EP1409772A2 - Method for selectively electroplating a strip-shaped, metal support material - Google Patents

Method for selectively electroplating a strip-shaped, metal support material

Info

Publication number
EP1409772A2
EP1409772A2 EP02754718A EP02754718A EP1409772A2 EP 1409772 A2 EP1409772 A2 EP 1409772A2 EP 02754718 A EP02754718 A EP 02754718A EP 02754718 A EP02754718 A EP 02754718A EP 1409772 A2 EP1409772 A2 EP 1409772A2
Authority
EP
European Patent Office
Prior art keywords
carrier material
lacquer
strip
paint
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02754718A
Other languages
German (de)
French (fr)
Other versions
EP1409772B2 (en
EP1409772B1 (en
Inventor
Michail Kotsias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imo Ingo Mueller Ek
Original Assignee
Imo Ingo Mueller Ek
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imo Ingo Mueller Ek filed Critical Imo Ingo Mueller Ek
Publication of EP1409772A2 publication Critical patent/EP1409772A2/en
Application granted granted Critical
Publication of EP1409772B1 publication Critical patent/EP1409772B1/en
Publication of EP1409772B2 publication Critical patent/EP1409772B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

Definitions

  • the invention relates to a method for the selective electroplating of a band-like, metallic carrier material in a continuous pass, in particular for the electroplating of a carrier material strip with pre-punched contact elements.
  • the carrier material is first completely covered with lacquer by either spraying it with lacquer or immersing it in lacquer. Then the areas where contact material is to be galvanized are removed from the paint by means of a laser.
  • a further disadvantage of the known method is that even if only very small areas have to be galvanized, very large amounts of lacquer are required for completely coating the carrier material with a lacquer layer.
  • the relatively large thickness of the lacquer layer required to achieve a closed lacquer layer and, in particular, the extreme accumulation of lacquer with three-dimensional carrier materials make this even more difficult. It should be borne in mind that the paint materials required for such experience are relatively expensive.
  • the process according to the invention has the advantage that in the case of electrophoretic paint coating, a closed paint layer can be achieved even with significantly smaller paint thicknesses, this having a very constant paint thickness. In this way, damage to the carrier material can be effectively prevented when the lacquer layer is removed by laser treatment. In addition, the very thin lacquer layer can be removed more quickly and with less power, which enables a higher throughput speed of the carrier material.
  • the electrophoretic lacquer is deposited on the carrier material very quickly, which in turn enables higher throughput speeds of the carrier material.
  • the electrophoretic lacquer coating also leads to uniform thin lacquer layers in the case of three-dimensional carrier materials, so that selective electroplating is also possible with them. Since the removal of lacquer can be controlled practically as desired by the action of a laser, in addition to strip-like galvanization, selective galvanization can also be achieved. Advantageous further developments and improvements of the method specified in claim 1 are possible through the measures listed in the subclaims.
  • the tape-like carrier material expediently undergoes a cleaning and / or activation and / or rinsing process before the coating in order to create optimal initial conditions.
  • a plurality of lacquer strips of the same or different widths can be applied to the same side or to both sides of the tape-like carrier material.
  • the width of these strips can be precisely adjusted using the electrophoretic coating process, so that the required coating material can be minimized by optimizing the strip width.
  • the thickness of the lacquer layer can vary depending on the applied voltage, the lacquer composition and the speed of the
  • Carrier material are adjusted, in particular a cataphoretic or anaphoretic paint deposition takes place.
  • this lacquer layer can also be completely removed at the required points by appropriate adjustment of the laser beam, whereby damage to the carrier material is nevertheless avoided.
  • cathodes in a housing of the lacquer coating device are expediently covered with respect to the carrier material by means of a slot-like bend, the width of the lacquer strip being adjustable depending on the slot width and the distance between the bend and the carrier material.
  • several lacquer strips can be formed by bending with several slots.
  • the carrier material is expediently rinsed and dried, in particular in an oven or by UV light. Furthermore, the carrier material is expediently rinsed after laser stripping.
  • the areas stripped by laser can now be galvanized using one or more of the following selective galvanizing processes: selective diving in a galvanizing bath, covering the areas outside the at least one paint stripe using mechanical masking masks, in particular belt tools, applying the electrolyte using wheel technology, Spotter or brush technique.
  • FIG. 1 is a schematic representation of the individual stations of a system for selective electroplating to carry out the method according to the invention
  • FIG. 2 shows a schematic illustration of a paint coating cell for applying a paint strip of the desired width
  • FIG. 3 shows an end view of a carrier material tape with three lacquer strips on the front and rear
  • FIG. 4 shows a perspective illustration of the carrier material strip shown in FIG. 3,
  • FIG. 6 shows a perspective illustration of the carrier material band shown in FIG. 4
  • FIG. 7 shows an end view of a three-dimensional carrier material band with a lacquer strip on the shaped area
  • FIG. 8 shows a perspective illustration of the carrier material band shown in FIG. 7
  • FIG. 9 shows an end view of a further three-dimensional carrier material band with a lacquer strip
  • FIG. 10 is a perspective view of the carrier material tape shown in FIG. 9,
  • FIG. 11 shows an end view of a carrier material strip with a lacquer strip in which a strip-shaped area has been stripped by laser treatment, and with a cover for selective galvanizing and
  • FIG. 12 is a perspective view of the carrier material tape shown in FIG. 11.
  • the electroplating system shown in FIG. 1 for the selective electroplating of a carrier material strip is designed as a so-called reel-to-reel system, the metallic carrier material strip 10 being continuously unwound from a first roll or spool 11, passed through the system and behind it again to a second one Roll or spool 12 is wound as a finished tape.
  • Belt speeds of 20 m / min or higher speeds are possible.
  • the carrier material strip 10 passes through a preparation station 13, in which it is cleaned, activated and rinsed.
  • the carrier material strip 10 is then passed through a coating station 14, where selective electrophoretic coating takes place.
  • the coating station 14 can have one or more coating cells 15, as are shown schematically in FIG. 2.
  • Such a coating cell basically consists of an encapsulated housing, for example, which is shielded in such a way that uncontrolled paint deposition on undesired areas is avoided.
  • bends 17, 18, which, like the other housing areas, consist for example of Teflon or another non-conductive plastic, are arranged in such a way that they cover layered areas of the carrier material strip 10 with respect to a flat anode 19.
  • the anode 19 is made of stainless steel, but can also be platinum-plated from titanium.
  • the coating cell 15 shown is designed for anaphoretic paint deposition, for which an anaphoretic paint is used.
