EP1658637A1 - Diode encastree comportant une connexion par fil plaquee d'argent - Google Patents

Diode encastree comportant une connexion par fil plaquee d'argent

Info

Publication number
EP1658637A1
EP1658637A1 EP04738735A EP04738735A EP1658637A1 EP 1658637 A1 EP1658637 A1 EP 1658637A1 EP 04738735 A EP04738735 A EP 04738735A EP 04738735 A EP04738735 A EP 04738735A EP 1658637 A1 EP1658637 A1 EP 1658637A1
Authority
EP
European Patent Office
Prior art keywords
diode
press
contact
silver
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04738735A
Other languages
German (de)
English (en)
Inventor
Richard Spitz
Mario Einsiedler
Stefan Schoene
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10346855A external-priority patent/DE10346855A1/de
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1658637A1 publication Critical patent/EP1658637A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Definitions

  • the result is a press-in diode with a very good solderable wire contact 2 and a base contact 3, which can be pressed into an aluminum carrier without any corrosion problem.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne une diode encastrée notamment destinée à des systèmes de redresseurs, comportant une puce de diode (7), un contact de culot (3) destiné à être encastré dans un support, formant une première connexion de la diode encastrée (1), et un contact par fil (2) formant la deuxième connexion de la diode encastrée (1). L'invention vise à mettre en oeuvre une diode encastrée (1) résistant à la corrosion, pouvant être soudée aisément. A cet effet, le contact par fil (2) est au moins partiellement pourvu d'un placage d'argent (10), le contact de culot (3) ne présentant de préférence pas de placage d'argent (10).
EP04738735A 2003-08-18 2004-06-19 Diode encastree comportant une connexion par fil plaquee d'argent Withdrawn EP1658637A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10338408 2003-08-18
DE10346855A DE10346855A1 (de) 2003-08-18 2003-10-09 Einpressdiode mit versilbertem Drahtanschluss
PCT/DE2004/001285 WO2005020322A1 (fr) 2003-08-18 2004-06-19 Diode encastree comportant une connexion par fil plaquee d'argent

Publications (1)

Publication Number Publication Date
EP1658637A1 true EP1658637A1 (fr) 2006-05-24

Family

ID=34219269

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04738735A Withdrawn EP1658637A1 (fr) 2003-08-18 2004-06-19 Diode encastree comportant une connexion par fil plaquee d'argent

Country Status (3)

Country Link
EP (1) EP1658637A1 (fr)
JP (1) JP2006527913A (fr)
WO (1) WO2005020322A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4569423B2 (ja) 2005-08-31 2010-10-27 株式会社日立製作所 半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3145099A (en) * 1961-05-22 1964-08-18 Waukesha Foundry Co Non-galling bearing alloy of silver in nickel base
DE2836334B1 (de) * 1978-08-19 1980-05-08 Mannesmann Demag Ag, 4100 Duisburg Verfahren zum Schützen von metallenen, kraftschlüssig gepaarten, schwingend belasteten Maschinenteilen vor Reibkorrosion
DE3236376C2 (de) * 1982-10-01 1986-06-19 MTU Motoren- und Turbinen-Union München GmbH, 8000 München Verfahren zum Schützen von metallischen, kraftschlüssig gepaarten Maschinenteilen vor Reibkorrosion
US5005069A (en) * 1990-04-30 1991-04-02 Motorola Inc. Rectifier and method
DE4341269A1 (de) * 1993-12-03 1995-06-22 Bosch Gmbh Robert Gleichrichterdiode
DE19549202B4 (de) * 1995-12-30 2006-05-04 Robert Bosch Gmbh Gleichrichterdiode
DE10146274A1 (de) * 2001-09-19 2003-04-10 Bosch Gmbh Robert Metallische Oberfläche eines Körpers, Verfahren zur Herstellung einer strukturierten metallischen Oberfläche eines Körpers und dessen Verwendung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005020322A1 *

Also Published As

Publication number Publication date
WO2005020322A1 (fr) 2005-03-03
JP2006527913A (ja) 2006-12-07

Similar Documents

Publication Publication Date Title
DE102011084803B4 (de) Leistungshalbleitervorrichtung
DE60221079T3 (de) Zinn-Silberbeschichtungen
DE10152203B4 (de) Elektrolytkondensator und Herstellung desselben
DE29514398U1 (de) Abschirmung für Flachbaugruppen
DE2810054A1 (de) Elektronische schaltungsvorrichtung und verfahren zu deren herstellung
DE3743857A1 (de) Elektrische sicherung und verfahren zu ihrer herstellung
DE19902405B4 (de) Verfahren zur Herstellung einer korrosionsresistenten, elektrischen Verbindung
DE202014010271U1 (de) Scheibe mit mindestens zwei elektrischen Anschlusselementen und Verbindungsleiter
DE102011077915A1 (de) Einpresspin für eine elektrische Einpressverbindung zwischen einer elektronischen Komponente und einer Substratplatte
DE102007001191B4 (de) Halbleitervorrichtung mit einem Widerstand zum Abgleichen der Stromverteilung
EP3152985B1 (fr) Procédé de production d'un arrangement de feuilles et arrangment de feuilles correspondant
DE60130412T2 (de) System und Verfahren zur Erzeugung von Hochspannungswiderstandsfähigkeit zwischen den nachgiebigen Stiften eines Steckverbinders mit hoher Kontaktdichte
DE102019204639A1 (de) Luftspaltbildung in einer elektrischen Kontaktierung einer Leiterplatte
DE4423561A1 (de) Oberflächenmontage-Elektronikbauteil mit Schmelzsicherung
DE10103084B4 (de) Halbleitermodul und Verfahren zu seiner Herstellung
DE3613594C2 (fr)
EP1658637A1 (fr) Diode encastree comportant une connexion par fil plaquee d'argent
DE19511553A1 (de) System und Verfahren zur Erzeugung elektrisch leitfähiger Verbindungsstrukturen sowie Verfahren zur Herstellung von Schaltungen und von bestückten Schaltungen
EP3451455A1 (fr) Procédé de fabrication d'une liaison électrique et une ligne électrique
DE10059808A1 (de) Verfahren zur Verbindung einer integrierten Schaltung und einer flexiblen Schaltung
DE10346855A1 (de) Einpressdiode mit versilbertem Drahtanschluss
WO2015067792A1 (fr) Grille de connexion et son utilisation
DE19716044C2 (de) Verfahren zum selektiven galvanischen Aufbringen von Lotdepots auf Leiterplatten
DE60209712T2 (de) Gedruckte leiterplatte
WO2007080027A1 (fr) Dispositif de refroidissement de composants de puissance sur des cartes de circuit imprimé et son procédé de fabrication

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20060320

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160105