JP2003525759A - Method and machine for shaping edges - Google Patents

Abstract

Method and apparatus for shaping the edge (103) of a rigid, brittle materials such as ceramic plates and rigid composite plates utilizing a resin-bonded abrasive wheel.

Description

Detailed Description of the Invention

FIELD OF THE INVENTION The present invention relates to methods and machines for shaping the edges of rigid materials such as ceramic plates and rigid composite plates.

BACKGROUND OF THE INVENTION Numerous glass plate components and rigid printed circuit boards are used for display windows or LCD panels in respective precision devices such as cell phones, pagers and handheld computers. These glass plate components and printed circuit boards, along with other precision components, are arranged in a narrow space in a complex manner. Further, LCD panels and the like are typically assembled from glass face plates and flexible printed circuit boards.

[0003] Typically, numerous cracks and / or chips (sometimes referred to as "fine cracks").
Exists on the cutting surface of a rigid and brittle material such as a ceramic plate or a rigid composite plate (including a rigid printed circuit board) immediately after cutting. Similarly, numerous recesses, typically having a size of 1 to 50 microns, are typically present in the cutting surface of rigid, brittle materials such as ceramic plates and rigid composite plates. Furthermore, the corners of the edges of cut rigid brittle materials such as glass sheets are usually sharp. Such a cut glass plate,
For example, when used in the construction of precision equipment, those plates can damage components of other equipment. For example, sharp edged corners of a cut glass sheet can damage (eg, cut) flexible printed circuit boards or other precision components. The cutting surface of the glass sheet may also cut guide rolls or carriers used to facilitate assembly of precision equipment.

Further, glass fragments on the cutting surface and / or fine cracks, cracks and the like existing on the cutting surface may cause the glass fragments to separate from the glass plate and enter the assembly equipment and / or precision equipment. There is.

Furthermore, if cracks are present in the cutting surface of rigid, brittle materials such as ceramic plates and rigid composite plates, the strength of the material is significantly reduced. Thus, the edges of parts made from rigid, brittle materials, such as ceramic plates and rigid composite plates, have corners,
It is preferably finished without pits or cracks.

Conventional techniques for removing corners, indentations and cracks from the edges of rigid and brittle materials such as ceramic plates and rigid composite plates include polishing the edges of the material with metal bonded diamond wheels. . Metal bonded diamond wheels are abrasive wheels in which abrasive diamond particles are bonded with a metal binder. Since rigid, brittle materials, such as ceramic plates and rigid composite plates, are brittle, prior art cutting modes that use rigid, inelastic materials, such as diamond wheels, typically "break" or "break". It is a crack type. In general, these cutting modes result in the formation of numerous cracks and indentations in the polishing surface, making it impossible to effectively remove the indentations from the edges of the material. In addition, relatively thin, rigid, brittle plates (eg, less than 1.4 mm for glass plates) (eg, less than 1.4 mm for glass plates).
In the case of glass plates), the formation of cracks can lead to destructive cracks in rigid, brittle plates (ie the plates break or shatter).

More recently, resin bonded diamond wheels have been used, for example, in place of metal bonded diamond wheels to shape the edges of glass sheets (eg, US Pat. No. 5,975,992 (Raeder et al. ) And 5,816,
897 (see Raeder et al.)). Advantages of resin bonded diamond wheels include increased flexibility and elasticity of the wheels.

The amount of polishing performed in a conventional chamfering process utilizing a metal bonded or resin diamond wheel can be controlled by adjusting the position of the metal bonded diamond wheel relative to the surface of the material to be polished. Further, in the conventional chamfering process, the amount to be polished is determined by the position of the diamond wheel with respect to the material to be polished. This process requires frequent and precise adjustment of the relative position of the diamond wheel surface and the surface of the material to be polished. Such frequent adjustments are troublesome. The position adjustment is performed by computer control (sometimes referred to as NC (Numerical Control) machining system) (for example, Japanese Patent Laid-Open No. 11-2 published on August 17, 1999).
21763)) is typically used. Entry of location data typically requires a relatively long time (eg, 60-120 minutes).

