EP1421651A2 - Electric contact - Google Patents

Electric contact

Info

Publication number
EP1421651A2
EP1421651A2 EP02794538A EP02794538A EP1421651A2 EP 1421651 A2 EP1421651 A2 EP 1421651A2 EP 02794538 A EP02794538 A EP 02794538A EP 02794538 A EP02794538 A EP 02794538A EP 1421651 A2 EP1421651 A2 EP 1421651A2
Authority
EP
European Patent Office
Prior art keywords
electrical contact
contact layer
contact
din
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02794538A
Other languages
German (de)
French (fr)
Other versions
EP1421651B1 (en
Inventor
Joachim Ganz
Isabell Buresch
Franz Kaspar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Doduco Contacts and Refining GmbH
Original Assignee
AMI Doduco GmbH
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMI Doduco GmbH, Wieland Werke AG filed Critical AMI Doduco GmbH
Publication of EP1421651A2 publication Critical patent/EP1421651A2/en
Application granted granted Critical
Publication of EP1421651B1 publication Critical patent/EP1421651B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the invention relates to an electrical contact with the features specified in the preamble of claim 1.
  • Such electrical contacts are used as plug contacts, for example in connectors for automobiles and in telecommunications technology.
  • the known electrical contacts for this purpose consist of a base body made of a copper-based alloy, which provides the required electrical conductivity and spring properties, and of a hard gold layer electroplated onto the base body, which is gold with less than 1 wt. -% cobalt is involved. It is also known to provide a silver layer as a contact layer instead of a hard gold layer on the base body.
  • the gold-cobalt contact layers previously used are not suitable for the increased temperature requirements because cobalt segregates from the alloy above 150 ° C. The result is that the cobalt can then oxidize and increase the contact resistance. Hot-tinned contacts can also no longer be used at 200 ° C because you are already close to the melting point of the tin at 232 ° C and the tin softens and creeps. The accelerated diffusion of Sn in Cu and vice versa quickly leads to the formation of intermetallic phases, which oxidize and lead to high contact resistance. With Ag coatings, irreversible softening takes place from approx. 160 ° C.
  • the object of the present invention is to find a contact structure which is particularly suitable and at the same time inexpensive for the tougher requirements (200 ° C. ambient temperature and 42 V voltage), which is particularly suitable for plug contacts in automobiles and in telecommunications technology.
  • the electrical contact according to the invention has a basic body made of a copper-based alloy, an at least 0.3 ⁇ m thick contact layer made of gold with 0.5% by weight to 15% by weight of one or more platinum metals, with the exception of palladium, which expediently possibly only up to 8 % By weight is contained in the contact layer, and between the base body and the contact layer an intermediate layer made of silver or of a silver-based alloy or of nickel.
  • the metals "ruthenium, rhodium, palladium, osmium, iridium and platinum” are combined under the name "platinum metals".
  • a silver-based alloy is understood to mean an alloy consisting predominantly of silver.
  • the contact layer ensures a sufficiently low contact resistance and sufficient wear resistance, in particular abrasion resistance, as well as sufficient security against welding together! contacts. Even with a thickness of the contact layer of not more than 5 ⁇ m, the desired low contact resistance can be achieved over a period of 3,000 hours at 200 ° C if an intermediate layer made of silver or a silver-based alloy, e.g. silver with a few, is provided between the base body and the contact layer Percent of an additive dissolved in it, such as nickel or palladium, e.g. fine-grain silver AgNi0.15. This intermediate layer prevents base components from diffusing out of the base body onto the contact surface and oxidizing there. Pure silver is particularly suitable for the intermediate layer.
  • Nickel as an intermediate layer can also diffuse base components from the base body to the contact surface prevent, but is only suitable for the present purpose if a special ductility is not important, because nickel is so brittle that cracks can occur at the small bending radii that typically occur when forming plug contacts.
  • Silver is more ductile and should preferably contain such alloy components in such small quantities that the ductility required for the intended use of the plug contacts is retained, as is the effectiveness as a diffusion barrier layer. Silver also has the advantage that it can be applied inexpensively in layers up to a few 10 ⁇ m thick.
  • the thickness of the intermediate layer is preferably 0.2 ⁇ m to 15 ⁇ m, most preferably approximately 1 ⁇ m to 2 ⁇ m.
  • an intermediate layer made of silver proves its worth, on the one hand because it prevents base components from diffusing into the contact layer from the base body, and on the other hand because it can compensate for material losses in the contact layer as a sacrificial layer.
  • the contact layer is expediently no thicker than 10 ⁇ m.
  • a contact layer that is thicker than 10 ⁇ m does not bring any technical improvement, preferably the contact layer is not thicker than 5 ⁇ m.
  • platinum metal which is alloyed with gold
  • platinum itself is particularly suitable.
  • gold-platinum and gold-palladium show a very good resistance to oxidation and show sufficient ductility in the stressed composition in order to avoid them
  • Platinum Being able to deform damage to the contact layer. Platinum has the advantage over palladium of being cheaper. The cost-effectiveness is an important criterion, which must be considered in particular for mass parts for the automotive industry and for communication technology. Gold platinum stands out it also has a special corrosion resistance and a lower tendency than gold-palladium to catalytically form organic cover layers.
  • the contact layer should consist of gold with 0.5% to 15% by weight of one or more platinum metals. Below a content of 0.5% by weight, the tendency towards cold welding is too great. Above 15% by weight, the contact layer becomes too brittle and cannot subsequently be deformed to form plug contacts without risking the contact layer tearing.
