EP1286833A1 - Method for producing document cards comprising several layers and document cards produced therewith - Google Patents

Method for producing document cards comprising several layers and document cards produced therewith

Info

Publication number
EP1286833A1
EP1286833A1 EP01933825A EP01933825A EP1286833A1 EP 1286833 A1 EP1286833 A1 EP 1286833A1 EP 01933825 A EP01933825 A EP 01933825A EP 01933825 A EP01933825 A EP 01933825A EP 1286833 A1 EP1286833 A1 EP 1286833A1
Authority
EP
European Patent Office
Prior art keywords
card
adhesive system
layers
adhesive
polyisocyanate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01933825A
Other languages
German (de)
French (fr)
Other versions
EP1286833B2 (en
EP1286833B1 (en
Inventor
Ralf Henn
Dirk Fischer
Matthias Schumacher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem Orga En Lohmann GmbH & Co KG GmbH
Original Assignee
Lohmann GmbH and Co KG
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by Lohmann GmbH and Co KG, Orga Kartensysteme GmbH filed Critical Lohmann GmbH and Co KG
Publication of EP1286833A1 publication Critical patent/EP1286833A1/en
Application granted granted Critical
Publication of EP1286833B1 publication Critical patent/EP1286833B1/en
Priority to CY20071101500T priority Critical patent/CY1107019T1/en
Publication of EP1286833B2 publication Critical patent/EP1286833B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/23—Identity cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/46—Associating two or more layers using pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/703—Isocyanates or isothiocyanates transformed in a latent form by physical means
    • C08G18/705—Dispersions of isocyanates or isothiocyanates in a liquid medium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2429/00—Carriers for sound or information
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/24868—Translucent outer layer

Definitions

  • the invention relates to a method for producing multilayer document cards, in particular multilayer identification cards made of plastic, the card having a card core with at least one card core layer, a cover layer on at least one side of the card core and adhesive layers between the individual card layers and the card core printed on one or two sides is, with the method steps of providing the printed layer (s) of the card core, providing the cover layers, applying the adhesive layers to the individual cover and / or core layers, superimposing the individual card layers on top of one another and connecting the card layers in a lamination press under the influence of pressure and Heat, as well as a suitable two-component adhesive system and ID cards made with it.
  • Multi-layer identification cards are widely used as check and bank cards as well as identification documents. These cards are often also provided with a magnetic stripe or an integrated circuit (semiconductor component, chip). Identification cards with a chip are referred to as chip cards or smart cards. Multi-layered ID cards with a chip are used to a large extent as access authorization in GSM mobile radio, where the ID card holder identifies himself as an authorized user by inserting his ID card (GSM card) into the mobile radio terminal.
  • Various materials can be used for the card layers - card core layers as well as cover layers: polyvinyl chloride (PVC), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET, PETG, PETF).
  • Multi-layer ID cards are produced by providing the card core printed on one or both sides in a first step.
  • the card core consists either of a card core layer printed on one or both sides or two card core layers, of which at least one side facing outwards is printed.
  • the card cover layers are then provided. All layers are bonded together in a lamination press.
  • an adhesive coating is generally applied.
  • one of these layers may be coated with adhesive.
  • the adhesive coating can either be carried out on the back of the cover layers or else can be applied to the card core layer which has already been printed.
  • the adhesives currently used are preferably formulations based on polyurethanes, polyesters or polyamides and / or their copolymers.
  • Thermoplastic adhesive formulations are used in particular. Crosslinking of these thermoplastic adhesives through the use of high-energy radiation is known, but requires an additional process step and involves the risk that the plastic, material and / or adhesive materials experience adverse changes for the product. It is particularly important to note the tendency of a number of plastics to change color when using high-energy radiation.
  • the use of covalently crosslinking adhesive systems has so far not become known. But it is precisely covalently crosslinked adhesive formulations that are expected to increase the bond strength and, in particular, improve the temperature and solvent resistance.
  • Increased temperature resistance is particularly desirable, on the one hand, in order to prevent deformation / change of the card under the influence of heat, as can already occur in existing systems when the card behind the windshield of a motor vehicle is exposed to solar radiation.
  • non-destructive delamination of the printed card and cover layers is also to be prevented in a sustainable manner in order to prevent falsification and misuse of such identification cards.
  • the object of the invention is to provide a method and an adhesive system with which a permanent and in particular temperature and solvent-resistant connection of the individual layers of a multilayered document, in particular an identification card, can be achieved.
  • an increase in the bond strength between the cover layer and the printed card core layer is to be achieved compared to previously used formulations, so that a non-destructive delamination of the film composite becomes impossible.
  • the invention further relates to a two-component adhesive system, which can be used in particular for the production of multilayer identification cards made of plastic and consists of a thermoplastic hot melt adhesive component and a separate crosslinking component, the adhesive system being crosslinkable by applying pressure and / or heat.
  • a two-component adhesive system which can be used in particular for the production of multilayer identification cards made of plastic and consists of a thermoplastic hot melt adhesive component and a separate crosslinking component, the adhesive system being crosslinkable by applying pressure and / or heat.
  • the invention is described below with the aid of plastic identification cards. The same applies, however, to all multilayered documents, such as, for example, data carriers, identification documents, value documents and the like, the core being able to be made of plastic or another material.
  • Thermoplastic adhesive systems are preferred in the production of cards for a variety of different applications because they are superior to other products in terms of processability, bond strength and temperature resistance. Nevertheless, these adhesive systems show restrictions that are based essentially on the reversibility of their behavior under the influence of temperature and solvent. These restrictions can be avoided according to the invention.
  • thermoplastic plastics with double bonds are polyamides, in particular polycondensates, which are formed by the reaction of diamines with dimerized fatty acids.
  • polyfunctional amines such as. B. ethylene diamine or polyethylene amines are used, which are reacted with higher dicarboxylic acids, preferably dimerized fatty acids from linoleic acid, oleic acid or tall oil fatty acid.
  • the polycondensation provides the thermoplastic polyamides called polyamide resins.
  • radical initiators / crosslinkers used for this purpose consist of peroxides and act as initiators of the radical polymerization.
  • organic peroxy compounds as so-called radical initiators:
  • Methyl ethyl ketone peroxide ( ⁇ 80 ° C) dibenzoyl peroxide ( ⁇ 100 ° C) di (tert-butyl) peroxide ( ⁇ 150 ° C) cumene hydroperoxide ( ⁇ 180 ° C) tert-butyl peroxybenzoate ( ⁇ 130 ° C) tert-butyl hydroperoxide ( ⁇ 200 ° C).
  • the processing temperature of the hot melt adhesive corresponds to the activation temperature of the radical initiator.
  • the lamination temperature required for the respective hot-melt adhesive can be used simultaneously to activate the radical starter.
  • thermoplastic double bond-containing resins with a softening temperature in this range together with dibenzoyl peroxide, di (tert-butyl) peroxide or tert-butyl peroxibenzoate would be suitable.
  • Adhesive systems consisting of these components are only activated and crosslinked when the lamination temperature is applied; at normal temperature they are stable and can be processed in the usual way.
  • residues R and R ' are, for example:
  • the rest R "stands for further chain building blocks of the polyamide resin.
  • the activation temperature for the peroxide used according to the invention is preferably 60 ° C. or more. It is in particular in the range from 80 to 250 ° C.
  • Hot melt adhesives suitable according to the invention in particular those based on unsaturated polyurethanes, polyesters and polyamides, advantageously have a softening point in the range from 80 to 250 ° C. and have a melt viscosity at 160 ° C. of 50,000 to 110,000 mPa.s in accordance with ASTMD3236.
  • the softening temperature is particularly preferably in the range from 100 to 160.degree.
  • thermoplastic is an unsaturated polyamide
  • condensates of unsaturated dimeric fatty acids with polyamines are preferred.
  • Particularly suitable polyamides are ethylenediamine, diethylenetriamine and alkylenediamines with up to 12 carbon atoms.
  • Particularly preferred are condensates of unsaturated dimerized linoleic acid with one of these polyamines, which satisfy the boundary conditions shown above in terms of softening point and melt viscosity.
  • the adhesive system contains 1 to 10% by weight of peroxide as radical initiator, in particular 2 to 5% by weight, in each case based on the unsaturated thermoplastic adhesive.
  • the adhesive system is generally used in solution to coat the card layers, with toluene and isopropanol, for example, being suitable as solvents. Coating methods and quantity are common and known to the person skilled in the art.
  • the advantage of the method and adhesive system is in particular that the adhesive system contains the thermoplastic curative substance component and the crosslinker component as a mixture which is only activated by the use of elevated temperature.
