EP1447214A8 - Polyimide-metal layered products and polyamideimide-metal layered product - Google Patents

Polyimide-metal layered products and polyamideimide-metal layered product Download PDF

Info

Publication number
EP1447214A8
EP1447214A8 EP20020779957 EP02779957A EP1447214A8 EP 1447214 A8 EP1447214 A8 EP 1447214A8 EP 20020779957 EP20020779957 EP 20020779957 EP 02779957 A EP02779957 A EP 02779957A EP 1447214 A8 EP1447214 A8 EP 1447214A8
Authority
EP
European Patent Office
Prior art keywords
polyimide
polyamideimide
metal layered
metal
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20020779957
Other languages
German (de)
French (fr)
Other versions
EP1447214B1 (en
EP1447214A1 (en
EP1447214A4 (en
Inventor
Hideki R & D Ctr. ARAKAWA Chem. Ind. Ltd. GODA
Takayuki R & D Ctr.ARAKAWA Chem.Ind.Ltd FUJIWARA
Takeshi R & D Ctr.ARAKAWA Chem.Ind.Ltd. TAKEUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arakawa Chemical Industries Ltd
Original Assignee
Arakawa Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001336062A external-priority patent/JP4022851B2/en
Priority claimed from JP2002162636A external-priority patent/JP3978656B2/en
Priority claimed from JP2002189252A external-priority patent/JP2004025778A/en
Priority claimed from JP2002218714A external-priority patent/JP4051616B2/en
Application filed by Arakawa Chemical Industries Ltd filed Critical Arakawa Chemical Industries Ltd
Publication of EP1447214A1 publication Critical patent/EP1447214A1/en
Publication of EP1447214A8 publication Critical patent/EP1447214A8/en
Publication of EP1447214A4 publication Critical patent/EP1447214A4/en
Application granted granted Critical
Publication of EP1447214B1 publication Critical patent/EP1447214B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14Polyamide-imides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0346Organic insulating material consisting of one material containing N
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12431Foil or filament smaller than 6 mils
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12993Surface feature [e.g., rough, mirror]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The present invention provides the following laminates:
  • (1) a polyimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyimide resin composition (A) comprising alkoxy-containing silane-modified polyimide (a) and a polar solvent (b), drying and curing the composition;
  • (2) a polyamideimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyamideimide resin composition (C-1) comprising methoxy-containing silane-modified polyamideimide (d), a polar solvent (b) and an inorganic filler (c), drying and curing the composition; and
  • (3) a polyimide-metal laminate in which the cured film of the above composition (A) has a metal plated layer thereon.
  • EP20020779957 2001-11-01 2002-10-31 Polyimide-metal layered products and polyamideimide-metal layered product Expired - Lifetime EP1447214B1 (en)

    Applications Claiming Priority (11)

    Application Number Priority Date Filing Date Title
    JP2001336062A JP4022851B2 (en) 2001-11-01 2001-11-01 Manufacturing method of polyimide film with metal and polyimide film with metal obtained by the manufacturing method
    JP2001336053 2001-11-01
    JP2001336062 2001-11-01
    JP2001336053 2001-11-01
    JP2002162636 2002-06-04
    JP2002162636A JP3978656B2 (en) 2001-11-01 2002-06-04 Metal foil laminate and double-sided metal foil laminate
    JP2002189252A JP2004025778A (en) 2002-06-28 2002-06-28 Metallic-foil laminated body and double-faced metallic-foil laminated body
    JP2002189252 2002-06-28
    JP2002218714A JP4051616B2 (en) 2002-07-26 2002-07-26 Resin composition for coating and metal foil laminate circuit board
    JP2002218714 2002-07-26
    PCT/JP2002/011333 WO2003037620A1 (en) 2001-11-01 2002-10-31 Polyimide-metal layered products and polyamideimide-metal layered product

    Publications (4)

    Publication Number Publication Date
    EP1447214A1 EP1447214A1 (en) 2004-08-18
    EP1447214A8 true EP1447214A8 (en) 2005-03-02
    EP1447214A4 EP1447214A4 (en) 2006-03-22
    EP1447214B1 EP1447214B1 (en) 2010-07-21