  • a lacquer layer is resistant to acidic media, such as a nickel, gold or tin bath, and can be removed in an alkaline environment.
  • the anode 19 is connected to the positive pole of a galvanizing voltage, while a contacting unit 21 is arranged in front of the cell by supplying current to the carrier material strip 10.
  • cataphoretic paint deposition with cataphoretic paint is also possible.
  • the cataphoretic lacquer is resistant to alkaline media and can be removed in an acidic environment. The polarity is reversed, that is, a cathode takes the place of the anode 19.
  • the coating cell 15 is designed such that the paint strip formed or the areas coated with paint are no longer damaged after the coating process. This is achieved, for example, by guide rollers, not shown, which are positioned in front of and behind the coating area. le 15 are attached and which position the carrier material in both the vertical and horizontal directions exactly so that the area coated with the lacquer strip 22 does not come into contact with areas of the housing 16.
  • the distance between the carrier material band 10 and the bent portions 17, 18 is chosen so that, on the one hand, there is a sufficient dimming effect, but that no points of contact arise.
  • the paint located in a storage tank (not shown) is fed to the coating cell 15 via nozzles.
  • a pump located in the storage tank is connected to the paint cell via a pipeline, and the amount of paint supplied can be adjusted or controlled via an interposed throttle valve, also not shown.
  • a filter arrangement can also be provided.
  • the paint feed pump is designed in such a way that the use of lightly sliding materials on all moving parts that are surrounded by paint prevents electrical charges, otherwise the paint will separate on moving parts that can become electrically charged and come into contact with the paint come, can take place.
  • FIGS. 3 to 10 various types of carrier material tapes are shown as examples, which are provided with differently arranged lacquer strips. 3 and 4, three lacquer strips 24-26 of different widths are applied to the front and back. This can be carried out either with painting cells 15 arranged one after the other or with painting cells which have a plurality of slots 20 and bends and anodes or cathodes arranged on both sides of the carrier material band 23.
  • 5 and 6 is pre-punched so that individual contacts are already formed, which can be broken off or cut off after completion. Two paint strips 28, 29 are applied.
  • the carrier material band 30 shown in FIGS. 7 and 8 is also pre-punched to form individual contacts, these contacts having semicircular formations 32 on one side of a holding strip 31 which holds them together, so that the carrier material band 30 is three-dimensional.
  • a paint strip 33 is applied to the outside of the formations 32.
  • the carrier material band 34 shown in FIGS. 9 and 10 is also three-dimensional, with holding strips 35 connecting the individual contact elements 36 at their ends. These contact elements 36 are box-shaped in the central area, a lacquer strip 37 running over the central area of the box-like configurations.
  • the selective paint strip (or several) is used in 3D Backing material strips are applied over the entire spatial depth, as can be seen in FIGS. 7 to 10.
  • the carrier material strip 10 is guided through a drying station 38 according to FIG. 1.
  • the drying and thus a partial polymerization is carried out in an oven of the drying station 38, in which there is a uniform temperature distribution.
  • the lacquer strips can also be dried with UV light and partially polymerized.
  • the carrier tape 10 is passed through a laser station 39 for selective stripping.
  • those lacquer areas which are to be galvanized later are removed from the lacquer strip (s). Both streak-like paint removal and paint removal from singular surfaces are possible, for example by the laser oscillatingly processing these surfaces.
  • several strip-shaped lacquer removals can also be carried out by means of the laser within one lacquer strip. The tolerances of the paint removal and thus the subsequent electroplating are low and amount to approx. 50 ⁇ m.
  • the substrate is not damaged by the laser beam and the varnish removal is complete. This is ensured by the exact setting of the laser via energy, wavelength, strength and duration of the pulses. 11 and 12 show that of the on the carrier a strip-shaped area 42 was stripped in the laser station 39.
  • the carrier material strip 10 is now passed through a galvanizing station 43, in which the region 42 stripped by the laser is galvanized. This is achieved by a selective electroplating process known per se.
  • a galvanizing station 43 in which the region 42 stripped by the laser is galvanized.
  • the areas of the carrier material strip 10 outside the paint strip 20 are covered by two continuously rotating belts 44.
  • the speed of the belts 44 is matched to the throughput speed of the carrier material band 10, so that the belts 44 move accordingly.
  • the area left between the two belts 44 is now wetted with a plating solution by means of a cloth, a brush or the like and is thereby galvanized. Depending on the desired layer thickness, this can be done in several stages.
  • the selective electroplating can also be carried out by selective immersion in a galvanizing bath.
  • other mechanical masking masks can also be used, spotter technology and brush technology being mentioned as further known methods for selective galvanizing.
  • the carrier material strip 10 is completely stripped in a stripping station 45 by passing it through a corresponding aqueous solution.
  • the aqueous solution is acidic or alkaline.
  • the carrier strip 10 which is usually made of brass, copper or a copper alloy.
  • Different electroplating layers can also lie one above the other, with the steps required for this taking place one after the other.
  • the carrier material strip 10 can also already have, for example, an electroplating layer which has been applied in a conventional manner, for example selective electroplating without a lacquer covering.
  • the method according to the invention can - as described - be carried out with carrier material tapes which according to FIGS. 5 to 10 already have pre-punched contacts or other elements or which are still full-surface, for example according to FIGS. 3, 4, 11 and 12.
  • punching operations can also be carried out after the electroplating, but this requires a larger amount of lacquer and electroplating metals.

Abstract

A method for the continuous selective electroplating of a metallic substrate material ( 10 ) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material ( 10 ) is coated in an electrophoretic coating means ( 14 ) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser ( 40 ), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas ( 42 ) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.

Description

Verfahren iιr selektiven Galvsπisiemrig sines banriarti gen , metal 1 i acht n Trägermateriπls Process iιr selective Galvsπisiemrig sines banriarti gen, metal 1 i eight n carrier materials
Rp.sπrirp.ihtingRp.sπrirp.ihting
Die Erfindung betrifft ein Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials im kontinuierlichen Durchlauf, insbesondere zur Galvanisierung eines Trägermaterialbands mit vorgestanzten Kontaktelementen.The invention relates to a method for the selective electroplating of a band-like, metallic carrier material in a continuous pass, in particular for the electroplating of a carrier material strip with pre-punched contact elements.