SUMMARY OF THE INVENTION The present invention shapes the edges of rigid, brittle materials such as ceramic (ie, glass, crystalline ceramic and combinations thereof) and rigid composite boards (including rigid printed circuit boards). Do (ie provide a surface with a solid edge)
Method and machine for.

In one aspect, the invention provides a method for shaping edges of materials such as ceramic plates and rigid composite boards (including rigid printed circuit boards), the methods comprising:
A step of polishing edges of materials such as ceramic plates and rigid composite plates (including rigid printed circuit boards) with a predetermined amount of polishing using a resin bonded polishing wheel that is under load and in contact with the edges to be polished. And the amount of polishing is determined by controlling the load for pressing the material being polished by the resin bonded polishing wheel. The method according to the invention is preferably carried out such that the edges of the resulting abrasive material are free of corners, depressions and cracks.

In one embodiment, the wheel has a width surface that contacts an edge of the material to be abraded, and during polishing, (i) the width surface traverses along the edge of the material to be abraded, or (Ii) At least one of the edges of the material to be polished traverses along the width surface.

In another aspect, the invention uses a resin-bonded abrasive wheel that is under load and in contact with the edge being abraded to remove rigid, brittle materials such as ceramic plates and rigid composite plates with a predetermined amount of polishing. Provided is a machine for polishing the edges, the machine comprising a resin bonded polishing wheel, a mechanism for rotating the polishing wheel, contacting the polishing wheel on the material to be polished during polishing and loading of the polishing wheel. And a system for controlling the.

One embodiment of the machine according to the invention is shown in FIG. Machine 20 according to the invention
0 comprises a grinding wheel 201, a drive shaft 202, a motor 203, and a pressure cylinder 204. The machine 200 and the material to be polished (eg, glass plate) 206 are arranged so that they can move independently of each other. The material 206 to be polished is movable, for example, parallel to the drive shaft 202 of the device (in the direction indicated by the arrow) during polishing.

Advantages of the present invention include, for example, being able to provide materials such as ceramic plates and rigid composite plates that are free of corners, dents and cracks in a relatively short time compared to the prior art.

DETAILED DESCRIPTION The present invention may be suitable for shaping the edges of various rigid, brittle materials such as ceramic plates and rigid composite plates. Examples of such glass plates include those used for display windows, LCD panels or face plates of precision devices (eg cell phones or pagers). The thickness of the glass plate of such a device is typically 0.2 to 1.4 mm, more typically, for example, about 0.3 to 0.7 mm.
Furthermore, it is about 0.3 to 0.5 mm. Rigid composite plates include rigid composite plates composed of binder materials such as polymers reinforced with fillers such as ceramic particles and fibers. The rigid composite board includes a board for a rigid printed board. Rigid printed circuit boards may have single or multiple layers of circuitry (eg, copper circuitry). The thickness of the rigid printed circuit board is typically about 0.5-5 mm, more typically about 1-3 mm.

The resin-bonded polishing wheel used in the present invention is a polishing wheel in which abrasive particles are fixed by a resin binder. Resin bonded abrasive wheels typically exhibit flexibility and elastic properties so that they can substantially elastically conform to the shape of the surface being abraded. Furthermore, the cutting mode for polishing brittle glass sheets in accordance with the method and apparatus of the present invention is typically "shear type". Without wishing to be bound by theory, it is believed that the absence of cracks, dents, etc. on the glass plate surface polished in accordance with the method and apparatus of the present invention is facilitated by a "shear-type" cutting mode. Further embodiments of the present invention are also suitable for relatively thin glass plates (eg, thickness less than 1.5 mm). Generally, the polishing surface formed by the shear-type cutting mode is called a “shear surface”. The sheared surface is a smooth cutting surface (mirror surface) and looks bright.

