EP1308969B1 - Micro-capteur inductif formé à plat sur un substrat - Google Patents

Micro-capteur inductif formé à plat sur un substrat Download PDF

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Publication number
EP1308969B1
EP1308969B1 EP01204214A EP01204214A EP1308969B1 EP 1308969 B1 EP1308969 B1 EP 1308969B1 EP 01204214 A EP01204214 A EP 01204214A EP 01204214 A EP01204214 A EP 01204214A EP 1308969 B1 EP1308969 B1 EP 1308969B1
Authority
EP
European Patent Office
Prior art keywords
micro
segments
inductive
coil
segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01204214A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1308969A1 (fr
Inventor
Pierre-André Farine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asulab AG
Original Assignee
Asulab AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asulab AG filed Critical Asulab AG
Priority to DE60138388T priority Critical patent/DE60138388D1/de
Priority to EP01204214A priority patent/EP1308969B1/fr
Priority to US10/259,570 priority patent/US20030085790A1/en
Priority to JP2002313945A priority patent/JP2003188015A/ja
Publication of EP1308969A1 publication Critical patent/EP1308969A1/fr
Application granted granted Critical
Publication of EP1308969B1 publication Critical patent/EP1308969B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an inductive micro-sensor comprising a micro-coil formed flat on a substrate, and more particularly to such a micro-sensor integrated in a microelectronic circuit chip of an inductive detection or measurement device.
  • Induction coils of large size made by winding a conductive wire on a core having a diameter of the order of 30 to 50 mm have been used for a long time in the industry, for example to detect the proximity of objects metallic or their appearance defects. These coils were first used as a model to move to a smaller scale, with a diameter of about one millimeter. This miniaturization makes it possible to use these coils in microsystems, for a very large number of applications, for example to produce proximity inductive sensors for counting parts, for safety devices, or for servocontrols such as angular control of a stepper motor of a watch movement.
  • These coiled wire coils can still have a sufficiently high signal, but the coil itself still has a size that is a disadvantage in some applications, especially in the field of watchmaking where it is the rule for all components of the movement to have the lowest possible height and occupy the smallest possible area.
  • these micro-coils were then made in plane form by conformation of a conductive material on a substrate according to the known techniques for producing the tracks of a printed circuit.
  • the coil was formed by a sequence of segments leading to a spiral type structure rectangular or square contour. There is then a strong reduction of the inductance. According to the work published by Ph. A. Passeraub & col.
  • the invention therefore aims at overcoming the drawbacks of the above-mentioned prior art by providing a micro-sensor having a spiral-type flat winding coil with a rectangular or square contour, making it possible to have a fairly high inductance, and that can be produced from simple way with a minimum of waste.
  • the subject of the invention is an inductive micro-sensor comprising on a substrate a flat micro-coil formed by long, high-aspect ratio conductive segments, each segment being arranged with respect to the following segment in a perpendicular direction to form a spiral-like structure with a generally rectangular or square contour.
  • the micro-coil is characterized in that each long segment is connected to the next long segment S i , S i + 1 by means of a short segment s i forming with the two long segments angles ⁇ and ⁇ 'greater than 90 ° .
  • the Figures 1 to 3 represent an inductive micro-sensor of the prior art, for example making it possible to carry out the angular detection of a mobile in a movement, as described, for example, in the European patent EP 0 952 426 .
  • the micro-sensor is constituted by a plane coil 1 disposed on the plate 3 of a printed circuit (not shown) having contact pads 5 for transmitting signals, for example to a servo unit.
  • the plane coil 1 comprises a winding of 10 "turns".
  • the segments S i of this winding are made by known techniques, such as screen printing ("screen printing") or photolithography with electrodeposition. As represented in figure 2 the segments have a low aspect ratio (height to width ratio less than 1).
  • the above disadvantages are reduced or even eliminated by "breaking" the connection angles of the large segments S i by small segments s i .
  • the angle ⁇ formed between a large segment S i and a small segment s; and the angle ⁇ 'formed by the small segment s i and a next larger segment S i + 1 is greater than 90 °.
  • the winding being preferably regular, the angle ⁇ is preferably equal to ⁇ ', that is to say 135 ° for all the connection areas of the large segments S i .
  • Segments S i and s i can be made by known photolithography and electroplating techniques. They can also and preferably be made by the "bumping" technique of depositing an additional layer of gold on the surface of the integrated circuit, in particular above the areas of the contact pads, possibly above the last layer. insulation. This technique makes it possible, thanks to the excellent conductivity of gold to obtain optimum interconnectivity, as well as extremely low resistance values for the structures produced on the insulating layer of the integrated circuit.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
EP01204214A 2001-11-06 2001-11-06 Micro-capteur inductif formé à plat sur un substrat Expired - Lifetime EP1308969B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE60138388T DE60138388D1 (de) 2001-11-06 2001-11-06 Induktiver Mikrosensor, flach hergestellt auf einem Substrat
EP01204214A EP1308969B1 (fr) 2001-11-06 2001-11-06 Micro-capteur inductif formé à plat sur un substrat
US10/259,570 US20030085790A1 (en) 2001-11-06 2002-09-30 Inductive micro-sensor formed flat on an integrated circuit
JP2002313945A JP2003188015A (ja) 2001-11-06 2002-10-29 集積回路上に平形に形成された誘導マイクロセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01204214A EP1308969B1 (fr) 2001-11-06 2001-11-06 Micro-capteur inductif formé à plat sur un substrat