Bei einem derartigen, aus der DE 19934584 AI bekannten Verfahren wird das Trägermaterial zunächst vollständig mit Lack überzogen, indem es entweder mit Lack besprüht oder in Lack eingetaucht wird. Dann werden mittels eines Lasers diejenigen Stellen vom Lack befreit, an denen Kontaktmaterial aufgalva- nisiert werden soll.In such a method, known from DE 19934584 AI, the carrier material is first completely covered with lacquer by either spraying it with lacquer or immersing it in lacquer. Then the areas where contact material is to be galvanized are removed from the paint by means of a laser.
Bei dem bekannten Verfahren kann sowohl durch das Besprühen mit Lack als auch durch Eintauchen in Lack in nachteiliger Weise nur eine Lackschicht mit ungleichmäßiger Dicke erzielt werden. Diese Problematik verschärft sich bei einem dreidimensionalen Trägermaterial, da der Lack sich dann insbesondere in Ecken und Kanten in extremer Dicke festsetzt. Weiterhin kann sich eine für das Verfahren zwingend erforderliche geschlossene Lackschicht nur dann erzielen lassen, wenn sie relativ dick ist. Beim Laserabtrag an den zu galvanisierenden Stellen führt dies dann entweder zu einer zeitaufwendigen Bearbeitung, oder es müssen Laser mit großer Leistung verwendet werden. Da die Lackschicht an den zu galvanisierenden Stellen vollständig abgetragen sein muss,- ist es erforderlich, den Laserstrahl so einzustellen, dass die Lackschicht auch anIn the known method, only a layer of lacquer with an uneven thickness can be achieved disadvantageously both by spraying with lacquer and by immersion in lacquer. This problem is exacerbated in the case of a three-dimensional carrier material, since the lacquer then sticks to an extreme thickness, particularly in corners and edges. Furthermore, a closed lacquer layer that is absolutely necessary for the method can only be achieved if it is relatively thick. Laser ablation on the parts to be galvanized This then either leads to time-consuming processing or lasers with high power have to be used. Since the lacquer layer must be completely removed at the points to be electroplated, it is necessary to adjust the laser beam so that the lacquer layer is also on
Stellen größter Dicke entfernt wird. Dies wiederum führt dazu, dass an Stellen mit geringer Schichtdicke das Trägermaterial durch den Laserstrahl beschädigt wird. Ein weiterer Nachteil des bekannten Verfahrens besteht darin, dass selbst dann, wenn nur sehr geringe Flächen galvanisiert werden müssen, sehr große Lackmengen für das vollständige Überziehen des Trägermaterials mit einer Lackschicht benötigt werden. Die erforderliche relativ große Dicke der Lackschicht zur Erzielung einer geschlossenen Lackschicht und insbesondere die extremen Lackansammlungen bei drei-dimensionalen Trägermaterialien kommen noch erschwerend hinzu. Dabei ist zu berücksichtigen, dass die für ein solches Erfahren erforderlichen Lackmaterialien relativ teuer sind.Places of greatest thickness is removed. This in turn leads to the carrier material being damaged by the laser beam at locations with a small layer thickness. A further disadvantage of the known method is that even if only very small areas have to be galvanized, very large amounts of lacquer are required for completely coating the carrier material with a lacquer layer. The relatively large thickness of the lacquer layer required to achieve a closed lacquer layer and, in particular, the extreme accumulation of lacquer with three-dimensional carrier materials make this even more difficult. It should be borne in mind that the paint materials required for such experience are relatively expensive.
Eine Aufgabe der vorliegenden Erfindung besteht darin, das bekannte Verfahren so weiterzubilden, dass ein schnellerer Durchlauf des bandartigen Trägermaterials durch die Galvani- sierungsstrecke bei wesentlich geringerem Lackbedarf erzielt wird.It is an object of the present invention to develop the known method in such a way that a faster passage of the band-like carrier material through the electroplating section is achieved with a significantly lower paint requirement.
Diese Aufgabe wird erfindungsgemäß durch die Verfahrensschritte des Anspruchs 1 gelöst. Das erfindungsgemäße Verfahren hat den Vorteil, dass bei der elektrophoretischen LackbeSchichtung schon bei wesentlich geringeren Lackdicken eine geschlossene Lackschicht erzielt werden kann, wobei diese eine sehr konstante Lackdicke besitzt. Hierdurch können beim Entfernen der Lackschicht durch Laserbehandlung Beschädigungen des Trägermaterials wirksam verhindert werden. Darüber hinaus kann die sehr dünne Lackschicht schneller und mit geringerer Leistung entfernt wer- den, was eine höhere Durchlaufgeschwindigkeit des Trägermaterials ermöglicht. Das Abscheiden des elektrophoretischen Lacks auf dem Trägermaterial erfolgt sehr schnell, was wiederum höhere Durchlaufgeschwindigkeiten des Trägermaterials ermöglicht. Verstärkt werden diese Vorteile noch dadurch, dass nur eine selektive Lackschicht aufgebracht wird, beispielsweise ein Lackstreifen oder mehrere Lackstreifen. Diese Lackstreifen werden nur in den Bereichen aufgebracht, in denen eine Galvanisierschicht aufzubringen ist. Neben der Einsparung an teurem Lackmaterial ist somit auch ein schnelleres Entfernen des Lacks am Ende der Behandlung möglich.According to the invention, this object is achieved by the method steps of claim 1. The process according to the invention has the advantage that in the case of electrophoretic paint coating, a closed paint layer can be achieved even with significantly smaller paint thicknesses, this having a very constant paint thickness. In this way, damage to the carrier material can be effectively prevented when the lacquer layer is removed by laser treatment. In addition, the very thin lacquer layer can be removed more quickly and with less power, which enables a higher throughput speed of the carrier material. The electrophoretic lacquer is deposited on the carrier material very quickly, which in turn enables higher throughput speeds of the carrier material. These advantages are reinforced by the fact that only a selective lacquer layer is applied, for example one lacquer strip or several lacquer strips. These lacquer strips are only applied in the areas in which an electroplating layer is to be applied. In addition to saving on expensive paint material, it is also possible to remove the paint more quickly at the end of the treatment.
Die elektrophoretische Lackbeschichtung führt auch bei dreidimensionalen Trägermaterialien zu gleichmäßigen dünnen Lackschichten, so dass auch eine selektive Galvanisierung bei diesen möglich ist. Da der Lackabtrag durch Lasereinwirkung praktisch beliebig steuerbar ist, können neben streifenartigen Galvanisierungen auch punktuelle Galvanisierungen erreicht werden. Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen des im Anspruch 1 angegebenen Verfahrens möglich.The electrophoretic lacquer coating also leads to uniform thin lacquer layers in the case of three-dimensional carrier materials, so that selective electroplating is also possible with them. Since the removal of lacquer can be controlled practically as desired by the action of a laser, in addition to strip-like galvanization, selective galvanization can also be achieved. Advantageous further developments and improvements of the method specified in claim 1 are possible through the measures listed in the subclaims.
