like. So that no rattling noises arise here, and to separate cold and warm air from each other, a sealing ring 7 is provided, which is arranged in an annular groove 71 of a front portion 42 of the support frame 4.
  • Fig. 5 shows a view obliquely from above on a not yet mounted support frame 4, wherein the fan 3, the board 6, the wire connection 61 and the sealing ring 7 are not shown.
  • the support member 45 is integrally formed on the support frame 4 via webs 45a.
  • the made of plastic together with the support frame 4 support members 41 a and the locking members 41 b, which are provided at their ends with latching projections 43 are resilient, so that they can engage behind edges or openings in or on the circuit board 2.
  • the fan 31 is located in Fig. 1 Above an annular air passage opening 47, whose outer periphery 47a, often referred to as "Venturi", is formed by an annular member 40 of the support frame 4.
  • the outer periphery 47a widens downward.
  • the Heilstromleitglied 5 is disposed below the air passage opening 47 so that it deflects the generated air flow in a direction approximately parallel to the printed circuit board 2.
  • the Heilstromleitglied 5 is preferably formed integrally with the support frame 4 and formed below the support member 45.
  • the air guide member 5 preferably has approximately the shape of a bell, which widens downwards in the radial direction R. It can therefore also be referred to as Heilleitglocke 5.
  • the sheath 51 for the wire connections 61 is preferably formed as a protuberance from the Lucasstromleitglied 5.
  • Fig. 2 shows this in a view obliquely from below on the arrangement 1, in a partial sectional view with a view of the wire connections 61 and the enclosure 51.
  • - Fig. 4 shows an enlarged view of the area II of Fig. 2 ,
  • Fig. 3 shows a partially sectioned side view of the arrangement 1.
  • the arrangement 1 is mounted on a printed circuit board 2 by means of snap-in connections.
  • the support frame 4 with the molded thereon shipsstromleitglied 5 is in Fig. 5 shown in a view obliquely from above, wherein the fan 3, the board 6, the wire connections 61 and the sealing ring 7 are not shown.
  • Fig. 6 shows a view of the support frame 4 from below, so from the circuit board side. In the middle you can see three holes 52, which serve to attach the motor 33.
  • the arrangement 1 is preferably operated such that cold air is drawn in from the outside and supplied to the components to be cooled.
  • the fan 3 can also be operated in the opposite direction, so that it sucks heated air from the circuit board 2 and blows outward.
  • Fig. 7 shows an exploded view of an inventive arrangement 1. Below the circuit board 2 is shown, which has recesses 23 for the ends 44 of the support members 41 a and recesses 22 for the latching hooks 43. The components on the circuit board are in Fig. 7 not shown.
  • the support frame 4 is shown, as well as this associated sealing ring 7 and the board 6.
  • the latter is electrically connected via its arm 64 with approximately vertically extending connecting leads 61.
  • the fan 3 with its fan blades 32. It is attached to the support member (flange) 45 of the support frame 4, preferably by a mechanical connection with the central projection 48 of the support member 45, which projection in the mounted state, a central recess 63 of the board 6 penetrates and thereby centered.
  • Fig. 8 shows a preferred alternative to Fig. 3 ,
  • a latching foot 80 is provided with a cylindrical inner recess 81 running in the longitudinal direction of this latching foot and with a round double spring 82.
  • This has two resilient legs 64, 66 and tapers at the lower end to a cone 68, which facilitates insertion into a round hole 70 of the circuit board 2.
  • the legs 64, 66 are formed by a longitudinal section 72 in the lower end of the latching foot 80. This has on its outer side an annular groove 74 which fits into the recess 70 and can be locked by pressing it into this form-fitting manner with her.
  • Fig. 8 shows this locked position.
  • such a spring-locking foot 80 allows mounting by snapping in a well-defined position, so that the support members 41 a can be omitted.
  • the Fig. 9 to 23 show different variants of the air guide 5 of the Fig. 1 to 8 , If, in fact, electronic components 21 are located under this air guiding element, it may be necessary to cool these components as well by a part of the cooling air flow.
  • the Fig. 9 to 23 each show an air guide member 5, whose location on the support frame 4 from the Fig. 1 to 8 resulting from - preferably three - webs 45a ( Fig. 5 ) is connected to the ring 40 of the support frame 4. These webs 45a are in for simplicity Fig. 9 to 23 not shown.
  • the air guide members 5 are, as in Fig. 1 to 8 , arranged on the support member (flange) 45 and are preferably integral therewith. At the top of the support member 45 are the inner upstanding edge 48 and the outer upstanding edge 49.
  • the outer edge 49 usually has an interruption 49a as seen in FIG Fig. 5 is shown. In Fig. 9 to 23 this interruption is not shown, but can be provided there in the same way.
  • the outside of the air guide member 5 generally has an upper portion 53 which is substantially parallel to the axis of rotation A of the fan 3.
  • the section 53 merges via a middle section 54 into a lower section 55, which runs rather perpendicular to the axis of rotation A.
  • the air guide member 5 has a series of equidistant holes 60 with a circular cross section, which lie approximately at the transition from the region 53 to the region 54. To these offset at the area 55 an equal number of holes 62 is provided, also with a circular cross-section.
  • Fig. 10 agrees largely with Fig. 9 match, but there are only the holes 60 are provided and not the holes 62nd
  • Fig. 12 are provided in the transition region 54 twelve elongated recesses 64, which, as shown, extend in the circumferential direction. Likewise, in the region 55 twelve elongated recesses 66 are provided which also extend in the circumferential direction and are offset relative to the recesses 64 in the manner shown.
  • Fig. 15 are provided in the transition region 54 twelve elongated recesses 68 which extend in the direction from top to bottom, and between these are in the region 55 twelve elongated recesses 70, which also extend from top to bottom.
  • Fig. 18 shows an air guide member 5, in which twelve recesses 72 are incorporated with rectangular cross-section in the transition region 54. Similarly, in the area 55 twelve recesses 74 are incorporated with rectangular cross-section, and these are offset from the recesses 72.
  • Fig. 21 are provided in the transition region 54 of the air guide member 5 twelve recesses 76 of rectangular cross-section, and in the area 55 twelve recesses 78, also with a rectangular cross-section.
  • Fig. 22 only the recesses 76 are provided, and at Figure 23 only the recesses 78.
  • the mode of action is practically the same as in the variants according to the FIGS. 15, 16 and 17 , ie from the variant Fig. 21 to the variant Fig. 23 takes the cooling effect for components 21 below the air guide 5 from.
  • Fig . 24 shows another example of a non-inventive arrangement 101.
  • the assembly 101 is mounted in use on a printed circuit board 2, which in Fig. 24 is indicated, and it preferably serves to a - in Fig. 24 not shown - heat-sensitive component to cool directly under the arrangement 101 is mounted on the circuit board 2.
  • Fig. 1 shows such components 21st
  • the assembly 101 has a support frame 104, which, as in the previous embodiments, is formed approximately in the manner of a drilling rig. It has four support legs, namely two guide legs 105, 106 and two locking legs 107, 108. The latter are designed as the spring-locking foot 80 of Fig. 8 , Reference is therefore made to the description there to avoid lengths.
  • All support legs 105 to 108 have a support surface 105 a, 106 a, 107 a, 108 a, with which they are supported after assembly on the upper side of the printed circuit board 2.
  • the guide leg 105 has a guide pin 110 with the length d1
  • the guide leg 106 has a guide pin 111 with the same length d1, but a smaller diameter.
  • the latching sections 107b, 108b have a length d2 which is smaller than d1.
  • a bore 112 serves to receive the guide pin 110, and a bore 113 serves to receive the latching leg 107 in the manner in which Fig. 8 has been described in detail for the locking leg 80.
  • a bore (not shown) is provided whose dimensions correspond to those of the bore 113, and for the guide leg 106 is provided a bore (not shown) whose diameter is smaller than the diameter of the bore 112.
  • a connector 114 is mounted, which is used for electrical connection of the circuit board 2 with three metal pins 41, via which the motor 33 of the fan 3 and its connection board 6 electrically with corresponding conductor tracks the circuit board 2 is connected.
  • the four support legs 105 to 108 are formed as shown hollow and go in its upper part in a substantially annular or tubular member 115, which merges above into a flat edge 117 which is perpendicular to the axis of rotation A and on its radially inner Side is bounded by an upstanding edge 119.
  • a sealing ring 120 can be arranged on the edge 117 and serves to seal against a housing wall or the like.
  • On its inner side 121 of the edge 119 is frusto-conical.
  • the truncated cone 121 merges into a cylindrical section 123, within which the blades 32 of the fan 3 rotate during operation.
  • a support member 127 is fixed by webs 125, and between this and the cylindrical portion 123 is an annular air passage opening 130, from which in operation a cooling air flow exits downwardly, in Fig. 25 symbolically indicated at 132. (If necessary, the cooling air flow can also run in the opposite direction.)
  • Fig. 25 shows, in the annular portion 115, the flat edge 117 and the edge 119, a groove-like recess 134 whose width b to the width of the arm 64 (FIG. Fig. 7 ) of the board 6 is adjusted.
  • This arm 64 widens at its free end to a hammer-like widening 64 b, which in Fig. 25 is shown in section and whose width B is greater than the width b of the groove 134.
  • This widening 64b is guided in a complementary recess 136 of a box-like extension 138 of the support frame 104 and is there after mounting by two detent springs 140, 142 in kept the way, like that Fig.
  • the motor 33 is permanently connected after its assembly with the part 127, which has approximately the shape of a saucer to absorb grease that could leak during operation from the bearings of the motor 33, and to avoid contamination of the printed circuit board 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Description

Die Erfindung betrifft eine Anordnung zur Kühlung einer Leiterplatte oder dergleichen.The invention relates to an arrangement for cooling a printed circuit board or the like.