The elastic modulus of a suitable resin bonded abrasive wheel is preferably 50-10,000 kg.
/ Cm ² range, more preferably in the range of 500～7,000Kg / cm ^2. Resin bonded abrasive wheels having an elastic modulus of less than 50 kg / cm ² may also be useful, but such wheels tend to wear quickly. Furthermore, about 10,000
The use of resin bonded wheels having a modulus of elasticity greater than 0 kg / cm ² tends to result in the formation of newly formed surface cracks or depressions.

In another aspect, the Shore D hardness of the resin bonded abrasive wheel is preferably 10-9.
It is in the range of 5, more preferably in the range of 40-80. If the Shore D hardness is less than about 10, the abrasive wheels tend to wear quickly. Shore D hardness is about 9
Above 5, there is a tendency for newly formed surfaces to crack or dimple.

The density of the resin bonded polishing wheel is preferably in the range of about 0.4 to 2.5 g / cm ³ . If the density is less than about 0.4 g / cm ³ , the polishing wheel tends to wear quickly. At densities above about 2.5 g / cm ³ , newly formed surfaces tend to crack or dimple.

Examples of abrasive particles present in resin bonded abrasive wheels include conventional abrasive particles such as SiC, Al ₂ O ₃ and CeO ₂ . Typically, the abrasive particles are JIS
(Japan Industrial Standard) grade (for example, JIS (R6001, 1987 version) JIS100 to JIS10,000).
, Preferably in the range of JIS 220 to JIS 2,000, etc.) and sorted using a well-known technique and standard. Abrasive particle size (according to JIS)
Is generally in the range of about 1 to 125 μm, preferably in the range of about 6 to 50 μm. ANSI (American National Standard In)
It is also within the scope of the present invention to use abrasive particles graded to other approved industry standards, such as status) and FEPA (Federation Europane de Products Abrasifs).

The resin binder for the resin bonded abrasive wheel is preferably polyurethane.
A preferred polyurethane is disclosed 19 for which the disclosure is incorporated herein by reference.
It is a crosslinked polyurethane matrix as disclosed in Japanese Patent Application Laid-Open No. 2 (1990) -294336 published on Dec. 5, 1990. The glass transition temperature of the crosslinked polyurethane is preferably higher than about 10 ° C, more preferably in the range of greater than about 10 ° C to 70 ° C.

Suitable resin bonded abrasive wheels are commercially available and / or related art (eg, the disclosure of which is incorporated herein by reference, December 12, 1990).
It can be produced by a technique known in Japanese Patent Application Laid-Open No. 2 (1990) -294336 and U.S. Pat. No. 4,933,373 (Moren), which are published on May 5.

An example of a commercially available resin bonded abrasive wheel is the Sumitomo 3M
Co. , Ltd. From Japan, Japan under the trade name of "DLO WHEEL".

The outer diameter of the polishing wheel used in practicing the present invention is typically 50-5.
It is in the range of 00 mm, more typically in the range of 100-305 mm. The inner diameter of the wheel is typically in the range 5-300 mm, more typically in the range 10-127 mm. The width of the wheels is typically in the range 10-500 mm, more typically in the range 10-300 mm.

FIG. 1 is a perspective view showing an edge of a material (for example, a glass plate) to be polished by the method according to the present invention. The material 101 is fixed such that the width of the edge to be polished is parallel to the axial direction of the resin-bonded polishing wheel 102. Polishing wheel 1
The outer peripheral surface of 02 is under load and is in contact with the edge 103 for a predetermined time.

The load experienced by the polishing wheel when in contact with the edge of the material being polished is varied depending on the desired area and amount to be polished. Due to the flexibility and elasticity of resin bonded polishing wheels, the load for contacting the polishing wheel with the surface being polished can be varied as desired over a range of loads. The load is correlated to the amount polished per unit time. In other words, the amount to be polished can be changed and controlled by adjusting the load. The amount to be polished is also influenced by, for example, the polishing time and the rotation speed of the polishing wheel.

