EP1649549A1 - Conductor connecting module for printed circuit boards - Google Patents

Conductor connecting module for printed circuit boards

Info

Publication number
EP1649549A1
EP1649549A1 EP04740236A EP04740236A EP1649549A1 EP 1649549 A1 EP1649549 A1 EP 1649549A1 EP 04740236 A EP04740236 A EP 04740236A EP 04740236 A EP04740236 A EP 04740236A EP 1649549 A1 EP1649549 A1 EP 1649549A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
housing
contact
circuit boards
connection module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04740236A
Other languages
German (de)
French (fr)
Other versions
EP1649549B1 (en
Inventor
Heiko Neumetzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADC GmbH
Original Assignee
ADC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ADC GmbH filed Critical ADC GmbH
Priority to SI200430122T priority Critical patent/SI1649549T1/en
Priority to PL04740236T priority patent/PL1649549T3/en
Publication of EP1649549A1 publication Critical patent/EP1649549A1/en
Application granted granted Critical
Publication of EP1649549B1 publication Critical patent/EP1649549B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7064—Press fitting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/242—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
    • H01R4/2425—Flat plates, e.g. multi-layered flat plates
    • H01R4/2429—Flat plates, e.g. multi-layered flat plates mounted in an insulating base

Definitions

  • the invention relates to a wire connection module for printed circuit boards according to the preamble of claim 1.
  • the wire connection module comprises a housing, in which contact elements are arranged, wherein the contact elements have a first contact region, which is formed as insulation displacement contact, and a second contact region, which is formed as a solderable contact pin.
  • the housing is formed in one piece and is soldered via the contact pins with the circuit board.
  • the contact elements are inserted from the top of the housing and held by stops, wherein in the inserted state, the contact pins protrude from the bottom of the housing.
  • Schirmgngsbleche are provided which are inserted from the underside of the housing and are each arranged between two pairs of contact elements.
  • the shield plates are also formed with contact pins, so that they can also be soldered to the circuit board and placed on a common ground line.
  • Such wire connection modules are also referred to as PCB print modules. Via the trained as insulation displacement contacts contact areas wires can then be electrically connected to the circuit board. If the printed circuit boards are inserted in a housing or a slot, then the printed circuit board must first be connected or, in the event of a subsequent change in the wiring, the housing or the slot must be removed.
  • the invention is therefore based on the technical problem of providing a wire connection module for printed circuit boards, by means of which a simpler wiring with wires is possible.
  • the contact elements are formed such that the longitudinal axes of the insulation displacement contacts in the assembled state of the core connection module are parallel to the surface of the circuit board. This makes it possible to make the insulation displacement contacts accessible in slots over the front panel from the outside. This in turn allows a simple subsequent Bebendinglten the insulation displacement contacts, without having to remove the slot or adjacent bays. The same applies mutatis mutandis when the circuit board is placed in a housing.
  • Another advantage is that the arrangement on the circuit board has a slightly lower height.
  • the contact pins are arranged at right angles to the insulation displacement contacts, so that they are perpendicular to the surface of the circuit board in the mounted state, which allows easy insertion and soldering.
  • the contact elements are preferably formed in one piece and are preferably inserted from the cutting-terminal contacts associated front side of the housing, wherein subsequently the contact pins are angled.
  • the housing is preferably designed as a one-piece plastic housing.
  • the housing is formed with fixing pins, by means of which the wire connection module can be fixed and aligned with the printed circuit board.
  • the fixing pins may be formed as a press fit or with an at least partially cylindrical detent.
  • the fixing pins may be formed as a hot stamping pin.
  • the housing is formed with a stop surface to support the housing on an end face of the circuit board.
  • the circuit board can at least partially absorb the Anschalt concept occurring when Beschaltten the insulation displacement contacts.
  • FIG. 1 shows a perspective bottom view of a wire connection module for printed circuit boards
  • FIG. 2 shows a perspective top view of the wire connection module in the installed state on a printed circuit board
  • FIG. 3 shows a perspective bottom view of the illustration according to FIG.
  • Fig. 4 is a perspective view of the wire connection module in the broken state
  • Fig. 5 is a front perspective view of a front panel
  • Fig. 6 is a rear perspective view of the front panel.
  • the wire connection module 1 is shown for printed circuit boards.
  • the wire connection module 1 comprises a housing 2 with contact elements, wherein the contact elements have a trained as insulation displacement contact 3 and a contact pin 4 as contact area.
  • the contact pins 4 are arranged at right angles to the insulation displacement contacts 3, which can be seen for example in Fig. 4.
  • the contact pins 4 are formed, for example, as simple solder pins in push-through technology, as press-fit pins or with special geometry for SMD soldering, wherein in Figs. 1 - 4, the training is shown as solder pins in push-through technology.
  • the longitudinal axes L of the insulation displacement contacts 3 are parallel to the surface of the circuit board 6 and the cutting edges of the insulation displacement contacts 3.
  • the housing 2 is formed with fixing pins 5, which are inserted through corresponding holes in the circuit board 6, which in Fig. 3 is shown. Furthermore, the housing 2 is formed with latching lugs 7, 8 on the top and bottom, by means of which the wire connection module 1 can be latched to a front panel. Further, the housing 2 comprises a stop surface 9, which supports the housing 2 on an end face 10 of the printed circuit board 6, which is shown in FIGS. 2 and 3. As can be seen in particular in FIG. 2, the rear part of the housing 2 additionally rests on the printed circuit board 6. In the region of the angled portion of the contact pin 4, two formations 11 are respectively arranged on the housing 2, which hold and fix the contact pins 4.
  • the wire connection module 1 In comparison to cable connectors which are snapped onto the front side of a printed circuit board, the wire connection module 1 according to the invention allows the use of different Printed circuit board thicknesses, which are required for static reasons, especially for larger printed circuit boards 6 or are standardized in use in 19-inch technology. From the standard grid of the electronics of 5.08 mm, the modules can be pitch-compliant, so that higher-pole rows of contacts can be realized by simply juxtaposing the wire connection modules 1 within the same grid.
  • FIGS. 5 and 6 show three wire connection modules 1 within a front panel 12. As can be seen in Fig. 5, the insulation displacement contacts 3 from the front side of the front plate 12 are freely accessible, so that the wires can be easily connected with standard tools, without removing the front panel 12. It can also be seen that if several slots are arranged with front panels 12 one above the other, they do not interfere with the Berisms.