Es ist bekannt, mittels Klein- und Kleinstlüftern Bereiche einer Leiterplatte direkt zu kühlen, an denen viel Wärme erzeugt wird. Solche Bereiche werden gewöhnlich als "hot spots" bezeichnet.It is known to cool by means of small and micro fans areas of a circuit board directly, where much heat is generated. Such areas are commonly referred to as "hot spots".

Nachteilig hierbei ist, dass die Fläche, auf der ein solcher Lüfter montiert wird, nicht mehr für Bauelemente zur Verfügung steht, wie das die DE 195 03 521 A1 zeigt (DE-7006i = D189). Nachteilig ist auch, dass der von üblichen Kleinlüftern erzeugte Kühlluftstrom wegen seiner Form wenig für eine oberflächennahe Direktkühlung auf Leiterplatten geeignet ist.The disadvantage here is that the surface on which such a fan is mounted, is no longer available for components, such as the DE 195 03 521 A1 shows (DE-7006i = D189). Another disadvantage is that the cooling air flow generated by conventional small fans is not very suitable for near-surface direct cooling on printed circuit boards because of its shape.

Die WO 99/07196 A beschreibt einen Kühlkörper mit einer leitfähigen Platte, die auf einer Oberfläche eines Gehäuses mit einem integrierten Schaltkreis befestigt wird. Die Dicke der Platte vergrößert sich graduell von deren Randzone bis zu deren mittlerem Abschnitt hin und folgt hierbei einem gekrümmten Profil, das eine von dem integrierten Schaltkreis weg gerichtete Konkavität besitzt. Durch diese Anordnung wird ein im Wesentlichen in senkrechter Richtung auf die Platte auftreffender Luftstrom zu deren Rändern hin in eine im Wesentlichen horizontale Auslassrichtung abgelenkt.The WO 99/07196 A describes a heat sink with a conductive plate mounted on a surface of an integrated circuit package. The thickness of the plate gradually increases from its edge zone to its central portion, following a curved profile which has a concave away from the integrated circuit. By virtue of this arrangement, an air stream impinging on the plate essentially in the vertical direction is deflected towards its edges in a substantially horizontal outlet direction.

Die US 6,130,820 beschreibt ein Tragegestell, mit dem ein Kleinlüfter in einem vorgegebenen Abstand über einem integrierten Schaltkreis befestigt wird. Das Tragegestell ist spinnenförmig mit einem Aufnahmeblock und daran angeordneten Trägerelementen zur Befestigung an einer den Schaltkreis tragenden Hauptplatine ausgebildet. Der Aufnahmeblock hat eine Ausnehmung, in der ein Gerätelüfter angeordnet wird.The US 6,130,820 describes a support frame with which a small fan is attached at a predetermined distance above an integrated circuit. The support frame is formed in a spider shape with a receiving block and carrier elements arranged thereon for attachment to a main circuit board carrying the circuit. The receiving block has a recess in which a device fan is arranged.

Es ist deshalb eine Aufgabe der Erfindung, eine neue Anordnung für die Kühlung einer Leiterplatte oder dgl. bereit zu stellen.It is therefore an object of the invention to provide a novel arrangement for cooling a printed circuit board or the like.

Nach der Erfindung wird diese Aufgabe gelöst durch eine Anordnung für die Kühlung einer Leiterplatte gemäß Anspruch 1. Hierbei ist ein Tragegestell vorgesehen, an dem ein Klein- oder Kleinstlüfter befestigt ist, und an diesem Tragegestell ist ein Luftleitelement vorgesehen, das dazu dient, die Strömungsrichtung mindestens eines Teils der im Betrieb durch die Luftdurchtrittsöffnung transportierten Luft umzulenken. Auf diese Weise wird ein Luftstrom erzeugt, der für die Kühlung einer Leiterplatte besonders geeignet ist, und es ist möglich, auch unterhalb einer solchen Anordnung Bauelemente auf der Leiterplatte anzuordnen und durch die Anordnung zu kühlen. Bauelemente mit hoher Wärmeerzeugung können z.B. direkt beim Lüfter im stärksten Luftstrom angeordnet werden. Dieser kann entweder zur Leiterplatte hin gerichtet sein, oder von dieser weg, um warme Luft von der Leiterplatte abzusaugen.According to the invention, this object is achieved by an arrangement for cooling a printed circuit board according to claim 1. Here, a support frame is provided, to which a small or micro fan is attached, and on this support frame, an air guide is provided, which serves to the flow direction to divert at least a portion of the air transported through the air passage opening during operation. In this way, an air flow is generated, which is particularly suitable for the cooling of a printed circuit board, and it is possible even below such an arrangement to arrange components on the circuit board and to cool by the arrangement. High heat generation devices may e.g. be placed directly at the fan in the strongest airflow. This may either be directed towards the printed circuit board, or away from it, to suck warm air from the circuit board.

Eine andere erfindungsgemäße Lösung der gestellten Aufgabe ist Gegenstand des Anspruchs 16. Ein solches Tragegestell kann selbst einen Teil des Lüfters bilden, hält diesen im Abstand von einer zu kühlenden Leiterplatte, und lenkt auch den vom Lüfter erzeugten Luftstrom in der gewünschten Richtung.Such a support frame can itself form part of the fan, keeping it at a distance from a circuit board to be cooled, and also directs the air flow generated by the fan in the desired direction.

Weitere Einzelheiten und vorteilhafte Weiterbildungen der Erfindung ergeben sich aus den im Folgenden beschriebenen und in der Zeichnung dargestellten, in keiner Weise als Einschränkung der Erfindung zu verstehenden Ausführungsbeispielen, sowie aus den Unteransprüchen. Es zeigt:

Fig. 1
einen schematischen Schnitt durch eine erfindungsgemäße Anordnung mit einem Tragegestell, einem daran befestigten Kleinlüfter, sowie einem Luftleitelement zur Umlenkung des vom Lüfter erzeugten Luftstroms,
Fig. 2
eine Ansicht von schräg unten auf den Lüfter der Fig. 1 , mit einer teilweisen Schnittdarstellung der elektrischen Verbindungselemente des Kleinlüfters,
Fig. 3
eine teilweise geschnittene Seitenansicht der Anordnung nach den Figuren 1 und 2, welche hier nach ihrer Montage auf einer Leiterplatte dargestellt ist,
Fig. 4
eine Darstellung der Einzelheit II der Fig. 2,
Fig. 5
eine raumbildliche Darstellung eines Tragegestells und seines Luftleitglieds 5, aber vor der Montage des Kleinlüfters, und gesehen von schräg oben,
Fig. 6
eine raumbildliche Darstellung analog Fig. 5, aber gesehen von unten, also von der Leiterplattenseite her,
Fig. 7
eine aufeinander gezogene Darstellung einer Leiterplatte, eines Tragegestells, eines Lüfters, und der elektrischen Anschlusselemente dieses Lüfters,
Fig. 8
eine Variante zu Fig. 3, bei der anstelle eines Rasthakens eine runde Doppelfeder verwendet wird, welche eine Ringnut hat, die in eine runde Bohrung 70 der Leiterplatte 2 eingerastet ist,
Fig. 9 bis 23
verschiedene Varianten der bei den Fig. 1 bis 8 verwendeten Luftleitglocke; diese Varianten ermöglichen es, auch elektronische Bauelemente, welche direkt unter dem Tragegestell angeordnet sind, mit einem vorgegebenen Anteil des vom Kleinlüfter erzeugten Kühlluftstroms zu kühlen,
Fig. 24
eine stark vergrößerte, auseinandergezogene Darstellung eines Beispiels, einer nicht erfindungsgemäßen Anordnung mit einem Tragegestell und einem Kleinlüfter, der mit einer Platine für seinen elektrischen Anschluss versehen ist und der, einschließlich Platine, an diesem Tragegestell befestigt wird, und nicht
Fig. 25
eine raumbildliche Darstellung der Anordnung gemäß Fig. 24 in einem Teilschnitt, gesehen längs der Linie XXV-XXV der Fig. 24, wobei die Platine in ihrem montierten Zustand, jedoch ohne den Lüfter, dargestellt ist.
Further details and advantageous developments of the invention will become apparent from the hereinafter described and illustrated in the drawings, in no way as a limitation of the invention to be understood embodiments, and from the dependent claims. It shows:
Fig. 1
a schematic section through an inventive arrangement with a support frame, a small fan attached thereto, and an air guide for deflecting the air flow generated by the fan,
Fig. 2
a view from diagonally down to the fan of the Fig. 1 , with a partial sectional view of the electrical connection elements of the small fan,
Fig. 3
a partially sectioned side view of the arrangement according to the Figures 1 and 2 which is shown here after being mounted on a printed circuit board,
Fig. 4
a representation of the detail II the Fig. 2 .
Fig. 5
a three-dimensional view of a support frame and its Luftleitglieds 5, but before installing the small fan, and seen from diagonally above,
Fig. 6
a spatial representation analogous Fig. 5 but seen from below, so from the PCB side,
Fig. 7
an exploded view of a circuit board, a support frame, a fan, and the electrical connection elements of this fan,
Fig. 8
a variant too Fig. 3 , in which instead of a latching hook a round double spring is used, which has an annular groove which fits into a round bore 70 of the Printed circuit board 2 is engaged,
Fig. 9 to 23
different variants of the Fig. 1 to 8 used Luftleitglocke; these variants make it possible to cool electronic components, which are arranged directly under the support frame, with a predetermined proportion of the cooling air flow generated by the small fan,
Fig. 24
a greatly enlarged, exploded view of an example, a non-inventive arrangement with a support frame and a small fan, which is provided with a board for its electrical connection and which, including board, is attached to this support frame, and not
Fig. 25
a spatial representation of the arrangement according to Fig. 24 in a partial section, seen along the line XXV-XXV the Fig. 24 , wherein the board in its assembled state, but without the fan is shown.