    Family

    ID=27532027

    Family Applications (1)

    Application Number Title Priority Date Filing Date
    EP20020779957 Expired - Lifetime EP1447214B1 (en) 2001-11-01 2002-10-31 Polyimide-metal layered products and polyamideimide-metal layered product

    Country Status (7)

    Country Link
    US (1) US7118798B2 (en)
    EP (1) EP1447214B1 (en)
    KR (1) KR100605517B1 (en)
    CN (1) CN100376386C (en)
    DE (1) DE60237102D1 (en)
    TW (1) TWI272183B (en)
    WO (1) WO2003037620A1 (en)

    Families Citing this family (42)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    JP4232506B2 (en) * 2002-06-24 2009-03-04 株式会社豊田自動織機 Sliding parts
    TWI296569B (en) * 2003-08-27 2008-05-11 Mitsui Chemicals Inc Polyimide metal laminated matter
    JP4742580B2 (en) * 2004-05-28 2011-08-10 住友化学株式会社 Film and laminate using the same
    KR100971865B1 (en) * 2004-06-23 2010-07-22 히다치 가세고교 가부시끼가이샤 Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board
    JP5035830B2 (en) * 2004-08-30 2012-09-26 国立大学法人 名古屋工業大学 Hyperbranched polyimide hybrid material
    KR100591068B1 (en) * 2004-09-03 2006-06-19 주식회사 코오롱 Flexible Copper-Clad Laminate and manufacturing method thereof
    JP4654647B2 (en) * 2004-09-30 2011-03-23 味の素株式会社 Polyamideimide film with metal for circuit board and method for producing the same
    JP4701667B2 (en) * 2004-09-30 2011-06-15 味の素株式会社 Metallic polyimide film for circuit board and method for producing the same
    JP4711058B2 (en) * 2005-06-28 2011-06-29 信越化学工業株式会社 Resin solution composition, polyimide resin, and semiconductor device
    US20070036900A1 (en) * 2005-08-12 2007-02-15 Yuqing Liu Process for improving the corrosion resistance of a non-stick coating on a substrate
    TWI306882B (en) * 2006-05-25 2009-03-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same
    JP2008182222A (en) * 2006-12-28 2008-08-07 Mitsui Mining & Smelting Co Ltd Flexible printed circuit board and semiconductor device
    JP5178064B2 (en) * 2007-06-27 2013-04-10 富士フイルム株式会社 Metal layer laminate having metal surface roughened layer and method for producing the same
    US20090038739A1 (en) * 2007-08-09 2009-02-12 United Technologies Corporation Replacement of a lubricant layer bonded to a part of a gas turbine engine
    US20090165926A1 (en) * 2007-10-24 2009-07-02 United Technologies Corporation Method and assembly for bonding metal layers in a gas turbine engine using a polyimide adhesive
    US8128100B2 (en) * 2007-12-05 2012-03-06 United Technologies Corporation Laminate air seal for a gas turbine engine
    TWI398350B (en) * 2008-02-05 2013-06-11 Du Pont Highly adhesive polyimide copper clad laminate and method of making the same
    CN102714192A (en) * 2009-11-20 2012-10-03 E.I.内穆尔杜邦公司 Interposer films useful in semiconductor packaging applications, and methods relating thereto
    JP5397819B2 (en) * 2010-03-30 2014-01-22 日立金属株式会社 Insulating paint and insulated wire using the same
