EP1453155A2 - Method for producing slip ring brushes and such a produced slip ring brush - Google Patents

Method for producing slip ring brushes and such a produced slip ring brush Download PDF

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Publication number
EP1453155A2
EP1453155A2 EP03026305A EP03026305A EP1453155A2 EP 1453155 A2 EP1453155 A2 EP 1453155A2 EP 03026305 A EP03026305 A EP 03026305A EP 03026305 A EP03026305 A EP 03026305A EP 1453155 A2 EP1453155 A2 EP 1453155A2
Authority
EP
European Patent Office
Prior art keywords
circuit board
brush
slip ring
brush element
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03026305A
Other languages
German (de)
French (fr)
Other versions
EP1453155A3 (en
EP1453155B1 (en
Inventor
Ludwig Angerpointner
Klaus Drost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LTN Servotechnik GmbH
Original Assignee
LTN Servotechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority claimed from DE10324699A external-priority patent/DE10324699A1/en
Application filed by LTN Servotechnik GmbH filed Critical LTN Servotechnik GmbH
Publication of EP1453155A2 publication Critical patent/EP1453155A2/en
Publication of EP1453155A3 publication Critical patent/EP1453155A3/en
Application granted granted Critical
Publication of EP1453155B1 publication Critical patent/EP1453155B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/18—Contacts for co-operation with commutator or slip-ring, e.g. contact brush
    • H01R39/24—Laminated contacts; Wire contacts, e.g. metallic brush, carbon fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/38—Brush holders
    • H01R39/383—Brush holders characterised by the electrical connection to the brush holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/12—Manufacture of brushes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49119—Brush

Definitions

  • the invention relates to a method for producing slip ring brushes according to claim 1. Furthermore, the invention comprises, according to Claim 8 a slip ring brush itself.
  • Slip ring units often consist of a slip ring brush, among other things and slip rings, the slip ring brush sliding during operation Has contact with rotating slip rings.
  • slip ring units are used in many technical fields to electrical signals or electrical power from a fixed to a rotating electrical Transfer unit. It is important that, for example, by resilient Brush elements a good and lasting contact between the Slip ring brush and the slip rings is given, even if for example the entire slip ring unit is exposed to vibrations.
  • US Pat. No. 4,583,797 describes a slip ring which also has substantially U-shaped brush wires.
  • U-shaped brush wires through a brush block that is used as a circuit board Conductors can be formed, inserted through.
  • the brush wires are soldered to the circuit board so that the solder joint is on the rotor facing surface of the circuit board.
  • This design has the Disadvantage that the assembly of the corresponding slip ring brush is complex is.
  • slip ring brushes manufactured in this way have regard to their spring properties a not optimal quality.
  • the invention is therefore based on the object of a method for the production to create a slip ring brush, which requires minimal assembly effort conditioned, and by what high quality slip ring brushes can be produced with a small amount of installation space.
  • the invention provides a new slip ring brush created by which the lifespan or the reliability of Slip ring units is significantly increased. This is done through the slip ring brush solved according to claim 8.
  • the invention is based on the idea that at least one brush element is soldered to a first surface of a circuit board, the soldering process is made such that solder, from the second surface the circuit board coming through holes in the circuit board up to the brush element passes. Through this process, the conductor tracks the circuit board with the brush element electrically and mechanically connected.
  • an opening or a hole is closed under the term bore understand which does not necessarily have to have a circular cross-section, rather, the bores can also have a polygonal cross section or have any other curve geometry as a perimeter limitation.
  • the second Surface of the circuit board pads arranged on which the ends of a cable with the advantage of a ribbon cable, can be electrically contacted.
  • Figure 1 is a plan view of a first surface A of a circuit board 1 shown.
  • the circuit board 1 consists of epoxy resin, which is filled with glass fibers, and has a comparatively low Thermal conductivity.
  • other materials for the circuit board 1 can be used, such as materials based on Polyamide or ceramic components are based.
  • FIG. 2 is a top view of the second surface B of the circuit board 1 shown.
  • holes 1.2, 1.21, 1.22 and further conductor tracks 1.1, 1.12 also pads 1.3, 1.31, 1.31a, 1.32, 1.32a shown.
  • a virtual one runs parallel to the drawing plane of FIGS. 1 and 2 geometric plane, namely the central longitudinal section C, which in the Figures 3 and 5 is shown in the side views of the circuit board 1. Accordingly, the central longitudinal section C is located in the middle between the two Surfaces A and B.
  • the slip ring brush according to the invention comprises Brush elements, which in the example shown are designed as wire brackets 2, 21 are.
  • the wire bracket 2, 21, which are all identical in construction are, have three legs 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 and have one essentially U-shaped or ⁇ -shaped shape, so that the wire bracket 2, 21 each have an opening 21.4.
  • the wire bracket 2, 21 or their Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 have an inside I and one Outside O.
  • the inside I is the geometric area of the Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3, the center or the Center of gravity of the wire bracket 2, 21 points.
  • the outside shows O away from the center of the U- or ⁇ -shaped wire bracket 2, 21.
  • the outer side O is therefore on the outer circumference of the wire bracket 2, 21.
  • the wire clips 2, 21 are produced from a 20 mm long wire with a diameter of 0.2 mm by a bending process. Due to the requirements regarding a design of the slip ring units that is as miniaturized as possible, the wire clips 2, 21 have a correspondingly small diameter. Such thin wire brackets 2, 21 have an extremely high volume-related surface area (approximately 20 mm 2 / mm 3 ), as a result of which they assume the ambient temperature in their entire volume within a very short time.
  • the wire clips 2, 21 consist of a noble metal alloy. The main component of this noble metal alloy is the noble metal palladium with proportions of copper and silver.
  • a mixture of gold, copper and silver can also be used, for example, as the noble metal alloy, in which case gold can be used as the main component.
  • the components of the alloy advantageously have an electrochemical potential which is positive with respect to hydrogen as zero potential.
  • step S3 the surface A of the circuit board 1 becomes the outside O of the leg 21.1 of the wire bracket 21 placed such that the Outside O of the leg 21.1 at the exit of the holes 1.21, 1.22 comes to lie.
  • the wire bracket 21 is oriented so that related the opening 21.4 on the central cross section C of the circuit board 1 is on the same side as surface A, on which the leg 21.1 is attached.
  • the respective elements in the following order surface A, leg 21.1, opening 21.4, so that the leg 21.1 between the circuit board 1 and the opening 21.4.
  • the Leg 21.1 so placed on the surface A of the circuit board 1 that this to be centered over the respective exit of the holes 1.21, 1.22 comes. In practice, however, it shows that there are deviations from ⁇ 0.4 mm from the center of the holes 1.21, 1.22 can be tolerated, without noticeable loss of quality in the soldered connection become.
  • the legs 21.1 are in any case at the exit of the holes 1.21, 1.22 placed on the circuit board 1.
  • the term at the exit of the holes 1.21, 1.22 thus comprises an area within which an attached leg 21.1 still using Lot 3, which through the holes 1.21, 1.22 can pass through functionally soldered.
  • wire clips 2, 21 are exposed to high temperatures, so that no impairment of their spring properties or their elasticity can be determined by the soldering, in particular in the areas which must have a high elasticity during operation, namely Legs 2.2, 21.2 and 2.3, 21.3, as well as the transition areas from these legs 2.2, 21.2, 2.3, 21.3 to leg 2.1, 21.1. All other wire clips 2 are then attached to the printed circuit board 1 using the same method.
  • the circuit board 1 now also fulfills the function of a brush block of a slip ring brush.
  • a wave soldering process can also be used, in which the legs 2.1, 21.1 of the wire clips 2, 21 are glued onto the surface A of the circuit board 1 before the actual soldering, the wire clips 2, 21 in turn being aligned such that the Opening 21.4 with respect to the central longitudinal section C of the circuit board 1 is on the same side as the surface A and the bores 1.2, 1.21, 1.22 which are relevant for the contacting are covered by the legs 2.1, 21.1 of the wire bracket 2, 21, respectively Legs 2.1, 21.1 are located at the exit of the holes 1.2, 1.21, 1.22.
  • the circuit board 1 is moved over a transport system at a uniform speed through a soldering machine and subjected to a wave soldering process.
  • these pads 1.3, 1.31, 1.31a, 1.32, 1.32a from accepting solder, or if certain holes 1.2, 1.21, 1.22 on the circuit board 1 are not to be filled with solder, these pads 1.3, 1.31, 1.31 Mask a, 1.32, 1.32a or the relevant holes 1.2, 1.21, 1.22 with wave-resistant adhesive strips before wave soldering.
  • All legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are located namely after step S4 on one side of the circuit board 2, 21 namely on the side of the surface A.
  • This arrangement has the advantage that on the surface B of the circuit board 1 for soldering a cable, shown in Example of a ribbon cable 5, no legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are arranged as geometric Obstacles or interference contours would affect the soldering process.
  • the Ribbon cable 5 has, according to FIG. 5, six individual wires 5.1 to 5.6 with associated insulation, each individual wire is 5.1 to 5.6 to Purpose of its identification with a different colored one Surrounded by plastic insulation.
  • Using a ribbon cable 5 has the advantage, among other things, that the order of the individual wires 5.1 to 5.6 given by their lateral connection of the plastic insulation is so that the individual wires 5.1 to 5.6 are mixed up when soldering to the respective pads 1.3, 1.31, 1.31a, 1.32, 1.32a largely avoided can be.
  • the stripped ends of the individual wires 5.1 to 5.6 of the ribbon cable 5 are thus connected to the pads 1.3, 1.31, 1.32 soldered with a hand soldering process. Because the surface B the printed circuit board 1 has no geometric obstacles for soldering, the soldering can be done very quickly and a consistently high quality of the Soldering points between the ends of the ribbon cable 5 and the pads 1.3, 1.31, 1.32 can be achieved.
  • FIG. 4 is a top view of a slip ring brush according to the invention shown.
  • the soldered to the circuit board 1 protrude in the illustration Wire bracket 2, 21 out of the drawing plane. 4 is the Rotor 4, consisting of six individual axially lined up and against each other electrically insulated slip rings, such as those in the fully assembled Slip ring unit is provided, indicated by dashed lines.
  • the ribbon cable 5, which on the Surface B of the circuit board 1 is shown attached, the one of the circuit board 1 hidden contours of the ribbon cable 5 shown in dashed lines are.
  • FIG. 5 shows a side view of the slip ring brush according to the invention, consisting of the circuit board 1, which serves as a brush block and the Wire bracket 21, which is a brush element.
  • the circuit board 1 On the slip ring brush, or on the circuit board 1 is a ribbon cable 5 according to the section Z-Z ( Figure 4) contacted.
  • the outer individual wires 5.1, 5.2 are in the area of Connection end of the ribbon cable 5 according to the pattern of Pads 1.3, 1.31, 1.32 ( Figure 2) bent divergently.
  • the legs 21.2, 21.3 of the wire bracket 21 lie according to the figure 4 on a slip ring of the Rotor 4. It is for a perfect function of the slip ring unit necessary that at least one of the legs 21.2, 21.3 always on one Slip ring is present.
  • the electricity to be transmitted then arrives via the conductor track 1.12 on the surface B of the circuit board 1 to the pad 1:32.
  • a single wire 5.2 of the ribbon cable 5 is soldered to this pad 1.32, so that the current to be transmitted flows into the ribbon cable 5 can.

