DE20301773U1 - Electrical equipment - Google Patents

Electrical equipment

Info

Publication number
DE20301773U1
DE20301773U1 DE20301773U DE20301773U DE20301773U1 DE 20301773 U1 DE20301773 U1 DE 20301773U1 DE 20301773 U DE20301773 U DE 20301773U DE 20301773 U DE20301773 U DE 20301773U DE 20301773 U1 DE20301773 U1 DE 20301773U1
Authority
DE
Germany
Prior art keywords
electrical
metallic
circuit board
printed circuit
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20301773U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leopold Kostal GmbH and Co KG
Original Assignee
Leopold Kostal GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leopold Kostal GmbH and Co KG filed Critical Leopold Kostal GmbH and Co KG
Priority to DE20301773U priority Critical patent/DE20301773U1/en
Publication of DE20301773U1 publication Critical patent/DE20301773U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB

Description

The description text was not recorded electronically  
The description text was not recorded electronically  
The description text was not recorded electronically  
The description text was not recorded electronically  
The description text was not recorded electronically

Claims (10)

1. Electrical device with a metal-clad printed circuit board ( 1 ), one of which is arranged on one ( 1 ') of its two surfaces (1 × 1 "), connected to traces of the printed circuit board ( 1 ) formed by parts ( 1 a) of the metal cladding, heat energy donating electrical module (2) is arranged, via a a a on its wall (1 b ') before handenen ductile metal layer (1 c) breakthrough provided (1 b) of the Lei terplatte (1) form-locking and force-locking held metallic connecting element ( 3 ) with one on the other ( 1 ") of the two surfaces (1 ', 1") of the printed circuit board ( 1 ) arranged cooling body ( 4 ) is coupled via a heat-conducting means ( 5 ), characterized in that the ductile metal layer ( 1 c) present in the breakthrough ( 1 b) for the electrical connection of parts ( 1 a) of the metal lamination arranged on both surfaces ( 1 ', 1 ") of the printed circuit board ( 1 ) is provided and m it on a Ver connecting element ( 3 ) existing, structured surface ( 3 a *) is in mechanical engagement, which is formed on an opening ( 1 b) assigned (first) region ( 3 a) of the connecting element ( 3 ).
2. Electrical device according to claim 1, characterized in that the connecting element ( 3 ) consists of a profiled ductile metal core and is materially surrounded by an even more ductile metal layer.
3. Electrical device according to one of claims 1 or 2, characterized in that the metallic connecting element ( 3 ) consists of a tinned copper hat having a hat-shaped contour.
4. Electrical device according to one of claims 1 to 3, characterized in that the metallic connecting element ( 3 ) in an arranged as a hole opening ( 1 b) of the circuit board ( 1 ) to the ordered first area ( 3 a) with respect to the expansion of the circular opening ( 1 b) has a slightly larger circular cross-section and is pressed into the same.
5. Electrical device according to one of claims 1 to 4, characterized in that the metallic connecting element ( 3 ) in a to the first region ( 3 a) adjoining the second region ( 3 b) with respect to an extension of the diameter first area ( 3 a) has a larger extent.
6. Electrical device according to claim 5, characterized in that the second region ( 3 b) of the metallic connecting element ( 3 ) is also provided with a circular cross section.
7. Electrical device according to one of claims 1 to 6, characterized in that the metallic connecting element (3) (4) end facing a flat supporting surface (3 b ') has at its the heat sink and with the same a the heat conducting means ( 5 ) forming heat-conducting film is connected to a likewise flat head zone ( 4 ') of the heat sink ( 4 ).
8. Electrical device according to claim 7, characterized in that the electrical insulation of the connecting element ( 3 ) to the cooling body ( 4 ) effecting, designed as a heat-conducting means ( 5 ) has an extent which is greater than the extent of which preferably from Metal heat sink ( 4 ) facing the end of the Verbindungsele element ( 3 ) existing support surface ( 3 b ').
9. Electrical device according to one of claims 1 to 8, characterized in that the metallic connecting element ( 3 ) on an existing on its at the electrical module ( 2 ) associated end face flat surface ( 3 a ') applied solder material ( 7 ) with the a corresponding supporting surface ( 2 ') having an electrical component ( 2 ) is connected in an electrically conductive manner.
10. Electrical device according to claim 9, characterized in that the electrical component ( 2 ) is designed as a so-called SMD component and that the first region ( 3 a) of the metallic connecting element ( 3 ) has such a height that a with the a material connection to the wall ( 1 b ') associated metal layer ( 1 c) ge ensuring solder material ( 7 ) gap to be filled ( 1 b') between the flat head surface ( 3 a ') of the connecting element ( 3 ) and the support surface ( 2 ') of the electrical component ( 2 ) which is directly supported on one surface ( 1 a) of the printed circuit board ( 1 ) is provided in the opening ( 1 b) of the printed circuit board ( 1 ).
DE20301773U 2003-02-05 2003-02-05 Electrical equipment Expired - Lifetime DE20301773U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20301773U DE20301773U1 (en) 2003-02-05 2003-02-05 Electrical equipment