  • the gold-based alloy for the contact layer could contain platinum metals other than platinum and palladium, in particular in combination with platinum or palladium, e.g. ruthenium; however, this has no further significant advantages.
  • the gold-based alloy could also contain silver in addition to a platinum metal.
  • the intermediate layer is preferably between 1 ⁇ m and 15 ⁇ m thick. Below 1 ⁇ m, the diffusion-inhibiting effect of the intermediate layer is so small that the thickness of the contact layer would have to be increased to compensate, which is uneconomical. On the other hand, increasing the thickness of the intermediate layer beyond 15 ⁇ m would be technically unnecessary and therefore uneconomical. An intermediate layer made of silver with a thickness of approx. 1 ⁇ m to 2 ⁇ m is considered optimal. Electrical plug contacts according to the invention are usually produced from strip-shaped semi-finished products by stamping, bending and embossing processes.
  • the intermediate layer made of silver or made of a silver-based alloy or of nickel and the contact layer made of the gold-based alloy is applied.
  • the intermediate layer and the contact layer are preferably tracked down! For the intended thin layer thicknesses, especially for the contact layer, this is considered the most economical and also leads to sufficiently dense and ductile layers without foreign inclusions.
  • the intermediate layer and the contact layer can advantageously even be deposited successively in a single coating pass. Electrolytic deposition is also an option, in particular for the intermediate layer.
  • the material from which the intermediate layer is made is preferably applied not only to the front of the base base body, on which the contact layer is also arranged, but also to the back of the base body. Especially at the high temperatures at which contacts according to the invention are to be used, this has the advantage that the contact resistance rises less over time than without coating the back of the base body.
  • a band-shaped base body made of copper was coated on one side with 2 ⁇ m silver and then with 1 ⁇ m AuPt2.5.
  • the contact resistance was initially measured at 2m ⁇ . After 3000 hours of aging in air at 200 ° C, the contact resistance rose to values between 1 ⁇ and 10 ⁇ . However, the back of the copper tape was also included
  • the contact resistance only increased by a few m ⁇ under the same aging conditions.
  • the side surfaces of the basic body formed by stamping were free of silver with this good result. This leads to the further advantage that it is possible without disadvantage for the contact resistance is to first coat band-shaped or plate-shaped basic bodies and then to separate them by punching.
  • CuFeP The material with the designation C194 according to ASTM
  • CuNiSn The material with the designation C72500 according to ASTM
  • CuSnZn The material with the designation C425 according to ASTM
  • the invention is suitable not only for plug contacts, but also for switching contacts.
  • the attached single figure shows a cross section through a band-shaped semi-finished product for an electrical plug contact according to the invention with a basic body 1 made of a copper-based alloy, for example CuCrSiTi (X), with an intermediate layer 2 made of silver in a thickness between 0.2 ⁇ m to 15 ⁇ m and with a Contact layer 3, which is 0.5 microns to 2 microns thick and consists of gold with 1 wt .-% to 5 wt .-% platinum.
  • the intermediate layer 2 is only on the front side 4 of the base body.
  • the material from which the intermediate layer 2 is made, or another material suitable as a diffusion barrier, can also advantageously be applied to the rear side 5.

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Abstract

An electric contact comprises a main body consisting of a copper-based alloy or of stainless steel and a contact layer consisting of a gold-based alloy. The contact layer has a thickness of at least 0.3 mum and consists of gold with a content of 0.5 percent by weight to 15 percent by weight of one or more platinum group metals, and that an intermediate layer consisting of silver or of a silver-based alloy or of nickel is provided between the main body and the contact layer. The contact layer is preferably applied on the main body by a PVD process.

Description

Elektrischer Kontakt Electric contact
Beschreibung:Description:
Die Erfindung geht aus von einem elektrischen Kontakt mit den im Oberbegriff des Patentanspruchs 1 angegebenen Merkmalen. Derartige elektrische Kontakte werden als Steckkontakte beispielsweise in Steckverbindern für Automobile und in der Telekommunikationstechnik eingesetzt. Gegenwärtig wird gefordert, daß Steckverbinder im Automotivebereich für Umgebungstemperaturen bis 150°C geeignet sein müssen und daß ihre Federeigenschaften über die übliche Lebensdauer von Automobilen nicht so stark abnimmt, daß dadurch die Zuverlässigkeit der Kontaktgabe beeinträchtigt wird. Die bekannten elektrischen Kontakte für diesen Verwendungszweck bestehen aus einem Grundkörper aus einer Kupferbasis- legierung, welche die erforderliche elektrische Leitfähigkeit und Federeigenschaft zur Verfügung stellt, und aus einer auf den Grundkörper galvanisch aufgebrachten Hartgoldschicht, bei welcher es sich um Gold mit weniger als 1 Gew.