EP1588405A2 - Carrier, holder, laser cutting device and method for separating semiconductor products using laser light - Google Patents
Carrier, holder, laser cutting device and method for separating semiconductor products using laser lightInfo
- Publication number
- EP1588405A2 EP1588405A2 EP04703293A EP04703293A EP1588405A2 EP 1588405 A2 EP1588405 A2 EP 1588405A2 EP 04703293 A EP04703293 A EP 04703293A EP 04703293 A EP04703293 A EP 04703293A EP 1588405 A2 EP1588405 A2 EP 1588405A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- plate
- carrier
- products
- holes
- semiconductor products
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000003698 laser cutting Methods 0.000 title claims description 6
- 238000005520 cutting process Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light.
- the invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
- the foil When the semiconductor components are separated with laser light, the foil remains (at least substantially) intact, so that even after the assembly of semiconductor products has been cut through the semiconductor components are still connected to each other by the foil layer.
- the problem of positioning semiconductor components of limited dimensions (for instance with a surface area of less than 0.36 mm 2 ) can thus be solved using the foil.
- the drawback however is that arranging and removing the foil are costly operations.
- the foil material also has the effect of increasing cost price.
- the separated semiconductor products can be contaminated by for instance glue residues that are left behind.
- the international patent application WO 01 75966 describes a method of separating objects by means of a laser and water beam. Prior to cutting, the objects are arranged for this purpose on a carrier provided with adhesive. The laser and water beam is displaced over the object along a contour for cutting out in order to separate the products, whereafter the cut-out products still adhering to the carrier are available for further processing.
- the carrier can be permeable for laser radiation.
- a specific embodiment variant describes a carrier embodied as a mat which makes use, among other things, of underpressure for a further processing of the cut-out products.
- the object of the present invention is to simplify and make cheaper the separation of semiconductor products by means of laser cutting.
- the invention provides for this purpose a carrier for supporting and engaging semiconductor products during separating of the products using laser light, comprising: a plate provided with a pattern of holes arranged in a flat carrying side of the plate, which plate is manufactured from a material at least substantially not absorbing the laser light. Examples of such materials are glass and ceramic. A material at least partially permeable to laser light will not absorb any energy, or hardly any, from the laser light and will not therefore be damaged under the influence of the laser beam. By means of the pattern of holes an underpressure can be exerted on the assembly of semiconductor products (and, after separation, on the individual components), this being further elucidated hereinbelow.
- glass as material for the plate is that it is not expensive and, in addition, can be readily processed by means of micro-mechanical production techniques (for instance powder blasting). Boro-silicate glass is thus suitable for manufacturing a plate which can be applied in combination with a YAG laser (1064 nm).
- a YAG laser 1064 nm
- zinc selenide embodied as a ceramic material
- CO 2 laser 10600 nm
- calcium fluoride likewise embodied as a ceramic material
- UV laser 354 nm
- laser light is understood to mean electromechanical radiation in a single colour, or electromechanical radiation comprising substantially a single wavelength.
- carriers can be manufactured with a very large number of holes (up to more than 100 holes per cm 2 ) with great precision in respect of dimensioning.
- the use of adhesive foil becomes unnecessary due to the carrier according to the invention, which has the effect of reducing cost and whereby the problem of glue residues being left on semiconductor products is obviated.
- the cross-sections through the holes close to the carrying side of the plate are larger than at a distance from the carrying side. This is the case when the holes have a top angle between 15 and 45°, preferably a top angle of 30°.
- the surface area of the assembly of semiconductor products on which an underpressure is exerted can thus be enlarged, with the advantage that the assembly of semiconductor products is drawn with a greater force against the plate. This results in improved engaging of the assembly of semiconductor products and the separated components.
- the pattern of holes will generally be grid-shaped as the semiconductor products are generally also placed in a grid form on the assembly of semiconductor products.
- each product After separation of the products, each product must still cover at least one hole of the pattern of holes such that using this covered hole an underpressure is still exerted on the product for positioning thereof.
- the carrier can have product-related dimensions (in particular the pattern of holes) although it is also possible to envisage that diverse products with the same carrier can be processed, provided account is taken in the design of the placing of the semiconductor products in the assembly of semiconductor products.
- the invention also provides a holder for supporting and engaging semiconductor products during separating of the products using laser light, comprising a carrier as described above and means for generating underpressure connecting onto the side of the plate remote from the carrying side.
- a holder for supporting and engaging semiconductor products during separating of the products using laser light comprising a carrier as described above and means for generating underpressure connecting onto the side of the plate remote from the carrying side.
