EP1620350A1 - Miroir bidimensionnel a systeme micro-electro-mecanique ayant des structures de suspension articulees destinees a des reseaux a facteur de remplissage eleve - Google Patents
Miroir bidimensionnel a systeme micro-electro-mecanique ayant des structures de suspension articulees destinees a des reseaux a facteur de remplissage eleveInfo
- Publication number
- EP1620350A1 EP1620350A1 EP04728310A EP04728310A EP1620350A1 EP 1620350 A1 EP1620350 A1 EP 1620350A1 EP 04728310 A EP04728310 A EP 04728310A EP 04728310 A EP04728310 A EP 04728310A EP 1620350 A1 EP1620350 A1 EP 1620350A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- mirror
- articulated hinge
- dimensional rotational
- dimensional
- rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
- G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
- G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
- G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
- G02B6/3546—NxM switch, i.e. a regular array of switches elements of matrix type constellation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
- G02B6/3544—2D constellations, i.e. with switching elements and switched beams located in a plane
- G02B6/3548—1xN switch, i.e. one input and a selectable single output of N possible outputs
Definitions
- the invention relates to a micro-electro-mechanical- system two dimensional mirror with articulated suspension structures for high fill factor arrays.
- a MEMS (Micro-Electro-Mechanical-System) device is a micro-sized mechanical structure having electrical circuitry fabricated together with the device by various microfabrication processes mostly derived from integrated circuit fabrication methods.
- MEMS microelectro echanical systems
- a number of microelectromechanical mirror arrays have already been built using MEMS production processes and techniques. These arrays have designs that fall into approximately three design categories listed and discussed below:
- the conventional 2D gimbal mirror is one of the most common types of MEMS 2D micromirrors .
- An example is shown in Figure 6. It consists of a central mirror 10 that is connected to an outer frame 12 with a torsional hinge 14 as shown in Figure 6.
- the outer rame 12 is in turn connected to the support structure 16 with another set of torsional hinges 18.
- There are four electrodes under the central mirror 10 that can be actuated resulting in a 2D tilt of the mirror-frame assembly.
- US Patent Application Publication No: US2002/0071169 Al, publication date June 13, 2002 One of the shortcomings of this design is the inability to achieve high fill factors (that is the spacing between two consecutive mirrors or the ratio of the active area to the total area in an array) in a mirror array.
- FIG. 7 A schematic of an example of such a device is shown in Figure 7. Although this device structure can yield high fill factor arrays, the fabrication processes are very complex.
- references are made to US Patent No 5,061,049, US Patent No 5,079,545, US Patent No 5,105,369, US Patent No 5,278,652, US Patent No 4,662,746, US Patent No 4,710,732, US Patent No 4,956,619, US Patent No 5,172,262, and US Patent No 5,083,857.
- FIG. 8 An example of a MEMS tilt platform is supported by a flexible post 30 as shown in Figure 8.
- the post 30 extends within a moat 32 or trench formed in the substrate or supporting material 34.
- the post 30 can be made sufficiently long and flexible to act as a unidirectional hinge, bending to allow the mirror 36 to be positioned with two degrees of freedom.
- the cantilever part of the device can also be used for capacitive or optical sensing of mirror position.
- the invention provides a micro-electro-mechanical-system (MEMS) mirror device, comprising: a mirror having a 2-dimensional rotational articulated hinge at a first end, and having a 1-dimensional rotational articulated hinge at a second end opposite the first end; a movable cantilever connected to the mirror through the 1-dimensional rotational articulated hinge; a support structure connected to the mirror through the 2-dimensional rotational articulated hinge and connected to the movable cantilever; whereby movement of said movable cantilever causes rotation of the mirror in a first axis of rotation, and the mirror is also rotatable about a second torsional axis of rotation perpendicular to said first axis of rotation.
- MEMS micro-electro-mechanical-system
- the 2-dimensional rotational articulated hinge comprises: a first 1-dimensional rotational articulated hinge having a first mounting point at a first end and having a second end; a second 1-dimensional rotational articulated hinge having a second mounting point at a first end and having a second end, the second end of the first 1- dimensional rotational articulated hinge being connected to the second end of the second 1-dimensional rotational articulated hinge; a third 1-dimensional rotational articulated hinge connected to the second ends of the first and second articulated 1-dimensional rotational hinges; whereby the first 1-dimensional rotational articulated hinge and the second 1- dimensional rotational articulated hinge define the first axis of rotation between the first and second mounting points, and the third 1-dimensional rotational articulated hinge and the 1- dimensional rotational articulated hinge at the second end of the mirror defines the second torsional axis of rotation perpendicular to the first axis of rotation.