Metallic diamond wheels that are not flexible and elastic, on the other hand, do not provide a range of loads, but are rather maintained at a substantially single optimum value. Due to the rigidity and inelasticity of diamond wheels, the material being abraded (eg, glass plate) will typically fail even if the load slightly exceeds the (substantially single) optimum. Similarly, if the load is just below the (substantially single) optimum value, the material will not be polished or will be insufficient. Therefore, in conventional methods of shaping materials with diamond wheels, the amount to be polished cannot be effectively controlled by adjusting the load, but rather the amount to be polished is the position of the wheel relative to the surface being polished. Determined by

Typically, the load for practicing the present invention will be about 0.1-4 kg / 50 mm (ie 0.1-4 kilograms based on a 50 mm wide wheel) (0.002 k
g / mm to 0.08 kg / mm), preferably 0.5 to 2 kg / 50 mm (0.
01 kg / mm to 0.04 kg / mm). Polishing time is typically 0.5
~ 5 seconds, preferably 1-3 seconds. The peripheral rotation speed of the polishing wheel is typically about 100 to 2000 m / min, preferably 200 to 1000 m / min. The contact angle θ between the polishing wheel and the edge of the glass plate is typically 0 to 60 °, preferably 30 to 60 °.

The present invention can be further understood with reference to FIGS. The device or machine 200 has a resin bonded grinding wheel 201, a drive shaft 202, a motor 203 and a pressure cylinder 204 arranged on a movable frame 205. The glass plate 206 to be polished is fixed to the work table 207. The machine 200 and the material to be polished (eg, glass plate) 206 are arranged so that they can move independently of each other. The material 206 being abraded may be, for example, the drive shaft 20 of the device during abrading.
It is possible to move in parallel with 2 (direction indicated by an arrow).

The load is applied, for example, by using a pneumatic cylinder, and also, for example, “ACTI
VE FORCE CONTROL SYSTEM ”under the product name Mechano
tron Co. , Ltd. , USA, USA, and can be controlled using a system regulated by a control system such as those available from USA. Mechanotron Co
． The device uses closed loop feedback to provide adjustable constant force. The device uses a load cell or drive motor feedback to monitor the force, and a microprocessor to continuously adjust the force to the desired setting. The device behaves like a passive device, but is more effective at low forces and exhibits a faster response speed. The device can use linear or rotary bearings with or without balanced weights. The device can also be used for wrist-mounted or floor-mounted devices. Furthermore, the device can directly control the force using any of a variety of actuators.

The present invention is further illustrated by the following examples, which are not to be construed as unduly limiting the invention to their particular materials and amounts, as well as other conditions and details, described in these examples. . Various modifications and alterations of this invention will be apparent to those skilled in the art. All parts and percentages are by weight unless otherwise specified.

EXAMPLES Example 1 A resin-bonded polishing wheel (Sumitomo /
3M Co. , Ltd. , Japan by “DLO WHEEL SERI
(Commercially available under the trade name of “ES”). The elastic constant of the grinding wheel is 1,000 kg
/ Cm ² and the density was 1.5 g / cm ³ . Abrasive particles are JIS 600 grade S
It was iC. The outer diameter of the wheel is 200mm, the inner diameter is 31.8mm, and the width is 5
It was 0 mm. A glass plate (thickness 0.7 mm) was fixed to the work table. The edge of the glass plate was polished under the following conditions. Wheel rotation speed is 1,500 rp
m, the contact angle was 45 °, and the load was 2 kg / 50 mm. The polishing time was 2 seconds. Water was used as the lubricant.

The chamfered portion C of the polishing edge of the glass plate is defined by Japanese Industrial Standards (Japanese) for drawings.
Se Industrial Standard for Drawing). FIG. 3 is a 100 times photograph of the edge surface of a polished glass plate. The black area in the lower half of FIG. 3 was the edge surface of the glass plate. The polishing edge had a smooth appearance.

