EP1366641A1 - Plaque de cuisson ceramique - Google Patents

Plaque de cuisson ceramique

Info

Publication number
EP1366641A1
EP1366641A1 EP02702359A EP02702359A EP1366641A1 EP 1366641 A1 EP1366641 A1 EP 1366641A1 EP 02702359 A EP02702359 A EP 02702359A EP 02702359 A EP02702359 A EP 02702359A EP 1366641 A1 EP1366641 A1 EP 1366641A1
Authority
EP
European Patent Office
Prior art keywords
layer
ceramic
intermediate layer
electrically conductive
hotplate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02702359A
Other languages
German (de)
English (en)
Other versions
EP1366641B1 (fr
Inventor
Karsten Wermbter
Andreas Killinger
Christian Friedrich
Chuanfei Li
Rainer Gadow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Carl Zeiss AG
Schott Glaswerke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss AG, Schott Glaswerke AG filed Critical Carl Zeiss AG
Priority to DK02702359T priority Critical patent/DK1366641T3/da
Publication of EP1366641A1 publication Critical patent/EP1366641A1/fr
Application granted granted Critical
Publication of EP1366641B1 publication Critical patent/EP1366641B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/68Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater

Definitions

  • the invention relates to a ceramic hob with a hotplate made of glass ceramic or glass, with an electrical heating conductor layer, with an insulating layer between the hotplate and the heating conductor layer, and with an electrically conductive intermediate layer between the hotplate and the insulating layer.
  • Such a ceramic hob is known from DE 31 05 065 C2 and from US 6 037 572.
  • the hotplate according to DE 31 05 065 C2 consists of glass ceramic, on the underside of which a metallic layer is applied, for example by a spraying process, on which in turn a ceramic insulating layer is also applied by a spraying process, on which a heating conductor element is finally vapor-deposited or in a spraying process is applied.
  • glass ceramics used for hobs have an NTC characteristic, i.e. the electrical conductivity increases noticeably as the temperature rises.
  • NTC characteristic i.e. the electrical conductivity increases noticeably as the temperature rises.
  • an electrical insulation layer is therefore a prerequisite for operating such a cooking system.
  • the system must have a dielectric strength of 3,750 volts at operating temperatures.
  • dielectric strength can be reduced if, according to DE 31 05 065 C2 or according to US 6 037 572, an electrically conductive layer is applied between the insulating layer and the hotplate, which is earthed. In such a case, a dielectric strength of around 1500 volts is sufficient for the ceramic insulation layer to ensure the necessary operational safety in accordance with VDE.
  • the layer thickness of the ceramic insulating layer can be significantly reduced, which causes problems. be reduced due to the different thermal expansions.
  • the invention is therefore based on the object of improving a ceramic cooktop in accordance with the type mentioned at the outset in such a way that the operational safety of the ceramic cooktop is improved and good long-term stability in rough everyday operation is ensured.
  • the intermediate layer is a thermally sprayed layer made of an electrically conductive ceramic or of a cermet.
  • the intermediate layer By forming the intermediate layer in the form of an electrically conductive ceramic, a considerably better adaptation of the coefficient of expansion of the intermediate layer to the coefficient of expansion of the hotplate is achieved, which is almost zero, since the coefficient of expansion of suitable ceramic materials is significantly lower than the coefficient of expansion of metals. Even when using a As a result of the ceramic particles embedded in a metallic matrix, the cermet layer has a reduced thermal expansion, as a result of which the thermal stresses are reduced.
  • an electrically conductive ceramic as an intermediate layer has the further advantage that the ceramic can be better matched to the glass ceramic of the hotplate in terms of the choice of material, with particularly good adhesion and low thermal stresses in use being able to be achieved through a targeted choice of material.
  • the intermediate layer is an oxide layer which is electrically conductive due to the loss of oxygen during thermal spraying.
  • the intermediate layer can in particular be made of Ti0 2 , from a mixture of Al 2 0 3 with a Ti0 2 content of at least 50% by weight, preferably at least 90% by weight, of Zr0 2 , from a mixture of Al 2 0 3 with Zr0 2 with a proportion of Zr0 2 of at least 50% by weight, preferably of at least 90% by weight, from a mixture of Ti0 2 and Zr0 2 , or from a mixture of Al 2 0 3 with Ti0 2 and Zr0 2 with a proportion of at least 50% by weight, preferably at least 90% by weight, of Ti0 2 and Zr0 2 (be prepared.
  • These intermediate layers made of Ti0 2 from a mixture of Al 2 0 3 with a Ti0 2 content of at least 50% by weight, preferably at least 90% by weight, of Zr0 2 , from a mixture of Al 2 0 3 with Zr0 2 with a proportion of Zr0 2 of at least 50% by weight, preferably of at least 90% by weight, of Ti0 2 and
  • Ti0 2 _ x For example, for Ti0 2 _ x with x - 0.1, a volume conductivity of about 10 3 ohm x cm to about 5 x 10 2 ohm x cm (at room temperature) results. As a result of the relatively low thermal expansion of Ti0 2 _ x and the particularly good affinity of Ti0 2 _ x for glass ceramics, Ti0 2 _ x appears to be particularly suitable for use as a conductive intermediate layer.
  • the intermediate layer can also be produced from a cermet with a metal matrix.
  • the metal matrix preferably has at least one of the constituents nickel, cobalt and chromium.
  • the intermediate layer is made of a cermet with a metal matrix, which is an alloy of the main components nickel, cobalt and chromium.
  • a metal matrix which is an alloy of the main components nickel, cobalt and chromium.
  • particles of carbide such as tungsten carbide, chromium carbide or the like, can also be embedded in the metal matrix.