Das bandartige Trägermaterial durchläuft vor dem Belacken zweckmäßigerweise einen Reinigungs- und/oder Aktivierungsund/oder Spülvorgang, um optimale Anfangsbedingungen zu schaffen.The tape-like carrier material expediently undergoes a cleaning and / or activation and / or rinsing process before the coating in order to create optimal initial conditions.
In vorteilhafter Weise können mehrere Lackstreifen in gleicher oder unterschiedlicher Breite auf derselben Seite oder auf beiden Seiten des bandartigen Trägermaterials aufgebracht werden. Die Breite dieser Streifen ist dabei durch das elektrophoretische Lackbeschichtungsverfahren genau einstellbar, so dass durch Optimierung der Streifenbreite eine Minimierung des benötigten Lackmaterials erreicht werden kann.Advantageously, a plurality of lacquer strips of the same or different widths can be applied to the same side or to both sides of the tape-like carrier material. The width of these strips can be precisely adjusted using the electrophoretic coating process, so that the required coating material can be minimized by optimizing the strip width.
Die Lackschichtdicke kann in Abhängigkeit der angelegten Spannung, der Lackzusammensetzung und der Geschwindigkeit desThe thickness of the lacquer layer can vary depending on the applied voltage, the lacquer composition and the speed of the
Trägermaterials eingestellt werden, wobei insbesondere eine kataphoretische oder anaphoretische Lackabscheidung erfolgt.Carrier material are adjusted, in particular a cataphoretic or anaphoretic paint deposition takes place.
Durch die somit exakt einstellbare Lackschichtdicke kann auch durch entsprechende Einstellung des Laserstrahls diese Lack- Schicht vollständig an den erforderlichen Stellen abgetragen werden, wobei dennoch eine Beschädigung des Trägermaterials vermieden wird. Zur elektrophoretischen Lackbeschichtung werden Kathoden in einem Gehäuse der Lackbeschichtungseinrichtung zweckmäßigerweise gegenüber dem Trägermaterial durch eine schlitzartige Abbiendung abgedeckt, wobei in Abhängigkeit der Schlitzbreite und des Abstands zwischen Abbiendung und Trägermaterial die Lackstreifenbreite eingestellt werden kann. Durch Abbiendungen mit mehreren Schlitzen können entsprechend mehrere Lackstreifen gebildet werden.Due to the thus precisely adjustable lacquer layer thickness, this lacquer layer can also be completely removed at the required points by appropriate adjustment of the laser beam, whereby damage to the carrier material is nevertheless avoided. For electrophoretic lacquer coating, cathodes in a housing of the lacquer coating device are expediently covered with respect to the carrier material by means of a slot-like bend, the width of the lacquer strip being adjustable depending on the slot width and the distance between the bend and the carrier material. Correspondingly, several lacquer strips can be formed by bending with several slots.
Nach der Belackung wird das Trägermaterial zweckmäßigerweise gespült und getrocknet, insbesondere in einem Ofen oder durch UV-Licht. Weiterhin wird das Trägermaterial zweckmäßigerweise nach der Laserentlackung gespült.After coating, the carrier material is expediently rinsed and dried, in particular in an oven or by UV light. Furthermore, the carrier material is expediently rinsed after laser stripping.
Die durch Laser entlackten Stellen können nun durch eines oder mehrere der folgenden selektiven Galvanisierungsverfah- ren galvanisiert werden: Selektivtauchen in einem Galvanisie- rungsbad, Abdeckung der Bereiche außerhalb des wenigstens ei- nen Lackstreifens mittels mechanischer Abdeckmasken, insbesondere Riemenwerkzeugen, Aufbringen des Elektrolytmittels mittels Radtechnik, Spotter oder Brushtechnik.The areas stripped by laser can now be galvanized using one or more of the following selective galvanizing processes: selective diving in a galvanizing bath, covering the areas outside the at least one paint stripe using mechanical masking masks, in particular belt tools, applying the electrolyte using wheel technology, Spotter or brush technique.
Ausführungsbeispiele der Erfindung sind in der Zeichnung dar- gestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen: Fig. 1 eine schematische Darstellung der einzelnen Stationen einer Anlage zur selektiven Galvanisierung zur Durchführung des erfindungsgemäßen Verfahrens,Exemplary embodiments of the invention are shown in the drawing and explained in more detail in the following description. Show it: 1 is a schematic representation of the individual stations of a system for selective electroplating to carry out the method according to the invention,
Fig. 2 eine schematische Darstellung einer Lackbeschich- tungszelle zur Aufbringung eines Lackstreifens gewünschter Breite,2 shows a schematic illustration of a paint coating cell for applying a paint strip of the desired width,
Fig. 3 eine Stirnansicht eines Trägermaterialbands mit drei Lackstreifen an Vorder- und Rückseite,3 shows an end view of a carrier material tape with three lacquer strips on the front and rear,
Fig. 4 eine perspektivische Darstellung des in Fig. 3 dar- gestellten Trägermaterialbands,4 shows a perspective illustration of the carrier material strip shown in FIG. 3,
Fig. 5 eine Stirnansicht eines gestanzten Trägermaterialbands mit zwei Lackstreifen,5 shows an end view of a punched carrier material strip with two lacquer strips,
Fig. 6 eine perspektivische Darstellung des in Fig. 4 dargestellten Trägermaterialbands, Fig. 7 eine Stirnansicht eines drei-dimensionalen Trägermaterialbands mit einem Lackstreifen am ausgeformten Bereich,6 shows a perspective illustration of the carrier material band shown in FIG. 4, FIG. 7 shows an end view of a three-dimensional carrier material band with a lacquer strip on the shaped area,
Fig. 8 eine perspektivische Darstellung des in Fig. 7 dargestellten Trägermaterialbands, Fig. 9 eine Stirnansicht eines weiteren drei-dimensionalen Trägermaterialbands mit einem Lackstreifen,8 shows a perspective illustration of the carrier material band shown in FIG. 7, FIG. 9 shows an end view of a further three-dimensional carrier material band with a lacquer strip,
Fig. 10 eine perspektivische Darstellung des in Fig. 9 dargestellten Trägermaterialbands,10 is a perspective view of the carrier material tape shown in FIG. 9,
Fig. 11 eine Stirnansicht eines Trägermaterialbands mit ei- nem Lackstreifen, in dem durch Laserbehandlung ein streifenförmiger Bereich entlackt ist, und mit einer Abdeckung zur selektiven Galvanisierung und Fig. 12 eine perspektivische Darstellung des in Fig. 11 dargestellten Trägermaterialbands.11 shows an end view of a carrier material strip with a lacquer strip in which a strip-shaped area has been stripped by laser treatment, and with a cover for selective galvanizing and FIG. 12 is a perspective view of the carrier material tape shown in FIG. 11.