[0034] Comparative Example A   Resin-bonded polishing wheel (Sumitomo /
3M Co. , Ltd. Under the trade name of "DLO WHEEL SERIES"
0.7 mm thick under the same polishing conditions as the above example, except that it was commercially available)
The edge of the glass plate was polished. Wheel elastic constant is 12,000 kg / cm ^Two , Density is 2.5 g / cm^ThreeMet. Abrasive particles are JIS 600 grade SiC
there were. The outer diameter of the wheel is 200 mm, the inner diameter is 31.8 mm, and the width is 50 mm.
Met. FIG. 4 is a 100 times photograph of the edge surface of a polished glass plate. Lower half of Figure 4
The black area of the minute was the edge surface of the glass plate. Present on the polished surface of the glass plate edge
There were dents such as shell-like chips or dents.

Example 2 A type FR4 printed circuit board having copper circuit layers (thickness 1.6 mm) on both sides (ie, ASTM standard D1 the disclosure of which is incorporated herein by reference).
A glass epoxy resin printed circuit according to 867-62T) was fixed to the work table. The edge surface of the printed circuit board was completely destroyed and was very rough (R
a = 25.1, Kosaka Laboratory Company, Japan
(measured according to JIS B0601 using a surface profilometer obtained from An under the trade name of “SEF-30D”). The edge of the printed circuit board was polished by the resin-bonded polishing wheel described in Example 1 under the following conditions. The rotation speed of the wheel was 1,500 rpm, the contact angle was 0 ° C., and the load was 2 kg / 50 mm. The polishing time was 4 seconds. Water was used as the lubricant.

After polishing, the edge surface of the printed circuit board is very smooth so that the interface between the epoxy resin of the board and the glass fiber has a very smooth surface roughness (Ra = 3.9). It was

Comparative Example B Except that the polishing wheel used was similar to that described in Comparative Example 1.
The edges of the printed circuit board (type FR4) were polished as described in Example 2.

The edge surface of the printed circuit board after polishing was rough (Ra = 13.2), and glass fibers were shown to project from the epoxy resin matrix.

Various modifications and alterations of this invention will be apparent to those skilled in the art without departing from the scope and spirit of this invention, and this invention is not unduly limited to the exemplary embodiments described in this application. You should understand that.

[Brief description of drawings]

1 is a perspective view showing an edge of a material to be polished by a method according to the present invention.

FIG. 2A is a front view of a machine according to the method of the present invention for polishing the edges of a material to be polished (eg, glass plate).

FIG. 2B is a side view of a machine according to the method of the present invention for polishing the edges of a material to be polished (eg, glass plate).

FIG. 2C is a plan view of a machine according to the method of the present invention for polishing edges of a material to be polished (eg, glass plate).

FIG. 3 is a 100 × photograph of an edge surface of a glass plate shaped according to the method of the present invention.

FIG. 4 is a 100 × photograph of an edge surface of a glass plate shaped by a conventional method.

─────────────────────────────────────────────────── ─── Continued front page    (81) Designated countries EP (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, I T, LU, MC, NL, PT, SE, TR), OA (BF , BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG), AP (GH, G M, KE, LS, MW, MZ, SD, SL, SZ, TZ , UG, ZW), EA (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM), AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, B Z, CA, CH, CN, CO, CR, CU, CZ, DE , DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, I S, JP, KE, KG, KP, KR, KZ, LC, LK , LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, P T, RO, RU, SD, SE, SG, SI, SK, SL , TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW

Claims (21)

