EP1222725B1 - Universelle multifunktionelle gemeinsame abschirmstruktur für elektrische schaltung und energieanpassung - Google Patents

Universelle multifunktionelle gemeinsame abschirmstruktur für elektrische schaltung und energieanpassung Download PDF

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Publication number
EP1222725B1
EP1222725B1 EP00946814A EP00946814A EP1222725B1 EP 1222725 B1 EP1222725 B1 EP 1222725B1 EP 00946814 A EP00946814 A EP 00946814A EP 00946814 A EP00946814 A EP 00946814A EP 1222725 B1 EP1222725 B1 EP 1222725B1
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Prior art keywords
pathways
pathway
conductive
arrangement
shielding
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English (en)
French (fr)
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EP1222725A4 (de
EP1222725A1 (de
EP1222725B8 (de
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Anthony A. Anthony
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X2Y Attenuators LLC
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X2Y Attenuators LLC
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Priority claimed from US09/460,218 external-priority patent/US6331926B1/en
Priority claimed from US09/579,606 external-priority patent/US6373673B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6616—Vertical connections, e.g. vias
    • H01L2223/6622—Coaxial feed-throughs in active or passive substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the present invention relates to a layered, universal, multi-functional common conductive shield structure with conductive feed-thru or by-pass pathways for circuitry and energy conditioning that also possesses a commonly shared and centrally positioned conductive pathway or electrode that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes.
  • the invention when energized, will allow the contained conductive pathways or electrodes to operate with respect to one another harmoniously, yet in an oppositely phased or charged manner, respectively.
  • the invention When placed into a circuit and energized, the invention will also provide EMI filtering and surge protection while maintaining an apparent even or balanced voltage supply between a source and an energy utilizing-load.
  • the invention will also be able to simultaneous and effectively provide energy conditioning functions that include bypassing, energy and signal decoupling, energy storage, and continued balance in Simultaneous Switching Operations (SSO) states of intergrated circuit gate.
  • SSO Simultaneous Switching Operations
  • a single passive component generally has a physical functional line conditioning limitation of between 5 and 250 MHz.
  • a load still requires combinations of discrete passive elements for "lump" elements such as various L-C-R, L-C, and R-C networks to shape or control energy delivered to the system load.
  • discrete L-C-R, L-C, R-C networks begin to take on characteristics of transmission lines and even microwave-like features rather than providing lump capacitance, resistance or inductance that such a network was designed for.
  • energy pathways should normally be grouped or paired as an electrically complementary element or elements that work together electrically and magnetically in harmony and in balance within an energized system.
  • Attempts to line condition propagating energy with prior art componentry has led to increased levels of interference in the form of EMI, RFI, and capacitive and inductive parasitics. These increases are due in part to imbalances and performance deficiencies of the passive componentry that create or induce interference into the associated electrical circuitry.
  • EMI can also be generated from the electrical circuit pathway itself, which makes shielding from EMI desirable.
  • Differential and common mode noise energy can be generated and will traverse along and around cables, circuit board tracks or traces, and along almost any high-speed transmission line or bus line pathway. In many cases, energy fields that radiate from these critical energy conductors act as an antenna, hence aggravating the problem even more.
  • Other sources of EMI interference are generated from the active silicon components as they operate or switch. These problems such as SSO are notorious causes of circuit disruptions. Other problems include unshielded and parasitic energy that freely couples upon or onto the electrical circuitry and generates significant interference at high frequencies.
  • U. S. Patent Application 09/561,283 filed on April 28, 2000 and U. S. Patent Application 09/579,606 filed on May 26, 2000 by the applicants relate to continued improvements to a new family of discrete, multi-functional energy conditioners.
  • These multi-functional energy conditioners posses a commonly shared, centrally located, conductive electrode of a structure that can simultaneously interact with energized and paired conductive pathway electrodes contained in energy-carrying conductive pathways.
  • These energy-carrying conductive pathways can operate in an oppositely phased or charged manner with respect to each other and are separated from one another by a physical shielding.
  • a layered, multi-functional, common conductive shield structure containing energy-conductive pathways that share a common and centrally positioned conductive pathway or electrode as part of its structure which allows for energy conditioning as well as a multitude of other functions simultaneously, within one inclusive embodiment or embodiment variation that possesses a commonly shared and centrally positioned conductive pathway or electrode as part of its structure.
  • the layered, multi-functional, common conductive shield structure also provides simultaneous physical and electrical shielding to portions of propagating energy by allowing predetermined, simultaneous energy interactions to take place between grouped and energized conductive pathways and various conductive pathways external to the embodiment elements.
  • a superior approach is to get the low impedance from the power planes. It is impractical to utilize many low impedance decoupling capacitors on a PCB if low impedance power planes are not available to hook them up. Accordingly, the solution to low impedance power distribution above several hundred MHz lies in thin dielectric power plane technology, in accordance with the present invention, which is much more effective than discrete decoupling capacitors. Therefore, it is also an object of the invention to be able to operate effectively across a broad frequency range as compared to a single component or a multiple passive conditioning network. Ideally, this invention can be universal in its application potentials, and by utilizing various embodiments of predetermined grouped elements, a working invention will continue to perform effectively within a system operating beyond 1 GHz of frequency.
  • EMI electromagnetic field interference
  • UFCCSS refers to all types both discrete and non-discrete versions of multi-functional common conductive shield structure with conductive pathways
  • UFCCSS-F refers to both discrete and non-discrete versions of multi-functional common conductive shield structure with conductive feed-thru pathways
  • UFCCSS-B refers to both discrete and non-discrete versions of multi-functional common conductive shield structure with conductive by-pass pathways for all disclosure purposes.
  • AOC for the words "predetermined area or space of physical convergence or junction” which is defined as the physical boundary of manufactured-together invention elements.
  • Non-energization and energization are defined as the range or degree to which electrons with in the "AOC” are in motion and are propagating to and/or from an area located outside the pre-determined boundary of an electrical conductive pathway or energized circuit pathway that contains either discrete and non-discrete versions of UMFCCSS AOC so, that propagated energy reacts with invention elements and/or combinations of elements to conduct a phased or charged exchange of electrons in a balanced manner.
  • the invention begins as a combination of electrically conductive, electrically semi-conductive, and non-conductive dielectric independent materials, layered or stacked in various embodiments such as discrete and non-discrete structures. These layers can be combined to form a unique circuit when placed and energized in a system.
  • the invention embodiments include layers of electrically conductive, electrically semi-conductive, and non-conductive planes that form groups of common conductive pathway electrodes, conductors, deposits, plates (all referred to as 'pathways', herein), and dielectric planes. These layers are oriented in a generally parallel relationship with respect to one another and to a predetermined pairing or groups of elements that also include various combinations of pathways and their layering into a predetermined structure that is universal in the type of embodiments that can be manufactured.
  • Other elements can include some means of conductively coupling the common conductive planes. These devices are not just limited to dielectric layers, multiple electrode conductive pathways, sheets, laminates, deposits, multiple common conductive pathways, shields, sheets, laminates, or deposits.