Abstract

The slip ring brush has a circuit board (1) with opposing first and second (B) surfaces, a conducting track and a bore (1.21, 1.22) through both surfaces and a brush element (21). A connection is made between the brush element and conducting track by soldering. The method involves soldering the brush element so that the solder (3) passes from the second circuit board surface through the bore to the brush element on the first circuit board surface. An independent claim is also included for the following: (a) slip ring brushes manufactured in accordance with the inventive method.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von Schleifringbürsten gemäß dem Anspruch 1. Darüber hinaus umfasst die Erfindung, gemäß dem Anspruch 8 eine Schleifringbürste selbst.The invention relates to a method for producing slip ring brushes according to claim 1. Furthermore, the invention comprises, according to Claim 8 a slip ring brush itself.

Schleifringeinheiten bestehen häufig unter anderem aus einer Schleifringbürste und Schleifringen, wobei die Schleifringbürste im Betrieb gleitenden Kontakt zu rotierenden Schleifringen hat. Derartige Schleifringeinheiten werden in vielen technischen Gebieten eingesetzt, um elektrische Signale oder elektrische Leistung von einer ortsfesten auf eine sich drehende elektrische Einheit zu übertragen. Dabei ist es wichtig, dass beispielsweise durch federnde Bürstenelemente ein guter und andauernder Kontakt zwischen der Schleifringbürste und den Schleifringen gegeben ist, auch wenn zum Beispiel die gesamte Schleifringeinheit Vibrationen ausgesetzt ist.Slip ring units often consist of a slip ring brush, among other things and slip rings, the slip ring brush sliding during operation Has contact with rotating slip rings. Such slip ring units are used in many technical fields to electrical signals or electrical power from a fixed to a rotating electrical Transfer unit. It is important that, for example, by resilient Brush elements a good and lasting contact between the Slip ring brush and the slip rings is given, even if for example the entire slip ring unit is exposed to vibrations.

In der Auslegeschrift DE 1 275 672 ist eine Schleifringbürste gezeigt, bei der U-förmige Bürstendrähte an einem Bürstenblock befestigt sind. Die Bürstendrähte werden im Zuge der Montage der Schleifringbürste durch den Bürstenblock hindurch geführt und durch eine Schraubverbindung am Bürstenblock festgeklemmt. Dieses Herstellungsverfahren hat unter anderem den Nachteil, dass es vergleichsweise aufwändig und zeitraubend ist. In the publication DE 1 275 672 a slip ring brush is shown at the U-shaped brush wires are attached to a brush block. The brush wires are in the course of the assembly of the slip ring brush by the Brush block passed through and a screw connection on the brush block clamped. This manufacturing process has among others the Disadvantage that it is comparatively complex and time-consuming.

In der Patentschrift US 4 583 797 ist ein Schleifring beschrieben, der ebenfalls im Wesentlichen U-förmige Bürstendrähte aufweist. Auch hier sind die U-förmigen Bürstendrähte durch einen Bürstenblock, der als Leiterplatte mit Leiterbahnen ausgebildet sein kann, hindurch gesteckt. Die Bürstendrähte sind mit der Leiterplatte so verlötet, dass sich die Lötstelle an der dem Rotor zugewandten Oberfläche der Leiterplatte befindet. Diese Bauweise hat den Nachteil, dass die Montage der entsprechenden Schleifringbürste aufwändig ist. Darüber hinaus weisen derartig hergestellte Schleifringbürsten hinsichtlich ihrer Federeigenschaften eine nicht optimale Qualität auf.US Pat. No. 4,583,797 describes a slip ring which also has substantially U-shaped brush wires. Here too are U-shaped brush wires through a brush block that is used as a circuit board Conductors can be formed, inserted through. The brush wires are soldered to the circuit board so that the solder joint is on the rotor facing surface of the circuit board. This design has the Disadvantage that the assembly of the corresponding slip ring brush is complex is. In addition, slip ring brushes manufactured in this way have regard to their spring properties a not optimal quality.

Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zur Herstellung einer Schleifringbürste zu schaffen, welches einen minimalen Montageaufwand bedingt, und durch welches qualitativ hochwertige Schleifringbürsten mit kleinem erforderlichen Bauraum herstellbar sind.The invention is therefore based on the object of a method for the production to create a slip ring brush, which requires minimal assembly effort conditioned, and by what high quality slip ring brushes can be produced with a small amount of installation space.

Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruches 1 gelöst.This object is achieved by the features of the claim 1 solved.

Darüber hinaus wird durch die Erfindung eine neuartige Schleifringbürste geschaffen, durch welche die Lebensdauer bzw. die Zuverlässigkeit von Schleifringeinheiten signifikant erhöht wird. Dies wird durch die Schleifringbürste gemäß dem Anspruch 8 gelöst.In addition, the invention provides a new slip ring brush created by which the lifespan or the reliability of Slip ring units is significantly increased. This is done through the slip ring brush solved according to claim 8.

Der Erfindung liegt der Gedanke zugrunde, dass zumindest ein Bürstenelement auf eine erste Oberfläche einer Leiterplatte gelötet wird, wobei der Lötvorgang derart vorgenommen wird, dass Lot, von der zweiten Oberfläche der Leiterplatte kommend, durch Bohrungen der Leiterplatte bis zum Bürstenelement hindurchtritt. Durch dieses Verfahren werden die Leiterbahnen der Leiterplatte mit dem Bürstenelement elektrisch und mechanisch verbunden.The invention is based on the idea that at least one brush element is soldered to a first surface of a circuit board, the soldering process is made such that solder, from the second surface the circuit board coming through holes in the circuit board up to the brush element passes. Through this process, the conductor tracks the circuit board with the brush element electrically and mechanically connected.

Im Folgendem ist unter dem Begriff Bohrung eine Öffnung bzw. ein Loch zu verstehen, welches nicht unbedingt einen Kreisquerschnitt aufweisen muss, vielmehr können die Bohrungen etwa auch einen Vieleckquerschnitt aufweisen oder beliebige sonstige Kurvengeometrien als Umfangsbegrenzung haben. In the following, an opening or a hole is closed under the term bore understand which does not necessarily have to have a circular cross-section, rather, the bores can also have a polygonal cross section or have any other curve geometry as a perimeter limitation.

In einer bevorzugten Ausgestaltung der Erfindung werden an der zweiten Oberfläche der Leiterplatte Pads angeordnet, an den die Enden eines Kabels, mit Vorteil eines Flachbandkabels, elektrisch kontaktiert werden können.In a preferred embodiment of the invention, the second Surface of the circuit board pads arranged on which the ends of a cable, with the advantage of a ribbon cable, can be electrically contacted.

Vorteilhafte Ausbildungen der Erfindung entnimmt man den abhängigen Ansprüchen.Advantageous developments of the invention can be found in the dependent claims.

Weitere Einzelheiten und Vorteile des erfindungsgemäßen Schleifringes und des entsprechenden Verfahrens ergeben sich aus der nachfolgenden Beschreibung eines Ausführungsbeispieles anhand der beiliegenden Figuren.Further details and advantages of the slip ring according to the invention and of the corresponding method result from the following description an embodiment with reference to the accompanying figures.

Es zeigen die

Figur 1
eine Draufsicht auf eine erste Oberfläche einer Leiterplatte, die als Bürstenblock dient,
Figur 2
eine Draufsicht auf eine zweite, der ersten gegenüber liegenden, Oberfläche der Leiterplatte,
Figur 3
eine schematische Darstellung von Verfahrensschritten zur Herstellung einer erfindungsgemäßen Schleifringbürste,
Figur 4
eine Draufsicht der Schleifringbürste mit einem Flachbandkabel,
Figur 5
eine Seitenansicht der Schleifringbürste mit an der Leiterplatte befestigten Bürstenelementen und einem Flachbandkabel.
They show
Figure 1
3 shows a plan view of a first surface of a printed circuit board which serves as a brush block,
Figure 2
2 shows a plan view of a second surface of the printed circuit board opposite the first,
Figure 3
1 shows a schematic representation of process steps for producing a slip ring brush according to the invention,
Figure 4
a plan view of the slip ring brush with a ribbon cable,
Figure 5
a side view of the slip ring brush with brush elements attached to the circuit board and a ribbon cable.

In der Figur 1 ist eine Draufsicht auf eine erste Oberfläche A einer Leiterplatte 1 dargestellt. Auf dieser Oberfläche A der Leiterplatte 1 befinden sich Leiterbahnen 1.1, 1.11 im gezeigten Beispiel aus Kupfer, die an Bohrungen 1.2, 1.21, 1.22 enden. Diese Bohrungen 1.2, 1.21, 1.22, welche die Leiterplatte 1 vollständig durchdringen, sind metallisiert, so dass sie an ihren Innenwandungen, sowie ringförmig an deren Rändern metallisch, im gezeigten Beispiel mit Zinn, beschichtet sind. Die Leiterplatte 1 besteht aus Epoxydharz, welches mit Glasfasern gefüllt ist, und weist eine vergleichsweise niedrige Wärmeleitfähigkeit auf. Alternativ dazu können auch andere Materialen für die Leiterplatte 1 verwendet werden, wie zum Beispiel Werkstoffe, die auf Polyamid- oder Keramikkomponenten basieren.In Figure 1 is a plan view of a first surface A of a circuit board 1 shown. There are conductor tracks on this surface A of the printed circuit board 1 1.1, 1.11 in the example shown made of copper, the holes 1.2, 1.21, 1.22 end. These holes 1.2, 1.21, 1.22, which the circuit board 1 penetrate completely, are metallized so that they are on their inner walls, as well as ring-shaped at the edges, in the example shown coated with tin. The circuit board 1 consists of epoxy resin, which is filled with glass fibers, and has a comparatively low Thermal conductivity. Alternatively, other materials for the circuit board 1 can be used, such as materials based on Polyamide or ceramic components are based.

In der Figur 2 ist eine Draufsicht auf die zweite Oberfläche B der Leiterplatte 1 gezeigt. In dieser Ansicht sind neben den Bohrungen 1.2, 1.21, 1.22 und weiteren Leiterbahnen 1.1, 1.12 auch Pads 1.3, 1.31, 1.31a, 1.32, 1.32a dargestellt. Parallel zur Zeichenebene der Figuren 1 und 2 verläuft eine virtuelle geometrische Ebene, nämlich der Mittenlängsschnitt C, welche in den Figuren 3 und 5 in den Seitenansichten der Leiterplatte 1 dargestellt ist. Demnach befindet sich der Mittenlängsschnitt C mittig zwischen den beiden Oberflächen A und B.FIG. 2 is a top view of the second surface B of the circuit board 1 shown. In addition to holes 1.2, 1.21, 1.22 and further conductor tracks 1.1, 1.12 also pads 1.3, 1.31, 1.31a, 1.32, 1.32a shown. A virtual one runs parallel to the drawing plane of FIGS. 1 and 2 geometric plane, namely the central longitudinal section C, which in the Figures 3 and 5 is shown in the side views of the circuit board 1. Accordingly, the central longitudinal section C is located in the middle between the two Surfaces A and B.

Gemäß den Figuren 1 und 2, sind sowohl auf der Oberfläche A, als auch auf der Oberfläche B, die Leiterbahnen 1.1, 1.11, 1.12 als auch die Pads 1.3, 1.31, 1.31a, 1.32, 1.32a punktsymmetrisch bezüglich des Flächenmittelpunktes P angeordnet. Darüber hinaus gilt diese Symmetriebetrachtung bezüglich des Flächenmittelpunktes P auch für die Bohrungen 1.2, 1.21, 1.22 und die Außenkontur der Leiterplatte 1.According to Figures 1 and 2, are on both the surface A and the surface B, the conductor tracks 1.1, 1.11, 1.12 and the pads 1.3, 1.31, 1.31a, 1.32, 1.32a point symmetrical with respect to the Area center P arranged. In addition, this applies Symmetry consideration with respect to the center of the area P also for the Bores 1.2, 1.21, 1.22 and the outer contour of the circuit board 1.

Gemäß den Figuren 3, 4 und 5 umfasst die erfindungsgemäße Schleifringbürste Bürstenelemente, die im gezeigten Beispiel als Drahtbügel 2, 21 ausgeführt sind. Die Drahtbügel 2, 21, welche allesamt baugleich ausgeführt sind, weisen drei Schenkel 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 auf und haben eine im Wesentliche U-förmige bzw. Ω-förmige Gestalt, so dass die Drahtbügel 2, 21 jeweils eine Öffnung 21.4 haben. Die Drahtbügel 2, 21 bzw. deren Schenkel 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 haben eine Innenseite I und eine Außenseite O. Die Innenseite I ist derjenige geometrische Bereich der Schenkel 2.1, 21.1; 2.2, 21.2; 2.3, 21.3, der zum Mittelpunkt bzw. zum Schwerpunkt des Drahtbügels 2, 21 weist. Dagegen weist die Außenseite O vom Mittelpunkt des U- bzw. Ω-förmigen Drahtbügels 2, 21 weg nach außen. Die Außenseite O ist also am Außenumfang des Drahtbügels 2, 21. According to FIGS. 3, 4 and 5, the slip ring brush according to the invention comprises Brush elements, which in the example shown are designed as wire brackets 2, 21 are. The wire bracket 2, 21, which are all identical in construction are, have three legs 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 and have one essentially U-shaped or Ω-shaped shape, so that the wire bracket 2, 21 each have an opening 21.4. The wire bracket 2, 21 or their Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3 have an inside I and one Outside O. The inside I is the geometric area of the Leg 2.1, 21.1; 2.2, 21.2; 2.3, 21.3, the center or the Center of gravity of the wire bracket 2, 21 points. In contrast, the outside shows O away from the center of the U- or Ω-shaped wire bracket 2, 21. The outer side O is therefore on the outer circumference of the wire bracket 2, 21.

Die Drahtbügel 2, 21 sind im vorgestellten Ausführungsbeispiel aus einem 20 mm langen Draht mit einem Durchmesser von 0,2 mm durch ein Biegeverfahren hergestellt. Bedingt durch die Anforderungen bezüglich einer möglichst miniaturisierten Bauweise der Schleifringeinheiten weisen die Drahtbügel 2, 21 einen entsprechend geringen Durchmesser auf. Die derartig dünnen Drahtbügel 2, 21 haben eine überaus hohe volumenbezogene Oberfläche (etwa 20 mm2/mm3), wodurch sie binnen kürzester Zeit in ihrem gesamten Volumen die Umgebungstemperatur annehmen. Die Drahtbügel 2, 21 bestehen im gezeigten Beispiel aus einer Edelmetalllegierung. Diese Edelmetalllegierung weist als Hauptbestandteil das Edelmetall Palladium auf mit Anteilen von Kupfer und Silber. Alternativ dazu kann beispielsweise als Edelmetalllegierung auch eine Mischung aus Gold, Kupfer und Silber verwendet werden, wobei hier Gold als Hauptkomponente verwendet werden kann. Die Komponenten der Legierung weisen jedenfalls mit Vorteil ein in Bezug auf Wasserstoff als Nullpotential positives elektrochemisches Potenzial auf.In the exemplary embodiment presented, the wire clips 2, 21 are produced from a 20 mm long wire with a diameter of 0.2 mm by a bending process. Due to the requirements regarding a design of the slip ring units that is as miniaturized as possible, the wire clips 2, 21 have a correspondingly small diameter. Such thin wire brackets 2, 21 have an extremely high volume-related surface area (approximately 20 mm 2 / mm 3 ), as a result of which they assume the ambient temperature in their entire volume within a very short time. In the example shown, the wire clips 2, 21 consist of a noble metal alloy. The main component of this noble metal alloy is the noble metal palladium with proportions of copper and silver. As an alternative to this, a mixture of gold, copper and silver can also be used, for example, as the noble metal alloy, in which case gold can be used as the main component. In any case, the components of the alloy advantageously have an electrochemical potential which is positive with respect to hydrogen as zero potential.

Anhand der Verbindung und Kontaktierung des Drahtbügels 21 an die Leiterplatte 1 soll das Verfahren zur Herstellung der erfindungsgemäßen Schleifringbürste erläutert werden.Based on the connection and contacting of the wire bracket 21 to the circuit board 1 is intended to illustrate the process for the preparation of the invention Slip ring brush are explained.

Zunächst werden in dem Verfahren entsprechend der Figur 3 in den Schritten S1 und S2 die Leiterplatte 1 und ein Drahtbügel 21 bereitgestellt. Sodann wird im Schritt S3 auf die Oberfläche A der Leiterplatte 1 die Außenseite O des Schenkels 21.1 des Drahtbügels 21 derart aufgesetzt, dass die Außenseite O des Schenkels 21.1 am Austritt der Bohrungen 1.21, 1.22 zu liegen kommt. Dabei ist also der Drahtbügel 21 so ausgerichtet, dass bezogen auf den Mittenquerschnitt C der Leiterplatte 1 sich die Öffnung 21.4 auf der gleichen Seite befindet wie die Oberfläche A, an welcher der Schenkel 21.1 aufgesetzt ist. Mit anderen Worten sind ausgehend vom Mittenquerschnitt C die jeweiligen Elemente in folgender Reihenfolge angeordnet: Oberfläche A, Schenkel 21.1, Öffnung 21.4, so dass der Schenkel 21.1 zwischen der Leiterplatte 1 und der Öffnung 21.4 liegt. Im Idealfall wird der Schenkel 21.1 so auf die Oberfläche A der Leiterplatte 1 aufgesetzt, dass dieser mittig über dem jeweiligen Austritt der Bohrungen 1.21, 1.22 zu liegen kommt. In der Praxis zeigt sich jedoch, dass hier Abweichungen von ± 0,4 mm von der Mitte der Bohrungen 1.21, 1.22 toleriert werden können, ohne dass nennenswerte Qualitätseinbußen der Lötverbindung festgestellt werden. Die Schenkel 21.1 werden jedenfalls am Austritt der Bohrungen 1.21, 1.22 auf die Leiterplatte 1 aufgesetzt. Der Begriff am Austritt der Bohrungen 1.21, 1.22 umfasst also einen Flächenbereich, innerhalb welchem ein aufgesetzter Schenkel 21.1 noch mittels Lot 3, welches durch die Bohrungen 1.21, 1.22 hindurchtritt funktionsgemäß verlötet werden kann.First, in the process according to Figure 3 in the steps S1 and S2 the circuit board 1 and a wire bracket 21 provided. thereupon in step S3 the surface A of the circuit board 1 becomes the outside O of the leg 21.1 of the wire bracket 21 placed such that the Outside O of the leg 21.1 at the exit of the holes 1.21, 1.22 comes to lie. Thus, the wire bracket 21 is oriented so that related the opening 21.4 on the central cross section C of the circuit board 1 is on the same side as surface A, on which the leg 21.1 is attached. In other words, starting from the central cross section C arranged the respective elements in the following order: surface A, leg 21.1, opening 21.4, so that the leg 21.1 between the circuit board 1 and the opening 21.4. Ideally, the Leg 21.1 so placed on the surface A of the circuit board 1 that this to be centered over the respective exit of the holes 1.21, 1.22 comes. In practice, however, it shows that there are deviations from ± 0.4 mm from the center of the holes 1.21, 1.22 can be tolerated, without noticeable loss of quality in the soldered connection become. The legs 21.1 are in any case at the exit of the holes 1.21, 1.22 placed on the circuit board 1. The term at the exit of the holes 1.21, 1.22 thus comprises an area within which an attached leg 21.1 still using Lot 3, which through the holes 1.21, 1.22 can pass through functionally soldered.