[Claims] 1. A method for shaping an edge of a ceramic plate or a rigid composite plate, comprising a resin-bonded grinding wheel which is in contact with an edge to be ground under load, the ceramic plate having a predetermined polishing amount. Or a step of polishing an edge of a rigid composite plate, wherein the polishing amount is determined by controlling a load for pressing the ceramic plate or the rigid composite plate by the resin bonding polishing wheel, How to include. 2. The resin adhesive polishing wheel has an elastic modulus of 100 to 10,000.
The method according to claim 1, which is in the range of kg / cm ² . 3. The method according to claim 1, wherein the resin adhesive polishing wheel has a Shore D hardness in the range of 10 to 95. 4. The resin adhesive polishing wheel has an elastic modulus of 100 to 10,000.
The method according to claim 1, wherein the hardness is in the range of kg / cm ² and the Shore D hardness is in the range of 10 to 95. 5. The resin adhesive polishing wheel has a density of 0.4 to 2.5 g / cm. ^Three The method according to claim 1, wherein 6. The method according to claim 1, wherein the resin-bonded polishing wheel has an outer diameter in the range of 50 to 500 mm. 7. The method according to claim 1, wherein the width of the resin-bonded polishing wheel is in the range of 10 to 500 mm. 8. The method according to claim 1, wherein the load is in the range of 0.002 kg / mm to 0.08 kg / mm. 9. The elastic modulus of the resin-bonded polishing wheel is 500 to 7,000 k.
g / cm ² , the density is 0.4 to 2.5 g / cm ³ , the Shore D hardness is 40 to 80, and the outer diameter is 100 to 305 mm.
The method according to claim 1, wherein the width is in the range of 10 to 300 mm. 10. The method according to claim 9, wherein the load is in the range of 0.01 kg / mm to 0.04 kg / mm. 11. The method according to claim 9, wherein the thickness of the glass plate or the like is in the range of 0.2 to 1.4 mm. 12. The wheel has a width surface that contacts an edge of the ceramic plate or the rigid composite plate to be polished, and the width surface is at the edge of the ceramic plate or the rigid composite plate during the polishing. The method of claim 1, traversing along. 13. The wheel has a width surface in contact with an edge of the ceramic plate or the rigid composite plate to be polished, and the edge of the ceramic plate or the rigid composite plate is in the width surface during the polishing. The method of claim 1, traversing along. 14. The method of claim 1, wherein the edge is a glass sheet edge. 15. A machine for polishing an edge of a ceramic plate or a rigid composite plate of a predetermined polishing amount by using a resin-bonded polishing wheel which receives a load and contacts an edge to be polished, the resin-bonded polishing A machine comprising a wheel, a mechanism for rotating the polishing wheel, and a system for contacting the polishing wheel on the ceramic plate or the rigid composite plate and controlling the load on the polishing wheel during polishing. . 16. The resin adhesive polishing wheel has an elastic modulus of 50 to 10,000.
is in the range of kg / cm ² , the density is in the range of 0.4 to 2.5 g / cm ³ , the Shore D hardness is in the range of 10 to 95, and the outer diameter is in the range of 50 to 500 mm,
16. The machine according to claim 15, which has a width in the range of 10 to 500 mm. 17. The resin adhesive polishing wheel has a density of 0.4 to 2.5 g / c.
The machine according to claim 15, which is in the range of m ³ . 18. The machine according to claim 15, wherein the resin-bonded polishing wheel has an outer diameter in the range of 50 to 500 mm and a width in the range of 10 to 500 mm. 19. The resin adhesive polishing wheel has an elastic modulus of 500 to 7,000.
kg / cm ² , a density of 0.4 to 2.5 g / cm ³ , a Shore D hardness of 40 to 80, an outer diameter of 100 to 305 mm, and The machine according to claim 15, wherein the width is in the range of 10 to 300 mm. 20. A mechanism for traversing a width plane that contacts an edge of the ceramic plate or rigid composite plate along an edge of the ceramic plate or rigid composite plate during operation of the apparatus. Machine described in. 21. A mechanism for traversing the edge of the ceramic plate or rigid composite plate to be polished along the width surface of the wheel that contacts the edge of the ceramic plate or rigid composite plate during operation of the device. The machine according to claim 15, further comprising: