JPH05185800A - Transfer sheet - Google Patents

Transfer sheet

Info

Publication number
JPH05185800A
JPH05185800A JP4021883A JP2188392A JPH05185800A JP H05185800 A JPH05185800 A JP H05185800A JP 4021883 A JP4021883 A JP 4021883A JP 2188392 A JP2188392 A JP 2188392A JP H05185800 A JPH05185800 A JP H05185800A
Authority
JP
Japan
Prior art keywords
transfer
metal film
sheet
film
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4021883A
Other languages
Japanese (ja)
Inventor
Shozo Kawazoe
昭造 河添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP4021883A priority Critical patent/JPH05185800A/en
Publication of JPH05185800A publication Critical patent/JPH05185800A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Abstract

PURPOSE:To obtain a transfer sheet which is capable of transferring a metal film with an adhesive force strong enough to dispense with an after-adhesion process and forming a high-accuracy transfer pattern due to the excellent cutting properties of a transfer part and a non-transfer part as well as is best suited for the formation of a circuit pattern and an electric junction part. CONSTITUTION:The subject transfer sheet consists of a metal film 2 provided in a freely transferrable manner on an easy-to-peel sheet 1, if necessary, through a single or more than a single layer as an intermediate layer. The metal film 2 is of a soft metal and at the same time, demonstrates a strong transfer adhesive force to a transfer medium in a filmy state so that it does not come off despite the attempt to peel it off with an adhesive tape having an adhesive strength against a peel-off force of 10g/cm or larger, if applied to a metal film. Consequently, it is possible to complete the transfer of a metal film with the concurrent achievement of satisfactory cutting, using a simple process by which to stack the metal film over the transfer medium together, then press and separate them.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、金属膜を後接着処理の
必要がない強固な密着力で転写でき、転写部と非転写部
のカッティング性に優れて高精度な転写パターンを形成
でき、回路パターンや電気的接合部の形成などに好適な
転写シートに関する。
INDUSTRIAL APPLICABILITY The present invention is capable of transferring a metal film with a strong adhesive force without the need for post-adhesion treatment, and is capable of forming a highly accurate transfer pattern with excellent cutting properties of a transfer portion and a non-transfer portion. The present invention relates to a transfer sheet suitable for forming a circuit pattern or an electrical joint.

【0002】[0002]

【従来の技術】従来、易剥離性シートの上にインジウム
やスズ等からなるろう材系金属膜を転写可能に設けてな
る転写シートが知られていた(特開昭62−14349
6号公報)。しかしながら、その金属膜を被転写体に転
写するに際しては加熱処理や超音波をかける必要のある
問題点があった。
2. Description of the Related Art Heretofore, a transfer sheet has been known in which a brazing filler metal film made of indium, tin or the like is transferably provided on an easily peelable sheet (JP-A-62-14349).
No. 6). However, there is a problem that it is necessary to apply heat treatment or ultrasonic waves when transferring the metal film to the transfer target.

【0003】前記に鑑みて、本発明者が属するグループ
は先に、押圧処理で転写できる低融点系金属膜を設けた
転写シートを提案した(特開昭64−10578号、特
開昭64−10579号)。しかし、その低融点系金属
膜の被転写体に対する転写密着性が充分でなく、低融点
系金属膜を被転写体に押圧後、その転写シートを剥がす
ことにより前記押圧による転写密着力でその押圧部分を
伴うことなく、従って押圧部分と非押圧部分との境界で
低融点系金属膜をカッティングしつつ転写を完了させう
るものではなかった。そのため低融点系金属膜より転写
部分をちぎり取った状態で転写する必要があり、そのち
ぎり取りによる転写の際に非転写部分からなる不要部分
を伴うなどのカッティング不良により転写精度、殊に細
線等の微細パターンでの転写精度が向上しにくい難点が
あった。
In view of the above, the group to which the present inventor belongs has previously proposed a transfer sheet provided with a low melting point metal film which can be transferred by a pressing treatment (Japanese Patent Laid-Open Nos. 64-10578 and 64-78). 10579). However, the transfer adhesiveness of the low melting point metal film to the transfer target is not sufficient, and after the low melting point metal film is pressed against the transfer target, the transfer sheet is peeled off and the transfer adhesion force by the pressing causes the pressing. It was not possible to complete the transfer while cutting the low-melting point metal film at the boundary between the pressed portion and the non-pressed portion without involving any portion. Therefore, it is necessary to transfer the part that has been transferred from the low-melting-point metal film in a state where it is torn off, and transfer accuracy, especially fine lines, etc. However, it was difficult to improve the transfer accuracy in the fine pattern of.