  • the adhesive system contains a polyisocyanate component and a thermoplastic resin component reactive therewith, containing active hydrogen.
  • the adhesive formulation used uses the reactivity of the isocyanate components to crosslink the adhesive layer.
  • the second resin component has free functional groups with hydrogen atoms reactive towards isocyanate functions, which are available as reaction partners of the isocyanate groups for the polyaddition when the system is activated. In particular, these are hydroxyl groups and amino groups.
  • the two components do not yet react at room temperature or during the processing of the adhesive, but only above a critical temperature that is reached during the lamination of the ID card.
  • the activation and processing temperatures specified for the adhesive system based on unsaturated thermoplastic adhesives and peroxides apply.
  • the polyisocyanate component of the adhesive system contains a polyisocyanate based on hexamethylene diisocyanate (HDI), isophorodiisocyanate (IPDI), tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI) or the like.
  • HDI hexamethylene diisocyanate
  • IPDI isophorodiisocyanate
  • TDI tolylene diisocyanate
  • MDI diphenylmethane diisocyanate
  • aliphatic diisocyanate compounds which have a low tendency to yellowing are particularly preferred.
  • the polyisocyanate can be present as a monomer, but in principle also as a prepolymer, i.e. partially cross-linked with a conventional cross-linking agent.
  • a prepolymer i.e. partially cross-linked with a conventional cross-linking agent.
  • Such polymers are known and in any case contain at least two reactive isocyanate groups per molecule / chain for the continuation of the reaction.
  • Common crosslinkers for prepolymer formation are glycols, polyetherols and polyesterols, but also polyamines.
  • the polyisocyanate component is blocked to prevent the adhesive system from reacting prematurely (even at room temperature). This can be accomplished in two ways.
  • the adhesive system is a stable system of two components at room temperature.
  • the blocking temperature can be varied by selecting the blocking agent.
  • the use of catalysts can lower the deblocking temperature. Examples of possible blocking agents are:
  • Phenol 140 to 180 ° C
  • ⁇ -caprolactam 160 to 180 ° C
  • butanone oxime 135 to 155 ° C
  • malonic acid ester 100 to 130 ° C.
  • the isocyanate also serves as a blocking agent, with the advantage that, when deblocking, no blocking agent is released which could influence the adhesive effect of the adhesive system.
  • the polyisocyanate can also be blocked in a mechanical manner, ie by microencapsulation of the isocyanate component.
  • the adhesive system is in the form of a suspension of two components, ie the microencapsulated isocyanate component in the crosslinker, both of which are not miscible with one another.
  • the encapsulation is only lifted above a critical temperature; the release of the polyisocyanate and the intimate mixing with the crosslinker enables the crosslinking reaction.
  • the encapsulation of the isocyanate component can be achieved in a manner known per se, for example by partial reaction of the isocyanate groups with diamines or polyamines. In the process, prepolymers are formed in the form of polyurea resins, which envelop the remaining polyisocyanate in the form of microscopic particles and isolate them from the environment.
  • microencapsulated isocyanate component is incorporated into the adhesive system, a stable system of two components is obtained which only reacts above about 80 to 100 ° C. after the polyurea has melted or dissolved.
  • Resin components and reactants for the polyisocyanates are all forms of polyols and higher molecular weight and thermoplastic polyamines, for example polyetherols, polyesterols, OH-functional, poly (meth) acrylates and urethanes or NH 2 -functional polyamides.
  • OH-functional resins are particularly suitable, such as, for example, polyacrylate resins with a molecular weight of 2000 to 6000 g / mol with an OH content of 1 to 5% by weight, saturated polyesters with a molecular weight of 500 to 6000 g / Mol and an OH content of 1 to 8 wt .-% and polyether with a molar mass of 500 to 3000 g / mol and an Oh content of 1 to 12 wt .-%.
  • polyacrylate resins with a molecular weight of 2000 to 6000 g / mol with an OH content of 1 to 5% by weight
  • saturated polyesters with a molecular weight of 500 to 6000 g / Mol and an OH content of 1 to 8 wt .-%
  • polyether with a molar mass of 500 to 3000 g / mol and an Oh content of 1 to 12 wt .-%.
  • crosslinking density can be adjusted according to the invention via the proportion of reactive groups so that the thermoplastic character of the adhesive layer is lost, but the required elasticity is retained.
  • the lamination temperature and the activation temperature for the adhesive system are coordinated such that the activation takes place automatically at the lamination temperature. This then leads to the initiation of the crosslinking of the thermoplastic plastic of the adhesive system.
  • the adhesive system can also be processed here in the form of a solution in, for example, tolol, but as a rule the liquid nature of the thermoplastic plastic components can be used to apply the system.
  • the adhesive systems according to the invention can contain customary additives, for example to influence stability and processability or to lower the activation temperature.
  • Silicate is particularly suitable as a filler, since this enables the adhesive system to be thixotropically adjusted, which facilitates application to the card layers.
  • the invention relates to a multilayer identification card made of plastic, which consists of a card core with at least one card core layer, which is printed on one or two sides, which has a cover layer on each side of the card core and adhesive layers between the individual card layers, the identification card according to the above described method or using the adhesive system described above is available.
  • crosslinked adhesive system leads in particular to an increase in the temperature resistance and bond strength of objects bonded to it.
  • Essential for this improved property profile is the conversion of an originally purely thermoplastic reversible adhesive system into a networked structure.
  • adhesive Systems increase security against manipulation, e.g. B. by delamination of individual cover layers in laminated ID cards.
  • the adhesive systems according to the invention can also be used as a lamination for magnetic strips, holograms, signature strips and other applications on cards and ID documents. They can also be used with advantage in terms of higher bond strength, temperature and solvent resistance to protect against manipulation and misuse.
  • the adhesive systems can be used in all technical fields in which permanent crosslinking of the adhesive layer is advantageous.

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  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesive Tapes (AREA)
  • Paper (AREA)

Abstract

The invention relates to a method for producing a multi-layer document card, especially an identity card made of plastic, comprising several layers. Said card comprises a card core with at least one card core layer, a protective layer on at least one side of said card core, and adhesive layers between the individual card layers. The card core is printed on either on one or two sides. The method is carried out in the following manner: The printed layers of the card core are prepared, the protective layers are prepared, the adhesive layers are applied to the individual protective and/or core layers, the individual card layers are precisely positioned one on top of the other, the card layers are joined together in a lamination press with the aid of pressure and heat. An adhesive system which is cross-linked under the effect of pressure and/or heat, comprising a thermoplastic synthetic component and a cross-linking component, is used in at least one adhesive layer.

Description

VERFAHREN ZUR HERSTELLUNG VON MEHRSCHICHTIGEN DOKUMENTENKARTEN UND DANACH HERGESTELLTE DOKUMENTENKARTENMETHOD FOR THE PRODUCTION OF MULTILAYERED DOCUMENT CARDS AND DOCUMENT CARDS PRODUCED THEREFORE
Die Erfindung betrifft ein Verfahren zur Herstellung mehrschichtiger Dokumentenkarten, insbesondere mehrschichtiger Ausweiskarten aus Kunststoff, wobei die Karte einen Kartenkern mit wenigstens einer Karten kernschicht, einer Deckschicht auf wenigstens einer Seite des Kartenkerns und Klebstoffschichten zwischen den einzelnen Kartenschichten aufweist und der Kartenkern ein- oder zweiseitig bedruckt ist, mit den Verfahrensschritten Bereitstellen der bedruckten Schicht(en) des Kartenkerns, Bereitstellen der Deckschichten, Aufbringen der Klebstoffschichten auf die einzelnen Deck- und/oder Kernschichten, positionsgenaues Übereinanderlegen der einzelnen Kartenschichten und Verbinden der Kartenschichten in einer Laminationspresse unter dem Einfluß von Druck und Wärme, sowie ein dafür geeignetes zweikomponentiges Klebstoffsystem und damit hergestellte Ausweiskarten.The invention relates to a method for producing multilayer document cards, in particular multilayer identification cards made of plastic, the card having a card core with at least one card core layer, a cover layer on at least one side of the card core and adhesive layers between the individual card layers and the card core printed on one or two sides is, with the method steps of providing the printed layer (s) of the card core, providing the cover layers, applying the adhesive layers to the individual cover and / or core layers, superimposing the individual card layers on top of one another and connecting the card layers in a lamination press under the influence of pressure and Heat, as well as a suitable two-component adhesive system and ID cards made with it.