  • the invention also includes element methods to combine them together in an interweaved arrangement of overlapping and non-overlapping methodologies that also connects specific types of planes together for energization into a larger electrical system in a predetermined manner. This manner yields distinct electrical circuit functions, some heretofore not found, occurring both effectively and simultaneously, that was normally performed with multiple embodiments of prior art devices. When or after the structured layer arrangement is manufactured, it can be shaped, buried within, enveloped, or inserted into various electrical systems or other sub-systems.
  • the circuit of the structure can easily be combined with almost any larger circuitry to perform line conditioning, decoupling, and/or aid in modifying an electrical transmission of energy to a desired electrical form or electrical shape.
  • the invention can be a separate, stand-alone embodiment or manufactured as a group and integral to a larger electrical structure such as an integrated circuit. It can also exist as a non-energized stand alone discrete device that can be energized with a combination as a sub-circuit for larger circuitry found in other embodiments such as, but not limited to, a Printed Circuit Board (PCB), interposer, substrates, connectors, integrated circuits, or atomic structures.
  • PCB Printed Circuit Board
  • An alternative invention embodiment can also by built primarily as another device such as a PCB, interposer, or substrate that has a purpose mainly other than that of a smaller discrete version of the invention.
  • This alternate type of embodiment serves as a possible system or subsystem platform that contains both active and passive components along with circuitry, yet is layered to provide most of the benefits described for conditioning propagated energy from a source to a load and back to a return.
  • PCBs are already utilizing predetermined layered configurations with VIAs to service or tap the various power, signal, and ground layers that lie between a dielectric and insulating material. The characteristics described herein can easily be obtained from such a device.
  • the pathway or plane By surrounding the conductive pathway electrode planes with the Faraday cage-like structures made up with one centralized and shared, common conductive pathway or area, the pathway or plane becomes a 0-reference ground plane for circuit voltages between the two oppositely phased or potential conductive structures located on opposite sides of the central, shared, common conductive layer.
  • This configuration aids significantly in eliminating and suppressing E-Fields and H-fields, stray capacitances, stray inductances, parasitics, and allowing for mutual cancellation of oppositely charged or phased, adjoining or abutting, electrical fields of the variously positioned signal, power and return pathways.
  • An external conductive connection for a PCB built with the device can take advantage of the various grounding schemes used now by large PCB manufacturers.
  • a passive architecture such as utilized by the invention, can be built to condition or minimize both types of energy fields that can be found in an electrical system. While the invention is not necessarily built to condition one type of field more than another, however, it is contemplated that different types of materials can be added or used to build an embodiment that could do such specific conditioning upon one energy field over another.
  • the applicant contemplates a manufacturer to have the option in some cases for combining a variety and wide range of possible materials that are selected and combined into the material make-up of the invention when manufactured, while still maintaining some or all of the desired degree of electrical functions of the invention.
  • materials for composition of the invention can comprise one or more layers of material elements compatible with available processing technology and is not limited to any possible dielectric material.
  • These materials may be a semiconductor material such as silicon, germanium, gallium-arsenide, or a semi-insulating or insulating material and the like such as, but not limited to any K, high K and low K dielectrics.
  • the invention is not limited to any possible conductive material, magnetic, nickel-based materials, MOV-type material, ferrite material, films such as Mylar, any substances and/or processes that can create conductive pathways for a conductive material, and any substances and/or processes that can create conductive areas such as, but not limited to, doped polysilicons, sintered polycrystallines, metals, or polysilicon silicates, polysilicon silicide.
  • the invention removes an obstacle capacitive load balancing between ENERGIZED paired or multiple lines much differently than that of two discrete capacitors PLACED IN A CIRCUIT AND CONNECTED TO A RETURN PATH, WHICH IS KNOWN AS BYPASS DECOUPLING.
  • PRIOR ART CAPACITORS manufactured in the same production batch which can easily posses a variability in capacitance, ranging anywhere from 15% - 25%.
  • EVEN WHEN prior art units ARE MADE for example, while it is possible to obtain individual variations of capacitance between discrete units of less than 10%, it is however, at a cost or a substantial premium that must be paid by the user over the common dielectrics in order for the manufacturer to recover the costs for testing, hand sorting manufactured lots, as well as the additional costs for the more specialized dielectrics and manufacturing techniques that are needed to produce these devices with reduced individual variance differences required for differential signaling.
  • the invention allows the use of very inexpensive dielectric materials (relative to the others available) to be used to obtain balance between two differential lines.
  • the device When the universal multi-functional common conductive shield structure is manufactured and subsequently attached to an externally manufactured conductive pathway (not of), separate from the differential pathways that are also utilizing the invention embodiment, the device will simultaneous provide energy conditioning functions that include bypassing, energy, power line decoupling, energy storage such that the differential electrodes that are enveloped within the shield structure are free from almost all internally generated capacitive or energy parasitics trying to escape from the enveloped containment area surrounding the conductive pathway electrode and at the same time, will act to prevent any externally generated capacitive or energy parasitics such as "floating capacitance" from coupling onto the very same differential conductive pathways due to the physical shielding, separate of the electrostatic shield effect created by the energization of the common conductive structure and its attachment with common means know to the art to an externally located conductive area.
  • energy conditioning functions that include bypassing, energy, power line decoupling, energy storage such that the differential electrodes that are enveloped within the shield structure are free from almost all internally generated capacitive or energy parasitics trying to escape
  • a device that is manufactured at 1% tolerance when manufactured as described in the disclosure will also have a correlated 1% capacitive tolerance between paired lines in an energized system and also as an added benefit exchange two prior art devices for bypassing paired lines with one invention embodiment.
  • the new device is placed between paired or a paired plurality of differential conductive pathways, while the common conductive pathways that also make up the invention are connected to a third conductive pathway that is common to all elements of the common conductive pathways and is the external conductive area.
  • Attachment to an external conductive area includes areas such as commonly described as a "floating", non-potential conductive area, a circuit system return, chassis or PCB ground, or even an earth ground.
  • the invention through other functions such as cancellation of mutually opposing conductors allows a low impedance pathway to develop within the Gauss-Faraday cage-like units with respect to the enveloping conductive common shields pathways that can subsequently continue to move energy out onto the externally located conductive area, thus completing an energy pathway of low impedance for unwanted EMI noise as well.
  • This attachment scheme normally will allow a "0" voltage reference to develop with respect to each differential conductor located on opposite sides of the shared central and common conductive pathway, its termination structures, if any and the externally used conductive surface.
  • the invention is an ideal and universal solution.
  • the voltage is maintained and balanced even with SSO (Simultaneous Switching Operations) states among gates located within an integrated circuit and without contributing disruptive energy parasitics back into the circuit system as the invention is passively operated, within.