- each 1-dimensional rotational articulated hinge comprises a respective articulated beam having a large thickness to width aspect ratio.
- the beams are formed of a unitary construction.
- the beams of silicon, the mirror, and the movable cantilever are formed of a unitary construction.
- the articulated hinges may be made of deposited materials such as polysilicon, silicon nitride or any other depositable material, and the mirror, and the movable cantilever are formed of a unitary construction.
- the mirror has an angular range of motion of at least 0.5 degrees in each axis.
- other ranges of motion are not excluded.
- the device further comprises electrodes for applying electrostatic force to the mirror so as to move the mirror in the first and second axes of rotation.
- the electrodes comprise two electrodes for applying electrostatic force to the mirror so as to move the mirror in the second axis of rotation, and at least one electrode for applying electrostatic force to the movable cantilever so as to move the mirror in the second rotational axis.
- the mirror is made of silicon plated with a metal .
- the metal comprises Au, Al or Cu layers.
- the plurality N of devices are arranged side by side to form a IxN MEMs array, where N>2.
- the plurality NxM of devices are arranged in N rows of M devices thereby forming an NxM MEMs array, where N>2 and M>2.
- the mirror is used for optical switching and the movable cantilever is used for capacitive or optical sensing of mirror position.
- the invention provides an optical switch comprising: a plurality of optical ports; a plurality of devices as summarized above each adapted to switch light between a respective pair of said optical ports .
- the invention provides a 2-dimensional rotational articulated hinge for connection to a support structure and a device to be rotated, the hinge comprising: a first 1-dimensional rotational articulated hinge having a first mounting point at a first end and having a second end; a second 1-dimensional rotational articulated hinge having a second mounting point at a first end and having a second end, the second end of the first 1-dimensional rotational articulated hinge being connected to the second end of the second 1-dimensional rotational articulated hinge; a third 1-dimensional rotational articulated hinge connected to the second ends of the first and second articulated 1- dimensional rotational hinges; whereby the first 1-dimensional rotational articulated hinge and the second 1-dimensional rotational articulated hinge define a first axis of rotation between the first and second mounting points, and the third 1- dimensional rotational articulated hinge and the 1-dimensional rotational articulated hinge at the second end of the mirror defines a second torsional axis of rotation perpendicular to the first axis of rotation.
- each 1-dimensional rotational articulated hinge comprises a respective articulated beam of silicon having a high thickness to width aspect ratio.
- the beams of silicon are formed of a unitary construction.
- the articulated hinges can be formed of deposited material such as polysilicon, silicon nitride etc with low thickness to width ratio.
- each of the articulated hinge may be a single beam of unitary construction of a deposited material or materials.
- Figure 1A and Figure IB provide two views of a conventional 1 dimensional MEMS mirror with an articulated suspension structure
- Figure 2 shows the device of Figure 1 in two rotational states
- Figure 3A is a plan view of a two dimensional articulated rotational hinge provided by an embodiment of the invention.
- Figure 3B illustrates a MEMS mirror featuring the two dimensional rotational articulated hinge of Figure 3A;
- Figure 4A is a view of a mirror with a two dimensional rotational articulated hinge and moving cantilever mounting system provided by an embodiment of the invention
- Figure 4B provides a cutaway and side sectional view of a mirror with a two dimensional rotational articulated hinge and moving cantilever mounting system provided by another embodiment of the invention
- Figure 5 is a one dimensional MEMS array of devices like the device of Figure 4A;
- Figure 6 is a view of a conventional two dimensional gimbal mirror with a supporting frame;
- Figure 7 is a representative sketch of a MEMS mirror with a hidden hinge structure
- Figure 8 is a representative sketch of a 2D mirror mounted on a single moving flexible post .
- FIG. 1A and IB A known ID MEMS torsional mirror supported by articulated suspension springs/hinges is shown in Figures 1A and IB.
- This arrangement consists of a support structure 30 within which is mounted a mirror 34 connected to the support • structure 30 through two articulated hinges 36.
- the articulated hinges 36 consist of a silicon beam with a high aspect ratio of length to width thereby allowing torsional rotation. Using articulation allows a long silicon beam to be provided in a very small space.
- a pair of address electrodes 38 and 40 are also shown. These would be connected to control systems capable of applying voltages to the electrode. Typically the mirror arrangement would be attached to ground.
- the mirror 34 can be rotated around its rotational axis ( ⁇ x) 32 by applying electrostatic force on either side of the mirror using the electrodes 38,40. This is shown in Figure 2.