    JP4720953B1 (en) 2010-09-17 2011-07-13 富士ゼロックス株式会社 Method for manufacturing tubular body
    CN102209437B (en) * 2010-10-19 2012-11-14 博罗县精汇电子科技有限公司 Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof
    JPWO2012053548A1 (en) * 2010-10-19 2014-02-24 旭硝子株式会社 RESIN COMPOSITION, LAMINATE, ITS MANUFACTURING METHOD, STRUCTURE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
    US10406791B2 (en) 2011-05-12 2019-09-10 Elantas Pdg, Inc. Composite insulating film
    US10253211B2 (en) 2011-05-12 2019-04-09 Elantas Pdg, Inc. Composite insulating film
    US8987357B2 (en) * 2011-05-27 2015-03-24 Basf Se Thermoplastic molding composition
    KR101566836B1 (en) 2012-09-11 2015-11-09 주식회사 엘지화학 Metallic laminate and method for preparing the same
    EP2708569B1 (en) * 2012-09-12 2018-05-23 Ems-Patent Ag Transparent polyamide-imides
    KR102001282B1 (en) * 2013-04-16 2019-07-17 도요보 가부시키가이샤 Metal foil laminate
    JP6360288B2 (en) 2013-09-04 2018-07-18 Ckd株式会社 Electromagnetic coil cooling structure and electromagnetic actuator
    TWI504694B (en) * 2014-03-27 2015-10-21 Taiflex Scient Co Ltd Thermosetting solder resist ink with low dielectric constant and low dielectric loss and its preparation method
    US9279057B2 (en) 2014-05-06 2016-03-08 Taiflex Scientific Co., Ltd. Thermally curable solder-resistant ink and method of making the same
    TWI607868B (en) * 2014-08-29 2017-12-11 達邁科技股份有限公司 Polyimide film, and manufacture and assembly of the polyimide film
    JP6352791B2 (en) 2014-12-11 2018-07-04 Ckd株式会社 Coil sheet, coil, and method of manufacturing coil
    JP6247629B2 (en) 2014-12-11 2017-12-13 Ckd株式会社 Coil sheet manufacturing method and coil manufacturing method
    US10508175B2 (en) * 2015-03-27 2019-12-17 Samsung Electronics Co., Ltd. Composition and polyamideimide composite and polyamideimide film and electronic device
    US9975997B2 (en) * 2015-03-27 2018-05-22 Samsung Electronics Co., Ltd. Compositions, composites prepared therefrom, and films and electronic devices including the same
    JP2017067764A (en) 2015-09-29 2017-04-06 ミネベアミツミ株式会社 Strain gauge, load sensor, and manufacturing method for strain gauge
    CN105463376B (en) * 2015-12-08 2018-11-27 云南云天化股份有限公司 Coated polyimide metallic film with transitional bonding layer and preparation method thereof
    CN107234050A (en) * 2017-08-11 2017-10-10 东莞市明大胶粘制品有限公司 Polyimide resin is directly coated on the technique and its metallic article of metal surface
    CN107602899A (en) * 2017-09-21 2018-01-19 珠海市创元电子材料有限公司 A kind of polyimide film, its manufacture method and application
    KR20220081336A (en) * 2019-10-09 2022-06-15 바스프 코팅스 게엠베하 Silane-Functional Curing Agents for Carboxyl-Functional Resins, Binders Thereof and 2K Coating Compositions
    CN114559721A (en) * 2022-03-04 2022-05-31 西南科技大学 Sandwich-structure high-energy-storage-density polyimide-based composite film and preparation method thereof

