EP1520457A1 - Screening device for electronic subsassemblies on a printed circuit board - Google Patents

Screening device for electronic subsassemblies on a printed circuit board

Info

Publication number
EP1520457A1
EP1520457A1 EP03718802A EP03718802A EP1520457A1 EP 1520457 A1 EP1520457 A1 EP 1520457A1 EP 03718802 A EP03718802 A EP 03718802A EP 03718802 A EP03718802 A EP 03718802A EP 1520457 A1 EP1520457 A1 EP 1520457A1
Authority
EP
European Patent Office
Prior art keywords
shielding
circuit board
printed circuit
cap
shielding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03718802A
Other languages
German (de)
French (fr)
Other versions
EP1520457B1 (en
Inventor
Walter FÜRSICH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1520457A1 publication Critical patent/EP1520457A1/en
Application granted granted Critical
Publication of EP1520457B1 publication Critical patent/EP1520457B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating

Definitions

  • the invention relates to a shielding device with a shielding cap that covers an electronic circuit arranged on a printed circuit board, with an edge that is spaced from a component side of the printed circuit board by a gap, with a contact device that is arranged in the gap, and an electrical connection between the shielding cap and a conductive contour on the printed circuit board, tabs being formed on the edge of the shielding cap, through which the shielding cap is fixed on the printed circuit board and the contact device is held under elastic prestress.
  • Shield housings are used as interference suppressors, which dampen the radiation or the radiation of electromagnetic interference radiation.
  • the disturbing radiation on circuit boards can also be caused by assemblies that are located on the circuit board itself.
  • assemblies which are constructed using SMD technology interference sinks and interference sources are often in the immediate vicinity.
  • Multi-part shields in a small design are used to shield time-variable field sizes. They usually consist of a screen frame, which is divided into individual chambers by partitions and is soldered to the circuit board. In order to keep the electronic components covered by the shield accessible for test purposes, the shield frame is closed by a removable cover part. Since the frame part receives its mechanical stability only by soldering it onto the circuit board, it is necessary to handle the frame part and the cover part together when mounting these miniaturized shields. The assembly and removal of the lid are cumbersome and the assembly is time consuming.
  • a one-piece, metallic shield that can be plugged onto a printed circuit board is known from DE 29 808 620 Ul.
  • the attachment is done by locking hooks, which reach behind the circuit board on the back.
  • the ground contact of the shield with the circuit board is formed by a large number of resilient tabs. When a shielding trough is fitted, these tabs are under elastic prestress and establish the electrical contact through line or point contact. Under harsh operating conditions, sections of the contacting may fail due to mechanical influences or corrosion. In this case, the shielding efficiency of the interference suppressor is impaired.
  • Another disadvantage is that when installing the shield
  • the invention is based on the object of further developing a shielding device of the type mentioned at the outset in such a way that the shielding efficiency is improved and the manufacture, in particular the manufacture of shielding devices of different sizes, which only shield partial areas on the printed circuit board, is possible with less effort.
  • the contact device is formed by a sealing body arranged circumferentially in the gap, the sealing body being produced from an elastic, electromagnetic wave-absorbing material. Characteristic of the It is therefore the invention that the contact is made not by a large number of contact points with line or point contact, but by a flat sealing body made of an elastic material. Due to its compressibility, this adapts better to curvatures and unevenness of the printed circuit board. A low ohmic contact resistance of the ground contact is maintained even in the event of mechanical shocks or vibrations.
  • the sealing body that runs around the joint between the shield housing and the printed circuit board provides a seal, thus providing additional protection against dirt entering the interior of the shield.
  • the manufacturing tool for the shielding cap has a simpler structure. Setup costs for changes to the production tool are lower.
  • the shielding cap can be mass-produced inexpensively as a stamped and bent part made of sheet metal.
  • the sealing body can be a blank or a semi-finished product. Overall, the production can be adapted to a partial shielding of areas of different sizes on a printed circuit board with less effort.
  • the shielding cap is made of a metallic material, for example of tinplate, integrally and integrally with one another.
  • the tinplate can be protected by tinning.
  • the edge is formed as a right-angled bend which, when the shielding cap is in the installed state, runs essentially parallel to the component side and each flap is formed on the outside and on the starting side and is offset in the course of a wall of the shielding cap.
  • the sealing body being designed as a flat gasket and being attached to the edge of the shielding cap or the component side of the printed circuit board by means of an electrically conductive adhesive.
  • the shielding cap and seal can be handled as one part during assembly.
  • the shielding cap is cuboid-shaped with regard to the geometry to be shielded in the grid dimension of the printed circuit board. This uniform, modular design lowers manufacturing and logistics costs.
  • the shielding cap is provided with openings on a ceiling part and / or on a wall part, which form the passage opening for cooling air.
  • the size of the breakthroughs is adapted to the frequency spectrum to be shielded.
  • EMC materials which are polymeric materials, particularly preferably polyamide fleece, which is coated with metal or is knitted with a metal braid.
  • FIG. 1 shows an exploded perspective view of the shielding device according to the invention, in an embodiment in which the entire printed circuit board is covered by the shielding cap,
  • FIG. 2 shows an enlarged detailed illustration of the shielding cap from the underside
  • FIG. 3 shows a detailed illustration of an edge region of a shielding device mounted on a printed circuit board in a cross-sectional illustration
  • FIG. 4 shows a section of the conductive contour on the printed circuit board with contact points arranged offset.
  • the shielding device 1 consists of a shielding cap 20 and a contact device 6.
  • the shielding cap 20 covers the entire area of the printed circuit board 2 in the example shown.
  • the following explanations are not restricted to this embodiment, but In particular, screening is only partial
  • tabs 8 are formed on the edge 3 of the shielding cap 20 on the outer circumferential side, by means of which the shielding cap 20 can be fixed on a component side 4 of the printed circuit board 2.
  • a conductive contour 7 can be seen, the U crack of which corresponds to the edge region of the shielding cap 20.
  • the conductive contour 7 consists of contact points, which are explained in more detail below, and is produced in etching technology in grid dimensions.
  • the contact device 6 is designed as a circumferential seal 22. When the shielding device is installed, the shielding cap 20 is lowered onto the printed circuit board 2.