Mehrschichtige Ausweiskarten sind als Scheck- und Bankkarten sowie als Ausweisdokumente weit verbreitet. Oftmals werden diese Karten noch mit einem Magnetstreifen oder einem integrierten Schaltkreis (Halbleiterbaustein, Chip) versehen. Ausweiskarten mit Chip werden als Chipkarte oder smart-cards bezeichnet. So werden mehrschichtige Ausweiskarten mit Chip in großem Umfang als Zugangsberechtigung im GSM-Mobilfunk verwendet, wo der Ausweiskarteninhaber sich durch Einstecken seiner Ausweiskarte (GSM-Karte) in Mobilfunkendgerät gegenüber dem Mobilfunknetz als Zugangsberechtigter ausweist. Für die Kartenschichten - Kartenkernschichten wie auch Deckschichten - kommen verschiedene Materialien in Betracht: Polyvinylchlorid (PVC), Poly- carbonat (PC), Acrylnitril-Butadien-Styrol (ABS), Polyethylenterephthalat (PET, PETG, PETF). In Ausweisdokumenten ist die Verwendung von Papierkernschichten üblich. Die Wahl der Materialien und der Kartenaufbau hängen von verschiedenen Faktoren ab. Diese Faktoren sind beispielsweise die gewünschten mechanischen Eigenschaften der herzustellenden Ausweiskarte, das Verhalten bei hohen und niedrigen Temperaturen, die Frage der Bedruckbarkeit, die Frage der Laserbeschriftbarkeit sowie wirtschaftliche und ökologische Vorgaben.Multi-layer identification cards are widely used as check and bank cards as well as identification documents. These cards are often also provided with a magnetic stripe or an integrated circuit (semiconductor component, chip). Identification cards with a chip are referred to as chip cards or smart cards. Multi-layered ID cards with a chip are used to a large extent as access authorization in GSM mobile radio, where the ID card holder identifies himself as an authorized user by inserting his ID card (GSM card) into the mobile radio terminal. Various materials can be used for the card layers - card core layers as well as cover layers: polyvinyl chloride (PVC), polycarbonate (PC), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET, PETG, PETF). The use of paper core layers is common in identification documents. The choice of materials and the map structure depend on various factors. These factors are, for example, the desired mechanical properties of the ID card to be produced, the behavior at high and low temperatures, the question of printability, the question of laser marking and economic and ecological requirements.
Mehrschichtige Ausweiskarten werden hergestellt, in dem in einem ersten Schritt der ein- oder beidseitig bedruckte Kartenkern bereitgestellt wird. Der Kartenkern besteht entweder aus einer ein- oder beidseitig bedruckten Karten- kemschicht oder zwei Kartenkernschichten, von denen wenigstens eine nach außen weisende Seite bedruckt ist. Danach werden die Kartendeckschichten bereitgestellt. Alle Schichten werden in einer Laminationspresse miteinander verbunden.Multi-layer ID cards are produced by providing the card core printed on one or both sides in a first step. The card core consists either of a card core layer printed on one or both sides or two card core layers, of which at least one side facing outwards is printed. The card cover layers are then provided. All layers are bonded together in a lamination press.
Um eine ausreichende Haftung der Schichten aneinander zu erreichen, wird in der Regel eine Klebstoffbeschichtung aufgebracht. Zur Verbindung der Karten- kernschichten wird gegebenenfalls eine dieser Schichten mit Klebstoff beschichtet. Zur Aufbringung der Deckschichten kann die Klebstoffbeschichtung entweder auf der Rückseite der Deckschichten erfolgen oder aber auf die bereits bedruckte Kartenkernschicht aufgebracht werden.In order to achieve sufficient adhesion of the layers to one another, an adhesive coating is generally applied. To connect the card core layers, one of these layers may be coated with adhesive. To apply the cover layers, the adhesive coating can either be carried out on the back of the cover layers or else can be applied to the card core layer which has already been printed.
Bei den derzeitig verwendeten Klebstoffen handelt es sich vorzugsweise um Formulierungen auf Basis von Polyurethanen, Polyestern oder Polyamiden und/oder deren Copolymeren. Insbesondere werden thermoplastische Klebstoffformulierungen eingesetzt. Eine Vernetzung dieser thermoplastischen Klebstoffe durch die Anwendung von energiereicher Strahlung ist bekannt, erfordert aber einen zusätzlichen Verfahrensschritt und birgt die Gefahr, daß die Kunst- Stoff- und/oder Klebstoffmaterialien für das Produkt nachteilige Veränderungen erfahren. Hinzuweisen ist insbesondere auf die Tendenz einer Reihe von Kunststoffen, sich bei der Anwendung energiereicher Strahlung zu verfärben. Der Einsatz covalent vernetzender Klebstoffsysteme ist bislang nicht bekannt geworden. Aber gerade covalent vernetzte Klebstoffformulierungen lassen eine Erhöhung der Verbundfestigkeit und insbesondere eine Verbesserung der Temperatur- und Lösemittelbeständigkeit erwarten.The adhesives currently used are preferably formulations based on polyurethanes, polyesters or polyamides and / or their copolymers. Thermoplastic adhesive formulations are used in particular. Crosslinking of these thermoplastic adhesives through the use of high-energy radiation is known, but requires an additional process step and involves the risk that the plastic, material and / or adhesive materials experience adverse changes for the product. It is particularly important to note the tendency of a number of plastics to change color when using high-energy radiation. The use of covalently crosslinking adhesive systems has so far not become known. But it is precisely covalently crosslinked adhesive formulations that are expected to increase the bond strength and, in particular, improve the temperature and solvent resistance.
Insbesondere erwünscht ist eine erhöhte Temperaturfestigkeit, einerseits, um eine Verformung/Veränderung der Karte unter dem Einfluß von Wärme zu verhindert, wie sie bei bestehenden Systemen bereits auftreten kann, wenn die Karte hinter der Windschutzscheibe eines Kraftfahrzeuges der Sonnenstrahlung ausgesetzt wird. Verhindert werden soll aber auch nachhaltig eine zerstörungs- freie Delamination der bedruckten Karten- und Deckschicht, um eine Verfälschung und den Mißbrauch derartiger Ausweiskarten zu verhindern.Increased temperature resistance is particularly desirable, on the one hand, in order to prevent deformation / change of the card under the influence of heat, as can already occur in existing systems when the card behind the windshield of a motor vehicle is exposed to solar radiation. However, non-destructive delamination of the printed card and cover layers is also to be prevented in a sustainable manner in order to prevent falsification and misuse of such identification cards.
Dementsprechend liegt der Erfindung die Aufgabe zugrunde, ein Verfahren und ein Klebstoffsystem bereitzustellen, mit dem eine dauerhafte und insbesondere temperatur- und lösungsmittelfeste Verbindung der einzelnen Schichten eines mehrschichtigten Dokuments, insbesondere einer Ausweiskarte, erreicht werden kann.Accordingly, the object of the invention is to provide a method and an adhesive system with which a permanent and in particular temperature and solvent-resistant connection of the individual layers of a multilayered document, in particular an identification card, can be achieved.
Erreicht werden sollen unter anderem eine Erhöhung der Verbundfestigkeit zwischen Deckschicht und bedruckter Kartenkemschicht gegenüber bisher eingesetzten Formulierungen, so daß eine zerstörungsfreie Delamination des Folienverbundes unmöglich wird.Among other things, an increase in the bond strength between the cover layer and the printed card core layer is to be achieved compared to previously used formulations, so that a non-destructive delamination of the film composite becomes impossible.
Diese Aufgabe wird mit einem Verfahren der eingangs genannten Art gelöst, bei dem in wenigstens einer Klebstoffschicht ein unter dem Einfluß von Druck- und/oder Wärme vernetzendes Klebstoffsystem mit einer thermoplastischen Kunststoffkomponente und einer Vernetzerkomponente verwandt wird.This object is achieved with a method of the type mentioned in the introduction, in which an adhesive system which crosslinks under the influence of pressure and / or heat with a thermoplastic plastic component and a crosslinking component is used in at least one adhesive layer.
Die Erfindung betrifft ferner ein zweikomponentiges Klebstoffsystem, das insbesondere zur Herstellung von mehrschichtigen Ausweiskarten aus Kunststoff eingesetzt werden kann und aus einer thermoplastischen Schmelzklebstoffkomponente und einer separaten Vernetzerkomponente besteht, wobei das Klebstoffsystem durch Anwendung von Druck und/oder Wärme vernetzbar ist. Im folgenden wird die Erfindung anhand von Ausweiskarten aus Kunststoff beschrieben. Entsprechendes gilt aber für alle mehrschichtigten Dokumente, wie beispielsweise auch Datenträger, Ausweisdokumente, Wertdokumente und dergleichen, wobei der Kern aus Kunststoff oder einem anderen Material bestehen kann.The invention further relates to a two-component adhesive system, which can be used in particular for the production of multilayer identification cards made of plastic and consists of a thermoplastic hot melt adhesive component and a separate crosslinking component, the adhesive system being crosslinkable by applying pressure and / or heat. The invention is described below with the aid of plastic identification cards. The same applies, however, to all multilayered documents, such as, for example, data carriers, identification documents, value documents and the like, the core being able to be made of plastic or another material.