Gleiche Bezugszeichen bezeichnen in den Figuren gleiche oder gleich wirkende Elemente. Begriffe wie oben, unten, links, rechts beziehen sich auf die jeweilige Figur.Like reference numerals designate the same or the same elements in the figures. Terms such as above, below, left, right refer to the respective figure.

Fig. 1 zeigt einen schematischen Längsschnitt durch eine erfindungsgemäße Anordnung 1. Diese hat als Hauptbestandteile einen Lüfter 3 mit einem Lüfterrad 31, dessen Lüfterflügel bei 32 dargestellt sind, und mit einem Elektromotor 33 zum Antrieb des Lüfterrads 31. Ferner hat die Anordnung 1 ein Tragegestell 4, welches den Lüfter 3 trägt und an dem dieser befestigt ist. Am Tragegestell 4 sind Abstützelemente 41 a und Rastelemente 41 b angeformt. Mittels der Rastelemente 41 b kann das Tragegestell 4 auf einer Leiterplatte 2 durch Einclipsen befestigt werden. Auf der Leiterplatte 2 sind zu kühlende Bauelemente 21 schematisch dargestellt. Fig. 8 zeigt eine alternative, bevorzugte Art der Befestigung auf der Leiterplatte 2. Fig. 1 shows a schematic longitudinal section through an inventive arrangement 1. This has as main components a fan 3 with a fan 31, the fan blades are shown at 32, and with an electric motor 33 for driving the fan wheel 31. Further, the arrangement 1 has a support frame 4, which carries the fan 3 and is attached to this. On supporting frame 4 supporting elements 41 a and latching elements 41 b are formed. By means of the latching elements 41 b, the support frame 4 can be fastened on a printed circuit board 2 by clipping. On the circuit board 2 to be cooled components 21 are shown schematically. Fig. 8 shows an alternative, preferred method of attachment to the printed circuit board 2.

Der Lüfter 3 ist mit seinem Lüfterrad 31 so angeordnet, dass er auf seiner von der Leiterplatte 2 abgewandten Seite C einen Luftstrom mit einer im wesentlichen zur Leiterplatte 2 senkrechten Richtung (Richtung der Drehachse A des Lüfters 3) ansaugt. Zumindest ein Teil dieses Luftstroms wird durch ein Luftleitelement 5, das etwa die Gestalt einer Glocke hat, so umgelenkt, dass dieser Luftstrom etwa parallel zur Leiterplatte 2 verläuft und dadurch die Bauelemente 21 optimal kühlt.The fan 3 is arranged with its fan 31 so that it sucks on its side facing away from the circuit board 2 side C an air flow with a direction substantially perpendicular to the circuit board 2 direction (the direction of rotation axis A of the fan 3). At least part of this air flow is through an air guide 5, which is about the shape a bell has, deflected so that this air flow is approximately parallel to the circuit board 2 and thereby optimally cool the components 21.

Die Anordnung 1 hat also eine Mehrfachfunktion:

  • Sie ermöglicht durch die Rastelemente 41 b und die Abstützelemente 41 a bzw. die Rastfüße 80 gemäß Fig. 8 eine sehr schnelle Montage an der Leiterplatte 2.
  • Sie bildet ein Distanzglied, welches den Lüfter 3 in einem gewünschten Abstand von der Leiterplatte 2 hält.
  • Sie bildet eine äußere Umhüllung, nämlich einen sogenannten Venturikanal, für die Flügel 32 des Lüfters 3, d.h. sie komplettiert den Lüfter 3 zu einem Gerätelüfter üblicher Bauart.
  • Sie formt den Luftstrom so, dass die Kühlung der Bauelemente 21 auf.der Leiterplatte 2 optimiert wird.
  • Sie reduziert die Fläche der Leiterplatte 2, weil auch unterhalb der Anordnung 1 Bauelemente 21 auf der Leiterplatte 2 montiert werden können, z.B. Bauelemente mit geringer Wärmeerzeugung, oder Bauelemente, für welche ein Teil des Luftstroms zur Kühlung abgezweigt wird, wie das nachfolgend anhand der Fig. 9 bis 23 erläutert wird.
The arrangement 1 thus has a multiple function:
  • It allows by the locking elements 41 b and the support members 41 a and the locking feet 80 according to Fig. 8 a very fast installation on the circuit board 2.
  • It forms a spacer which holds the fan 3 at a desired distance from the circuit board 2.
  • It forms an outer envelope, namely a so-called Venturi channel, for the wings 32 of the fan 3, ie it completes the fan 3 to a device fan of conventional design.
  • It forms the air flow in such a way that the cooling of the components 21 on the printed circuit board 2 is optimized.
  • It reduces the surface of the circuit board 2, because even below the arrangement 1 components 21 can be mounted on the circuit board 2, for example, components with low heat generation, or components for which a part of the air flow is diverted for cooling, as described below with reference to FIG Fig. 9 to 23 is explained.

Die Enden 44 der Abstützelemente 41 a dienen zur Abstützung der Anordnung 1 auf der Leiterplatte 2. Die Rastelemente 41 b haben an ihren Enden jeweils einen Rasthaken 43 zum Hintergreifen einer Ausnehmung 22 der Leiterplatte 2. Die Abstützelemente 41 a haben einen Positionierfortsatz 44 zur Lagefixierung an einer zugeordneten, komplementären Ausnehmung 23 der Leiterplatte 2. Hierdurch ist eine einfache, reversible Montage der Anordnung 1 auf einer Leiterplatte 2 möglich. Der elektrische Anschluss des Elektromotors 33 kann durch Verlöten im Lötbad zusammen mit dem Verlöten der Bauelemente 21 erfolgen. Hierzu ist der Elektromotor 33 mittels einer Platine 6 elektrisch mit Drahtverbindungen 61 verbunden. Dies ermöglicht es, normale Lüfter mit standardisierten elektrischen Anschlüssen zu verwenden. Die Platine 6 ruht hierbei auf einem auch den Lüfter 3 tragenden Flansch bzw. Abstützglied 45 des Tragegestells 4. Die Enden 62 der Drahtverbindungen 61 sind im montierten Zustand mit Leiterbahnen auf der Leiterplatte 2 verlötet.The locking elements 41 b have at their ends in each case a latching hook 43 for engaging behind a recess 22 of the printed circuit board 2. The support elements 41 a have a positioning extension 44 for fixing the position an associated, complementary recess 23 of the printed circuit board 2. This makes a simple, reversible mounting of the arrangement 1 on a printed circuit board 2 is possible. The electrical connection of the electric motor 33 can be done by soldering in the solder bath together with the soldering of the components 21. For this purpose, the electric motor 33 is electrically connected by means of a circuit board 6 with wire connections 61. This makes it possible to use normal fans with standardized electrical connections. The board 6 rests in this case on a flange 3 supporting the fan or supporting member 45 of the support frame 4. The ends 62 of the wire connections 61 are soldered in the assembled state with conductor tracks on the circuit board 2.

Wie Fig. 5 zeigt, hat das Abstützglied 45 einen inneren hochstehenden Rand 48 und einen äußeren hochstehenden Rand 49, die zur Aufnahme der Platine 6 dienen. Letztere hat, wie in Fig. 7 dargestellt, ein radial verlaufendes Anschlussteil 64, und dieses wird durch eine Unterbrechung 49a (Fig. 5) des äußeren Randes 49 radial nach außen geführt und mit den senkrecht verlaufenden Anschlussleitungen 61 verbunden. Die Ausnehmung 48a im inneren Rand 48 dehnt zur Befestigung des Motors 33 am Abstützglied 45.As Fig. 5 shows, the support member 45 has an inner upstanding edge 48 and an outer upstanding edge 49, which serve to receive the board 6. The latter has, as in Fig. 7 shown, a radially extending connector 64, and this is interrupted by an interruption 49a (FIG. Fig. 5 ) of the outer edge 49 guided radially outward and with the vertically extending connecting leads 61 connected. The recess 48a in the inner edge 48 stretches for attachment of the motor 33 on the support member 45th

Wie Fig. 8 zeigt, kann man z.B. drei Anschlussleitungen 61 verwenden. Die elektronischen Bauelemente für den Motor 33, z.B. ein Hallsensor und ein Kommutierungsbaustein, befinden sich in der Platine 6, und deshalb hat diese relativ zum Motor 33 eine vorgegebene Lage. Die Stromzufuhr zur Platine 6 und zum Motor 33 erfolgt über das radiale Anschlußteil 64.As Fig. 8 shows, you can use, for example, three connection lines 61. The electronic components for the motor 33, such as a Hall sensor and a Kommutierungsbaustein located in the board 6, and therefore this has a predetermined position relative to the motor 33. The power supply to the board 6 and the motor 33 via the radial connector 64th

Hier ist darauf hinzuweisen, dass ein elektronisch kommutierter Kleinstlüfter sehr geringe Abmessungen hat. Z.B. hat ein elektronisch kommutierter DC-Axiallüfter der Serie 250 von ebm-papst Abmessungen von 25 x 25 x 8 mm, ein Gewicht von 8 g, und eine Leistungsaufnahme von 0,2 bis 0,6 W. Die gesamte Anordnung, wie sie in Fig. 1 und 2 dargestellt ist, kann z.B. einen Außendurchmesser von 55 mm und eine Höhe von 36 mm haben.It should be noted that an electronically commutated micro fan has very small dimensions. For example, an ebm-papst 250 series electronically commutated DC axial fan has dimensions of 25 x 25 x 8mm, a weight of 8g, and a power rating of 0.2 to 0.6W Fig. 1 and 2 may have, for example, an outer diameter of 55 mm and a height of 36 mm.