  • the elastic sealing body 22 is first pressed. Because of the good compression properties of the sealing material, the pressing requires only a small pressing force. A further lowering causes each end piece 9 of the tab 8 to pass through the passage opening and to protrude from the rear.
  • the cupboard flap protruding from the outlet opening is plastically deformed by a mutual bending. A positive connection is created between cap 20 and carrier 2. As already shown, the plastic deformation can also take place by bending, by embossing, or by upsetting.
  • the elastic sealing body 22 is pressed together in the gap between the cap edge and the component side.
  • the Installation requires only by virtue of a relatively low contact pressure due to the leiditen omprimiere s "of the D ⁇ ch- tung material.
  • the shielding hood is shown supply overlap in their broad side with an integrally formed fastening in its longitudinal side with two.
  • the through openings 15 for the ventilation of the interior are drawn in a greatly enlarged manner. In reality, the diameter of these bores is very small and is matched to the frequency of the alternating field to be shielded.
  • the shielding cap 20 is a one-piece bending element. Stamped part made of tin-plated tinplate.
  • the edge region of the shielding cap is drawn in an enlarged detail.
  • the edge 3 of the shielding cap 20 is continued by a right-angled bend 12.
  • the tab 8 is formed on the fold 12.
  • the end section 9 of the tab 8 is designed as a cabinet flap 11.
  • the tab 8 is pushed through the passage opening 10 of the printed circuit board 2.
  • the end section 9 is plastically deformed by mutual bending about an axis pointing in the direction of passage.
  • the cabinet flaps 11 engage behind the back of the printed circuit board 2.
  • the circumferential seal 22 also simultaneously protects the interior 18 against dust penetrating from the exterior 19 or against contamination. 3, the seal 22 is drawn as a flat seal 13. It is in the sealing gap 5 between
  • the flat seal 13 is coated on an upper side with an adhesive 14, whereby the seal and the shielding cap Assembly form a unit and are easier to handle.
  • the underside of the flat seal 13 lies along the conductive one
  • the conductive contour 7 is formed by dome-shaped contact points 21 which are electrically connected via a corresponding layout.
  • the pressure in the sealing gap 5 leads to an elastic one
  • the contact points 21 press into the underside of the flat gasket. This covering of the top surface of the contact point is very well protected against external influences. This counteracts corrosion in the contact area. The consequence of this is that the ohmic contact resistance of the ground contact can be kept equally low over a very long service life.
  • the contour 7 can also be formed by a continuous conductor track or by another contact pattern. Of course, it is also possible to coat the flat gasket 13 from the lower side with a conductive adhesive.
  • the arrangement of the dome-shaped contact points 21 along the conductive contour 7 is shown enlarged in a top view in FIG.
  • the contact points 21 are staggered.
  • the distance between the contact points in the longitudinal extension of the ground contact is four millimeters, for example.
  • the tips at the contact points are tinned and have a diameter of 1.3 millimeters.
  • the EMC flat gasket consists of a polyamide spunbond fleece, which has a high compressibility of up to 85 percent and is very flexible.
  • the EMC seal can also be constructed differently and consist of different materials.
  • the seal can be, for example, an open-cell foam, the electrical and magnetically conductive ⁇ particles are added. Also suitable are nonwoven and composite materials that contain fibers made of a material with this conductivity property.
  • the metal braid can be a tinned, copper-clad steel wire braid.
  • the sealing body can be wrapped in steel mesh.
  • the metallic braid it is also possible for the metallic braid to be embedded in the sealing body by polymeric solidification.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention relates to a screening device comprising: a screening cover (20), which covers an electronic circuit located on a printed circuit board (2) and comprises an edge (3) that is separated from the component side (4) of the printed circuit board by a gap (5) and a contact device (6), which is located in the gap and produces an electric connection between the screening cover and a conductive contour element (7) on the printed circuit board. According to the invention, lugs (8) are formed on the edge of the screening cover, said lugs fixing the screening cover on the printed circuit board and maintaining an elastic pretension on the contact device. The contact device is configured as an elastic sealing body (22) that extends continuously through the gap and absorbs electromagnetic waves.

Description

Afoschirmeinrichtung für elektronische Baugruppen auf einer LeiterplatteAfoshield device for electronic assemblies on a printed circuit board
Bezeichnung der ErfindungName of the invention
Die Erfindung betrifft eine Abschirmeinrichtung mit einer Abschirmkappe, die eine auf einer Leiterplatte angeordnete e- lektronische Schaltung abdeckt, mit einem Rand, der von einer Bestückungsseite der Leiterplatte durch einen Spalt beabstandet ist, mit einer Kontakteinrichtung, die im Spalt angeordnet ist und eine elektrische Verbindung zwischen der Abschirmkappe und einer leitenden Kontur auf der Leiterplatte herstellt, wobei am Rand der Abschirmkappe Laschen angeformt sind, durch die die Abschirmkappe auf der Leiterplatte festgelegt und die Kontakteinrichtung unter elastischer Vorspannung gehalten ist.The invention relates to a shielding device with a shielding cap that covers an electronic circuit arranged on a printed circuit board, with an edge that is spaced from a component side of the printed circuit board by a gap, with a contact device that is arranged in the gap, and an electrical connection between the shielding cap and a conductive contour on the printed circuit board, tabs being formed on the edge of the shielding cap, through which the shielding cap is fixed on the printed circuit board and the contact device is held under elastic prestress.
