EP1593412A1 - Snowboard - Google Patents

Abstract

The snowboard has an upper protection layer (3) covering the inner structure of the board, where the inner structure has a core (5) and a support (10). A metallic plate (2) placed between the layer (3) and the structure is located at the level of a transparent zone (4) of the layer (3). The plate has a traversing recess (12), on its upper side, inside which the layer (3) and the support penetrate to form hollow zones.

Description

Technical area

The invention relates to the field of snow sliding sports. She aims more particularly a board structure incorporating a metal element visible through the upper layer of protection, conferring effects of decor in volume particularly attractive.

Previous techniques

In general, a board for gliding on snow, such as a ski, a surf or equivalent, has an internal structure that is composed of a core optionally covered with one or more reinforcements generally fibrous. This internal structure is covered with a protective upper layer which comprises usually the decor of the upper face. This decor can be obtained by silk screen on the underside of this layer of different colored patterns, which show through this layer of protection.

It is conceivable that the screen printing methods make it possible to produce patterns of a great variety, but which are exclusively blueprints, since they are made on the underside of this protective layer. In some cases, we can get relief effects when the underside of the protective layer is deformed by the texture of the underlying fibrous reinforcement. However, these deformations are of very limited motives, since they are generated by slight variations thickness of the reinforcement which is generally a textile structure.

One of the objectives of the invention is thus to allow the formation of effect with elements that are easy to handle in the context of processes for making the boards, and which make it possible to obtain at leisure multiple relief effects.

Presentation of the invention

The invention therefore relates to a gliding board especially on snow which has a protective upper layer covering the internal structure of the board. This internal structure includes a core and possible reinforcements.

According to the invention, this board is characterized in that has a metal plate disposed between the upper layer and the internal structure of the board. This plate is located at the level of a zone transparency of the upper layer of protection, that is to say in an area through which the underlying elements are apparent. This plate has at least one recess, made on its upper face, and on the inside from which penetrates the material of the upper layer of protection.

In other words, the characteristic wafer has recessed areas which are visible from the top of the board, these recessed areas being filled partially or totally by the polymeric material that forms the layer superior protection. In this way, this material, marrying substantially the forms hollow areas, generates meniscuses that increase the feeling of relief by magnifying effects.

The use of metallic materials for the wafer makes it possible to obtain reflecting effects which may vary depending on the degree of polishing or brushing or more generally the surface state of the wafer. This piece metal also has the advantage of withstanding high pressures and temperatures observed during the various operations, particularly injection implemented during the manufacture of the board.

In practice, it is possible to make hollow areas that match patterns very varied. In particular, it is possible to make recesses that are through, and then let appear the internal structure of the board to through the upper layer of protection. These recesses can be made in different ways, and especially by machining or in a preferred manner by chemical etching.

In practice, the material used to make the wafer is based on a metal selected from the group consisting of aluminum, stainless steel, nickel or brass in particular. These metals can be used alone or in alloy. We can in particular, the alloys known under the name ARCAP (copper-based, nickel, tin, zinc, manganese, aluminum, lead, iron or titanium). The plate can have a thickness between 0.1 and 0.8 millimeters depending on the depth reasons that one wishes to achieve.

In practice, the wafer can be glued under the upper layer of protection by means of a hot-melt film, thus allowing the manipulation of the upper layer of protection during the operations of setting place in a mold.

In the particular case where the recesses of the wafer are through, and that the board includes a reinforcement, this reinforcement can penetrate partially inside of the wafer recess, and in turn form a meniscus that increases the relief effects.

Advantageously in practice, the upper face of the wafer can also include an identification mark of the board, which may be individualized by the aforementioned engraving or machining processes previously.

Brief description of the figures

La figure 1 est une vue générale en perspective sommaire de la zone avant d'un ski équipé de la plaquette caractéristique.

Les figures 2 et 3 sont des vues en coupe de planche de glisse équipées de plaquettes caractéristiques possédant des évidements respectivement traversants et non traversants.

The manner of carrying out the invention, as well as the advantages which result therefrom, will emerge from the description of the embodiments which follow, in support of the appended figures, in which:

Figure 1 is a general perspective perspective view of the front area of a ski equipped with the characteristic wafer.

Figures 2 and 3 are sectional views of gliding board equipped with characteristic plates having recesses respectively through and not through.

Way of realizing the invention

As already mentioned, the invention can be implemented on different types gliding board and in particular skis or surfboards.