Thermoplastische Klebstoffsysteme sind bevorzugt bei der Herstellung von Karten für eine Vielzahl unterschiedlicher Anwendung, da sie anderen Produkten in Bezug auf Verarbeitbarkeit, Verbundfestigkeit und Temperaturbeständigkeit überlegen sind. Dennoch zeigen diese Klebstoffsysteme Einschränkungen, die im wesentlichen auf der Reversibilität ihres Verhaltens unter Temperatur- und Lösemitteleinfluß beruhen. Diese Einschränkungen können erfindungsgemäß vermieden werden.Thermoplastic adhesive systems are preferred in the production of cards for a variety of different applications because they are superior to other products in terms of processability, bond strength and temperature resistance. Nevertheless, these adhesive systems show restrictions that are based essentially on the reversibility of their behavior under the influence of temperature and solvent. These restrictions can be avoided according to the invention.
Im folgenden werden für das Verfahren und das Klebstoffsystem gemäß der Erfindung relevante Merkmale und Ausführuπgsformen anhand des Klebstoff- Systems beschrieben.Features and embodiments that are relevant for the method and the adhesive system according to the invention are described below with reference to the adhesive system.
Bei dem erfindungsgemäß zum Einsatz kommenden Klebstoffsystem handelt es sich insbesondere um die Kombination eines thermoplastischen Kunststoffes mit Doppelbindungen mit einem Peroxid. Bevorzugte thermoplastische Kunststoffe mit Doppelbindungen sind Polyamide, insbesondere Polykondensate, die durch Reaktion von Diaminen mit dimerisierten Fettsäuren gebildet werden. Als Ausgangsprodukte werden in der Regel polyfunktionelle Amine, wie z. B. Ethylen- diamin oder Polyethylenamine eingesetzt, die mit höheren Dicarbonsäuren, vorzugsweise dimerisierten Fettsäuren aus Linolsäure, Ölsäure oder Tallölfettsäure zur Reaktion gebracht werden. Die Polykondensation liefert die als Polyamid- harze bezeichneten thermoplastischen Polyamide. Neben diesen in ihrer Molekülstruktur mehr oder weniger definiert aufgebauten (Homo) Polyamiden lassen sich durch Variation der Ausgangsprodukte (unterschiedliche Diamine, Amino- carbonsäuren und deren Lactame mit anderen Dicarbonsäuren) und deren Verhältnissen zueinander entsprechende Copolyamide mit spezifischen Eigen- Schaftsprofil aufbauen. Voraussetzung für die erfindungsgemäße Einsatzfähigkeit solcher Polyamidharze ist allerdings, daß in ihrer Molekülstruktur noch eine C=C-Doppelbindung vorhanden ist. Grundsätzlich lassen sich alle thermoplasti- sehen Polyamidharze, die noch über C=C-Doppelbindungen verfügen, erfin- dungsgemäß einsetzen.The adhesive system used according to the invention is in particular the combination of a thermoplastic with double bonds with a peroxide. Preferred thermoplastic plastics with double bonds are polyamides, in particular polycondensates, which are formed by the reaction of diamines with dimerized fatty acids. As a rule, polyfunctional amines, such as. B. ethylene diamine or polyethylene amines are used, which are reacted with higher dicarboxylic acids, preferably dimerized fatty acids from linoleic acid, oleic acid or tall oil fatty acid. The polycondensation provides the thermoplastic polyamides called polyamide resins. In addition to these (homo) polyamides, which are more or less defined in their molecular structure, by varying the starting products (different diamines, aminocarboxylic acids and their lactams with other dicarboxylic acids) and their ratios to one another, corresponding copolyamides with a specific property profile can be built up. A prerequisite for the applicability of such polyamide resins according to the invention is, however, that a C = C double bond is still present in their molecular structure. Basically, all thermoplastic see using polyamide resins that still have C = C double bonds according to the invention.
Erfindungsgemäß werden diese noch vorhandenen Doppelbindungen für die Vernetzung in einer Radikal-Kettenreaktion genutzt. Die hierzu verwendeten Radikalstarter/Vernetzer bestehend aus Peroxiden und wirken als Initiatoren der radikalischen Polymerisation. Entsprechend der Verarbeitungstemperatur eignen sich u.a. die folgenden organischen Peroxiverbindungen als sogenannte Radikalstarter:According to the invention, these double bonds which are still present are used for crosslinking in a radical chain reaction. The radical initiators / crosslinkers used for this purpose consist of peroxides and act as initiators of the radical polymerization. Depending on the processing temperature, the following organic peroxy compounds as so-called radical initiators:
Methylethylketonperoxid (~80°C) Dibenzoylperoxid (~100°C) Di(tert.-Butyl)peroxid (~150°C) Cumolhydroperoxid (~180°C) tert.-Butylperoxibenzoat (~130°C) tert.-Butylhydroperoxid (~200°C).Methyl ethyl ketone peroxide (~ 80 ° C) dibenzoyl peroxide (~ 100 ° C) di (tert-butyl) peroxide (~ 150 ° C) cumene hydroperoxide (~ 180 ° C) tert-butyl peroxybenzoate (~ 130 ° C) tert-butyl hydroperoxide ( ~ 200 ° C).
Es ist besonders vorteilhaft, wenn die Verarbeituπgstemperatur des Schmelzklebers (Erweichungstemperatur bzw. Laminiertemperatur) mit der Aktivierungstemperatur des Radikalstarters korrespondiert. Auf diese Weise kann die für den jeweiligen Schmelzkleber erforderliche Laminiertemperatur gleichzeitig zur Aktivierung des Radikalstarters herangezogen werden. Bei einer typischen Ver- arbeitungstemperatur im Bereich von 130 bis 150°C kämen dementsprechend thermoplastische doppelbindungshaltige Harze mit einer Erweichungstemperatur in diesem Bereich zusammen mit Dibenzoylperoxid, Di(tert.-Butyl)peroxid oder tert-Butylperoxibenzoat in Frage. Aus diesen Komponenten bestehende Klebstoffsysteme werden erst bei Einwirken der Laminierungstemperatur akti- viert und vernetzt; bei Normaltemperatur sind sie stabil und auf übliche Art und Weise verarbeitbar.It is particularly advantageous if the processing temperature of the hot melt adhesive (softening temperature or laminating temperature) corresponds to the activation temperature of the radical initiator. In this way, the lamination temperature required for the respective hot-melt adhesive can be used simultaneously to activate the radical starter. At a typical processing temperature in the range from 130 to 150 ° C., thermoplastic double bond-containing resins with a softening temperature in this range together with dibenzoyl peroxide, di (tert-butyl) peroxide or tert-butyl peroxibenzoate would be suitable. Adhesive systems consisting of these components are only activated and crosslinked when the lamination temperature is applied; at normal temperature they are stable and can be processed in the usual way.
Das Reaktionsschema für eine C-C-Verknüpfung eines thermoplastischen Harzes mit Dibenzoylperoxid als Radikalstarter ist nachstehend wiedergegeben. (1 ) Radikalbildung durch thermische SpaltungThe reaction scheme for a CC linkage of a thermoplastic resin with dibenzoyl peroxide as a radical initiator is shown below. (1) Radical formation through thermal fission
(2) Kettenstart(2) chain start
Je nachdem welche Monomere dem Polykondensat zugrunde liegen, handelt es sich bei den Resten R bzw. R' zum Beispiel um:Depending on which monomers the polycondensate is based on, the residues R and R 'are, for example:
• -(CH2)„-CONH-R" , n=2-9,• - (CH 2 ) "- CONH-R", n = 2-9,
• Rest einer dimerisierten Linolsäure:• Remainder of a dimerized linoleic acid:
Hierbei steht der Rest R" für weitere Kettenbausteine des Polyamidharzes.The rest R "stands for further chain building blocks of the polyamide resin.
(3) Ketten Wachstum(3) chain growth
(4) Kettenabbruch(4) chain termination
Vorzugsweise beträgt die Aktivierungstemperatur für das erfindungsgemäß zum Einsatz kommende Peroxid 60°C oder mehr. Sie liegt insbesondere im Bereich von 80 bis 250°C. The activation temperature for the peroxide used according to the invention is preferably 60 ° C. or more. It is in particular in the range from 80 to 250 ° C.