Abstract

A wiring connection module (1) for circuit boards, comprises a housing in which are arranged contacts which have a first contact zone designed as an insulation-piercing contact. The contacts are designed so that the longitudinal axes (L) of the insulation-piercing contacts (3) lie parallel to the surface of the circuit board (6), with the wiring connection module (1) in its assembled state.

Description

Aderanschlussmodul für Leiterplatten Wire connection module for printed circuit boards
Die Erfindung betrifft ein Aderanschlussmodul für Leiterplatten gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a wire connection module for printed circuit boards according to the preamble of claim 1.
Ein solches Aderanschlussmodul ist beispielsweise aus der EP 0 766 952 B1 bekannt. Das Aderanschlussmodul umfasst ein Gehäuse, in dem Kontaktelemente angeordnet sind, wobei die Kontaktelemente einen ersten Kontaktbereich aufweisen, der als Schneid-Klemm-Kontakt ausgebildet ist, sowie einen zweiten Kontaktbereich, der als lötbarer Kontaktpin ausgebildet ist. Das Gehäuse ist einteilig ausgebildet und wird über die Kontaktpins mit der Leiterplatte verlötet. Die Kontaktelemente werden von der Oberseite des Gehäuses eingeschoben und durch Anschläge gehalten, wobei im eingeschobenen Zustand die Kontaktpins aus der Unterseite des Gehäuses herausragen. Zur Schirmung sind Schirmgngsbleche vorgesehen, die von der Unterseite des Gehäuses eingeschoben werden und jeweils zwischen zwei Paaren von Kontaktelementen angeordnet sind. Die Schirmbleche sind ebenfalls mit Kontaktpins ausgebildet, so dass diese ebenfalls mit der Leiterplatte verlötet und auf eine gemeinsame Masseleitung gelegt werden können. Derartige Aderanschlussmodule werden auch als PCB-Printmodule bezeichnet. Über die als Schneid-Klemm-Kontakte ausgebildeten Kontaktbereiche können dann Adern elektrisch mit der Leiterplatte verbunden werden. Werden die Leiterplatten in einem Gehäuse oder einem Einschub eingesetzt, so muss die Leiterplatte zuvor beschaltet werden bzw. bei einer nachträglichen Änderung der Beschaltung muss das Gehäuse bzw. der Einschub entfernt werden.Such a wire connection module is known, for example, from EP 0 766 952 B1. The wire connection module comprises a housing, in which contact elements are arranged, wherein the contact elements have a first contact region, which is formed as insulation displacement contact, and a second contact region, which is formed as a solderable contact pin. The housing is formed in one piece and is soldered via the contact pins with the circuit board. The contact elements are inserted from the top of the housing and held by stops, wherein in the inserted state, the contact pins protrude from the bottom of the housing. For shielding Schirmgngsbleche are provided which are inserted from the underside of the housing and are each arranged between two pairs of contact elements. The shield plates are also formed with contact pins, so that they can also be soldered to the circuit board and placed on a common ground line. Such wire connection modules are also referred to as PCB print modules. Via the trained as insulation displacement contacts contact areas wires can then be electrically connected to the circuit board. If the printed circuit boards are inserted in a housing or a slot, then the printed circuit board must first be connected or, in the event of a subsequent change in the wiring, the housing or the slot must be removed.
Der Erfindung liegt daher das technische Problem zugrunde, ein Aderanschlussmodul für Leiterplatten zu schaffen, mittels dessen eine einfachere Beschaltung mit Adern möglich ist.The invention is therefore based on the technical problem of providing a wire connection module for printed circuit boards, by means of which a simpler wiring with wires is possible.
Die Lösung des technischen Problems ergibt sich durch den Gegenstand mit den Merkmalen des Patentanspruchs 1. Weitere vorteilhafte Ausgestaltungen der Erfindung ergeben sich aus den Unteransprüchen. Hierzu sind die Kontaktelemente derart ausgebildet, dass die Längsachsen der Schneid-Klemm-Kontakte im montierten Zustand des Aderanschlussmoduls parallel zur Oberfläche der Leiterplatte liegen. Hierdurch ist es möglich, die Schneid-Klemm-Kontakte bei Einschüben über die Frontplatte von außen zugänglich zu machen. Dies wiederum ermöglicht ein einfaches nachträgliches Beschälten der Schneid-Klemm-Kontakte, ohne den Einschub oder benachbarte Einschübe entfernen zu müssen. Gleiches gilt sinngemäß, wenn die Leiterplatte in einem Gehäuse angeordnet wird. Ein weiterer Vorteil ist, dass die Anordnung auf der Leiterplatte eine etwas geringere Bauhöhe aufweist. In einer bevorzugten Ausführungsform sind die Kontaktpins im rechten Winkel zu den Schneid-Klemm- Kontakten angeordnet, sodass diese im montierten Zustand senkrecht zur Oberfläche der Leiterplatte