  • the intermediate layer there is good electrical conductivity of the intermediate layer, and at the same time the thermal expansion coefficient is considerably reduced compared to a pure metal matrix due to the ceramic inclusions.
  • the metal matrix in question also has good adhesion to a glass ceramic surface and, owing to the increased ductility, is suitable for absorbing or reducing certain thermal stresses which occur during operation.
  • a ceramic adhesion promoter layer is provided between the electrically conductive intermediate layer and the hotplate.
  • This adhesion promoter layer preferably consists of aluminum oxide, titanium oxide or mixtures thereof and is preferably applied by thermal spraying.
  • an adhesion promoter layer leads to a further improvement in adhesion to the glass ceramic surface, resulting overall in an extremely stable layer composite which has very good temperature resistance and resistance to temperature changes.
  • the insulating layer which is applied to the intermediate layer preferably consists of cordierite or mullite and is preferably applied by thermal spraying.
  • the use of these ceramics to produce the insulating layer has the advantage of a relatively low coefficient of thermal expansion which is between approximately 4.3 and 5.0 ⁇ 10 " 6 K -1 for mullite and between approximately 2.2 and 2.4 x 10 " 6 K _1 for cordierite. As a result of the low coefficient of thermal expansion, there are lower stresses in connection with the hotplate made of glass ceramic.
  • Fig. 1 shows a cross section through an inventive ceramic hob in a first embodiment
  • Fig. 2 shows a cross section through an inventive ceramic hob in a modified version compared to FIG. 1.
  • a ceramic hob according to the invention is shown in cross section and generally designated by the number 10.
  • the ceramic cooktop comprises a cooking plate 12 of glass ceramics, for example, from ceramic ®.
  • This hotplate 12 is used to hold cooking vessels.
  • a hotplate is generated at different locations. For household purposes, typically four or possibly five hotplates are provided on a ceramic hob. Only one hotplate is shown in FIGS. 1 and 2.
  • An intermediate layer of TiO 2 was applied to the underside of the hotplate 12 by thermal spraying. This can be done, for example, by atmospheric plasma spraying (APS) with a layer thickness of approximately 50-250 ⁇ m.
  • APS atmospheric plasma spraying
  • the respective layers are preferably applied only in the area of the respective hotplates in order to keep the total voltages as low as possible.
  • the glass ceramic is cleaned, e.g. degreased with acetone.
  • the pretreatment by sandblasting, which is otherwise customary in thermal spraying, is dispensed with, since this would damage the glass ceramic.
  • an insulating layer 16 which preferably consists of cordierite (2MgO »2Al 2 0 3 « 5Si0 2 ) or mullite (3Al 2 0 3 «2Si0 2 ), is sprayed onto it again by atmospheric plasma spraying.
  • the layer thickness of the insulating layer 16 depends on the desired dielectric strength and the material used and is between approximately 100 and 500 ⁇ m, preferably between approximately 150 and 300 ⁇ m.
  • the heating conductor 20 can be applied, for example, in a known manner by a screen printing process, the flow temperatures during the baking of the layers being able to be reduced by a glassy fraction of usually more than 5% in such a way that baking temperatures between about 500 and 850 ° C. result, a dense, closed conductor layer is created.
  • the heating conductor layer 18 can also be produced by thermal spraying.
  • the part not to be coated is first masked using a customary masking method and then the exposed parts are coated with the heating conductor material by thermal spraying.
  • the part previously covered can then be removed, so that a winding heating conductor 20 is formed, the individual heating conductor tracks of which are insulated from one another.
  • FIG. 2 A modification of the ceramic cooktop is shown in FIG. 2 and generally designated by the number 10 '.
  • this intermediate layer 14 ′ which is a cermet layer, is separated by an adhesion promoter layer 24 sprayed onto the hotplate 12.
  • the adhesion promoter layer 24 preferably consists of Al 2 0 3 or a mixture of Al 2 0 3 and Ti0 2 , for example 97% by weight Al 2 0 3 and 3% by weight Ti0 2 .
  • the adhesion promoter layer 24 is thermally sprayed with a layer thickness of approximately 10 to 150 ⁇ m, preferably by APS. The preferred layer thickness is on the order of approximately 30 to 100 ⁇ m.
  • a cermet layer consisting of a nickel / cobalt / chromium alloy with embedded carbide particles (tungsten carbide, chromium carbide etc.) is then sprayed onto the adhesion promoter layer 24.
  • the intermediate layer 14 ' is produced with a layer thickness of approximately 50 to 250 ⁇ m, preferably approximately 50 to 100 ⁇ m.
  • the insulating layer 16 and the heat conductor layer 18 are then applied in the manner already described with reference to FIG. 1.
  • the individual layers lying one above the other gradually run out at the edge region and thus continuously pass to the layer below them.
  • the total area of the individual layers decreases toward the heating conductor layer. This results in favorable stress conditions in the edge regions of the respective layers in order to counteract delamination of the layers.
  • annular depression 26 which surrounds the intermediate layer 14 in an annular manner at the edge region thereof.
  • This slight depression allows stresses that arise between the hotplate 12 and the intermediate layer 14 to be absorbed and partially reduced.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Cookers (AREA)
  • Baking, Grill, Roasting (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Inorganic Insulating Materials (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
EP02702359A 2001-03-06 2002-02-20 Plaque de cuisson ceramique Expired - Lifetime EP1366641B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DK02702359T DK1366641T3 (da) 2002-02-20 2002-02-20 Keramikkogefelt