Erfindungsgemäß geeignete Schmelzklebstoffe, insbesondere solche auf Basis von ungesättigten Polyurethanen, Polyestern und Polyamiden, haben zweckmäßigerweise eine Erweichungspunkt im Bereich von 80 bis 250°C und verfügen über eine Schmelzviskosität bei 160°C von 50.000 bis 110.000 mPa.s gemäß ASTMD3236. Besonders bevorzugt liegt die Erweichungstemperatur im Bereich von 100 bis 160°C.Hot melt adhesives suitable according to the invention, in particular those based on unsaturated polyurethanes, polyesters and polyamides, advantageously have a softening point in the range from 80 to 250 ° C. and have a melt viscosity at 160 ° C. of 50,000 to 110,000 mPa.s in accordance with ASTMD3236. The softening temperature is particularly preferably in the range from 100 to 160.degree.
Sofern es sich bei thermoplastischen Kunststoff um ein ungesättigtes Polyamid handelt, sind Kondensate aus ungesättigten dimeren Fettsäuren mit Polyaminen bevorzugt. Als Polyamide kommen insbesondere Ethylendiamin, Diethylentria- min und Alkylendiamine mit bis zu 12 C-Atomen in Frage. Besonders bevorzugt sind Kondensate von ungesättigter dimerisierter Linolsäure mit einem dieser Polyamine, die den vorstehend aufgezeigten Randbedingungen in bezug auf Erweichungspunkt und Schmelzviskosität genügen.If thermoplastic is an unsaturated polyamide, condensates of unsaturated dimeric fatty acids with polyamines are preferred. Particularly suitable polyamides are ethylenediamine, diethylenetriamine and alkylenediamines with up to 12 carbon atoms. Particularly preferred are condensates of unsaturated dimerized linoleic acid with one of these polyamines, which satisfy the boundary conditions shown above in terms of softening point and melt viscosity.
In der Regel enthält das Klebstoffsystem 1 bis 10 Gew.-% Peroxid als Radikalstarter, insbesondere 2 bis 5 Gew.-%, jeweils bezogen auf den ungesättigten thermoplastischen Klebstoff. Zur Beschichtung der Kartenschichten wird das Klebstoffsystem in der Regel in Lösung eingesetzt, wobei als Lösungsmittel beispielsweise Toluol und Isopropanol in Frage kommen. Beschichtungsverfahren und Menge sind üblich und dem Fachmann bekannt.As a rule, the adhesive system contains 1 to 10% by weight of peroxide as radical initiator, in particular 2 to 5% by weight, in each case based on the unsaturated thermoplastic adhesive. The adhesive system is generally used in solution to coat the card layers, with toluene and isopropanol, for example, being suitable as solvents. Coating methods and quantity are common and known to the person skilled in the art.
Der Vorzug des Verfahrens und Klebstoffsystems liegt insbesondere auch darin, daß das Klebstoffsystem die thermoplastische Kuriststoffkomponente und die Vernetzerkomponente als Gemisch enthält, das erst durch die Anwendung erhöhter Temperatur aktiviert wird.The advantage of the method and adhesive system is in particular that the adhesive system contains the thermoplastic curative substance component and the crosslinker component as a mixture which is only activated by the use of elevated temperature.
Gemäß einer anderen bevorzugten Ausführungsform der Erfindung enthält das Klebstoffsystem nebeneinander eine Polyisocyanatkomponente und eine damit reaktive, aktiven Wasserstoff enthaltende thermoplastische Harzkomponente. In dieser Variante der Erfindung nutzt die eingesetzte Klebstoffformulierung die Reaktivität der Isocyanatkomponeπte zur Vernetzung der Klebstoffschicht. Die zweite Harzkomponente besitzt freie funktioneile Gruppen mit gegenüber Iso- cyanatfunktionen reaktiven Wasserstoffatomen, die bei Aktivierung des Systems als Reaktionspartner der Isocyanatgruppen für die Polyaddition zur Verfügung stehen. Insbesondere sind dies Hydroxylgruppen und Aminogruppen. Die zwei Komponenten reagieren allerdings noch nicht bei Raumtemperatur oder während der Verarbeitung des Klebstoffes, sondern erst oberhalb einer kritischen Temperatur, die während der Lamination der Ausweiskarte erreicht wird. Dabei gelten die für das Klebstoffsystem auf Basis ungesättigter thermoplastischer Klebstoffe und Peroxide genannten Aktivierungs- und Verarbeitungstemperaturen.According to another preferred embodiment of the invention, the adhesive system contains a polyisocyanate component and a thermoplastic resin component reactive therewith, containing active hydrogen. In this variant of the invention, the adhesive formulation used uses the reactivity of the isocyanate components to crosslink the adhesive layer. The second resin component has free functional groups with hydrogen atoms reactive towards isocyanate functions, which are available as reaction partners of the isocyanate groups for the polyaddition when the system is activated. In particular, these are hydroxyl groups and amino groups. However, the two components do not yet react at room temperature or during the processing of the adhesive, but only above a critical temperature that is reached during the lamination of the ID card. The activation and processing temperatures specified for the adhesive system based on unsaturated thermoplastic adhesives and peroxides apply.
Die Polyisocyanatkomponente des Klebstoffsystems enthält dabei ein Poly- isocyaπat auf Basis von Hexamethylendiisocyanat (HDI), Isophoroπdiisocyanat (IPDI), Toluylendiisocyanat (TDI), Diphenylmethandiisocyanat (MDI) oder dergleichen. Dabei sind zur Erzielung einer guten optischen Qualität und Elastizität der Klebstoffverbindung insbesondere aliphatische Diisocyanatverbindungen bevorzugt, die eine geringe Tendenz zum Vergilben zeigen.The polyisocyanate component of the adhesive system contains a polyisocyanate based on hexamethylene diisocyanate (HDI), isophorodiisocyanate (IPDI), tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI) or the like. In order to achieve good optical quality and elasticity of the adhesive compound, aliphatic diisocyanate compounds which have a low tendency to yellowing are particularly preferred.
Das Polyisocyanat kann als Monomer vorliegen, grundsätzlich aber auch als Prepolymer, d.h. teilvernetzt mit einem üblichen Vernetzungsmittel. Solche Polymere sind bekannt und enthalten in jedem Fall für die Weiterführung der Reaktion wenigstens zwei reaktive Isocyanatgruppen pro Molekül/Kette. Übliche Vernetzer für die Prepolymerbildung sind Glykole, Polyetherole und Polyesterole, aber auch Polyamine.The polyisocyanate can be present as a monomer, but in principle also as a prepolymer, i.e. partially cross-linked with a conventional cross-linking agent. Such polymers are known and in any case contain at least two reactive isocyanate groups per molecule / chain for the continuation of the reaction. Common crosslinkers for prepolymer formation are glycols, polyetherols and polyesterols, but also polyamines.
Um eine vorzeitige Reaktion des Klebstoffsystems (bereits bei Raumtemperatur) zu verhindern, ist die Polyisocyanatkomponente blockiert. Dies kann auf zwei Wegen erreicht werden.The polyisocyanate component is blocked to prevent the adhesive system from reacting prematurely (even at room temperature). This can be accomplished in two ways.
Bei der chemischen Blockierung oder Verkappung werden die eingesetzten NCO-Gruppen mit üblichen Blockierungsmittel zur Reaktion gebracht, die ober- halb einer Deblockierungstemperatur wieder abgespalten werden. Mit einem Blockierungsmittel HBL läuft die Reaktion wie folgt ab: BlockierungIn the case of chemical blocking or capping, the NCO groups used are reacted with customary blocking agents which are split off again above a deblocking temperature. With an HBL blocking agent, the reaction proceeds as follows: blocking
R — N = C=0 H— BL ■.= R — N — C=0R - N = C = 0 H - BL ■. = R - N - C = 0
Deblockieruπg ^ Q ^ Isocyanat T = 100- 1 80°CDeblocking ^ Q ^ isocyanate T = 100-1 80 ° C.
Auch hier stellt das Klebstoffsystem bei Raumtemperatur ein stabiles System zweier Komponenten dar. Durch die Wahl des Blockierungsmittels kann die Blockierungstemperatur variiert werden. Zudem läßt sich durch den Einsatz von Katalysatoren die Deblockierungstemperatur senken. Als Blockierungsmittel kommen beispielsweise in Frage:Here too, the adhesive system is a stable system of two components at room temperature. The blocking temperature can be varied by selecting the blocking agent. In addition, the use of catalysts can lower the deblocking temperature. Examples of possible blocking agents are:
Phenol (140 bis 180°C) ε-Caprolactam (160 bis 180°C) Butanonoxim (135 bis 155°C) Malonsäureester (100 bis 130°C).Phenol (140 to 180 ° C) ε-caprolactam (160 to 180 ° C) butanone oxime (135 to 155 ° C) malonic acid ester (100 to 130 ° C).