Stand der TechnikState of the art
In der Elektrotechnik ist es häufig erforderlich, elektrische oder magnetische Felder innerhalb oder außerhalb eines bestimmten Gebiets zu schwächen. Als Entstörmittel werden Schirmgehäuse verwendet, die die Abstrahlung oder die Einstrahlung von elektromagnetischer Störstrahlung dämpfen. Auf Leiterplatten kann die störende Einstrahlung auch von Baugruppen verursacht werden, die sich selbst auf der Leiterplatte befinden. Bei miniaturisierten Baugruppen, wie bei- spielsweise Baugruppen, die in SMD-Technik aufgebaut sind, liegen Störsenke und Störquelle oft in unmittelbarer Nachbarschaft. Zur Abschirmung zeitlich veränderlicher Feldgrößen werden mehrteilige Schirmungen in Kleinbauweise eingesetzt. Sie bestehen meist aus einem Schirmrahmen, der durch Zwischenwände in einzelne Kammern unterteilt ist und mit der Leiterplatte verlötet ist. Um die von der Abschirmung abgedeckten elektronischen Bauelemente für Testzwecke zugänglich zu halten, ist der Schirmrahmen durch ein abnehmbares Deckelteil verschlossen. Da das Rahmenteil erst durch das Einlöten auf der Leiterplatte seine mechanische Stabilität erhält, ist es erforderlich, bei der Montage dieser miniaturisierten Schirmungen das Rahmenteil und das Deckelteil zusammen zu handhaben. Das Zusammenfügen und Abnehmen des Deckels sind umständlich und die Montage ist zeitaufwendig.In electrical engineering, it is often necessary to weaken electrical or magnetic fields inside or outside a certain area. Shield housings are used as interference suppressors, which dampen the radiation or the radiation of electromagnetic interference radiation. The disturbing radiation on circuit boards can also be caused by assemblies that are located on the circuit board itself. In the case of miniaturized assemblies, such as assemblies which are constructed using SMD technology, interference sinks and interference sources are often in the immediate vicinity. Multi-part shields in a small design are used to shield time-variable field sizes. They usually consist of a screen frame, which is divided into individual chambers by partitions and is soldered to the circuit board. In order to keep the electronic components covered by the shield accessible for test purposes, the shield frame is closed by a removable cover part. Since the frame part receives its mechanical stability only by soldering it onto the circuit board, it is necessary to handle the frame part and the cover part together when mounting these miniaturized shields. The assembly and removal of the lid are cumbersome and the assembly is time consuming.
Eine einteilige, metallische Schirmung, die auf eine Leiterplatte aufsteckbar ist, ist aus DE 29 808 620 Ul bekannt. Die Befestigung erfolgt durch Rasthaken, welche die Leiterplatte rückseitig hintergreifen. Die Massekontaktierung des Schirms mit der Leiterplatte wird durch eine Vielzahl federnder Lappen gebildet. Diese Lappen stehen bei einer montierten Abschirmwanne unter elastischer Vorspannung und stellen den e- lektrischen Kontakt durch eine Linien- bzw. Punktberührung her. Unter rauen Betriebsbedingungen kann es vorkommen, dass Abschnitte der Kontaktierung durch mechanische Einwirkungen oder durch Korrosion versagen. In diesem Fall ist die Abschirmeffizienz des Entstörmittels beeinträchtigt. Ein weite- rer Nachteil ist, dass bei der Montage der Abschirmung zurA one-piece, metallic shield that can be plugged onto a printed circuit board is known from DE 29 808 620 Ul. The attachment is done by locking hooks, which reach behind the circuit board on the back. The ground contact of the shield with the circuit board is formed by a large number of resilient tabs. When a shielding trough is fitted, these tabs are under elastic prestress and establish the electrical contact through line or point contact. Under harsh operating conditions, sections of the contacting may fail due to mechanical influences or corrosion. In this case, the shielding efficiency of the interference suppressor is impaired. Another disadvantage is that when installing the shield
Überwindung der Federkraft der einzelnen Lappen eine Anpresskraft erforderlich ist, die auf die Abschirmwanne aufgebracht und von der Leiterplatte aufgenommen werden muss . Die Äb- schir wirkung hängt aber von der kontaktierenden Federkraft und dem Abstand der einzelnen Kontaktpunkte ab. Wenn aber eine Vielzahl federnder Lappen elastisch verformt werden muss, ist ein entsprechend hoher Anpressdruck erforderlich und es kann bei miniaturisierten Baugruppen vorkommen, dass die Lei- terplatte unzulässig "verformt wird. An der Leice s ruktur können sich Mikrorisse ausbilden.Overcoming the spring force of the individual tabs a contact pressure is required, which must be applied to the shielding trough and taken up by the circuit board. However, the effectiveness depends on the contacting spring force and the distance between the individual contact points. However, if a large number of resilient tabs have to be elastically deformed, a correspondingly high contact pressure is required and it can happen with miniaturized assemblies that the cables plate is deformed inadmissibly " . Micro-cracks can form on the Leice structure.
Auch bei der aus der DE 297 13 412 Ul bekannten Schirmung wird die Kontaktierung durch am Schirmrand umlaufende Kon- taktfedern hergestellt.In the case of the shielding known from DE 297 13 412 Ul, the contacting is established by contact springs running around the edge of the shield.
Die Herstellung dieser bekannten, einteiligen Schirmungen erfordert ein komplexes Fertigungswerkzeug. Änderungen an diesem Werkzeug, die für die Herstellung einer neuen Abschirmge- ometrie oder Raumform erforderlich sind, sind nur mit vergleichsweise hohem Aufwand möglich.The production of these known, one-piece shields requires a complex manufacturing tool. Changes to this tool that are required to produce a new shielding geometry or spatial shape can only be made with comparatively great effort.
Darstellung der ErfindungPresentation of the invention
Der Erfindung liegt die Aufgabe zu Grunde, eine Abschirmeinrichtung der eingangs genannten Art derart weiter zu entwickeln, dass die Abschirmeffizienz verbessert wird und die Herstellung, insbesondere die Herstellung unterschiedlich großer Abschirmeinrichtungen, die nur partielle Bereiche auf der Leiterplatte schirmen, mit geringerem Aufwand möglich ist.The invention is based on the object of further developing a shielding device of the type mentioned at the outset in such a way that the shielding efficiency is improved and the manufacture, in particular the manufacture of shielding devices of different sizes, which only shield partial areas on the printed circuit board, is possible with less effort.
Diese Aufgabe wird erfindungsgemäß bei einer Abschirmein- richtung der eingangs genannten Art mit den kennzeichnenden Merkmalen von Anspruch 1 gelöst. Auf vorteilhafte Ausgestaltungen nehmen die Unteransprüche Bezug.This object is achieved according to the invention in a shielding device of the type mentioned at the outset with the characterizing features of claim 1. The subclaims refer to advantageous configurations.
