EP1620890A2 - Electronic component as well as system support and panel for the production thereof - Google Patents
Electronic component as well as system support and panel for the production thereofInfo
- Publication number
- EP1620890A2 EP1620890A2 EP04730953A EP04730953A EP1620890A2 EP 1620890 A2 EP1620890 A2 EP 1620890A2 EP 04730953 A EP04730953 A EP 04730953A EP 04730953 A EP04730953 A EP 04730953A EP 1620890 A2 EP1620890 A2 EP 1620890A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- contacts
- layer
- rewiring
- carrier
- rewiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE10320646A DE10320646A1 (en) | 2003-05-07 | 2003-05-07 | Electronic component, typically integrated circuit, system support and manufacturing method, with support containing component positions in lines and columns, starting with coating auxiliary support with photosensitive layer |
PCT/DE2004/000934 WO2004100253A2 (en) | 2003-05-07 | 2004-05-04 | Electronic component as well as system support and panel for the production thereof |
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EP1620890A2 true EP1620890A2 (en) | 2006-02-01 |
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EP04730953A Withdrawn EP1620890A2 (en) | 2003-05-07 | 2004-05-04 | Electronic component as well as system support and panel for the production thereof |
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---|---|
US (1) | US7795717B2 (en) |
EP (1) | EP1620890A2 (en) |
DE (1) | DE10320646A1 (en) |
WO (1) | WO2004100253A2 (en) |
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2003
- 2003-05-07 DE DE10320646A patent/DE10320646A1/en not_active Ceased
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- 2004-05-04 WO PCT/DE2004/000934 patent/WO2004100253A2/en active Application Filing
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DE10320646A1 (en) | 2004-09-16 |
US7795717B2 (en) | 2010-09-14 |
WO2004100253A3 (en) | 2005-09-29 |
US20060087044A1 (en) | 2006-04-27 |
WO2004100253A2 (en) | 2004-11-18 |
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