- such means for generating underpressure connecting onto the side of the plate remote from the carrying side are formed by a chamber connecting onto the carrier and an extractor connecting onto the chamber.
- the means for generating underpressure can be thus connected in simple manner to all holes in the carrier.
- the chamber is preferably also provided with positioning means for the carrier, so that the carrier can be correctly positioned in simple manner relative to the means for generating underpressure. Also an advantage is that the carrier can thus be mounted for easy exchange with the means for generating underpressure.
- the invention furthermore provides a laser cutting device for supporting and engaging semiconductor products during separating of the products using laser light, provided with a holder as described, wherein the laser source is located on the carrying side of the plate.
- the laser source is located on the carrying side of the plate.
- the laser beam comes into direct contact with the assembly of semiconductor products. It must be possible to displace the plate and the laser beam in precisely controllable manner relative to each other with displacing means in order to thus be able to determine precisely the position of separation of the assembly of semiconductor products.
- the invention further provides a method for supporting and engaging semiconductor products during separating of the products using laser light, comprising the processing steps of: A) placing an assembly of semiconductor products for separating onto a flat plate provided with a pattern of holes, B) applying an underpressure to the holes of the pattern of holes such that the assembly of semiconductor products is drawn against the plate, C) directing at least one laser beam onto the assembly and cutting through the assembly where this is desired by means of mutual displacement of the laser source and the flat plate such that each severed semiconductor product is still connected to at least one hole in the flat plate, and D) taking the separated products from the plate.
- the assembly of semiconductor products often has a form deviating slightly from flat as a result of heating during previous processing steps.
- an assembly of semiconductor products which is warped to some extent can be made flat once again before the cutting operation begins.
- the assembly of semiconductor products is preferably drawn against the plate during processing step B) such that possible deviations in the flatness in the contact side of the assembly are removed by the suction of the plate. It will be apparent that this will have a positive effect on the accuracy during separation.
- figure 1 shows a view of the carrier according to the invention
- figure 2 shows a perspective view of a holder according to the invention
- figure 3 is a perspective view of a holder according to the invention with a lead frame placed thereon from which a number of semiconductor products have been released
- figure 4 shows a view of a cross-section through a part of a carrier.
- Figure 1 shows a carrier 1 manufactured from a transparent material which can hardly be activated by laser light.
- Arranged in carrier 1 is a grid-like pattern of holes 2 built up of individual holes 3 with which an assembly of semiconductor products, not shown in this figure, can be engaged.
- FIG. 2 shows a holder 4 according to the invention of which a carrier 5 forms part. Holes 6 in carrier 5 are shown schematically.
- a vacuum chamber 7 is provided with a central opening 8 to which a pump 11 connects via a throughfeed 9 and a pipe 10.
- pump 11 By activating pump 11 an underpressure can be generated in vacuum chamber 7, at least when carrier 5 connects onto chamber 7. The consequence is that air will then be drawn in through holes 6.
- an underpressure will be exerted on assembly 12 by the holes.
- FIG. 3 shows a lead frame 13 having a housing 14 injected thereon with which a plurality of semiconductor products (not shown) are encapsulated. Such a unit has already been designated above as an assembly of semiconductor products.
- Lead frame 13 is sucked down by openings 15 in a carrier 16. It is noted that some of the openings 15 in carrier 16 are not covered by lead frame 13; this is not a problem however, at least when the means for generating an underpressure on the non- visible side of carrier 16 are sufficiently powerful.
- Also shown in this figure are cutting lines 17 in housing 14 where separation of the individual semiconductor products 18 has taken place.
- figure 4 shows a cross-section through a part of carrier 16, wherein an opening 15 is shown in more detail.
- the opening 15 On a carrying side 19 of carrier 16 the opening 15 has a larger cross-section than at a greater distance from the carrying side 19. Opening 19 thus forms a kind of cup whereby the area is relatively large over which underpressure can be applied to an assembly of semiconductor products 12 (figure 2) or to already separated products 18 (figure 3).