-% Kobalt handelt. Es ist ferner bekannt, anstelle einer Hartgoldschicht auf dem Grundkörper eine Silberschicht als Kontaktschicht vorzusehen. Häufig werden auch Kontaktschichten aus Zinn eingesetzt, welche durch Feuerverzinnung des Grundkörpers aufgebracht werden. Damit lassen sich unter den bisher geforderten Randbedingungen eine hinreichende Beständigkeit gegen Verschleiß der elektrischen Kontakte und ein hinreichend niedriger Koπtaktübergangswiderstand erreichen. Das trifft jedoch nicht mehr für Steckkontakte zu, welche erhöhten Temperaturanforderungen bis 200°C unter anderem nach der US-Car-Specificati- on im Temperaturwechsel über die vorgesehene Lebensdauer genügen müssen. Diese schärferen Forderungen rühren daher, daß immer mehr Motorfunktionen elektrisch oder elektronisch kontrolliert und gesteuert werden sollen, was den Einsatz der Elektronik und damit von Steckkontakten vor Ort am Motor oder im Abgassystem erfordert.The invention relates to an electrical contact with the features specified in the preamble of claim 1. Such electrical contacts are used as plug contacts, for example in connectors for automobiles and in telecommunications technology. At present, it is demanded that connectors in the automotive sector must be suitable for ambient temperatures up to 150 ° C and that their spring properties do not decrease so much over the usual service life of automobiles that the reliability of the contact is impaired. The known electrical contacts for this purpose consist of a base body made of a copper-based alloy, which provides the required electrical conductivity and spring properties, and of a hard gold layer electroplated onto the base body, which is gold with less than 1 wt. -% cobalt is involved. It is also known to provide a silver layer as a contact layer instead of a hard gold layer on the base body. Contact layers made of tin are also frequently used Base body are applied. This allows sufficient resistance to wear of the electrical contacts and a sufficiently low contact resistance to be achieved under the boundary conditions previously required. However, this no longer applies to plug contacts, which have to meet increased temperature requirements of up to 200 ° C, among other things according to the US car specification, in the temperature change over the intended service life. These stricter requirements stem from the fact that more and more engine functions are to be controlled and controlled electrically or electronically, which requires the use of electronics and thus of plug contacts on site on the engine or in the exhaust system.
Die bisher verwendeten Kontaktschichten aus Gold-Kobalt eignen sich für die erhöhten Temperaturanforderungen nicht, weil Kobalt oberhalb von 150°C aus der Legierung segregiert. Die Folge ist, daß das Kobalt dann oxidieren kann und den Kontaktübergangswiderstand erhöht. Feuerverzinnte Kontakte können bei 200°C aber auch nicht mehr eingesetzt werden, weil man sich dann bereits nahe bei dem Schmelzpunkt des Zinns von 232°C befindet und das Zinn erweicht und kriecht. Die beschleunigte Diffusion von Sn in Cu und umgekehrt führt sehr schnell zur Bildung von intermetallischen Phasen, welche oxidieren und zu hohen Kontaktübergangswiderständen führen. Bei Ag-Beschichtungen findet ab ca. 160°C eine irreversible Erweichung statt.The gold-cobalt contact layers previously used are not suitable for the increased temperature requirements because cobalt segregates from the alloy above 150 ° C. The result is that the cobalt can then oxidize and increase the contact resistance. Hot-tinned contacts can also no longer be used at 200 ° C because you are already close to the melting point of the tin at 232 ° C and the tin softens and creeps. The accelerated diffusion of Sn in Cu and vice versa quickly leads to the formation of intermetallic phases, which oxidize and lead to high contact resistance. With Ag coatings, irreversible softening takes place from approx. 160 ° C.
In der Telekommunikationstechnik werden sehr hohe Steckzyklen - oft bis zu 10.000 - gefordert. Diese Anforderung wird heute von Steckkontakten mit einer PdNi- oder PdCo-Beschichtung als Kontaktschicht erfüllt. Aufgrund des stark gestiegenen Pd-Preises sind solche Beschichtungen jedoch sehr teuer geworden.Very high mating cycles - often up to 10,000 - are required in telecommunications technology. This requirement is met today by plug contacts with a PdNi or PdCo coating as the contact layer. However, due to the sharp rise in the Pd price, such coatings have become very expensive.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, einen für die verschärften Anforderungen (200°C Umgebungstemperatur und 42 V Spannung) besonders geeigneten und gleichzeitig kostengünstigen Kontaktaufbau zu finden, welcher sich insbesondere für Steckkontakte in Automobilen und in der Telekommunikationstechnik eignet.The object of the present invention is to find a contact structure which is particularly suitable and at the same time inexpensive for the tougher requirements (200 ° C. ambient temperature and 42 V voltage), which is particularly suitable for plug contacts in automobiles and in telecommunications technology.
Diese Aufgabe wird gelöst durch einen Steckkontakt mit den im Patentanspruch 1 angegebenen Merkmalen. Vorteilhafte Weiterbildungen der Erfindung sind Ge- genstand der Unteransprüche.This object is achieved by a plug contact with the features specified in claim 1. Advantageous developments of the invention are the subject of the dependent claims.
Der erfindungsgemäße elektrische Kontakt hat einen Grundköφer aus einer Kupferbasislegierung, eine mindestens 0,3 μm dicke Kontaktschicht aus Gold mit 0,5 Gew.-% bis 15 Gew.-% eines oder mehrerer Platinmetalle, ausgenommen Palladium, welches zweckmäßigerweise gegebenenfalls nur bis zu 8 Gew.-% in der Kontaktschicht enthalten ist, und zwischen dem Grundköφer und der Kontaktschicht eine Zwischenschicht aus Silber oder aus einer Silberbasislegierung oder aus Nickel. Unter der Bezeichnung "Platinmetalle" faßt man die gemeinschaftlich vorkommenden Metalle Ruthenium, Rhodium, Palladium, Osmium, Iridium und Platin zusammen. Unter einer Silberbasislegierung wird eine überwiegend aus Silber bestehende Legierung verstanden.The electrical contact according to the invention has a basic body made of a copper-based alloy, an at least 0.3 μm thick contact layer made of gold with 0.5% by weight to 15% by weight of one or more platinum metals, with the exception of palladium, which expediently possibly only up to 8 % By weight is contained in the contact layer, and between the base body and the contact layer an intermediate layer made of silver or of a silver-based alloy or of nickel. The metals "ruthenium, rhodium, palladium, osmium, iridium and platinum" are combined under the name "platinum metals". A silver-based alloy is understood to mean an alloy consisting predominantly of silver.