Die in Fig. 1 dargestellte Galvanisieranlage zur selektiven Galvanisierung eines Trägermaterialbands ist als so genannte Reel-to-Reel-Anlage ausgebildet, wobei das metallische Trägermaterialband 10 von einer ersten Rolle oder Spule 11 kontinuierlich abgewickelt, durch die Anlage hindurchgeführt und dahinter wieder auf eine zweite Rolle oder Spule 12 als fer- tig bearbeitetes Band aufgewickelt wird. Dabei sind Bandgeschwindigkeiten von 20 m/min oder auch größere Geschwindigkeiten möglich.The electroplating system shown in FIG. 1 for the selective electroplating of a carrier material strip is designed as a so-called reel-to-reel system, the metallic carrier material strip 10 being continuously unwound from a first roll or spool 11, passed through the system and behind it again to a second one Roll or spool 12 is wound as a finished tape. Belt speeds of 20 m / min or higher speeds are possible.
Zunächst durchläuft das Trägermaterialband 10 eine Vorberei- tungsstation 13, in der es gereinigt, aktiviert und gespült wird.First, the carrier material strip 10 passes through a preparation station 13, in which it is cleaned, activated and rinsed.
Anschließend wird das Trägermaterialband 10 durch eine Belak- kungsstation 14 geführt, wo eine selektive elektrophoretische Belackung erfolgt. Die Belackungsstation 14 kann eine oder mehrere Belackungszellen 15 besitzen, wie sie in Fig. 2 schematisch dargestellt sind. Eine solche Belackungszelle besteht prinzipiell aus einem beispielsweise gekapselten Gehäuse, das so abgeschirmt ist, dass eine unkontrollierte Lackabscheidung an unerwünschten Bereichen vermieden wird. Hierzu sind Abbiendungen 17 , 18 , die wie die übrigen Gehäusebereiche beispielsweise aus Teflon oder einem anderen nicht-leitenden Kunststoff bestehen, so angeordnet, dass sie die nicht zu be- schichtenden Bereiche des Trägermaterialbands 10 gegenüber einer flächigen Anode 19 abdecken. Infolge des durch die beiden Abbiendungen 17, 18 gebildeten Schlitzes 20 wird durch elektrophoretische Lackabseheidung ein Lackstreifen entspre- chend der Breite auf dem Trägermaterialband 10 gebildet. Die Anode 19 besteht dabei aus Edelstahl, kann jedoch auch aus Titan platiniert sein.The carrier material strip 10 is then passed through a coating station 14, where selective electrophoretic coating takes place. The coating station 14 can have one or more coating cells 15, as are shown schematically in FIG. 2. Such a coating cell basically consists of an encapsulated housing, for example, which is shielded in such a way that uncontrolled paint deposition on undesired areas is avoided. For this purpose, bends 17, 18, which, like the other housing areas, consist for example of Teflon or another non-conductive plastic, are arranged in such a way that they cover layered areas of the carrier material strip 10 with respect to a flat anode 19. As a result of the slot 20 formed by the two bent portions 17, 18, a lacquer strip corresponding to the width is formed on the carrier material strip 10 by electrophoretic lacquer separation. The anode 19 is made of stainless steel, but can also be platinum-plated from titanium.
Die dargestellte Belackungszelle 15 ist zur anaphoretischen Lackabscheidung ausgebildet, wozu ein anaphoretischer Lack verwendet wird. Eine solche Lackschicht ist beständig gegen saure Medien, wie ein Nickel-, Gold- oder Zinnbad, und lässt sich im alkalischen Milieu ablösen. Zur anaphoretischen Lackabscheidung ist die Anode 19 mit dem positiven Pol einer Gal- vanisierspannung verbunden, während durch Stromzuführung zum Trägermaterialband 10 vor der Zelle eine Kontaktierungsein- heit 21 angeordnet ist. Alternativ hierzu ist auch eine kata- phoretische Lackabscheidung mit kataphoretischem Lack möglich. Der kataphoretische Lack ist beständig gegenüber alka- lischen Medien und lässt sich im sauren Milieu ablösen. Die Polung ist umgekehrt, das heißt, anstelle der Anode 19 tritt eine Kathode.The coating cell 15 shown is designed for anaphoretic paint deposition, for which an anaphoretic paint is used. Such a lacquer layer is resistant to acidic media, such as a nickel, gold or tin bath, and can be removed in an alkaline environment. For anaphoretic paint deposition, the anode 19 is connected to the positive pole of a galvanizing voltage, while a contacting unit 21 is arranged in front of the cell by supplying current to the carrier material strip 10. As an alternative to this, cataphoretic paint deposition with cataphoretic paint is also possible. The cataphoretic lacquer is resistant to alkaline media and can be removed in an acidic environment. The polarity is reversed, that is, a cathode takes the place of the anode 19.
Die Belackungszelle 15 ist so ausgebildet, dass der gebildete Lackstreifen beziehungsweise die mit Lack beschichteten Bereiche nach dem Beschichtungsvorgang nicht mehr beschädigt werden. Dies wird beispielsweise durch nicht dargestellte Führungsrollen erzielt, die vor und hinter der Belackungszel- le 15 angebracht sind und die das Trägermaterial sowohl in vertikaler als auch in horizontaler Richtung exakt so positionieren, dass der mit dem Lackstreifen 22 beschichtete Bereich nicht in Kontakt mit Bereichen des Gehäuses 16 gelangt. Der Abstand zwischen dem Trägermaterialband 10 und den Abbiendungen 17, 18 ist dabei so gewählt, dass zum einen eine genügende Abblendwirkung vorhanden ist, dass aber keine Berührungspunkte entstehen.The coating cell 15 is designed such that the paint strip formed or the areas coated with paint are no longer damaged after the coating process. This is achieved, for example, by guide rollers, not shown, which are positioned in front of and behind the coating area. le 15 are attached and which position the carrier material in both the vertical and horizontal directions exactly so that the area coated with the lacquer strip 22 does not come into contact with areas of the housing 16. The distance between the carrier material band 10 and the bent portions 17, 18 is chosen so that, on the one hand, there is a sufficient dimming effect, but that no points of contact arise.