Bei der erfindungsgemäßen Abschirmeinrichtung ist vorgesehen, dass die Kontakteinrichtung durch einen im Spalt umlaufend angeordneten Dichtkörper gebildet wird, wobei der Dichtkörper aus einem elastischen, elektromagnetische Wellen absorbierenden Werkstoff hergestellt ist. Charakteristisch für die Er- findung ist also mithin, dass die Kontaktierung nicht durch eine Vielzahl von Ko taktpunkten mit Linien- oder Punktberührung erfolgt, sondern durch einen flächig" anliegenden Dichtkörper aus einem elastischen Material. Dieser passt sich auf Grund seiner Kompressionsfähigkeit besser an Wölbungen und Unebenheiten der Leiterplatte an. Auch bei mechanischen Stößen oder Vibrationen bleibt ein niedriger ohmscher Übergangswiderstand der Massekontaktierung erhalten. Außerdem liegt der in der Fuge umlaufende Dichtkörper zwischen Schirmgehäuse und Leiterplatte dichtend an und bildet auf diese Weise zusätzlich einen Schutz vor in den Innenraum der Abschirmung eindringender Verschmutzung.In the shielding device according to the invention, it is provided that the contact device is formed by a sealing body arranged circumferentially in the gap, the sealing body being produced from an elastic, electromagnetic wave-absorbing material. Characteristic of the It is therefore the invention that the contact is made not by a large number of contact points with line or point contact, but by a flat sealing body made of an elastic material. Due to its compressibility, this adapts better to curvatures and unevenness of the printed circuit board. A low ohmic contact resistance of the ground contact is maintained even in the event of mechanical shocks or vibrations. In addition, the sealing body that runs around the joint between the shield housing and the printed circuit board provides a seal, thus providing additional protection against dirt entering the interior of the shield.
Durch die konstruktive Loslösung der Kontaktierung vom Schirmrahmen vereinfacht sich dessen Herstellung. Das Herstellungswerkzeug der Abschirmkappe ist einfacher aufgebaut. Rüstkosten für Änderungen am Fertigungswerkzeug sind niedriger. Die Abschirmkappe kann kostengünstig in Großserie als Stanz-Biegeteil aus Blech hergestellt werden. Der Dichtkörper kann ein Zuschnitt oder ein Halbzeug sein. Insgesamt kann eine Anpassung der Fertigung auf eine partielle Abschirmung unterschiedlich großer Bereiche auf einer Leiterplatte mit geringerem Aufwand realisiert werden.The constructive detachment of the contact from the screen frame simplifies its manufacture. The manufacturing tool for the shielding cap has a simpler structure. Setup costs for changes to the production tool are lower. The shielding cap can be mass-produced inexpensively as a stamped and bent part made of sheet metal. The sealing body can be a blank or a semi-finished product. Overall, the production can be adapted to a partial shielding of areas of different sizes on a printed circuit board with less effort.
Überraschenderweise hat sich herausgestellt, dass eine bereits nur wenige Millimeter breite EMV-Dichtung eine sehr gute Abschirmeffizienz gegenüber HF-Feldern ermöglicht.Surprisingly, it has been found that an EMC seal that is only a few millimeters wide enables very good shielding efficiency against HF fields.
Werkstoffe, die hinsichtlich elektromagnetischer Strahlung eine aufzehrende Wirkung aufweisen, sind in verschiedenen Zusammensetzungen und Ausführungen bekannt und handelsüblich. Für eine einfache Befestigung der Abschirmkappe auf der Leiterplatte ist vorgesehen, dass die Leiterplatte mit DurchtrittsÖffnungen versehen ist und ein austrittseitig aus der Durchtrittsöffnung hervorstehendes Ende einer Lasche plas- tisch so verformt wird, dass es die Leiterplatte rückseitig hintergreift. Dadurch entsteht eine einfach herzustellende formschlüssige Verbindung. Das plastische Verformen der vorstehenden Endabschnitte kann durch Biegen, Prägen oder Stauchen erfolgen. Um für Testzwecke ein einfaches Abnehmen der Kappe zu ermöglichen, kann jedes Endstück einer Lasche als Schränklappen ausgebildet sein.Various compositions and designs of materials which have a draining effect with regard to electromagnetic radiation are known and customary in the trade. For a simple fastening of the shielding cap on the printed circuit board, it is provided that the printed circuit board is provided with passage openings and an end of a tab protruding from the exit opening is plastically deformed in such a way that it engages behind the printed circuit board on the rear. This creates a form-fitting connection that is easy to produce. The plastic deformation of the projecting end sections can be done by bending, stamping or upsetting. In order to enable the cap to be removed easily for test purposes, each end piece of a tab can be designed as a cabinet flap.
Hinsichtlich der Fertigungskosten ist es günstig, wenn die Abschirmkappe materialeinheitlich und einstückig ineinander übergehend aus einem metallischen Werkstoff, beispielsweise aus Weißblech, gebildet ist. Das Weißblech kann durch Verzinnen geschützt sein.With regard to the manufacturing costs, it is favorable if the shielding cap is made of a metallic material, for example of tinplate, integrally and integrally with one another. The tinplate can be protected by tinning.
In einer weiteren Ausgestaltung der Erfindung ist vorgesehen, dass der Rand als rechtwinkelige Abkantung ausgebildet ist, die im montierten Zustand der Abschirmkappe im wesentlichen parallel zur Bestückungsseite verläuft und jede Lasche außen- u fangsseitig angeformt und im Verlauf von einer Wand der Abschirmkappe abgesetzt ausgeführt ist. Dadurch kann die Ab- schirmkappe in einem Stanz- und Biegevorgang hergestellt werden.In a further embodiment of the invention it is provided that the edge is formed as a right-angled bend which, when the shielding cap is in the installed state, runs essentially parallel to the component side and each flap is formed on the outside and on the starting side and is offset in the course of a wall of the shielding cap. As a result, the shielding cap can be produced in one punching and bending process.