  • Discrete Passive Components employ surface mount technology to physically and electrically connect to external electrical conductors and traces or pathways found on/in, but not limited to, Printed Circuit Boards (PCB), multi-silicon chip module (MCM), silicon chip scale packages (CSP), Interposer, Substrates, Connectors, Integrated Circuits.
  • PCB Printed Circuit Boards
  • MCM multi-silicon chip module
  • CSP silicon chip scale packages
  • Interposer Interposer
  • Substrates Connectors, Integrated Circuits.
  • the present invention may exist in innumerable embodiments.
  • multicomponent filters As an example of various types of layered configurations contemplated, but not intended to limit the invention, various additional embodiments of multicomponent filters will be described. In each figure, the five pathways are shown individually and then in a top plan view and finally in a side view.
  • Another variation of the invention relates to improvements to multi layered electronic circuit conditioning assemblies that consists of a physical layering architecture that suppresses unwanted electromagnetic emissions, both those unwanted electromagnetic emissions received from other sources and those created internally within the multi layered electronic circuit conditioning assemblies' internal electronic circuitry such as differential and common mode currents.
  • propagated electromagnetic interference can be the product of both electric and magnetic fields, respectively.
  • the invention is capable of conditioning energy that uses DC, AC, and AC/DC hybrid-type propagation of energy along conductive pathways found in an electrical system or test equipment. This includes use of the invention to condition energy in systems that contain many different types of energy propagation formats found in systems containing many kinds of circuitry propagation characteristics within the same electrical system platform.
  • the main cause of radiated emission problems can be due to the two types of conducted currents, differential and common mode energy. The fields generated by these currents result in many types of EMI emissions.
  • DM currents are those currents that flow in a circular path in wires, circuit board traces, and other conductors.
  • the fields related to these currents originate from the loop defined by the conductors.
  • Principals of a Faraday cage-like structure are used when the common plates are joined to one another and the grouping of common conductive pathways together coact with the larger external conductive area or surface to suppress radiated electromagnetic emissions and provide a greater conductive surface area in which to dissipate over voltages and surges and initiate Faraday cage-like electrostatic suppression of parasitics and other transients, simultaneously.
  • This is particularly true when a plurality of common conductive pathways are electrically coupled to system, chassis ground and is relied upon for reference ground for a circuit in which the invention is placed into and energized.
  • one or more of a plurality of materials having different electrical characteristics can be inserted and maintained between common conductive pathways and both electrode pathways.
  • FIG. 1 comprises a portion of the Faraday cage-like structure 800 that consists of two areas of space that sandwiches one of two differential electrodes. Conductive electrode pathway 809 is sandwiched between central common conductive shared pathway 804 and common conductive pathway 808 (not shown).
  • Common conductive pathways 804, 808 (not shown) and 810 (not shown) are all separated from each other by a general parallel interposition of a predetermined dielectric material and between each outside pathway 810 and 808 relative to each pathways respective position to the central common conductive shared pathway 804, by differential conductive electrode pathways 809 and 809' (not shown) that feature a differential conductive electrode such as conductive pathway 809 almost completely covered or shielded by pathways 808 and 804, respectively that are sandwiching pathway 809, in this case, above and below, within the invention.
  • the pathways 804, 808, and 810 are also surrounded by dielectric material 801 that provides support and an outer casing of the component.
  • a means to allow connection of both common shield termination structures 802 to the same common conductive pathways 808 and 804 and 810 individually is desired.
  • termination structures 802 should be attached by standard means known in the art to the same external conductive area or to the same external conductive path (not shown) without an interruption or conductive gap between each respective termination structure.
  • a standard means known in the art facilitates connection of common shield termination structures 802 that attached respectively on all three pathways 804, 808, and 810 together will form a single structure 800 to act as one common conductive cage-like structure of 800.
  • 800' mirrors single Faraday cage-like structure 800 except that differential electrode 809' contained within has a exit/entrance section 812A (not shown) that is not fully shielded, but in a generally opposing direction of 180 degrees to that of conductive termination structure 809' and differential electrode 809 to join with conductive termination structure 809A' (not shown).
  • These two Faraday cage-like structures 800 and 800' are in a positioned and parallel relationship, but most importantly structures 800 and 800' are sharing the same, central common conductive shared pathway 804, layer or pathway that makes up each Faraday cage-like structure 800 and 800' when taken individually.
  • 800 and 800' create a single and larger conductive Faraday cage-like shield structure 800" (not shown) that acts as a double container.
  • Each container 800 and 800' will hold an equal number of same sized differential electrodes that are opposing one another within said larger structure 800" in a generally parallel manner, respectively.
  • Larger conductive Faraday cage-like shield structure 800" with coacting 800 and 800' individual shield-like structures when energized and attached to the same external common conductive path become one electrically.
  • the predetermined arrangement of the common conductive electrodes into a differential conductive sandwich with a centralized common shield are elements that make up one common conductive cage-like structure 800" which is the base element of the present invention, namely the Faraday cage-like structure 800".
  • the structure in essence, forms minimum of two Faraday cages 800 and 800' that are required to make up a multi-functional line-conditioning device in all of the layered embodiments of the present invention.
  • the central common conductive shared pathway 804 with respect to its interposition between the differential electrodes needs the outer two additional sandwiching common electrode pathways 808 and 810 to be considered an un-energized Faraday cage-like structure 800".
  • the central common pathway 804 will be simultaneously used by both differential electrodes 809 and 809' at the same time, but with opposite results with respective to charge switching.
  • a new device will have a minimum of two electrodes sandwiched between three common conductive electrodes and connected external termination structures that are connected such that they are conductively as one to form a single, larger Faraday-cage-like structure 800", that when attached to a larger external conductive area, helps perform simultaneously energized line conditioning and filtering functions upon the energy propagating along the conductors and sandwiched within the cage-like structure 800" in an oppositely phased or charged manner.
  • common conductive pathway 804 also applies to common conductive pathway 808 and 810.
  • Common conductive pathway 804 is offset a distance 814 from the edge of the invention.
  • One or more portions 811 of the common ground common conductive pathway 804 extends through material 801 and is attached to common ground termination band or structure 802. Although not shown, the common ground termination band 802 electrically connects the common conductive pathways 804, 808 and 810 to each other, and to all other common conductive pathways of the filter, if used.
  • the conductive electrode pathway 809 is not as large as the common conductive pathway 804 such that an offset distance and area 806 exists between the edge 803 of the electrode pathway 809 and of the edge 805 of the central common conductive shared pathway 804.
  • This offset distance and area 806 enables the common conductive pathway 804 to extend beyond the electrode pathway 809 to provide a shield against any flux lines which might extend beyond the edge 803 of the electrode pathway 809 resulting in reduction or elimination of near field coupling to other electrode pathways within the filter or to elements external to the filter.
  • the horizontal offset is approximately 0 to 20+ times the vertical distance between the electrode pathway 809 and the common conductive pathway 804, however, the offset distance 806 can be optimized for a particular application but all distances of overlap 806 among each respective pathway is ideally approximately the same as manufacturing tolerances will allow. Minor size differences are unimportant in distance/area 806 between pathways as long as the electrostatic shielding function of structure 800" is not compromised.