- Generally indicated at 50 is the mirror in a first configuration where the mirror has been rotated counter clockwise about the rotational axis 32 and generally indicated at 52 shows the same arrangement in which the mirror has been rotated clockwise about the rotational axis 32.
- an embodiment of the invention provides a 2D rotatable articulated hinge.
- a top view of the new articulated hinge is shown in Figure 3A.
- the 2D rotatable articulated hinge includes a first articulated hinge portion 60 and a pair of second articulated hinges 62,63.
- Each of the second articulated hinges 62,63 is connectable to a support structure indicated generally at 64 and is also connected to the first articulated hinge 60.
- Each of the three articulated hinges 60,62,63 is similar to the conventional articulated hinge 36 of Figure 1A.
- each articulated hinge consists of a silicon beam with high aspect ratio thickness to width.
- the entire arrangement consisting of the three articulated hinges 60,62,63 is preferably made from a single unitary piece of silicon.
- the arrangement is made of a deposited material such as PolySi, Silicon Nitride, Silicon dioxide, and Metallic depositable materials. Other materials may be employed.
- the construction is unitary in the sense that no assembly is required.
- the beams may be made of multiple materials, for example in a layered structure.
- the first articulated hinge 60 allows rotation along a first torsional axis ( ⁇ x) while the second and third articulated hinges allow rotation about a second axis ( ⁇ z) .
- any suitable dimensions for the articulated hinges may be employed. Different numbers of articulations can be employed. The more articulations included in a given articulated hinge, the less will be the required force to cause rotation about the respective axis. In an example implementation, the dimensions of the various hinges are as follows :
- Hinge 62 and 63 ⁇ 75 urn (L) , 1.5 um (W) , 15 um (T) , 5 um (Gap) and 3 (articulations) ⁇ ;
- Hinge 60 and 74 ⁇ 75 um (L), 1.5 um (W) , 15 um (T) , 5 um (Gap) and 11 (articulations) ⁇
- the articulated hinge is generally indicated by 70 and is connected to a mirror 72 at the opposite end of which there is another ID articulated hinge 74.
- the entire arrangement of Figure 3B is made from a single piece of silicon.
- the arrangement as shown in Figure 3 allows the mirror 72 to rotate about the main rotational axis ( ⁇ x) and the additional rotational axis ( ⁇ z) which is orthogonal to the main rotational axis.
- Figure 3B the arrangement of Figure 3B is employed in an apparatus illustrated by way of example in Figure 4A.
- the 2D rotation articulated hinge 70 is shown connected to the mirror 72 and ID rotational articulated hinge 74.
- a support structure is generally indicated by 76.
- the 2D rotational articulated hinge 70 is connected in two places 78,80 to the support structure.
- the ID rotational articulated hinge 74 is connected to the support structure 76 through a cantilever 80.
- the cantilever is preferably simply another piece of silicon which is connected to the support structure 76 at 82 in a manner which allows substantially no rotation of this cantilever about the main rotational axis ( ⁇ x) .
- the cantilever 80 does have some flexibility, and in particular, the end 87 of the cantilever 80 most remote from the connection 82 to the support structure is capable of some up and down motion. To allow additional flexibility of the cantilever 80, parts may be removed. In the illustrated example, the cantilever 80 includes a gap 89. near the mounting point 82 to support structure 76. This reduces the amount of force necessary to cause the up and down motion of point 87. To control rotation in the torsional axis ( ⁇ x) , electrodes are provided 84,85 which operate similar to the electrodes through 38,40 of Figure 1A. This allows the control of the rotation of the mirror 72 about the main torsional axis.
- an electrode 86 beneath the cantilever structure 80 which controls the up and down motion of the end 87 of the cantilever 80 most remote from the connection 82 to the support structure 76.
- the up and down motion of this point 87 causes rotation of the mirror 72 about the additional rotational axis ( ⁇ z) .
- the resulting deflection of the cantilever rotates the mirror around the second axis (formed by T-bar) thus making the mirror to tilt in both axes either simultaneously or independently.
- an additional support structure would need to be provided on top of the cantilever 80 with an additional electrode so that a force could be applied to cause the end of 87 of the cantilever 80 to move upwards.
- this additional degree of freedom may not be required.
- Figure 4B which is very similar to Figure 4A, with the exception of the additional support structure 91 and additional electrode 93 which allow an electrostatic force to be applied to the cantilever structure to move it both up and down.