Der in einem nicht dargestellten Vorratstank befindliche Lack wird über Düsen der Belackungszelle 15 zugeführt. Eine im Vorratstank befindliche Pumpe ist über eine Rohrleitung mit der Lackzelle verbunden, wobei über ein ebenfalls nicht dargestelltes zwischengeschaltetes Drosselventil die Menge des zugeführten Lackes eingestellt beziehungsweise gesteuert werden kann. Eine Filteranordnung kann ebenfalls vorgesehen sein. Die Lackförderpumpe ist so konstruiert, dass durch Verwendung von leicht gleitenden Materialien an allen bewegten Teilen, die mit Lack umgeben sind, elektrische Aufladungen verhindert werden, da sonst eine Abscheidung des Lackes auf bewegten Teilen, die sich elektrisch aufladen können und mit dem Lack in Berührung kommen, stattfinden kann.The paint located in a storage tank (not shown) is fed to the coating cell 15 via nozzles. A pump located in the storage tank is connected to the paint cell via a pipeline, and the amount of paint supplied can be adjusted or controlled via an interposed throttle valve, also not shown. A filter arrangement can also be provided. The paint feed pump is designed in such a way that the use of lightly sliding materials on all moving parts that are surrounded by paint prevents electrical charges, otherwise the paint will separate on moving parts that can become electrically charged and come into contact with the paint come, can take place.
In den Figuren 3 bis 10 sind verschiedenartige Trägerma- terialbänder als Beispiele dargestellt, die mit unterschiedlich angeordneten Lackstreifen versehen sind. Bei dem in den Fig. 3 und 4 dargestellten Trägermaterialband sind drei Lackstreifen 24 - 26 unterschiedlicher Breite an Vorder- und Rückseite aufgebracht. Dies kann entweder mit nacheinander angeordneten Belackungszellen 15 oder mit Belak- kungszellen durchgeführt werden, die mehrere Schlitze 20 und beidseitig des Trägermaterialbands 23 angeordnete Abbiendungen und Anoden beziehungsweise Kathoden besitzt.In FIGS. 3 to 10, various types of carrier material tapes are shown as examples, which are provided with differently arranged lacquer strips. 3 and 4, three lacquer strips 24-26 of different widths are applied to the front and back. This can be carried out either with painting cells 15 arranged one after the other or with painting cells which have a plurality of slots 20 and bends and anodes or cathodes arranged on both sides of the carrier material band 23.
Das in den Fig. 5 und 6 dargestellte Trägermaterialband 27 ist so vorgestanzt, das bereits einzelne Kontakte ausgebildet sind, die nach Fertigstellung abgebrochen oder abgeschnitten werden können. Es sind zwei Lackstreifen 28, 29 aufgebracht.5 and 6 is pre-punched so that individual contacts are already formed, which can be broken off or cut off after completion. Two paint strips 28, 29 are applied.
Das in den Fig. 7 und 8 dargestellte Trägermaterialband 30 ist ebenfalls zur Bildung von einzelnen Kontakten vorgestanzt, wobei diese Kontakte auf einer Seite eines Haltestreifens 31, der sie zusammenhält, halbkreisartige Ausformungen 32 besitzen, so dass das Trägermaterialband 30 dreidimensional ausgebildet ist. Ein Lackstreifen 33 ist an der Außenseite der Ausformungen 32 aufgebracht.The carrier material band 30 shown in FIGS. 7 and 8 is also pre-punched to form individual contacts, these contacts having semicircular formations 32 on one side of a holding strip 31 which holds them together, so that the carrier material band 30 is three-dimensional. A paint strip 33 is applied to the outside of the formations 32.
Das in den Fig. 9 und 10 dargestellte Trägermaterialband 34 ist ebenfalls drei-dimensional ausgebildet, wobei Haltestreifen 35 die einzelnen Kontaktelemente 36 an ihren Enden ver- binden. Diese Kontaktelemente 36 sind im mittleren Bereich kastenartig ausgebildet, wobei ein Lackstreifen 37 über den mittleren Bereich der kastenartigen Ausbildungen verläuft. Der selektive Lackstreifen (oder auch mehrere) wird bei 3D- Trägermaterialbändern über die gesamte räumliche Tiefe aufgebracht, wie dies in den Fig. 7 bis 10 erkennbar ist.The carrier material band 34 shown in FIGS. 9 and 10 is also three-dimensional, with holding strips 35 connecting the individual contact elements 36 at their ends. These contact elements 36 are box-shaped in the central area, a lacquer strip 37 running over the central area of the box-like configurations. The selective paint strip (or several) is used in 3D Backing material strips are applied over the entire spatial depth, as can be seen in FIGS. 7 to 10.
Nach der Aufbringung eines oder mehrerer Lackstreifen wird das Trägermaterialband 10 gemäß Fig. 1 durch eine Trocknungsstation 38 geführt. Die Trocknung und damit eine Teilpolymerisation wird in einem Ofen der Trocknungsstation 38 vorgenommen, in dem eine gleichmäßige Temperaturverteilung vorhanden ist. Alternativ hierzu können die Lackstreifen auch mit UV-Licht getrocknet und teilpolymerisiert werden.After the application of one or more lacquer strips, the carrier material strip 10 is guided through a drying station 38 according to FIG. 1. The drying and thus a partial polymerization is carried out in an oven of the drying station 38, in which there is a uniform temperature distribution. Alternatively, the lacquer strips can also be dried with UV light and partially polymerized.