  • the electrode 809 may have one or two portions 812 which extend beyond the edge 805 of the common conductive pathway 804 and 808. These portions 812 are connected to electrode termination band 807 which enables the electrode 809 to be electrically connected to the energy pathways (not shown) by solder or the like.
  • element 813 is a dynamic representation of the center axis point of the three-dimensional energy conditioning functions that take place within the invention and is relative with respect to the final size, shape and position of the embodiment in an energized circuit.
  • UMFCCSS universal, multi-functional, common conductive shield structure
  • the UMFCCSS shown comprises multiple, stacked, common conductive cage-like structures 800A, 800B, 800C, and 800D (each referred to generally as 800X), in a generally parallel relationship.
  • Each common conductive cage like structure 800X comprises at least two common conductive pathway electrodes 830, 810, 804, 808, 840.
  • the number of stacked, common conductive cage-like structures 800X is not limited to the number shown herein, and can be any even integer. Although not shown, in applications, each common conductive cage-like structure sandwiches a conductive pathway electrode as previously described in relation to Fig. 1 .
  • the common conductive cage-like structure 800X are shown separately to emphasize the fact that any type of conductive pathway electrode can be inserted within the common conductive cage like structures 800X. As such, the common conductive cage-like structures 800X have a universal application and can be used in combination with conductive pathway electrodes in discrete, or non-discrete configurations such as, but not limited to, embedded within silicone or as part of a PCB.
  • the common conductive pathway electrodes 830, 810, 804, 808, 840 have terminations which are all conductively interconnected as shown at 802 which provide a connection point to an external conductive area.
  • Each common conductive pathway electrode 830, 810, 804, 808, 840 is formed on a plate of dielectric material 801 and insulated on opposite sides by insulation band 805 which is also comprised of dielectric material 801.
  • the dielectric material 801 conductively separates the individual common conductive pathway electrodes from the conductive pathway electrodes (not shown) sandwiched therein. Also as described in relation to Fig.
  • a minimum of two Faraday cages 800 and 800' are required to make up a multi-functional line-conditioning device in all of the layered embodiments of the present invention Accordingly, there are a minimum of two required common conductive cage like structures 800X, as represented in Fig. 2 by 900 A, 900 B, and 900C.
  • the area of convergence (AOC) is designated at 813 and will be discussed in detail below.
  • UFMCCSS-B the universal, multi-functional, common conductive shield structure
  • the field motion as energy is undergoing conditioning within the structure is depicted between differential conductive energy pathways 4880C, 4890C, and each surrounding common conductive cage like structure 800A, 800B, 800C, 800D.
  • the energy propagating along the differential conductive energy pathways 4880C and 4890C are propagating in opposite directions in relation to each other. Propagation of energy creates inductive coupling in the form of magnetic field fields, shown generally by element 875, which rotate in a counter-clockwise in relation to the energy propagation direction.
  • the opposing direction of energy propagation in differential conductive energy pathways 4880C and 4890C result in the magnetic fields 875 created by the currents rotating in opposite directions providing a mutual flux cancellation, or minimization, of the magnetic fields.
  • the common conductive cage-like structures structures 800A, 800B, 800C, 800D sandwich the differential conductive energy pathways 4880C, 4890C
  • the shared, common conductive pathways shared between the structures 800A, 800B, 800C, 800D provide a voltage balance to the attached circuit. It is noted that the upper and lower most differential conductive energy pathway does not have a corresponding differential conductive energy pathway on the side opposite the area of convergence.
  • the conductively connected cage like structures provide a double development in conjunction with common conductive terminations structure 802 which helps improve the voltage balance as well as containment of parasitics.
  • a further embodiment of the layered, universal, multi-functional common conductive shield structure of the present invention is shown in a by-pass configuration 6800, hereinafter referred to as "by-pass shield structure.”
  • By-pass shield structure 6800 could also take on a configuration of "feed-thru shield structure” 6800 in terms of relative stacking position of a static embodiment of each. There would be relatively no difference between these two possible configurations when inspecting the positioning of stacked two common conductive shield structures 1000A and 1000B or of common conductive pathways 6808, 6804, 6810, 6811, 6812 and central common shared conductive pathway 6804 that could make up each embodiment.
  • the by-pass shield structure 6800 is shown in cross section extending longitudinally and comprises a seven layer common conductive pathway stacking of two common conductive shield structures, which form the present embodiment of the by-pass shield structure.
  • the by-pass shield structure 6800 is shown in cross section perpendicular to the cross section shown in FIG. 3A .
  • the by-pass shield structure 6800 comprises a central common conductive shared pathway 6804 that is connected with elements and energized and will form a zero voltage reference to circuitry (not shown) with the creation of 6804-IM, 6811-IM and 6812-IM which is formed and relative only to the active circuit elements attached commonly (not shown) but not before connection of the 6802 (s) by connection means 6805 to external conductive surface 6803.
  • the energized circuit (not shown) created active energy-utilizing load or loads will utilize portions of propagated energy with elements, central common conductive shared pathway 6804, 6808, 6810, 6811, 6812 which are all attached to external common conductive electrode structure(s) 6802 which in turn are both coupled to external common conductive pathway 6803 by attachment means 6805 such as solder material or any other attachment means commonly found in the art.
  • the circuitry will include a passively operating universal, multi-functional, common conductive shield structure that will be used by energy source and energy-utilizing load (s) with propagated energy in a balanced manner that will be available when energized active components in said circuitry (not shown) demand portions of said energy.
  • differential conductive pathways 6807 and 6809 are each inserted into one of the two common conductive shield structures.
  • the first common conductive shield structure is formed between common conductive pathway 6810 and central common conductive shared pathway 6804.
  • the second common conductive shield structure is formed between common conductive pathway 6808 and central common conductive-shared pathway 6804.
  • a first differential conductive pathway 6807 is placed within the first common conductive shield structure and separated from the common conductive pathway 6810 and the central common conductive-shared pathway 6804 by a dielectric material 6801.
  • the dielectric material 6801 separates and electrically isolates the first differential conductive pathway 6807 from the first common conductive shield structure.
  • a second differential conductive pathway 6809 is placed within the second common conductive shield structure and separated from the common conductive pathway 6808 and the central common conductive-shared pathway 6804 by a dielectric material 6801.
  • the first and second differential conductive pathways 6807 and 6809, respectively, are then electrically connected to external conductive energy pathways 6820 and 6821, respectively.
  • the electrical connections can be made by any means known to a person of ordinary skill in the art, including but not limited to solder, resistive fit sockets, and conductive adhesives.
  • Completing the by-pass shield structure 6800 are the additional outer shield structures 6811 and 6812, which sandwich both common conductive shield structures with dielectric material 6801 interposed between.