- the embodiment of Figure 4A has employed the use of electrodes through which electrostatic forces can be applied to control rotation in the two rotational axes. More generally, any other type of force could also be employed in either or both of these rotational axes. For example thermal, magnetic, thermal bimorph or piezo-electric forces can be employed to achieve the required rotation and control .
- This combination of the 2D rotational articulated hinge, an articulated torsional mirror, and a moving cantilever results in a fully functional 2-D MEMS mirror.
- the cantilever can be deflected in either up or down directions depending on the arrangement of electrodes or force application, thus making the torsional mirror rotate about the second axis ⁇ z in either direction. For most electrostatic applications, the cantilever can be deflected downwards only to reduce the number of I/O's and control complexity.
- a number of mirrors can be placed side by side to make a linear mirror array with minimal spacing between two mirrors .
- An example of this is shown in Figure 5 where a linear array of four 2D torsional mirrors with 2D rotational articulated hinges and cantilevers 90,92,94,96 is shown. An arbitrary number could be included in such an array.
- Another embodiment provides a two dimensional array of NxM such mirror devices .
- One of the main advantages of the structure of Figure 4 is the minimal coupling between the two tilt axes.
- This device structure can be used in any number of applications. It can be used as a single mirror for any appropriate application of a single or multi-array configuration.
- the arrangement achieves a high fill factor for mirror arrays (that is the spacing between two consecutive mirrors in an array) and is very simple to fabricate.
- the spacing between two mirrors can be as low as few microns or as limited by microfabrication processes.
- the device can be fabricated with existing MEMS fabrication processes.
- a few of the suitable processes that are commercially available are "Optical IMEMS R from Analog Devices - Inc ( see Thor Juneau, et al, 2003, Single-Chip 1x84 MEMS Mirror Array For Optical Telecommunication Applications' , Proceeding of SPIE, MOEMS and Miniaturized Systems III, 27-29 January 2003, Vol. 4983, pp. 53-64.), SOI MUMPS (http : //www.memsrus . com/figs/soimumps .pdf) from Cronos (MEMScAP subsidiary) .
- a custom process can also be put together to fabricate the device.
- control system would be provided to control the rotation of the mirror in the two degrees of freedom. This would be controlled through the proper application of the forces through the various electrodes.
- the control system will preferably be an open loop system with a voltage look-up table for various tilt position or a closed loop system with capacitance or optical sensing.
- the mirrors in the above employed embodiments need to have a reflective coating, for example of Au, Al, or Cu in one of more layers .
- the mirrors are used to perform the main switching of beams of light.
- the cantilever portion could also have a reflective coating.
- the cantilever and/or mirror components could be used for capacitive or optical sensing.
- the mirror components might be used for switching, while the cantilever components are used to perform sensing with signals generated to perform feedback control over the orientation of the mirrors .
Abstract
L'invention concerne un dispositif miroir à système micro-électro-mécanique (MEMS) comprenant un miroir ayant, à une première extrémité, une articulation rotative bidimensionnelle et, à la deuxième extrémité opposée à la première extrémité, une articulation rotative unidimensionnelle; un élément en porte-à-faux mobile relié au miroir par l'articulation rotative unidimensionnelle; une structure support connectée au miroir par l'articulation rotative bidimensionnelle et connectée à l'élément en porte-à-faux mobile. Le mouvement de cet élément en porte-à-faux mobile engendre la rotation du miroir dans un premier axe de rotation, et le miroir tourne également autour d'un deuxième axe de rotation perpendiculaire au premier axe de rotation.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46497203P | 2003-04-24 | 2003-04-24 | |
PCT/CA2004/000598 WO2004094301A1 (fr) | 2003-04-24 | 2004-04-20 | Miroir bidimensionnel a systeme micro-electro-mecanique ayant des structures de suspension articulees destinees a des reseaux a facteur de remplissage eleve |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1620350A1 true EP1620350A1 (fr) | 2006-02-01 |