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE20301773U DE20301773U1 (en) 2003-02-05 2003-02-05 Electrical equipment
DE200450003737 DE502004003737D1 (en) 2003-02-05 2004-01-31 Cooling device for semiconductors on printed circuit board
EP04002127A EP1445799B1 (en) 2003-02-05 2004-01-31 Heat dissipation device for a semiconductor on a printed circuit board
AT04002127T AT362198T (en) 2003-02-05 2004-01-31 Cooling device for semiconductor on pcb

Publications (1)

Publication Number Publication Date
DE20301773U1 true DE20301773U1 (en) 2003-04-17

Family

ID=7979732

Family Applications (2)

Application Number Title Priority Date Filing Date
DE20301773U Expired - Lifetime DE20301773U1 (en) 2003-02-05 2003-02-05 Electrical equipment
DE200450003737 Active DE502004003737D1 (en) 2003-02-05 2004-01-31 Cooling device for semiconductors on printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE200450003737 Active DE502004003737D1 (en) 2003-02-05 2004-01-31 Cooling device for semiconductors on printed circuit board

Country Status (3)

Country Link
EP (1) EP1445799B1 (en)
AT (1) AT362198T (en)
DE (2) DE20301773U1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
EP1503615A2 (en) * 2003-07-31 2005-02-02 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
EP1528847A1 (en) * 2003-10-29 2005-05-04 Magnetek S.p.A. Heat dissipating insert, circuit comprising said insert and production method
DE202004006870U1 (en) * 2004-04-29 2005-06-09 Fuba Printed Circuits Gmbh circuit board
WO2006059923A1 (en) * 2004-11-30 2006-06-08 Telefonaktiebolaget Lm Ericsson (Publ) A printed board assembly with improved heat dissipation
DE102005024096A1 (en) * 2005-05-25 2006-11-30 Bosch Rexroth Aktiengesellschaft Device and method for mounting electrical components
DE102006009812A1 (en) * 2006-03-01 2007-09-06 Beru Ag Electrical circuit for controlling electric heater in motor vehicle, has power semiconductor, e.g. MOSFET, mounted on metallic intermediate plate in surface mounted technology, where intermediate plate is retained by mounting plate
DE102007011811A1 (en) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Copper inlay for printed circuit boards
EP1732130A3 (en) * 2005-06-06 2008-12-03 Delphi Technologies, Inc. Circuit assembly with surface-mount IC package and heat sink
DE102007029422A1 (en) * 2007-06-26 2009-01-08 Behr-Hella Thermocontrol Gmbh Method for thermal contacting of power elements mounted on front side of circuit board, involves installing power element on mounting location on circuit board by forming hole in circuit board
DE102007057533A1 (en) * 2007-11-29 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Heat sink and method of manufacturing a heat sink
DE202014006215U1 (en) * 2014-07-31 2015-08-13 Kathrein-Werke Kg Printed circuit board with cooled component, in particular SMD component
WO2016146291A1 (en) * 2015-03-16 2016-09-22 Siemens Aktiengesellschaft Printed circuit board comprising a semiconductor switching element