【0004】[0004]

【発明が解決しようとする課題】本発明は、金属膜を後
接着処理の必要がない強固な密着力で転写でき、転写部
と非転写部のカッティング性に優れて高精度な転写パタ
ーンを形成できる転写シートの開発を課題とする。
SUMMARY OF THE INVENTION According to the present invention, a metal film can be transferred with a strong adhesive force without the need for post-adhesion treatment, and a highly precise transfer pattern can be formed with excellent cutting properties of a transfer portion and a non-transfer portion. The challenge is to develop a transfer sheet that can be used.

【0005】[0005]

【課題を解決するための手段】本発明は、易剥離性シー
トの上に、必要に応じ1層又は2層以上の中間層を介し
て金属膜を転写可能に有してなり、その金属膜が軟質金
属からなると共に、膜状態を維持したまま被転写体に対
して強固な転写密着力を示し、その転写密着力が金属膜
に対して10g/cm以上の剥離接着強度を示す粘着テー
プを接着して剥離しても剥がすことができないものであ
ることを特徴とする転写シートを提供するものである。
DISCLOSURE OF THE INVENTION The present invention comprises a metal film which can be transferred onto an easily peelable sheet via one or two or more intermediate layers, if necessary. A pressure-sensitive adhesive tape that is made of a soft metal and has a strong transfer adhesion to a transfer target while maintaining a film state, and the transfer adhesion has a peel adhesion strength of 10 g / cm or more to a metal film. It is intended to provide a transfer sheet characterized in that it cannot be peeled off even if it is adhered and peeled off.

【0006】[0006]

【作用】本発明者は前記の課題を克服するために鋭意研
究を重ねる中で、軟質金属からなる金属膜が薄膜活性に
優れるためかその理由は不明であるが、種々の被転写体
に対して特段に優れる転写密着力を示すことを究明し、
しかもその強固な転写密着力に基づいてか転写部と非転
写部のカッティング性にも優れて高精度な転写パターン
を形成できることを究明した。
The inventors of the present invention have made extensive studies to overcome the above problems, and it is unclear why a metal film made of a soft metal has excellent thin film activity. And found that it exhibits a particularly excellent transfer adhesion.
Moreover, it was clarified that a highly precise transfer pattern can be formed on the basis of the strong transfer adhesive force and excellent cutting property of the transfer portion and the non-transfer portion.

【0007】[0007]

【発明の構成要素の例示】本発明の転写シートは、易剥
離性シートの上に金属膜を転写可能に有してなり、必要
に応じその易剥離性シートと金属膜との間に1層又は2
層以上の中間層を有するものである。図1、図2にかか
る転写シートを例示した。1が易剥離性シート、2が金
属膜、3が中間層である。
Examples of constituent elements of the invention: The transfer sheet of the present invention comprises a metal film transferably transferred onto an easily peelable sheet, and if necessary, one layer is provided between the easily peelable sheet and the metal film. Or 2
It has one or more intermediate layers. The transfer sheet according to FIGS. 1 and 2 is illustrated. 1 is an easily peelable sheet, 2 is a metal film, and 3 is an intermediate layer.

