EP1268127A2 - Method and apparatus for shaping edges - Google Patents

Method and apparatus for shaping edges

Info

Publication number
EP1268127A2
EP1268127A2 EP01920194A EP01920194A EP1268127A2 EP 1268127 A2 EP1268127 A2 EP 1268127A2 EP 01920194 A EP01920194 A EP 01920194A EP 01920194 A EP01920194 A EP 01920194A EP 1268127 A2 EP1268127 A2 EP 1268127A2
Authority
EP
European Patent Office
Prior art keywords
range
resin
edge
abrasive wheel
bonded abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01920194A
Other languages
German (de)
French (fr)
Other versions
EP1268127B1 (en
Inventor
Hironori Hagiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP1268127A2 publication Critical patent/EP1268127A2/en
Application granted granted Critical
Publication of EP1268127B1 publication Critical patent/EP1268127B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Meat And Fish (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Method and apparatus for shaping the edge (103) of a rigid, brittle materials such as ceramic plates and rigid composite plates utilizing a resin-bonded abrasive wheel.

Claims

What is claimed is:
1. A method for shaping an edge of a ceramic plate or a rigid composite plate comprising: abrading an edge of a ceramic plate or a rigid composite plate in a predetermined abrasion amount, using a resin-bonded abrasive wheel under a load and in contact with the edge being abrading, wherein the abrasion amount is determined by controlling the load for pressing the ceramic plate or the rigid composite plate with the resin-bonded abrasive wheel.
2. The method according to claim 1, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 100 to 10,000 kg/cm2.
3. The method according to claim 1, wherein the resin-bonded abrasive wheel has a shore D hardness in the range from 10 to 95.
4. The method according to claim 1, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 100 to 10,000 kg/cm2, and a shore D hardness in the range from 10 to 95.
5. The method according to claim 1, wherein the resin-bonded abrasive wheel has a density in the range from 0.4 to 2.5 g/cm3.
6. The method according to claim 1, wherein the resin-bonded abrasive wheel has an outer diameter in the range from 50 to 500 mm.
7. The method according to claim 1, wherein the resin-bonded abrasive wheel has a width in the range from 10 to 500 mm.
8. The method according to claim 1, wherein the load is in the range from
11
0.002 kg/mm to 0.08 kg/mm.
9. The method according to claim 1, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 500 to 7,000 kg/cm2, a density in the range from 0.4 to 2.5 g/cm3, a shore D hardness in the range from 40 to 80, an outer diameter in the range from 100 to 305 mm, and has a width in the range from 10 to 300 mm.
10. The method according to claim 9, wherein the load is in the range from 0.01 kg/mm to 0.04 kg/mm.
11. The method according to claim 9, wherein the glass plate etc. has a thickness in the range from 0.2 to 1.4 mm.
12. The method according to claim 1, wherein the wheel has a width surface contacting the edge of the ceramic plate or the rigid composite plate being abraded, and wherein during said abrading, said width surface traverses along the edge of the ceramic plate or the rigid composite plate.
13. The method according to claim 1, wherein the wheel has a width surface contacting the edge of the ceramic plate or the rigid composite plate being abraded, and wherein during said abrading, the edge of the ceramic plate or the rigid composite plate traverses along said width surface.
14. The method according to claim 1, wherein the edge is an edge of a glass plate.
15. An apparatus for abrading an edge of a ceramic plate or a rigid composite plate in a predetermined abrasion amount using a resin-bonded abrasive wheel under a load, and in contact with, the edge to be abraded, the apparatus comprising a resin-bonded
12 abrasive wheel, a mechanism for rotating the abrasive wheel, and a system for contacting and controlling, during abrading, the load of the abrasive wheel on the ceramic plate or the rigid composite plate.
16. The apparatus according to claim 15, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 50 to 10,000 kg/cm2, a density in the range from 0.4 to 2.5 g/cm3, a shore D hardness in the range from 10 to 95, an outer diameter in the range from 50 to 500 mm, and has a width in the range from 10 to 500 mm.
17. The apparatus according to claim 15, wherein the resin-bonded abrasive wheel has a density in the range from 0.4 to 2.5 g/cm3.
18. The apparatus according to claim 15, wherein the resin-bonded abrasive wheel has an outer diameter in the range from 50 to 500 mm, and a width in the range from 10 to 500 mm.
19. The apparatus according to claim 15, wherein the resin-bonded abrasive wheel has an elastic modulus in the range from 500 to 7,000 kg/cm2, a density in the range from 0.4 to 2.5 g/cm3, a shore D hardness in the range from 40 to 80, an outer diameter in the range from 100 to 305 mm, and has a width in the range from 10 to 300 mm.
20. The apparatus according to, claim 15 further comprising a mechanism for traversing a width surface contacting the edge of the ceramic plate or rigid composite plate during operation of the device along the edge of the ceramic plate or rigid composite plate.
21. The apparatus according to claim 15 further comprising a mechanism for traversing the edge of the ceramic plate or rigid composite plate to be abraded during operation of the device along a width surface of the wheel contacting the edge of the
13 ceramic plate or rigid composite plate.
14
EP01920194A 2000-03-07 2001-03-06 Method and apparatus for shaping edges Expired - Lifetime EP1268127B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000061915A JP2001259978A (en) 2000-03-07 2000-03-07 Chamfering method for end part of glass plate
JP2000061915 2000-03-07
PCT/US2001/006940 WO2001066307A2 (en) 2000-03-07 2001-03-06 Method and apparatus for shaping edges

Publications (2)

Publication Number Publication Date
EP1268127A2 true EP1268127A2 (en) 2003-01-02
EP1268127B1 EP1268127B1 (en) 2005-06-01

Family

ID=18581991

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01920194A Expired - Lifetime EP1268127B1 (en) 2000-03-07 2001-03-06 Method and apparatus for shaping edges

Country Status (7)

Country Link
US (1) US20030017788A1 (en)
EP (1) EP1268127B1 (en)
JP (2) JP2001259978A (en)
AT (1) ATE296713T1 (en)
AU (1) AU2001247271A1 (en)
DE (1) DE60111203D1 (en)
WO (1) WO2001066307A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070164819A1 (en) * 2004-03-26 2007-07-19 Junetsu Urata Amplifier
US20070298240A1 (en) * 2006-06-22 2007-12-27 Gobena Feben T Compressible abrasive article
US7303464B1 (en) * 2006-10-13 2007-12-04 3M Innovative Properties Company Contact wheel
DE102009030294B4 (en) * 2009-06-24 2013-04-25 Siltronic Ag Process for polishing the edge of a semiconductor wafer
CN102985386B (en) * 2010-07-08 2015-09-02 旭硝子株式会社 Evaluation method of glass substrate end surface, processing method of glass substrate end surface, and glass substrate
GB2482345A (en) * 2010-07-30 2012-02-01 Vestas Wind Sys As Tapering an edge of a fibrous reinforcement sheet using a rotary tool
US8721392B2 (en) * 2011-06-28 2014-05-13 Corning Incorporated Glass edge finishing method
SG192302A1 (en) * 2012-01-18 2013-08-30 Avanstrate Inc Method of making glass sheet
WO2015113026A2 (en) * 2014-01-27 2015-07-30 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
JP2019171520A (en) * 2018-03-28 2019-10-10 株式会社ノリタケカンパニーリミテド Resinoid grinding wheel

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US3889430A (en) * 1972-05-17 1975-06-17 S P A M Abrasive tools
CH559593A5 (en) * 1973-01-26 1975-03-14 Moon Star Chemical Corp Helical honing tool for gear wheel - has abrasive particles embedded in polymer esp. mixt. of polyurethane and epoxy resin
DE2730665A1 (en) * 1977-07-07 1979-01-11 Lippert H Gmbh Grindstones for wet grinding - contg. curable hydrophilic satd. polyester or epoxy! resin binder
EP0042932A3 (en) * 1980-06-30 1984-07-25 International Business Machines Corporation A process for the manufacture of hollow tube-like members
US4525958A (en) * 1981-11-19 1985-07-02 Ppg Industries, Inc. Method of controlling article speed during edge grinding
JPS6062464A (en) * 1983-09-10 1985-04-10 Kawasaki Steel Corp Side end grinding attachment for metallic belt by rotary grinding wheel
JPS6165762A (en) * 1984-09-06 1986-04-04 Nippon Sheet Glass Co Ltd Grinding device for end face of a plate
IT1190474B (en) * 1986-02-04 1988-02-16 Siv Soc Italiana Vetro Edge grinding edge grinder for sheet glass
JP2719855B2 (en) * 1991-05-24 1998-02-25 信越半導体株式会社 Mirror chamfering device around wafer
JPH081493A (en) * 1994-06-17 1996-01-09 Shin Etsu Handotai Co Ltd Mirror finished surface polishing method for wafer chamfering part and mirror finished surface polishing device
TW383322B (en) * 1994-11-02 2000-03-01 Norton Co An improved method for preparing mixtures for abrasive articles
US5569062A (en) * 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
US5868603A (en) * 1996-12-12 1999-02-09 Corning Incorporated Method for edge finishing glass sheets
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
EP1043120A1 (en) * 1999-03-31 2000-10-11 Nippei Toyama Corporation Method and apparatus for grinding a workpiece
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6267649B1 (en) * 1999-08-23 2001-07-31 Industrial Technology Research Institute Edge and bevel CMP of copper wafer
JP2001121430A (en) * 1999-10-25 2001-05-08 Noritake Co Ltd Grinding wheel with bushing
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0166307A2 *

Also Published As

Publication number Publication date
AU2001247271A1 (en) 2001-09-17
US20030017788A1 (en) 2003-01-23
EP1268127B1 (en) 2005-06-01
WO2001066307A3 (en) 2002-03-28
JP2003525759A (en) 2003-09-02
JP2001259978A (en) 2001-09-25
ATE296713T1 (en) 2005-06-15
DE60111203D1 (en) 2005-07-07
WO2001066307A2 (en) 2001-09-13

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