Nachdem der Drahtbügel 21 bzw. dessen Schenkel 21.1 nunmehr derartig am Austritt der Bohrungen 1.21, 1.22 auf die Leiterplatte 1 aufgesetzt wurde, wird dieser im gezeigten Beispiel durch ein Handlötverfahren an der Leiterplatte 1 dauerhaft befestigt. Dabei wird das heiße Lot, bzw. das heiße Lötzinn, von der Oberfläche B der Leiterplatte 1 her in die Bohrungen 1.21, 1.22 eingeführt, so dass es infolge der Kapillarwirkung durch die Bohrungen 1.21, 1.22 und durch den Spalt zwischen den Bohrungen 1.21, 1.22 und dem Drahtbügel 21 steigt. Die Wärmequelle für den Lötprozess befindet sich also auf der dem Drahtbügel 21 gegenüberliegenden Seite der Leiterplatte 1, so dass die Leiterplatte 1 eine gegenüber dem Wärmeeintrag abschirmende Wirkung auf den Drahtbügel 21 ausübt.After the wire bracket 21 or its leg 21.1 now such was placed on the circuit board 1 at the exit of the holes 1.21, 1.22, this is in the example shown by a hand soldering process on the circuit board 1 permanently attached. The hot solder, or the hot solder, from the surface B of the circuit board 1 into the holes 1.21, 1.22 introduced so that due to the capillary action through the holes 1.21, 1.22 and through the gap between the holes 1.21, 1.22 and the Wire bracket 21 rises. The heat source for the soldering process is therefore located on the opposite side of the wire bracket 21 of the circuit board 1, so that the circuit board 1 shields against the heat input Has an effect on the wire bracket 21.

Wie bereits beschrieben, nehmen derartig filigrane Drahtbügel 2, 21 sehr rasch die Umgebungstemperatur an. Wenn nun ein Drahtbügel 2, 21 einer Temperatur, wie sie bei einem herkömmlichen Lötprozess auftritt, unmittelbar ausgesetzt würde, würde dieser ohne nennenswerten Zeitverzug vollständig durchwärmt. Eine Durchwärmung auf diesem Temperaturniveau führt aber bei den Werkstoffen, wie sie üblicherweise für die Drahtbügel 2, 21 verwendet werden, zu einer Veränderung im Werkstoffgefüge, was letztlich die elastische Verformbarkeit der Drahtbügel 2, 21 bzw. deren Federkonstante verschlechtert. Durch das erfindungsgemäße Verfahren wird also unter anderem eine temperaturschonende Behandlung der Drahtbügel 2, 21 erreicht, wenn diese an die Leiterplatte 1 gelötet werden. As already described, such filigree wire brackets 2, 21 take a lot the ambient temperature quickly. If now a wire bracket 2, 21 one Temperature, as occurs in a conventional soldering process, immediately would be suspended, this would be complete without any significant delay heated through. A warming at this temperature level leads but with the materials, as usually for the wire bracket 2, 21 are used to change the material structure, which ultimately the elastic deformability of the wire bracket 2, 21 or their spring constant deteriorated. By the method according to the invention among other things, a temperature-friendly treatment of the wire bracket 2, 21 reached when these are soldered to the circuit board 1.

Mit dem Verfahren wird nunmehr vermieden, dass die Drahtbügel 2, 21 hohen Temperaturen ausgesetzt werden, so dass durch das Anlöten keine Beeinträchtigungen seiner Federeigenschaften, bzw. seiner Elastizität festzustellen sind, insbesondere in den Bereichen welche im Betrieb eine hohe Elastizität aufweisen müssen, nämlich die Schenkel 2.2, 21.2 und 2.3, 21.3, sowie die Übergangsbereiche von diesen Schenkeln 2.2, 21.2, 2.3, 21.3 in den Schenkel 2.1, 21.1. Mit dem gleichen Verfahren werden danach alle übrigen Drahtbügel 2, an der Leiterplatte 1 befestigt. Auf diese Weise wird durch einen Arbeitsgang, nämlich dem Lötprozess, sowohl eine elektrische Kontaktierung zwischen den Drahtbügeln 2, 21 und den Leiterbahnen 1.1, 1.11, 1.12 hergestellt, als auch eine feste mechanische Verbindung zwischen den Drahtbügeln 2, 21 und der Leiterplatte 1. Weitere Arbeitsgänge zum Befestigen der Drahtbügel 2, 21 auf der Leiterplatte 1 sind nicht zwingend notwendig, so dass mit diesem Verfahren eine überaus wirtschaftliche Herstellung von Schleifringbürsten möglich ist. Die Leiterplatte 1 erfüllt nunmehr auch die Funktion eines Bürstenblockes einer Schleifringbürste.
Alternativ zum Handlötverfahren kann auch ein Schwalllötverfahren angewendet werden, bei dem vor dem eigentlichen Löten die Schenkel 2.1, 21.1 der Drahtbügel 2, 21 auf die Oberfläche A der Leiterplatte 1 aufgeklebt werden, wobei die Drahtbügel 2, 21 wiederum so ausgerichtet werden, dass sich die Öffnung 21.4 bezogen auf den Mittenlängsschnitt C der Leiterplatte 1 auf der gleichen Seite befindet, wie die Oberfläche A und die für die Kontaktierung jeweils relevanten Bohrungen 1.2, 1.21, 1.22 von den Schenkeln 2.1, 21.1 der Drahtbügel 2, 21 abgedeckt werden, bzw. die Schenkel 2.1, 21.1 am Austritt der Bohrungen 1.2, 1.21, 1.22 liegen. Danach wird die Leiterplatte 1 über ein Transportsystem mit gleichmäßiger Geschwindigkeit durch eine Lötmaschine bewegt und einem Schwalllötverfahren ausgesetzt. Um zu verhindern, dass die Pads 1.3, 1.31, 1.31a, 1.32, 1.32a Lot annehmen, oder wenn bestimmte Bohrungen 1.2, 1.21, 1.22 auf der Leiterplatte 1 nicht mit Lot gefüllt werden sollen, kann man diese Pads 1.3, 1.31, 1.31a, 1.32, 1.32a oder die betreffende Bohrungen 1.2, 1.21, 1.22 vor dem Schwalllöten mit hitzebeständigem Klebestreifen abkleben. With the method it is now avoided that the wire clips 2, 21 are exposed to high temperatures, so that no impairment of their spring properties or their elasticity can be determined by the soldering, in particular in the areas which must have a high elasticity during operation, namely Legs 2.2, 21.2 and 2.3, 21.3, as well as the transition areas from these legs 2.2, 21.2, 2.3, 21.3 to leg 2.1, 21.1. All other wire clips 2 are then attached to the printed circuit board 1 using the same method. In this way, an electrical contact between the wire clips 2, 21 and the conductor tracks 1.1, 1.11, 1.12, as well as a fixed mechanical connection between the wire clips 2, 21 and the circuit board 1 Work steps for attaching the wire clips 2, 21 to the printed circuit board 1 are not absolutely necessary, so that an extremely economical production of slip ring brushes is possible with this method. The circuit board 1 now also fulfills the function of a brush block of a slip ring brush.
As an alternative to the manual soldering process, a wave soldering process can also be used, in which the legs 2.1, 21.1 of the wire clips 2, 21 are glued onto the surface A of the circuit board 1 before the actual soldering, the wire clips 2, 21 in turn being aligned such that the Opening 21.4 with respect to the central longitudinal section C of the circuit board 1 is on the same side as the surface A and the bores 1.2, 1.21, 1.22 which are relevant for the contacting are covered by the legs 2.1, 21.1 of the wire bracket 2, 21, respectively Legs 2.1, 21.1 are located at the exit of the holes 1.2, 1.21, 1.22. Thereafter, the circuit board 1 is moved over a transport system at a uniform speed through a soldering machine and subjected to a wave soldering process. To prevent the pads 1.3, 1.31, 1.31a, 1.32, 1.32a from accepting solder, or if certain holes 1.2, 1.21, 1.22 on the circuit board 1 are not to be filled with solder, these pads 1.3, 1.31, 1.31 Mask a, 1.32, 1.32a or the relevant holes 1.2, 1.21, 1.22 with wave-resistant adhesive strips before wave soldering.

