EP1326275A3 - Power electronic module - Google Patents

Power electronic module Download PDF

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Publication number
EP1326275A3
EP1326275A3 EP02028592A EP02028592A EP1326275A3 EP 1326275 A3 EP1326275 A3 EP 1326275A3 EP 02028592 A EP02028592 A EP 02028592A EP 02028592 A EP02028592 A EP 02028592A EP 1326275 A3 EP1326275 A3 EP 1326275A3
Authority
EP
European Patent Office
Prior art keywords
thermal adhesive
electronic module
power electronic
conductor tracks
support element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02028592A
Other languages
German (de)
French (fr)
Other versions
EP1326275A2 (en
Inventor
Bernd Thyzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1326275A2 publication Critical patent/EP1326275A2/en
Publication of EP1326275A3 publication Critical patent/EP1326275A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

Die Erfindung bezieht sich auf eine Leistungselektronikeinheit mit einem flächigen Trägerelement, auf dem Leiterbahnen 4 zur elektrischen Verbindung von ebenfalls auf dem Trägerelement befindlichen elektrischen Leistungsbauelementen 6 und Steuerbauelementen 7 einer Schaltung angeordnet sind. Das Trägerelement ist ein Kühlkörper 1, auf dem die Leiterbahnen 4 mittels eines Wärmeleitklebers 3 aufgebracht sind und durch Abstandshalter 4 im Wärmeleitkleber 3 eine solche Mindestdikke des Wärmeleitklebers 3 sichergestellt ist, dass der Wärmeleitkleber 3 eine elektrische Isolationsschicht ist.

Figure imgaf001
The invention relates to a power electronics unit with a planar support element, on which conductor tracks 4 for the electrical connection of also located on the support element electrical power components 6 and control elements 7 of a circuit are arranged. The carrier element is a heat sink 1, on which the conductor tracks 4 are applied by means of a thermally conductive adhesive 3 and by spacers 4 in the thermal adhesive 3 such Mindestdikke the thermal adhesive 3 is ensured that the thermal adhesive 3 is an electrical insulation layer.
Figure imgaf001
EP02028592A 2002-01-03 2002-12-20 Power electronic module Withdrawn EP1326275A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10200066A DE10200066A1 (en) 2002-01-03 2002-01-03 Power electronics unit
DE10200066 2002-01-03

Publications (2)

Publication Number Publication Date
EP1326275A2 EP1326275A2 (en) 2003-07-09
EP1326275A3 true EP1326275A3 (en) 2006-05-03

Family

ID=7711464

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02028592A Withdrawn EP1326275A3 (en) 2002-01-03 2002-12-20 Power electronic module

Country Status (3)

Country Link
US (1) US6771505B2 (en)
EP (1) EP1326275A3 (en)
DE (1) DE10200066A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341453A1 (en) * 2003-09-09 2005-03-31 Robert Bosch Gmbh circuit support
JP2005151617A (en) * 2003-11-11 2005-06-09 Sumitomo Wiring Syst Ltd Circuit structure and its production process
JP2005197688A (en) * 2003-12-29 2005-07-21 Siemens Ag Electronic unit
DE102004018471B4 (en) * 2004-04-16 2009-04-16 Infineon Technologies Ag Power semiconductor circuit and method of manufacturing a power semiconductor circuit
DE102004058335A1 (en) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. substratum
US7718256B1 (en) 2006-04-05 2010-05-18 Northrop Grumman Corporation Thermal interface material for electronic assemblies
CN103597918B (en) * 2011-05-17 2016-08-24 开利公司 Variable ratio frequency changer drives heat radiator assembly
JP6115464B2 (en) * 2013-12-20 2017-04-19 株式会社オートネットワーク技術研究所 Circuit structure
CN107079578A (en) * 2014-09-24 2017-08-18 Hiq太阳能股份有限公司 Transistor heat management and EMI rwan management solution RWANs for fast edge rates environment
DE102015212169A1 (en) * 2015-06-30 2017-01-05 Osram Gmbh Circuit carrier for an electronic circuit and method for producing such a circuit carrier
DE102015212177A1 (en) * 2015-06-30 2017-01-05 Osram Gmbh Circuit carrier for an electronic circuit and method for producing such a circuit carrier
DE102016102588B4 (en) * 2016-02-15 2021-12-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing a connection carrier, connection carrier, optoelectronic component with a connection carrier and method for producing an optoelectronic component
DE102019215644A1 (en) * 2019-10-11 2021-04-15 Robert Bosch Gmbh Electronic assemblies, in particular for electric vehicles or hybrid vehicles
CN111599753B (en) * 2020-05-29 2023-10-13 绍兴同芯成集成电路有限公司 Thin wafer cooling fin and manufacturing process thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9201519U1 (en) * 1992-02-07 1992-04-02 Daimler-Benz Aktiengesellschaft, 7000 Stuttgart, De
JPH05185800A (en) * 1992-01-10 1993-07-27 Nitto Denko Corp Transfer sheet
JPH0786704A (en) * 1993-09-10 1995-03-31 Matsushita Electric Ind Co Ltd Wiring board for power circuit and manufacturing method thereof
WO1998005067A1 (en) * 1996-07-29 1998-02-05 Rjr Polymers, Inc. Electronic packages containing microsphere spacers
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2772184B2 (en) * 1991-11-07 1998-07-02 株式会社東芝 Semiconductor device
US5410449A (en) * 1993-05-24 1995-04-25 Delco Electronics Corp. Heatsink conductor solder pad
DE19546285A1 (en) * 1995-12-12 1997-06-19 Telefunken Microelectron Electronic module with circuit on substrate surface
DE19722357C1 (en) * 1997-05-28 1998-11-19 Bosch Gmbh Robert Control unit
DE19736962B4 (en) * 1997-08-25 2009-08-06 Robert Bosch Gmbh Arrangement, comprising a carrier substrate for power devices and a heat sink and method for producing the same
DE19859739A1 (en) * 1998-12-23 2000-07-06 Bosch Gmbh Robert Heat sink for electronic control device has power component thermally coupled to heat sink block on underside of component carrier via heat conduction plate in component reception opening in component carrier
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
US6477052B1 (en) * 2000-08-01 2002-11-05 Daimlerchrysler Corporation Multiple layer thin flexible circuit board
US6477054B1 (en) * 2000-08-10 2002-11-05 Tektronix, Inc. Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
US6625027B2 (en) * 2001-10-31 2003-09-23 Baker Hughes Incorporated Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05185800A (en) * 1992-01-10 1993-07-27 Nitto Denko Corp Transfer sheet
DE9201519U1 (en) * 1992-02-07 1992-04-02 Daimler-Benz Aktiengesellschaft, 7000 Stuttgart, De
JPH0786704A (en) * 1993-09-10 1995-03-31 Matsushita Electric Ind Co Ltd Wiring board for power circuit and manufacturing method thereof
WO1998005067A1 (en) * 1996-07-29 1998-02-05 Rjr Polymers, Inc. Electronic packages containing microsphere spacers
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein

Also Published As

Publication number Publication date
US20030148653A1 (en) 2003-08-07
US6771505B2 (en) 2004-08-03
EP1326275A2 (en) 2003-07-09
DE10200066A1 (en) 2003-07-17

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