Die Leitungen 61 sind zu ihrem Schutz teilweise von einer Umhüllung 51 umgeben, welche am Tragegestell 4 ausgebildet ist.The lines 61 are partially surrounded for their protection by a sheath 51, which is formed on the support frame 4.

Die Anordnung 1 ist auf ihrer von der Leiterplatte 2 abgewandten Seite C zur Anlage gegen eine Gehäusewand oder dergleichen ausgebildet. Damit hier keine Klappergeräusche entstehen, und um kalte und warme Luft voneinander zu trennen, ist ein Dichtring 7 vorgesehen, der in einer Ringnut 71 eines Stirnabschnitts 42 des Tragegestells 4 angeordnet ist.The arrangement 1 is formed on its side facing away from the circuit board 2 side C to rest against a housing wall or the like. So that no rattling noises arise here, and to separate cold and warm air from each other, a sealing ring 7 is provided, which is arranged in an annular groove 71 of a front portion 42 of the support frame 4.

Fig. 5 zeigt eine Ansicht von schräg oben auf ein noch nicht montiertes Tragegestell 4, bei welchem der Lüfter 3, die Platine 6, die Drahtverbindung 61 und der Dichtring 7 nicht dargestellt sind. Fig. 5 shows a view obliquely from above on a not yet mounted support frame 4, wherein the fan 3, the board 6, the wire connection 61 and the sealing ring 7 are not shown.

Das Abstützglied 45 ist über Stege 45a am Tragegestell 4 angeformt. Die aus Kunststoff zusammen mit dem Tragegestell 4 gefertigten Stützglieder 41 a und die Rastglieder 41 b, welche an ihren Enden mit Rastfortsätzen 43 versehen sind, sind elastisch nachgiebig, so dass sie hinter Kanten oder Öffnungen in oder an der Leiterplatte 2 einrasten können.The support member 45 is integrally formed on the support frame 4 via webs 45a. The made of plastic together with the support frame 4 support members 41 a and the locking members 41 b, which are provided at their ends with latching projections 43 are resilient, so that they can engage behind edges or openings in or on the circuit board 2.

Am Tragegestell 4 ist auch ein Luftstromleitglied 5 zur gezielten Umlenkung des vom Lüfter 3 erzeugten Luftstroms vorgesehen.On the support frame 4 is also a Luftstromleitglied 5 for targeted deflection of the fan Provided 3 generated air flow.

Das Lüfterrad 31 befindet sich in Fig. 1 oberhalb einer ringartigen Luftdurchtrittsöffnung 47, deren Außenumfang 47a, oft auch als "Venturi" bezeichnet, von einem ringförmigen Element 40 des Tragegestells 4 gebildet wird. Der Außenumfang 47a erweitert sich nach unten. Das Luftstromleitglied 5 ist unterhalb der Luftdurchtrittsöffnung 47 so angeordnet, dass es den erzeugten Luftstrom in eine Richtung etwa parallel zur Leiterplatte 2 umlenkt. Das Luftstromleitglied 5 ist bevorzugt einstückig mit dem Tragegestell 4 ausgebildet und unterhalb des Abstützglieds 45 angeformt.The fan 31 is located in Fig. 1 Above an annular air passage opening 47, whose outer periphery 47a, often referred to as "Venturi", is formed by an annular member 40 of the support frame 4. The outer periphery 47a widens downward. The Luftstromleitglied 5 is disposed below the air passage opening 47 so that it deflects the generated air flow in a direction approximately parallel to the printed circuit board 2. The Luftstromleitglied 5 is preferably formed integrally with the support frame 4 and formed below the support member 45.

Zur Formung des Luftstroms in Richtung parallel zur Leiterplatte 2 hat das Luftleitglied 5 bevorzugt etwa die Form einer Glocke, die sich nach unten in radialer Richtung R erweitert. Man kann es deshalb auch als Luftleitglocke 5 bezeichnen.For shaping the air flow in the direction parallel to the printed circuit board 2, the air guide member 5 preferably has approximately the shape of a bell, which widens downwards in the radial direction R. It can therefore also be referred to as Luftleitglocke 5.

Die Umhüllung 51 für die Drahtverbindungen 61 ist bevorzugt als Ausstülpung aus dem Luftstromleitglied 5 ausgebildet. Fig. 2 zeigt dies in einer Ansicht von schräg unten auf die Anordnung 1, und zwar in einer Teilschnittdarstellung mit Blick auf die Drahtverbindungen 61 und die Umhüllung 51. -- Fig. 4 zeigt eine vergrößerte Darstellung des Bereichs II der Fig. 2.The sheath 51 for the wire connections 61 is preferably formed as a protuberance from the Luftstromleitglied 5. Fig. 2 shows this in a view obliquely from below on the arrangement 1, in a partial sectional view with a view of the wire connections 61 and the enclosure 51. - Fig. 4 shows an enlarged view of the area II of Fig. 2 ,

Fig. 3 zeigt eine teilweise geschnittene Seitenansicht der Anordnung 1. In dieser Darstellung ist die Anordnung 1 auf einer Leiterplatte 2 mittels Rastverbindungen montiert. Fig. 3 shows a partially sectioned side view of the arrangement 1. In this illustration, the arrangement 1 is mounted on a printed circuit board 2 by means of snap-in connections.

Das Tragegestell 4 mit dem daran angeformten Luftstromleitglied 5 ist in Fig. 5 in einer Ansicht von schräg oben dargestellt, wobei der Lüfter 3, die Platine 6, die Drahtverbindungen 61 und der Dichtring 7 nicht dargestellt sind.The support frame 4 with the molded thereon Luftstromleitglied 5 is in Fig. 5 shown in a view obliquely from above, wherein the fan 3, the board 6, the wire connections 61 and the sealing ring 7 are not shown.

Fig. 6 zeigt eine Ansicht des Tragegestells 4 von unten, also von der Leiterplattenseite her. In der Mitte erkennt man drei Löcher 52, die zur Befestigung des Motors 33 dienen. Fig. 6 shows a view of the support frame 4 from below, so from the circuit board side. In the middle you can see three holes 52, which serve to attach the motor 33.

Die Anordnung 1 wird bevorzugt derart betrieben, dass kalte Luft von außen angesaugt und den zu kühlenden Bauteilen zugeführt wird. Alternativ kann der Lüfter 3 auch in der entgegengesetzten Richtung betrieben werden, so dass er erwärmte Luft von der Leiterplatte 2 ansaugt und nach außen ausbläst.The arrangement 1 is preferably operated such that cold air is drawn in from the outside and supplied to the components to be cooled. Alternatively, the fan 3 can also be operated in the opposite direction, so that it sucks heated air from the circuit board 2 and blows outward.

Fig. 7 zeigt eine Explosionsdarstellung einer erfindungsgemäßen Anordnung 1. Unten ist die Leiterplatte 2 dargestellt, welche Ausnehmungen 23 für die Enden 44 der Stützglieder 41 a und Ausnehmungen 22 für die Rasthaken 43 hat. Die Bauelemente auf der Leiterplatte sind in Fig. 7 nicht dargestellt. Fig. 7 shows an exploded view of an inventive arrangement 1. Below the circuit board 2 is shown, which has recesses 23 for the ends 44 of the support members 41 a and recesses 22 for the latching hooks 43. The components on the circuit board are in Fig. 7 not shown.

Oberhalb der Leiterplatte 2 ist das Tragegestell 4 dargestellt, ebenso der diesem zugeordnete Dichtring 7 und die Platine 6. Letztere ist über ihren Arm 64 elektrisch mit etwa vertikal verlaufenden Anschlussleitungen 61 verbunden.Above the circuit board 2, the support frame 4 is shown, as well as this associated sealing ring 7 and the board 6. The latter is electrically connected via its arm 64 with approximately vertically extending connecting leads 61.

Oberhalb der Platine 6 befindet sich der Lüfter 3 mit seinen Lüfterflügeln 32. Er wird an dem Stützglied (Flansch) 45 des Tragegestells 4 befestigt, bevorzugt durch eine mechanische Verbindung mit dem zentralen Vorsprung 48 des Abstützglieds 45, welcher Vorsprung im montierten Zustand eine zentrale Ausnehmung 63 der Platine 6 durchdringt und diese dadurch zentriert.Above the board 6 is the fan 3 with its fan blades 32. It is attached to the support member (flange) 45 of the support frame 4, preferably by a mechanical connection with the central projection 48 of the support member 45, which projection in the mounted state, a central recess 63 of the board 6 penetrates and thereby centered.

Fig. 8 zeigt eine bevorzugte Alternative zu Fig. 3. Hier ist anstelle des flachen Rasthakens 41 b der Fig. 3 ein Rastfuß 80 mit einer in Längsrichtung dieses Rastfußes verlaufenden zylindrischen Innenausnehmung 81 und mit einer runden Doppelfeder 82 vorgesehen. Diese hat zwei federnde Schenkel 64, 66 und verjüngt sich am unteren Ende zu einem Konus 68, welcher das Einführen in ein rundes Loch 70 der Leiterplatte 2 erleichtert. Die Schenkel 64, 66 werden gebildet durch einen Längsschnitt 72 im unteren Ende des Rastfußes 80. Dieser hat an seiner Außenseite eine Ringnut 74, welche in die Ausnehmung 70 passt und durch Einpressen in diese formschlüssig mit ihr verrastbar ist. Fig. 8 zeigt diese eingerastete Stellung. Fig. 8 shows a preferred alternative to Fig. 3 , Here, instead of the flat latching hook 41 b of Fig. 3 a latching foot 80 is provided with a cylindrical inner recess 81 running in the longitudinal direction of this latching foot and with a round double spring 82. This has two resilient legs 64, 66 and tapers at the lower end to a cone 68, which facilitates insertion into a round hole 70 of the circuit board 2. The legs 64, 66 are formed by a longitudinal section 72 in the lower end of the latching foot 80. This has on its outer side an annular groove 74 which fits into the recess 70 and can be locked by pressing it into this form-fitting manner with her. Fig. 8 shows this locked position.