Alle Schenkel 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 der Drahtbügel 2, 21 befinden sich also nach dem Schritt S4 auf einer Seite der Leiterplatte 2, 21 nämlich auf der Seite der Oberfläche A. Diese Anordnung hat den Vorteil, dass somit an der Oberfläche B der Leiterplatte 1 für das Anlöten eines Kabels, im gezeigten Beispiel eines Flachbandkabels 5, keine Schenkel 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 des Drahtbügels 2, 21 angeordnet sind, die als geometrische Hindernisse oder Störkonturen für den Anlötprozess wirken würden. Das Flachbandkabel 5 weist gemäß der Figur 5 sechs Einzeldrähte 5.1 bis 5.6 mit zugehöriger Isolierung auf, dabei ist jeder Einzeldraht 5.1 bis 5.6 zum Zwecke seiner Kennzeichnung mit jeweils einer unterschiedlich eingefärbten Kunststoff-Isolierung umgeben. Die Verwendung eines Flachbandkabels 5 hat unter anderem den Vorteil, dass die Reihenfolge der Einzeldrähte 5.1 bis 5.6 durch deren jeweils seitliche Verbindung der Kunststoff-Isolierung vorgegeben ist, so dass ein Vertauschen der Einzeldrähte 5.1 bis 5.6 beim Anlöten an die jeweiligen Pads 1.3, 1.31, 1.31a, 1.32, 1.32a weitgehend vermieden werden kann. Die abisolierten Enden der Einzeldrähte 5.1 bis 5.6 des Flachbandkabels 5 werden also im Schritt S5 an die Pads 1.3, 1.31, 1.32 mit einem Handlötverfahren gelötet. Dadurch, dass die Oberfläche B der Leiterplatte 1 für das Löten keine geometrischen Hindernisse aufweist, kann das Löten sehr rasch erfolgen und eine durchgehend hohe Qualität der Lötstellen zwischen den Enden des Flachbandkabels 5 und den Pads 1.3, 1.31, 1.32 erreicht werden.All legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are located namely after step S4 on one side of the circuit board 2, 21 namely on the side of the surface A. This arrangement has the advantage that on the surface B of the circuit board 1 for soldering a cable, shown in Example of a ribbon cable 5, no legs 2.1, 21.1, 2.2, 21.2, 2.3, 21.3 of the wire bracket 2, 21 are arranged as geometric Obstacles or interference contours would affect the soldering process. The Ribbon cable 5 has, according to FIG. 5, six individual wires 5.1 to 5.6 with associated insulation, each individual wire is 5.1 to 5.6 to Purpose of its identification with a different colored one Surrounded by plastic insulation. Using a ribbon cable 5 has the advantage, among other things, that the order of the individual wires 5.1 to 5.6 given by their lateral connection of the plastic insulation is so that the individual wires 5.1 to 5.6 are mixed up when soldering to the respective pads 1.3, 1.31, 1.31a, 1.32, 1.32a largely avoided can be. The stripped ends of the individual wires 5.1 to 5.6 of the ribbon cable 5 are thus connected to the pads 1.3, 1.31, 1.32 soldered with a hand soldering process. Because the surface B the printed circuit board 1 has no geometric obstacles for soldering, the soldering can be done very quickly and a consistently high quality of the Soldering points between the ends of the ribbon cable 5 and the pads 1.3, 1.31, 1.32 can be achieved.

In der Figur 4 ist eine Draufsicht auf eine erfindungsgemäße Schleifringbürste gezeigt. Dabei ragen in der Darstellung die an die Leiterplatte 1 angelöteten Drahtbügel 2, 21 aus der Zeichenebene heraus. In der Figur 4 ist der Rotor 4, bestehend aus sechs einzelnen axial aneinandergereihten und gegeneinander elektrisch isolierten Schleifringen, wie er in der fertig montierten Schleifringeinheit vorgesehen ist, durch gestrichelte Linien angedeutet. Darüber hinaus ist in dieser Figur 4 auch das Flachbandkabel 5, welches an der Oberfläche B der Leiterplatte 1 befestigt ist gezeigt, wobei die von der Leiterplatte 1 verdeckten Konturen des Flachbandkabels 5 gestrichelt dargestellt sind. FIG. 4 is a top view of a slip ring brush according to the invention shown. The soldered to the circuit board 1 protrude in the illustration Wire bracket 2, 21 out of the drawing plane. 4 is the Rotor 4, consisting of six individual axially lined up and against each other electrically insulated slip rings, such as those in the fully assembled Slip ring unit is provided, indicated by dashed lines. About that In addition, in this Figure 4, the ribbon cable 5, which on the Surface B of the circuit board 1 is shown attached, the one of the circuit board 1 hidden contours of the ribbon cable 5 shown in dashed lines are.