stehen, was ein einfaches Durchstecken und Verlöten ermöglicht. Die Kontaktelemente sind vorzugsweise einstückig ausgebildet und werden vorzugsweise von der den Schneid-Klemm-Kontakten zugeordneten Stirnseite des Gehäuses eingeschoben, wobei anschließend die Kontaktpins abgewinkelt werden.The solution of the technical problem results from the subject matter with the features of claim 1. Further advantageous embodiments of the invention will become apparent from the dependent claims. For this purpose, the contact elements are formed such that the longitudinal axes of the insulation displacement contacts in the assembled state of the core connection module are parallel to the surface of the circuit board. This makes it possible to make the insulation displacement contacts accessible in slots over the front panel from the outside. This in turn allows a simple subsequent Beschälten the insulation displacement contacts, without having to remove the slot or adjacent bays. The same applies mutatis mutandis when the circuit board is placed in a housing. Another advantage is that the arrangement on the circuit board has a slightly lower height. In a preferred embodiment, the contact pins are arranged at right angles to the insulation displacement contacts, so that they are perpendicular to the surface of the circuit board in the mounted state, which allows easy insertion and soldering. The contact elements are preferably formed in one piece and are preferably inserted from the cutting-terminal contacts associated front side of the housing, wherein subsequently the contact pins are angled.
Das Gehäuse ist vorzugsweise als einteiliges Kunststoffgehäuse ausgebildet.The housing is preferably designed as a one-piece plastic housing.
In einer bevorzugten Ausführungsform ist das Gehäuse mit Fixierstiften ausgebildet, über die das Aderanschlussmodul zur Leiterplatte fixiert und ausgerichtet werden kann. Die Fixierstifte können als Presssitz oder mit einer zumindest teilweise zylindrischen Rastung ausgebildet sein. Alternativ können die Fixierstifte als Warmprägezapfen ausgebildet sein.In a preferred embodiment, the housing is formed with fixing pins, by means of which the wire connection module can be fixed and aligned with the printed circuit board. The fixing pins may be formed as a press fit or with an at least partially cylindrical detent. Alternatively, the fixing pins may be formed as a hot stamping pin.
In einer weiteren bevorzugten Ausführungsform ist das Gehäuse mit einer Anschlagfläche ausgebildet, um das Gehäuse an einer Stirnfläche der Leiterplatte abzustützen. Somit kann die Leiterplatte die beim Beschälten der Schneid-Klemm- Kontakte auftretenden Anschaltkräfte mindestens teilweise aufnehmen.In a further preferred embodiment, the housing is formed with a stop surface to support the housing on an end face of the circuit board. Thus, the circuit board can at least partially absorb the Anschaltkräfte occurring when Beschaltten the insulation displacement contacts.
Die Erfindung wird nachfolgend anhand eines bevorzugten Ausführungsbeispiels näher erläutert. Die Fig. zeigen: Fig. 1 eine perspektivische Unteransicht eines Aderanschlussmoduls für Leiterplatten, Fig. 2 eine perspektivische Draufsicht auf das Aderanschlussmodul im montierten Zustand auf einer Leiterplatte, Fig. 3 eine perspektivische Unteransicht der Darstellung gemäß Fig. 2,The invention will be explained in more detail below with reference to a preferred embodiment. The figures show: 1 shows a perspective bottom view of a wire connection module for printed circuit boards, FIG. 2 shows a perspective top view of the wire connection module in the installed state on a printed circuit board, FIG. 3 shows a perspective bottom view of the illustration according to FIG.
Fig. 4 eine perspektivische Darstellung des Aderanschlussmoduls im aufgebrochenen Zustand, Fig. 5 eine perspektivische Vorderansicht auf eine Frontplatte und Fig. 6 eine perspektivische Hinteransicht der Frontplatte.Fig. 4 is a perspective view of the wire connection module in the broken state, Fig. 5 is a front perspective view of a front panel and Fig. 6 is a rear perspective view of the front panel.