Eine besondere Möglichkeit der Blockierung stellt die Dimerisierung von Isocyanatgruppen zu Urethdion dar, die katalytisch nach folgendem Schema abläuft. oA special possibility of blocking is the dimerization of isocyanate groups to urethdione, which proceeds catalytically according to the following scheme. O
II R— N"=C=0 Kat CII R - N " = C = 0 Kat C
R— N— RR - N - R
0=C= N— R T > 130 - I 60°C C II Isocyanat 0 Urethdion0 = C = N - R T> 130 - I 60 ° C C II isocyanate 0 urethdione
Bei dieser "inneren" Blockierung dient das Isocyanat zugleich als Blockierungsmittel mit dem Vorteil, daß bei der Deblockierung kein Blockierungsmittel frei wird, das die Klebewirkung des Klebstoffsystems beeinflussen könnte.With this "internal" blocking, the isocyanate also serves as a blocking agent, with the advantage that, when deblocking, no blocking agent is released which could influence the adhesive effect of the adhesive system.
Die Blockierung des Polyisocyanats kann auch auf mechanische Art und Weise erfolgen, d. h. durch Mikroverkapselung der Isocyanatkomponente. In jedem Fall liegt das Klebstoffsystem als Suspension zweier Komponenten vor, d. h. der mikroverkapselten Isocyanatkomponente in dem Vernetzer, die beide nicht miteinander mischbar ist. Erst oberhalb einer kritischen Temperatur wird die Ver- kapselung aufgehoben; die Freisetzung des Polyisocyanats und die innige Ver- mischung mit dem Vernetzer ermöglicht die Vernetzungsreaktion. Die Verkapselung der Isocyanatkomponente kann auf an und für sich bekannte Art und Weise erreicht werden, beispielsweise durch Teilreaktion der Isocyanatgruppen mit Diaminen oder Polyaminen. Dabei bilden sich Prepolymere in Form von Polyharnstoffharzen, welche verbleibendes Polyisocyanat in Form mikro- skopischer Teilchen umhüllen und von der Umgebung isolieren.The polyisocyanate can also be blocked in a mechanical manner, ie by microencapsulation of the isocyanate component. In any case, the adhesive system is in the form of a suspension of two components, ie the microencapsulated isocyanate component in the crosslinker, both of which are not miscible with one another. The encapsulation is only lifted above a critical temperature; the release of the polyisocyanate and the intimate mixing with the crosslinker enables the crosslinking reaction. The encapsulation of the isocyanate component can be achieved in a manner known per se, for example by partial reaction of the isocyanate groups with diamines or polyamines. In the process, prepolymers are formed in the form of polyurea resins, which envelop the remaining polyisocyanate in the form of microscopic particles and isolate them from the environment.
Wird die mikroverkapselte Isocyanatkomponente in das Klebstoffsystem eingearbeitet, erhält man ein stabiles System zweier Komponenten, welches erst oberhalb von etwa 80 bis 100°C nach Abschmelzen bzw. Auflösen des Poly- harnstoffs reagiert.If the microencapsulated isocyanate component is incorporated into the adhesive system, a stable system of two components is obtained which only reacts above about 80 to 100 ° C. after the polyurea has melted or dissolved.
Als Harzkomponente und Reaktionspartner für die Polyisocyanate kommen alle Formen von Polyolen und höhermolekularen und thermoplastischen Polyaminen in Frage, beispielsweise Polyetherole, Polyesterole, OH-funktionelle, Poly(meth)acrylate und -urethane oder NH2-funktionelle Polyamide. Insbesondere geeignet sind eine Reihe von OH-funktionellen Harzen, wie beispiels- weise Polyacrylatharze mit einer Molmasse von 2000 bis 6000 g/Mol mit einem OH-Gehalt von 1 bis 5 Gew.-%, gesättigte Polyester mit einer Molmasse von 500 bis 6000 g/Mol und einem OH-Gehalt von 1 bis 8 Gew.-% und Polyether mit einer Molmasse von 500 bis 3000 g/Mol und einem Oh-Gehalt von 1 bis 12 Gew.-%.Resin components and reactants for the polyisocyanates are all forms of polyols and higher molecular weight and thermoplastic polyamines, for example polyetherols, polyesterols, OH-functional, poly (meth) acrylates and urethanes or NH 2 -functional polyamides. A number of OH-functional resins are particularly suitable, such as, for example, polyacrylate resins with a molecular weight of 2000 to 6000 g / mol with an OH content of 1 to 5% by weight, saturated polyesters with a molecular weight of 500 to 6000 g / Mol and an OH content of 1 to 8 wt .-% and polyether with a molar mass of 500 to 3000 g / mol and an Oh content of 1 to 12 wt .-%.
Das Reaktionsschema sieht dabei wie folgt aus:The reaction scheme looks like this:
(1 ) Isocyanat + Hydroxylgruppe: — =C=0 O II(1) Isocyanate + hydroxyl group: - = C = 0 O II
R- NH-C— O— R'R- NH-C- O- R '
H— O— R'H— O— R '
Isocyanat UrethanIsocyanate urethane
Hydroxylgruppehydroxyl
(1 ) Isocyanat + Amtngruppe:(1) Isocyanate + Amtngruppe:
R-N=C=0 OR-N = C = 0 O
IIII
.N-R' R- NH-C- NH-R' v.N-R 'R- NH-C- NH-R' v
Isocyanat HarπstoffTiarzIsocyanate urine Tiarz
Amingruppe Die Vernetzungsdichte kann dabei erfindungsgemäß über den Anteil der reaktiven Gruppen so eingestellt werden, daß der thermoplastische Charakter der Klebstoffschicht verloren geht, die erforderliche Elastizität aber erhalten bleibt.amine group The crosslinking density can be adjusted according to the invention via the proportion of reactive groups so that the thermoplastic character of the adhesive layer is lost, but the required elasticity is retained.
Auch bei dieser Ausführungsform des erfindungsgemäßen Verfahrens bzw. Klebstoffsystems sind Laminierungstemperatur und Aktivierungstemperatur für das Klebstoffsystem aufeinander abgestimmt dergestalt, daß die Aktivierung bei der Laminierungstemperatur automatisch erfolgt. Dies führt dann zur Einleitung der Vernetzung des thermoplastischen Kunststoffs des Klebstoffsystems.In this embodiment of the method or adhesive system according to the invention, the lamination temperature and the activation temperature for the adhesive system are coordinated such that the activation takes place automatically at the lamination temperature. This then leads to the initiation of the crosslinking of the thermoplastic plastic of the adhesive system.
Wie zuvor kann auch hier das Klebstoffsystem in Form einer Lösung in bei- spielsweise Tolol verarbeitet werden, wobei aber in der Regel die flüssige Natur der thermoplastischen Kunststoffkomponenten ausgenutzt werden kann, um das System zu applizieren.As before, the adhesive system can also be processed here in the form of a solution in, for example, tolol, but as a rule the liquid nature of the thermoplastic plastic components can be used to apply the system.
Die erfindungsgemäßen Klebstoffsysteme können übliche Zusätze enthalten, um beispielsweise Stabilität und Verarbeitbarkeit zu beeinflussen oder die Akti- vierungstemperatur herabzusetzen. Als Füllstoff kommt insbesondere Silikat in Frage, da hierdurch eine thixotrope Einstellung des Klebstoffsystems erreicht werden kann, was die Applikation auf die Kartenschichten erleichtert.The adhesive systems according to the invention can contain customary additives, for example to influence stability and processability or to lower the activation temperature. Silicate is particularly suitable as a filler, since this enables the adhesive system to be thixotropically adjusted, which facilitates application to the card layers.
Die Erfindung betrifft schließlich eine mehrschichtige Ausweiskarte aus Kunststoff, welche aus einem Kartenkern mit wenigstens einer Kartenkernschicht, die ein- oder zweiseitig bedruckt ist, die je einer Deckschicht auf jeder Seite des Kartenkerns sowie Klebstoffschichten zwischen den einzelnen Kartenschichten besteht, wobei die Ausweisekarte nach dem vorstehend beschriebenen Verfahren oder unter Verwendung des vorstehend beschriebenen Klebstoffsystems erhältlich ist.Finally, the invention relates to a multilayer identification card made of plastic, which consists of a card core with at least one card core layer, which is printed on one or two sides, which has a cover layer on each side of the card core and adhesive layers between the individual card layers, the identification card according to the above described method or using the adhesive system described above is available.
