EP1298976A2 - Méthode de fabrication d'un blindage électromagnétique - Google Patents

Méthode de fabrication d'un blindage électromagnétique Download PDF

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Publication number
EP1298976A2
EP1298976A2 EP02021490A EP02021490A EP1298976A2 EP 1298976 A2 EP1298976 A2 EP 1298976A2 EP 02021490 A EP02021490 A EP 02021490A EP 02021490 A EP02021490 A EP 02021490A EP 1298976 A2 EP1298976 A2 EP 1298976A2
Authority
EP
European Patent Office
Prior art keywords
circuit board
cover
adhesive
components
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02021490A
Other languages
German (de)
English (en)
Other versions
EP1298976B1 (fr
EP1298976A3 (fr
Inventor
Nicolai Walkling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1298976A2 publication Critical patent/EP1298976A2/fr
Publication of EP1298976A3 publication Critical patent/EP1298976A3/fr
Application granted granted Critical
Publication of EP1298976B1 publication Critical patent/EP1298976B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet

Definitions

  • the present invention relates to a process for the preparation a shield against electromagnetic radiation for arranged on a printed circuit board components.
  • the object of the present invention is to provide a shield, in which the occurring bumps balanced can be.
  • a flexible becomes electrically conductive compound on the screen cover and / or the printed circuit board applied.
  • the flexible stamp ensures that the flexible shield cover completely to the predetermined contact surfaces on the circuit board and leans fixed by means of the bonding compound conductive on the circuit board becomes.
  • the inventive method can be large bumps balance and also adapts later Changes in evenness.
  • components are shielded on a printed circuit board 1.
  • a conductive cover 2 which is flexible is designed so that he z. B. bend in the longitudinal direction leaves.
  • This cover can be designed differently his, he can z. B. several individual chambers. 6 have with which certain components separately shielded can be.
  • This cover has the outer circumference and between the chambers connecting surfaces on which by means of a tool, in this case a punch 3 a Pressure can be exercised.
  • Connecting surfaces are the surfaces which are located on the screen cover 3 and by means of solder, Glue or the like can be connected to the circuit board 1.
  • This application can be made by means of a dispensing process become.
  • Another way of applying the Glue is that the glue is on a carrier foil located in appropriate places and by means of this Carrier film is applied to the circuit board 1. By the pressing of the carrier film adheres to the circuit board the glue in the appropriate places on the circuit board 1, and after removing the carrier film, he stands for the Connection process available.
  • the adhesive can by means of a Carrier film applied to the connecting surfaces of the lid 2 become.
  • the actual process step consists in that by means of the punch the connecting surfaces, i. the adhesive surfaces the lid with the provided on the circuit board Bonding surfaces, i. Adhesive surfaces by means of the adhesive get connected. It could also solder surfaces or act like that.
  • the edges of the shield cover can be seamless can be pressed onto the circuit board 1 and thus can Even large bumps are compensated.
  • a flexible stamp is a stamp to understand its edges, which exert the pressure on the screen cover 2, can adapt to a curved base.
  • the electrically conductive adhesive or the like is a compound between the two parts is a reliable ensures solid and electrically conductive EMC shielding.
  • Fig. 5 the state is shown in which before contacting of circuit board 1 and cover 2, the circuit board. 1 slightly bent, while the cover 2 is still aligned is.
  • FIG. 6 shows that during the actual connection process the flexible lid 2 of the flexible punch 3 the circuit board 1 is pressed, the stamp in the Able to compensate for bumps.
  • Figure 7 shows the final state in which the flexible Cover 2 has adapted to the bent printed circuit board 1.
  • Figures 6 and 7 show particularly well the deflection of the Printed circuit board, due to the method according to the invention the application of the shield cover is not adversely affected.
  • the embodiment has been described as that for connecting printed circuit board 1 and cover 2, an adhesive is used. It should be noted that the procedure be carried out with adhesives of various kinds can, as long as it is adhesive with an electric Conductivity is. This conductivity can be produced thereby be added to the adhesive conductive particles but it can also be produced by the adhesive has a conductive outer layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP02021490A 2001-09-27 2002-09-25 Méthode de fabrication d'un blindage électromagnétique Expired - Lifetime EP1298976B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10147751 2001-09-27
DE10147751A DE10147751C1 (de) 2001-09-27 2001-09-27 Verfahren zur Herstellung einer Schirmung

Publications (3)

Publication Number Publication Date
EP1298976A2 true EP1298976A2 (fr) 2003-04-02
EP1298976A3 EP1298976A3 (fr) 2004-11-03
EP1298976B1 EP1298976B1 (fr) 2012-05-09

Family

ID=7700541

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02021490A Expired - Lifetime EP1298976B1 (fr) 2001-09-27 2002-09-25 Méthode de fabrication d'un blindage électromagnétique

Country Status (3)

Country Link
EP (1) EP1298976B1 (fr)
AT (1) ATE557579T1 (fr)
DE (1) DE10147751C1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005004158B4 (de) * 2005-01-28 2006-11-30 Siemens Ag Anordnung für die Schirmung von Sockel-Platinen mit einem Schirmblech
DE102005059657A1 (de) * 2005-12-14 2007-06-21 Conti Temic Microelectronic Gmbh Vorrichtung zur Abschirmung einer elekrischen Einheit vor/von EMV-Strahlung
US7515219B2 (en) * 2006-05-17 2009-04-07 Visteon Global Technologies, Inc. Electromagnetic shield for display
DE102011121576A1 (de) * 2011-12-20 2013-07-04 Wabco Gmbh Steuergerät-Modul für ein Fahrzeug

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090728A (en) 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures
US6271465B1 (en) 1999-08-31 2001-08-07 Nokia Mobile Phones Limited Low cost conformal EMI/RFI shield

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2330953B (en) * 1997-11-04 2002-01-09 Nec Technologies Electromagnetic shielding of a PCB
US6624432B1 (en) * 1999-10-12 2003-09-23 Shielding For Electronics, Inc. EMI containment apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090728A (en) 1998-05-01 2000-07-18 3M Innovative Properties Company EMI shielding enclosures
US6271465B1 (en) 1999-08-31 2001-08-07 Nokia Mobile Phones Limited Low cost conformal EMI/RFI shield

Also Published As

Publication number Publication date
EP1298976B1 (fr) 2012-05-09
DE10147751C1 (de) 2002-09-26
EP1298976A3 (fr) 2004-11-03
ATE557579T1 (de) 2012-05-15

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