【0008】易剥離性シートとしては、例えば粘着シー
ト等におけるセパレータなどとして公知の適宜なものを
用いることができる。一般には、ポリテトラフルオロエ
チレン、ポリクロロトリフルオロエチレン、ポリフッ化
ビニル、ポリフッ化ビニリデン、テトラフルオロエチレ
ン・ヘキサフルオロプロピレン共重合体、クロロトリフ
ルオロエチレン・フッ化ビニリデン共重合体の如きフッ
素系樹脂からなるシート、ポリエチレンやポリプロピレ
ンの如きポリオレフィン系樹脂からなるシート、あるい
はポリエステル、ポリアミド、ポリ塩化ビニル、ポリス
チレンの如き通例のプラスチックからなるシートや金属
箔などの薄葉体を、例えばシリコーン系剥離剤、フッ素
系剥離剤、長鎖アクリル系剥離剤、硫化モリブデンの如
き剥離性付与剤で表面処理したものなどが用いられる。
易剥離性シートの厚さは適宜に決定してよいが、一般に
は金属膜の転写性などの点より1〜600μmとされ
る。なお前記のシートは、延伸処理等により伸び率など
の変形性を制御したものであってもよい。
As the easily peelable sheet, for example, an appropriate sheet known as a separator in an adhesive sheet or the like can be used. Generally, from a fluororesin such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, chlorotrifluoroethylene / vinylidene fluoride copolymer. Sheet, a sheet made of a polyolefin resin such as polyethylene or polypropylene, or a sheet made of a usual plastic such as polyester, polyamide, polyvinyl chloride or polystyrene, or a thin foil such as a metal foil, for example, a silicone release agent or a fluorine-based release agent. A release agent, a long-chain acrylic release agent, or a material surface-treated with a release property imparting agent such as molybdenum sulfide is used.
The thickness of the easily peelable sheet may be appropriately determined, but is generally 1 to 600 μm in view of the transferability of the metal film. The sheet may have a deformability such as elongation controlled by a stretching process or the like.

【0009】易剥離性シートの上に転写可能に設ける金
属膜は、軟質金属で形成される。その例としてはインジ
ウム、スズ、ビスマス、鉛、金、亜鉛、銀、アルミニウ
ム、銅、それらの合金などがあげられる。金属膜の形成
は、真空蒸着法、スパッタリング法、イオンプレーティ
ング法、メッキ法、無電解メッキ法などの薄膜形成法で
行うことができる。形成する金属膜の厚さは、転写性な
どの点より通例10Å〜100μm、就中300Å〜1
0μmとされる。
The transferably provided metal film on the easily peelable sheet is formed of a soft metal. Examples thereof include indium, tin, bismuth, lead, gold, zinc, silver, aluminum, copper and alloys thereof. The metal film can be formed by a thin film forming method such as a vacuum vapor deposition method, a sputtering method, an ion plating method, a plating method or an electroless plating method. The thickness of the metal film to be formed is usually 10Å to 100 μm, especially 300Å to 1 from the viewpoint of transferability.
It is set to 0 μm.

【0010】本発明の転写シートにおける金属膜は、そ
の膜状態を維持したまま被転写体に対して強固な転写密
着力を示し、その転写密着力が金属膜に対して10g/
cm以上、好ましくは100g/cm以上の剥離接着強度を
示す粘着テープを接着して剥離しても剥がすことができ
ないものである。
The metal film in the transfer sheet of the present invention exhibits a strong transfer adhesive force to the transferred object while maintaining the film state, and the transfer adhesive force is 10 g / m with respect to the metal film.
Even if an adhesive tape having a peeling adhesive strength of cm or more, preferably 100 g / cm or more is adhered and peeled off, it cannot be peeled off.