  • Each of the outer common conductive shields form image structures 6808-IM and 6810-IM as just described, when energized, that includes an outer conductive portion of shields 6811 and 6812 (not shown) and the outer conductive portions of external common conductive electrode structure(s) 6802 that forms a relatively large skin area and a zero voltage reference with 6804-IM by external common conductive electrode structure 6802.
  • the outer skin surface formed by the combination of the external common conductive electrode structure 6802 and the outer shield image structures 6811 and 6812 absorbs energy when the circuit is energized and than act as an additional enveloping shield structure with respect to 6809 and 6807 differential conductive pathways.
  • the by-pass shield structure 6800 is attached to an external common conductive pathway 6803 of an energy conditioning circuit assembly ("ECCA") by known means, such as solder material 6805, portions of energy will travel along the created low impedance pathway that exists internally with common conductive structure elements and the external connection to third conductive pathway 6803 and be able to return by this pathway to its source.
  • ECCA energy conditioning circuit assembly
  • the external common conductive electrode structure(s) 6802 are connected to electrical circuits by means known in the art and therefore the present invention is not limited to discreet structures but could, for example, be formed in silicon within an integrated circuit.
  • by-pass shield structure 6800 and the two common conductive shield structures (referred elsewhere in the application as contained structures 800C and 800D, effectively enlarge the zero voltage reference 6804-IM, 6811-IM and 6812-IM within the area of convergence ("AOC”) 6813.
  • the AOC 6813 is the energy central balance point of the circuit.
  • the very basic common conductive pathway manufacturing sequence (excluding dielectric materials, etc.) is as follows, always, first a common conductive pathway, then a conductive pathway, then a second common conductive pathway, second conductive pathway and a third common conductive pathway. Additional sequence would than be as follows, third conductive pathway, fourth common conductive pathway, fourth conductive pathway; fifth common conductive pathway.
  • the result of the by-pass shield structure when energized within a circuit is increased physical shielding from externally generated and internally propagating parasitics 6816 (represented by the double sided arrows) as well as providing lower impedance paths generated along the common conductive pathway electrode surfaces to external conductive pathway 6803.
  • the double-sided arrows depict the electrostatic functions that occur in an energized state to energy parasitics 6816, which are also representative of portions of externally and internally originating energy parasitics that would otherwise disrupt portion of propagated energy.
  • the double-sided arrows show the charged electron exchange representative of the electrostatic functions that occur in an energized state to trap parasitics within a shielded container.
  • the double-sided arrows also represent the simultaneous, but opposite charge affect that occurs along the "skins" of the conductive material that is located within each respective container.
  • FIG. 4A shows the universal, multi-functional, common conductive shield structure having feed-thru pathways (UMFCCSS-F)
  • UFCCSS-F feed-thru pathways
  • Fig. 4A shows the universal, multi-functional, common conductive shield structure having four stacked, common conductive cage-like structure containers 800A, 800B, 800C, and 800D (each referred to generally as 800X), in a generally parallel relationship, as previously shown in FIG. 2 .
  • Each common conductive cage like structure 800X comprises at least two common conductive pathway electrodes 4830, 4810, 4804, 4808, 4840.
  • the common conductive pathway electrodes 4830, 4810, 4804, 4808, 4840 each have terminations which are all conductively interconnected as shown at 802 which provides a connection point to an external conductive area (not shown).
  • four stacked, common conductive cage-like structure containers 800A, 800B, 800C, and 800D each contain a conductive pathway electrode 4809A, 4807A, 4809B, and 4807B, respectively.
  • the conductive pathway electrodes 4809A, 4809B are conductively connected in parallel by termination bands 4880A and 4880B through the universal, multi-functional, common conductive shield structure in a feed-thru relationship.
  • Termination bands 4880A and 4880B are conductively connected to power energy pathways from an energy power source (not shown).
  • Termination bands 4890A and 4890 B. are conductively connected to return energy pathways from to an energy-utilizing load. It can be seen from Fig. 4B that the power conductive pathway electrodes 4809A and 4809B are interspersed with return conductive pathway electrodes 4807A and 4807B. Relating back to Fig. 4A , it can be seen that the shared common conductive pathway electrodes 4810, 4804, 4808 between common conductive cage like structure containers 800A, 800B, 800C, and 800 D, are each sandwiched in Fig. 4B between a power conductive pathway electrode and a return conductive pathway electrode.
  • central common conductive shared pathway electrode 4804 is centrally positioned having one power conductive pathway electrode and one return conductive pathway electrode on each side. Therefore, central common conductive shared pathway electrode 4804 not only provides a balance between adjacent conductive pathway electrodes 4807A, 4809B, but also between call conductive pathway electrodes as the center of the area of convergence 813.
  • FIG. 4C and 4D a universal, multi-functional, common conductive shield structure with feed-thru pathways (UMFCCSS-F) is described.
  • Fig. 4C again shows the universal, multi-functional, common conductive shield structure having four stacked, common conductive cage-like structure containers 800A, 800B, 800C, and 800D (each referred to generally as 800X), in a generally parallel relationship, as previously shown in FIG. 2 .
  • Each common conductive cage like structure 800X comprises at least two common conductive pathway electrodes 4830, 4810, 4804, 4808, 4840.
  • the common conductive pathway electrodes 4830, 4810, 4804, 4808, 4840 each have terminations which are all conductively interconnected as shown at 802 which provides a connection point to an external conductive area (not shown).
  • four stacked, common conductive cage-like structure containers 800A, 800B, 800C, and 800D each contain a conductive pathway electrode 4809C, 4807C, 4809D, and 4807D, respectively.
  • the conductive pathway electrodes 4809C, 4809D are conductively connected in parallel by termination band 4880C through the universal, multi-functional, common conductive shield structure in a by-pass relationship.
  • Termination band 4880C is conductively connected to a power energy pathway from an energy power source (not shown).
  • Termination band 4890C is conductively connected to a return energy pathway from to an energy-utilizing load (not shown). It can be seen from Fig. 4D that the power conductive pathway electrodes 4809C and 4809D are interspersed with return conductive pathway electrodes 4807C and 4807D. Relating back to Fig. 4C , it can be seen that the shared common conductive pathway electrodes 4810, 4804, 4808 between common conductive cage like structure containers 800A, 800B, 800C, and 800D, are each sandwiched in Fig. 4D between a power conductive pathway electrode and a return conductive pathway electrode. This enables the universal, multi- functional, common conductive shield structure to operate in a balanced manner as will be described in detail in relation to Fig. 5B .
  • central common conductive shared pathway electrode 4804 is centrally positioned having one power conductive pathway electrode and one return conductive pathway electrode on each side. Therefore, central common conductive shared pathway electrode 4804 not only provides a balance between adjacent conductive pathway electrodes 4807C, 4809D, but also between call conductive pathway electrodes as the center of the area of convergence 813.
  • FIG. 5A & FIG. 5B which are almost identical depictions of UMFCCSS 3800-BY-PASS, and both will be described freely, back and fourth to explain and reveal a simple circuit using the invention and how portions of energy propagates within the circuit depicted in-terms of the other invention elements that will be listed.