Die Verwendung des vernetzten Klebstoffsystems gemäß der Erfindung führt insbesondere zu einer Erhöhung der Temperaturbeständigkeit und Verbundfestigkeit damit verklebter Gegenstände. Wesentlich für dieses verbesserte Eigenschaftsprofil ist die Überführung eines ursprünglich rein thermoplastischen reversiblen Klebstoffsystems in eine vernetzte Struktur. Derartige Klebstoff- Systeme erhöhen die Sicherheit vor Manipulationen z. B. durch Delamination einzelner Deckschichten in laminierten Ausweiskarten.The use of the crosslinked adhesive system according to the invention leads in particular to an increase in the temperature resistance and bond strength of objects bonded to it. Essential for this improved property profile is the conversion of an originally purely thermoplastic reversible adhesive system into a networked structure. Such adhesive Systems increase security against manipulation, e.g. B. by delamination of individual cover layers in laminated ID cards.
Die erfindungsgemäßen Klebstoffsysteme können ferner als Kaschierung für Magnetstreifen, Hologramme, Unterschriftsstreifen und andere Applikationen auf Karten und Ausweisdokumenten eingesetzt werden. Sie sind auch hier unter dem Aspekt höherer Verbundfestigkeit, Temperatur- und Lösemittelbeständigkeit zum Schutz vor Manipulationen und Mißbrauch mit Vorteil einsetzbar.The adhesive systems according to the invention can also be used as a lamination for magnetic strips, holograms, signature strips and other applications on cards and ID documents. They can also be used with advantage in terms of higher bond strength, temperature and solvent resistance to protect against manipulation and misuse.
Im übrigen können die Klebstoffsysteme auf allen technischen Gebieten, bei denen eine dauerhafte Vernetzung der Klebstoffschicht vorteilhaft ist, eingesetzt werden.Otherwise, the adhesive systems can be used in all technical fields in which permanent crosslinking of the adhesive layer is advantageous.
- Patentansprüche - - claims -

Claims

Patentansprüche claims
1. Verfahren zur Herstellung mehrschichtiger Dokumentenkarten, insbesondere einer mehrschichtigen Ausweiskarte aus Kunststoff, wobei die s Karte einen Kartenkern mit wenigstens einer Kartenkernschicht, einer Deckschicht auf jeder Seite des Kartenkerns und Klebstoffschichten zwischen den einzelnen Kartenschichten aufweist und der Kartenkern ein- oder zweiseitig bedruckt ist, mit den folgenden Verfahrensschritten:1. A method for producing multilayer document cards, in particular a multilayer identification card made of plastic, the s card having a card core with at least one card core layer, a cover layer on each side of the card core and adhesive layers between the individual card layers and the card core being printed on one or two sides, with the following process steps:
Bereitstellen der bedruckten Schicht(en) des Kartenkerns, 0 - Bereitstellen der Deckschichten,Provision of the printed layer (s) of the card core, 0 - provision of the cover layers,
Aufbringen der Klebstoffschichten auf die einzelnen Deck- und/oder Kernschichten, positionsgenaues Übereinanderlegen der einzelnen Kartenschichten, Verbinden der Kartenschichten in einer Laminationspresse unter dem Einfluß von Druck und Wärme,Applying the adhesive layers to the individual cover and / or core layers, superimposing the individual card layers on top of one another, connecting the card layers in a lamination press under the influence of pressure and heat,
d a d u r c h g e k e n n z e i c h n e t, daß in wenigstens einer Klebstoffschicht ein unter dem Einfluß von Druck und/oder Wärme vernetzendes Klebstoffsystem mit einer thermoplastischen Kunststoffkomponente und einer Vernetzerkomponente verwandt wird.That is, that in at least one layer of adhesive, an adhesive system that crosslinks under the influence of pressure and / or heat is used with a thermoplastic plastic component and a crosslinking component.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, daß das2. The method according to claim 1, characterized in that the
Klebstoffsystem einen thermoplastischen Kunststoff mit Doppelbindungen und ein Peroxid enthält. Adhesive system contains a thermoplastic with double bonds and a peroxide.
3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß das Peroxid eine Aktivierungstemperatur von 60°C oder mehr aufweist.3. The method according to claim 2, characterized in that the peroxide has an activation temperature of 60 ° C or more.
4. Verfahren nach Anspruch 2 oder 3, dadurch gekennzeichnet, daß das Peroxid eine Aktivierungstemperatur von 80 bis 250°C aufweist.4. The method according to claim 2 or 3, characterized in that the peroxide has an activation temperature of 80 to 250 ° C.
5. Verfahren nach einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, daß der thermoplastische Kunststoff ein ungesättigtes Polyamid ist.5. The method according to any one of claims 2 to 4, characterized in that the thermoplastic is an unsaturated polyamide.
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß das ungesättigte Polyamid ein Kondensat aus Polyaminen und ungesättigten dimeren Fettsäuren ist.6. The method according to claim 5, characterized in that the unsaturated polyamide is a condensate of polyamines and unsaturated dimeric fatty acids.
7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß die ungesättigte dimere Fettsäure dimerisierte Linolsäure ist.7. The method according to claim 6, characterized in that the unsaturated dimeric fatty acid is dimerized linoleic acid.
8. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, daß der Klebstoffsystem nebeneinander eine Polyisocyanatkomponente und eine damit reaktive, aktiven Wasserstoff enthaltende Kunststoffkomponente enthält.8. The method according to claim 1, characterized in that the adhesive system contains a polyisocyanate component and a reactive, active hydrogen-containing plastic component next to each other.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß das9. The method according to claim 8, characterized in that the
Polyisocyanat eines auf Basis von HDI, IPDI, TDI oder MDI ist.Polyisocyanate is one based on HDI, IPDI, TDI or MDI.
10. Verfahren nach Anspruch 8 oder 9, dadurch gekennzeichnet, daß das Polyisocyanat mit einem Polyamin teilvernetzt vorliegt.10. The method according to claim 8 or 9, characterized in that the polyisocyanate is partially crosslinked with a polyamine.
11. Verfahren nach wenigstens einem der Anspruch 8 bis 10, dadurch gekennzeichnet, daß die Isocyanatgruppen des Polyisocyanats blockiert sind.11. The method according to at least one of claims 8 to 10, characterized in that the isocyanate groups of the polyisocyanate are blocked.
12. Verfahren nach Anspruch 11 , dadurch gekennzeichnet, daß das Polyisocyanat bei 60°C oder mehr deblockiert. 12. The method according to claim 11, characterized in that the polyisocyanate deblocks at 60 ° C or more.
13. Verfahren nach Anspruch 11 oder 12, dadurch gekennzeichnet, daß das Polyisocyanat bei einer Temperatur im Bereich von 80 bis 250°C deblockiert.13. The method according to claim 11 or 12, characterized in that the polyisocyanate deblocks at a temperature in the range of 80 to 250 ° C.
14. Verfahren nach einem der Ansprüche 11 bis 13, dadurch gekenn- zeichnet, daß das Polyisocyanat mit Phenol, E-Caprolactam, Butanonoxim oder14. The method according to any one of claims 11 to 13, characterized in that the polyisocyanate with phenol, E-caprolactam, butanone oxime or
Malonsäureester blockiert ist.Malonic ester is blocked.
15. Verfahren nach einem der Ansprüche 11 bis 13, dadurch gekennzeichnet, daß das Polyisocyanat durch Dimerisierung zu Urethdion blockiert ist.15. The method according to any one of claims 11 to 13, characterized in that the polyisocyanate is blocked by dimerization to urethdione.
16. Verfahren nach einem der Ansprüche 11 bis 13, dadurch gekenn- zeichnet, daß das Polyisocyanat durch Mikroverkapselung mechanisch blockiert ist.16. The method according to any one of claims 11 to 13, characterized in that the polyisocyanate is mechanically blocked by microencapsulation.
17. Verfahren nach einem der Ansprüche 8 bis 16, dadurch gekennzeichnet, daß die Kunststoffkomponente ein Polyesterpolyol, Polyetherpolyol, OH-funktionelles Polyacrylatharz oder Polyamin ist.17. The method according to any one of claims 8 to 16, characterized in that the plastic component is a polyester polyol, polyether polyol, OH-functional polyacrylate resin or polyamine.