Auf diese Weise ermöglicht ein solcher Feder-Rastfuß 80 eine Montage durch Einrasten in einer genau definierten Position, so dass die Abstützglieder 41 a entfallen können.In this way, such a spring-locking foot 80 allows mounting by snapping in a well-defined position, so that the support members 41 a can be omitted.

Die Fig. 9 bis 23 zeigen verschiedene Varianten des Luftleitglieds 5 der Fig. 1 bis 8. Wenn sich nämlich unter diesem Luftleitglied elektronische Bauelemente 21 befinden, kann es erforderlich sein, diese Bauelemente ebenfalls durch einen Teil des Kühlluftstroms zu kühlen. Die Fig. 9 bis 23 zeigen jeweils ein Luftleitglied 5, dessen Lage am Tragegestell 4 aus den Fig. 1 bis 8 hervorgeht und das durch - bevorzugt drei - Stege 45a (Fig. 5) mit dem Ring 40 des Tragegestells 4 verbunden ist. Diese Stege 45a sind zur Vereinfachung in Fig. 9 bis 23 nicht dargestellt.The Fig. 9 to 23 show different variants of the air guide 5 of the Fig. 1 to 8 , If, in fact, electronic components 21 are located under this air guiding element, it may be necessary to cool these components as well by a part of the cooling air flow. The Fig. 9 to 23 each show an air guide member 5, whose location on the support frame 4 from the Fig. 1 to 8 resulting from - preferably three - webs 45a ( Fig. 5 ) is connected to the ring 40 of the support frame 4. These webs 45a are in for simplicity Fig. 9 to 23 not shown.

Die Luftleitglieder 5 sind, ebenso wie in Fig. 1 bis 8, am Trägerteil (Flansch) 45 angeordnet und sind bevorzugt einstückig mit diesem. An der Oberseite des Trägerteils 45 befinden sich der innere hoch stehende Rand 48 und der äußere hoch stehende Rand 49. Der äußere Rand 49 hat gewöhnlich eine Unterbrechung 49a, wie sie in Fig. 5 dargestellt ist. In Fig. 9 bis 23 ist diese Unterbrechung nicht dargestellt, kann aber dort in der gleichen Weise vorgesehen werden.The air guide members 5 are, as in Fig. 1 to 8 , arranged on the support member (flange) 45 and are preferably integral therewith. At the top of the support member 45 are the inner upstanding edge 48 and the outer upstanding edge 49. The outer edge 49 usually has an interruption 49a as seen in FIG Fig. 5 is shown. In Fig. 9 to 23 this interruption is not shown, but can be provided there in the same way.

Die Außenseite des Luftleitglieds 5 hat generell einen oberen Abschnitt 53, der im wesentlichen parallel zur Drehachse A des Lüfters 3 verläuft. Der Abschnitt 53 geht über einen mittleren Abschnitt 54 über in einen unteren Abschnitt 55, der eher senkrecht zur Drehachse A verläuft. Diese Abschnitte sind nur in Fig. 9 dargestellt und gelten in der gleichen Weise für die Fig. 10 bis 23.The outside of the air guide member 5 generally has an upper portion 53 which is substantially parallel to the axis of rotation A of the fan 3. The section 53 merges via a middle section 54 into a lower section 55, which runs rather perpendicular to the axis of rotation A. These sections are only in Fig. 9 represented and apply in the same way for the 10 to 23 ,

In Fig. 9 hat das Luftleitglied 5 eine Serie von äquidistanten Löchern 60 mit kreisrundem Querschnitt, die etwa am Übergang vom Bereich 53 zum Bereich 54 liegen. Zu diesen versetzt ist am Bereich 55 eine gleich große Zahl von Löchern 62 vorgesehen, ebenfalls mit kreisrundem Querschnitt.In Fig. 9 the air guide member 5 has a series of equidistant holes 60 with a circular cross section, which lie approximately at the transition from the region 53 to the region 54. To these offset at the area 55 an equal number of holes 62 is provided, also with a circular cross-section.

Auf diese Weise kann eine relativ große Menge an Luft unter das Luftleitglied (5) fließen und dort kühlend wirken. Fig. 10 stimmt weitgehend mit Fig. 9 überein, doch sind dort nur die Löcher 60 vorgesehen und nicht die Löcher 62.In this way, a relatively large amount of air can flow under the air guide member (5) and act cooling there. Fig. 10 agrees largely with Fig. 9 match, but there are only the holes 60 are provided and not the holes 62nd

Umgekehrt ist es bei Fig. 11 . Dort sind nur die Löcher 62 vorgesehen, aber nicht die Löcher 60. Sowohl wie bei Fig. 10 wie bei Fig. 11 wird deshalb der Haupt-Kühlluftstrom zur Leiterplatte 2 verstärkt.Conversely, it is at Fig. 11 , There, only the holes 62 are provided, but not the holes 60. Both as in Fig. 10 as in Fig. 11 Therefore, the main cooling air flow to the circuit board 2 is amplified.

In Fig. 12 sind im Übergangsbereich 54 zwölf längliche Ausnehmungen 64 vorgesehen, die sich, wie dargestellt, in Umfangsrichtung erstrecken. Ebenso sind im Bereich 55 zwölf längliche Ausnehmungen 66 vorgesehen, die sich ebenfalls in Umfangsrichtung erstrecken und relativ zu den Ausnehmungen 64 in der dargestellten Weise versetzt sind.In Fig. 12 are provided in the transition region 54 twelve elongated recesses 64, which, as shown, extend in the circumferential direction. Likewise, in the region 55 twelve elongated recesses 66 are provided which also extend in the circumferential direction and are offset relative to the recesses 64 in the manner shown.

Bei der Variante nach Fig. 13 sind nur die Ausnehmungen 64 vorgesehen, und bei der Variante nach Fig. 14 nur die Ausnehmungen 66. Folglich werden bei Fig. 12 die Bauelemente 21 unterhalb des Luftleitglieds 5 am besten gekühlt, bei Fig. 13 weniger stark, und bei Fig. 14 am schwächsten. Die Frage, welche der Varianten verwendet wird, hängt also wesentlich davon ab, wie viel Wärme im Bereich unterhalb des jeweiligen Luftleitglieds 5 erzeugt wird.In the variant after Fig. 13 only the recesses 64 are provided, and in the variant according to Fig. 14 only the recesses 66. Consequently, at Fig. 12 the components 21 below the Luftleitglieds 5 best cooled, at Fig. 13 less strong, and at Fig. 14 the weakest. The question of which of the variants is used thus depends essentially on how much heat is generated in the region below the respective air-guiding member 5.

Bei Fig. 15 sind im Übergangsbereich 54 zwölf längliche Ausnehmungen 68 vorgesehen, die sich in Richtung von oben nach unten erstrecken, und zwischen diesen liegen im Bereich 55 zwölf längliche Ausnehmungen 70, die sich ebenfalls von oben nach unten erstrecken.at Fig. 15 are provided in the transition region 54 twelve elongated recesses 68 which extend in the direction from top to bottom, and between these are in the region 55 twelve elongated recesses 70, which also extend from top to bottom.

Bei Fig. 16 sind nur die Ausnehmungen 68 vorhanden, und bei Fig.17 nur die Ausnehmungen 70. Auch hier gilt, dass für die Bauelemente 21 unterhalb des Luftleitglieds 5 die Kühlwirkung bei Fig. 15 am besten, bei Fig. 16 weniger gut, und bei Fig. 17 am schlechtesten ist.at Fig. 16 only the recesses 68 are present, and at Figure 17 only the recesses 70. Again, that for the components 21 below the air guide 5, the cooling effect at Fig. 15 best, at Fig. 16 less well, and at Fig. 17 worst is.

Fig. 18 zeigt ein Luftleitglied 5, bei dem im Übergangsbereich 54 zwölf Ausnehmungen 72 mit rechteckförmigem Querschnitt eingearbeitet sind. Ebenso sind im Bereich 55 zwölf Ausnehmungen 74 mit rechteckförmigem Querschnitt eingearbeitet, und diese sind zu den Ausnehmungen 72 versetzt. Fig. 18 shows an air guide member 5, in which twelve recesses 72 are incorporated with rectangular cross-section in the transition region 54. Similarly, in the area 55 twelve recesses 74 are incorporated with rectangular cross-section, and these are offset from the recesses 72.

Bei Fig. 19 sind nur die Ausnehmungen 72 vorhanden, und bei Fig. 20 nur die Ausnehmungen 74. Die Kühlwirkung nimmt deshalb von Fig. 18 zu Fig. 20 ab.at Fig. 19 only the recesses 72 are present, and at Fig. 20 only the recesses 74. The cooling effect therefore decreases Fig. 18 to Fig. 20 from.

Bei Fig. 21 sind im Übergangsbereich 54 des Luftleitglieds 5 zwölf Aussparungen 76 mit rechteckförmigem Querschnitt vorgesehen, und im Bereich 55 zwölf Aussparungen 78, ebenfalls mit rechteckförmigem Querschnitt. Bei Fig. 22 sind nur die Ausnehmungen 76 vorgesehen, und bei Fig.23 nur die Ausnehmungen 78. Die Wirkungsweise ist praktisch dieselbe wie bei den Varianten nach den Fig. 15, 16 und 17, d.h. von der Variante nach Fig. 21 zur Variante nach Fig. 23 nimmt die Kühlwirkung für Bauelemente 21 unterhalb des Luftleitglieds 5 ab.at Fig. 21 are provided in the transition region 54 of the air guide member 5 twelve recesses 76 of rectangular cross-section, and in the area 55 twelve recesses 78, also with a rectangular cross-section. at Fig. 22 only the recesses 76 are provided, and at Figure 23 only the recesses 78. The mode of action is practically the same as in the variants according to the FIGS. 15, 16 and 17 , ie from the variant Fig. 21 to the variant Fig. 23 takes the cooling effect for components 21 below the air guide 5 from.