【0011】前記特性を有する金属膜の形成は、上記の
とおり適宜な薄膜形成法で行うことができるが、その形
成の際等を通じて金属膜の表面に通例形成される酸化層
を可及的に少なくすること、金属膜を形成する粒径を大
きくすること、就中0.5μm以上、特に1μm以上とす
ることなどにより行うことができる。すなわち前記金属
膜は、原子に近い状態で易剥離性シート等の支持ベース
の上に付着しつつそれらが凝集して塊となり、その塊を
単位としてそれらが集合ないし重畳したものであるが、
前記した粒径はかかる塊の大きさを意味する。
The metal film having the above-mentioned characteristics can be formed by an appropriate thin film forming method as described above, but an oxide layer which is usually formed on the surface of the metal film is formed as much as possible during the formation. It can be carried out by reducing the amount, increasing the grain size for forming the metal film, and particularly 0.5 μm or more, particularly 1 μm or more. That is, the metal film, while being attached to a support base such as an easily peelable sheet in a state close to atoms, aggregates into a lump, and the lumps are aggregated or overlapped as a unit,
The particle size mentioned above means the size of such a mass.

【0012】前記において、金属膜表面での酸化層形成
の抑制は、膜形成時や保管時において酸素との接触を可
及的に防止することにより達成することができる。金属
膜を形成する粒径の制御は、支持ベース温度や膜形成速
度等の膜形成条件に基づいて行うことができる。
In the above description, the formation of an oxide layer on the surface of the metal film can be suppressed by preventing contact with oxygen as much as possible during film formation and storage. The grain size for forming the metal film can be controlled based on the film forming conditions such as the supporting base temperature and the film forming rate.

【0013】本発明において易剥離性シートと金属膜と
の間に必要に応じて設ける中間層は、金属膜の転写後そ
の上に別個の工程を介して付設する方法に代えて、予め
易剥離性シート上に金属膜と共に形成しておいてそれを
金属膜を介して被転写体に転写することにより、前記の
別個の付設工程を不要とすることを目的とするものであ
る。従って形成する中間層は、用途等に応じて適宜に決
定することができ、その層数も1層又は2層以上の任意
数とすることができる。
In the present invention, the intermediate layer which is provided between the easily peelable sheet and the metal film, if necessary, may be easily peeled in advance instead of the method of attaching the intermediate layer after the transfer of the metal film through a separate step. It is an object of the present invention to eliminate the above-mentioned separate attachment step by forming it together with a metal film on the conductive sheet and transferring it to the transfer target through the metal film. Therefore, the intermediate layer to be formed can be appropriately determined according to the application and the like, and the number of layers can be any number of one layer or two or more layers.

【0014】中間層の形成に一般的に用いられる材料と
しては、上記した軟質金属のほか、例えばニッケル、ク
ロム、シリコン、鉄等やそれらの合金、Al23、SiO
1〜2、TiO1〜2、Ta25、ZnO、WO3、ZnS、Zn
Se、SnO2、In22、GaAs、GaP、CdO等の金属
酸化物ないし金属化合物などがあげられる。
As the material generally used for forming the intermediate layer, in addition to the above-mentioned soft metals, for example, nickel, chromium, silicon, iron and their alloys, Al 2 O 3 and SiO 2 are used.
1-2 , TiO 1-2 , Ta 2 O 5 , ZnO, WO 3 , ZnS, Zn
Examples thereof include metal oxides and metal compounds such as Se, SnO 2 , In 2 O 2 , GaAs, GaP and CdO.

【0015】中間層の形成は上記した薄膜形成法等によ
り行うことができ、その厚さは通例10Å〜100μm
とされる。なお中間層を設ける場合、転写性などの点よ
り易剥離性シートに対する中間層の界面接着力が、金属
膜を重畳した中間層の引張強度よりも大きいこと、就中
10g以上、特に50g以上大きいことが好ましい。こ
れにより、中間層を易剥離性シートから剥離するのに要
する力が金属膜を含む中間層の膜強度よりも大きくな
り、金属膜を転写する際に中間層を含む膜をその押圧力
で切断することができる。
The intermediate layer can be formed by the above-mentioned thin film forming method or the like, and the thickness thereof is usually 10Å to 100 μm.
It is said that. When the intermediate layer is provided, the interfacial adhesion of the intermediate layer to the easily peelable sheet is greater than the tensile strength of the intermediate layer on which the metal film is superposed, especially 10 g or more, especially 50 g or more, in view of transferability and the like. It is preferable. As a result, the force required for peeling the intermediate layer from the easily peelable sheet becomes larger than the film strength of the intermediate layer including the metal film, and the film including the intermediate layer is cut by the pressing force when transferring the metal film. can do.