  • FIG. 5A is more of UMFCCSS 3800-BY-PASS a system view
  • FIG. 5B is a close-up of the system energy propagation effects and structural representations of UMFCCSS 3800-BY-PASS as portions of energy is undergoing conditioning within the AOC of the invention embodiment.
  • FIG. 5A is more of UMFCCSS 3800-BY-PASS a system view
  • FIG. 5B is a close-up of the system energy propagation effects and structural representations of UMFCCSS 3800-BY-PASS as portions of energy is undergoing conditioning within the AOC of the invention embodiment.
  • FIG. 5A & FIG. 5B which are almost identical depictions of UMFCCSS 3800
  • 5B depicts or represents a moment in time or snap-shot of an exploded and inside-out view or depiction of a minimally configured 5-conductive pathway electrode layering within a UMFCCSS 3800 (in-By-Pass) placed into a simple circuit arrangement and energized with propagating energy EEE-portions of propagating Energy; elements include 000 the circuit system 00 - energy source for the system and EEE for the energy-utilizing load 01 - energy-utilizing load of the system.
  • Dielectric material 3801 generally supports and insulates the conductive layers from each other as previously described in other embodiments.
  • Electrostatic charge switching exchange 3802 or or a portion of the E-Field suppression of parasitic energies from 3818 and 3804 conductor cancellation of energy of UMFCCSS-B is also shown.
  • Conductive pathway material 3803 for attachment meansdifferential conductive pathway or electrode 3804.
  • Element 3805 (Not Shown) but is conductive mounting pad surface (needed) or area or means for portions of energy propagated along differential conductive attachment between 3818 to 3815 VIA 3809, if needed to 3820 from load 00 and to source 01 and from 3804 to 3803 to 3809 to 3811 from source 01 to load 00 and to 3818 thru 3809 (Not Shown).
  • the UMFCCSS-3800-BY-PASS is described as a minimum unit in which a capacitance is formed by the pair of the inner conductive pathway electrodes 3818 and 3804 separated by a respective dielectric layer or material 3801 and by central shared common conductive shield pathway electrode 3816.
  • the described grouping as a whole is now further described as being sandwiched or almost enveloped by outer common conductive pathway electrodes 3806 and 3819.
  • FIG5B which represents the charged electron exchange that serves as a descriptive representation of the electrostatic functions that occur in an energized state to trap parasitics within a shielded container
  • This also is representative of the simultaneous, but opposite charge affect that is occurring along the "skins" of the conductive material that is located with in each respective "container” on opposite sides of the central common and shared conductive pathway 3816.
  • Large conductive arrears located on both the respective sides of 3816 and on one of two large conductive areas of common electrodes 3819 and 3806 that face the respective large areas of conductive material located on each large side of electrode 3816.
  • Energy propagated upon 3818 and 3804 is condition simultaneously in this local in any invention embodiment regardless of the number of conductive containers that are stacked, regardless if multiple conductive pathways are contained such as additional paired plates 3818A and 3804A (NOT Shown) that are arranges in a manner which consists of a plurality of additional differential and paired pathway electrodes interleaved and embedded within a dielectric casing with paired group of differentially operating conductive pathways as a closely spaced pair of conductive elements which significantly increase the total area of paired groups of differentially operating conductive pathways a correspondingly increase in the current handling capacity of the full embodiment will occur.
  • additional paired plates 3818A and 3804A NOT Shown
  • any UMFCCSS-FEED-THRU embodiment will always have electrical current limitations due to the energy flowing through the AOC rather than moving in a by-pass fashion in which all conductively layered electrodes or pathways are being utilized by portions of propagated energy located on opposite sides of the critical centrally positioned common conductive pathway electrode and "0" voltage reference plane. Electrically in parallel means that when attached as disclosed in a manner as revealed herein.
  • An electrically parallel fashion means with respect to the conductive energy pathways utilized by energy propagated from an operating source propagated to the AOC, propagating further to the energy-utilizing source and then, portions of energy are propagated from the energy-utilizing load to the AOC and than portions returning by way of the AOC to source pathways or portions are taken off through the low impedance pathway enhanced by the third conductive set of pathways that are common within the AOC and to one another that leads to the externally positioned common conductive external pathways.
  • a properly attached invention whether discrete or non-discrete will aid in achieving a simultaneous ability to perform multiple and distinct energy conditioning functions such as decoupling, filtering, voltage balancing using parallel electrical positioning principals which are always relative to the energy source, paired conductive energy pathways, the energy utilizing load and the conductive energy pathways returning back to the source to complete the circuit.
  • This also includes the opposing but electrically canceling and complimentary positioning of portions of propagated energy acting upon the conductive pathways in a balanced manner on opposite sides of a "0" Voltage reference created simultaneously using the pivotal centrally positioned common and shared conductive electrode pathway.
  • This generally always-parallel energy distribution scheme allows the material make up of all of the manufactured invention elements to operate together more effectively and efficiently with the load and the source pathways located within a circuit.
  • central shared common conductive shield pathway electrode 3816 is the balancing point for energy originating (with respect to itself) on the generally parallel and opposite sides of 3816, within the structure and will have located in close proximity with respect of the entire 3800 physical 3-demensional center, a center point of energy conditioning, suppression and shielding. before energization, free electrons are distributed randomly on the outer "skin" of all the conductive pathways all the plates are GnD are in parallel respectively to each other but are lower cap value series to board
  • FIG. 5C and FIG. 5D Moving freely between FIGS, 5A , 5B , 5C and 5D , a disclosure of portions of the AOC circuitry functions of any UMFCCSS in a possible bypass arrangement are shown.
  • FIG. 5C and FIG. 5D Moving freely between FIGS, 5A , 5B , 5C and 5D , a disclosure of portions of the AOC circuitry functions of any UMFCCSS in a possible bypass arrangement are shown.
  • FIG 5C is the graphed response of two 3800 (in-bypass) configured capacitive-type units constructed relative to the related invention elements
  • FIG 5C shows a test data comparing two universal multi-functional common conductive shield structures with bypass pathways (UMFCCSS-B) 3800-A and 3800B that have been made into a 1206 size package which is a standard package size used by the passive component manufacturing industry for sale of embodiments as a discrete passive component, whether capacitive or inductive the term 1206 is universally understood by those of the art.
  • Embodiments 3800-A and 3800-B are roughly of the same capacitive values.
  • 3800-A and 3800B do not differ significantly in terms of the placement arraignment of any of the conductive pathway electrodes with respect to the common conductive pathway electrodes within. 3800-A and 3800B do not differ significantly with any of the solder material used to physically make the connection. 3800-A and 3800B do not differ significantly in terms of the placement arraignment of any of the common conductive pathway electrodes within, nor differ significantly between the respective conductive terminations structures that are used to connect 3800-A and 3800B into the test circuit.
  • 3800-A and 3800B do differ slightly in the static capacitive value but both differ very significantly by dielectric material used in each units manufacturing process.
  • 3800-A is made with a MOV dielectric with a Mean Average value of Line to Ground capacitance of approx. 912 pF while 3800-B is made with the X7R dielectric with an average lot value of Line to Ground capacitance of approx. 1,000 pF.
  • FIG. 5C shows the graphed test results as lines 3800-A1, 3800-B1. While capacitor values of 3800-A and 3800-B are similar, the dielectric material is not and yet the test results shown that the more expensive and not as commonly used MOV material takes on a stunning filter effectiveness of the more common X7R material.
  • These test results 3800-A1 and 3800-B1 show that a user of the invention configured like 3800-A will be able to utilize all of the beneficially desired MOV dielectric characteristics of quick clamping of voltage transients and surge suppression capabilities that this particular dielectric is know for in the art.
  • FIG. 5D is a data graph comparing various attachments connections and non-attachments non-connections of common conductive termination structures of a universal multi-functional common conductive shield structure with bypass pathways (UMFCCSS-B) that are conductively connected to all common conductive pathway electrodes and an external conductive surface common to all termination structures run out to 500 MhZ in the test circuit system connected in a similar manner to that shown in FIG. 5A and FIG. 5B .
  • Conductive pathway electrodes 3815 (A) and 3803 (B) of the same invention embodiment are measured in relation to four sequential stages of attachment to a common conductive pathway separate of conductive pathway electrodes 3815 (A) and 3803 (B) and externally located (with respect of the AOC).
  • This common conductive pathway extends upward and into the AOC by means of the conductive connection such as 3821A and 3821 B that facilitates the low impedance characteristics of the internal conductive pathway electrodes that are created by mutual cancellation of opposing magnetic flux found occurring within an energized, manufactured invention when properly placed into circuitry.
  • These sequential stages of attachment were tested and the results are labeled 3800-1,2,3,4 respectively and are normalized for Insertion loss.
  • Package size utilized is a 1206 Sized layering with a static capacitance rating of 220pF, Line to Ground constructed in NPO dielectric material.
  • Plot 3800-1 is of attachment to conductive electrode pathway elements 3815 and 3803, ONLY.
  • both 3821A and 3821B of the invention are attached to the common conductive external area all common and conductively attached electrode elements allow propagated energy to operate electrically parallel with respect to the source and the load as well as with the other common conductive structures position not only to each other but also with any main circuit return path, chassis ground or low impedance pathway.
  • this attachment method 3800-3 results in measured the invention resonant frequency moving from 301 MhZ out approximately 86 MHz to 387 MhZ. This would normally be achieved in the prior art components by the addition of more prior art passive comments of different values to achieve the same an equivalent effect.
  • 3800-3 represents the performance improvement achieved with an additional external conductive strap wrapped over the UMFCCSS-B from 3821A TO 3821 B and adds an common conductive pathway in parallel to the internal pathways disclosed and thereby again enhances and lowers the impedance of the third conductive and common pathway within the AOC to a propagated energy-return path that can be utilized portions of energy originating from the same source. It should be noted that although internally the conductive pathways are balanced, that once the invention is placed upon the common conductive area created by the puddle solder material placed during the test creates a slight, but unimportant un-balance among the common conductive plates that is noted as non-critical.
  • At least three, distinctly different energy conditioning functions will occur within any variation of the UMFCCSS; electrostatic minimization of energy parasitics by almost total shield envelopment; physical shielding of differential conductive pathways; electromagnetic shielding function or mutual magnetic flux cancellation of opposing differential conductive pathways; use of a "0" voltage reference created by the central, common and shared pathway electrode that is part of two distinct common conductive shield structures, the parallel movement shielding effect as opposed to a series movement effect by a majority of the portions of energy using the AOC in which each energy portion operating on one side of the central common and shared conductive energy pathway in a electrical and/or magnetic operation will have a parallel non-reinforcing counterpart that operates in a generally opposing cancellation-type manner that does not reinforce detrimental forces in a manner like that of the prior art which operates in a generally series-type manner which may use mutual magnetic flux cancellation of opposing differential conductive pathway but fails to use the simultaneous sandwiching electrostatic shielding function as has been described in this disclosure.
  • the number of pathways can be multiplied in a predetermined manner to create a number of conductive pathway element combinations a generally physical parallel relationship that also be considered electrically parallel in relationship with respect to these elements in an energized existence with respect to a circuit source will exist additionally in parallel which thereby add to create increased capacitance values.
  • additional common conductive pathways surrounding the combination of a center conductive pathway and a plurality of conductive electrodes are employed to provide an increased inherent ground and optimized Faraday cage-like function and surge dissipation area in all embodiments.
  • the multi-functional energy conditioner can also be embedded and filter communication or data lines directly from their circuit board terminal connections, thus reducing circuit board real estate requirements and further reducing overall circuit size while having simpler production requirements.

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Claims (17)

  1. Abschirmende Leitungsanordnung, umfassend:
    eine elektrisch leitende Vielzahl von Abschirmungsleitungen (804, 808, 810) von im Wesentlichen gewöhnlicher Größe und Form, die wenigstens eine erste Abschirmungsleitung in einer ersten Ebene, eine zweite Abschirmungsleitung in einer dritten Ebene und eine dritte Abschirmungsleitung in einer fünften Ebene enthalten;
    wobei alle der Vielzahl der Abschirmungsleitungen übereinander gestapelt sind und miteinander leitend verbunden sind;
    eine elektrisch leitende Vielzahl von abgeschirmten Leitungen (809), die eine erste abgeschirmte Leitung in einer zweiten Ebene und eine zweite abgeschirmte Leitung in einer vierten Ebene enthalten;
    wobei die erste abgeschirmte Leitung zwischen der ersten Abschirmungsleitung und der zweiten Abschirmungsleitung liegt;
    wobei die zweite abgeschirmte Leitung zwischen der zweiten Abschirmungsleitung und der dritten Abschirmungsleitung liegt;
    wobei die erste abgeschirmte Leitung und die zweite abgeschirmte Leitung voneinander und von der Vielzahl der Abschirmungsleitungen elektrisch isoliert sind; und
    wobei jede einzelne der Vielzahl der Abschirmungsleitungen größer ist als jede der Vielzahl der abgeschirmten Leitungen.
  2. Anordnung nach Anspruch 1, wobei die Gesamtsummenanzahl der Vielzahl der Abschirmungsleitungen (804, 808, 810) eine ungerade Zahl ist.
  3. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei die erste abgeschirmte Leitung und die zweite abgeschirmte Leitung Umgehungsleitungen (4809C, 4809D) sind, von denen jede lediglich einen Querschnitt aufweist, der sich bis zu einer Kante der Anordnung erstreckt.
  4. Anordnung nach Anspruch 1, wobei die Anzahl der Vielzahl der Abschirmungsleitungen (804, 808, 810) und der Vielzahl der abgeschirmten Leitungen eine ungerade Anzahl (809) ist.