Publications (2)

Publication Number Publication Date
EP1308969A1 EP1308969A1 (fr) 2003-05-07
EP1308969B1 true EP1308969B1 (fr) 2009-04-15

Family

ID=8181186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01204214A Expired - Lifetime EP1308969B1 (fr) 2001-11-06 2001-11-06 Micro-capteur inductif formé à plat sur un substrat

Country Status (4)

Country Link
US (1) US20030085790A1 (sr)
EP (1) EP1308969B1 (sr)
JP (1) JP2003188015A (sr)
DE (1) DE60138388D1 (sr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7187179B1 (en) * 2005-10-19 2007-03-06 International Business Machines Corporation Wiring test structures for determining open and short circuits in semiconductor devices
US7907043B2 (en) * 2005-11-30 2011-03-15 Ryutaro Mori Planar inductor
US7982573B2 (en) * 2006-11-29 2011-07-19 Ryutaro Mori Coil device
JP4904503B2 (ja) * 2006-11-29 2012-03-28 隆太郎 森 コイル装置
JP4968588B2 (ja) * 2006-11-29 2012-07-04 隆太郎 森 コイル装置
CN109801769B (zh) * 2017-11-16 2021-06-11 世界先进积体电路股份有限公司 电感结构
US10600556B2 (en) * 2018-01-04 2020-03-24 Vanguard International Semiconductor Corporation Inductor structure
DE102021122810A1 (de) 2021-09-03 2023-03-09 Turck Holding Gmbh Miniaturisierter, induktiver Näherungssensor und Verfahren zur Detektion eines Erfassungskörpers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3721759A1 (de) * 1987-07-01 1989-01-12 Ceag Licht & Strom Auf einer leiterplatte angebrachter transformator
DE4205084A1 (de) * 1992-02-17 1993-09-02 Karl Harms Handels Gmbh & Co K Vorrichtung zum empfangen elektromagnetischer wellen, insbesondere fuer diebstahlsicherungssysteme
DE19731969A1 (de) * 1997-07-24 1998-08-27 Siemens Ag Verfahren zum Herstellen eines elektrischen Bauteils

Also Published As

Publication number Publication date
DE60138388D1 (de) 2009-05-28
JP2003188015A (ja) 2003-07-04
EP1308969A1 (fr) 2003-05-07
US20030085790A1 (en) 2003-05-08

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