18. Zweikomponentiges Klebstoffsystem, insbesondere zur Herstellung von mehrschichtigen Dokumenten, insbesondere Ausweiskarten aus Kunststoff, bestehend aus einer thermoplastischen18. Two-component adhesive system, in particular for the production of multilayer documents, in particular identification cards made of plastic, consisting of a thermoplastic
Schmelzklebstoffkomponente und einer separaten Vernetzerkomponente, dadurch gekennzeichnet, daß das Klebstoffsystem durch Anwendung von Druck und Wärme vernetzbar ist.Hot melt adhesive component and a separate crosslinking component, characterized in that the adhesive system can be crosslinked by applying pressure and heat.
19. Klebstoffsystem nach Anspruch 18, dadurch gekennzeichnet, daß das Klebstoffsystem einen thermoplastischen Kunststoff mit Doppelbindungen und ein Peroxid enthält.19. Adhesive system according to claim 18, characterized in that the adhesive system contains a thermoplastic with double bonds and a peroxide.
20. Klebstoffsystem nach Anspruch 19, dadurch gekennzeichnet, daß das Peroxid eine Aktivierungstemperatur von 60°C oder mehr aufweist. 20. Adhesive system according to claim 19, characterized in that the peroxide has an activation temperature of 60 ° C or more.
21. Klebstoffsystem nach Anspruch 19 oder 20, dadurch gekennzeichnet, daß das Peroxid eine Aktivierungstemperatur von 80 bis 250°C aufweist.21. Adhesive system according to claim 19 or 20, characterized in that the peroxide has an activation temperature of 80 to 250 ° C.
22. Klebstoffsystem nach einem der Ansprüche 19 bis 21 , dadurch gekennzeichnet, daß der thermoplastische Kunststoff ein ungesättigtes Polyamid s ist.22. Adhesive system according to one of claims 19 to 21, characterized in that the thermoplastic is an unsaturated polyamide s.
23. Klebstoffsystem nach Anspruch 22, dadurch gekennzeichnet, daß das ungesättigte Polyamid ein Kondensat aus Polyaminen und ungesättigten dimeren Fettsäuren ist.23. Adhesive system according to claim 22, characterized in that the unsaturated polyamide is a condensate of polyamines and unsaturated dimeric fatty acids.
24. Klebstoffsystem nach Anspruch 6, dadurch gekennzeichnet, daß 0 die ungesättigte dimere Fettsäure dimerisierte Linolsäure ist.24. Adhesive system according to claim 6, characterized in that 0 is the unsaturated dimeric fatty acid dimerized linoleic acid.
25. Klebstoffsystem nach Anspruch 18, dadurch gekennzeichnet, daß das Klebstoffsystem nebeneinander eine Polyisocyanatkomponente und eine damit reaktive, aktiven Wasserstoff enthaltende Vernetzerkomponente enthält.25. Adhesive system according to claim 18, characterized in that the adhesive system contains a polyisocyanate component and a crosslinker component containing reactive, active hydrogen therewith.
26. Klebstoffsystem nach Anspruch 25, dadurch gekennzeichnet, daß das Polyisocyanat eines auf Basis von HDI, IPDI, TDI oder MDI ist.26. Adhesive system according to claim 25, characterized in that the polyisocyanate is one based on HDI, IPDI, TDI or MDI.
27. Klebstoffsystem nach Anspruch 25 oder 26, dadurch gekennzeichnet, daß der Polyisocyanat teilvernetzt mit einem Polyamin vorliegt.27. Adhesive system according to claim 25 or 26, characterized in that the polyisocyanate is partially crosslinked with a polyamine.
28. Klebstoffsystem nach wenigstens einem der Anspruch 25 bis 27, dadurch gekennzeichnet, daß die Isocyanatgruppen des Polyisocyanats blockiert sind.28. Adhesive system according to at least one of claims 25 to 27, characterized in that the isocyanate groups of the polyisocyanate are blocked.
29. Klebstoffsystem nach Anspruch 28, gekennzeichnet durch eine Deblockierungstemperatur des Polyisocyanats von 60°C oder mehr.29. Adhesive system according to claim 28, characterized by a deblocking temperature of the polyisocyanate of 60 ° C or more.
30. Klebstoffsystem nach Anspruch 28 oder 29, gekennzeichnet durch eine Deblockierungstemperatur im Bereich von 80 bis 250°C. 30. Adhesive system according to claim 28 or 29, characterized by a deblocking temperature in the range from 80 to 250 ° C.
31. Klebstoffsystem nach einem der Ansprüche 28 bis 30, dadurch gekennzeichnet, daß das Polyisocyanat mit Phenol, E-Caprolactam, Butanonoxim oder Maloπsäureester blockiert ist.31. Adhesive system according to one of claims 28 to 30, characterized in that the polyisocyanate is blocked with phenol, E-caprolactam, butanone oxime or maloic acid ester.
32. Klebstoffsystem nach einem der Ansprüche 28 bis 30, dadurch ge- kennzeichnet, daß das Polyisocyanat durch Dimerisierung zu Urethdion blockiert ist.32. Adhesive system according to one of claims 28 to 30, characterized in that the polyisocyanate is blocked by dimerization to urethdione.
33. Klebstoffsystem nach einem der Ansprüche 28 bis 30, dadurch gekennzeichnet, daß das Polyisocyanat durch Mikroverkapselung mechanisch blockiert ist.33. Adhesive system according to one of claims 28 to 30, characterized in that the polyisocyanate is mechanically blocked by microencapsulation.
34. Klebstoffsystem nach einem der Ansprüche 25 bis 33, dadurch gekennzeichnet, daß die Kunststoffkomponente ein Polyesterpolyol, Polyether- polyol, OH-funktionelles Polyacrylatharz oder Polyamin ist.34. Adhesive system according to one of claims 25 to 33, characterized in that the plastic component is a polyester polyol, polyether polyol, OH-functional polyacrylate resin or polyamine.
35. Mehrschichtige Dokumentenkarte, insbesondere Ausweiskarte aus Kunststoff, bestehend aus einem Kartenkern mit wenigstens einer Kartenkernschicht, wobei der Kartenkern ein- oder zweiseitig bedruckt ist, einer Deckschicht auf wenigstens einer Seite des Kartenkerns sowie Klebstoffschichten zwischen den einzelnen Kartenschichten, dadurch gekennzeichnet, daß die Ausweiskarte nach dem Verfahren eines der Ansprüche bis 1 bis 17 erhältlich ist.35. multilayer document card, in particular identification card made of plastic, consisting of a card core with at least one card core layer, the card core being printed on one or two sides, a cover layer on at least one side of the card core and adhesive layers between the individual card layers, characterized in that the identification card is obtainable by the process of one of claims 1 to 17.
36. Mehrschichtige Dokumentenkarte, insbesondere Ausweiskarte aus36. Multi-layer document card, especially identification card
Kunststoff, bestehend aus einem Kartenkern mit wenigstens einer Kartenkernschicht, wobei der Kartenkern ein- oder zweiseitig bedruckt ist, einer Deckschicht auf wenigstens einer Seite des Kartenkerns sowie Klebschichten zwischen den einzelnen Kartenschichten, dadurch gekennzeichnet, daß wenigstens eine der Klebstoffschichten unter Verwendung eines Klebstoffsystems nach einem der Ansprüche 18 bis 34 hergestellt ist. Plastic, consisting of a card core with at least one card core layer, the card core being printed on one or two sides, a cover layer on at least one side of the card core and adhesive layers between the individual card layers, characterized in that at least one of the adhesive layers using an adhesive system according to a of claims 18 to 34 is made.
EP01933825.0A 2000-05-20 2001-04-12 Method for producing document cards comprising several layers Expired - Lifetime EP1286833B2 (en)

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DE10025093A DE10025093A1 (en) 2000-05-20 2000-05-20 Multi-layer plastics identity and validation cards are bonded by a durable heat- and solvent-resistant two-component crosslinkable adhesive system based e.g. on an unsaturated polyamide or a polyurethane
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CY1107019T1 (en) 2012-09-26
AU2001260205B2 (en) 2007-02-01
DK1286833T4 (en) 2013-11-11
CN1213858C (en) 2005-08-10
WO2001089831A1 (en) 2001-11-29
PT1286833E (en) 2007-11-30
ES2295165T5 (en) 2013-12-12
DE50112911D1 (en) 2007-10-04
DK1286833T3 (en) 2008-01-07
EP1286833B2 (en) 2013-07-31
DE10025093A1 (en) 2001-11-22
ATE370834T1 (en) 2007-09-15
AU6020501A (en) 2001-12-03
EP1286833B1 (en) 2007-08-22
CN1441723A (en) 2003-09-10
US20040007324A1 (en) 2004-01-15
ES2295165T3 (en) 2008-04-16

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