Die Kontaktschicht gewährleistet einen hinreichend niedrigen Kontaktübergangswiderstand und eine ausreichende Verschleißfestigkeit, insbesondere Abriebfestigkeit, sowie eine hinreichende Sicherheit gegen ein Verschweißen von aneinander! iegenden Kontakten. Auch bei einer Dicke der Kontaktschicht von nicht mehr als 5 μm erreicht man den angestrebten niedrigen Kontaktübergangswiderstand über eine Dauer von 3.000 Stunden bei 200°C, wenn zwischen dem Grundköφer und der Kontaktschicht eine Zwischenschicht aus Silber oder einer Silberbasislegierung vorgesehen ist, z.B. Silber mit wenigen Prozent eines darin gelösten Zusatzes wie z.B. Nickel oder Palladium, z.B. Feinkornsilber AgNi0,15. Die- se Zwischenschicht verhindert, daß unedle Bestandteile aus dem Grundköφer auf die Kontaktoberfläche diffundieren und dort oxidieren. Reines Silber ist für die Zwischenschicht besonders geeignet. Auch Nickel als Zwischenschicht kann eine Diffusion unedler Bestandteile aus dem Grundköφer an die Kontaktoberfläche verhindern, eignet sich aber für den vorliegenden Zweck nur dann, wenn es auf eine besondere Duktilität nicht ankommt, denn Nickel ist so spröde, daß bei den geringen Biegeradien, welche beim Formen von Steckkontakten typischerweise auftreten, Risse auftreten können. Silber ist demgegenüber duktiler und soll vor- zugsweise allenfalls solche Legierungsbestandteile in so geringen Mengen enthalten, daß die für den jeweils vorgesehenen Einsatzzweck bei Steckkontakten erforderliche Duktilität ebenso erhalten bleibt wie die Wirksamkeit als Diffusioπs- sperrschicht. Silber hat darüberhinaus den Vorteil, daß es in Schichten bis zu einigen 10 μm Dicke kostengünstig aufgebracht werden kann. Vorzugsweise be- trägt die Dicke der Zwischenschicht 0,2 μm bis 15 μm, am besten ca. 1 μm bis 2 μm. Das genügt, um einer Kontaktschicht, welche vorzugsweise nur 0,5 μm bis 2 μm dick ist, unter den vorgegebenen Einsatzbedingungen und Einsatzzeiten einen niedrigen Kontaktübergangswiderstand zu bewahren. Gerade bei derart dünnen Kontaktschichten bewährt sich eine Zwischenschicht aus Silber, einerseits, weil sie das Eindiffundieren unedler Bestandteile aus dem Grundköφer in die Kontaktschicht verhindert, andererseits weil sie als Opferschicht Materialverluste der Kontaktschicht auszugleichen vermag.The contact layer ensures a sufficiently low contact resistance and sufficient wear resistance, in particular abrasion resistance, as well as sufficient security against welding together! contacts. Even with a thickness of the contact layer of not more than 5 μm, the desired low contact resistance can be achieved over a period of 3,000 hours at 200 ° C if an intermediate layer made of silver or a silver-based alloy, e.g. silver with a few, is provided between the base body and the contact layer Percent of an additive dissolved in it, such as nickel or palladium, e.g. fine-grain silver AgNi0.15. This intermediate layer prevents base components from diffusing out of the base body onto the contact surface and oxidizing there. Pure silver is particularly suitable for the intermediate layer. Nickel as an intermediate layer can also diffuse base components from the base body to the contact surface prevent, but is only suitable for the present purpose if a special ductility is not important, because nickel is so brittle that cracks can occur at the small bending radii that typically occur when forming plug contacts. Silver, on the other hand, is more ductile and should preferably contain such alloy components in such small quantities that the ductility required for the intended use of the plug contacts is retained, as is the effectiveness as a diffusion barrier layer. Silver also has the advantage that it can be applied inexpensively in layers up to a few 10 μm thick. The thickness of the intermediate layer is preferably 0.2 μm to 15 μm, most preferably approximately 1 μm to 2 μm. This is sufficient to maintain a low contact resistance under the specified conditions and times of use for a contact layer, which is preferably only 0.5 μm to 2 μm thick. Especially with such thin contact layers, an intermediate layer made of silver proves its worth, on the one hand because it prevents base components from diffusing into the contact layer from the base body, and on the other hand because it can compensate for material losses in the contact layer as a sacrificial layer.
Zweckmäßigerweise ist die Kontaktschicht nicht dicker als 10 μm. Eine Kontaktschicht, die dicker ist als 10 μm, bringt keine technische Verbesserung mehr, vor- zugsweise ist die Kontaktschicht nicht dicker als 5 μm.The contact layer is expediently no thicker than 10 μm. A contact layer that is thicker than 10 μm does not bring any technical improvement, preferably the contact layer is not thicker than 5 μm.