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365988B2 (en) 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
ES2347864B1 (en) * 2010-06-11 2011-06-16 Zertan S.A. HEAT DISSIPATION SYSTEM FOR POWER TRANSISTORS.
US9763317B2 (en) 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
CN105283031A (en) * 2014-07-11 2016-01-27 台达电子工业股份有限公司 Heat dissipation module and combination method
AT517221B1 (en) * 2015-04-29 2016-12-15 Melecs Ews Gmbh & Co Kg circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2124035B (en) * 1982-07-15 1985-07-31 Standard Telephones Cables Ltd Printed circuit boards
US5014904A (en) * 1990-01-16 1991-05-14 Cray Research, Inc. Board-mounted thermal path connector and cold plate
JPH0955459A (en) * 1995-06-06 1997-02-25 Seiko Epson Corp Semiconductor device
DE19528632A1 (en) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Control unit consisting of at least two housing parts
DE19736962B4 (en) * 1997-08-25 2009-08-06 Robert Bosch Gmbh Arrangement, comprising a carrier substrate for power devices and a heat sink and method for producing the same
SE516533C2 (en) * 1999-06-30 2002-01-29 Ericsson Telefon Ab L M Pattern card with metal plugs for heat dissipation
US6411516B1 (en) * 2001-06-15 2002-06-25 Hughes Electronics Corporation Copper slug pedestal for a printed circuit board
DE10214311A1 (en) * 2002-03-28 2003-10-09 Marconi Comm Gmbh Cooling device for electronic component such as SMD, has heat conductor held by friction in opening in circuit board, with heat sink on opposite surface

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329267A1 (en) * 2003-06-30 2005-01-27 Robert Bosch Gmbh Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
EP1503615A2 (en) * 2003-07-31 2005-02-02 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
DE10335129B3 (en) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Cooling arrangement for arranged on a printed circuit board electrical components, in particular SMD components
EP1503615A3 (en) * 2003-07-31 2005-07-27 Kathrein-Werke KG Circuit board having a cooled component, particularly a SMD-component
EP1528847A1 (en) * 2003-10-29 2005-05-04 Magnetek S.p.A. Heat dissipating insert, circuit comprising said insert and production method
DE202004006870U1 (en) * 2004-04-29 2005-06-09 Fuba Printed Circuits Gmbh circuit board
WO2006059923A1 (en) * 2004-11-30 2006-06-08 Telefonaktiebolaget Lm Ericsson (Publ) A printed board assembly with improved heat dissipation
DE102005024096A1 (en) * 2005-05-25 2006-11-30 Bosch Rexroth Aktiengesellschaft Device and method for mounting electrical components
EP1732130A3 (en) * 2005-06-06 2008-12-03 Delphi Technologies, Inc. Circuit assembly with surface-mount IC package and heat sink
US7561436B2 (en) 2005-06-06 2009-07-14 Delphi Technologies, Inc. Circuit assembly with surface-mount IC package and heat sink
DE102006009812A1 (en) * 2006-03-01 2007-09-06 Beru Ag Electrical circuit for controlling electric heater in motor vehicle, has power semiconductor, e.g. MOSFET, mounted on metallic intermediate plate in surface mounted technology, where intermediate plate is retained by mounting plate
DE102006009812B4 (en) * 2006-03-01 2008-09-04 Beru Ag Mounting arrangement for several power semiconductors and circuit with such a mounting arrangement
DE102007011811A1 (en) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Copper inlay for printed circuit boards
DE102007029422A1 (en) * 2007-06-26 2009-01-08 Behr-Hella Thermocontrol Gmbh Method for thermal contacting of power elements mounted on front side of circuit board, involves installing power element on mounting location on circuit board by forming hole in circuit board
DE102007057533A1 (en) * 2007-11-29 2009-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Heat sink and method of manufacturing a heat sink
DE102007057533B4 (en) * 2007-11-29 2016-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Heat sink, method for manufacturing a heat sink and printed circuit board with heat sink
DE202014006215U1 (en) * 2014-07-31 2015-08-13 Kathrein-Werke Kg Printed circuit board with cooled component, in particular SMD component
WO2016146291A1 (en) * 2015-03-16 2016-09-22 Siemens Aktiengesellschaft Printed circuit board comprising a semiconductor switching element
DE102015204709A1 (en) * 2015-03-16 2016-09-22 Siemens Aktiengesellschaft Printed circuit board with a semiconductor switching element

Also Published As

Publication number Publication date
DE502004003737D1 (en) 2007-06-21
EP1445799A2 (en) 2004-08-11
EP1445799A3 (en) 2006-04-12
EP1445799B1 (en) 2007-05-09
AT362198T (en) 2007-06-15

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030522

R021 Search request validly filed

Effective date: 20030410

R163 Identified publications notified

Effective date: 20031218

R150 Term of protection extended to 6 years

Effective date: 20060130

R157 Lapse of ip right after 6 years

Effective date: 20090901