  5. Anordnung nach irgendeinem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Vielzahl der Abschirmungsleitungen enthält:
    erste zwei parallele Abschirmungsleitungen (6811-IM, 6810), die sich jeweils in voneinander getrennten Ebenen befinden und zwischen sich keine leitenden Leitungen aufweisen, und wobei sich die ersten zwei parallelen Abschirmungsleitungen über allen anderen leitenden Leitungen der Anordnung befinden; und
    zweite zwei parallele Abschirmungsleitungen (6808, 6812IM), die sich jeweils in voneinander getrennten Ebenen befinden und zwischen sich keine leitenden Leitungen aufweisen, wobei sich die zweiten zwei parallelen Abschirmungsleitungen unterhalb aller anderen leitenden Leitungen der Anordnung befinden.
  6. Anordnung (3800) nach irgendeinem der vorangehenden Ansprüche, wobei die Anordnung eine nicht-diskrete Anordnung in einer größeren Struktur ist, wobei die größere Struktur eine elektrische Masseebene (3808) unterhalb der Anordnung aufweist, und ferner eine leitende Verbindung von der Vielzahl der Abschirmungsleitungen zur Masseebene umfasst.
  7. Anordnung nach irgendeinem der vorangehenden Ansprüche, ferner gekennzeichnet durch ein Material zwischen bestimmten leitenden Leitungen der Anordnung, wobei das Material aus einer Gruppe ausgewählt ist, die aus einem Ferrit, einem Dielektrikum und einem Halbleiter wie z. B. Silicium, Germanium und Gallium-Arsenid besteht.
  8. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei jede der Vielzahl der abgeschirmten Leitungen (809) die gleiche Größe und Form aufweist.
  9. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei jeder Vielzahl der Abschirmungsleitungen (804, 808, 810) die gleiche Größe und Form aufweist.
  10. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei die erste abgeschirmte Leitung die gleiche Form wie die zweite abgeschirmte Leitung aufweist.
  11. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei eine erste Hälfte der Vielzahl der abgeschirmten Leitungen (6807, 6821) von einer zweiten Hälfte der Vielzahl der abgeschirmten Leitungen elektrisch und physikalisch isoliert ist.
  12. Anordnung nach irgendeinem der vorangehenden Ansprüche, in der die leitenden Schichten, die zu jeweils einer der Vielzahl der abgeschirmten Leitungen am nächsten liegen, Schichten der Vielzahl der Abschirmungsleitungen sind.
  13. Anordnung nach irgendeinem der vorangehenden Ansprüche, in der ein Teil der Vielzahl der Abschirmungsleitungen mittels eines Dotierungsprozesses ausgebildet ist.
  14. Anordnung nach irgendeinem der Ansprüche 1, 2 und 4-13, wobei die Vielzahl der abgeschirmten Leitungen Durchführungsleitungen (6811, 6812) bilden, die jeweils wenigstens zwei Punkte aufweisen, an denen sie aus der Anordnung austreten.
  15. Anordnung nach irgendeinem der vorangehenden Ansprüche, die als Teil einer Einfügungsstruktur, einer Substratstruktur, einer Verbinderstruktur oder einer integrierten Schaltungsstruktur ausgebildet ist.
  16. Anordnung nach irgendeinem der vorangehenden Ansprüche, in der entweder die erste abgeschirmte Leitung oder die zweite abgeschirmte Leitung zwischen einer Quelle und einer Last elektrisch angeschlossen ist, und die jeweils andere zwischen einer Last und einer Rückleitung in einer elektrischen Schaltung angeschlossen ist, wobei die Vielzahl der Abschirmungsleitungen mit einer Masse der elektrischen Schaltung elektrisch verbunden ist.
  17. Anordnung nach irgendeinem der vorangehenden Ansprüche, wobei sich die erste Abschirmungsleitung in ihrer Ebene weiter erstreckt als der Umfang der ersten abgeschirmten Leitung, mit Ausnahme dort, wo sich die erste abgeschirmte Leitung so erstreckt, dass sie mit einer Struktur außerhalb der Anordnung elektrisch verbindet.
EP00946814A 1999-06-15 2000-06-15 Universelle multifunktionelle gemeinsame abschirmstruktur für elektrische schaltung und energieanpassung Expired - Lifetime EP1222725B8 (de)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
US13918299P 1999-06-15 1999-06-15
US139182P 1999-06-15
US14698799P 1999-08-03 1999-08-03
US146987P 1999-08-03
US16503599P 1999-11-12 1999-11-12
US165035P 1999-11-12
US09/460,218 US6331926B1 (en) 1997-04-08 1999-12-13 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US460218 1999-12-13
US18010100P 2000-02-03 2000-02-03
US180101P 2000-02-03
US18532000P 2000-02-28 2000-02-28
US185320P 2000-02-28
US19119600P 2000-03-22 2000-03-22
US191196P 2000-03-22
US20032700P 2000-04-28 2000-04-28
US200327P 2000-04-28
US20386300P 2000-05-12 2000-05-12
US203863P 2000-05-12
US09/579,606 US6373673B1 (en) 1997-04-08 2000-05-26 Multi-functional energy conditioner
US579606 2000-05-26
PCT/US2000/016518 WO2000077907A1 (en) 1999-06-15 2000-06-15 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning

Publications (4)

Publication Number Publication Date
EP1222725A1 EP1222725A1 (de) 2002-07-17
EP1222725A4 EP1222725A4 (de) 2004-07-21
EP1222725B1 true EP1222725B1 (de) 2008-06-18
EP1222725B8 EP1222725B8 (de) 2008-11-26

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EP (1) EP1222725B8 (de)
JP (1) JP2003502991A (de)
CN (1) CN1373922A (de)
AU (1) AU6051300A (de)
DE (1) DE60039245D1 (de)
IL (1) IL147092A0 (de)
WO (1) WO2000077907A1 (de)

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Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US7356050B2 (en) 2003-12-17 2008-04-08 Siemens Aktiengesellschaft System for transmission of data on a bus
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器
US10775856B1 (en) 2019-12-02 2020-09-15 Management Services Group, Inc. Compute device housing with layers of electromagnetic interference shields, and devices and systems for the same

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JP2725439B2 (ja) * 1990-05-17 1998-03-11 株式会社 村田製作所 電子部品の周波数調整方法
JP2606044B2 (ja) * 1991-04-24 1997-04-30 松下電器産業株式会社 誘電体フィルタ

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WO2000077907A9 (en) 2004-10-07
JP2003502991A (ja) 2003-01-21
DE60039245D1 (de) 2008-07-31
EP1222725A4 (de) 2004-07-21
CN1373922A (zh) 2002-10-09
EP1222725A1 (de) 2002-07-17
EP1222725B8 (de) 2008-11-26
AU6051300A (en) 2001-01-02
IL147092A0 (en) 2002-08-14
WO2000077907A1 (en) 2000-12-21

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