Als Platinmetall, welches dem Gold zulegiert wird, kommt vor allem Platin selbst infrage. Auch Palladium in sehr geringen Gehalten, jedenfalls in Gehalten von weniger als 8 Gew.-%, ist gut einsetzbar. Sowohl Gold-Platin als auch Gold-Palladium zeigen eine sehr gute Oxidationsbeständigkeit und weisen bei der bean- spruchten Zusammensetzung eine hinreichende Duktilität aus, um sie ohneAs platinum metal, which is alloyed with gold, platinum itself is particularly suitable. Palladium in very low contents, at least in contents of less than 8% by weight, can also be used well. Both gold-platinum and gold-palladium show a very good resistance to oxidation and show sufficient ductility in the stressed composition in order to avoid them
Schaden für die Kontaktschicht verformen zu können. Platin hat gegenüber Palladium den Vorteil, preisgünstiger zu sein. Die Preisgünstigkeit ist ein wichtiges Kriterium, welches insbesondere bei Massenteilen für die Automobilindustrie und für die Kommunikationstechnik beachtet werden muß. Gold-Platin zeichnet sich außerdem durch eine besondere Korrosionsbeständigkeit und durch eine geringere Neigung als Gold-Palladium aus, auf katalytischem Wege organische Deckschichten zu bilden.Being able to deform damage to the contact layer. Platinum has the advantage over palladium of being cheaper. The cost-effectiveness is an important criterion, which must be considered in particular for mass parts for the automotive industry and for communication technology. Gold platinum stands out it also has a special corrosion resistance and a lower tendency than gold-palladium to catalytically form organic cover layers.
Die Kontaktschicht soll aus Gold mit 0,5 Gew.-% bis 15 Gew.-% eines oder meh- rerer Platinmetalle bestehen. Unterhalb eines Gehaltes von 0,5 Gew.-% ist die Neigung zum Kaltverschweißen zu groß. Oberhalb von 15 Gew.-% wird die Kontaktschicht zu spröde und kann nachträglich nicht mehr zur Bildung von Steckkontakten verformt werden, ohne ein Reissen der Kontaktschicht zu riskieren.The contact layer should consist of gold with 0.5% to 15% by weight of one or more platinum metals. Below a content of 0.5% by weight, the tendency towards cold welding is too great. Above 15% by weight, the contact layer becomes too brittle and cannot subsequently be deformed to form plug contacts without risking the contact layer tearing.
Besonders bevorzugt ist eine Kontaktschicht aus Gold mit 1 Gew.-% bis 5 Gew.-% Platin in einer Dicke von 0,5 μm bis 2 μm, insbesondere aus Gold mit 1 bis 3 Gew.-% Platin in einer Dicke von 0,5 μm bis 2 μm, welche über einer Zwischenschicht aus Silber als das Optimum hinsichtlich Kosten, Verarbeitbarkeit und Beständigkeit unter den gegebenen Einsatzbedingungen angesehen wird.A contact layer made of gold with 1% by weight to 5% by weight platinum in a thickness of 0.5 μm to 2 μm, in particular made of gold with 1 to 3% by weight platinum in a thickness of 0, is particularly preferred. 5 μm to 2 μm, which is considered to be the optimum in terms of cost, processability and durability under the given conditions of use over an intermediate layer of silver.
Grundsätzlich könnte die Goldbasislegierung für die Kontaktschicht andere Pla- tinmetalle als Platin und Palladium enthalten, und zwar insbesondere in Kombination mit Platin oder Palladium, z.B. Ruthenium; das bringt allerdings keine weitergehenden signifikanten Vorteile mit sich. Schließlich könnte die Gold-Basis-Legierung zusätzlich zu einem Platinmetall auch Silber enthalten.In principle, the gold-based alloy for the contact layer could contain platinum metals other than platinum and palladium, in particular in combination with platinum or palladium, e.g. ruthenium; however, this has no further significant advantages. Finally, the gold-based alloy could also contain silver in addition to a platinum metal.
Die Zwischenschicht ist vorzugsweise zwischen 1 μm und 15 μm dick. Unterhalb von 1 μm ist die diffusionshemmende Wirkung der Zwischenschicht so gering, daß zum Ausgleich die Dicke der Kontaktschicht erhöht werden müßte, was unwirtschaftlich ist. Andererseits wäre eine Erhöhung der Dicke der Zwischenschicht über 15 μm hinaus technisch unnötig und deshalb unwirtschaftlich. Als optimal wird eine Zwischenschicht aus Silber in einer Dicke von ca. 1 μm bis 2 μm angesehen. Erfindungsgemäße elektrische Steckkontakte werden üblicherweise aus bandförmigem Halbzeug durch Stanz-, Biege- und Prägevorgänge hergestellt. Auf Bänder aus Kupfer oder einer Kupferbasislegierung oder Edelstahl mit der gewünschten Federeigenschaft, wird die Zwischenschicht aus Silber oder aus einer Silber- basislegierung oder aus Nickel und auf dieser die Kontaktschicht aus der Goldbasislegierung aufgebracht. Die Zwischenschicht und die Kontaktschicht werden vorzugsweise aufgespürter! Für die vorgesehenen geringen Schichtdicken, insbesondere für die Kontaktschicht, wird das als am wirtschaftlichsten angesehen und führt darüberhinaus zu hinreichend dichten und duktilen Schichten ohne Fremdeinschlüsse. Die Zwischenschicht und die Kontaktschicht können mit Vorteil sogar aufeinanderfolgend in einem einzigen Beschichtungsdurchlauf abgeschieden werden. Insbesondere für die Zwischenschicht kommt aber auch eine elektrolytische Abscheidung infrage.The intermediate layer is preferably between 1 μm and 15 μm thick. Below 1 μm, the diffusion-inhibiting effect of the intermediate layer is so small that the thickness of the contact layer would have to be increased to compensate, which is uneconomical. On the other hand, increasing the thickness of the intermediate layer beyond 15 μm would be technically unnecessary and therefore uneconomical. An intermediate layer made of silver with a thickness of approx. 1 μm to 2 μm is considered optimal. Electrical plug contacts according to the invention are usually produced from strip-shaped semi-finished products by stamping, bending and embossing processes. On strips made of copper or a copper-based alloy or stainless steel with the desired spring properties, the intermediate layer made of silver or made of a silver-based alloy or of nickel and the contact layer made of the gold-based alloy is applied. The intermediate layer and the contact layer are preferably tracked down! For the intended thin layer thicknesses, especially for the contact layer, this is considered the most economical and also leads to sufficiently dense and ductile layers without foreign inclusions. The intermediate layer and the contact layer can advantageously even be deposited successively in a single coating pass. Electrolytic deposition is also an option, in particular for the intermediate layer.