【0016】本発明の転写シートにおいて、中間層を含
むこともある金属膜の転写は、それを被転写体に重ねて
易剥離性シート側から押圧することにより行うことがで
きる。すなわち金属膜を被転写体に対して押圧した後そ
の転写シートを剥がすことにより、前記押圧による転写
密着力でその押圧部分を伴うことなく、従って押圧部分
と非押圧部分との境界で金属膜(中間層を有する場合に
はそれを含む)をカッティングしつつ転写を完了させる
ことができる。転写シートの押圧部分は、転写すべき金
属膜部分、すなわち必要な転写パターンに応じて決定さ
れる。押圧力は、易剥離性シートに対する金属膜ないし
中間層の界面接着力以上〜30kg/cm2以下、就中0.
5〜10kg/cm2で充分である。なお、転写シートの金
属膜と柔軟な被転写体等を重ねて被転写体側より押圧す
るこによっても金属膜を転写することができる。
In the transfer sheet of the present invention, the transfer of the metal film, which may include an intermediate layer, can be carried out by stacking it on the transfer object and pressing it from the easily peelable sheet side. That is, by pressing the metal film against the transferred material and then peeling off the transfer sheet, the transfer film does not accompany the pressed portion due to the transfer adhesion force by the pressing, and thus the metal film (at the boundary between the pressed portion and the non-pressed portion). The transfer can be completed while cutting the intermediate layer (including the intermediate layer). The pressing portion of the transfer sheet is determined according to the metal film portion to be transferred, that is, the required transfer pattern. The pressing force is not less than the interfacial adhesive force of the metal film or the intermediate layer with respect to the easily peelable sheet to 30 kg / cm 2 or less, and especially 0.
5-10 kg / cm 2 is sufficient. The metal film can also be transferred by stacking the metal film of the transfer sheet on a flexible transfer target and pressing the transfer target from the transfer target side.

【0017】被転写体については、金属、セラミック、
プラスチック、木材、紙など任意であり、その形状も板
状、曲面体状、繊維状など任意である。なお被転写体
は、転写密着力の点よりその表面が清浄であることが好
ましい。またプラスチック板やガラス板等の場合には表
面の粗面化処理や活性化処理等を施すことが望ましい。
Regarding the transferred material, metal, ceramic,
It may be plastic, wood, paper, or the like, and may have a plate shape, a curved body shape, a fiber shape, or the like. The surface of the transferred material is preferably clean from the viewpoint of transfer adhesion. Further, in the case of a plastic plate or a glass plate, it is desirable to perform surface roughening treatment or activation treatment.

【0018】本発明の転写シートは、高精度な転写パタ
ーンを形成できることより、例えば種々の回路パターン
の形成や、半導体レーザ、IC等の電子部品のリード
部、ないしそのリード部と電気回路基板との電気的接合
部、プリント配線基板とフラットケーブルとの電気的接
合部、チップ状電子部品の外部電極等の電気的接合部の
形成、メッキ材、装飾材など、種々の目的に用いること
ができる。また中間層を設けることにより、例えばマイ
グレーションによる電気的接触不良を防止するためのニ
ッケル等からなる金属バリアー層の併設など、より広範
囲の目的に用いることができる。
Since the transfer sheet of the present invention can form a highly accurate transfer pattern, for example, various circuit patterns are formed, lead parts of electronic parts such as semiconductor lasers and ICs, or the lead parts and an electric circuit board. It can be used for various purposes, such as electrical joints of, electrical joints of printed wiring boards and flat cables, formation of electrical joints such as external electrodes of chip-shaped electronic components, plating materials, and decorative materials. . Further, by providing the intermediate layer, the intermediate layer can be used for a wider range of purposes, such as providing a metal barrier layer made of nickel or the like for preventing electrical contact failure due to migration.