Bei diesem Stanz-Biegeteil kann eine sehr wirkungsvolle Abschirmung dadurch realisiert werden, indem der Dichtkörper als Flachdichtung ausgebildet ist und durch einen elektrisch leitfähigen Klebstoff am Rand der Abschirmkappe oder der Bestückungsseite der Leiterplatte befestigt ist. Darüber hinaus ergibt sich der Vorteil, dass bei der Montage die Abschirmkappe samt Dichtung als ein Teil handhabbar ist. "Zur Verbesserung der Kontaktsicherheit weist die leitendeWith this stamped and bent part, very effective shielding can be achieved by the sealing body being designed as a flat gasket and being attached to the edge of the shielding cap or the component side of the printed circuit board by means of an electrically conductive adhesive. In addition, there is the advantage that the shielding cap and seal can be handled as one part during assembly. " In order to improve contact security, the executive
Kontur der Leiterplatte kuppenför ige Kontaktpunkt auf, die sich in die Flachdichtung eindrücken. Ihre Oberfläche ist durch die elastische Flachdichtung dichtend abgeschlossen und gegen Korrosion weitgehend geschützt.Contour of the printed circuit board at the point of contact that is pressed into the flat gasket. Its surface is sealed by the elastic flat gasket and largely protected against corrosion.
Wenn nur partielle Bereiche auf einer Leiterplatte geschirmt werden müssen, kann es günstig sein, wenn die Abschirmkappe hinsichtlich der abzuschirmenden Geometrie im Rastermaß der Leiterplatte quaderförmiger ausgebildet ist. Diese einheitlich modulare Bauweise senkt Herstellungs- und Logistikkosten.If only partial areas on a printed circuit board need to be shielded, it can be advantageous if the shielding cap is cuboid-shaped with regard to the geometry to be shielded in the grid dimension of the printed circuit board. This uniform, modular design lowers manufacturing and logistics costs.
Für den Fall, dass der Innenraum der Abschirmung belüftet bzw. entlüftet werden muss, ist vorgesehen, dass die Abschirmkappe an einem Deckenteil und/oder an einem Wandteil mit Durchbrüchen versehen ist, die Durchtrittsöffnung für Kühlluft bilden. Die Größe der Durchbrüche ist an das abzuschirmende FrequenzSpektrum angepasst.In the event that the interior of the shield has to be ventilated or vented, it is provided that the shielding cap is provided with openings on a ceiling part and / or on a wall part, which form the passage opening for cooling air. The size of the breakthroughs is adapted to the frequency spectrum to be shielded.
Wenn auf der Leiterplatte partielle Gebiete unterschiedliche Schirmwirkungen erfordern, ist vorgesehen, dass auf einer Leiterplatte mehrere Abschirmkappen angeordnet sind und die Schirmeffizienz dieser Abschirmkappen unterschiedlich ist.If partial areas on the circuit board require different shielding effects, it is provided that several shielding caps are arranged on one circuit board and the shielding efficiency of these shielding caps is different.
Zur weiteren Kostensenkung können handelsübliche EMV- Materialien verwendet werden, das sind polymere Werkstoffe, besonders bevorzugt Polyamid-Vlies, das metallisch beschichtet oder durch ein Metallgeflecht umstrickt ist. Kurzbeschreibung der ZeichnungenTo further reduce costs, commercially available EMC materials can be used, which are polymeric materials, particularly preferably polyamide fleece, which is coated with metal or is knitted with a metal braid. Brief description of the drawings
Die Erfindung wird nachfolgend an Hand eines in den Zeichnungen dargestellten Ausführungsbeispiels näher beschrieben. Es zeigen:The invention is described below with reference to an embodiment shown in the drawings. Show it:
Figur 1 eine perspektivische Explosionsdarstellung der erfindungsgemäßen Abschirmeinrichtung, in einer Ausführung, bei der die gesamte Leiterplatte von der Abschirmkappe abgedeckt ist,1 shows an exploded perspective view of the shielding device according to the invention, in an embodiment in which the entire printed circuit board is covered by the shielding cap,
Figur 2 eine vergrößerte Detaildarstellung der Abschirmkappe von der Unterseite,FIG. 2 shows an enlarged detailed illustration of the shielding cap from the underside,
Figur 3 eine Detaildarstellung eines Randbereichs einer auf einer Leiterplatte montierten Abschirmeinrichtung in quergeschnittener Darstellung,FIG. 3 shows a detailed illustration of an edge region of a shielding device mounted on a printed circuit board in a cross-sectional illustration,
Figur 4 einen Abschnitt der leitenden Kontur auf der Lei- terplatte mit auf Lücke versetzt angeordneten Kontaktpunkten .FIG. 4 shows a section of the conductive contour on the printed circuit board with contact points arranged offset.
Ausführung der ErfindungImplementation of the invention
In der Zeichnung ist in Figur 1 beispielhaft eine Ausführungsform der erfindungsgemäßen Abschirmeinrichtung 1 in einer perspektivischen Explosionsdarstellung wiedergegeben. Die Abschirmeinrichtung 1 besteht aus einer Abschirmkappe 20 und aus einer Kontakteinrichtung 6. Die Abschirmkappe 20 deckt im gezeigten Beispiel den gesamten Bereich der Leiterplatte 2 ab. Die folgenden Erläuterungen sind jedoch nicht eingeschränkt auf diese Ausführungsform beschränkt, sondern erfas- sen insbesondere auch Abschirmeiirrlchtungeii die nur partielleAn exemplary embodiment of the shielding device 1 according to the invention is shown in a perspective exploded view in the drawing in FIG. 1. The shielding device 1 consists of a shielding cap 20 and a contact device 6. The shielding cap 20 covers the entire area of the printed circuit board 2 in the example shown. However, the following explanations are not restricted to this embodiment, but In particular, screening is only partial
Bereiche auf der Leiterplatte abschirmen.Shield areas on the circuit board.