The front of the ski (1) illustrated in Figure 1 has a plate (2) characteristic arranged under the upper protective layer (3) in a zone (4) where the latter is transparent. More specifically, this upper layer of protection (3) covers the internal structure of the board formed of the core (5), possible lateral reinforcement elements (6) and a sole. However, other types of structure can accommodate a top layer of protection (3) without the invention therefore being limited to the form illustrated in FIG.

The upper protective layer (3) made from a material conventional polymer, generally has on its underside a layer of lacquer or other pigment defining totally planar patterns.

The absence of this layer of lacquer in the transparent zone (4) makes it possible to leaving visible the reinforcement (10) which is generally made of a fibrous web, and for example a fiberglass fabric impregnated with an epoxy resin, or a thermoplastic resin.

As illustrated more specifically in FIG. 2, the characteristic wafer (2) has a recess (12) dug through the plate (2). This recess can be achieved in different ways, especially by etching techniques chemical thanks to which it is possible to control the depth of the recess. Other machining techniques, or even laser engraving can be employed, particularly in the case where the recess (12) is through, as illustrated in Figure 2.

Chemical etchings linking different stages of masking allow to generate possibly recesses with several levels depth, thus increasing the relief effects.

As illustrated in FIG. 2, during the molding operations, the layer upper protection (3) tends to penetrate slightly inside the the recess (12) to form a recessed area or meniscus. This meniscus (13) comes into contact with a complementary meniscus (14) formed in the reinforcement (10) which penetrates into the recess (12) from below.

An adhesive film (21) allows the bonding of the wafer (2) under the layer protective cover (3), to facilitate handling of the assembly during molding operations.

Insofar as the reinforcement (10) is pre-impregnated with a resin, a film barrier (16) is interposed between the reinforcement (10) and the upper protective layer (3), passing under the plate (2). This barrier film (16) makes it possible to avoid any migration and agglomeration of resin under the upper protective layer (3).

As already mentioned, the meniscus (14) formed by the reinforcement (10) at the level of the recess (12) makes the curvature of the fibers that compose it all the more visible that the meniscus (13) of the upper protective layer plays a magnifying effect.

Embossing effects can also be achieved by using platelets which have non-through recesses as illustrated in Figure 3. Such recess (22) is lightly filled by the meniscus (23) formed by the protection (3). To facilitate the positioning of the wafer (20), an adhesive film (21) can be placed on the upper face of the wafer (20) to ensure gluing the underside of the upper protective layer (3).

Multiple patterns can be made on the apparent face of the wafer feature. Among these reasons, we can realize distinctive signs of the manufacturer's mark of the board.

In a more personalized way, it is possible to realize distinctive signs to identify a particular rental or leisure organization owner of the gliding board. At a higher level of customization, these patterns may include an individual and unique indication, thus allowing to identify the ski by a number or the name of its owner eventually. This identification has a character of inviolability, since it is necessary to destroy the upper layer of protection if it is desired to eliminate it.

It follows from the foregoing that the boards according to the invention the advantage of being able to benefit from decorative effects with relief aspects three-dimensional, while being relatively simple to implement.

Claims (9)

Gliding board (1) in particular on snow having an upper protective layer (3) covering the internal structure of the board, including the core (5) and any reinforcements (10), characterized in that : it comprises a metal plate (2) disposed between the upper protective layer (3) and the internal structure of the board, said wafer (2) is located at a transparent zone (4) of the upper protective layer (3), said plate (2) has at least one recess (12) formed on its upper face, inside which penetrates the material of the upper protective layer (3). Gliding board according to claim 1, characterized in that the or recesses (12) are through and reveal the internal structure of the board through the upper protective layer (3). Gliding board according to claim 1, characterized in that the plate (2) is glued under the upper protective layer (3) by means of an adhesive film (21). Gliding board according to claim 1, the internal structure of which includes at least one reinforcement (10), characterized in that the reinforcement (10) located under the upper protective layer (3) partially penetrates inside the recess. (12) of the wafer (2). Gliding board according to claim 4, characterized in that it comprises a film (16) interposed between the wafer (2) and the reinforcement (10). Gliding board according to claim 1, characterized in that the recess is made by chemical etching. Gliding board according to claim 1, characterized in that the plate is made of a material based on a metal selected from the group consisting of aluminum, stainless steel and brass. Gliding board according to claim 1, characterized in that the wafer has a thickness of between 0.1 and 0.8 mm. Gliding board according to claim 1, characterized in that the upper face of the plate (2) comprises an identification mark of the board.

Images