Fig. 24 zeigt ein anderes Beispiel einer nicht erfindungsgemäßen Anordnung 101. Wie bei den vorhergehenden Ausführungsbeispielen werden für gleiche oder gleich wirkende Teile dieselben Bezugszeichen verwendet, und diese Teile werden nicht nochmals beschrieben. Die Anordnung 101 wird bei ihrer Verwendung auf einer Leiterplatte 2 montiert, welche in Fig. 24 angedeutet ist, und sie dient bevorzugt dazu, ein - in Fig. 24 nicht dargestelltes - wärmeempfindliches Bauteil zu kühlen, das direkt unter der Anordnung 101 auf der Leiterplatte 2 befestigt ist. Fig. 1 zeigt derartige Bauteile 21. Fig . 24 shows another example of a non-inventive arrangement 101. As in the previous embodiments, the same reference numerals are used for the same or similar parts, and these parts will not be described again. The assembly 101 is mounted in use on a printed circuit board 2, which in Fig. 24 is indicated, and it preferably serves to a - in Fig. 24 not shown - heat-sensitive component to cool directly under the arrangement 101 is mounted on the circuit board 2. Fig. 1 shows such components 21st

Die Anordnung 101 hat ein Tragegestell 104, das, wie bei den vorhergehenden Ausführungsbeispielen, etwa nach Art einer Bohrinsel ausgebildet ist. Es hat vier Stützbeine, nämlich zwei Führungsbeine 105, 106 und zwei Rastbeine 107, 108. Letztere sind so ausgebildet, wie der Feder-Rastfuß 80 der Fig. 8. Auf die dortige Beschreibung wird deshalb Bezug genommen, um Längen zu vermeiden.The assembly 101 has a support frame 104, which, as in the previous embodiments, is formed approximately in the manner of a drilling rig. It has four support legs, namely two guide legs 105, 106 and two locking legs 107, 108. The latter are designed as the spring-locking foot 80 of Fig. 8 , Reference is therefore made to the description there to avoid lengths.

Alle Stützbeine 105 bis 108 haben eine Stützfläche 105a, 106a, 107a, 108a, mit der sie nach der Montage auf der Oberseite der Leiterplatte 2 abgestützt sind. Das Führungsbein 105 hat einen Führungszapfen 110 mit der Länge d1, und ebenso hat das Führungsbein 106 einen Führungszapfen 111 mit der gleichen Länge d1, aber einem kleineren Durchmesser. Bei den Rastbeinen 107, 108 haben die Rastabschnitte 107b, 108b eine Länge d2, die kleiner ist als d1.All support legs 105 to 108 have a support surface 105 a, 106 a, 107 a, 108 a, with which they are supported after assembly on the upper side of the printed circuit board 2. The guide leg 105 has a guide pin 110 with the length d1, and also the guide leg 106 has a guide pin 111 with the same length d1, but a smaller diameter. In the case of the latching legs 107, 108, the latching sections 107b, 108b have a length d2 which is smaller than d1.

Entsprechend sind auf der Leiterplatte 2 vier Bohrungen vorgesehen, von denen in Fig. 24 nur zwei sichtbar sind. Eine Bohrung 112 dient zur Aufnahme des Führungszapfens 110, und eine Bohrung 113 dient zur Aufnahme des Rastbeins 107 in der Weise, wie das bei Fig. 8 für das Rastbein 80 ausführlich beschrieben wurde.Accordingly, four holes are provided on the circuit board 2, of which in Fig. 24 only two are visible. A bore 112 serves to receive the guide pin 110, and a bore 113 serves to receive the latching leg 107 in the manner in which Fig. 8 has been described in detail for the locking leg 80.

Für das Rastbein 108 ist eine (nicht dargestellte) Bohrung vorgesehen, deren Maße denen der Bohrung 113 entsprechen, und für das Führungsbein 106 ist eine (nicht dargestellte) Bohrung vorgesehen, deren Durchmesser kleiner ist als der Durchmesser der Bohrung 112.For the locking leg 108, a bore (not shown) is provided whose dimensions correspond to those of the bore 113, and for the guide leg 106 is provided a bore (not shown) whose diameter is smaller than the diameter of the bore 112.

Auf diese Weise wird eine korrekte und dabei einfache Befestigung der Anordnung 101 auf der Leiterplatte 2 gewährleistet, da zuerst die Führungszapfen 110, 111 in die entsprechende Bohrungen der Leiterplatte 2 eingeführt werden müssen, was nur in einer bestimmten Drehstellung möglich ist, und es erst dann überhaupt möglich ist, den Rastabschnitt 107b in der Bohrung 113 und dem Rastabschnitt 108b in der entsprechenden (nicht dargestellten) Bohrung zu verrasten, da die Abstände d1 größer sind als die Abstände d2.In this way, a correct and easy attachment of the assembly 101 is ensured on the circuit board 2, since first the guide pins 110, 111 must be inserted into the corresponding holes in the circuit board 2, which is possible only in a certain rotational position, and only then it is even possible to latch the latching portion 107b in the bore 113 and the latching portion 108b in the corresponding (not shown) bore, since the distances d1 are greater than the distances d2.

Auf der Leiterplatte 2 ist auch ein Steckverbinder 114 montiert, der zur elektrischen Verbindung der Leiterplatte 2 mit drei Metallstiften 41 dient, über welche der Motor 33 des Lüfters 3 bzw. dessen Anschlussplatine 6 elektrisch mit entsprechenden Leiterbahnen auf der Leiterplatte 2 verbunden wird.On the circuit board 2, a connector 114 is mounted, which is used for electrical connection of the circuit board 2 with three metal pins 41, via which the motor 33 of the fan 3 and its connection board 6 electrically with corresponding conductor tracks the circuit board 2 is connected.

Die vier Stützbeine 105 bis 108 sind wie dargestellt hohl ausgebildet und gehen in ihrem oberen Bereich in ein im Wesentlichen ring- oder rohrförmiges Teil 115 über, das oben in einen flachen Rand 117 übergeht, der senkrecht zur Drehachse A verläuft und der auf seiner radial inneren Seite durch einen nach oben ragenden Rand 119 begrenzt ist. Ein Dichtring 120 kann auf dem Rand 117 angeordnet werden und dient zur Abdichtung gegen eine Gehäusewand oder dgl. Auf seiner Innenseite 121 ist der Rand 119 kegelstumpfförmig ausgebildet. Der Kegelstumpf 121 geht über in einen zylindrischen Abschnitt 123, innerhalb dessen sich im Betrieb die Flügel 32 des Lüfters 3 drehen.The four support legs 105 to 108 are formed as shown hollow and go in its upper part in a substantially annular or tubular member 115, which merges above into a flat edge 117 which is perpendicular to the axis of rotation A and on its radially inner Side is bounded by an upstanding edge 119. A sealing ring 120 can be arranged on the edge 117 and serves to seal against a housing wall or the like. On its inner side 121 of the edge 119 is frusto-conical. The truncated cone 121 merges into a cylindrical section 123, within which the blades 32 of the fan 3 rotate during operation.

Am unteren Ende des zylindrischen Abschnitts 123 ist über Stege 125 ein Trägerteil 127 befestigt, und zwischen diesem und dem zylindrischen Abschnitt 123 befindet sich eine ringförmige Luftdurchtrittsöffnung 130, aus der im Betrieb ein Kühlluftstrom nach unten austritt, der in Fig. 25 bei 132 symbolisch angedeutet ist. (Ggf. kann der Kühlluftstrom auch in entgegengesetzter Richtung verlaufen.)At the lower end of the cylindrical portion 123, a support member 127 is fixed by webs 125, and between this and the cylindrical portion 123 is an annular air passage opening 130, from which in operation a cooling air flow exits downwardly, in Fig. 25 symbolically indicated at 132. (If necessary, the cooling air flow can also run in the opposite direction.)

Wie Fig. 25 zeigt, befindet sich im ringförmigen Teil 115, dem flachen Rand 117 und dem Rand 119 eine nutartige Aussparung 134, deren Breite b an die Breite des Arms 64 (Fig. 7) der Platine 6 angepasst ist. Dieser Arm 64 erweitert sich an seinem freien Ende zu einer hammerartigen Verbreiterung 64b, die in Fig. 25 im Schnitt dargestellt ist und deren Breite B größer ist als die Breite b der Nut 134. Diese Verbreiterung 64b ist in einer zu ihr komplementären Ausnehmung 136 einer kastenartigen Erweiterung 138 des Tragegestells 104 geführt und wird dort nach der Montage durch zwei Rastfedern 140, 142 in der Weise gehalten, wie das Fig. 25 zeigt, so dass die Platine 6 nach ihrer Montage in der gewünschten Lage sicher festgehalten wird. Auch wird so sichergestellt, dass die drei Metallstifte 61, welche an der Platine 6 festgelötet sind, bei der Montage einen Kontakt mit dem Kontaktglied 114 herstellen und nicht im Tragegestell 104 nach oben verschoben werden können.As Fig. 25 shows, in the annular portion 115, the flat edge 117 and the edge 119, a groove-like recess 134 whose width b to the width of the arm 64 (FIG. Fig. 7 ) of the board 6 is adjusted. This arm 64 widens at its free end to a hammer-like widening 64 b, which in Fig. 25 is shown in section and whose width B is greater than the width b of the groove 134. This widening 64b is guided in a complementary recess 136 of a box-like extension 138 of the support frame 104 and is there after mounting by two detent springs 140, 142 in kept the way, like that Fig. 25 shows, so that the board 6 is securely held after their assembly in the desired position. It is also ensured that the three metal pins 61, which are soldered to the board 6, make contact with the contact member 114 during assembly and can not be moved in the support frame 104 upwards.