    Family Cites Families (19)

    * Cited by examiner, † Cited by third party
    Publication number Priority date Publication date Assignee Title
    EP0048221B1 (en) * 1980-09-15 1986-09-24 Ciba-Geigy Ag Use of flexible materials in printed circuits
    US4806432A (en) * 1985-11-21 1989-02-21 Shin-Etsu Chemical Co., Ltd. Copper-foiled laminated sheet for flexible printed circuit board
    EP0297139B1 (en) 1986-09-29 1990-12-27 Nippon Steel Chemical Co., Ltd. Flexible printed circuit board and process for its production
    US4910077A (en) 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same
    JPH04142327A (en) 1990-10-04 1992-05-15 Mitsui Petrochem Ind Ltd Imide resin composition
    JPH04296317A (en) 1991-03-27 1992-10-20 Mitsubishi Kasei Corp Resin composition for sealing semiconductor
    JPH06104542A (en) 1992-09-17 1994-04-15 Shin Etsu Chem Co Ltd Metal base wiring board
    US6046072A (en) * 1993-03-29 2000-04-04 Hitachi Chemical Company, Ltd. Process for fabricating a crack resistant resin encapsulated semiconductor chip package
    US5622782A (en) * 1993-04-27 1997-04-22 Gould Inc. Foil with adhesion promoting layer derived from silane mixture
    JP3482723B2 (en) * 1995-02-21 2004-01-06 宇部興産株式会社 Multi-layer aromatic polyimide film
    US5614324A (en) 1995-07-24 1997-03-25 Gould Electronics Inc. Multi-layer structures containing a silane adhesion promoting layer
    JP4210875B2 (en) 1998-03-17 2009-01-21 日立化成工業株式会社 Heat resistant flame retardant resin composition, adhesive film using the same, and metal foil with adhesive
    JP3994298B2 (en) 1998-03-20 2007-10-17 日立化成工業株式会社 Flexible wiring board
    JP4258589B2 (en) * 1998-10-26 2009-04-30 東洋紡績株式会社 Curable composition
    DE60041630D1 (en) * 1999-07-15 2009-04-09 Arakawa Chem Ind CONTAINING GLYCIDYL ETHER GROUP PARTIAL ALKOXYSILANE CONDENSATE, SILANO MODIFIED RESIN, COMPOSITION, AND METHOD FOR THE PRODUCTION THEREOF
    JP3387882B2 (en) 2000-03-01 2003-03-17 荒川化学工業株式会社 Silane-modified polyamideimide resin, resin composition thereof and production method thereof.
    JP2001234020A (en) 2000-02-21 2001-08-28 Hitachi Ltd Resin composition, adhesive film, metallic foil-adhered adhesive film using the resin composition, circuit board and mounted structure
    JP2002069419A (en) 2000-08-30 2002-03-08 Ube Ind Ltd Heat resistant adhesive and laminate
    JP3539633B2 (en) * 2001-01-24 2004-07-07 荒川化学工業株式会社 Alkoxy-containing silane-modified polyamic acid resin composition and polyimide-silica hybrid cured product

    Also Published As

    Publication number Publication date
    TWI272183B (en) 2007-02-01
    KR100605517B1 (en) 2006-07-31
    US20040247907A1 (en) 2004-12-09
    CN100376386C (en) 2008-03-26
    EP1447214B1 (en) 2010-07-21
    EP1447214A1 (en) 2004-08-18
    DE60237102D1 (en) 2010-09-02
    US7118798B2 (en) 2006-10-10
    EP1447214A4 (en) 2006-03-22
    CN1578728A (en) 2005-02-09
    KR20040062594A (en) 2004-07-07
    WO2003037620A1 (en) 2003-05-08
    TW200300111A (en) 2003-05-16

    Similar Documents

    Publication Publication Date Title
    EP1447214A8 (en) Polyimide-metal layered products and polyamideimide-metal layered product
    TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
    ATE336369T1 (en) IR-REFLECTIVE, TRANSPARENT MULTI-LAYER PLASTIC LAMINATES
    TW200709751A (en) Polyimide copper foil laminate and method of producing the same
    TW200701852A (en) Method for producing flexible copper-clad laminated substrate and multi-layer laminate
    EP3992239A4 (en) Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package
    WO2009017051A1 (en) Composite for multilayer circuit board
    TW200746971A (en) Flexible laminate board, process for manufacture of the board, and flexible print wiring board
    TW200746967A (en) Conductor-clad laminate, wiring circuit board, and processes for producing the same
    CN202503862U (en) Heat conduction aluminum film
    KR102039341B1 (en) Manufacturing method of copper clad laminate
    EP4245518A4 (en) Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package
    KR900004225A (en) Printed wiring boards, methods of making such plates and insulating films for use in such plates
    ATE202037T1 (en) LAMINATED COMPOSITE PRODUCT
    WO2008126817A1 (en) Metallic foil-clad laminate plate and printed wiring board
    EP3950841A4 (en) Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
    MX9803358A (en) Multilayer printed circuit board and process for producing the same.
    TW200520640A (en) Sheet for flexible printed circuit board and method for manufacture thereof
    EP3778685A4 (en) Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package
    EP4245807A4 (en) Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package
    TW200505306A (en) Epoxy resin laminate board as a reinforcing material for flexible printed wiring board
    EP1626615A4 (en) Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the same
    JP2004359853A5 (en)
    JPH01192547A (en) Polyphenylene sulfide resin laminate and preparation thereof
    WO2012088163A3 (en) Method for preparing a conformally sealed printed wiring board using a coated substrate comprising a curable epoxy composition comprising imidazolium salts