In der Fig. 1 ist das Aderanschlussmodul 1 für Leiterplatten dargestellt. Das Aderanschlussmodul 1 umfasst ein Gehäuse 2 mit Kontaktelementen, wobei die Kontaktelemente einen als Schneid-Klemm-Kontakt 3 und einen als Kontaktpin 4 ausgebildeten Kontaktbereich aufweisen. Die Kontaktpins 4 sind dabei rechtwinklig zu den Schneid-Klemm-Kontakten 3 angeordnet, was beispielsweise in Fig. 4 erkennbar ist. Die Kontaktpins 4 sind beispielsweise als einfache Lötstifte in Durchstecktechnik, als Einpressstifte oder mit besonderer Geometrie für SMD- Lötung ausgebildet, wobei in den Fig. 1 - 4 die Ausbildung als Lötstifte in Durchstecktechnik dargestellt ist. Dabei liegen die Längsachsen L der Schneid- Klemm-Kontakte 3 parallel zu der Oberfläche der Leiterplatte 6 sowie den Schneidkanten der Schneid-Klemm-Kontakte 3. Das Gehäuse 2 ist mit Fixierstiften 5 ausgebildet, die in entsprechende Bohrungen der Leiterplatte 6 durchgesteckt werden, was in Fig. 3 dargestellt ist. Des Weiteren ist das Gehäuse 2 mit Rastnasen 7, 8 auf der Ober- und Unterseite ausgebildet, mittels derer das Aderanschlussmodul 1 mit einer Frontplatte verrastet werden kann. Weiter umfasst das Gehäuse 2 eine Anschlagfläche 9, die das Gehäuse 2 an einer Stirnfläche 10 der Leiterplatte 6 abstützt, was in den Fig. 2 und 3 dargestellt ist. Wie insbesondere in Fig. 2 zu erkennen ist, liegt zusätzlich der hintere Teil des Gehäuses 2 auf der Leiterplatte 6 auf. Im Bereich der Abwinkelung des Kontaktpins 4 sind jeweils zwei Ausformungen 11 am Gehäuse 2 angeordnet, die die Kontaktpins 4 halten und fixieren. Im Vergleich zu Kabelsteckverbindern, die auf die Stirnseite einer Leiterplatte aufgerastet werden, erlaubt das erfindungsgemäße Aderanschlussmodul 1 den Einsatz auf verschiedenen Leiterplattendicken, wie sie aus statischen Gründen gerade bei größeren Leiterplatten 6 erforderlich sind oder im Einsatz bei 19-Zolltechnik genormt sind. Ab dem Standardraster der Elektronik von 5,08 mm können die Module teilungskonform ausgeführt werden, so dass sich höherpolige Kontaktreihen durch einfaches Aneinanderreihen der Aderanschlussmodule 1 innerhalb des gleichen Rasters realisieren lassen.In Fig. 1, the wire connection module 1 is shown for printed circuit boards. The wire connection module 1 comprises a housing 2 with contact elements, wherein the contact elements have a trained as insulation displacement contact 3 and a contact pin 4 as contact area. The contact pins 4 are arranged at right angles to the insulation displacement contacts 3, which can be seen for example in Fig. 4. The contact pins 4 are formed, for example, as simple solder pins in push-through technology, as press-fit pins or with special geometry for SMD soldering, wherein in Figs. 1 - 4, the training is shown as solder pins in push-through technology. The longitudinal axes L of the insulation displacement contacts 3 are parallel to the surface of the circuit board 6 and the cutting edges of the insulation displacement contacts 3. The housing 2 is formed with fixing pins 5, which are inserted through corresponding holes in the circuit board 6, which in Fig. 3 is shown. Furthermore, the housing 2 is formed with latching lugs 7, 8 on the top and bottom, by means of which the wire connection module 1 can be latched to a front panel. Further, the housing 2 comprises a stop surface 9, which supports the housing 2 on an end face 10 of the printed circuit board 6, which is shown in FIGS. 2 and 3. As can be seen in particular in FIG. 2, the rear part of the housing 2 additionally rests on the printed circuit board 6. In the region of the angled portion of the contact pin 4, two formations 11 are respectively arranged on the housing 2, which hold and fix the contact pins 4. In comparison to cable connectors which are snapped onto the front side of a printed circuit board, the wire connection module 1 according to the invention allows the use of different Printed circuit board thicknesses, which are required for static reasons, especially for larger printed circuit boards 6 or are standardized in use in 19-inch technology. From the standard grid of the electronics of 5.08 mm, the modules can be pitch-compliant, so that higher-pole rows of contacts can be realized by simply juxtaposing the wire connection modules 1 within the same grid.
In den Fig. 5 und 6 sind drei Aderanschlussmodule 1 innerhalb einer Frontplatte 12 dargestellt. Wie in Fig. 5 erkennbar, sind die Schneid-Klemm-Kontakte 3 von der Stirnseite der Frontplatte 12 frei zugänglich, so dass die Adern einfach mit Standard-Werkzeugen beschaltet werden können, ohne die Frontplatte 12 zu entfernen. Ebenso ist erkennbar, dass, wenn mehrere Einschübe mit Frontplatten 12 übereinander angeordnet sind, diese sich hinsichtlich des Beschaltens nicht stören. FIGS. 5 and 6 show three wire connection modules 1 within a front panel 12. As can be seen in Fig. 5, the insulation displacement contacts 3 from the front side of the front plate 12 are freely accessible, so that the wires can be easily connected with standard tools, without removing the front panel 12. It can also be seen that if several slots are arranged with front panels 12 one above the other, they do not interfere with the Beschaltens.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
AderanschlussmodulCable termination module
Gehäusecasing
Schneid-Klemm-KontaktInsulation displacement contact
Kontaktpincontact pin
Fixierstiftlocating pin
Leiterplattecircuit board
Rastnaselocking lug
Rastnaselocking lug
Anschlagflächestop surface
Stirnflächeface
Ausformungformation
Frontplatte front panel