Der Motor 33 wird nach seiner Montage mit dem Teil 127 dauerhaft verbunden, das etwa die Form einer Untertasse hat, um Schmierfett, das im Betrieb aus den Lagern des Motors 33 austreten könnte, aufzufangen und eine Verunreinigung der Leiterplatte 2 zu vermeiden.The motor 33 is permanently connected after its assembly with the part 127, which has approximately the shape of a saucer to absorb grease that could leak during operation from the bearings of the motor 33, and to avoid contamination of the printed circuit board 2.

Naturgemäß sind im Rahmen der vorliegenden Erfindung vielfache Abwandlungen und Modifikationen möglich.Naturally, many modifications and modifications are possible within the scope of the present invention.

Claims (28)

  1. Arrangement for cooling a circuit board (2) or the like, which arrangement comprises:
    A carrier frame (4), which comprises
    - elements (41, 43, 44; 80) for connection to the circuit board (2) and for supporting thereon,
    - a ring-like air passthrough aperture (47),
    - and a miniature or subminiature fan (3) which is mounted on the side (C) of the carrier frame (4) facing away from the circuit board (2) and at a distance from the circuit board, and is equipped with a fan wheel (31) which, during operation, rotates about a rotation axis (A) and in doing so transports air through the annular air passthrough aperture (47), characterised in that
    there is provided on the carrier frame (4), on the side of the air passthrough aperture (47) facing towards the circuit board (2), an air-directing element (5) which serves to deflect the flow direction of at least a portion of the air transported, during operation,
    through the air passthrough aperture (47),
    and the air-directing element (5) being provided with openings (60, 62; 64, 66; 68, 70; 72, 74; 76, 78) in order to direct, through a wall of the air-directing element (5), a portion of the air flow delivered by the fan (3).
  2. Arrangement according to claim 1, wherein the air-directing element (5) is configured approximately in the manner of a bell which widens in a radial direction (R) away from the fan (3).
  3. Arrangement according to claim 1 or 2, wherein the carrier frame (4) comprises, radially inside the air passthrough aperture (47), a support member (45) on which the fan (3) is arranged.
  4. Arrangement according to claim 3, wherein the support member (45) is joined, via webs or the like (45a), to a part (40) of the carrier frame (4) located radially outside the air passthrough aperture (47).
  5. Arrangement according to claim 4, wherein the part (40) of the carrier frame (4) located outside the air passthrough aperture (47) is configured in the manner of a tubular section.
  6. Arrangement according to one of claims 3 to 5, wherein an electronically commutated motor (33) mounted on the support member (45) is provided for driving the fan (3),
    and a circuit plate (6), which is configured to connect the motor (33) to electrical connecting leads (61), is arranged between this motor (33) and the support member (45).
  7. Arrangement according to claim 6, wherein the circuit plate (6) comprises electronic components for commutation of the motor (33) serving for driving the fan wheel (31).
  8. Arrangement according to claim 6 or 7, wherein the electrical connecting leads (62) are guided in the carrier frame (4) and are configured at their circuit-board end (D) for electrical contacting with the circuit board (2).
  9. Arrangement according to claim 8, wherein the connecting leads are configured as wire connections (61) which are at least partially surrounded by a sheath (51), which are formed by portions of the carrier frame (4) and/or of the air-directing element (5).
  10. Arrangement according to claim 5, wherein the outer side of the fan wheel (31), together with the inner side (47a) of the part (40) configured in the manner of a tubular section, forms an annular space (47) inside which, during operation, the blades (32) of the fan wheel (31) rotate.
  11. Arrangement according to claim 10, wherein the cross section of the annular space (47) widens in the direction towards its outlet.
  12. Arrangement according to one of the preceding claims, wherein the carrier frame (4) comprises, on its side facing away from the circuit board, an end surface (42) on which a sealing ring (7) is arranged.
  13. Arrangement according to claim 12, wherein a depression, inside which the fan (3) is arranged, is provided inside the end surface (42).
  14. Arrangement according to one of the preceding claims, wherein the fan (3) is configured to transport, through the air passthrough aperture (47), air coming from the air-directing element (5).
  15. Arrangement according to one of the preceding claims, wherein the fan (3) is configured to transport air through the air passthrough aperture (47) in a direction which goes from the air passthrough aperture (47) to the air-directing element (5), in order to deflect the air at this element in a direction away from the rotation axis (A) of the fan (3).
  16. Carrier frame for installation of a fan (3) at a distance from a circuit board (2), which carrier frame (4) comprises a support member (45) which, in the installed state, is at a distance from the circuit board (2) and is configured as a carrier for a motor (33) of the fan (3),
    which support member (45) is surrounded by an air passage (47) which in turn is surrounded by an outer air-guiding member (40) which is joined by at least one joining member (45a) to the support member (45), which joining member (45a) crosses the air passage (47), installation elements (41, 43, 44; 80) being provided for installation of the carrier frame (4) on the circuit board (2), characterised in that there is provided on the support member (45), on its side facing towards the circuit board (2), an air-directing member (5) which serves to deflect the flow direction of at least a portion of air transported through the air passage (47),
    the air-directing member (5) being provided with at least one opening (60, 62, 64, 66, 68, 70, 72, 74, 76, 78) which serves to direct, through a wall of the air-directing member (5), a portion of an air flow delivered by the fan (3).
  17. Carrier frame according to claim 16, wherein the air-directing element (5) is configured approximately in the manner of a bell whose open side faces towards the circuit board (2).
  18. Carrier frame according to claim 16 or 17, wherein the support member (45) is joined, via webs (45a), to a part (40) located radially outside the air passthrough aperture (47).
  19. Carrier frame according to claim 18, wherein the part (40) located outside the air passthrough aperture (47) is configured in the manner of a tubular section.
  20. Carrier frame according to one of claims 16 to 19,
    wherein an electronically commutated motor (33) configured for mounting on the support member (45) is provided for driving the fan (3).
  21. Carrier frame according to claim 20, wherein a circuit plate (6), which is configured to connect the motor (33) to electrical connecting leads (61), is arranged between this motor (32) and the support member (45).
  22. Carrier frame according to claim 21, wherein the circuit plate (6) comprises electronic components for commutation of the motor (33).
  23. Carrier frame according to claim 21 or 22, in which the electrical connecting leads (62) are guided, which leads are configured at their circuit-board end (D) for electrical contacting with the circuit board (2).
  24. Carrier frame according to claim 23, wherein the connecting leads (61) are configured as wire connections (61) which are at least partially surrounded by a sheath (51), which are formed by portions of the carrier frame (4) and/or of the air-directing element (5).
  25. Carrier frame according to claim 19 and 20, wherein the outer side of the fan wheel (31), together with the inner side (47a) of the part (40) configured in the manner of a tubular section, forms an annular space (47) inside which, during operation, the blades (32) of the fan wheel (31) rotate.
  26. Carrier frame according to claim 25, wherein the cross section of the annular space (47) widens in the region of at least one end portion.
  27. Carrier frame according to one of claims 16 to 26, which frame has, on its side facing away from the circuit board (2), an end surface (42) on which a sealing ring (7) is arranged.
  28. Carrier frame according to claim 27, wherein a depression for receiving a fan (3) is provided inside the end surface (42)
EP05791377.4A 2004-10-19 2005-10-04 Assembly used for cooling a circuit board or similar Not-in-force EP1702165B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP11009570.0A EP2436933B1 (en) 2004-10-19 2005-10-04 Support frame for axial fan

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202004019747 2004-10-19
DE202005015079 2005-09-19
PCT/EP2005/010652 WO2006042635A1 (en) 2004-10-19 2005-10-04 Assembly used for cooling a circuit board or similar

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP11009570.0A Division-Into EP2436933B1 (en) 2004-10-19 2005-10-04 Support frame for axial fan
EP11009570.0A Division EP2436933B1 (en) 2004-10-19 2005-10-04 Support frame for axial fan

Publications (2)

Publication Number Publication Date
EP1702165A1 EP1702165A1 (en) 2006-09-20
EP1702165B1 true EP1702165B1 (en) 2015-12-30

Family

ID=35482279

Family Applications (2)

Application Number Title Priority Date Filing Date
EP11009570.0A Active EP2436933B1 (en) 2004-10-19 2005-10-04 Support frame for axial fan
EP05791377.4A Not-in-force EP1702165B1 (en) 2004-10-19 2005-10-04 Assembly used for cooling a circuit board or similar

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP11009570.0A Active EP2436933B1 (en) 2004-10-19 2005-10-04 Support frame for axial fan

Country Status (3)