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10112235A DE10112235C2 (de) 2001-03-06 2001-03-06 Keramik-Kochfeld
DE10112235 2001-03-06
PCT/EP2002/001751 WO2002078397A1 (fr) 2001-03-06 2002-02-20 Plaque de cuisson ceramique

Publications (2)

Publication Number Publication Date
EP1366641A1 true EP1366641A1 (fr) 2003-12-03
EP1366641B1 EP1366641B1 (fr) 2004-12-01

Family

ID=7677416

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02702359A Expired - Lifetime EP1366641B1 (fr) 2001-03-06 2002-02-20 Plaque de cuisson ceramique

Country Status (8)

Country Link
US (1) US20040104212A1 (fr)
EP (1) EP1366641B1 (fr)
CN (1) CN1494816A (fr)
AT (1) ATE284123T1 (fr)
CA (1) CA2439177A1 (fr)
DE (2) DE10112235C2 (fr)
ES (1) ES2232733T3 (fr)
WO (1) WO2002078397A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20041363A1 (it) * 2004-07-08 2004-10-08 Cedil Sa Elettrodomestico per cucine e simili
US20100015354A1 (en) * 2008-07-16 2010-01-21 Lee Tai-Cheung Method of making rollers with a fine pattern
CN101979998B (zh) * 2010-09-17 2012-07-25 九江学院 一种对热喷涂制备碳化铬金属陶瓷涂层中碳化物损失的定量表征方法
ES2401890B1 (es) * 2011-06-29 2014-04-10 BSH Electrodomésticos España S.A. Dispositivo de aparato doméstico
CN104254151A (zh) * 2014-08-25 2014-12-31 常熟市董浜镇华进电器厂 安全可靠的电热管
DE102016224069A1 (de) 2016-12-02 2018-06-07 E.G.O. Elektro-Gerätebau GmbH Kochgerät mit einer Kochplatte und einer Heizeinrichtung darunter
KR102111109B1 (ko) * 2017-02-21 2020-05-14 엘지전자 주식회사 면상 발열장치, 이를 포함하는 전기 레인지 및 그 제조방법
CN207869432U (zh) * 2018-03-07 2018-09-14 东莞市国研电热材料有限公司 一种多温区陶瓷发热体
EP3627671A1 (fr) 2018-09-21 2020-03-25 Siemens Aktiengesellschaft Procédé de fabrication d'un dispositif de tête d'enroulement pour une machine rotative électrique