Vorzugsweise wird das Material, aus welchem die Zwischenschicht besteht, nicht nur auf die Vorderseite des unedlen Grundköφers aufgebracht, auf welcher auch die Kontaktschicht angeordnet wird, sondern auch auf die Rückseite des Grundköφers. Gerade bei den hohen Temperaturen, unter denen erfindungsgemäße Kontakte eingesetzt werden sollen, hat das den Vorteil zur Folge, daß der Kontaktwiderstand im Laufe der Zeit weniger ansteigt als ohne Beschichtung der Rückseite des Grundköφers.The material from which the intermediate layer is made is preferably applied not only to the front of the base base body, on which the contact layer is also arranged, but also to the back of the base body. Especially at the high temperatures at which contacts according to the invention are to be used, this has the advantage that the contact resistance rises less over time than without coating the back of the base body.
Dies illustriert folgendes Beispiel: Ein bandförmiger Grundkörper aus Kupfer wurde einseitig mit 2 μm Silber und dann mit 1 μm AuPt2,5 beschichtet. Als Kontaktwiderstand wurden zunächst 2mΩ gemessen. Nach 3000h Alterung an Luft bei 200°C stieg der Kontaktwiderstand auf werte zwischen 1Ω und 10Ω an. Wurde jedoch auch die Rückseite des Kupferbandes mitThis is illustrated by the following example: A band-shaped base body made of copper was coated on one side with 2 μm silver and then with 1 μm AuPt2.5. The contact resistance was initially measured at 2mΩ. After 3000 hours of aging in air at 200 ° C, the contact resistance rose to values between 1Ω and 10Ω. However, the back of the copper tape was also included
2 μm Silber beschichtet, stieg der Kontaktwiderstand unter denselben Alterungsbedingungen nur um wenige mΩ an. Die durch Stanzen gebildeten Seitenflächen des Grundköφers waren bei diesem guten Ergebnis frei von Silber. Das führt zu dem weiteren Vorteil, daß es ohne Nachteil für den Kontaktwiderstand möglich ist, bandförmige oder plattenförmige Grundköφer zuerst zu beschichten und danach durch Stanzen zu vereinzeln.Coated with 2 μm silver, the contact resistance only increased by a few mΩ under the same aging conditions. The side surfaces of the basic body formed by stamping were free of silver with this good result. This leads to the further advantage that it is possible without disadvantage for the contact resistance is to first coat band-shaped or plate-shaped basic bodies and then to separate them by punching.
Für den Grundköφer eignen sich besonders die nachfolgenden Werkstoffe:The following materials are particularly suitable for the basic body:
(a) CuNiSi(Mg): Die Werkstoffe mit den Bezeichnungen C7025, C7026 nach ASTM(a) CuNiSi (Mg): The materials with the designations C7025, C7026 according to ASTM
(b) CuFeP: Der Werkstoff mit der Bezeichnung C194 nach ASTM(b) CuFeP: The material with the designation C194 according to ASTM
(c) CuCrSiTi(X): Die Werkstoffe mit den Bezeichnungen C18070, C18080, C 18090 nach ASTM(c) CuCrSiTi (X): The materials with the designations C18070, C18080, C 18090 according to ASTM
(d) CuNiSn: Der Werkstoff mit der Bezeichnung C72500 nach ASTM (e) CuSnZn: Der Werkstoff mit der Bezeichnung C425 nach ASTM(d) CuNiSn: The material with the designation C72500 according to ASTM (e) CuSnZn: The material with the designation C425 according to ASTM
(f) CuNiZn: Die Werkstoffe mit den Bezeichnungen C75700, C77000, C76400 nach ASTM(f) CuNiZn: The materials with the designations C75700, C77000, C76400 according to ASTM
(g) Edelstahl: Die Werkstoffe mit den Bezeichnungen(g) Stainless steel: The materials with the designations
1.4310 nach DIN 17224, 1.4311 nach DIN 17440,1.4310 according to DIN 17224, 1.4311 according to DIN 17440,
1.4406 nach DIN 17440,1.4406 according to DIN 17440,
1.4428 nach DIN 17443,1.4428 according to DIN 17443,
1.4429 nach DIN 17440, 1.4568 nach DIN 17224, 1.4841 nach DIN 17224,1.4429 according to DIN 17440, 1.4568 according to DIN 17224, 1.4841 according to DIN 17224,
1.4318, 1.1231, 1.1248, 1.1269, 1.1274, 1.5029 nach DIN V 17006-100.1.4318, 1.1231, 1.1248, 1.1269, 1.1274, 1.5029 according to DIN V 17006-100.