Country Link
US (1) US7390172B2 (en)
EP (2) EP2436933B1 (en)
WO (1) WO2006042635A1 (en)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4823694B2 (en) * 2006-01-13 2011-11-24 日本電産コパル株式会社 Small fan motor
TWI317863B (en) * 2006-05-29 2009-12-01 Asustek Comp Inc Electrical device and heat dissipation module thereof
TWI306384B (en) * 2006-10-04 2009-02-11 Delta Electronics Inc Heat dissipating module and fan thereof
DE202008002356U1 (en) 2008-02-19 2009-06-25 Ebm-Papst Mulfingen Gmbh & Co. Kg compact fans
US8408884B2 (en) * 2008-04-25 2013-04-02 Delta Electronics, Inc. Fan and airflow guiding structure thereof
US8403651B2 (en) * 2008-04-25 2013-03-26 Delta Electronics, Inc. Fan and airflow guiding structure thereof
CN101667057B (en) * 2008-09-01 2012-09-19 鸿富锦精密工业（深圳）有限公司 Fan fixing device
US8104559B2 (en) * 2008-09-22 2012-01-31 Clark Equipment Company Multiple air flow paths using single axial fan
ES2472840T3 (en) * 2008-11-07 2014-07-03 Ebm-Papst Mulfingen Gmbh & Co. Kg Diagonal fan
JP5363138B2 (en) * 2009-02-25 2013-12-11 ミネベア株式会社 Fan device
TW201037495A (en) * 2009-04-02 2010-10-16 Pegatron Corp Motherboard with fan
US8696332B2 (en) * 2009-06-15 2014-04-15 Sunonwealth Electric Machine Industry Co., Ltd Heat-dissipating fan
US20110274556A1 (en) * 2010-05-04 2011-11-10 Adda Corporation Positioning structure for stator assembly of cooling fan
GB2484698B (en) * 2010-10-20 2016-12-14 Greenwood Air Man Ltd Fan cover locating mechanism
CN102480906A (en) * 2010-11-26 2012-05-30 英业达股份有限公司 Circuit module and electronic device applying circuit module
US9074770B2 (en) 2011-12-15 2015-07-07 Honeywell International Inc. Gas valve with electronic valve proving system
US9995486B2 (en) 2011-12-15 2018-06-12 Honeywell International Inc. Gas valve with high/low gas pressure detection
US8839815B2 (en) 2011-12-15 2014-09-23 Honeywell International Inc. Gas valve with electronic cycle counter
US8899264B2 (en) 2011-12-15 2014-12-02 Honeywell International Inc. Gas valve with electronic proof of closure system
US9851103B2 (en) 2011-12-15 2017-12-26 Honeywell International Inc. Gas valve with overpressure diagnostics
US9557059B2 (en) 2011-12-15 2017-01-31 Honeywell International Inc Gas valve with communication link
US8947242B2 (en) 2011-12-15 2015-02-03 Honeywell International Inc. Gas valve with valve leakage test
US8905063B2 (en) 2011-12-15 2014-12-09 Honeywell International Inc. Gas valve with fuel rate monitor
US9846440B2 (en) 2011-12-15 2017-12-19 Honeywell International Inc. Valve controller configured to estimate fuel comsumption
US9835265B2 (en) 2011-12-15 2017-12-05 Honeywell International Inc. Valve with actuator diagnostics
CN103677168A (en) * 2012-08-31 2014-03-26 富瑞精密组件（昆山）有限公司 Electronic device with fan
US9234661B2 (en) 2012-09-15 2016-01-12 Honeywell International Inc. Burner control system
US10422531B2 (en) 2012-09-15 2019-09-24 Honeywell International Inc. System and approach for controlling a combustion chamber
EP2868970B1 (en) 2013-10-29 2020-04-22 Honeywell Technologies Sarl Regulating device
US10024439B2 (en) 2013-12-16 2018-07-17 Honeywell International Inc. Valve over-travel mechanism
DE102014112821A1 (en) * 2014-09-05 2016-03-10 Ebm-Papst Mulfingen Gmbh & Co. Kg Fan with PCB cooling circuit
US9841122B2 (en) 2014-09-09 2017-12-12 Honeywell International Inc. Gas valve with electronic valve proving system
US9645584B2 (en) 2014-09-17 2017-05-09 Honeywell International Inc. Gas valve with electronic health monitoring
US10503181B2 (en) 2016-01-13 2019-12-10 Honeywell International Inc. Pressure regulator
US10564062B2 (en) 2016-10-19 2020-02-18 Honeywell International Inc. Human-machine interface for gas valve
US11073281B2 (en) 2017-12-29 2021-07-27 Honeywell International Inc. Closed-loop programming and control of a combustion appliance
DE102018110822B4 (en) * 2018-05-04 2021-07-29 Dongguan Protechnic Electric Co., Ltd. Highly efficient, waterproof and heat dissipating fan
US10697815B2 (en) 2018-06-09 2020-06-30 Honeywell International Inc. System and methods for mitigating condensation in a sensor module
DE102019214087A1 (en) * 2019-09-16 2021-03-18 Ebm-Papst Mulfingen Gmbh & Co. Kg Connection of at least two components of a fan and method for connecting the two components of the fan to one another
CN115143068A (en) * 2021-03-30 2022-10-04 日本电产东测株式会社 Electric pump
CN114962328B (en) * 2022-07-25 2023-01-06 沈阳鼓风机集团股份有限公司 Axial-flow type main driving compressor for continuous wind tunnel device
DE102022124201A1 (en) 2022-09-21 2024-03-21 Ebm-Papst Mulfingen Gmbh & Co. Kg Centrifugal fan with retrofittable air guide segments
DE102022134377A1 (en) 2022-12-21 2024-06-27 Ebm-Papst Mulfingen Gmbh & Co. Kg Flow guide device and fan unit with the flow guide device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999007196A2 (en) * 1997-07-31 1999-02-11 Maurizio Checchetti Heat sink
US5975194A (en) * 1996-02-01 1999-11-02 Hewlett Packard Company Fan assisted heat sink device
US6130820A (en) * 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4885488A (en) * 1988-05-23 1989-12-05 Texas Instruments Incorporated Miniaturized fan for printed circuit boards
DE4344054C2 (en) 1993-12-23 1996-05-02 Preh Elektro Feinmechanik Control unit for a motor vehicle air conditioning system
US5478221A (en) * 1994-01-31 1995-12-26 Lzr Electronics, Inc. Miniature fan for printed circuit board
EP0666424B1 (en) 1994-02-05 1997-10-15 PAPST-MOTOREN GmbH & Co. KG Fan with rotor, in particular a radial fan rotor
US5990582A (en) * 1997-05-13 1999-11-23 Micron Electronics, Inc. Computer fan speed control device
DE29718082U1 (en) 1997-10-11 1999-02-11 Papst Motoren Gmbh & Co Kg Small fan unit, especially for use as a circuit board fan
DE19804255A1 (en) * 1998-02-04 1999-08-05 Deutz Ag Vehicle or machinery cooling system with heat exchanger
US6174232B1 (en) 1999-09-07 2001-01-16 International Business Machines Corporation Helically conforming axial fan check valve
DE60203858T2 (en) 2001-03-03 2006-02-23 Zalman Tech Co., Ltd. REFRIGERATOR AND EQUIPMENT THAT USES THIS
US6498724B1 (en) 2001-07-27 2002-12-24 Sen Long Chien Heat dissipation device for a computer
US6726455B2 (en) * 2002-09-27 2004-04-27 Sunonwealth Electric Machine Industry Co., Ltd. Fan having a heat sensor device
TW582582U (en) * 2002-11-22 2004-04-01 Hon Hai Prec Ind Co Ltd Ventilation device for computer system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5975194A (en) * 1996-02-01 1999-11-02 Hewlett Packard Company Fan assisted heat sink device
WO1999007196A2 (en) * 1997-07-31 1999-02-11 Maurizio Checchetti Heat sink
US6130820A (en) * 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device

Also Published As

Publication number Publication date
US7390172B2 (en) 2008-06-24
EP2436933A3 (en) 2018-01-24
WO2006042635A1 (en) 2006-04-27
EP2436933A2 (en) 2012-04-04
EP2436933A8 (en) 2012-05-16
EP2436933B1 (en) 2020-06-03
US20060228237A1 (en) 2006-10-12
EP1702165A1 (en) 2006-09-20

Similar Documents

Publication Publication Date Title
EP1702165B1 (en) Assembly used for cooling a circuit board or similar
DE102006003563B4 (en) Fan for a semiconductor or the like
EP2872825B1 (en) Lighting module
DE19503521B4 (en) Fan with a fan
EP1958825A2 (en) Attachment device
DE102004017371A1 (en) Antenna device for a vehicle with a fastener designed as a latching element
DE202008015459U1 (en) Fan with a sensor
DE19723664A1 (en) Control unit for brushless electric motor
EP0739063B1 (en) Connection of printed board to board connector and using this connection for plug in units of electronic equipment
DE102006042565A1 (en) Vehicle tire pressure measurement unit
EP1447885A2 (en) Socket for electrical installation
EP3424283B1 (en) Circuit of an electronic control unit
DE202005015950U1 (en) Printed circuit board cooling device, has air directing unit provided on side of circular air passage opening at stretcher support frame and returning flow direction of part of air transported via opening
DE102005033593B3 (en) Contact spring in a support frame of an antenna amplifier of a vehicle
DE19727989C2 (en) Variable electrical resistance
EP3378289B1 (en) Circuit board for mechanically fastening a housing
DE102020112963B3 (en) Ventilation system for a headlight of a motor vehicle, headlight and motor vehicle
EP1462049B1 (en) Fastening means for a work top
DE102007048159A1 (en) Housing for accommodating e.g. high frequency plug, has mounting auxiliary boreholes, and covers and frame conductively connected with one another within area of surfaces coated with conductive material
DE60003942T2 (en) ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREFOR
DE202008015041U1 (en) Fan
DE102017105470B4 (en) Light assembly
DE102010017715B4 (en) Cover for housing a portion of a circuit board, corresponding electronics housing and mounting method
DE19704022C2 (en) Electrical surface-mounted installation housing
DE202007014016U1 (en) Housing for receiving electrical or electronic components and / or components, in particular high-frequency components

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060406

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

17Q First examination report despatched

Effective date: 20070518

RBV Designated contracting states (corrected)

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566

RBV Designated contracting states (corrected)

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20150716

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 767626

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160115

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502005015065

Country of ref document: DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160331

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160430

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160502

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502005015065

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20161003

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161031

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20161004

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20170630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161031

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161004

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161031

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161102

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161004

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161004

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20161031

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 767626

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161004

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20161004

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20051004

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20151230

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20191001

Year of fee payment: 15

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502005015065

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210501