Als Nächstes wird das Trägermaterialband 10 durch eine Laserstation 39 zur selektiven Entlackung geführt. Mittels des Laserstrahls eines Lasers 40 werden aus dem oder den Lackstrei- fen diejenigen Lackbereiche entfernt, die später galvanisiert werden sollen. Dabei ist sowohl eine streifenförmige Entlak- kung als auch die Entlackung an singulären Flächen möglich, indem beispielsweise der Laser oszillierend diese Flächen bearbeitet. Selbstverständlich können auch innerhalb eines Lackstreifens mehrere streifenförmige Lackabtragungen mittels des Lasers vorgenommen werden. Die Toleranzen des Lackabtrags und damit der anschließenden Galvanisierung sind gering und betragen ca. 50 μm. Das Substrat wird durch den Laserstrahl nicht beschädigt, und der Lackabtrag ist vollständig. Dies wird durch die exakte Einstellung des Lasers über Energie, Wellenlänge, Stärke und Dauer der Pulse sichergestellt. In den Fig. 11 und 12 ist dargestellt, dass von dem auf dem Trä- germaterialband 10 aufgebrachten Lackstreifen 22 ein strei- fenförmiger Bereich 42 in der Laserstation 39 entlackt wurde.Next, the carrier tape 10 is passed through a laser station 39 for selective stripping. By means of the laser beam from a laser 40, those lacquer areas which are to be galvanized later are removed from the lacquer strip (s). Both streak-like paint removal and paint removal from singular surfaces are possible, for example by the laser oscillatingly processing these surfaces. Of course, several strip-shaped lacquer removals can also be carried out by means of the laser within one lacquer strip. The tolerances of the paint removal and thus the subsequent electroplating are low and amount to approx. 50 μm. The substrate is not damaged by the laser beam and the varnish removal is complete. This is ensured by the exact setting of the laser via energy, wavelength, strength and duration of the pulses. 11 and 12 show that of the on the carrier a strip-shaped area 42 was stripped in the laser station 39.
Das Trägermaterialband 10 wird nun durch eine Galvanisiersta- tion 43 hindurchgeführt, in der eine Galvanisierung des durch den Laser entlackten Bereichs 42 erfolgt. Dies wird durch ein an sich bekanntes selektives Galvanisierungsverfahren erreicht. Gemäß Fig. 12 werden dabei die Bereiche des Trägermaterialbands 10 außerhalb des Lackstreifens 20 mittels zwei kontinuierlich umlaufenden Riemen 44 abgedeckt. Die Geschwindigkeit der Riemen 44 ist dabei der Durchlaufgeschwindigkeit des Trägermaterialbands 10 angeglichen, so dass die Riemen 44 entsprechend mitlaufen. Der frei gelassene Bereich zwischen den beiden Riemen 44 wird nun mittels eines Tuchs, einer Bür- ste oder dergleichen mit Galvanisierlösung benetzt und dabei galvanisiert. Dies kann je nach gewünschter Schichtdicke in mehreren Stufen erfolgen. Befindet sich der Lackstreifen an einem Randbereich des Trägermaterialbands 10, so kann die selektive Galvanisierung auch durch selektives Tauchen in ein Galvanisierbad erfolgen. Alternativ hierzu können auch andere mechanische Abdeckmasken eingesetzt werden, wobei als weitere bekannte Verfahren zur selektiven Galvanisierung die Spottertechnik und die Brushtechnik zu nennen sind.The carrier material strip 10 is now passed through a galvanizing station 43, in which the region 42 stripped by the laser is galvanized. This is achieved by a selective electroplating process known per se. According to FIG. 12, the areas of the carrier material strip 10 outside the paint strip 20 are covered by two continuously rotating belts 44. The speed of the belts 44 is matched to the throughput speed of the carrier material band 10, so that the belts 44 move accordingly. The area left between the two belts 44 is now wetted with a plating solution by means of a cloth, a brush or the like and is thereby galvanized. Depending on the desired layer thickness, this can be done in several stages. If the lacquer strip is located at an edge region of the carrier material strip 10, the selective electroplating can also be carried out by selective immersion in a galvanizing bath. As an alternative to this, other mechanical masking masks can also be used, spotter technology and brush technology being mentioned as further known methods for selective galvanizing.
Als letzter Schritt wird das Trägermaterialband 10 in einer Entlackungsstation 45 vollständig entlackt, indem es durch eine entsprechende wässrige Lösung geführt wird. Je nachdem, ob kataphoretische oder anaphoretische Lackabscheidung eingesetzt wurde, ist die wässrige Lösung sauer oder alkalisch.As a last step, the carrier material strip 10 is completely stripped in a stripping station 45 by passing it through a corresponding aqueous solution. Depending on, Whether cataphoretic or anaphoretic paint deposition has been used, the aqueous solution is acidic or alkaline.
Selbstverständlich können auf das üblicherweise aus Messing, Kupfer oder einer Kupferlegie ung bestehende Trägermaterialband 10 auch verschiedene Materialien, wie Gold, Palladium, Silber und Zink, aufgalvanisiert werden. Verschiedene Galvanisierschichten können auch übereinanderliegen, wobei hierzu die erforderlichen Schritte nacheinander ablaufen. Das Trä- germaterialband 10 kann beispielsweise auch bereits eine Galvanisierschicht besitzen, die auf klassische Weise aufgebracht wurde, zum Beispiel selektive Galvanisierung ohne Lackabdeckung.Of course, various materials such as gold, palladium, silver and zinc can also be electroplated onto the carrier strip 10, which is usually made of brass, copper or a copper alloy. Different electroplating layers can also lie one above the other, with the steps required for this taking place one after the other. The carrier material strip 10 can also already have, for example, an electroplating layer which has been applied in a conventional manner, for example selective electroplating without a lacquer covering.
Das erfindungsgemäße Verfahren kann - wie beschrieben - mit Trägermaterialbändern durchgeführt werden, die gemäß den Fig. 5 bis 10 bereits vorgestanzte Kontakte oder andere Elemente aufweisen oder die noch vollflächig sind, beispielsweise gemäß den Fig. 3, 4, 11 und 12. Im letzteren Fall können auch nach der Galvanisierung noch Stanzvorgänge erfolgen, allerdings erfordert dies eine größere Menge an Lack und Galvani- sierungsmetallen. The method according to the invention can - as described - be carried out with carrier material tapes which according to FIGS. 5 to 10 already have pre-punched contacts or other elements or which are still full-surface, for example according to FIGS. 3, 4, 11 and 12. In the latter case punching operations can also be carried out after the electroplating, but this requires a larger amount of lacquer and electroplating metals.