【0019】[0019]

【発明の効果】本発明の転写シートによれば、その金属
膜が転写密着力に優れて後接着処理の必要がなく、金属
膜と被転写体を重ねて押圧後それらを分離する簡単な方
法で押圧部と非押圧部の境界での金属膜の良好なカッテ
ィングを達成しつつ転写を完了でき、高精度な転写パタ
ーンを形成することができる。従って、曲面にも転写す
ることができる。
EFFECT OF THE INVENTION According to the transfer sheet of the present invention, the metal film has excellent transfer adhesion and does not require post-adhesion treatment. Thus, the transfer can be completed while achieving good cutting of the metal film at the boundary between the pressed portion and the non-pressed portion, and a highly accurate transfer pattern can be formed. Therefore, it can be transferred onto a curved surface.

【0020】[0020]

【実施例】【Example】

実施例1 厚さ50μmのポリテトラフルオロエチレンフィルムの
片面に、インジウムを真空蒸着(1/104Torr)
して厚さ5μmのインジウム膜を形成して転写シートを
得た。なおインジウム膜の平均粒径は約3μmであり、
表面での酸化層は部分的であった。
Example 1 Indium was vacuum-deposited (1/10 4 Torr) on one surface of a polytetrafluoroethylene film having a thickness of 50 μm.
Then, an indium film having a thickness of 5 μm was formed to obtain a transfer sheet. The average grain size of the indium film is about 3 μm,
The oxide layer on the surface was partial.

【0021】実施例2 実施例1に準じて、平均粒径約2μm、表面酸化層が部
分的なビスマス膜を有する転写シートを得た。
Example 2 According to the same manner as in Example 1, a transfer sheet having an average particle size of about 2 μm and a surface oxide layer having a partial bismuth film was obtained.

【0022】実施例3 実施例1に準じて、平均粒径約2μm、表面酸化層が部
分的なスズ膜を有する転写シートを得た。
Example 3 According to the same manner as in Example 1, a transfer sheet having an average particle diameter of about 2 μm and a surface-oxidized layer having a partial tin film was obtained.

【0023】実施例4 実施例1に準じて、平均粒径約1.5μm、表面酸化層
が部分的な鉛膜を有する転写シートを得た。
Example 4 According to the same manner as in Example 1, a transfer sheet having an average particle size of about 1.5 μm and a surface oxide layer having a partial lead film was obtained.

【0024】実施例5 実施例1に準じて、平均粒径0.5〜1μm、表面酸化
層が部分的な金膜を有する転写シートを得た。
Example 5 According to Example 1, a transfer sheet having an average particle size of 0.5 to 1 μm and a surface oxidation layer having a partial gold film was obtained.

【0025】実施例6 実施例1に準じて先ずニッケル膜を形成した後その上
に、平均粒径約2μm、表面酸化層が部分的なインジウ
ム膜を設けて転写シートを得た。
Example 6 According to Example 1, a nickel film was first formed, and then an indium film having an average grain size of about 2 μm and a partial surface oxide layer was provided on the nickel film to obtain a transfer sheet.

【0026】比較例1 実施例1に準じ、真空度1/102Torrの条件で表
面の全面が酸化層で覆われたインジウム膜(酸化インジ
ウム)を有する転写シートを得た。なおインジウム膜の
平均粒径は約1μmであった。
Comparative Example 1 According to Example 1, a transfer sheet having an indium film (indium oxide) whose entire surface was covered with an oxide layer was obtained under the conditions of a vacuum degree of 1/10 2 Torr. The average particle size of the indium film was about 1 μm.