Wie die Figur 1 zeigt, sind am Rand 3 der Abschirmkappe 20 außenumfangsseitig Laschen 8 angeformt, durch welche die Abschirmkappe 20 auf einer Bestückungsseite 4 der Leiterplatte 2 festlegbar ist. Auf der Bestückungsseite 4 der Leiterplatte 2 ist eine leitende Kontur 7 zu sehen, deren U riss mit dem Randbereich der Abschirmkappe 20 korrespondiert. Die leitende Kontur 7 besteht aus Kontaktpunkten, die untenstehend näher erläutert sind, und ist in Ätztechnik im Rastermaß hergestellt. Die Kontakteinrichtung 6 ist als umlaufende Dichtung 22 ausgebildet. Bei der Montage der Abschirmeinrichtung wird die Abschirmkappe 20 auf die Leiterplatte 2 abgesenkt. Beim Absenken tauchen die in Richtung Leiterplatte 2 weisenden Laschen 8 in Durchtrittsöffnungen 10 der Leiterplatte 2. Im weiteren Verlauf des Absenken kommt es zunächst zu einer Pressung des elastischen Dichtkörpers 22. Die Pressung erfordert wegen der guten Kompressionseigenschaften des Dichtungs- Werkstoffs nur eine geringe Anpresskraft. Ein weiteres Absenken bewirkt, dass jedes Endstück 9 der Lasche 8 die Durchtrittsöffnung passiert und rückseitig übersteht. Zwecks Befestigung der Abschirmkappe wird nun der austrittseitig aus der Durchtrittsöffnung überstehende Schränklappen durch eine wechselseitige Biegung plastisch verformt. Es entsteht zwischen Kappe 20 und Träger 2 eine formschlüssige Verbindung. Wie bereits dargestellt kann die plastische Verformung aber auch durch Umbiegen, durch Prägen, oder durch Stauchen erfolgen. Im Spalt zwischen Kappenrand und Bestückungsseite wird der elastische Dichtkörper 22 zusammengepresst . In denAs FIG. 1 shows, tabs 8 are formed on the edge 3 of the shielding cap 20 on the outer circumferential side, by means of which the shielding cap 20 can be fixed on a component side 4 of the printed circuit board 2. On the component side 4 of the printed circuit board 2, a conductive contour 7 can be seen, the U crack of which corresponds to the edge region of the shielding cap 20. The conductive contour 7 consists of contact points, which are explained in more detail below, and is produced in etching technology in grid dimensions. The contact device 6 is designed as a circumferential seal 22. When the shielding device is installed, the shielding cap 20 is lowered onto the printed circuit board 2. When lowering, the tabs 8 pointing in the direction of the printed circuit board 2 are immersed in through openings 10 of the printed circuit board 2. In the further course of the lowering, the elastic sealing body 22 is first pressed. Because of the good compression properties of the sealing material, the pressing requires only a small pressing force. A further lowering causes each end piece 9 of the tab 8 to pass through the passage opening and to protrude from the rear. For the purpose of fastening the shielding cap, the cupboard flap protruding from the outlet opening is plastically deformed by a mutual bending. A positive connection is created between cap 20 and carrier 2. As already shown, the plastic deformation can also take place by bending, by embossing, or by upsetting. The elastic sealing body 22 is pressed together in the gap between the cap edge and the component side. In the
Dichtspalt 5 eindringende elektromagnetische Strahlungsenergie wird beim Durchgang auf Grund der dämpfenden Materialeigenschaften des Dichtungswerkstoffs stark abgeschwächt. Die Montage erfordert wegen des leiditen omprimiere s "des D±ch- tungswerkstoffs nur eine vergleichsweise geringe Anpress- kraft. In Figur 1 ist die Abschirmhaube in ihre Längsseite mit zwei, in ihrer Breitseite mit einem angeformten Befesti- gungslappen gezeigt. Selbstverständlich variiert die Anzahl der Befestigungslappen entsprechend der Größe der Abschirmkappe. Die Durchtrittsöffnungen 15 für die Be- bzw. Entlüftung des Innenraums sind stark vergrößert gezeichnet. In Wirklichkeit ist der Durchmesser dieser Bohrungen sehr klein und auf die abzuschirmende Frequenz des Wechselfeldes abgestimmt. Die Abschirmkappe 20 ist ein einteiliges Biege- Stanzteil aus einem verzinnten Weißblech.Sealing gap 5 penetrating electromagnetic radiation energy is greatly weakened during passage due to the damping material properties of the sealing material. The Installation requires only by virtue of a relatively low contact pressure due to the leiditen omprimiere s "of the D ± ch- tung material. In Figure 1, the shielding hood is shown supply overlap in their broad side with an integrally formed fastening in its longitudinal side with two. Of course, varying the number of The through openings 15 for the ventilation of the interior are drawn in a greatly enlarged manner. In reality, the diameter of these bores is very small and is matched to the frequency of the alternating field to be shielded. The shielding cap 20 is a one-piece bending element. Stamped part made of tin-plated tinplate.
In den Figuren 2 und 3 ist der Randbereich der Abschirmkappe in einer vergrößerten Detaildarstellung gezeichnet. Der Rand 3 der Abschirmkappe 20 ist durch eine rechtwinkelige Abkantung 12 fortgesetzt. Außenumfangsseitig ist die Lasche 8 an der Abkantung 12 angeformt . Der Endabschnitt 9 der Lasche 8 ist als Schränklappen 11 ausgeführt. Wie aus der querge- schnittenen Darstellung der Figur 3 leicht zu entnehmen ist, ist die Lasche 8 durch die Durchtrittsöffnung 10 der Leiterplatte 2 durchgesteckt. Der Endabschnitt 9 ist durch wechselseitiges Biegen um eine in Durchtrittsrichtung weisende Achse plastisch verformt. Dadurch hintergreift der Schränklappen 11 die Rückseite der Leiterplatte 2. Bei geschlossener Ausführungsform der Abschirmkappe schützt die umlaufende Dichtung 22 gleichzeitig auch den Innenraum 18 vor aus dem Außenraum 19 eindringenden Staub oder vor Verschmutzung. In der Schnittdarstellung der Figur 3 ist die Dichtung 22 als Flach- dichtung 13 gezeichnet. Sie steht im Dichtspalt 5 zwischenIn Figures 2 and 3, the edge region of the shielding cap is drawn in an enlarged detail. The edge 3 of the shielding cap 20 is continued by a right-angled bend 12. On the outer circumference, the tab 8 is formed on the fold 12. The end section 9 of the tab 8 is designed as a cabinet flap 11. As can easily be seen from the cross-sectional illustration in FIG. 3, the tab 8 is pushed through the passage opening 10 of the printed circuit board 2. The end section 9 is plastically deformed by mutual bending about an axis pointing in the direction of passage. As a result, the cabinet flaps 11 engage behind the back of the printed circuit board 2. When the shielding cap is closed, the circumferential seal 22 also simultaneously protects the interior 18 against dust penetrating from the exterior 19 or against contamination. 3, the seal 22 is drawn as a flat seal 13. It is in the sealing gap 5 between