Die Figur 5 zeigt eine Seitenansicht der erfindungsgemäßen Schleifringbürste, bestehend aus der Leiterplatte 1, welche als Bürstenblock dient und dem Drahtbügel 21, der ein Bürstenelement darstellt. An der Schleifringbürste, bzw. an der Leiterplatte 1 ist ein Flachbandkabel 5 gemäß dem Schnitt Z-Z (Figur 4) kontaktiert. Die äußeren Einzeldrähte 5.1, 5.2 sind im Bereich des Anschlussendes des Flachbandkabels 5 entsprechend dem Muster der Pads 1.3, 1.31, 1.32 (Figur 2) divergierend gebogen. Die Schenkel 21.2, 21.3 des Drahtbügels 21 liegen gemäß der Figur 4 an einem Schleifring des Rotors 4 an. Für eine einwandfreie Funktion der Schleifringeinheit ist es notwendig, dass stets zumindest einer der Schenkel 21.2, 21.3 an einem Schleifring anliegt. Eine entscheidende Größe für dieses Verhalten ist die Federkonstante des Drahtbügels 21. Diese Federkonstante wurde aufgrund des thermisch schonenden Herstellungsverfahrens der Schleifringbürste nicht nachteilig beeinflusst. Es werden also durch den schleifenden Kontakt Ströme vom Rotor beispielsweise auf den Drahtbügel 21 übertragen. Über die mit Lot 3 aufgefüllten Bohrungen 1.21, 1.22 wird der Strom zur Leiterbahn 1.11, die sich auf der Oberfläche A der Leiterplatte befindet, geleitet. Durch die Kontaktierung an zwei Bohrungen 1.21, 1.22 wird einerseits sichergestellt, dass eine ausreichende mechanische Festigkeit der Verbindung gegeben ist, und andererseits wird auch eine redundante elektrische Verbindung erreicht, weil die Bohrungen 1.21, 1.22 durch die Leiterbahn 1.11 miteinander verbunden sind. Der zu übertragende Strom gelangt dann über die Leiterbahn 1.12 auf der Oberfläche B der Leiterplatte 1 zum Pad 1.32. An diesem Pad 1.32 ist ein Einzeldraht 5.2 des Flachbandkabels 5 angelötet, so dass der zu übertragene Strom in das Flachbandkabel 5 fließen kann.FIG. 5 shows a side view of the slip ring brush according to the invention, consisting of the circuit board 1, which serves as a brush block and the Wire bracket 21, which is a brush element. On the slip ring brush, or on the circuit board 1 is a ribbon cable 5 according to the section Z-Z (Figure 4) contacted. The outer individual wires 5.1, 5.2 are in the area of Connection end of the ribbon cable 5 according to the pattern of Pads 1.3, 1.31, 1.32 (Figure 2) bent divergently. The legs 21.2, 21.3 of the wire bracket 21 lie according to the figure 4 on a slip ring of the Rotor 4. It is for a perfect function of the slip ring unit necessary that at least one of the legs 21.2, 21.3 always on one Slip ring is present. A decisive factor for this behavior is that Spring constant of wire bracket 21. This spring constant was due to the thermally gentle manufacturing process of the slip ring brush not adversely affected. So it is due to the sliding contact Currents are transferred from the rotor to the wire bracket 21, for example. about the holes 1.21, 1.22 filled with Lot 3 becomes the current to the conductor track 1.11, which is located on the surface A of the circuit board. By contacting two bores 1.21, 1.22, on the one hand, it is ensured that that adequate mechanical strength of the connection is given, and on the other hand there is also a redundant electrical Connection reached because the holes 1.21, 1.22 through the conductor track 1.11 are connected. The electricity to be transmitted then arrives via the conductor track 1.12 on the surface B of the circuit board 1 to the pad 1:32. A single wire 5.2 of the ribbon cable 5 is soldered to this pad 1.32, so that the current to be transmitted flows into the ribbon cable 5 can.

Durch die bezüglich des Punktes P symmetrische Anordnung der Bohrungen 1.2, 1.21, 1.22, Leiterbahnen 1.1, 1.11, 1.12 und Pads 1.3, 1.31, 1.31a, 1.32, 1.32a kann die Ausschussrate bei der Herstellung der Schleifringbürste bzw. die Bearbeitungszeit in der Fertigung erheblich reduziert werden. Denn es muss aus diesem Grund beim Aufsetzten eines Drahtbügels 2, 21 lediglich darauf geachtet werden, dass die richtige Seite, beispielsweise die Oberfläche A, der Leiterplatte 1 für das Aufsetzen gewählt wird. Dagegen spielt eine um den Punkt P um 180° verdrehte Lage der Leiterplatte 1 keine Rolle für die spätere Funktionsfähigkeit der Schleifringbürste.Due to the symmetrical arrangement of the holes with respect to point P. 1.2, 1.21, 1.22, tracks 1.1, 1.11, 1.12 and pads 1.3, 1.31, 1.31a, 1.32, 1.32a can reduce the reject rate in the manufacture of the slip ring brush or the processing time in production can be significantly reduced. For this reason, when a wire bracket 2, 21 is attached, just make sure that the right side, for example the Surface A, the circuit board 1 is chosen for putting on. On the other hand does not play a position of the circuit board 1 rotated by the point P by 180 ° Roller for the later functionality of the slip ring brush.

Claims (13)