【0027】比較例2 膜形成速度を遅くしたほかは実施例1に準じて、平均粒
径約0.4μmのインジウム膜を有する転写シートを得
た。なおインジウム膜の表面における酸化層は部分的
で、実施例1の場合と実質的に変りはなかった。
Comparative Example 2 A transfer sheet having an indium film having an average particle size of about 0.4 μm was obtained in the same manner as in Example 1 except that the film formation rate was slowed. The oxide layer on the surface of the indium film was partial and was substantially the same as that in the case of Example 1.

【0028】評価試験 転写性 実施例、比較例で得た転写シートを金属膜側を介して金
メッキ銅箔の上に載せ、易剥離性シート上より市販の細
書(0.2mm)用ボールペンで所定の文字や直線を書いた
のち転写シートを剥がし、その転写性を調べて下記の基
準で評価した。 ○:金メッキ銅箔上に転写された文字や直線に欠けた部
分がなくて直線の幅が均一であり、転写シートに残る金
属膜にメクレ等の剥がれが認められない場合。 ×:金メッキ銅箔上に転写された文字や直線に欠けがあ
ったり、直線の幅が不均一であったり、あるいは転写シ
ートに残る金属膜にメクレ等の剥がれが認められた場
合。
Evaluation Test Transferability The transfer sheets obtained in Examples and Comparative Examples were placed on a gold-plated copper foil with the metal film side interposed therebetween, and the transferable sheet was pre-determined with a commercially available fine ball (0.2 mm) ballpoint pen. After writing the letters and straight lines, the transfer sheet was peeled off, and the transferability was examined and evaluated according to the following criteria. ◯: There is no character transferred to the gold-plated copper foil or a part lacking in a straight line, the width of the straight line is uniform, and peeling such as clogging is not recognized in the metal film remaining on the transfer sheet. X: When characters or straight lines transferred on the gold-plated copper foil are chipped, the width of the straight lines is not uniform, or peeling such as mess is observed on the metal film remaining on the transfer sheet.

【0029】転写密着力 金メッキ銅箔(Cベース)、シリコン板(Sベース)、
又はステンレス板(Mベース)の上に実施例、比較例で
得た転写シートを金属膜側を介して載せ、易剥離性シー
トの上より小型ローラを介し押圧(2kg/cm2)したの
ち転写シートを剥がす方法で、幅20mm、長さ50mmの
転写層を形成したのち、その上に市販のアクリル系粘着
テープ(幅10mm)を圧着し、30分経過後にそのアク
リル系粘着テープを300mm/分の速度で剥がして観察
し、下記の基準で評価した(室温)。なお前記のアクリ
ル系粘着テープの各金属膜に対する室温における接着力
(180度ピール、剥離速度300mm/分)は、いずれ
の場合にも100g/cm以上であった。また易剥離性シ
ートに対する各金属膜の室温における接着力(180度
ピール、剥離速度300mm/分)は、それぞれインジウ
ム膜で6g/cm、ビスマス膜で9g/cm、スズ膜で7g
/cm、鉛膜で6g/cm、金膜で6g/cmであった。 ○:粘着テープへの金属膜の移着がなく、ベース基板上
に転写した金属膜にも剥がれ部分が認められない場合。 ×:金属膜がベース基板より剥がれて粘着テープに移着
した場合。
Transfer adhesion force Gold-plated copper foil (C base), silicon plate (S base),
Alternatively, the transfer sheets obtained in Examples and Comparative Examples are placed on a stainless steel plate (M base) with the metal film side interposed therebetween, and the transfer is performed after pressing the easily peelable sheet through a small roller (2 kg / cm 2 ). After forming a transfer layer having a width of 20 mm and a length of 50 mm by peeling the sheet, a commercially available acrylic adhesive tape (width of 10 mm) is pressure-bonded onto the transfer layer, and after 30 minutes, the acrylic adhesive tape is transferred to 300 mm / min. It was peeled off at a rate of, and observed, and evaluated according to the following criteria (room temperature). The adhesive strength (180 degree peeling, peeling speed 300 mm / min) at room temperature of each of the acrylic adhesive tapes to each metal film was 100 g / cm or more in all cases. The adhesion of each metal film to the easily peelable sheet at room temperature (180 degree peeling, peeling speed 300 mm / min) was 6 g / cm for indium film, 9 g / cm for bismuth film, and 7 g for tin film, respectively.
/ Cm, 6 g / cm for the lead film and 6 g / cm for the gold film. ◯: When the metal film was not transferred to the adhesive tape and no peeling part was observed in the metal film transferred onto the base substrate. X: When the metal film was peeled off from the base substrate and transferred to the adhesive tape.