Claims

Patentansprücheclaims
1) Aderanschlussmodul für Leiterplatten, umfassend ein Gehäuse, in dem Kontaktelemente angeordnet sind, wobei die Kontaktelemente einen ersten Kontaktbereich aufweisen, der als Schneid-Klemm-Kontakt ausgebildet ist, und einen zweiten Kontaktbereich aufweisen, der als lötbarer Kontaktpin ausgebildet ist, dadurch gekennzeichnet, dass die Kontaktelemente derart ausgebildet sind, dass die Längsachsen (L) der Schneid-Klemm-Kontakte (3) im montierten Zustand des Aderanschlussmoduls (1) parallel zur Oberfläche der Leiterplatte (6) liegen1) conductor connection module for printed circuit boards, comprising a housing in which contact elements are arranged, wherein the contact elements have a first contact region, which is formed as insulation displacement contact, and a second contact region, which is formed as a solderable contact pin, characterized the contact elements are designed such that the longitudinal axes (L) of the insulation displacement contacts (3) lie parallel to the surface of the printed circuit board (6) in the mounted state of the wire connection module (1)
2) Aderanschlussmodul für Leiterplatten nach Anspruch 1 , dadurch gekennzeichnet, dass die Kontaktpins (4) in einem rechten Winkel zu den Schneid-Klemm-Kontakten (3) angeordnet sind.2) Aderanschlussmodul for printed circuit boards according to claim 1, characterized in that the contact pins (4) are arranged at a right angle to the insulation displacement contacts (3).
3) Aderanschlussmodul für Leiterplatten nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das Gehäuse (2) als einteiliges Kunststoffgehäuse ausgebildet ist.3) Aderanschlussmodul for printed circuit boards according to claim 1 or 2, characterized in that the housing (2) is designed as a one-piece plastic housing.
4) Aderanschlussmodul für Leiterplatten nach Anspruch 2 oder 3, dadurch gekennzeichnet, dass das Gehäuse (2) mit Fixierstiften (5) ausgebildet ist, die parallel zu den Kontaktpins (4) angeordnet sind.4) Ader connection module for printed circuit boards according to claim 2 or 3, characterized in that the housing (2) with fixing pins (5) is formed, which are arranged parallel to the contact pins (4).
5) Aderanschlussmodul für Leiterplatten nach einem der vorangegangenen Ansprüche, dadurch gekennzeichnet, dass das Gehäuse (2) mit einer Anschlagfläche (9) ausgebildet ist, um das Gehäuse (2) an einer Stirnfläche (10) der Leiterplatte (6) abzustützen. 5) Aderanschlussmodul for printed circuit boards according to one of the preceding claims, characterized in that the housing (2) with a stop surface (9) is formed to support the housing (2) on an end face (10) of the printed circuit board (6).
EP04740236A 2003-07-25 2004-06-24 Conductor connecting module for printed circuit boards Not-in-force EP1649549B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SI200430122T SI1649549T1 (en) 2003-07-25 2004-06-24 Conductor connecting module for printed circuit boards
PL04740236T PL1649549T3 (en) 2003-07-25 2004-06-24 Conductor connecting module for printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10333913A DE10333913A1 (en) 2003-07-25 2003-07-25 Wiring connection module for circuit boards, uses contacts allowing longitudinal axes of insulation-piercing contacts to lie parallel to circuit-board surface
PCT/EP2004/006821 WO2005020376A1 (en) 2003-07-25 2004-06-24 Conductor connecting module for printed circuit boards

Publications (2)

Publication Number Publication Date
EP1649549A1 true EP1649549A1 (en) 2006-04-26
EP1649549B1 EP1649549B1 (en) 2006-11-02

Family

ID=34088827

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04740236A Not-in-force EP1649549B1 (en) 2003-07-25 2004-06-24 Conductor connecting module for printed circuit boards

Country Status (15)

Country Link
US (1) US7591654B2 (en)
EP (1) EP1649549B1 (en)
JP (1) JP2006528828A (en)
KR (1) KR100840161B1 (en)
CN (1) CN1830119A (en)
AT (1) ATE344540T1 (en)
AU (1) AU2004302244B2 (en)
BR (1) BRPI0412831A (en)
CA (1) CA2527353C (en)
DE (2) DE10333913A1 (en)
ES (1) ES2274465T3 (en)
MX (1) MXPA06000751A (en)
PL (1) PL1649549T3 (en)
TW (1) TWI261389B (en)
WO (1) WO2005020376A1 (en)

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Also Published As

Publication number Publication date
PL1649549T3 (en) 2007-03-30
AU2004302244A1 (en) 2005-03-03
CA2527353C (en) 2010-03-16
US20070111555A1 (en) 2007-05-17
EP1649549B1 (en) 2006-11-02
CN1830119A (en) 2006-09-06
BRPI0412831A (en) 2006-09-26
MXPA06000751A (en) 2006-03-30
AU2004302244B2 (en) 2009-10-22
DE10333913A1 (en) 2005-02-24
TWI261389B (en) 2006-09-01
DE502004001921D1 (en) 2006-12-14
ATE344540T1 (en) 2006-11-15
US7591654B2 (en) 2009-09-22
TW200507361A (en) 2005-02-16
WO2005020376A1 (en) 2005-03-03
CA2527353A1 (en) 2005-03-03
ES2274465T3 (en) 2007-05-16
JP2006528828A (en) 2006-12-21
KR100840161B1 (en) 2008-06-23
KR20060030488A (en) 2006-04-10

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