- blow air can be carried through opening 15 in a direction opposite to the suction during underpressure situations.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1022463A NL1022463C2 (en) | 2003-01-22 | 2003-01-22 | Support, holder, laser cutting device and method for separating semiconductor products with the aid of laser light. |
NL1022463 | 2003-01-22 | ||
PCT/NL2004/000040 WO2004066369A2 (en) | 2003-01-22 | 2004-01-19 | Carrier, holder, laser cutting device and method for separating semiconductor products using laser light |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1588405A2 true EP1588405A2 (en) | 2005-10-26 |
Family
ID=32768719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04703293A Withdrawn EP1588405A2 (en) | 2003-01-22 | 2004-01-19 | Carrier, holder, laser cutting device and method for separating semiconductor products using laser light |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060231454A1 (en) |
EP (1) | EP1588405A2 (en) |
JP (1) | JP2006517730A (en) |
KR (1) | KR20050099506A (en) |
CN (1) | CN1742359A (en) |
NL (1) | NL1022463C2 (en) |
TW (1) | TW200417101A (en) |
WO (1) | WO2004066369A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1027929C2 (en) * | 2004-12-31 | 2006-07-03 | Fico Bv | Holder for supporting objects such as electronic components during separation using laser, comprises gas permeable flexible layer located above suction holes in support |
US7642485B2 (en) | 2005-01-26 | 2010-01-05 | Disco Corporation | Laser beam processing machine |
DE102005046031B3 (en) | 2005-09-26 | 2007-07-12 | Schott Ag | Process for separating parts from a substrate |
JP4580444B2 (en) * | 2006-09-27 | 2010-11-10 | 芝浦メカトロニクス株式会社 | Film cutting apparatus and film cutting method |
WO2013082076A1 (en) * | 2011-11-30 | 2013-06-06 | Corning Incorporated | Carrier for thin glass sheets and method of using |
DE102016106706A1 (en) * | 2016-04-12 | 2017-10-12 | Laser Imaging Systems Gmbh | Device for fixing objects by means of vacuum |
CN113547225A (en) * | 2020-04-22 | 2021-10-26 | 鸿鎷科技有限公司 | Precision ceramic workbench with quartz base |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028991U (en) * | 1983-08-02 | 1985-02-27 | 日本電気株式会社 | Laser processing equipment |
JPH03102850A (en) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | Wafer holder |
TW524873B (en) * | 1997-07-11 | 2003-03-21 | Applied Materials Inc | Improved substrate supporting apparatus and processing chamber |
JPH1140523A (en) * | 1997-07-22 | 1999-02-12 | Mitsubishi Electric Corp | Substrate cutting device and substrate cutting method |
JP2000164535A (en) * | 1998-11-24 | 2000-06-16 | Mitsubishi Electric Corp | Laser working device |
JP2000164536A (en) * | 1998-11-25 | 2000-06-16 | Disco Abrasive Syst Ltd | Chuck table |
US6885522B1 (en) * | 1999-05-28 | 2005-04-26 | Fujitsu Limited | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation |
DE50113122D1 (en) * | 2000-04-04 | 2007-11-22 | Synova Sa | METHOD FOR CUTTING AN OBJECT AND FOR CONTINUOUS PROCESSING OF THE CUTTING GOOD AND SUPPORT FOR HOLDING THE OBJECT OR BZW. THE CUTTING GOOD |
JP2002144070A (en) * | 2000-11-02 | 2002-05-21 | Tdk Corp | Device for supporting work for laser beam machining |
WO2002067300A2 (en) * | 2001-02-20 | 2002-08-29 | Micro Component Technology, Inc. | Singulation apparatus and method for manufacturing semiconductors |
-
2003
- 2003-01-22 NL NL1022463A patent/NL1022463C2/en not_active IP Right Cessation
-
2004
- 2004-01-19 CN CNA2004800026699A patent/CN1742359A/en active Pending
- 2004-01-19 EP EP04703293A patent/EP1588405A2/en not_active Withdrawn
- 2004-01-19 KR KR1020057013533A patent/KR20050099506A/en not_active Application Discontinuation
- 2004-01-19 JP JP2006500732A patent/JP2006517730A/en active Pending
- 2004-01-19 US US10/542,213 patent/US20060231454A1/en not_active Abandoned
- 2004-01-19 WO PCT/NL2004/000040 patent/WO2004066369A2/en active Search and Examination
- 2004-01-20 TW TW093101505A patent/TW200417101A/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2004066369A2 * |
Also Published As
Publication number | Publication date |
---|---|
TW200417101A (en) | 2004-09-01 |
WO2004066369A3 (en) | 2004-09-30 |
US20060231454A1 (en) | 2006-10-19 |
CN1742359A (en) | 2006-03-01 |
NL1022463C2 (en) | 2004-07-26 |
WO2004066369A2 (en) | 2004-08-05 |
JP2006517730A (en) | 2006-07-27 |
KR20050099506A (en) | 2005-10-13 |
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Legal Events
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