Family
ID=33310985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04728310A Withdrawn EP1620350A1 (fr) | 2003-04-24 | 2004-04-20 | Miroir bidimensionnel a systeme micro-electro-mecanique ayant des structures de suspension articulees destinees a des reseaux a facteur de remplissage eleve |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1620350A1 (fr) |
JP (1) | JP2006524349A (fr) |
CA (1) | CA2522790C (fr) |
WO (1) | WO2004094301A1 (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101484435B1 (ko) | 2003-04-09 | 2015-01-19 | 가부시키가이샤 니콘 | 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
TWI609409B (zh) | 2003-10-28 | 2017-12-21 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造方法 |
TWI385414B (zh) | 2003-11-20 | 2013-02-11 | 尼康股份有限公司 | 光學照明裝置、照明方法、曝光裝置、曝光方法以及元件製造方法 |
TWI505329B (zh) | 2004-02-06 | 2015-10-21 | 尼康股份有限公司 | 光學照明裝置、曝光裝置、曝光方法以及元件製造方法 |
US7911672B2 (en) * | 2006-12-26 | 2011-03-22 | Zhou Tiansheng | Micro-electro-mechanical-system micromirrors for high fill factor arrays and method therefore |
CA2764403C (fr) * | 2007-04-19 | 2014-02-11 | Nippon Telegraph And Telephone Corporation | Element micromiroir, et reseau de micromiroirs |
US8451427B2 (en) | 2007-09-14 | 2013-05-28 | Nikon Corporation | Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method |
JP5267029B2 (ja) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | 照明光学装置、露光装置及びデバイスの製造方法 |
US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
KR101708943B1 (ko) | 2007-11-06 | 2017-02-21 | 가부시키가이샤 니콘 | 제어 장치, 노광 방법 및 노광 장치 |
KR20160092053A (ko) | 2007-11-06 | 2016-08-03 | 가부시키가이샤 니콘 | 조명 광학계, 노광 장치 및 노광 방법 |
JP5326259B2 (ja) | 2007-11-08 | 2013-10-30 | 株式会社ニコン | 照明光学装置、露光装置、およびデバイス製造方法 |
WO2009078223A1 (fr) | 2007-12-17 | 2009-06-25 | Nikon Corporation | Unité de modulation spatiale de lumière, système d'éclairage optique, dispositif d'alignement et procédé de fabrication de dispositif |
TW200929333A (en) | 2007-12-17 | 2009-07-01 | Nikon Corp | Illumination optical system, exposure apparatus, and device manufacturing method |
WO2009125511A1 (fr) | 2008-04-11 | 2009-10-15 | 株式会社ニコン | Unité de modulation spatiale de la lumière, système optique d'éclairage, aligneur et procédé de fabrication du dispositif |
WO2009132440A1 (fr) | 2008-04-29 | 2009-11-05 | Micralyne Inc. | Dispositif de microsystème électromécanique (mems) présentant une rotation indépendante dans deux axes de rotation |
WO2009145048A1 (fr) | 2008-05-28 | 2009-12-03 | 株式会社ニコン | Dispositif et procédé d'inspection pour modulateur spatial de lumière, système optique d'éclairage, procédé de réglage de ce système optique d'éclairage, dispositif d'exposition et procédé de fabrication de dispositif |
US8264666B2 (en) | 2009-03-13 | 2012-09-11 | Nikon Corporation | Exposure apparatus, exposure method, and method of manufacturing device |
US20110037962A1 (en) | 2009-08-17 | 2011-02-17 | Nikon Corporation | Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method |
US9389519B2 (en) | 2010-02-25 | 2016-07-12 | Nikon Corporation | Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method |
US20110205519A1 (en) | 2010-02-25 | 2011-08-25 | Nikon Corporation | Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method |
JP2012004465A (ja) | 2010-06-19 | 2012-01-05 | Nikon Corp | 照明光学系、露光装置、およびデバイス製造方法 |
KR101701219B1 (ko) * | 2013-03-11 | 2017-02-01 | 인텔 코포레이션 | Mems 스캐닝 미러 시야 제공 방법 및 장치 |
Family Cites Families (3)
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---|---|---|---|---|
US6201629B1 (en) * | 1997-08-27 | 2001-03-13 | Microoptical Corporation | Torsional micro-mechanical mirror system |
US6075239A (en) * | 1997-09-10 | 2000-06-13 | Lucent Technologies, Inc. | Article comprising a light-actuated micromechanical photonic switch |
US6431714B1 (en) * | 2000-10-10 | 2002-08-13 | Nippon Telegraph And Telephone Corporation | Micro-mirror apparatus and production method therefor |
-
2004
- 2004-04-20 WO PCT/CA2004/000598 patent/WO2004094301A1/fr active Application Filing
- 2004-04-20 JP JP2006504118A patent/JP2006524349A/ja active Pending
- 2004-04-20 CA CA2522790A patent/CA2522790C/fr not_active Expired - Lifetime
- 2004-04-20 EP EP04728310A patent/EP1620350A1/fr not_active Withdrawn
Non-Patent Citations (1)
Title |
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See references of WO2004094301A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2006524349A (ja) | 2006-10-26 |
CA2522790C (fr) | 2013-12-03 |
CA2522790A1 (fr) | 2004-11-04 |
WO2004094301A1 (fr) | 2004-11-04 |
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