【0030】前記の結果を表1に示した。The above results are shown in Table 1.

【表1】 [Table 1]

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例の断面図。FIG. 1 is a sectional view of an example.

【図2】他の実施例の断面図。FIG. 2 is a sectional view of another embodiment.

【符号の説明】 1:易剥離性シート 2:金属膜 3:中間層[Explanation of symbols] 1: Easy peeling sheet 2: Metal film 3: Intermediate layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 易剥離性シートの上に金属膜を転写可能
に有してなり、その金属膜が軟質金属からなると共に、
膜状態を維持したまま被転写体に対して強固な転写密着
力を示し、その転写密着力が金属膜に対して10g/cm
以上の剥離接着強度を示す粘着テープを接着して剥離し
ても剥がすことができないものであることを特徴とする
転写シート。
1. A metal film is transferably provided on an easily peelable sheet, and the metal film is made of a soft metal, and
Shows strong transfer adhesion to the transfer target while maintaining the film state, and the transfer adhesion is 10 g / cm to the metal film.
A transfer sheet characterized in that it cannot be peeled off even if the pressure-sensitive adhesive tape exhibiting the above peeling adhesive strength is adhered and peeled off.
【請求項2】 易剥離性シートと金属膜との間に1層又
は2層以上の中間層を有することを特徴とする請求項1
に記載の転写シート。
2. The one-layer or two or more intermediate layers are provided between the easily peelable sheet and the metal film.
The transfer sheet described in.
JP4021883A 1992-01-10 1992-01-10 Transfer sheet Pending JPH05185800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4021883A JPH05185800A (en) 1992-01-10 1992-01-10 Transfer sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4021883A JPH05185800A (en) 1992-01-10 1992-01-10 Transfer sheet

Publications (1)

Publication Number Publication Date
JPH05185800A true JPH05185800A (en) 1993-07-27

Family

ID=12067520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4021883A Pending JPH05185800A (en) 1992-01-10 1992-01-10 Transfer sheet

Country Status (1)

Country Link
JP (1) JPH05185800A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1326275A2 (en) * 2002-01-03 2003-07-09 Siemens Aktiengesellschaft Power electronic module
WO2012108070A1 (en) * 2011-02-10 2012-08-16 フリージア・マクロス株式会社 Metal foil with carrier and method for producing laminated substrate using same
JP2013034012A (en) * 2012-11-06 2013-02-14 Freesia Makurosu Kk Metal foil with carrier
WO2014038424A1 (en) 2012-09-05 2014-03-13 東レ株式会社 Laminated body

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1326275A2 (en) * 2002-01-03 2003-07-09 Siemens Aktiengesellschaft Power electronic module
EP1326275A3 (en) * 2002-01-03 2006-05-03 Siemens Aktiengesellschaft Power electronic module
WO2012108070A1 (en) * 2011-02-10 2012-08-16 フリージア・マクロス株式会社 Metal foil with carrier and method for producing laminated substrate using same
JP2012169350A (en) * 2011-02-10 2012-09-06 Freesia Makurosu Kk Metal foil with carrier and manufacturing method of multilayer substrate using the same
CN103384597A (en) * 2011-02-10 2013-11-06 福利家麦克罗斯株式会社 Metal foil with carrier and method for producing laminated substrate using same
WO2014038424A1 (en) 2012-09-05 2014-03-13 東レ株式会社 Laminated body
JP2013034012A (en) * 2012-11-06 2013-02-14 Freesia Makurosu Kk Metal foil with carrier

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