Leiterplatte 2 und Rand 12 unter elastischer Vorspannung. Die Flachdichtung 13 ist an einer Oberseite mit einem Klebstoff 14 beschichtet, wodurch Dichtung und Abschirmkappe bei der Montage eine Einheit bilden und leichter handhabbar sind. DiePrinted circuit board 2 and edge 12 under elastic prestress. The flat seal 13 is coated on an upper side with an adhesive 14, whereby the seal and the shielding cap Assembly form a unit and are easier to handle. The
Unterseite der Flachdichtung 13 liegt längs der leitendenThe underside of the flat seal 13 lies along the conductive one
Kontur 7 auf der- Bestückungsseite 4. Die leitende Kontur 7 wird durch kuppenförmige Kontaktpunkte 21 gebildet, die über ein entsprechendes Layout elektrisch angebunden sind. Durch die Pressung im Dichtspalt 5 kommt es zu einer elastischenContour 7 on the component side 4. The conductive contour 7 is formed by dome-shaped contact points 21 which are electrically connected via a corresponding layout. The pressure in the sealing gap 5 leads to an elastic one
Verformung des Dichtungswerkstoffs. Die Kontaktpunkte 21 pressen sich an der Unterseite der Flachdichtung ein. Durch diese Umhüllung der Kuppenoberfläche ist die Kontaktstelle vor äußeren Einwirkungen sehr gut geschützt. Einer Korrosion im Kontaktierungsbereich wird dadurch entgegengewirkt. Folge davon ist, dass über eine sehr lange Gebrauchsdauer der ohm- sche Übergangswiderstand der Massekontaktierung gleich niedrig gehalten werden kann. Die Kontur 7 kann auch durch eine durchgehende Leiterbahn oder durch ein anderes Kontakt-Muster gebildet sein. Selbstverständlich ist es auch möglich, die Flachdichtung 13 auch von der unteren Seite her mit einem leitfähigen Klebstoff zu beschichten.Deformation of the sealing material. The contact points 21 press into the underside of the flat gasket. This covering of the top surface of the contact point is very well protected against external influences. This counteracts corrosion in the contact area. The consequence of this is that the ohmic contact resistance of the ground contact can be kept equally low over a very long service life. The contour 7 can also be formed by a continuous conductor track or by another contact pattern. Of course, it is also possible to coat the flat gasket 13 from the lower side with a conductive adhesive.
Die Anordnung der kuppenförmigen Kontaktpunkte 21 längs der leitenden Kontur 7 ist in Figur 4 in einer Aufsicht vergrößert dargestellt. Die Kontaktpunkte 21 sind auf Lücke versetzt angeordnet. Der Abstand der Kontaktpunkte in Längserstreckung der Massekontaktierung gesehen beträgt im Bei- spiel vier Millimeter. Die Kuppen an den Kontaktpunkten sind verzinnt und haben einen Durchmesser von 1,3 Millimeter. Die EMV-Flachdichtung besteht aus einem Polyamid-Spunbond-Vlies, das eine hohe Kompressionsfähigkeit von bis zu 85 Prozent aufweist und sehr flexibel ist.The arrangement of the dome-shaped contact points 21 along the conductive contour 7 is shown enlarged in a top view in FIG. The contact points 21 are staggered. The distance between the contact points in the longitudinal extension of the ground contact is four millimeters, for example. The tips at the contact points are tinned and have a diameter of 1.3 millimeters. The EMC flat gasket consists of a polyamide spunbond fleece, which has a high compressibility of up to 85 percent and is very flexible.
Die EMV-Dichtung kann aber auch anders aufgebaut sein und aus anderen Werkstoffen bestehen. Die Dichtung kann beispielsweise ein offenzelliger Schaumstoff sein, dem elektrisch und magnetisch leitfähige ^Partikel zugesetzt sind. Geeignet sind ferner auch Vlies- und Verbundwerkstoffe, die Fasern aus einem Material mit dieser Leitfähigkeits-Eigenschaft enthalten.However, the EMC seal can also be constructed differently and consist of different materials. The seal can be, for example, an open-cell foam, the electrical and magnetically conductive ^ particles are added. Also suitable are nonwoven and composite materials that contain fibers made of a material with this conductivity property.
Das Metallgeflecht kann ein verzinntes, kupferkaschiertes Stahldrahtgeflecht sein. Der Dichtkörper kann vom Stahlgeflecht umsponnen sein. Es ist aber auch möglich, dass das metallische Geflecht durch polymere Verfestigung im Dichtkörper eingebettet ist. The metal braid can be a tinned, copper-clad steel wire braid. The sealing body can be wrapped in steel mesh. However, it is also possible for the metallic braid to be embedded in the sealing body by polymeric solidification.

Claims

Patentansprüche claims
1 . Abschirmeinrichtung, die aufweist: eine Abschirmkappe (20) , die eine auf einer Leiter- platte (2) angeordnete elektronische Schaltung abdeckt, mit einem Rand (3), der von einer Bestückungsseite (4) der Leiterplatte durch einen Spalt (5) beabstandet ist, eine Kontakteinrichtung (6), die im Spalt angeord- net ist und eine elektrische Verbindung zwischen der Abschirmkappe und einer leitenden Kontur (7) auf der Leiterplatte herstellt, wobei am Rand der Abschirmkappe Laschen (8) angeformt sind, durch die die Abschirmkappe auf der Leiterplatte festgelegt und die Kontakteinrichtung unter elastischer Vorspannung gehalten ist, dadurch gekennzeichnet, dass die Kontakteinrichtung als ein im Spalt umlaufender, elastischer Dichtkörper (22) ausgebildet ist, der elektromagnetische Wellen absorbiert.1 . Shielding device comprising: a shielding cap (20) which covers an electronic circuit arranged on a printed circuit board (2), with an edge (3) which is spaced from a component side (4) of the printed circuit board by a gap (5) , a contact device (6), which is arranged in the gap and establishes an electrical connection between the shielding cap and a conductive contour (7) on the printed circuit board, tabs (8) being formed on the edge of the shielding cap, through which the shielding cap opens of the printed circuit board and the contact device is held under elastic pretension, characterized in that the contact device is designed as an elastic sealing body (22) rotating in the gap, which absorbs electromagnetic waves.
2. Abschirmeinrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Leiterplatte mit Durchtrittsöffnungen (10) versehen ist, dass nach Festlegung der Abschir kap- pe die Laschen (8) austrittseitig aus der Durchtrittsöffnung hervorstehen und plastisch verformte Endabschnitte (9) der Laschen die Leiterplatte (2) rückseitig hintergreifen.2. Shielding device according to claim 1, characterized in that the printed circuit board is provided with through openings (10), that after fixing the shield, the tabs (8) protrude from the exit opening on the exit side and plastically deformed end sections (9) of the tabs the printed circuit board (2) reach behind on the back.
3. Abschirmeinrichtung nach Anspruch 2, dadurch gekennzeichnet, dass jedes Endstück einer Lasche (8) als Schränklappen (11) ausgebildet ist. 3. Shielding device according to claim 2, characterized in that each end piece of a tab (8) is designed as a cabinet flap (11).
1 . Abschirmeinrichtung nach" zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Abschirmkappe (20) materialeinheitlich und einstückig ineinander übergehend aus einem metallischen Werkstoff ge- bildet ist. 1 . Shielding device according to " at least one of the preceding claims, characterized in that the shielding cap (20) is made of a metallic material and integrally merges into one another.
5. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass der Rand (3) als rechtwinkelige Abkantung (12) ausgebildet ist, die im montierten Zustand der Abschirmkappe im wesentlichen parallel zur Bestückungsseite verläuft, und jede Lasche (8) außenumfangsseitig angeformt und im Verlauf von einer Wand (17) der Abschirmkappe (20) abgesetzt ausgeführt ist .5. Shielding device according to at least one of the preceding claims, characterized in that the edge (3) is designed as a right-angled bend (12) which, in the assembled state of the shielding cap, runs essentially parallel to the component side, and each tab (8) is formed on the outer circumferential side and in the course of a wall (17) of the shielding cap (20).
6. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass der Dichtkörper (22) als Flachdichtung (13) ausgebildet ist und durch einen elektrisch leitfähigen Klebstoff (14) am Rand (3) der Abschirmkappe oder der Bestückungsseite (4) befestigt ist.6. Shielding device according to at least one of the preceding claims, characterized in that the sealing body (22) is designed as a flat seal (13) and is fixed by an electrically conductive adhesive (14) on the edge (3) of the shielding cap or the component side (4) ,
7. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die leitende Kontur durch kuppenförmige Kontaktpunkte (21) , die auf der Bestückungsseite im Rastermaß angeordnet sind, gebildet ist.7. Shielding device according to at least one of the preceding claims, characterized in that the conductive contour is formed by dome-shaped contact points (21) which are arranged on the component side in a grid dimension.
8. Abschirmeinrichtung nach zumindest einem der vorstehen- den Ansprüche, dadurch gekennzeichnet, dass die Abschirmkappe als Stanz-Biegeteil ausgebildet ist. 8. Shielding device according to at least one of the preceding claims, characterized in that the shielding cap is designed as a stamped and bent part.
9. AbεchirmeinriclTtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Abschirmkappe uaderför ig ausgebildet ist.9. shielding device according to at least one of the preceding claims, characterized in that the shielding cap is uader-shaped.
10. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass an einem Deckenteil (16) und/oder an einem Wandteil (17) der Abschirmkappe (20) Durchbrüche (15) vorgesehen sind.10. Shielding device according to at least one of the preceding claims, characterized in that openings (15) are provided on a ceiling part (16) and / or on a wall part (17) of the shielding cap (20).
11. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass auf einer Leiterplatte (2) mehrere Abschirmkappen (20) angeordnet sind und die Schirmeffizienz dieser Abschirmkappen unterschiedlich ist.11. Shielding device according to at least one of the preceding claims, characterized in that a plurality of shielding caps (20) are arranged on a printed circuit board (2) and the shielding efficiency of these shielding caps is different.
12. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass der Dichtkörper (22) aus einem polymeren Werkstoff, besonders bevorzugt aus einem Polyamid-Vlies, das metallisch beschichtet oder durch ein Metallgeflecht umstrickt ist, gebildet ist.12. Shielding device according to at least one of the preceding claims, characterized in that the sealing body (22) is formed from a polymeric material, particularly preferably from a polyamide fleece which is metallically coated or knitted with a metal braid.
13. Abschirmeinrichtung nach zumindest einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass der Dichtkörper (22) aus einem elektrisch leitfähigen13. Shielding device according to at least one of the preceding claims, characterized in that the sealing body (22) consists of an electrically conductive
Elastomer, das durch ein verzinntes, kupferkaschiertes Stahldrahtgeflecht umsponnen ist, gebildet ist. Elastomer, which is wound by a tinned, copper-clad steel wire mesh, is formed.
EP03718802A 2002-07-10 2003-05-16 Screening device for electronic subsassemblies on a printed circuit board Expired - Lifetime EP1520457B1 (en)

Applications Claiming Priority (3)

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DE10231145 2002-07-10
DE10231145A DE10231145A1 (en) 2002-07-10 2002-07-10 Shielding device for electronic assemblies on a printed circuit board
PCT/EP2003/005182 WO2004008823A1 (en) 2002-07-10 2003-05-16 Screening device for electronic subsassemblies on a printed circuit board

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EP1520457B1 EP1520457B1 (en) 2006-05-03

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JP2005537635A (en) 2005-12-08
US6979773B2 (en) 2005-12-27
DE10231145A1 (en) 2004-01-29
DE50303215D1 (en) 2006-06-08
EP1520457B1 (en) 2006-05-03
RU2314664C2 (en) 2008-01-10
US20050205280A1 (en) 2005-09-22
MY135091A (en) 2008-02-29
HK1083000A1 (en) 2006-06-23
CN1669377A (en) 2005-09-14
RU2005103404A (en) 2005-10-10
CN100417314C (en) 2008-09-03
WO2004008823A1 (en) 2004-01-22
AU2003222851A1 (en) 2004-02-02

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