Verfahren zur Herstellung einer Schleifringbürste umfassend eine Leiterplatte (1), die eine erste Oberfläche (A) und eine der erste Oberfläche (A) gegenüberliegende zweite Oberfläche (B) aufweist,
mit einer Leiterbahn (1.1, 1.11, 1.12) und einer Bohrung (1.2, 1.21, 1.22), welche die Leiterplatte (1) durch die Oberfläche (A) und die Oberfläche (B) hindurch durchdringt, und einem Bürstenelement (2, 21), wobei
ein elektrischer Kontakt zwischen dem Bürstenelement (2) und der Leiterbahn (1.1, 1.11, 1.12) durch Löten hergestellt wird, dadurch gekennzeichnet dass,
das Bürstenelement (2, 21), in der Weise verlötet wird, dass das Lot (3), kommend von der zweiten Oberfläche (B) der Leiterplatte (1)
durch die Bohrung (1.2, 1.21, 1.22) der Leiterplatte (1) bis hin zum Bürstenelement (2, 21) an der Oberfläche (A) hindurchtritt. A method of making a slip ring brush comprising a printed circuit board (1) which has a first surface (A) and a second surface (B) opposite the first surface (A),
with a conductor track (1.1, 1.11, 1.12) and a bore (1.2, 1.21, 1.22) which penetrates the circuit board (1) through the surface (A) and the surface (B), and a brush element (2, 21), wherein
an electrical contact between the brush element (2) and the conductor track (1.1, 1.11, 1.12) is produced by soldering, characterized in that
the brush element (2, 21) is soldered in such a way that the solder (3) coming from the second surface (B) of the printed circuit board (1)
through the hole (1.2, 1.21, 1.22) of the circuit board (1) up to the brush element (2, 21) on the surface (A). Verfahren gemäß dem Anspruch 1, dadurch gekennzeichnet dass das Bürstenelement (2, 21) eine Innenseite (I) und eine Außenseite (O) aufweist, und vor dem Löten die Außenseite (O) des Bürstenelementes (2, 21) auf die erste Oberfläche (A) der Leiterplatte (1) aufgesetzt wird. Method according to claim 1, characterized in that the brush element (2, 21) has an inside (I) and an outside (O), and before soldering the outside (O) of the brush element (2, 21) on the first surface ( A) the circuit board (1) is placed. Verfahren gemäß dem Anspruch 1 oder 2, dadurch gekennzeichnet dass, das Bürstenelement (2, 21) vor dem Löten so ausgerichtet wird, dass das Bürstenelement (2, 21) am Austritt der Bohrung (1.2, 1.21, 1.22) aus der ersten Oberfläche (A) der Leiterplatte (1) zu liegen kommt.A method according to claim 1 or 2, characterized in that the brush element (2, 21) is aligned prior to soldering so that the brush element (2, 21) at the exit of the bore (1.2, 1.21, 1.22) from the first surface ( A) the circuit board (1) comes to rest. Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Bohrung (1.2, 1.21, 1.22) vor dem Löten metallisiert wird.Method according to one of the preceding claims, characterized in that the bore (1.2, 1.21, 1.22) is metallized before the soldering. Verfahren gemäß einem der vorhergehenden Ansprüche, wobei ein Handlöt- oder ein Schwalllötprozess angewendet wird.Method according to one of the preceding claims, wherein a Hand soldering or a wave soldering process is used. Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) aus mehreren Schenkeln (2.1, 21.1, 2.2, 21.2, 2.3, 21.3) besteht.Method according to one of the preceding claims, characterized in that the brush element (2, 21) consists of several legs (2.1, 21.1, 2.2, 21.2, 2.3, 21.3). Verfahren gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass auf der zweiten Oberfläche (B) der Leiterplatte (1) ein Pad (1.3, 1.31, 1.31a, 1.32, 1.32a) vorgesehen ist, an dem in einem weiteren Verfahrensschritt das Ende eines Kabels (5), insbesondere eines Flachbandkabels, kontaktiert wird (S5).Method according to one of the preceding claims, characterized in that a pad (1.3, 1.31, 1.31a, 1.32, 1.32a) is provided on the second surface (B) of the printed circuit board (1), on which in a further method step the end of a Cable (5), in particular a ribbon cable, is contacted (S5). Schleifringbürste, bestehend aus einer Leiterplatte (1), die eine erste Oberfläche (A) und eine der erste Oberfläche (A) gegenüberliegende zweite Oberfläche (B) aufweist,
mit einer Leiterbahn (1.1, 1.11, 1.12) und einer Bohrung (1.2, 1.21, 1.22), welche die Leiterplatte (1) durch die Oberfläche (A) und die Oberfläche (B) hindurch durchdringt, und einem Bürstenelement (2, 21), wobei
das Bürstenelement (2) und die Leiterbahn (1.1, 1.11, 1.12) durch eine Lötverbindung in elektrischem Kontakt stehen, dadurch gekennzeichnet dass, das Bürstenelement (2, 21), in der Weise verlötet ist, dass das Lot (3), von der zweiten Oberfläche (B) der Leiterplatte (1) durch die Bohrung (1.2, 1.21, 1.22) der Leiterplatte (1) bis hin zum Bürstenelement (2, 21) an der Oberfläche (A) hindurchgetreten ist. Slip ring brush consisting of a printed circuit board (1) which has a first surface (A) and a second surface (B) opposite the first surface (A),
with a conductor track (1.1, 1.11, 1.12) and a bore (1.2, 1.21, 1.22) which penetrates the circuit board (1) through the surface (A) and the surface (B), and a brush element (2, 21), wherein
the brush element (2) and the conductor track (1.1, 1.11, 1.12) are in electrical contact by a soldered connection, characterized in that the brush element (2, 21) is soldered in such a way that the solder (3) from which second surface (B) of the circuit board (1) has passed through the bore (1.2, 1.21, 1.22) of the circuit board (1) to the brush element (2, 21) on the surface (A). Schleifringbürste, gemäß dem Anspruch 8, dadurch gekennzeichnet dass das Bürstenelement (2, 21) eine Innenseite (I) und eine Außenseite (O) aufweist, und dass an der Lötverbindung die Außenseite (O) des Bürstenelementes (2, 21) zur ersten Oberfläche (A) der Leiterplatte (1) weist.Slip ring brush, according to claim 8, characterized in that the brush element (2, 21) has an inside (I) and an outside (O), and that on the soldered connection the outside (O) of the brush element (2, 21) to the first surface (A) of the circuit board (1). Schleifringbürste, gemäß dem Anspruch 8 oder 9, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) U-förmig ausgestaltet ist und mehrere Schenkel (2.1, 21.1, 2.2, 21.2, 2.3, 21.3) umfasst.Slip ring brush according to claim 8 or 9, characterized in that the brush element (2, 21) is U-shaped and comprises several legs (2.1, 21.1, 2.2, 21.2, 2.3, 21.3). Schleifringbürste gemäß einem der Ansprüche 8 bis 10, dadurch gekennzeichnet, dass das Bürstenelement (2, 21) aus einer Edelmetalllegierung besteht.Slip ring brush according to one of claims 8 to 10, characterized in that the brush element (2, 21) consists of a noble metal alloy. Schleifringbürste gemäß einem der Ansprüche 8 bis 11, dadurch gekennzeichnet, dass die Bohrung (1.2, 1.21, 1.22) metallisiert ist.Slip ring brush according to one of claims 8 to 11, characterized in that the bore (1.2, 1.21, 1.22) is metallized. Schleifringbürste gemäß einem der Ansprüche 8 bis 12, dadurch gekennzeichnet, dass auf der zweiten Oberfläche (B) der Leiterplatte (1) ein Pad (1.3, 1.31, 1.31a, 1.32, 1.32a) vorgesehen ist, an dem das Ende eines Kabels (5), insbesondere eines Flachbandkabels, kontaktierbar ist.Slip ring brush according to one of claims 8 to 12, characterized in that a pad (1.3, 1.31, 1.31a, 1.32, 1.32a) is provided on the second surface (B) of the printed circuit board (1), on which the end of a cable ( 5), in particular a ribbon cable, can be contacted.
EP03026305A 2003-02-28 2003-11-15 Method for producing slip ring brushes and such a produced slip ring brush Expired - Lifetime EP1453155B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10309213 2003-02-28
DE10309213 2003-02-28
DE10324699 2003-05-30
DE10324699A DE10324699A1 (en) 2003-02-28 2003-05-30 Process for producing slip ring brushes and slip ring brush made in this way

Publications (3)

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EP1453155A2 true EP1453155A2 (en) 2004-09-01
EP1453155A3 EP1453155A3 (en) 2005-10-26
EP1453155B1 EP1453155B1 (en) 2007-03-07

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Family Applications (1)

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EP03026305A Expired - Lifetime EP1453155B1 (en) 2003-02-28 2003-11-15 Method for producing slip ring brushes and such a produced slip ring brush

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US (1) US6909217B2 (en)
EP (1) EP1453155B1 (en)
AT (1) ATE356451T1 (en)
DE (1) DE50306739D1 (en)

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DE102012203842B3 (en) * 2012-03-12 2013-09-05 Schleifring Und Apparatebau Gmbh Slip ring brush and slip ring brush holder
DE102013204004A1 (en) 2012-03-12 2013-09-12 Schleifring Und Apparatebau Gmbh Slip ring brushes with blind riveting technology and holder
DE102012204830A1 (en) 2012-03-26 2013-09-26 Schleifring Und Apparatebau Gmbh Brush block for a slip ring assembly

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US8587648B2 (en) * 2004-06-01 2013-11-19 SeeScan, Inc. Self-leveling camera head
KR100699723B1 (en) * 2005-09-12 2007-03-26 삼성전기주식회사 A brush of vibration motor
DE102006002104A1 (en) 2006-01-17 2007-07-19 Ltn Servotechnik Gmbh Slip ring brush and slip ring unit equipped with it
WO2014100590A2 (en) * 2012-12-20 2014-06-26 SeeScan, Inc. Rotating contact assemblies for self-leveling camera heads
EP2903103B1 (en) * 2014-01-31 2019-01-02 LTN Servotechnik GmbH Brush unit and slip ring assembly with a brush unit
CN111834851A (en) * 2019-04-17 2020-10-27 泓记精密股份有限公司 Brush wire structure, brush module structure and manufacturing method thereof
CN112003110B (en) * 2020-08-26 2021-10-08 徐洪杰 Production method of integral flat plate electric brush

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DE102012203842B3 (en) * 2012-03-12 2013-09-05 Schleifring Und Apparatebau Gmbh Slip ring brush and slip ring brush holder
DE102013204004A1 (en) 2012-03-12 2013-09-12 Schleifring Und Apparatebau Gmbh Slip ring brushes with blind riveting technology and holder
DE102012204829A1 (en) * 2012-03-12 2013-09-12 Schleifring Und Apparatebau Gmbh Slip ring brush for brush holder of slip ring arrangement for transmission of electric signals between mutually rotatable parts, has insertion mandrel comprising structure for pressing mandrel into hole of holder for receiving brush wire
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DE102013204004B4 (en) * 2012-03-12 2020-03-05 Schleifring Gmbh Slip ring brushes with blind riveting and holder
DE102012204830A1 (en) 2012-03-26 2013-09-26 Schleifring Und Apparatebau Gmbh Brush block for a slip ring assembly
WO2013143842A1 (en) 2012-03-26 2013-10-03 Schleifring Und Apparatebau Gmbh Brush block for a slip ring arrangement

Also Published As

Publication number Publication date
ATE356451T1 (en) 2007-03-15
US6909217B2 (en) 2005-06-21
EP1453155A3 (en) 2005-10-26
DE50306739D1 (en) 2007-04-19
US20050012426A1 (en) 2005-01-20
EP1453155B1 (en) 2007-03-07

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