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110571A (en) * 1958-07-01 1963-11-12 Du Pont Ceramic material bonded to metal having refractory oxide dispersed therein
US3610888A (en) * 1970-01-30 1971-10-05 Westinghouse Electric Corp Oxide resistor heating element
US3978315A (en) * 1975-09-19 1976-08-31 Corning Glass Works Electrical heating units
DE3105065A1 (de) * 1981-02-12 1982-08-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kochplatte aus glaskeramik
US4764341A (en) * 1987-04-27 1988-08-16 International Business Machines Corporation Bonding of pure metal films to ceramics
US5227345A (en) * 1990-05-03 1993-07-13 The Dow Chemical Company Powder mixtures including ceramics and metal compounds
FR2665184B1 (fr) * 1990-07-24 1993-10-15 Centre Nal Recherc Scientifique Poudres composites alumine/metal, cermets realises a partir desdites poudres et procedes de fabrication.
US5728638A (en) * 1996-08-21 1998-03-17 Bfd, Inc. Metal/ceramic composites containing inert metals
US6037572A (en) * 1997-02-26 2000-03-14 White Consolidated Industries, Inc. Thin film heating assemblies
DE29824031U1 (de) * 1998-04-17 2000-02-24 Bsh Bosch Siemens Hausgeraete Kochplatte mit elektrisch leitfähiger Keramikplatte
US5973298A (en) * 1998-04-27 1999-10-26 White Consolidated Industries, Inc. Circular film heater and porcelain enamel cooktop
DE19855481A1 (de) * 1998-12-01 2000-06-08 Siceram Gmbh Elektrisches Kochfeld

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO02078397A1 *

Also Published As

Publication number Publication date
DE50201676D1 (de) 2005-01-05
CN1494816A (zh) 2004-05-05
ES2232733T3 (es) 2005-06-01
CA2439177A1 (fr) 2002-10-03
EP1366641B1 (fr) 2004-12-01
DE10112235C2 (de) 2003-04-03
WO2002078397A1 (fr) 2002-10-03
US20040104212A1 (en) 2004-06-03
DE10112235A1 (de) 2002-10-10
ATE284123T1 (de) 2004-12-15

Similar Documents

Publication Publication Date Title
EP0069298B1 (fr) Plaque chauffante
EP1366642B1 (fr) Plaque de cuisson ceramique
DE3105065C2 (fr)
DE3889506T2 (de) Materialien für Dickschichtleiterbahnen.
EP1144968B1 (fr) Thermometre a resistance de platine et son procede de production
EP1366641B1 (fr) Plaque de cuisson ceramique
DE2928895C2 (de) Masse zur Bildung von selbstreinigenden Überzügen und ihre Verwendung
DE102013104702B4 (de) Beschichtete Glaskeramikplatte
EP0817756B1 (fr) Ozoniseur et procede de fabrication
EP1366643B1 (fr) Plaque de cuisson ceramique
DE8909020U1 (de) Flächenheizelement
DE2011215C3 (de) Elektrische Heizvorrichtung
CH693851A5 (de) Ozonisator und Verfahren zur Herstellung eines solchen.
DE102005056501A1 (de) Flaches Induktionskochsystem
EP0793735B1 (fr) Element d'etancheite, notamment pour organes d'obturation et de regulation, et son procede de fabrication
DE2615473A1 (de) Messwiderstand fuer ein widerstandsthermometer
EP0488450A1 (fr) Anode pour tube à rayons X à couche d'oxyde
WO2001075408A1 (fr) Element de detection, notamment sonde de temperature
EP0719594A1 (fr) Procédé pour revêtir un objet, notamment des ustentiles culinaires, et objet ainsi revêtus
DE19609118A1 (de) Dickschichtpaste und ein dieses verwendendes keramisches Schaltungssubstrat
EP2788296B1 (fr) Composition d'émail électroniquement conductrice
EP0170767B1 (fr) Substrat pour circuits imprimés
DE102005007933A1 (de) Verfahren zum Herstellen einer Heizleiterschicht auf einem Substrat und damit hergestellte Kochplatte
DE102005028363B3 (de) Hochtemperatur-IR-Tarnbeschichtung
DE102009008672A1 (de) Verfahren zur Herstellung einer elektrisch isolierenden Dichtungsanordnung und Dichtungsanordnung zum Abdichten zwischen zwei Bauteilen eines Brennstoffzellenstacks

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20030823

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: CARL-ZEISS-STIFTUNGTRADING AS SCHOTT GLAS

Owner name: SCHOTT GLAS

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SCHOTT AG

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041201

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041201

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20041201

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: BOVARD AG PATENTANWAELTE

Ref country code: CH

Ref legal event code: EP

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20041201

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: GERMAN

REF Corresponds to:

Ref document number: 50201676

Country of ref document: DE

Date of ref document: 20050105

Kind code of ref document: P

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20050208

Year of fee payment: 4

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20050210

Year of fee payment: 4

Ref country code: FR

Payment date: 20050210

Year of fee payment: 4

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20050211

Year of fee payment: 4

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: LU

Payment date: 20050215

Year of fee payment: 4

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20050218

Year of fee payment: 4

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050220

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050220

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20050301

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20050309

Year of fee payment: 4

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2232733

Country of ref document: ES

Kind code of ref document: T3

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20050902

ET Fr: translation filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060220

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060221

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20060228

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060901

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060901

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

EUG Se: european patent has lapsed
GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20060220

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 20060901

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20061031

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20060221

BERE Be: lapsed

Owner name: *SCHOTT A.G.

Effective date: 20060228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050501

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070220