    Legal Events

    Date Code Title Description
    PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

    Free format text: ORIGINAL CODE: 0009012

    17P Request for examination filed

    Effective date: 20040408

    AK Designated contracting states

    Kind code of ref document: A1

    Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR

    RIN1 Information on inventor provided before grant (corrected)

    Inventor name: TAKEUCHI, TAKAYUKIR.& D. CENTER OF ARAKAWA

    Inventor name: GODA, HIDEKIR.& D. CENTER OF ARAKAWA CHEMICAL

    Inventor name: FUJIWARA, TAKAYUKIR.& D. CENTER OF ARAKAWA

    RIN1 Information on inventor provided before grant (corrected)

    Inventor name: FUJIWARA, TAKAYUKI,R & D CTR.ARAKAWA CHEM.IND.

    Inventor name: GODA, HIDEKI,R & D CTR. ARAKAWA CHEM. IND. LTD

    Inventor name: TAKEUCHI, TAKESHI,R & D CTR.ARAKAWA CHEM.IND.L

    RTI1 Title (correction)

    Free format text: POLYIMIDE-METAL LAYERED PRODUCTS AND POLYAMIDEIMIDE-METAL LAYERED PRODUCT

    A4 Supplementary search report drawn up and despatched

    Effective date: 20060208

    RIC1 Information provided on ipc code assigned before grant

    Ipc: H05K 3/38 20060101ALI20060127BHEP

    Ipc: B32B 7/12 20060101ALI20060127BHEP

    Ipc: B32B 15/08 20060101AFI20030514BHEP

    Ipc: C08J 5/12 20060101ALI20060127BHEP

    Ipc: H05K 1/03 20060101ALI20060127BHEP

    Ipc: B32B 27/28 20060101ALI20060127BHEP

    Ipc: C08G 73/10 20060101ALI20060127BHEP

    17Q First examination report despatched

    Effective date: 20070226

    GRAP Despatch of communication of intention to grant a patent

    Free format text: ORIGINAL CODE: EPIDOSNIGR1

    GRAS Grant fee paid

    Free format text: ORIGINAL CODE: EPIDOSNIGR3

    GRAA (expected) grant

    Free format text: ORIGINAL CODE: 0009210

    AK Designated contracting states

    Kind code of ref document: B1

    Designated state(s): BE DE ES LU

    REF Corresponds to:

    Ref document number: 60237102

    Country of ref document: DE

    Date of ref document: 20100902

    Kind code of ref document: P

    REG Reference to a national code

    Ref country code: ES

    Ref legal event code: FG2A

    Ref document number: 2347772

    Country of ref document: ES

    Kind code of ref document: T3

    PLBE No opposition filed within time limit

    Free format text: ORIGINAL CODE: 0009261

    STAA Information on the status of an ep patent application or granted ep patent

    Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

    26N No opposition filed

    Effective date: 20110426

    REG Reference to a national code

    Ref country code: DE

    Ref legal event code: R097

    Ref document number: 60237102

    Country of ref document: DE

    Effective date: 20110426

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: LU

    Payment date: 20171009

    Year of fee payment: 16

    Ref country code: BE

    Payment date: 20170913

    Year of fee payment: 16

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: DE

    Payment date: 20171025

    Year of fee payment: 16

    PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

    Ref country code: ES

    Payment date: 20171106

    Year of fee payment: 16

    REG Reference to a national code

    Ref country code: DE

    Ref legal event code: R119

    Ref document number: 60237102

    Country of ref document: DE

    REG Reference to a national code

    Ref country code: BE

    Ref legal event code: MM

    Effective date: 20181031

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: LU

    Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

    Effective date: 20181031

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: DE

    Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

    Effective date: 20190501

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: BE

    Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

    Effective date: 20181031

    REG Reference to a national code

    Ref country code: ES

    Ref legal event code: FD2A

    Effective date: 20191204

    PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

    Ref country code: ES

    Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

    Effective date: 20181101