von denen die unter (a), (b) und (c) genannten besonders bevorzugt sind, weil sie eine hohe elektrische Leitfähigkeit mit einer hohen Stabilität ihrer Federeigenschaften unter der geforderten Einsatztemperatur von 200°C verbinden.of which those mentioned under (a), (b) and (c) are particularly preferred because they combine high electrical conductivity with high stability of their spring properties under the required operating temperature of 200 ° C.
Die Erfindung eignet sich nicht nur für Steckkontakte, sondern auch für schaltende Kontakte. Die beigefügte einzige Abbildung zeigt einen Querschnitt durch ein bandförmiges Halbzeug für einen erfindungsgemäßen elektrischen Steckkontakt mit einem Grundköφer 1 aus einer Kupferbasislegierung, z.B. CuCrSiTi(X), mit einer Zwischenschicht 2 aus Silber in einer Dicke zwischen 0,2 μm bis 15 μm und mit einer Kontaktschicht 3, welche 0,5 μm bis 2 μm dick ist und aus Gold mit 1 Gew.-% bis 5 Gew.-% Platin besteht. Die Zwischenschicht 2 befindet sich nur auf der Vorderseite 4 des Grundkörpers. Mit Vorteil kann das Material, aus welchem die Zwischenschicht 2 besteht, oder ein anderes als Diffusionssperre geeignetes Material auch auf die Rückseite 5 aufgetragen werden. The invention is suitable not only for plug contacts, but also for switching contacts. The attached single figure shows a cross section through a band-shaped semi-finished product for an electrical plug contact according to the invention with a basic body 1 made of a copper-based alloy, for example CuCrSiTi (X), with an intermediate layer 2 made of silver in a thickness between 0.2 μm to 15 μm and with a Contact layer 3, which is 0.5 microns to 2 microns thick and consists of gold with 1 wt .-% to 5 wt .-% platinum. The intermediate layer 2 is only on the front side 4 of the base body. The material from which the intermediate layer 2 is made, or another material suitable as a diffusion barrier, can also advantageously be applied to the rear side 5.

Claims

Ansprüche: Expectations:
1. Elektrischer Kontakt, welcher einen Grundkörper aus einer Kupferbasislegierung oder Edelstahl und eine Kontaktschicht aus einer Goldbasislegierung hat, dadurch gekennzeichnet, daß die Kontaktschicht wenigstens 0,3 μm dick ist und aus Gold mit 0,5 Gew.-% bis 15 Gew.-% eines oder mehrerer Platinmetalle besteht und daß zwischen dem Grundköφer und der Kontaktschicht eine Zwischenschicht aus Silber oder aus einer Silberbasislegierung oder aus Nickel vorgesehen ist.1. Electrical contact, which has a base body made of a copper-based alloy or stainless steel and a contact layer made of a gold-based alloy, characterized in that the contact layer is at least 0.3 μm thick and made of gold with 0.5% by weight to 15% by weight. % of one or more platinum metals and that an intermediate layer made of silver or a silver-based alloy or nickel is provided between the base body and the contact layer.
2. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktschicht nicht dicker als 10 μm ist.2. Electrical contact according to claim 1, characterized in that the contact layer is not thicker than 10 μm.
3. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die3. Electrical contact according to claim 1, characterized in that the
Kontaktschicht nicht dicker als 5 μm ist.Contact layer is not thicker than 5 μm.
4. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktschicht 0,5 μm bis 2 μm dick ist.4. Electrical contact according to claim 1, characterized in that the contact layer is 0.5 μm to 2 μm thick.
5. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die5. Electrical contact according to claim 1, characterized in that the
Kontaktschicht 0,5 μm bis 1 μm dick ist.Contact layer is 0.5 μm to 1 μm thick.
6. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß als Platinmetall Platin oder Palladium gewählt ist, wobei Platin besonders bevorzugt ist. 6. Electrical contact according to one of the preceding claims, characterized in that platinum or palladium is selected as the platinum metal, with platinum being particularly preferred.
7. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktschicht aus Gold mit 1 Gew.-% bis 5 Gew.-% eines oder mehrerer Platinmetalle besteht.7. Electrical contact according to claim 1, characterized in that the contact layer consists of gold with 1% by weight to 5% by weight of one or more platinum metals.
8. Elektrischer Kontakt nach Anspruch 1 , dadurch gekennzeichnet, daß die Kontaktschicht aus 1 Gew.-% bis 3 Gew.-% eines oder mehrerer Platinmetalle besteht.8. Electrical contact according to claim 1, characterized in that the contact layer consists of 1% by weight to 3% by weight of one or more platinum metals.
9. Elektrischer Kontakt nach Anspruch 7 oder 8, dadurch gekennzeichnet, daß die Kontaktschicht als Platinmetall nur Platin enthält.9. Electrical contact according to claim 7 or 8, characterized in that the contact layer only contains platinum as platinum metal.
10. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch ge- kennzeichnet, daß die Zwischenschicht 0,2 μm bis 15 μm dick ist.10. Electrical contact according to one of the preceding claims, characterized in that the intermediate layer is 0.2 μm to 15 μm thick.
11. Elektrischer Kontakt nach Anspruch 10, dadurch gekennzeichnet, daß die Zwischenschicht 0,5 μm bis 10 μm dick ist.11. Electrical contact according to claim 10, characterized in that the intermediate layer is 0.5 μm to 10 μm thick.
12. Elektrischer Kontakt nach Anspruch 10, dadurch gekennzeichnet, daß die Zwischenschicht 1 μm bis 2 μm dick ist.12. Electrical contact according to claim 10, characterized in that the intermediate layer is 1 μm to 2 μm thick.
13. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß als Werkstoff für den Grundkörper ein Werkstoff aus der nachstehenden Gruppe ausgewählt ist:13. Electrical contact according to one of the preceding claims, characterized in that a material from the following group is selected as the material for the base body:
(a) CuNiSi(Mg): Die Werkstoffe mit den Bezeichnungen C7025, C7026 nach ASTM (b) CuFeP: Der Werkstoff mit der Bezeichnung C194 nach ASTM (c) CuCrSiTi(X): Die Werkstoffe mit den Bezeichnungen C18070, C18080, C 18090 nach ASTM(a) CuNiSi(Mg): The materials with the designation C7025, C7026 according to ASTM (b) CuFeP: The material with the designation C194 according to ASTM (c) CuCrSiTi(X): The materials with the designations C18070, C18080, C 18090 according to ASTM
(d) CuNiSn: Der Werkstoff mit der Bezeichnung C72500 nach ASTM(d) CuNiSn: The material designated C72500 according to ASTM
(e) CuSnZn: Der Werkstoff mit der Bezeichnung C425 nach ASTM (f) CuNiZn: Die Werkstoffe mit den Bezeichnungen C75700, C77000,(e) CuSnZn: The material with the designation C425 according to ASTM (f) CuNiZn: The materials with the designation C75700, C77000,
C76400 nach ASTM (g) Edelstahl: Die Werkstoffe mit den BezeichnungenC76400 according to ASTM (g) Stainless steel: The materials with the designations
1.4310 nach DIN 17224,1.4310 according to DIN 17224,
1.4311 nach DIN 17440, 1.4406 nach DIN 17440,1.4311 according to DIN 17440, 1.4406 according to DIN 17440,
1.4428 nach DIN 17443,1.4428 according to DIN 17443,
1.4429 nach DIN 17440, 1.4568 nach DIN 17224, 1.4841 nach DIN 17224, 1.4318, 1.1231 , 1.1248, 1.1269, 1.1274, 1.5029 nach DIN V 17006-100.1.4429 according to DIN 17440, 1.4568 according to DIN 17224, 1.4841 according to DIN 17224, 1.4318, 1.1231, 1.1248, 1.1269, 1.1274, 1.5029 according to DIN V 17006-100.
14. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktschicht durch Sputtem oder ein anderes PVD- Verfahren gebildet ist.14. Electrical contact according to one of the preceding claims, characterized in that the contact layer is formed by sputtering or another PVD process.
15. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch ge- kennzeichnet, daß der Grundkorper eine Vorderseite und eine Rückseite hat, daß die Kontaktschicht auf der Vorderseite angeordnet ist und daß sich das Material, aus welchem die Zwischenschicht besteht, sowohl auf der Vorderseite als auch auf der Rückseite des Grundkörpers befindet.15. Electrical contact according to one of the preceding claims, characterized in that the base body has a front and a back, that the contact layer is arranged on the front and that the material from which the intermediate layer consists is both on the front and also located on the back of the base body.
16. Elektrischer Kontakt nach Anspruch 15, dadurch gekennzeichnet, daß sich bei Grundkörpern, deren Dicke klein gegen ihre Länge und Breite ist, die zwischen der Vorderseite und der Rückseite vorhandenen Seitenflächen des Grundkörpers frei sind von dem Material, aus welchem die Zwischenschicht besteht.16. Electrical contact according to claim 15, characterized in that for base bodies whose thickness is small compared to their length and width, the side surfaces of the existing between the front and the back Base body is free of the material from which the intermediate layer consists.
17. Elektrischer Kontakt nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß das Palladium zu nicht mehr als 8 Gew.-% im Gold ent- halten ist. 17. Electrical contact according to one of the preceding claims, characterized in that the palladium is contained in the gold in no more than 8% by weight.
EP02794538A 2001-08-03 2002-08-02 Electric contact Expired - Lifetime EP1421651B1 (en)

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DE10138204A DE10138204B4 (en) 2001-08-03 2001-08-03 Electric contact
DE10138204 2001-08-03
PCT/EP2002/008603 WO2003015217A2 (en) 2001-08-03 2002-08-02 Electric contact

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WO2003015217A3 (en) 2004-03-25
JP4636453B2 (en) 2011-02-23
US20040238338A1 (en) 2004-12-02
DE50208722D1 (en) 2006-12-28
CN100511852C (en) 2009-07-08
US7015406B2 (en) 2006-03-21
ATE345586T1 (en) 2006-12-15
DE10138204B4 (en) 2004-04-22
EP1421651B1 (en) 2006-11-15
JP2004538369A (en) 2004-12-24
ES2275942T3 (en) 2007-06-16
DE10138204A1 (en) 2003-02-27

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