Claims

Ansprüche Expectations
1. Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials im kontinuierlichen Durchlauf, insbesondere eines Trägermaterialbands mit vorgestanzten Kontaktelementen, wobei1. A method for the selective galvanization of a band-like, metallic carrier material in a continuous pass, in particular a carrier material strip with pre-punched contact elements, wherein
a) das Trägermaterial (10, 23, 27, 30, 34) in einer elektrophoretischen Lackbeschichtungseinrichtung (14, 15) mit einem elektrophoretischen Lack selektiv mit wenigstens einem Lackstreifen (22, 24 - 26, 28, 29, 33, 37) beschichtet wird, b) der wenigstens eine Lackstreifen (22, 24 - 26, 28, 29, 33, 37) an denjenigen Stellen (42) mittels eines Lasers (40) entlackt wird, die galvanisiert werden sollen, c) in einem Galvanisierungsprozess eine Metallschicht auf die entlackten Stellen (42) im wenigstens einen Lackstreifen (22, 24 - 26, 28, 29, 33, 37) mittels selektiver Galvanisierung aufgebracht wird, und d) der wenigstens eine Lackstreifen (22, 24 - 26, 28, 29, 33, 37) anschließend entfernt wird. a) the carrier material (10, 23, 27, 30, 34) in an electrophoretic lacquer coating device (14, 15) with an electrophoretic lacquer is selectively coated with at least one lacquer strip (22, 24 - 26, 28, 29, 33, 37) , b) the at least one paint strip (22, 24 - 26, 28, 29, 33, 37) is stripped at those points (42) by means of a laser (40) that are to be galvanized, c) in a galvanization process, a metal layer the stripped areas (42) are applied in at least one paint stripe (22, 24 - 26, 28, 29, 33, 37) by means of selective electroplating, and d) the at least one paint stripe (22, 24 - 26, 28, 29, 33 , 37) is then removed.
2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das bandartige Trägermaterial (10, 23, 27, 30, 34) vor dem Belacken einen Reinigungs- und/oder Aktivierungs- und/oder Spülvorgang durchläuft.2. The method according to claim 1, characterized in that the band-like carrier material (10, 23, 27, 30, 34) undergoes a cleaning and / or activation and / or rinsing process before coating.
3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass mehrere Lackstreifen (24 - 26, 28, 29) in gleicher oder unterschiedlicher Breite auf derselben Seite oder auf beiden Seiten des bandartigen Trägermaterials (23, 27) aufgebracht werden.3. The method according to claim 1 or 2, characterized in that a plurality of lacquer strips (24 - 26, 28, 29) in the same or different widths are applied to the same side or on both sides of the band-like carrier material (23, 27).
4. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Lackschichtdicke in Abhängig- keit der angelegten Spannung, der Lackzusammensetzung und der Geschwindigkeit des Trägermaterials eingestellt wird, wobei insbesondere eine kataphoretische oder anaphoretische Lackabscheidung erfolgt.4. The method according to any one of the preceding claims, characterized in that the lacquer layer thickness is set depending on the applied voltage, the lacquer composition and the speed of the carrier material, in particular cataphoretic or anaphoretic lacquer deposition taking place.
5. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass Elektroden (19) in einem Gehäuse (16) der Lackbeschichtungseinrichtung (14, 15) gegenüber dem Trägermaterial (10) durch eine schlitzartige Abbiendung (17, 18) abgedeckt werden, wobei in Abhängigkeit der Schlitzbreite (20) und des Abstands zwischen Abbiendung (17, 18) und Trägermaterial (10) die Lackstreifenbreite eingestellt wird. 5. The method according to any one of the preceding claims, characterized in that electrodes (19) in a housing (16) of the paint coating device (14, 15) with respect to the carrier material (10) are covered by a slot-like bend (17, 18), wherein in Depending on the slot width (20) and the distance between the bend (17, 18) and the carrier material (10) the paint stripe width is set.
6. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägermaterial (10, 23, 27, 30, 34) nach der Belackung gespült und getrocknet wird, insbesondere in einem Ofen (28) oder durch UV-Licht.6. The method according to any one of the preceding claims, characterized in that the carrier material (10, 23, 27, 30, 34) is rinsed and dried after coating, in particular in an oven (28) or by UV light.
7. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass durch die Laserentlackung Streifen und/oder singuläre Galvanisierungsstellen (42) gebildet werden.7. The method according to any one of the preceding claims, characterized in that strips and / or singular galvanization points (42) are formed by the laser stripping.
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägermaterial (10, 23, 27, 30, 34) nach der Laserentlackung gespült wird.8. The method according to any one of the preceding claims, characterized in that the carrier material (10, 23, 27, 30, 34) is rinsed after the laser stripping.
9. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die durch Laser (40) entlackten Stellen (42) durch eines oder mehrere der folgenden selektiven Galvanisierungsverfahren galvanisiert werden: Selektivtauchen in ein Galvanisierungsbad, Abdeckung der Bereiche außerhalb des wenigstens einen Lackstreifens mittels mechanischer Abdeckmasken (44) , insbesondere Riemenwerkzeugen, Aufbringung des Elektrolyts mittels Radtechnik, Spottertechnik oder Brushtechnik.9. The method according to any one of the preceding claims, characterized in that the areas (42) stripped by laser (40) are galvanized by one or more of the following selective galvanizing processes: selective immersion in a galvanizing bath, coverage of the areas outside the at least one paint stripe by means of mechanical Masking (44), in particular belt tools, application of the electrolyte by means of wheel technology, spotter technology or brush technology.
10. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der wenigstens eine Lackstreifen (22, 24 - 26, 28, 29, 33, 37) nach der Galvanisierung in ei- ner alkalischen oder sauren wässrigen Lösung vollständig entfernt wird. 10. The method according to any one of the preceding claims, characterized in that the at least one paint strip (22, 24 - 26, 28, 29, 33, 37) after the galvanization in a ner alkaline or acidic aqueous solution is completely removed.
EP02754718A 2001-07-20 2002-06-20 Method for selectively electroplating a strip-shaped, metal support material Expired - Lifetime EP1409772B2 (en)

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DE10135349A DE10135349A1 (en) 2001-07-20 2001-07-20 Process for selectively galvanizing strip-like metallic carrier material in continuous pass involves selectively coating carrier material with electrophoretic lacquer in electrophoretic lacquer coating device forming strips
DE10135349 2001-07-20
PCT/EP2002/006824 WO2003012175A2 (en) 2001-07-20 2002-06-20 Method for selectively electroplating a strip-shaped, metal support material

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WO2003012175A3 (en) 2003-10-30
DE50202493D1 (en) 2005-04-21
US6972082B2 (en) 2005-12-06
WO2003012175A2 (en) 2003-02-13
JP2004536971A (en) 2004-12-09
CN1533449A (en) 2004-09-29
EP1409772B2 (en) 2008-08-13
CN1250777C (en) 2006-04-12
ATE291110T1 (en) 2005-04-15
DE10135349A1 (en) 2003-02-06
US20040206629A1 (en) 2004-10-21
HK1069607A1 (en) 2005-05-27
EP1409772B1 (en) 2005-03-16

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